CN114695305A

CN114695305A - Flexible substrate, attached crystal film COF and display screen

Info

Publication number: CN114695305A
Application number: CN202011595231.3A
Authority: CN
Inventors: 李杰威; 李亚鹏; 贾卫波; 唐书桓
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2022-07-01
Also published as: WO2022143075A1

Abstract

The embodiment of the application provides a flexible substrate, attaches brilliant film COF and display screen, relates to and shows technical field, provides a display panel's that is used for having more to hold out pin attaches brilliant film. A crystalline attached film (COF) comprising: a first flexible substrate; a first chip disposed on the first flexible substrate; the first flexible substrate comprises at least two groups of first connecting ends, wherein terminals on the first connecting ends are electrically connected with pins of the first chip through circuits on the first flexible substrate, and terminals of fan-out circuits of the display panel or the touch panel are bonded with the terminals on the first connecting ends.

Description

Flexible substrate, chip-attached film COF and display screen

Technical Field

The embodiment of the application relates to the technical field of display, in particular to a flexible substrate, an attached crystal film COF and a display screen.

Background

In the flexible display technology, a display screen of an electronic device has characteristics of being lighter, thinner, and rollable, and is increasingly applied to the fields of mobile phones, flat panels, wearing, and the like. Referring to fig. 1, in a display panel of a flexible display panel, driving lines (e.g., scan lines, data lines, etc.) of a display area (active area, AA) are fanned out to connection terminals (also called bonding terminals, which refer to pin areas of a frame) through fan-out lines on the frame. Therefore, the connecting end can be bent to the back of the display panel through the pad bonding (bending of the pin area of the frame of the display panel) technology, so that the pins (pins or terminals) in the connecting end are bonded (bonding) with a Chip On Film (COF), namely, a flexible circuit film with a chip, which is called a chip on film for short), and the connecting end is bent to the back of the display panel, so that the area of the display area is not occupied, and the extremely narrow frame and high screen occupation ratio (occupation ratio of the area of the display area on the display panel) is realized. However, as the number of Pixels Per Inch (PPI) of the display panel and the resolution are improved, the number of traces of the driving lines and the number of pins (pins) of the connecting terminal (bonding pad) are increased and are affected by the size of the bonding pad, and the bezel size (as shown in fig. 1, for example, a circular display screen, the bezel size 1, the bezel size 2 of the display area and the bezel (border) of the display panel, and the width bezel size 3 of the connecting terminal) of the bezel (as shown in fig. 1, the bezel size of the bezel (the bezel size 2 of the display area and the display panel, the width of the connecting terminal (bezel size 3)) of the lower bezel (as shown in fig. 1, the bezel of the connecting terminal) of the circular screen is further narrowed and severely limited. Therefore, the display panel with pin at multiple ends is produced, for example, as shown in fig. 2, the display panel is provided with a plurality of connecting ends (connecting end 1, connecting end 2 and connecting end 3), so that the driving circuit of the display area AA can be respectively connected to the pins in different connecting ends through the fan-out circuit, so that the width of the connecting end (frame size 3) can be reduced by uniformly setting the pins in each connecting end, thereby further reducing the frame size, improving the screen occupation ratio, and reducing the frame size 3 is also beneficial to reducing the maximum excircle of the display panel, and saving the installation space of the whole electronic equipment. For the above-mentioned multi-pin display panel, a new chip-attached film COF needs to be designed to bond with the connection terminal of the display panel, and input a signal to the driving line or receive a signal output from the driving line.

Disclosure of Invention

The embodiment of the application provides a flexible substrate, a chip-attached film COF and a display screen, and provides a novel COF for responding to signal input or output of a drive circuit of a display panel with pins at multiple ends.

In order to achieve the purpose, the technical scheme is as follows:

in a first aspect, a touch panel is provided. The touch panel includes: a touch sensor array; one driving circuit of any touch sensor in the touch sensor array is connected with one fan-out circuit of the touch panel; at least two groups of second connecting ends are arranged on the touch panel, and the second connecting ends comprise terminals of a plurality of fan-out lines of the touch panel. The touch panel with the pin at one end is usually provided with a group of connecting ends on a frame of the touch panel, all driving circuits of the touch panel are respectively connected to different terminals in the connecting ends through fan-out circuits, the number of the driving circuits of the touch panel and the number of the terminals of the connecting ends are more and more along with continuous improvement of touch precision, the size of the connecting ends is also more and more large, the size of the frame of the touch panel is influenced, and the narrowing of the touch panel is seriously limited. The embodiment of the application provides a touch panel on set up at least two sets of second link, can be connected to the terminal in the second link of difference respectively through the fan-out circuit with touch panel's drive line like this, can reduce the width of link through evenly setting up the terminal in every second link like this, thereby further reduce touch panel's frame size, improve the screen and account for than, and the reduction of frame size also is favorable to reducing touch panel's the biggest excircle, save the installation space of electronic equipment complete machine.

In a second aspect, a first epitaxial film COF is provided. The first COF includes: a first flexible substrate; a first chip disposed on the first flexible substrate; the first flexible substrate comprises at least two groups of first connecting ends, wherein terminals on the first connecting ends are electrically connected with pins of the first chip through circuits on the first flexible substrate, and terminals of fan-out circuits of the display panel or the touch panel are bonded with the terminals on the first connecting ends. When the display panel or the touch panel with the pins from multiple ends comprises at least two groups of second connecting ends which are in one-to-one correspondence with the positions of the at least two groups of first connecting ends on the first COF, the first COF is used for inputting signals to the driving circuit or receiving signals output by the driving circuit of the display panel or the touch panel with the pins from multiple ends.

In one possible implementation manner, the display area of the display panel comprises a pixel array, wherein one driving line of any pixel unit in the pixel array is connected with one fan-out line of the display panel; the display panel is provided with at least two groups of second connecting ends, the second connecting ends comprise terminals of a plurality of fan-out lines of the display panel, the first flexible substrate is arranged on the back face of the display panel, and the group of second connecting ends are bent to the back face of the display panel and are correspondingly connected with the group of first connecting ends. Optionally, the pixel unit includes a pixel circuit, and the driving line includes a scan line and a data line connected to the pixel circuit. In this example, since only the pixel array is included in the display panel, the display panel has only a display function. The first COF is used for connecting a display panel, and the first chip may be a Display Driver Integrated Circuit (DDIC).

In a possible implementation manner, the pixel unit further includes a touch sensor, and the driving circuit includes an input channel trace and an output channel trace connected to the touch sensor. In this example, the display panel may have a touch function at the same time, and the touch sensor is integrated in a pixel unit of the display panel, so as to implement a touch panel and an on cell TP (touch panel, i.e., the touch sensor of the touch panel is integrated in the pixel unit of the display panel). When the first COF is used to connect the display panel, the first chip may be a touch and display driver integrated IC (TDDI IC) integrating a DDIC and a TPIC.

In one possible implementation manner, the touch panel includes a touch sensor array, wherein one driving line of any touch sensor in the touch sensor array is connected to one fan-out line of the touch panel; the touch panel is provided with at least two groups of second connecting ends, the second connecting ends comprise terminals of a plurality of fan-out lines of the touch panel, the first flexible substrate is arranged on the back face of the touch panel, and one group of second connecting ends are bent to the back face of the touch panel and are correspondingly connected with one group of first connecting ends. In this example, the first COF is used for connecting a touch panel, and the first chip may be a Touch Panel Integrated Circuit (TPIC).

In one possible implementation, the driving lines include input channel traces and output channel traces connected with the touch sensors. In general, touch sensors are disposed at positions where input channel traces Rx and output channel traces Tx cross, and one set of touch sensors connects one Rx and one Tx.

