CN221261961U

CN221261961U - Packaged data memory

Info

Publication number: CN221261961U
Application number: CN202323280677.9U
Authority: CN
Inventors: 董妮; 刘荣环; 朱丽萍
Original assignee: Shenzhen Aizhixin Automation Technology Co ltd
Current assignee: Shenzhen Aizhixin Automation Technology Co ltd
Priority date: 2023-12-04
Filing date: 2023-12-04
Publication date: 2024-07-02
Anticipated expiration: 2033-12-04

Abstract

The present utility model relates to the field of data storage technologies, and in particular, to a packaged data storage. The technical proposal comprises: including encapsulation frame, encapsulation lid and chip substrate, encapsulation lid joint is in encapsulation frame upper end, and is provided with fixed subassembly between the two, encapsulation lid bottom is fixed with the sealing washer, install binding post on the chip substrate, encapsulation frame bottom and all be fixed with connecting terminal with the corresponding position of binding post, encapsulation lid bottom central point puts and is fixed with the rubber clamp plate, in the encapsulation frame and with chip substrate four corners alignment position fixed with the installation reference column, the installation reference column upper end passes chip substrate and with chip substrate sliding connection. According to the utility model, the packaging shell is arranged into a combined structure of the packaging frame and the packaging cover which are convenient to detach, so that the disassembly and the detection of the internal chip or the replacement of the shell are convenient under the condition of ensuring stable connection, and the risk of damage in the disassembly and the assembly process is reduced.

Description

Packaged data memory

Technical Field

The present utility model relates to the field of data storage technologies, and in particular, to a packaged data storage.

Background

Packaged data storage is a storage device that integrates a memory chip and a package housing. It is commonly used to store and read data and is widely used in computers, mobile devices and other electronic devices.

The packaging type data memory mainly comprises an internal chip and an external chip protection shell, the common combination relation is fixed by adhesion, or the internal buckle is fixed, the fixing sealing mode can ensure enough tightness, but normal dismounting operation is inconvenient, when the shell is damaged, or the internal chip needs to be overhauled, the dismounting operation is difficult, the shell is often damaged in the dismounting process, and the situation that the shell cannot be used is caused, so that the packaging type data memory convenient for dismounting the shell needs to be designed.

Disclosure of utility model

The utility model aims at solving the problems in the background technology and provides a packaged data memory with a convenient casing assembly and disassembly.

The technical scheme of the utility model is as follows: the packaging type data memory comprises a packaging frame, a packaging cover and a chip substrate, wherein the packaging cover is clamped at the upper end of the packaging frame, a fixing component is arranged between the packaging cover and the packaging frame, a sealing ring is fixed at the bottom of the packaging cover, a wiring terminal is mounted on the chip substrate, connecting terminals are fixed at the bottom of the packaging frame and at the corresponding positions of the wiring terminal, a rubber pressing plate is fixed at the central position of the bottom of the packaging cover, mounting positioning columns are fixed in the packaging frame and at the four corners of the chip substrate in alignment, and the upper ends of the mounting positioning columns penetrate through the chip substrate and are in sliding connection with the chip substrate.

Preferably, the fixed subassembly includes expansion plate and telescopic link, expansion plate sliding connection is at encapsulation frame inside wall, in the telescopic link encapsulation frame lateral wall and with expansion plate position alignment, the perforation has been seted up on the expansion plate, the draw-in groove has been seted up to the perforation bottom, the perforation is worn to the telescopic link tip, the adaptation groove has been seted up in telescopic link both sides and the corresponding position of draw-in groove.

Preferably, the packaging frame side wall and the telescopic link corresponding position have seted up the flexible groove, the telescopic link is located flexible inslot one end and is fixed with the extrusion piece, be fixed with ejection spring between extrusion piece and the flexible inslot wall.

Preferably, a pair of guide rods are fixed at the bottom of the packaging frame and at positions corresponding to the telescopic plates, the upper ends of the guide rods are slidably connected in the telescopic plates, and an ejection spring is fixed between the telescopic plates and the bottom of the packaging frame.

