CN114664701A - Metal-attached RFID electronic tag packaging equipment and application method thereof - Google Patents
Metal-attached RFID electronic tag packaging equipment and application method thereof Download PDFInfo
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- CN114664701A CN114664701A CN202210239850.1A CN202210239850A CN114664701A CN 114664701 A CN114664701 A CN 114664701A CN 202210239850 A CN202210239850 A CN 202210239850A CN 114664701 A CN114664701 A CN 114664701A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
- Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Abstract
The invention discloses metal-attached RFID electronic tag packaging equipment and a using method thereof, and relates to the technical field of RFID electronic tag packaging. The air cylinder type air pump mainly comprises a bottom plate and a top plate, wherein a supporting rod is connected between the bottom plate and the top plate, a bearing plate is movably sleeved on the supporting rod, a supporting plate is fixed on the supporting rod, a plurality of lower pressing blocks are installed on the supporting plate, heating pipes are arranged inside the plurality of lower pressing blocks, a plurality of installation cylinders are installed on the bearing plate, upper pressing blocks are movably inserted into the end parts of the installation cylinders, a first spring is connected between the upper pressing block and the inner walls of the installation cylinders, a connecting pipe is communicated between every two adjacent installation cylinders, an air cylinder with an output end fixed with the bearing plate is installed on the top plate, a vent pipe is arranged on the supporting plate, a plurality of air injection pipes are communicated on the vent pipe, and the vent pipe is connected with an air pump. The connecting pipes are arranged, so that the air pressure in the installation cylinders can be ensured to be the same, the air injection pipes cool and solidify the conductive adhesive, and the packaging effect is good.
Description
Technical Field
The invention relates to the technical field of RFID electronic tag packaging, in particular to metal-attached RFID electronic tag packaging equipment and a using method thereof.
Background
The RFID tag is also called as a radio frequency tag, can identify a specific target through a radio signal and read and write related data without establishing mechanical or optical contact between an identification system and the specific target, and consists of a coupling element, an antenna substrate and a chip.
The RFID label only needs to be manufactured completely through steps of uncoiling, dispensing, picking, pasting, hot pressing, detecting, rolling and the like in the manufacturing process, the hot pressing is the most important step, the chip and the antenna substrate are tightly extruded through an upper pressure head and a lower pressure head in the hot pressing, heat released from the pressure heads is used for carrying out hot curing treatment on conductive adhesive between the chip and the antenna substrate, and therefore the purpose of curing and packaging the chip and the antenna substrate is achieved. This a thermosetting device for RFID label encapsulation, turn into the pressure that gas compression produced with two pressure head direct extrusion forces of current device, reach the gas outgoing through first exhaust apparatus after the gas pressure reaches a definite value, it can't continue the extrusion to the chip to go up the briquetting, crush the chip when effectively preventing the cylinder excessive pressure, and the cylinder is the overpressure condition, guarantee that every pressure head can both reach the biggest pressure value when the cylinder continuously moves, make every chip all receive same pressure, the thermosetting effect between every chip and the antenna substrate can both reach the standard requirement, the encapsulation between chip and the antenna substrate is tighter, the reading discernment ability of label has been improved. A plurality of briquetting independent settings of going up in the contrast file, a plurality of briquetting is pushed down in step, because the difference of technology, can't guarantee that every goes up the inside atmospheric pressure homogeneous phase of briquetting, thereby encapsulation degree that can appear between each chip and each antenna base plate has the difference, the reading ability of label has well or badly, packaging efficiency is not high, and after chip and antenna base plate encapsulation, can transmit to next table surface through the live-rollers on, the conducting resin between chip and the antenna base plate is not yet cooled and solidifies completely, can take place the condition that chip and antenna base plate break away from when the live-rollers, lead to the failure of encapsulation.
Disclosure of Invention
The invention aims to: in order to solve the problems in the background art, the invention provides a metal-attached RFID tag packaging device and a method for using the same.