In a possible implementation manner, the first flexible substrate includes a third connection end, wherein a terminal on the third connection end is electrically connected to the pin of the first chip through a circuit on the first flexible substrate, a terminal of the third connection end is bonded to a terminal of the second flexible substrate, and the terminal of the second flexible substrate is electrically connected to the driving circuit board. And the terminal of the third connecting end is bonded with the terminal of the second flexible substrate and the terminal of the third connecting end. The second flexible substrate is mainly used for connecting the first COF to the driving circuit board, so as to realize connection between the first chip and the driving circuit board, for example: a Printed Circuit Board (PCB). And the terminals of one group of connecting ends of the second flexible substrate are bonded with the terminals of the third connecting end, and the other group of connecting ends of the second flexible substrate are connected with the PCB through the connector. An Application Processor (AP) (e.g., CPU), a power management chip (power IC), and the like are mounted on the PCB. In this way, the AP provides display data for the DDIC and the display panel to present actual image information; the power IC provides operating voltage for the DDIC and the display panel. The second flexible substrate provides a signal transmission connection path between the PCB and the DDIC. The DDIC is responsible for receiving signals transmitted by the PCB and controlling and transmitting the signals to the display panel according to a specific timing. For example, after the display data output by the AP passes through the DDIC, the display data is converted into a scan signal and a data voltage Vdata, and the scan signal and the data voltage Vdata are transmitted to the pixel units coupled to the driving lines to drive the pixel units to emit light. Alternatively, the AP provides an initial signal to the touch sensors through the TPIC (e.g., transmits the initial signal to the touch sensors through Rx), and detects a touch signal generated by the corresponding touch sensors through the TPIC when a touch event occurs at the touch sensors (e.g., the touch sensors transmit the touch signal through Tx). The second flexible substrate provides a signal transmission connection path between the PCB and the TPIC. The TPIC is responsible for receiving signals transmitted by the PCB, controlling and transmitting the signals to the touch sensor of the touch panel according to a specific time sequence, and receiving touch signals generated by the touch sensor.

In a third aspect, a second flexible substrate is provided, where the second flexible substrate includes at least two sets of fourth connecting ends, a set of fifth connecting ends, and a set of sixth connecting ends; the terminal on the fourth connecting end is connected with the terminal on the fifth connecting end through a circuit on the second flexible substrate, and the terminal on the fourth connecting end is bonded with the terminal of the fan-out circuit of the touch panel; the terminal of the fifth connection terminal is connected to a first COF, wherein the first COF includes a first flexible substrate and a first chip disposed on the first flexible substrate; the first flexible substrate comprises at least one group of first connecting ends and one group of third connecting ends, wherein terminals on the first connecting ends are electrically connected with pins of the first chip through circuits on the first flexible substrate, terminals of fan-out circuits of the display panel are bonded with the terminals on the first connecting ends, terminals on the third connecting ends are electrically connected with the pins of the first chip through circuits on the first flexible substrate, and the terminals on the third connecting ends are bonded with the terminals of the fifth connecting ends; and the terminal on the sixth connecting end is connected with the terminal on the fifth connecting end through the circuit on the second flexible substrate, and the terminal on the sixth connecting end is electrically connected with the driving circuit board. In this scheme, the display panel has only a display function, the touch panel is hung on the display panel, the second flexible substrate may connect the first COF with the driving circuit board, and the structure of the first COF may refer to the first COF described in the first aspect. In addition, the terminal of the fan-out line of the driving line of the touch sensor in the touch panel is bonded to the terminal on the fourth connection terminal on the second flexible substrate, and the terminal on the fourth connection terminal is connected to the terminal of the fifth connection terminal through the line on the second flexible substrate, and the terminal of the third connection terminal on the first COF is bonded to the terminal of the fifth connection terminal on the second flexible substrate, so that the fan-out line of the driving line of the touch sensor in the touch panel is connected to the first chip. In addition, the first chip is connected to the touch panel and the display panel simultaneously, so that the first chip can be a TDDI IC. The terminal on the sixth connecting end is connected with the terminal on the fifth connecting end through a circuit on the second flexible substrate, and the terminal on the sixth connecting end is electrically connected with the driving circuit board, so that the connection of the first chip and the driving circuit board is realized.

In a possible implementation manner, the touch panel is disposed on the back surface of the display panel, and the display area of the display panel includes a pixel array, where one driving line of any pixel unit in the pixel array is connected to one fan-out line of the display panel; the display panel is provided with at least one group of second connecting ends, the second connecting ends comprise terminals of a plurality of fan-out lines of the display panel, the first flexible substrate is arranged on the back face of the touch panel, and the group of second connecting ends are bent to the back face of the touch panel and are correspondingly connected with the group of first connecting ends.

In one possible implementation, the pixel unit includes a pixel circuit, and the driving line of the pixel unit includes a scan line and a data line connected to the pixel circuit.

In one possible implementation manner, the touch panel includes a touch sensor array, wherein one driving line of any touch sensor in the touch sensor array is connected to one fan-out line of the touch panel; the touch panel is provided with at least two groups of seventh connecting ends, the seventh connecting ends comprise terminals of a plurality of fan-out lines of the touch panel, the second flexible substrate is arranged on the back face of the touch panel, and the seventh connecting ends are bent to the back face of the touch panel and correspondingly connected with the fourth connecting ends.

In one possible implementation, the driving lines of the touch sensor include input channel traces and output channel traces connected to the touch sensor.

In a fourth aspect, a second flexible substrate is provided, on which a second chip is disposed; the second flexible substrate comprises at least two groups of fourth connecting ends and one group of sixth connecting ends; the terminal on the fourth connecting end is electrically connected with the pin of the second chip through a circuit on the second flexible substrate, and the terminal on the fourth connecting end is bonded with the terminal of the fan-out circuit of the touch panel; and the terminal on the sixth connecting end is electrically connected with the pin of the second chip through the circuit on the second flexible substrate, and the terminal on the sixth connecting end is electrically connected with the driving circuit board. In the scheme, when the touch panel is externally hung on the display panel, the display panel is not provided with the touch sensor, a terminal of a fan-out line of a driving line of the touch sensor in the touch panel is bonded with a terminal in a fourth connecting end on the second flexible substrate, and is connected with a second chip on the second flexible substrate through a line on the second flexible substrate, for example, the second chip can adopt TPIC; and the terminal on the sixth connecting end is electrically connected with the pin of the second chip through the circuit on the second flexible substrate, and the terminal on the sixth connecting end is electrically connected with the driving circuit board, so that the connection between the second chip and the driving circuit board is realized. In the scheme, a mode that the touch panel with the multiple pins is connected to the driving circuit board through the second flexible substrate is provided, wherein the TPIC is arranged on the second flexible substrate, and the touch panel (compared with a display panel) is simpler in structure, the number of outgoing lines of the driving circuit is relatively less, and the processing logic of the TPIC is simpler, so that the TPIC can be directly manufactured on an FPC with lower process precision requirement (relative to COF).

In one possible implementation manner, the second flexible substrate further includes a group of fifth connection terminals; the terminal of the fifth connection terminal is connected to a first COF, wherein the first COF includes a first flexible substrate and a first chip disposed on the first flexible substrate; the first flexible substrate comprises at least one group of first connecting ends and one group of third connecting ends, wherein terminals on the first connecting ends are electrically connected with pins of the first chip through circuits on the first flexible substrate, terminals of fan-out circuits of the display panel are bonded with the terminals on the first connecting ends, terminals on the third connecting ends are electrically connected with the pins of the first chip through circuits on the first flexible substrate, and the terminals on the third connecting ends are bonded with the terminals of the fifth connecting ends; and the terminal on the sixth connecting end is electrically connected with the pin of the second chip through the circuit on the second flexible substrate, or the terminal on the sixth connecting end is electrically connected with the terminal of the fifth connecting end through the circuit on the second flexible substrate. In this scheme, it should be noted that, the specific structure of the first COF may refer to the description related to the second aspect, and in this scheme, the first COF connected to the display panel and the touch panel share the second flexible substrate to be connected to the driving circuit board.

