CN114679848B - Forming method of PCB incomplete electroplating bath and PCB preparation method - Google Patents
Forming method of PCB incomplete electroplating bath and PCB preparation method Download PDFInfo
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- CN114679848B CN114679848B CN202210407426.3A CN202210407426A CN114679848B CN 114679848 B CN114679848 B CN 114679848B CN 202210407426 A CN202210407426 A CN 202210407426A CN 114679848 B CN114679848 B CN 114679848B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The embodiment of the invention provides a forming method of a PCB incomplete electroplating bath and a PCB preparation method, which comprise the following steps: drilling pre-drilled holes on a plurality of preset positions on the periphery of a preformed process groove on a PCB to be processed, wherein part of the pre-drilled holes are positioned in the process groove, and the rest part of the pre-drilled holes are positioned in the side wall of the groove; electroplating the PCB with the pre-drilled holes to form conductive plating layers on the surface of the PCB, the side wall and the bottom wall of the process groove and the wall of the pre-drilled holes; and cutting the side wall of the groove from inside to outside by adopting a drilling process between all pre-drilled holes on the inner side of the side wall of the groove of the process groove of the PCB subjected to electroplating, and extending along the side wall of the groove to form long grooves which are sequentially communicated with all adjacent pre-drilled holes, wherein the cutting thickness of the side wall of the groove is larger than the thickness of the conductive coating during forming the long grooves, so that the incomplete electroplating groove with PTH half holes is obtained. The embodiment can effectively improve the molding efficiency and reduce the design cost.
Description
Technical Field
The embodiment of the invention relates to the technical field of PCB electroplating processing, in particular to a forming method of a PCB incomplete electroplating tank and a PCB preparation method.
Background
Currently, an incomplete plating tank (also called NPTH tank, non PLATING Through Hole) is usually designed on the existing PCB board, and a conventional incomplete plating tank is designed with PTH half holes (PLATING Through Hole, metalized holes) at four corners and opposite side walls respectively.
The existing method for forming the incomplete electroplating bath on the PCB mainly comprises the following steps: firstly, drilling each pre-drilling hole in a process tank of a PCB, electroplating the PCB, further drilling holes secondarily in the process tank, drilling a removing sharp point between each PTH hole and the inner wall of the process tank to remove sharp corners, and then milling out the conductive coating on the surface of the tank wall, which does not need to be electroplated, on the inner side of the process tank by adopting a CNC milling process, so that the incomplete electroplating tank is finally formed.
However, the inventor finds that, in a specific embodiment, the forming method of the incomplete plating tank needs to adopt a CNC routing process after secondary drilling to remove the conductive plating layer on the surface of the tank wall of the process tank without plating, the whole process is relatively complex, the efficiency is low, and when the plating material layer is routed by adopting the CNC routing process, the conductive plating layer on the wall of the PTH half-hole is easily pulled up, finally, no conductive plating layer is arranged in the PTH half-hole, and the production yield of the PCB is reduced.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is to provide a forming method of an incomplete electroplating bath of a PCB, which can effectively improve the forming efficiency and reduce the design cost.
The technical problem to be further solved by the embodiment of the invention is to provide the PCB preparation method, which can effectively improve the molding efficiency and reduce the design cost.
In order to solve the above technical problems, the embodiment of the present invention firstly provides the following technical solutions: a forming method of a PCB incomplete plating bath comprises the following steps:
drilling pre-drilled holes on a plurality of preset positions on the periphery of a preformed process groove on a PCB to be processed, wherein part of the pre-drilled holes are positioned in the process groove, and the rest part of the pre-drilled holes are positioned in the side wall of the groove;
electroplating the PCB with the pre-drilled holes to form conductive plating layers on the surface of the PCB, the side wall and the bottom wall of the process groove and the wall of the pre-drilled holes;
and cutting the side wall of the groove from inside to outside by adopting a drilling process between all pre-drilled holes on the inner side of the side wall of the groove of the process groove of the PCB subjected to electroplating, and extending along the side wall of the groove to form long grooves which are sequentially communicated with all adjacent pre-drilled holes, wherein the cutting thickness of the side wall of the groove is larger than the thickness of the conductive coating during forming the long grooves, so that the incomplete electroplating groove with PTH half holes is obtained.
