CN114622263A - Conductive mechanism for electroplating equipment and electroplating device - Google Patents
Conductive mechanism for electroplating equipment and electroplating device Download PDFInfo
- Publication number
- CN114622263A CN114622263A CN202210467809.XA CN202210467809A CN114622263A CN 114622263 A CN114622263 A CN 114622263A CN 202210467809 A CN202210467809 A CN 202210467809A CN 114622263 A CN114622263 A CN 114622263A
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- conductive
- roller
- conducting
- electroplating
- friction
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of electroplating equipment, in particular to a conductive mechanism and an electroplating device for the electroplating equipment, which comprise a conductive roller and a conductive component connected with the conductive roller; the conductive roller is a cylinder formed by combining an insulator and a conductor, the insulator comprises a cylindrical part and a plurality of blocking parts uniformly arranged around the cylindrical part, the blocking parts are arranged at intervals, and the conductor is arranged between two adjacent blocking parts; the conducting roller can rotate relative to the conducting component, and the conducting component can output a positive electrode to one conducting body and output a negative electrode to the other conducting body simultaneously in the rotating process. The conducting roller adopts a split type design, and is matched with the double-electrode output of the conducting component, so that the electric conductor on the conducting roller realizes the conversion between the positive electrode and the negative electrode in the rotating process, and further realizes the effect of electroplating and deplating at the same time, and effectively solves the problem that metal atoms are attached to the surface of the conducting roller.
Description
Technical Field
The invention relates to the technical field of electroplating equipment, in particular to a conductive mechanism for electroplating equipment and an electroplating device.
Background
The electroplating process adopted by the electroplating equipment is a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing an electrolysis principle, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by utilizing an electrolysis effect, thereby playing roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
The electroplating equipment is usually provided with an upper row of conductive rollers and a lower row of conductive rollers, a plated object enters between the two rows of conductive rollers, each conductive roller in the two rows of conductive rollers rotates respectively to enable the plated object to move forward, and the plated object is electrified through the electrification of the conductive rollers so as to enable the plated object to complete the electroplating operation in the moving process.
The conductive roller in the scheme is generally connected with a cathode to enable an object to be plated to be also formed into a cathode, an outer metal conductive layer of the conductive roller is in a column shape formed integrally, namely the outer metal conductive layer of the conductive roller can be integrally formed into the cathode, an anode plate is arranged in the electroplating equipment at a position close to the object to be plated and the conductive roller to enable the object to be plated and the anode plate to form a loop, but the conductive roller and the anode plate can form a loop at the same time, namely the conductive roller is also electroplated, and unnecessary metal atoms are attached to the surface of the conductive roller under long-time operation, so that the surface of the conductive roller is thickened, uneven and unsmooth, and finally, the object to be plated generates traces or even is crushed in the rotating and transmitting moving process of the conductive roller.
Disclosure of Invention
The invention aims to provide a conductive mechanism and a plating device for plating equipment, wherein the conductive roller is designed in a split manner, so that flexible electrode switching and plating stripping are realized.
In order to solve the technical problems, the invention adopts the following technical scheme:
a conductive mechanism for electroplating equipment comprises a conductive roller and a conductive component connected with the conductive roller;
the conductive roller is a cylinder formed by combining an insulator and a conductor, the insulator comprises a cylindrical part and a plurality of blocking parts uniformly arranged around the cylindrical part, the blocking parts are arranged at intervals, and the conductor is arranged between two adjacent blocking parts;
the conductive assembly can simultaneously output a positive electrode to one of the conductors and a negative electrode to the other conductor.
Preferably, the conductive assembly comprises a bearing seat and a friction conductive head arranged on the bearing seat, the bearing seat is provided with at least two insertion holes for the conductive roller to extend into, the friction conductive heads are arranged around the insertion holes, one end of each friction conductive head penetrates through the inner wall surface of each insertion hole, and the friction conductive heads are connected with the power supply; the conductive roller can rotate relative to the inserting hole.
Preferably, the inner wall surface of the insertion hole is provided with a second accommodating groove for accommodating the friction conductive head and an elastic member located in the second accommodating groove, one end of the elastic member abuts against the friction conductive head, and the other end of the elastic member abuts against the inner wall surface of the second accommodating groove.