In a possible implementation manner, the touch panel includes a touch sensor array, wherein one driving line of any touch sensor in the touch sensor array is connected to one fan-out line of the touch panel; the touch panel is provided with at least two groups of seventh connecting ends, the seventh connecting ends comprise terminals of a plurality of fan-out lines of the touch panel, the second flexible substrate is arranged on the back face of the touch panel, and the seventh connecting ends are bent to the back face of the touch panel and correspondingly connected with the fourth connecting ends.

In one possible implementation manner, the driving circuit of the touch sensor includes an input channel trace and an output channel trace connected to the touch sensor.

In a fifth aspect, a display panel is provided, which includes a display panel and the first crystal-attached film COF of the second aspect.

In a sixth aspect, a display screen is provided, which includes the touch panel provided in the first aspect and the second flexible substrate provided in the third aspect or the fourth aspect.

In a seventh aspect, a display screen is provided, which includes a touch panel and the first crystal-attached film COF provided in the second aspect.

An eighth aspect provides an electronic device, including any one of the display screens provided in the fifth aspect to the seventh aspect, and a driving circuit board, where the display screen is connected to the driving circuit board.

The fifth aspect, the sixth aspect, the seventh aspect and the eighth aspect have the same technical effects as the first crystalline thin film COF or the second flexible substrate provided in the foregoing embodiments, and are not described herein again.

Drawings

Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a display panel according to another embodiment of the present application;

fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 4 is an external structural schematic diagram of a smart watch according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a display screen according to an embodiment of the present application;

fig. 6 is a schematic cross-sectional structural diagram of a display screen according to an embodiment of the present application;

fig. 7 is a schematic view of a connection mode of a connection end provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of a display panel according to yet another embodiment of the present application;

fig. 9 is a schematic structural diagram of a display screen according to another embodiment of the present application;

fig. 10 is a schematic structural diagram of a COF provided in an embodiment of the present application;

fig. 11 is a schematic cross-sectional structure diagram of a display screen according to another embodiment of the present application;

fig. 12 is a schematic structural diagram of a display panel according to yet another embodiment of the present application;

fig. 13 is a schematic cross-sectional view of a display screen according to another embodiment of the present application;

fig. 14 is a schematic structural diagram of a display screen according to another embodiment of the present application;

fig. 15 is a schematic structural diagram of a touch panel according to an embodiment of the present disclosure;

fig. 16 is a schematic structural diagram of a display screen according to still another embodiment of the present application;

fig. 17 is a schematic structural diagram of a display screen according to another embodiment of the present application;

fig. 18 is a schematic structural diagram of a display screen according to another embodiment of the present application;

fig. 19 is a schematic cross-sectional view of a display screen according to another embodiment of the present application;

fig. 20 is a schematic structural diagram of an FPC provided in an embodiment of the present application;

fig. 21 is a schematic structural diagram of a display screen according to still another embodiment of the present application;

fig. 22 is a schematic cross-sectional view of a display screen according to another embodiment of the present application;

fig. 23 is a schematic structural diagram of an FPC according to another embodiment of the present application;

fig. 24 is a schematic structural diagram of a display screen according to another embodiment of the present application;

fig. 25 is a schematic structural diagram of a display panel according to another embodiment of the present application;

fig. 26 is a schematic structural diagram of a display panel according to yet another embodiment of the present application;

fig. 27 is a schematic structural diagram of a display panel according to yet another embodiment of the present application;

fig. 28 is a schematic structural diagram of a display panel according to another embodiment of the present application;

fig. 29 is a schematic structural diagram of a display panel according to yet another embodiment of the present application;

fig. 30 is a schematic structural diagram of a display panel according to still another embodiment of the present application;

fig. 31 is a schematic structural diagram of a display panel according to another embodiment of the present application;

fig. 32 is a schematic structural diagram of a display panel according to yet another embodiment of the present application;

fig. 33 is a schematic structural diagram of a display panel according to still another embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

Hereinafter, the terms "first", "second", and the like are used for descriptive convenience only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "at least one" means one or more, and "a plurality" means two or more, unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple.

In addition, in the embodiments of the present application, "upper", "lower", "left", and "right" are not limited to being defined with respect to the schematically-placed orientations of the components in the drawings, and it should be understood that these directional terms may be relative concepts that are used for descriptive and clarifying purposes with respect to the components, and that may be changed accordingly depending on the orientation in which the components in the drawings are placed.

In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate. In addition, the term "electrically connected" may be directly electrically connected or indirectly electrically connected through an intermediate.

Embodiments of the present embodiment will be described in detail below with reference to the accompanying drawings.

The flexible substrate, the crystal-attached film COF and the display screen provided by the embodiment of the application can be applied to electronic devices such as mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (UMPC), handheld computers, netbooks, Personal Digital Assistants (PDA), wearable electronic devices and virtual reality devices, and the embodiment of the application does not limit the electronic devices, especially smart watches, advertisement display devices and vehicle-mounted display devices with circular, arc-shaped or other special-shaped display interfaces.

For example, fig. 3 shows a schematic structural diagram of the electronic device 100.

The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a Universal Serial Bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a camera 193, a display screen 194, and the like.

It is to be understood that the illustrated structure of the embodiment of the present invention does not specifically limit the electronic device 100. In other embodiments of the present application, electronic device 100 may include more or fewer components than shown, or some components may be combined, some components may be split, or a different arrangement of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

Processor 110 may include one or more processing units, such as: the processor 110 may include an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a video codec, a Digital Signal Processor (DSP), a baseband processor, and/or a neural-Network Processing Unit (NPU), etc. The different processing units may be separate devices or may be integrated into one or more processors.

A memory may also be provided in processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may hold instructions or data that have just been used or recycled by the processor 110. If the processor 110 needs to reuse the instruction or data, it can be called directly from the memory. Avoiding repeated accesses reduces the latency of the processor 110, thereby increasing the efficiency of the system.

In some embodiments, processor 110 may include one or more interfaces. The interface may include an integrated circuit (I2C) interface, an integrated circuit built-in audio (I2S) interface, a Pulse Code Modulation (PCM) interface, a universal asynchronous receiver/transmitter (UART) interface, a Mobile Industry Processor Interface (MIPI), a general-purpose input/output (GPIO) interface, a Subscriber Identity Module (SIM) interface, and/or a Universal Serial Bus (USB) interface, etc.

The charging management module 140 is configured to receive charging input from a charger. The charger may be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 may receive charging input from a wired charger via the USB interface 130. In some wireless charging embodiments, the charging management module 140 may receive a wireless charging input through a wireless charging coil of the electronic device 100. The charging management module 140 may also supply power to the electronic device through the power management module 141 while charging the battery 142.

The power management module 141 is used to connect the battery 142, the charging management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and/or the charge management module 140, and supplies power to the processor 110, the internal memory 121, the display 194, the camera 193, the wireless communication module 160, and the like. The power management module 141 may also be used to monitor parameters such as battery capacity, battery cycle count, battery state of health (leakage, impedance), etc. In some other embodiments, the power management module 141 may also be disposed in the processor 110. In other embodiments, the power management module 141 and the charging management module 140 may be disposed in the same device.

The wireless communication function of the electronic device 100 may be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, a modem processor, a baseband processor, and the like.

The antennas 1 and 2 are used for transmitting and receiving electromagnetic wave signals. Each antenna in the electronic device 100 may be used to cover a single or multiple communication bands. Different antennas can also be multiplexed to improve the utilization of the antennas. For example: the antenna 1 may be multiplexed as a diversity antenna of a wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.

The mobile communication module 150 may provide a solution including 2G/3G/4G/5G wireless communication applied to the electronic device 100. The mobile communication module 150 may include one or more filters, switches, power amplifiers, Low Noise Amplifiers (LNAs), and the like. The mobile communication module 150 may receive the electromagnetic wave from the antenna 1, filter, amplify, etc. the received electromagnetic wave, and transmit the electromagnetic wave to the modem processor for demodulation. The mobile communication module 150 may also amplify the signal modulated by the modem processor, and convert the signal into electromagnetic wave through the antenna 1 to radiate the electromagnetic wave. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be disposed in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be disposed in the same device as at least some of the modules of the processor 110.