The invention specifically adopts the following technical scheme for realizing the purpose:
the utility model provides a be applied to metal and adhere to RFID electronic tags encapsulation equipment, includes bottom plate and roof, be connected with the bracing piece between bottom plate and the roof, the movable sleeve is equipped with the loading board on the bracing piece, be fixed with the backup pad on the bracing piece, install a plurality of briquetting, a plurality of in the backup pad the inside of briquetting all is provided with the heating pipe down, install a plurality of installation section of thick bamboo, a plurality of on the loading board the equal activity of tip of installation section of thick bamboo is inserted and is equipped with the briquetting, go up the briquetting with be connected with spring one, adjacent two between the inner wall of installation section of thick bamboo the intercommunication has the connecting pipe between the installation section of thick bamboo, install on the roof output with the cylinder that the loading board is fixed, be provided with the breather pipe in the backup pad, the intercommunication has the jet-propelled pipe of a plurality of on the breather pipe, the breather pipe is connected with the aspiration pump.
Preferably, one of the installation cylinder is provided with an air outlet pipe, an annular groove I is formed in the inner wall of the air outlet pipe, a first clamping ball is movably arranged in the groove I, the diameter of the first clamping ball is smaller than that of the groove I and larger than the inner diameter of the air outlet pipe, and a second spring is connected between the first clamping ball and the inner wall of the groove I.
Preferably, one of the installation cylinder is provided with an air inlet pipe, an annular groove II is formed in the inner wall of the air inlet pipe, a clamping ball II is movably arranged in the groove II, the diameter of the clamping ball II is smaller than that of the groove II and larger than the inner diameter of the air inlet pipe, and a spring III is connected between the clamping ball II and the inner wall of the groove II.
Preferably, the connecting pipe includes air duct one and air duct two, air duct one with air duct two respectively with adjacent two the installation section of thick bamboo intercommunication, the other end movable sleeve of air duct two is established on the other end of air duct one, the end fixing of air duct one have with the sealing ring one that air duct two inner walls closely laminated, the end fixing of air duct two have with the sealing ring two that air duct one outer wall closely laminated.
Preferably, a sliding groove is formed in the bearing plate in a penetrating mode, a sliding block which slides in the sliding groove is fixed to the end portion of the mounting cylinder, and a fixing piece used for fixing the sliding block is arranged on the sliding block.
Preferably, the device groove has been seted up to the inside of slider, the mounting includes that two symmetries and activity set up the fixed block of device inslot portion, two be connected with spring four, two between the fixed block activity respectively runs through the both sides that the slider was carried on the back mutually, all set up the fixed slot that a plurality of is array distribution on the both sides inner wall that the spout is relative, one side of slider seted up with the control flume that the device groove communicates mutually, the inside activity of control flume is provided with two control levers, two the control lever respectively with two the fixed block is fixed.
Preferably, the fixed block is U type and two the opening of fixed block is carried on the back mutually, the equal activity of both ends of fixed block is inserted and is established the inside of fixed slot, be connected with the guide bar between the two inner walls that the device groove is relative, two the fixed block with the equal movable sleeve of spring is established on the guide bar.
Preferably, a corrugated pipe is connected between two adjacent mounting cylinders and movably sleeved on the first air guide pipe and the second air guide pipe.
Preferably, the lower pressing block comprises a plurality of heat-conducting cylinders, the heating pipe is arranged inside the heat-conducting cylinders, the tops of the plurality of heat-conducting cylinders are connected with an integrated heat-conducting block which is horizontally arranged, and the heat-conducting block and the plurality of upper pressing blocks are located on the same vertical plane.
A use method of a metal-attached RFID electronic tag packaging device comprises the following steps:
s1: the antenna substrate is transmitted between the upper pressing block and the lower pressing block through the transmission device, the cylinder is started to control the bearing plate to descend along the supporting rod, the upper pressing block is in contact with the chip, and the lower pressing block is in contact with the antenna substrate;
s2: the conductive adhesive is melted by the heat generated by the lower pressing block, and the chip is tightly adhered to the antenna substrate under the pressure of the upper pressing block and the lower pressing block;
s3: the connecting pipe is connected two adjacent installation barrels, and the inside atmospheric pressure of a plurality of installation barrel is the same, and the loading board descends and drives a plurality of installation barrel and descend in step, and the briquetting is the same to the pressure that the chip produced on a plurality of, and the inseparable degree of bonding is the same between each chip and each antenna substrate:
s4: go up briquetting and briquetting separation down, chip and antenna substrate after the bonding are along with transmission of transmission device, and through the top of jet-propelled pipe, the aspiration pump is bled to the external world, and gaseous through the breather pipe from the jet-propelled blowout of a plurality of, cool off the conducting resin and solidify.