Further, the pre-drilled holes comprise a first pre-drilled hole formed at the corner of the process groove and a second pre-drilled hole formed in the process groove and provided with an arc-shaped cutting groove on at least one side groove wall of the process groove.
Further, the cross section of the process groove is rectangular, the first pre-drilled holes are formed in four corners of the process groove, the hole centers of the second pre-drilled holes are located on the length central axis of the process groove, the diameter of the second pre-drilled holes is larger than the width of the groove body of the process groove, and arc-shaped cutting grooves are formed in groove walls on two opposite sides of the process groove.
Further, at least two second predrilled holes are formed in the middle of the process groove.
Further, the diameter of the first pre-drilled hole is 0.7+/-0.1 mm; the diameter of the second pre-drilled hole is 2.6+/-0.1 mm.
Further, the electroplating the PCB with pre-drilled holes specifically comprises: and copper deposition, plate electricity and picture electricity are sequentially carried out.
Further, the pre-drilled holes are blind holes or through holes.
On the other hand, in order to solve the above further technical problems, the embodiments of the present invention provide the following technical solutions: a PCB preparation method comprises the following steps:
the method for forming the incomplete plating bath of the PCB according to any one of the above; and
and etching the PCB subjected to the secondary drilling to obtain a finished PCB subjected to etching.
After the technical scheme is adopted, the embodiment of the invention has at least the following beneficial effects: according to the embodiment of the invention, the pre-drilled holes are drilled at a plurality of preset positions on the periphery of the process groove of the PCB to be processed, the PCB is electroplated to form the conductive plating layer on the surface of the PCB, the groove side wall and the groove bottom wall of the process groove and the hole wall of the pre-drilled holes, then the groove side wall is cut from inside to outside and extends along the groove side wall by adopting a drilling process between all the pre-drilled holes on the inner side of the groove side wall of the process groove of the PCB subjected to electroplating, and the long grooves which are sequentially communicated with each adjacent pre-drilled holes are formed.
Drawings
Fig. 1 is a flowchart illustrating a step of an alternative embodiment of a method for forming an incomplete plating bath for a PCB board according to the present invention.
Fig. 2 is a schematic plan view of a PCB board after primary drilling according to an alternative embodiment of the method for forming an incomplete plating tank of a PCB board of the present invention.
Fig. 3 is a schematic plan view of a PCB after being drilled for the second time according to an alternative embodiment of the method for forming an incomplete plating tank of a PCB of the present invention.
Detailed Description
The present application is described in further detail below with reference to the drawings and specific examples. It should be understood that the following exemplary embodiments and descriptions are only for the purpose of illustrating the invention and are not to be construed as limiting the invention, and that the embodiments and features of the embodiments herein may be combined with one another without conflict.
As shown in fig. 1, an alternative embodiment of the present invention provides a method for forming an incomplete plating bath of a PCB board, including the steps of:
s1: drilling pre-drilled holes 12 at a plurality of preset positions on the periphery of a preformed process groove 10 on the PCB 1 to be processed, wherein part of the pre-drilled holes 12 are positioned in the process groove 10, and the rest part is positioned in the side wall of the groove, as shown in fig. 2;
s2: electroplating the PCB 1 with the pre-drilled holes 12 to form conductive coatings on the surface of the PCB 1, the side walls and the bottom wall of the process groove 10 and the wall of the pre-drilled holes 12;
s3: the method comprises the steps of cutting the side wall of a groove from inside to outside by adopting a drilling process between each pre-drilled hole 12 on the inner side of the side wall of the groove 10 of the electroplated PCB 1, and extending along the side wall of the groove to form long grooves 14 which are sequentially communicated with each adjacent pre-drilled hole 12, wherein the cutting thickness of the side wall of the groove is larger than the thickness of the conductive coating when the long grooves 14 are formed, so that an incomplete electroplating groove with PTH half holes is obtained, as shown in figure 3.