Preferably, the middle position of the upper end of the expansion plate is fixed with a push rod, and the upper end of the encapsulation cover is provided with a jack at a position corresponding to the push rod.

Preferably, the width of the adapting groove is the same as the width of the telescopic plate, and the size of the through hole is adapted to the width of the vertical section of the telescopic rod.

Compared with the prior art, the utility model has the following beneficial technical effects: the packaging shell is arranged into a combined structure of the packaging frame and the packaging cover which are convenient to detach, so that the internal chip can be conveniently detached and detected or replaced by the shell under the condition of ensuring stable connection, and the risk of damage in the detaching process is reduced.

Drawings

FIG. 1 is a schematic view of an assembled cross-sectional structure of the present utility model;

FIG. 2 is a schematic view of the overall appearance structure of the present utility model;

FIG. 3 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;

Fig. 4 is a schematic view of the combined structure of the telescopic rod and the telescopic plate of the utility model.

Reference numerals: 1. a package frame; 11. a connection terminal; 2. a package cover; 21. a rubber press plate; 22. a seal ring; 3. a chip substrate; 31. a connection terminal; 4. a fixing assembly; 41. a telescoping plate; 42. perforating; 43. a clamping groove; 44. a telescopic rod; 45. an adaptation groove; 46. extruding a block; 47. an ejector spring; 48. a guide rod; 49. a return spring; 410. a push rod; 411. a jack; 412. a telescopic slot.

Detailed Description

The technical scheme of the utility model is further described below with reference to the attached drawings and specific embodiments.

Examples

As shown in fig. 1-4, the packaged data memory provided by the utility model comprises a packaging frame 1, a packaging cover 2 and a chip substrate 3, wherein the packaging cover 2 is clamped at the upper end of the packaging frame 1, a fixing component 4 is arranged between the packaging cover and the packaging frame, a sealing ring 22 is fixed at the bottom of the packaging cover 2, a wiring terminal 31 is installed on the chip substrate 3, a connecting terminal 11 is fixed at the bottom of the packaging frame 1 and at the position corresponding to the wiring terminal 31, a rubber pressing plate 21 is fixed at the central position of the bottom of the packaging cover 2, mounting positioning columns are fixed at the positions aligned with four corners of the chip substrate 3 in the packaging frame 1, and the upper ends of the mounting positioning columns penetrate through the chip substrate 3 and are in sliding connection with the chip substrate 3.

The fixing component 4 comprises a telescopic plate 41 and a telescopic rod 44, the telescopic plate 41 is slidably connected to the inner side wall of the packaging frame 1, the telescopic rod 44 is arranged in the side wall of the packaging frame 1 and aligned with the telescopic plate 41, a through hole 42 is formed in the telescopic plate 41, a clamping groove 43 is formed in the bottom of the through hole 42, the end portion of the telescopic rod 44 penetrates through the through hole 42, two sides of the telescopic rod 44 and corresponding positions of the clamping groove 43 are provided with an adapting groove 45, the side wall of the packaging frame 1 and corresponding positions of the telescopic rod 44 are provided with an adapting groove 412, one end of the telescopic rod 44 located in the adapting groove 412 is fixedly provided with an extrusion block 46, an ejection spring 47 is fixed between the extrusion block 46 and the inner side wall of the telescopic groove 412, the bottom of the packaging frame 1 and corresponding positions of the telescopic rod 41 are fixedly provided with a pair of guide rods 48, the upper ends of the guide rods 48 are slidably connected in the telescopic plate 41, a push rod 410 is fixed in the middle position of the upper end of the telescopic plate 41, the upper end of the packaging cover 2 and corresponding positions of the push rod 410 are provided with an inserting hole 411, the adapting groove 45 is identical in width to the width of the telescopic plate 41, and the size of the adapting groove 42 is matched with the vertical section width of the telescopic rod 44.