Has the advantages that:
1. according to the invention, two adjacent mounting cylinders are communicated through the connecting pipe, and the mounting cylinders are communicated with each other, so that the air pressure in each mounting cylinder can be ensured to be the same, when the chip and the antenna substrate are extruded, the pressure is the same, the situation that the reading and identifying capacities of the packaged RFID electronic tags are different in strength can be avoided, and the packaging effect is good;
2. after the chip and the antenna substrate are packaged, the chip and the antenna substrate are transmitted to the position right above the air injection pipes through the transmission device, the air suction pump works to suck outside air into the air vent pipes, and finally the outside air is sprayed out from the end parts of the air injection pipes to cool and solidify the conductive adhesive, so that the chip is prevented from being separated from the antenna substrate when passing through the rotating rollers;
3. the air inlet pipe is arranged to balance the air pressure in the mounting cylinder, and the air outlet pipe is arranged to avoid the damage to the chip and the antenna substrate caused by the overlarge pressure between the upper pressing block and the lower pressing block;
4. the arrangement of the sliding groove and the fixing piece facilitates the adjustment of the distance between the mounting cylinders, so that the distance between the upper pressing blocks is adjusted, the hot pressing of the antenna substrates and chips with different specifications is facilitated, and the practicability is high;
5. the lower pressing block comprises a plurality of heat-conducting cylinders and an integrated heat-conducting block, so that the lower pressing block can conveniently correspond to the upper pressing block after the distance is adjusted, and the hot pressing is not influenced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a cross-sectional view of the perspective structure of FIG. 1 according to the present invention;
FIG. 3 is an enlarged view of the structure A of FIG. 2 according to the present invention;
FIG. 4 is an enlarged view of the structure B of FIG. 2 according to the present invention;
FIG. 5 is a schematic perspective view of a snorkel according to the present invention;
FIG. 6 is an exploded view of the connecting tube of the present invention;
FIG. 7 is an exploded view of the mounting cylinder and upper press block of the present invention;
FIG. 8 is a schematic perspective view of a carrier plate according to the present invention;
figure 9 is an exploded view of the present invention fastener.
In fig. 1-9:
1. a base plate; 2. a top plate; 3. a support bar; 4. a carrier plate; 5. a support plate; 6. mounting the cylinder; 7. pressing the blocks; 8. a cylinder; 9. a breather pipe; 41. a chute; 42. a slider; 43. a fixing member; 51. pressing the block; 61. a first spring; 62. a connecting pipe; 63. an air outlet pipe; 64. an air inlet pipe; 65. a bellows; 91. a gas ejector tube; 411. fixing grooves; 421. a device slot; 422. a control slot; 423. a guide rod; 431. a fixed block; 432. a fourth spring; 433. a control lever; 511. a heat conducting tube; 512. a heat conducting block; 621. a first gas guide pipe; 622. a second gas guide pipe; 623. a first sealing ring; 624. a second sealing ring; 631. a first groove; 632. blocking the ball I; 633. a second spring; 641. a second groove; 642. a second ball is clamped; 643. and a third spring.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.