The modem processor may include a modulator and a demodulator. The modulator is used for modulating a low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used for demodulating the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then passes the demodulated low frequency baseband signal to a baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and then transferred to the application processor. The application processor outputs a sound signal through an audio device (not limited to the speaker 170A, the receiver 170B, etc.) or displays an image or video through the display screen 194. In some embodiments, the modem processor may be a stand-alone device. In other embodiments, the modem processor may be provided in the same device as the mobile communication module 150 or other functional modules, independent of the processor 110.

The wireless communication module 160 may provide a solution for wireless communication applied to the electronic device 100, including Wireless Local Area Networks (WLANs) (e.g., wireless fidelity (Wi-Fi) networks), Bluetooth (BT), Global Navigation Satellite System (GNSS), Frequency Modulation (FM), Near Field Communication (NFC), Infrared (IR), and the like. The wireless communication module 160 may be one or more devices that integrate one or more communication processing modules. The wireless communication module 160 receives electromagnetic waves via the antenna 2, performs frequency modulation and filtering processing on electromagnetic wave signals, and transmits the processed signals to the processor 110. The wireless communication module 160 may also receive a signal to be transmitted from the processor 110, perform frequency modulation and amplification on the signal, and convert the signal into electromagnetic waves through the antenna 2 to radiate the electromagnetic waves.

In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150 and antenna 2 is coupled to wireless communication module 160 so that electronic device 100 can communicate with networks and other devices through wireless communication techniques. The wireless communication technology may include global system for mobile communications (GSM), General Packet Radio Service (GPRS), code division multiple access (code division multiple access, CDMA), Wideband Code Division Multiple Access (WCDMA), time-division code division multiple access (time-division code division multiple access, TD-SCDMA), Long Term Evolution (LTE), LTE, BT, GNSS, WLAN, NFC, FM, and/or IR technologies, etc. The GNSS may include a Global Positioning System (GPS), a global navigation satellite system (GLONASS), a beidou navigation satellite system (BDS), a quasi-zenith satellite system (QZSS), and/or a Satellite Based Augmentation System (SBAS).

The electronic device 100 implements display functions via the GPU, the display screen 194, and the application processor. The GPU is a microprocessor for image processing, and is connected to the display screen 194 and an application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 110 may include one or more GPUs that execute program instructions to generate or alter display information.

The display screen 194 is used to display images, video, and the like. The display screen 194 includes a display panel. The display panel may adopt a Liquid Crystal Display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode, AMOLED), a flexible light-emitting diode (FLED), a miniature, a Micro-oeld, a quantum dot light-emitting diode (QLED), and the like. In some embodiments, the electronic device 100 may include 1 or N display screens 194, with N being a positive integer greater than 1. In the embodiment of the present application, the display panel may adopt a flexible panel, and the display panel provided in the embodiment of the present application is not limited to a display panel based on a Low Temperature Polysilicon (LTPS), where the LTPS is abbreviated as p-Si) process, but is also applicable to a display panel based on a Low Temperature Polysilicon Oxide (LTPO) process, because two Thin Film Transistor (TFT) devices, namely LTPS and Oxide, are integrated in a pixel unit based on LTPO, where the Oxide TFT is an NMOS structure and the LTPS TFT is a PMOS structure, and gates of the two TFTs need to be connected to respective independent scan line control, so that the pixel unit of LTPO can be connected to more scan lines (relative to the pixel unit of the LTPS process), and thus has a higher requirement for a narrow frame.

The electronic device 100 may implement a shooting function through the ISP, the camera 193, the video codec, the GPU, the display 194, the application processor, and the like.

The ISP is used to process the data fed back by the camera 193. For example, when a photo is taken, the shutter is opened, light is transmitted to the camera photosensitive element through the lens, the optical signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing and converting into an image visible to naked eyes. The ISP can also carry out algorithm optimization on the noise, brightness and skin color of the image. The ISP can also optimize parameters such as exposure, color temperature and the like of a shooting scene. In some embodiments, the ISP may be provided in camera 193.

The camera 193 is used to capture still images or video. The object generates an optical image through the lens and projects the optical image to the photosensitive element. The photosensitive element may be a Charge Coupled Device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The light sensing element converts the optical signal into an electrical signal, which is then passed to the ISP where it is converted into a digital image signal. And the ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into image signal in standard RGB, YUV and other formats. In some embodiments, the electronic device 100 may include 1 or N cameras 193, N being a positive integer greater than 1.

The external memory interface 120 may be used to connect an external memory card, such as a Micro SD card, to extend the memory capability of the electronic device 100. The external memory card communicates with the processor 110 through the external memory interface 120 to implement a data storage function. For example, files such as music, video, etc. are saved in the external memory card.

Internal memory 121 may be used to store one or more computer programs, including instructions. The processor 110 may cause the electronic device 100 to perform the methods provided in some embodiments of the present application, as well as various functional applications and data processing, etc. by executing the above-mentioned instructions stored in the internal memory 121. The internal memory 121 may include a program storage area and a data storage area. Wherein, the storage program area can store an operating system; the storage program area may also store one or more application programs (e.g., a gallery, contacts, etc.), and the like. The storage data area may store data (such as photos, contacts, etc.) created during use of the electronic device 101, and the like. In addition, the internal memory 121 may include a high-speed random access memory, and may also include a nonvolatile memory, such as one or more magnetic disk storage devices, flash memory devices, Universal Flash Storage (UFS), and the like. In other embodiments, the processor 110 causes the electronic device 100 to execute the methods provided in the embodiments of the present application, and various functional applications and data processing by executing instructions stored in the internal memory 121 and/or instructions stored in a memory provided in the processor.

The electronic device 100 may implement audio functions via the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the headset interface 170D, and the application processor. Such as music playing, recording, etc.

The audio module 170 is used to convert digital audio information into an analog audio signal output and also to convert an analog audio input into a digital audio signal. The audio module 170 may also be used to encode and decode audio signals. In some embodiments, the audio module 170 may be disposed in the processor 110, or some functional modules of the audio module 170 may be disposed in the processor 110.

The speaker 170A, also called a "horn", is used to convert the audio electrical signal into an acoustic signal. The electronic apparatus 100 can listen to music through the speaker 170A or listen to a handsfree call.

The receiver 170B, also called "earpiece", is used to convert the electrical audio signal into an acoustic signal. When the electronic apparatus 100 receives a call or voice information, it can receive voice by placing the receiver 170B close to the ear of the person.

The microphone 170C, also referred to as a "microphone," is used to convert sound signals into electrical signals. When making a call or transmitting voice information, the user can input a voice signal to the microphone 170C by speaking the user's mouth near the microphone 170C. The electronic device 100 may be provided with one or more microphones 170C. In other embodiments, the electronic device 100 may be provided with two microphones 170C to achieve a noise reduction function in addition to collecting sound signals. In other embodiments, the electronic device 100 may further include three, four or more microphones 170C to collect sound signals, reduce noise, identify sound sources, perform directional recording, and so on.

The headphone interface 170D is used to connect a wired headphone. The headset interface 170D may be the USB interface 130, or may be a 3.5mm open mobile electronic device platform (OMTP) standard interface, a cellular telecommunications industry association (cellular telecommunications industry association) standard interface of the USA.

The sensor module 180 may include a pressure sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, and the like.