Preferably, the conductive assembly further comprises two bearing seats arranged on the front side surface and the rear side surface of the bearing seat and bearings arranged on the bearing seats, and the conductive roller is connected to the two bearings in a penetrating manner.
Preferably, the outer arc length L1 of the blocking portion is smaller than the outer arc length L2 of the conductor.
The electroplating device comprises an electroplating pool and the conductive mechanism arranged in the electroplating pool.
The invention has the beneficial effects that:
the utility model provides a conductive mechanism that electroplating device used, wherein the conducting roller adopts split type design, and the bipolar electrode output of cooperation conducting assembly makes the electric conductor on the conducting roller realize the conversion between positive pole and the negative pole at rotatory in-process, and then realizes electroplating while removing the effect of plating, effectively solves the problem that the conducting roller surface adheres to metal atom.
The invention also provides an electroplating device which directly applies the conductive mechanism to carry out electroplating operation.
Drawings
Fig. 1 is a schematic perspective view of a conductive mechanism according to the present invention.
Fig. 2 is an exploded perspective view of the conductive mechanism of the present invention.
Fig. 3 is a schematic side view of a conductive roller in the conductive mechanism of the present invention.
FIG. 4 is a schematic side view of an electroplating apparatus according to the present invention.
Detailed Description
The present invention will be further described with reference to the following examples for facilitating understanding of those skilled in the art, and the description of the embodiments is not intended to limit the present invention.
As shown in fig. 1 to 3, a conductive mechanism for a plating apparatus includes a conductive roller 1 and a conductive member 2 connected to the conductive roller 1;
the conductive roller 1 is a cylinder formed by combining an insulator 11 and a conductor 12, the insulator 11 comprises a column-shaped part 14 and a plurality of barrier parts 13 uniformly arranged around the column-shaped part 14, the barrier parts 13 are arranged at intervals, and the conductor 12 is arranged between two adjacent barrier parts 13;
the conductive roller 1 can rotate relative to the conductive component 2, and the conductive component 2 can simultaneously output a positive electrode to one conductor 12 and a negative electrode to the other conductor 12 during the rotation process.
In practical application, the conductive roller 1 is forced to rotate to contact the object to be plated 4 and push the object to be plated 4 to advance, the conductive component 2 outputs a negative electrode to the conductive body 12 contacting the object to be plated 4 during rotation, so that the object to be plated 4 also forms a negative electrode and an anode plate 5 to form a plating loop, and outputs a positive electrode to the conductive body 12 far away from the object to be plated 4, and the conductive body 12 far away from the object to be plated 4 forms a positive electrode, at this time, metal atoms attached to the conductive body 12 are dissolved, thereby solving the problem that the conductive roller 1 is attached to the metal atoms.
In this embodiment, the conductive assembly 2 includes a bearing seat 21 and a friction conductive head 22 installed on the bearing seat 21, the bearing seat 21 is provided with an insertion hole 23 into which the conductive roller 1 extends, the friction conductive head 22 is provided with at least two parts around the insertion hole 23, one end of the friction conductive head 22 penetrates through the inner wall surface of the insertion hole 23, and the friction conductive head 22 is connected with a power supply; the conductive roller 1 can rotate relative to the inserting hole 23.
The conducting roller 1 is stressed to rotate relative to the inserting hole 23, the conducting roller 1 is in friction contact with different friction conducting heads 22 in the rotating process, the friction conducting head 22 positioned on the upper side of the inserting hole 23 in the plurality of friction conducting heads 22 surrounding the inserting hole 23 is connected with the positive pole of a power supply, the friction conducting head 22 positioned on the lower side of the inserting hole 23 is connected with the negative pole of the power supply, the conducting body 12 becomes the positive pole when the conducting body 12 contacts the friction conducting head 22 on the upper side of the inserting hole 23, the conducting body 12 is the negative pole when the conducting body 12 contacts the friction conducting head 22 on the lower side of the inserting hole 23, and the conducting body 12 on the conducting roller 1 continuously changes the electrodes in the rotating process.
In this embodiment, the inner wall surface of the inserting hole 23 is provided with a second receiving groove 24 for receiving the friction conductive head 22 and an elastic member 25 located in the second receiving groove 24, one end of the elastic member 25 abuts against the friction conductive head 22, and the other end of the elastic member 25 abuts against the inner wall surface of the second receiving groove 24. The friction conductive head 22 is pushed by the elastic member 25 to make the friction conductive head 22 reliably abut against the conductive roller 1 during rotation.