The first embodiment is as follows:
a metal-attached RFID tag packaging apparatus, please refer to fig. 1-9; the invention mainly comprises a bottom plate 1 and a top plate 2, wherein support rods 3 are connected between the bottom plate 1 and the top plate 2, the number of the support rods 3 is four, the four support rods are distributed in a rectangular shape, a bearing plate 4 is movably sleeved on each support rod 3, a support plate 5 is fixed on each support rod 3, a plurality of lower press blocks 51 are arranged on each support plate 5, heating pipes are arranged inside the plurality of lower press blocks 51, a plurality of mounting cylinders 6 are arranged on each bearing plate 4, in the embodiment, three mounting cylinders 6 are arranged, upper press blocks 7 are movably inserted at the end parts of three mounting cylinders 6, a first spring 61 is connected between each upper press block 7 and the inner wall of each mounting cylinder 6, a connecting pipe 62 is communicated between every two adjacent mounting cylinders 6, air cylinders 8 of which the output ends are fixed with the bearing plate 4 are arranged on the top plate 2, the number of the air cylinders 8 is two and is arranged in the vertical direction, and air vent pipes 9 are arranged on each support plate 5, the vent pipe 9 is communicated with a plurality of air injection pipes 91, the vent pipe 9 is connected with an air suction pump, when the device is used, the antenna substrate is transmitted between the upper pressing block 7 and the lower pressing block 51 by the transmission device, at the moment, the bearing plate 4 is driven by the air cylinder 8 to descend along the supporting rod 3, the upper pressing block 7 below the bearing plate 4 is abutted to the chip, the antenna substrate is extruded on the lower pressing block 51, the lower pressing block 51 is heated by the heating pipe inside the lower pressing block 51, the conductive adhesive between the chip and the antenna substrate is melted by the heat generated by the lower pressing block 51, because the connecting pipe 62 is connected between two adjacent mounting cylinders 6, the air pressure inside the three mounting cylinders 6 is the same, the upper pressing block 7 is driven by the bearing plate 4 to descend, after being extruded with the lower pressing block 51, the upper pressing block 7 can move towards the inside of the mounting cylinder 6, the spring I61 generates elasticity, meanwhile, the air pressure inside the mounting cylinders 6 is increased, under the extrusion of the upper pressing block 7 and the lower pressing block 51, the even distribution of conducting resin is between chip and antenna substrate, three chip is the same with the three antenna substrate adhesive degree, the RFID electronic tags's of encapsulation reading identification ability is the same, the encapsulation is effectual, and after last briquetting 7 extrudees with briquetting 51 down, along with transmission device's transmission, the antenna substrate removes to jet-propelled pipe 91 directly over, the aspiration pump bleeds to the external world, gas gets into the inside of breather pipe 9, from the tip blowout of a plurality of jet-propelled pipe 91, cool down the cooling to the conducting resin between antenna substrate and the chip, the conducting resin solidifies fast, bonding effect between chip and the antenna substrate is better, when the antenna substrate transmits to the live-rollers, can take place to buckle, the effectual chip and the separation of antenna substrate of having avoided, the packaging efficiency is high.
In this embodiment, in order to improve the effect of hot pressing the upper press block 7 and the lower press block 51 on the chip and the antenna substrate, please refer to fig. 3 and 4, wherein an air outlet pipe 63 is installed on one of the installation cylinders 6, an annular groove 631 is formed on an inner wall of the air outlet pipe 63, a ball-clamping unit 632 is movably disposed inside the groove 631, a diameter of the ball-clamping unit 632 is smaller than a diameter of the groove 631 and larger than an inner diameter of the air outlet pipe 63, a spring 633 is connected between the ball-clamping unit 632 and the inner wall of the groove 631, when the cylinder 8 drives the carrier plate 4 to descend, the upper press block 7 presses the chip and the antenna substrate onto the lower press block 51, as the carrier plate 4 continues to descend, the pressure applied by the upper press block 7 is more and more, the air pressure inside the installation cylinder 6 is greater, and in order to prevent the upper press block 7 from being too large, the chip and the antenna substrate are crushed, at this time, the air pressure inside the installation cylinder 6 overcomes the elastic force of the spring 633, the first clamping ball 632 is pushed to move, two ends of the air outlet pipe 63 are communicated, air in the mounting cylinder 6 is exhausted to the outside through the air outlet pipe 63, air pressure in the mounting cylinder 6 is weakened, the integrity of the chip and the antenna substrate is protected, specifically, an air inlet pipe 64 is mounted on one mounting cylinder 6, an annular groove II 641 is formed in the inner wall of the air inlet pipe 64, a clamping ball II 642 is movably arranged in the groove II 641, the diameter of the clamping ball II 642 is smaller than that of the groove II 641 and larger than the inner diameter of the air inlet pipe 64, a spring III 643 is connected between the clamping ball II 642 and the inner wall of the groove II 641, when the air pressure in the mounting cylinder 6 is smaller than the external air pressure and the next hot pressing of the chip and the antenna substrate is affected, the external air can push the clamping ball II 642 to move, the two ends of the air inlet pipe 64 are communicated, the external air enters the mounting cylinder 6 through the air inlet pipe 64, and the air pressure in the mounting cylinder 6 is improved, and the next hot pressing effect is ensured.