In embodiments of the present application, a touch sensor, also referred to as a "touch device". The touch sensor may be disposed on the display screen 194, and the touch sensor and the display screen 194 form a touch screen, which is also called a "touch screen". The touch sensor is used to detect a touch operation applied thereto or nearby. The touch sensor may communicate the detected touch operation to the application processor to determine the touch event type. Visual output related to the touch operation may be provided through the display screen. In other embodiments, a touch panel provided with a touch sensor array formed by a plurality of touch sensors may be disposed on the surface of the display panel in a hanging manner. In other embodiments, the touch sensor may be located in a different location than the display screen 194. In the embodiments of the present application, the form of the touch sensor is not limited, and the touch sensor may be, for example, a capacitor or a varistor.

In addition, the electronic device may further include one or more components such as a key, a motor, an indicator, and a Subscriber Identity Module (SIM) card interface, which is not limited in this embodiment of the present application.

Referring to fig. 4, taking the display of a circular smart watch as an example, the display 194 is usually disposed between the outer frame 41 and the bottom cover (not shown in fig. 4) of the watch. As shown in fig. 5 and 6, the display panel includes a display panel 51, and the display panel 51 includes a display area (active area, AA) and a non-display area (frame) located around the display area AA. The display area AA includes a pixel array formed by a plurality of pixel units distributed in an array. In addition, the display area AA includes driving lines arranged crosswise, the driving lines including SCAN lines SCAN and DATA lines DATA, wherein pixel units are arranged at positions where the SCAN lines SCAN and the DATA lines DATA cross, and one pixel unit is connected to one DATA line DATA and at least one SCAN line SCAN. The display panel further includes a COF52 and a Flexible Printed Circuit (FPC) 53.

Wherein, one driving line of any pixel unit in the pixel array is connected with one fan-out line of the display panel 51; the display panel 51 is provided with a connection terminal 511, the connection terminal 511 includes terminals (pins) of a plurality of fan-out lines of the display panel 51, wherein the COF52 and the FPC53 are provided on the back surface of the display panel 51, and the connection terminal 511 of the display panel 51 is bent to the back surface of the display panel 51 and is connected to the connection terminal 521 of the COF 52. As shown in fig. 7, a connection manner between the connection terminal 511 of the display panel 51 and the connection terminal 521 of the COF52 is shown, wherein the terminals of the connection terminal 511 and the terminals of the connection terminal 521 are bonded one by using a FOF (film on film) process, for example, the

terminals

5111 and 5211 are bonded together, and the connection terminal 511 and each of the other terminals in the connection terminal 521 are sequentially bonded together in a one-to-one manner, so as to achieve the binding (bonding) connection between the connection terminal 511 of the display panel 51 and the anisotropic conductive film (bonding) of the connection terminal 521 of the COF 52. Unless otherwise specified, the connection end and the connection end in the following schemes refer to bonding connection in which terminals in two interconnected connection ends are bonded to each other.

In addition, a display driving circuit 522 is disposed on the COF52, and the display driving circuit 522 may be a Display Driver Integrated Circuit (DDIC). In this case, the terminals in the connection terminals 521 of the COF52 are electrically connected to the pins of the DDIC through the wiring on the COF 52. The connection terminal 523 of the COF52 is connected to the connection terminal 531bonding of the FPC53, the terminal of the connection terminal 523 of the COF52 is electrically connected to the pin of the DDIC, the other set of connection terminals 532 of the FPC53 is connected to a Printed Circuit Board (PCB) through a connector, and the terminal 531 of the connection terminal 53 is connected to the terminal of the other set of connection terminals 532 through a trace on the FPC 53. An Application Processor (AP) (e.g., a CPU), a power management chip (power IC), and the like are mounted on a Printed Circuit Board (PCB) (or a driver board, a driver board). The printed circuit board, the COF52 and the FPC52 are all arranged between the outer frame 41 of the watch on the back of the display panel and the bottom cover.

In this way, the AP provides display data for the DDIC and the display panel 51 to present actual image information; the power IC supplies an operating voltage to the DDIC and the display panel 51. The FPC53 provides a signal transmission connection path between the PCB and the DDIC. The DDIC is responsible for receiving signals transmitted from the PCB and controlling the signals to be transmitted to the display panel 51 according to a specific timing. For example, after the display data output by the AP passes through the DDIC, the display data is converted into a scan signal and a data voltage Vdata, and the scan signal and the data voltage Vdata are transmitted to the pixel units coupled to the driving lines to drive the pixel units to emit light.

The operation principle of the display panel 51 with one pin out (i.e. the display panel with only one set of connection terminals 511) is mainly described in fig. 5, wherein such a display panel 51 has the problems as mentioned in the background art, and the further narrowing of the frame size of the lower frame of the screen is severely limited. In another embodiment of the present application, as shown in fig. 8, a multi-pin display panel 81 is provided, a display area AA of the display panel 81 includes a pixel array, wherein one driving line of any pixel unit in the pixel array is connected to one fan-out line of the display panel 81; at least two sets of connection terminals are disposed on the display panel 81, and fig. 8 specifically shows a connection terminal 811, a connection terminal 812, and a connection terminal 813 by taking three sets of connection terminals as an example; the connection terminals (811, 812, and 813) include terminals of a plurality of fan-out lines of the display panel 81. In conjunction with the above description, when the display panel 81 does not have a touch function, the pixel unit includes a pixel circuit, and the driving circuit includes a SCAN line SCAN and a DATA line DATA connected to the pixel circuit.

In order to provide signals such as display data and operating voltage to the display panel 81, an embodiment of the present application provides a COF91, referring to fig. 9, 10 and 11 (fig. 11 is a schematic structural diagram of fig. 9 at a section B-B'), the COF91 includes: a flexible substrate FPC 916; a chip 914 provided on a flexible substrate FPC 916; the flexible substrate FPC916 includes at least two sets of connection terminals, of which three sets of connection terminals (911, 912, 913) are shown in fig. 9, 10 and 11; the terminals at the connection terminals (911, 912, 913) are electrically connected to the pins of the chip 914 through the wiring on the Flexible Printed Circuit (FPC) 916, and the terminals of the fan-out wiring of the display panel 81 are bonded to the terminals at the connection terminals (911, 912, 913) of the COF 91.

As described above, the connection terminals (811, 812, and 813) of the display panel 81 are connected to the connection terminals (911, 912, and 913) of the COF91 one-to-one. The flexible substrate 916 of the COF91 further includes a connection terminal 915, wherein a terminal of the connection terminal 915 is electrically connected to a pin of the chip 914 through a circuit on the flexible substrate 916, a terminal of the connection terminal 915 is bonded to a terminal of the flexible substrate FPC92, and a terminal of the flexible substrate FPC92 is electrically connected to the driving circuit board. The connection between the driving circuit board and the COF91 can be described with reference to the connection between the PCB and the COF52 in fig. 5. In the examples shown in fig. 8, 9, 10, and 11, since the display panel 81 has only a display function, the chip 914 may be used to implement a function related to display driving of the display panel, for example, the chip 914 employs DDIC.

In another example, the display panel may have a touch function at the same time, for example, the touch sensor may be integrated in a pixel unit of the display panel, and thus, the pixel unit further includes the touch sensor, such as the display panel 81-a shown in fig. 12, and the driving line includes an input channel trace Rx and an output channel trace Tx connected to the touch sensor. As shown in fig. 13, a display panel and an on cell TP (touch panel, i.e., a touch sensor of the touch panel is integrated in a pixel unit of the display panel) can be implemented. In this example, one group or all of the connection terminals (811, 812, and 813) of the display panel 81-a contain terminals of fan-out lines connected to Rx or Tx; some or all of the connections (911, 912, 913) of the COF91 contain terminals that bond to the terminals of the fan-out lines of Rx or Tx. When the display panel shown in fig. 12 is used, the chip 914 needs to have the related functions of display driving and touch control for the display panel, and at this time, the chip 914 may use a touch and display driver integrated chip (TDDI IC) integrating a DDIC and a TP IC.