According to the embodiment of the invention, the pre-drilled holes 12 are drilled at a plurality of preset positions on the periphery of the process groove 10 of the PCB 1 to be processed, the PCB 1 is electroplated to form the conductive plating layer on the plate surface of the PCB 1, the groove side wall and the groove bottom wall of the process groove 10 and the hole wall of the pre-drilled holes 12, then the groove side wall is cut from inside to outside by adopting a drilling process between the pre-drilled holes 12 on the inner side of the groove side wall of the process groove 10 of the PCB 1 after electroplating, and the groove side wall extends along the groove side wall to form the long groove 14 which is sequentially communicated with each adjacent pre-drilled hole 12, and in the process of drilling the long groove 14, the cutting thickness of the groove side wall is larger than the thickness of the conductive plating layer, so that copper sheets at the hole openings of half holes can be drilled, burrs are avoided, the conductive plating layer on the groove wall can be removed along the inner side of the process groove 10, the forming process can be effectively simplified, and the design cost is reduced.
In an alternative embodiment of the present invention, the pre-drilled holes 12 include a first pre-drilled hole 121 formed at a corner of the process tank 10 and a second pre-drilled hole 123 formed in the process tank 10 and having an arc-shaped slot 123a formed in a wall of at least one side of the process tank 10. In this embodiment, the first pre-drilled hole 121 and the second pre-drilled hole 123 are respectively designed to form a plurality of different incomplete plating baths.
In an alternative embodiment of the present invention, the cross section of the process tank 10 is rectangular, the first pre-drilled holes 121 are formed at four corners of the process tank 10, the hole centers of the second pre-drilled holes 123 are located on the central axis of the length of the process tank 10, and the diameter of the second pre-drilled holes 123 is greater than the width of the tank body of the process tank 10, and the arc-shaped slots 123a are formed on the tank walls on two opposite sides of the process tank 10. In this embodiment, the first pre-drilled hole 121 and the second pre-drilled hole 123 are formed in the above manner, so that the overall structure is relatively simple, and the design and the formation are convenient.
In an alternative embodiment of the invention, the middle of the process tank 10 is formed with at least two of the second predrilled holes 123. In this embodiment, various forms of the incomplete plating bath are formed by designing a plurality of types of the second predrilled holes 123.
In an alternative embodiment of the present invention, the diameter of the first pre-drilled hole 121 is 0.7±0.1 mm; the diameter of the second predrilled hole 123 is 2.6±0.1 mm. In this embodiment, the first pre-drilled hole 121 and the second pre-drilled hole 123 are designed with the above dimensions, so as to meet the practical requirements of different PCBs 1.
In an alternative embodiment of the present invention, the electroplating the PCB board 1 with the pre-drilled hole 12 specifically includes: and copper deposition, plate electricity and picture electricity are sequentially carried out. In this embodiment, the plating processes of copper deposition, plating and patterning are sequentially adopted, so that the plating material layer can be formed on the PCB board 1 effectively.
In an alternative embodiment of the present invention, the predrilled hole 12 is a blind hole or a through hole. In this embodiment, the pre-drilled holes 12 may be blind holes (not drilled through the PCB board 1) or through holes (drilled through the PCB board 1), so as to meet the design requirements of different PCB boards 1.
On the other hand, the embodiment of the invention further provides a PCB preparation method, which comprises the following steps:
the method for forming the incomplete plating bath of the PCB in the embodiment; and
and etching the PCB 1 subjected to the secondary drilling to obtain a finished PCB subjected to etching.
In this embodiment, the molding method of the incomplete plating bath of the PCB board 1 can effectively simplify the molding steps; and the secondary drilling is carried out, the drilling tool drills the tinned copper wall off, meanwhile, the high-speed rotating drilling tool can have a pulling effect on the copper wall to bring out part of copper wires, and as the drilled copper wall is not protected by tin, the PCB after the secondary drilling is etched, a pattern circuit can be formed on the PCB 1, and burrs which cannot be drilled at the orifice of the half-hole of the PTH can be removed by chemical agents during etching, so that the yield of the PCB 1 is further ensured.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are all within the scope of the present invention.
Claims (8)
1. The forming method of the incomplete electroplating bath of the PCB is characterized by comprising the following steps of:
drilling pre-drilled holes on a plurality of preset positions on the periphery of a preformed process groove on a PCB to be processed, wherein part of the pre-drilled holes are positioned in the process groove, and the rest part of the pre-drilled holes are positioned in the side wall of the groove;
electroplating the PCB with the pre-drilled holes to form conductive plating layers on the surface of the PCB, the side wall and the bottom wall of the process groove and the wall of the pre-drilled holes;
and cutting the side wall of the groove from inside to outside by adopting a drilling process between all pre-drilled holes on the inner side of the side wall of the groove of the process groove of the PCB subjected to electroplating, and extending along the side wall of the groove to form long grooves which are sequentially communicated with all adjacent pre-drilled holes, wherein the cutting thickness of the side wall of the groove is larger than the thickness of the conductive coating during forming the long grooves, so that the incomplete electroplating groove with PTH half holes is obtained.