Further, in order to improve the usability of the device, please refer to fig. 2, fig. 6 and fig. 8, a sliding slot 41 is formed through the bearing plate 4, a sliding block 42 sliding in the sliding slot 41 is fixed at the end of the mounting cylinder 6, a fixing member 43 for fixing the sliding block 42 is arranged on the sliding block 42, the distance between the mounting cylinders 6 can be conveniently adjusted by sliding the sliding block 42, so as to adjust the distance between two adjacent upper press blocks 7, and facilitate the hot pressing of the antenna substrate and the chip with different specifications and sizes, the connecting pipe 62 comprises a first air duct 621 and a second air duct 622, the first air duct 621 and the second air duct 622 are respectively communicated with the two adjacent mounting cylinders 6, the other end of the second air duct 622 is movably sleeved on the other end of the first air duct 621, a first sealing ring 623 tightly attached to the inner wall of the second air duct 622 is fixed at the end of the first air duct 621, a second sealing ring 624 tightly attached to the outer wall of the first air duct 622 is fixed at the end of the second air duct 622, through sliding block 42, adjust the distance between two installation section of thick bamboo 6, air duct one 621 and two 622 mutual pull of air duct, the distance between two adjacent installation section of thick bamboo 6 of adaptation, excellent in use effect, the setting of a sealing ring 623 and two 624 sealing rings can improve the leakproofness between air duct one 621 and two 622 of air duct, avoids the inside gas of installation section of thick bamboo 6 to escape from the clearance between air duct one 621 and two 622 of air duct, influences the effect of hot pressing.
Further, after the distance between two adjacent mounting cylinders 6 is adjusted, in order to ensure the stability of the hot pressing, please refer to fig. 7, 8 and 9, a mounting groove 421 is formed in the inside of the sliding block 42, the fixing member 43 includes two fixing blocks 431 symmetrically and movably disposed in the mounting groove 421, a spring 432 is connected between the two fixing blocks 431, the two fixing blocks 431 movably penetrate through two opposite sides of the sliding block 42 respectively, a plurality of fixing grooves 411 distributed in an array are formed on inner walls of two opposite sides of the sliding groove 41, a control groove 422 communicated with the mounting groove 421 is formed in one side of the sliding block 42, two control rods 433 are movably disposed in the control groove 422, the two control rods 433 are fixed with the two fixing blocks 431 respectively, when in operation, two fingers of an operator are placed on the two control rods 433, the two fingers approach each other to drive the two control rods 433 to approach each other, thereby enabling the two fixed blocks 431 to approach each other, the two fixed blocks 431 move to the inside of the device groove 421, the end parts of the fixed blocks 431 are separated from the fixed groove 411, at this time, the sliding block 42 can slide, after being adjusted to a proper position, the two control rods 433 are loosened, under the elastic force of the spring four 432, the two fixed blocks 431 are pushed to be away from each other, the end parts of the two fixed blocks 431 are respectively inserted into the fixed grooves 411 at the two opposite sides of the sliding groove 41, the limiting of the sliding block 42 is completed, the sliding block 42 is prevented from being displaced when in use, the hot pressing is influenced, the fixed blocks 431 are U-shaped, the openings of the two fixed blocks 431 are opposite, both ends of the fixed blocks 431 are movably inserted into the inside of the fixed groove 411, the fixed blocks 431 are U-shaped, thus, four end parts are inserted into the inside of the fixed groove 411 on the same sliding block 42, the fixing effect is better, the stability is higher, the guide rod 423 is connected between the two opposite inner walls of the device groove 421, two fixed blocks 431 and the equal movable sleeve of spring four 432 are established on guide bar 423, and guide bar 423 is used for the direction, improves stability, can improve spring four 432's life simultaneously, avoids spring four 432 after long-time use, takes place permanent buckling, loses the effect.
Referring to fig. 2 and 6, a bellows 65 movably sleeved on the first air duct 621 and the second air duct 622 is connected between two adjacent mounting cylinders 6, and the bellows 65 can be adjusted according to a distance between the two adjacent mounting cylinders 6, so that the gas inside the mounting cylinders 6 can be further prevented from escaping, and the sealing performance is further improved.