In another example, the touch panel may be externally hung on the back of the display panel, in order to be used with the display panel, generally, the effective touch area of the touch panel coincides with the display area AA of the display panel, the touch panel 21 includes a touch sensor array formed by a plurality of touch sensors distributed in an array, as shown in fig. 14, the touch panel 21 of the display screen further includes driving lines arranged crosswise, the driving lines include input channel traces Rx and output channel traces Tx connected by the touch sensors, wherein the touch sensors are arranged at positions where Rx and Tx intersect, and one touch sensor is connected by one Rx and one Tx. The display screen also comprises a COF22 and a flexible substrate FPC 23.

As shown in fig. 14, one driving line of any touch sensor in the touch sensor array is connected to one fan-out line of the touch panel 21; the touch panel 21 is provided with a connection terminal 211, the connection terminal 211 includes terminals of a plurality of fan-out lines of the touch panel 21, the COF22 and the flexible substrate FPC23 are disposed on the back surface of the touch panel 21, and the connection terminal 211 is bent to the back surface of the touch panel 21 and correspondingly connected to the connection terminal 221 of the COF 22. The connection between the connection end 211 of the touch panel 21 and the connection end 221 of the COF22 can refer to the connection between the connection end 511 of the display panel 51 and the connection end 521 of the COF52 in fig. 7, and will not be described herein again.

In addition, the COF22 is provided with a touch driving circuit 222, and the touch driving circuit 222 may be a Touch Panel Integrated Circuit (TPIC). In this case, the terminals in the connection 221 of the COF22 are electrically connected to the pins of the TPIC through the traces on the COF 22. The connection terminal 223 of the COF22 is connected to the connection terminal 231bonding of the FPC23, the terminal of the connection terminal 223 of the COF22 is electrically connected to the pin of the TPIC, the other set of connection terminals 232 of the FPC23 is connected to a Printed Circuit Board (PCB) through a connector, and the terminal of the connection terminal 231 of the FPC23 is connected to the terminal of the other set of connection terminals 232 through a wire on the FPC 23. The PCB (or the driving circuit board, the driving system board) has an application processor AP (e.g., CPU) mounted thereon. The PCB, the COF22 and the FPC22 are all disposed between the bezel 41 of the watch on the back of the touch panel 21 and the bottom cover.

In this way, the AP provides an initial signal to the touch sensors of the touch panel 21 through the TPIC (e.g., transmits the initial signal to the touch sensors through Rx), and detects a touch signal generated by the corresponding touch sensors through the TPIC when a touch event occurs at the touch sensors (e.g., the touch sensors transmit the touch signal through Tx). The FPC23 provides a signal transmission connection path between the PCB and the TPIC. The TPIC is responsible for receiving signals transmitted by the PCB, controlling and transmitting the signals to the touch sensors of the touch panel 21 according to a specific timing sequence, and receiving touch signals generated by the touch sensors.

Fig. 14 mainly describes the operating principle of a touch panel with a single pin outlet (i.e. a touch panel with only one set of connecting terminals 211), where such a touch panel has a problem that the bezel size of the lower bezel (where the connecting terminals 211 are located) of the screen is further narrowed, which is severely limited. In another embodiment of the present application, as shown in fig. 15, a touch panel 31 with multiple pin outlets is provided, where the touch panel 31 includes a touch sensor array, where one driving line of any touch sensor in the touch sensor array is connected to one fan-out line of the touch panel 31; at least two groups of connection terminals are disposed on the touch panel 31, and fig. 16 specifically shows the connection terminal 311 and the connection terminal 312 by taking the two groups of connection terminals as an example; the connection terminals (311, 312) include terminals of a plurality of fan-out lines of the touch panel 31. In conjunction with the above description, the driving circuit of the touch panel 31 includes the input channel trace Rx and the output channel trace Tx connected by the touch sensor. Touch panel 31 is last to have set up a plurality of link (311, 312), can be connected to the terminal in the link of difference respectively through the fan-out circuit with touch panel's drive circuit like this, can reduce the width of link through evenly setting up the terminal in every link like this to further reduce the frame size, improve the screen and account for the ratio, and the reduction of frame size also is favorable to reducing touch panel's the biggest excircle, saves the installation space of electronic equipment complete machine.

In order to provide an initial signal to the touch panel 31 and receive a touch signal of the touch panel 31, an embodiment of the present application provides a COF32, referring to fig. 16, a COF32, including: a flexible substrate FPC 324; a chip 323 disposed on the flexible substrate FPC 324; the flexible substrate FPC324 includes at least two sets of connection terminals, of which two sets of connection terminals (321, 322) are shown in fig. 16; the terminals on the connection terminals (321, 322) are electrically connected to the pins of the chip 323 through the traces on the flexible printed circuit board FPC324, and the terminals of the fan-out traces of the touch panel 31 are bonded to the terminals on the connection terminals (321, 322).

Specifically, the connection terminals (311, 312) of the touch panel 31 are connected to the connection terminals (321, 322) of the COF32 one-to-one, respectively. The flexible substrate FPC324 of the COF32 further includes another connection terminal 325, wherein a terminal of the other connection terminal 325 is electrically connected to a pin of the chip 323 through a wire on the flexible substrate FPC324, a terminal of the other connection terminal 325 is bonded to a terminal of the flexible substrate FPC33, and a terminal of the flexible substrate 33 is electrically connected to the driving circuit board. The connection between the driving circuit board and the COF32 can be described with reference to the connection between the driving circuit board and the COF22 in fig. 14, which is not described herein again.

Referring to fig. 17, a display screen is provided, where the display screen includes a display panel 81 and a touch panel (not shown in fig. 17) externally mounted on the back surface of the display panel, and in the scheme, the scheme including the display panel 81, COF91 and PCB92 provided in fig. 9 and the scheme including the touch panel 31, COF32 and FPC33 provided in fig. 16 may be directly integrated, the touch panel (not shown in fig. 17) is externally mounted on the back surface of the display panel 81, and the COF91, PCB92, COF32 and FPC33 are mounted on the back surface of the touch panel.

In another implementation manner, referring to fig. 18 and fig. 19 (where fig. 19 is a schematic structural diagram of a section B-B' of fig. 18) and fig. 20, a display screen is provided, where the display screen includes a display panel 81 and a touch panel 31 externally hung on a back surface of the display panel 81, in this embodiment, the connection terminals (311, 312) of the touch panel 31 may be directly bonded to the FPC 92.

As shown in fig. 18, a flexible printed circuit board FPC92 is provided, which includes at least two sets of connection terminals (923, 924) connected to the connection terminals (311, 312) of the touch panel 31, a set of connection terminals 921 connected to the COF91, and a set of connection terminals (connection terminals 922 shown in fig. 20) connected to the driving circuit board. As shown in fig. 20, terminals at the connection terminals (923, 924) of the flexible printed circuit board FPC92 are connected to terminals at the connection terminals 921 via lines on the flexible printed circuit board FPC 92. As shown in fig. 18, the terminals on the connection terminals (923, 924) are bonded to the terminals of the fan-out lines of the touch panel 31 shown in fig. 15; the connection terminal 921 of the flexible substrate FPC92 is connected to the connection terminal 915 of the COF91 (the connection manner of the connection terminal 921 and the connection terminal 915 can refer to the connection manner of the connection terminal 523 and the connection terminal 531 in fig. 5, which is not described herein again). In this scheme, it should be noted that the specific structure of the COF91 can refer to the description of the related embodiment in fig. 9, where the difference between this scheme and fig. 9 is that the terminals of the fan-out lines of the driving lines of the touch sensor in the touch panel 31 in the example in fig. 9 are directly bonded to the terminals in the connection terminals (911, 912, 913) of the COF91, so as to connect the touch sensor to the chip 914 (TDDI); in this embodiment, the terminals of the fan-out lines of the driving lines of the touch sensor in the touch panel 31 are bonded to the terminals of the connection terminals (923, 924) on the flexible substrate FPC92, and the terminals of the connection terminals 915 of the COF91 are connected to the lines on the flexible substrate FPC92, and further the connection between the touch sensor and the chip 914(TDDI) is realized by the connection between the connection terminals 915 of the COF91 and the chip 914 (TDDI).