2. The method of claim 1, wherein the pre-drilled holes include a first pre-drilled hole formed at a corner of the process tank and a second pre-drilled hole formed in the process tank and having an arc-shaped slot formed in a wall of at least one side of the process tank.
3. The method of claim 2, wherein the cross section of the process tank is rectangular, the first pre-drilled holes are formed at four corners of the process tank, the centers of the second pre-drilled holes are positioned on the length central axis of the process tank, and the diameter of the second pre-drilled holes is larger than the width of the tank body of the process tank, and the arc-shaped slots are formed on the tank walls on two opposite sides of the process tank.
4. A method of forming a PCB panel incomplete plating bath according to claim 2 or 3, wherein the middle part of the process tank is formed with at least two of the second predrilled holes.
5. The method of claim 2, wherein the first pre-drilled hole has a diameter of 0.7±0.1 mm; the diameter of the second pre-drilled hole is 2.6+/-0.1 mm.
6. The method for forming an incomplete plating bath for a PCB board according to claim 1, wherein the plating the PCB board with the pre-drilled holes specifically includes: and copper deposition, plate electricity and picture electricity are sequentially carried out.
7. The method of claim 1, wherein the pre-drilled holes are blind holes or through holes.
8. The preparation method of the PCB is characterized by comprising the following steps of:
the method for forming an incomplete plating bath for a PCB board according to any one of claims 1 to 7; and
and etching the PCB subjected to the secondary drilling to obtain a finished PCB subjected to etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210407426.3A CN114679848B (en) | 2022-04-19 | 2022-04-19 | Forming method of PCB incomplete electroplating bath and PCB preparation method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210407426.3A CN114679848B (en) | 2022-04-19 | 2022-04-19 | Forming method of PCB incomplete electroplating bath and PCB preparation method |
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| CN114679848A CN114679848A (en) | 2022-06-28 |
| CN114679848B true CN114679848B (en) | 2023-07-11 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5499446A (en) * | 1993-12-01 | 1996-03-19 | Nec Corporation | Method for manufacturing printed circuit board with through-hole |
| EP1729555A1 (en) * | 2005-05-31 | 2006-12-06 | Siemens Aktiengesellschaft | Method for manufacturing a circuit board and a system of circuit boards as well as a circuit board and a system of circuit boards made by the methods |
| CN107072049A (en) * | 2017-03-28 | 2017-08-18 | 江门市高智电子科技有限公司 | Gong groove technique for BT plates |
| CN110972396A (en) * | 2019-11-22 | 2020-04-07 | 厦门鸿鹭联创工具有限公司 | Forming and processing method for printed circuit board with semi-copper hole |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2951870B1 (en) * | 2009-10-28 | 2012-03-30 | Commissariat Energie Atomique | CAVITY INTERCONNECTION STRUCTURE HAVING ONE OR MORE CONTACT SURFACES ON THE CAVITE WALLS AND METHOD OF MAKING THE SAME |
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2022
- 2022-04-19 CN CN202210407426.3A patent/CN114679848B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5499446A (en) * | 1993-12-01 | 1996-03-19 | Nec Corporation | Method for manufacturing printed circuit board with through-hole |
| EP1729555A1 (en) * | 2005-05-31 | 2006-12-06 | Siemens Aktiengesellschaft | Method for manufacturing a circuit board and a system of circuit boards as well as a circuit board and a system of circuit boards made by the methods |
| CN107072049A (en) * | 2017-03-28 | 2017-08-18 | 江门市高智电子科技有限公司 | Gong groove technique for BT plates |
| CN110972396A (en) * | 2019-11-22 | 2020-04-07 | 厦门鸿鹭联创工具有限公司 | Forming and processing method for printed circuit board with semi-copper hole |
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| Publication number | Publication date |
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| CN114679848A (en) | 2022-06-28 |
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