In order to enable the lower pressing block 51 to always correspond to the upper pressing block 7, please refer to fig. 2, the lower pressing block 51 includes a plurality of heat-conducting cylinders 511, the heating pipe is disposed inside the heat-conducting cylinders 511, the tops of the plurality of heat-conducting cylinders 511 are connected with an integrated heat-conducting block 512 which is horizontally disposed, the heat-conducting block 512 and the plurality of upper pressing blocks 7 are located on the same vertical plane, no matter how much the distance between two adjacent mounting cylinders 6 is increased or decreased, the upper pressing block 7 always corresponds to the heat-conducting block 512, and the using effect is better.
Example two:
a use method of a metal-attached RFID electronic tag packaging device comprises the following steps:
s1: the antenna substrate is transmitted between the upper pressing block 7 and the lower pressing block 51 through the transmission device, the cylinder 8 is started to control the bearing plate 4 to descend along the supporting rod 3, the upper pressing block 7 is contacted with the chip, and the lower pressing block 51 is contacted with the antenna substrate;
s2: the conductive adhesive is melted by the heat generated by the lower pressing block 51, and under the pressure of the upper pressing block 7 and the lower pressing block 51, the conductive adhesive is uniformly distributed between the chip and the antenna substrate, and the chip and the antenna substrate are tightly bonded;
s3: the connecting pipe 62 is connected with two adjacent installation cylinders 6, the air pressure inside the installation cylinders 6 is the same, the loading plate 4 descends to drive the installation cylinders 6 to descend synchronously, the pressure of the upper pressing block 7 on the plurality of to the chip is the same, and the tightness of adhesion between each chip and each antenna substrate is the same:
s4: go up briquetting 7 and briquetting 51 separation down, chip and antenna substrate after the bonding are along with transmission of transmission device, and through jet-propelled pipe 91's top, the aspiration pump is bled to the external world, and gas is spouted from a plurality of jet-propelled pipe 91 through breather pipe 9, cools off the solidification to the conducting resin.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The packaging equipment applied to the metal-attached RFID electronic tag is characterized by comprising a bottom plate (1) and a top plate (2), wherein a supporting rod (3) is connected between the bottom plate (1) and the top plate (2), a bearing plate (4) is movably sleeved on the supporting rod (3), a supporting plate (5) is fixed on the supporting rod (3), a plurality of lower pressing blocks (51) are installed on the supporting plate (5), heating pipes are arranged inside the lower pressing blocks (51), a plurality of mounting cylinders (6) are installed on the bearing plate (4), an upper pressing block (7) is movably inserted at the end parts of the mounting cylinders (6), a first spring (61) is connected between the upper pressing block (7) and the inner wall of the mounting cylinder (6), a connecting pipe (62) is communicated between two adjacent mounting cylinders (6), and an air cylinder (8) with an output end fixed with the bearing plate (4) is installed on the top plate (2), the air exhaust device is characterized in that a vent pipe (9) is arranged on the supporting plate (5), the vent pipe (9) is communicated with a plurality of air injection pipes (91), and the vent pipe (9) is connected with an air suction pump.
2. The packaging device applied to the metal-attached RFID electronic tag is characterized in that an air outlet pipe (63) is installed on one of the installation cylinders (6), an annular first groove (631) is formed in the inner wall of the air outlet pipe (63), a first clamping ball (632) is movably arranged in the first groove (631), the diameter of the first clamping ball (632) is smaller than that of the first groove (631) and larger than the inner diameter of the air outlet pipe (63), and a second spring (633) is connected between the first clamping ball (632) and the inner wall of the first groove (631).
3. The packaging apparatus applied to the metal-attached RFID tag as recited in claim 2, wherein an air inlet pipe (64) is installed on one of the installation cylinders (6), an annular second groove (641) is formed in an inner wall of the air inlet pipe (64), a second ball detent (642) is movably arranged inside the second groove (641), a diameter of the second ball detent (642) is smaller than that of the second groove (641) and larger than an inner diameter of the air inlet pipe (64), and a third spring (643) is connected between the second ball detent (642) and the inner wall of the second groove (641).
4. The metal-attached RFID electronic tag packaging device according to claim 1, wherein the connecting pipe (62) comprises a first air duct (621) and a second air duct (622), the first air duct (621) and the second air duct (622) are respectively communicated with the two adjacent mounting cylinders (6), the other end of the second air duct (622) is movably sleeved on the other end of the first air duct (621), a first sealing ring (623) closely attached to the inner wall of the second air duct (622) is fixed at the end of the first air duct (621), and a second sealing ring (624) closely attached to the outer wall of the first air duct (621) is fixed at the end of the second air duct (622).