In another implementation manner, referring to fig. 21, a display screen is provided, where the display screen includes a display panel 81 and a touch panel 31 externally hung on a back surface of the display panel 81, and in this embodiment, a connection end of the touch panel 31 may be directly bonded to the flexible substrate FPC 92.

As shown in fig. 21, 22 (fig. 22 is a schematic structural view of a cross section at C-C' of fig. 21), 23, an FPC92 is provided, on which a chip 925 is provided on an FPC 92; the FPC92 includes at least two sets of connection terminals (923, 924) connected to the connection terminals (311, 312) of the touch panel 31, a set of connection terminals 921 connected to the COF91, and a set of connection terminals (connection terminals 922 shown in fig. 23) connected to the driving circuit board. Wherein, the terminals on the connection terminals (923, 924) are electrically connected to the pins of the chip 925 through the wires on the FPC92, as shown in fig. 21, the terminals on the connection terminals (923, 924) are bonded to the terminals of the fan-out wires of the touch panel 31 shown in fig. 15; the connection ends 921 of the flexible substrate FPC92 are connected to the connection ends 915 of the COF91 (the connection manner of the connection ends 921 and 915 can refer to the connection manner of the connection ends 523 and 531 in fig. 5, which is not described herein again). The terminals on the connection terminal 922 are electrically connected to pins of the chip 925 through wires on the FPC92, or the terminals on the connection terminal 922 are electrically connected to the terminals of the connection terminal 921 through wires on the FPC92 (a part of the wires directly pass through the lower part of the chip 925 shown in fig. 23 and are not electrically connected to the chip 925); the terminals of the connection end 922 are electrically connected to the driving circuit board. In this scheme, it should be noted that the specific structure of the COF91 can refer to the description of the related embodiment in fig. 9, where the difference between this scheme and fig. 9 is that the terminals of the fan-out lines of the driving lines of the touch sensor in the touch panel 31 in the example in fig. 9 are directly bonded to the terminals in the connection terminals (911, 912, 913) of the COF91, so as to connect the touch sensor to the chip 914 (TDDI); in this embodiment, since the touch panel 31 is externally disposed on the display panel, the display panel is not provided with a touch sensor, the chip 914 on the COF91 adopts a DDIC, terminals of fan-out lines of driving lines of the touch sensor in the touch panel 31 are bonded to terminals (923, 924) of connecting terminals on the flexible substrate FPC92, and are connected to the chip 925 on the FPC92 through lines on the flexible substrate FPC92, and the chip 925 can adopt a TPIC.

As shown in fig. 24, an FPC41 is provided, on which a chip 413 is provided over an FPC 41; the FPC41 includes at least two sets of connection terminals (411, 412) connected to the connection terminals (311, 312) of the touch panel 31 and one set of connection terminals connected to the driving circuit board (not shown in fig. 24). Wherein, the terminals on the connection terminals (411, 412) are electrically connected with the pins of the chip 413 through the traces on the FPC41, as shown in fig. 24, the terminals on the connection terminals (411, 412) are bonded with the terminals of the fan-out traces of the touch panel 31 shown in fig. 15; the terminals on the connection terminals connected to the driver circuit board are electrically connected to the pins of the chip 413 through the traces on the FPC 41. In this embodiment, the touch panel 31 is externally attached to the display panel, so that no touch sensor is disposed on the display panel, terminals of fan-out lines of driving lines of the touch sensor in the touch panel 31 are bonded to terminals (411, 412) of the connection terminals on the flexible substrate FPC41, and are connected to the chip 413 on the FPC41 through lines on the flexible substrate FPC41, and the chip 413 may be a TPIC. As shown in fig. 24, the display screen using the FPC41 and the touch panel 31 may further include a display panel 81, a COF91, and an FPC91, and the specific structure of the COF91 may be described with reference to the description of the related embodiment in fig. 9, where the chip 914 on the COF91 uses a DDIC, and the connection end 921 of the flexible substrate FPC91 is connected to the connection end 915 of the COF91 (where the connection manner of the connection end 921 and the connection end 915 may refer to the connection manner of the connection end 523 and the connection end 531 in fig. 5, and details are not repeated here). The difference from the embodiment of fig. 21 is that the COF91 and the touch panel 31 may be connected to the driving circuit board through respective corresponding FPCs. In the scheme, a mode that the touch panel with multiple pins is directly connected to the driving circuit board through the FPC41 is provided, wherein the TPIC is disposed on the FPC41, because the structure of the touch panel is simpler (compared with the display panel), the number of outgoing lines of the driving circuit of the touch panel (compared with the display panel) is relatively smaller, and the processing logic of the TPIC is simpler, the precision requirement of the manufacturing process of the TPIC is lower than that of a DDIC (or TDDI IC), and the TPIC can be directly manufactured on the FPC with lower process precision requirement (compared with a COF).

In addition, based on the above-mentioned display panel with multiple pin outlets, since the display panel includes multiple connection terminals, the multiple connection terminals may be designed in any number or at any position of the display panel according to the principle of minimizing the bezel according to the design requirement, for example, for a circular display panel, in order to improve the symmetry of the display area and the installation space, the multiple connection terminals may be uniformly disposed around the display panel.

Currently, a cross-sectional view of a general flat display panel mounted on a front case of a smart watch is shown in fig. 25, in which an arc-shaped portion (a portion in a dotted frame of fig. 25) where an edge of the front case is raised does not generally display an image. In order to increase the display area by making full use of the space of the arc-shaped raised portion in the dotted line frame, the display panel may be extended to the position of the arc-shaped portion as shown in fig. 26. As shown in fig. 26 and 27, the display panel having a circular arc screen has an arc structure capable of displaying an image at a frame position of the display screen. If the display panel takes a regular shape, for example a circle, as shown in fig. 28. In the installation process of assembling the display panel to the electronic device, the frame position needs to be bent to the back of the display panel by a certain angle to form an arc-shaped structure corresponding to that in fig. 27, so that the edge of the display panel can be wrinkled, and the display effect is affected. Therefore, the display panel is designed to be expanded into a shape as shown in fig. 29, and the display areas are protruded at the periphery of the display panel, wherein the display areas have effective display areas, and the display areas are not directly connected according to the design requirements of the arc screen; the display area blocks can be trapezoidal, triangular or semicircular (wherein semicircular is taken as an example in fig. 29), so that the display screen shown in fig. 31 is formed by bending the display area blocks to the back of the display panel for a certain angle to cover the frame area of the arc screen, and the distance between the adjacent display area blocks in the shape that the display area blocks are bent can be connected together or unfolded relative to the display panel is smaller, so that the screen occupation ratio of the arc screen can be ensured, and the edge of the display panel can be prevented from being wrinkled. However, for the display panel with one pin on the single end, as shown in fig. 29, only one set of connection terminals is usually included, and when the size of the connection terminal is larger, and the connection terminal is folded to the back of the display panel for connecting the COF, the distance between the adjacent display blocks on both sides of the connection terminal is longer, as shown in fig. 30. When the display panel is assembled into a display screen, the display blocks are unevenly distributed on the display screen (as shown in fig. 31, a display gap with a larger area appears at a position corresponding to the connection end), which affects the display effect. When the display panel with the multi-pin output provided by the embodiment of the present application is used, as shown in fig. 32, taking five connection terminals as an example, since the size of the connection terminals can be reduced in the display panel with the multi-pin output, the connection terminals can be uniformly arranged between each display area, as shown in fig. 33. When the display panel is assembled into a display screen, the display blocks are uniformly distributed on the display screen, and a good display effect can be obtained.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A first attached-crystal film COF, comprising:

a first flexible substrate;

a first chip disposed on the first flexible substrate;

the first flexible substrate comprises at least two groups of first connecting ends, wherein terminals on the first connecting ends are electrically connected with pins of the first chip through circuits on the first flexible substrate, and terminals of fan-out circuits of the display panel or the touch panel are bonded with the terminals on the first connecting ends.