In this embodiment, the chip substrate 3 is firstly mounted in the package frame 1, this process can utilize the mounting positioning column to perform limiting, so that the connection terminal 31 on the chip substrate 3 corresponds to the connection terminal 11 on the package frame 1 one by one, then the package cover 2 covers the upper end of the package frame 1, extrusion of the rubber pressing plate 21 is utilized to realize fixation of the chip substrate 3, in this process, firstly, the needle and wire is required to be inserted into the insertion hole 411, and the upper end of the ejector rod 410 is extruded, so that the expansion plate 41 moves downwards under the condition of compressing the return spring 49, finally, the position of the insertion hole 411 is ensured to be aligned with the position of the expansion rod 44, at this moment, extrusion of the extrusion block 46 is utilized again, under the condition of compressing the ejector spring 47, the expansion rod 44 is driven to extend, finally, the end of the expansion rod 44 passes through the perforation 42, meanwhile, the position of the adaptation groove 45 is aligned with the expansion plate 41, then the ejector rod 410 is released, under the pushing of the return spring 49, the expansion plate 41 moves upwards until the side wall of the clamping groove 43 is inserted into the adaptation groove 45, the combined fixation operation is completed, in the process, in the disassembly process, only the need to extrude the expansion rod 410 again, after the perforation block 44 is compressed, the expansion rod 44 is aligned with the extrusion block 46, the expansion rod 44 is driven, and the expansion rod 44 is quickly removed, and the quick disassembly operation is avoided, and the assembly and disassembly is completed.

The above-described embodiments are merely a few preferred embodiments of the present utility model, and many alternative modifications and combinations of the above-described embodiments will be apparent to those skilled in the art based on the technical solutions of the present utility model and the related teachings of the above-described embodiments.

Claims

1. The packaged data memory comprises a packaging frame (1), a packaging cover (2) and a chip substrate (3), and is characterized in that: the packaging cover (2) is clamped at the upper end of the packaging frame (1), a fixing component (4) is arranged between the packaging cover and the packaging frame, a sealing ring (22) is fixed at the bottom of the packaging cover (2), a wiring terminal (31) is installed on the chip substrate (3), connecting terminals (11) are fixed at the bottom of the packaging frame (1) and at positions corresponding to the wiring terminal (31), a rubber pressing plate (21) is fixed at the central position of the bottom of the packaging cover (2), and mounting positioning columns are fixed in the packaging frame (1) and at four corner alignment positions of the chip substrate (3), and the upper ends of the mounting positioning columns penetrate through the chip substrate (3) and are in sliding connection with the chip substrate (3).

2. The packaged data storage according to claim 1, wherein the fixing component (4) comprises a telescopic plate (41) and a telescopic rod (44), the telescopic plate (41) is slidably connected to the inner side wall of the packaging frame (1), the telescopic rod (44) is arranged in the side wall of the packaging frame (1) and aligned with the telescopic plate (41), a through hole (42) is formed in the telescopic plate (41), a clamping groove (43) is formed in the bottom of the through hole (42), the end portion of the telescopic rod (44) penetrates through the through hole (42), and adapting grooves (45) are formed in the positions, corresponding to the clamping grooves (43), of the two sides of the telescopic rod (44).

3. The encapsulated data storage according to claim 2, wherein a telescopic slot (412) is formed in a position corresponding to the telescopic rod (44) on the side wall of the encapsulation frame (1), an extrusion block (46) is fixed at one end of the telescopic rod (44) in the telescopic slot (412), and an ejection spring (47) is fixed between the extrusion block (46) and the inner side wall of the telescopic slot (412).

4. The encapsulated data storage according to claim 2, wherein a pair of guide rods (48) are fixed at the bottom of the encapsulation frame (1) and at positions corresponding to the telescopic plates (41), the upper ends of the guide rods (48) are slidably connected in the telescopic plates (41), and ejection springs (47) are fixed between the telescopic plates (41) and the bottom of the encapsulation frame (1).

5. The encapsulated data storage according to claim 2, wherein the ejector rod (410) is fixed in the middle of the upper end of the expansion plate (41), and the jack (411) is arranged at the upper end of the encapsulation cover (2) and at a position corresponding to the ejector rod (410).

6. The packaged data storage according to claim 2, wherein the width of the adaptation groove (45) is the same as the width of the expansion plate (41), and the size of the perforation (42) is adapted to the width of the vertical section of the expansion rod (44).