5. The packaging device applied to the metal-attached RFID electronic tag according to claim 4, wherein a sliding slot (41) is formed through the carrier plate (4), a sliding block (42) sliding in the sliding slot (41) is fixed at the end of the mounting cylinder (6), and a fixing member (43) for fixing the sliding block (42) is arranged on the sliding block (42).
6. The metal-attached RFID electronic tag packaging apparatus according to claim 5, characterized in that a device groove (421) is formed in the sliding block (42), the fixing piece (43) comprises two symmetrical fixing blocks (431) which are movably arranged in the device groove (421), a spring IV (432) is connected between the two fixing blocks (431), the two fixing blocks (431) respectively and movably penetrate through two opposite sides of the sliding block (42), the inner walls of two opposite sides of the sliding groove (41) are respectively provided with a plurality of fixing grooves (411) which are distributed in an array way, one side of the sliding block (42) is provided with a control groove (422) communicated with the device groove (421), two control rods (433) are movably arranged in the control groove (422), and the two control rods (433) are respectively fixed with the two fixing blocks (431).
7. The packaging device applied to the metal-attached RFID electronic tag as claimed in claim 6, wherein the fixing blocks (431) are U-shaped, the openings of the two fixing blocks (431) are opposite, both ends of the fixing blocks (431) are movably inserted into the fixing slots (411), a guide rod (423) is connected between the two opposite inner walls of the device slot (421), and the two fixing blocks (431) and the spring four (432) are movably sleeved on the guide rod (423).
8. The packaging equipment applied to the metal-attached RFID electronic tag according to claim 5, wherein a bellows (65) movably sleeved on the first air duct (621) and the second air duct (622) is connected between two adjacent mounting cylinders (6).
9. The packaging device applied to the metal-attached RFID electronic tag as recited in claim 5, wherein the lower pressing block (51) comprises a plurality of heat conducting cylinders (511), a heating pipe is arranged inside the heat conducting cylinders (511), a heat conducting block (512) which is integrated and horizontally arranged is connected to the top of the plurality of heat conducting cylinders (511), and the heat conducting block (512) and the plurality of upper pressing blocks (7) are located on the same vertical plane.
10. The use method applied to the metal-attached RFID electronic tag packaging equipment is characterized by comprising the following steps of:
s1: the antenna substrate is transmitted between an upper pressing block (7) and a lower pressing block (51) through a transmission device, a cylinder (8) is started to control a bearing plate (4) to descend along a supporting rod (3), the upper pressing block (7) is contacted with a chip, and the lower pressing block (51) is contacted with the antenna substrate;
s2: the conductive adhesive is melted by the heat generated by the lower pressing block (51), and the chip is tightly adhered to the antenna substrate under the pressure of the upper pressing block (7) and the lower pressing block (51);
s3: connecting pipe (62) are connected two adjacent installation section of thick bamboo (6), and the inside atmospheric pressure of a plurality of installation section of thick bamboo (6) is the same, and loading board (4) descend and drive a plurality of installation section of thick bamboo (6) and descend in step, and briquetting (7) are the same to the pressure that the chip produced on a plurality of, and the inseparable degree of bonding is the same between each chip and each antenna substrate:
s4: go up briquetting (7) and briquetting (51) separation down, chip and antenna substrate after the bonding are along with transmission of transmission device, through the top of jet-propelled pipe (91), and the aspiration pump is bled to the external world, and gas is spouted from a plurality of jet-propelled pipe (91) through breather pipe (9), cools off the solidification to the conducting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210239850.1A CN114664701B (en) | 2022-03-12 | 2022-03-12 | Metal-attached RFID electronic tag packaging equipment and application method thereof |
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| CN202210239850.1A CN114664701B (en) | 2022-03-12 | 2022-03-12 | Metal-attached RFID electronic tag packaging equipment and application method thereof |
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| CN114664701B CN114664701B (en) | 2023-04-18 |
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| CN116960690B (en) * | 2023-09-18 | 2023-12-08 | 江苏金鼎汽车锁制造有限公司 | Ignition switch wire connector |
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| CN114664701B (en) | 2023-04-18 |
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