2. The first COF of claim 1, wherein the display region of the display panel comprises a pixel array, wherein one drive line of any pixel cell in the pixel array is connected to one fan-out line of the display panel;

the display panel is provided with at least two groups of second connecting ends, the second connecting ends comprise terminals of a plurality of fan-out lines of the display panel, the first flexible substrate is arranged on the back face of the display panel, and one group of second connecting ends are bent to the back face of the display panel and are correspondingly connected with one group of first connecting ends.

3. The first COF of claim 2, wherein the pixel cell comprises a pixel circuit, and the driving lines comprise scan lines and data lines connected to the pixel circuit.

4. The first COF of claim 3, wherein the pixel cell further comprises a touch sensor, and the driving lines comprise input channel traces and output channel traces connected to the touch sensor.

5. The first COF of claim 1, wherein the touch panel comprises an array of touch sensors, wherein one drive trace of any touch sensor in the array of touch sensors is connected to one fan-out trace of the touch panel;

the touch panel is provided with at least two groups of second connecting ends, the second connecting ends comprise terminals of a plurality of fan-out lines of the touch panel, the first flexible substrate is arranged on the back face of the touch panel, and one group of second connecting ends are bent to the back face of the touch panel and are correspondingly connected with one group of first connecting ends.

6. The first COF of claim 5, wherein the drive lines comprise input channel traces and output channel traces connected to the touch sensor.

7. The first COF of any one of claims 1-6, wherein the first flexible substrate comprises a third connection terminal, wherein a terminal on the third connection terminal is electrically connected to the pin of the first chip through a wire on the first flexible substrate, a terminal of the third connection terminal is bonded to a terminal of a second flexible substrate, and a terminal of the second flexible substrate is electrically connected to a driving circuit board.

8. A second flexible substrate, characterized in that,

the second flexible substrate comprises at least two groups of fourth connecting ends, one group of fifth connecting ends and one group of sixth connecting ends;

the terminal on the fourth connecting end is connected with the terminal on the fifth connecting end through a circuit on the second flexible substrate, and the terminal on the fourth connecting end is bonded with the terminal of the fan-out circuit of the touch panel;

the terminal of the fifth connection terminal is connected with a first COF, wherein the first COF comprises a first flexible substrate and a first chip arranged on the first flexible substrate; the first flexible substrate comprises at least one group of first connecting ends and one group of third connecting ends, wherein terminals on the first connecting ends are electrically connected with pins of the first chip through circuits on the first flexible substrate, terminals of fan-out circuits of the display panel are bonded with the terminals on the first connecting ends, terminals on the third connecting ends are electrically connected with the pins of the first chip through circuits on the first flexible substrate, and the terminals on the third connecting ends are bonded with the terminals of the fifth connecting ends;

and the terminal on the sixth connecting end is connected with the terminal on the fifth connecting end through the circuit on the second flexible substrate, and the terminal on the sixth connecting end is electrically connected with the driving circuit board.

9. The second flexible substrate of claim 8, wherein the touch panel is disposed on a back surface of the display panel, and a display area of the display panel includes a pixel array, wherein one driving line of any pixel unit in the pixel array is connected to one fan-out line of the display panel; the display panel is provided with at least one group of second connecting ends, the second connecting ends comprise terminals of a plurality of fan-out lines of the display panel, the first flexible substrate is arranged on the back face of the touch panel, and the group of second connecting ends are bent to the back face of the touch panel and are correspondingly connected with the group of first connecting ends.

10. The second flexible substrate of claim 9, wherein the pixel unit includes a pixel circuit, and the driving lines of the pixel unit include a scan line and a data line connected to the pixel circuit.

11. The second flexible substrate of any of claims 8-10, wherein the touch panel comprises an array of touch sensors, wherein one drive trace of any touch sensor in the array of touch sensors is connected to one fan-out trace of the touch panel; the touch panel is provided with at least two groups of seventh connecting ends, the seventh connecting ends comprise terminals of a plurality of fan-out lines of the touch panel, the second flexible substrate is arranged on the back face of the touch panel, and the seventh connecting ends are bent to the back face of the touch panel and correspondingly connected with the fourth connecting ends.

12. The second flexible substrate of claim 11, wherein the drive lines of the touch sensor comprise input channel traces and output channel traces connected to the touch sensor.

13. A second flexible substrate, wherein a second chip is disposed on the second flexible substrate;

the second flexible substrate comprises at least two groups of fourth connecting ends and one group of sixth connecting ends;

the terminal on the fourth connecting end is electrically connected with the pin of the second chip through the circuit on the second flexible substrate, and the terminal on the fourth connecting end is bonded with the terminal of the fan-out circuit of the touch panel;

and the terminal on the sixth connecting end is electrically connected with the pin of the second chip through the circuit on the second flexible substrate, and the terminal on the sixth connecting end is electrically connected with the driving circuit board.

14. The second flexible substrate of claim 13, further comprising a set of fifth connection ends;

the terminal of the fifth connection terminal is connected to a first COF, wherein the first COF includes a first flexible substrate and a first chip disposed on the first flexible substrate; the first flexible substrate comprises at least one group of first connecting ends and one group of third connecting ends, wherein terminals on the first connecting ends are electrically connected with pins of the first chip through circuits on the first flexible substrate, terminals of fan-out circuits of the display panel are bonded with the terminals on the first connecting ends, terminals on the third connecting ends are electrically connected with the pins of the first chip through circuits on the first flexible substrate, and the terminals on the third connecting ends are bonded with the terminals of the fifth connecting ends;

and the terminal on the sixth connecting end is electrically connected with the pin of the second chip through the circuit on the second flexible substrate, or the terminal on the sixth connecting end is electrically connected with the terminal of the fifth connecting end through the circuit on the second flexible substrate.

15. The second flexible substrate of claim 14, wherein the touch panel is disposed on a back surface of the display panel, and a display area of the display panel includes a pixel array, wherein one driving line of any pixel unit in the pixel array is connected to one fan-out line of the display panel; the display panel is provided with at least one group of second connecting ends, the second connecting ends comprise terminals of a plurality of fan-out lines of the display panel, the first flexible substrate is arranged on the back face of the touch panel, and the group of second connecting ends are bent to the back face of the touch panel and are correspondingly connected with the group of first connecting ends.

16. The second flexible substrate of claim 15, wherein the pixel unit comprises a pixel circuit, and the driving lines of the pixel unit comprise a scan line and a data line connected to the pixel circuit.

17. The second flexible substrate of any one of claims 13-16, wherein the touch panel comprises an array of touch sensors, wherein one drive trace of any one touch sensor in the array of touch sensors is connected to one fan-out trace of the touch panel; the touch panel is provided with at least two groups of seventh connecting ends, the seventh connecting ends comprise terminals of a plurality of fan-out lines of the touch panel, the second flexible substrate is arranged on the back face of the touch panel, and the seventh connecting ends are bent to the back face of the touch panel and correspondingly connected with the fourth connecting ends.

18. The second flexible substrate of claim 17, wherein the driving traces of the touch sensor comprise input channel traces and output channel traces connected to the touch sensor.

19. A touch panel, comprising: a touch sensor array;

one driving circuit of any touch sensor in the touch sensor array is connected with one fan-out circuit of the touch panel; at least two groups of second connecting ends are arranged on the touch panel, and the second connecting ends comprise terminals of a plurality of fan-out lines of the touch panel.

20. A display panel comprising a display panel and the first epitaxial film COF according to any one of claims 1 to 7.

21. A display screen comprising the touch panel of claim 19 and the second flexible substrate of any one of claims 8-12 or the second flexible substrate of any one of claims 13-18.

22. A display screen, comprising a touch panel and the first epitaxial film COF of any one of claims 1 to 7.