In this embodiment, the conductive assembly 2 further includes two bearing seats installed on the front and rear side surfaces of the bearing seat 21 and bearings installed on the bearing seats, and the conductive roller 1 is connected to the two bearings in a penetrating manner. Bearing seats are respectively designed on the front side surface and the rear side surface of the bearing seat 21, and the end parts of the conductive roller 1 respectively penetrate into the front bearing, the inserting hole 23 and the rear bearing.
In this embodiment, the outer arc length L1 of the blocking portion 13 is smaller than the outer arc length L2 of the conductors 12, so that two adjacent conductors 12 do not interfere with each other when energized simultaneously.
As shown in fig. 4, an electroplating apparatus includes an electroplating bath 3 and the conductive mechanism installed in the electroplating bath 3.
In actual operation, two rows of conductive mechanisms are arranged in a plating tank 3 of the plating device, and the plated object 4 enters between the two rows of conductive mechanisms, is tightly propped by the conductive rollers 1 on the two sides, and is driven to advance by the rotation of the conductive rollers 1. An anode plate 5 is arranged between two adjacent conductive rollers 1 in a row of conductive rollers 1. During operation, the anode plate 5 is connected with the positive electrode of a power supply, the friction conductive head 22 close to the plated object 4 is connected with the negative electrode of the power supply, and the friction conductive head 22 far away from the plated object 4 is connected with the positive electrode of the power supply;
the conductive roller 1 rotates to push the plated object 4 to move forward, in the rotating process of the conductive roller 1, when the conductive body 12 rotates to be in contact with the plated object 4, the conductive body 12 can simultaneously contact the negative electrode to rub the conductive head 22, so that the plated object 4 forms a negative electrode, the negative electrode of the plated object 4 and the positive electrode of the positive plate 5 form an electroplating loop, when the conductive body 12 rotates to be far away from the plated object 4, the conductive body 12 contacts the positive electrode to rub the conductive head 22, at the moment, the conductive body 12 forms a positive electrode, metal atoms attached to the conductive body 12 can be dissolved, the problem that the conductive roller 1 is attached with the metal atoms is solved, and the electroplating and deplating effects are achieved.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a number" means two or more unless explicitly defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "assembled", "connected", and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; the two elements can be directly connected or connected through an intermediate medium, and the two elements can be communicated with each other. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The above-mentioned embodiments only express a plurality of embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. Electrically conductive mechanism that electroplating device used, its characterized in that: comprises a conductive roller (1) and a conductive component (2) connected with the conductive roller (1);
the conductive roller (1) is a cylinder formed by combining an insulator (11) and a conductor (12), the insulator (11) comprises a column-shaped part (14) and a plurality of blocking parts (13) which are uniformly arranged around the column-shaped part (14), the blocking parts (13) are arranged at intervals, and the conductor (12) is arranged between two adjacent blocking parts (13);
the conductive roller (1) can rotate relative to the conductive component (2), and the conductive component (2) can output a positive electrode to one conductor (12) and a negative electrode to the other conductor (12) simultaneously in the rotating process.
2. The conductive mechanism for a plating apparatus according to claim 1, characterized in that: the conductive assembly (2) comprises a bearing seat (21) and friction conductive heads (22) arranged on the bearing seat (21), wherein the bearing seat (21) is provided with insertion holes (23) for the conductive roller (1) to extend into, at least two friction conductive heads (22) are arranged around the insertion holes (23), one end of each friction conductive head (22) penetrates through the inner wall surface of each insertion hole (23), and the friction conductive heads (22) are connected with a power supply; the conductive roller (1) can rotate relative to the inserting hole (23).
3. A conductive mechanism for a plating apparatus according to claim 2, wherein: the inner wall surface of the inserting hole (23) is provided with a second accommodating groove (24) for accommodating the friction conductive head (22) and an elastic piece (25) positioned in the second accommodating groove (24), one end of the elastic piece (25) is abutted against the friction conductive head (22), and the other end of the elastic piece (25) is abutted against the inner wall surface of the second accommodating groove (24).
4. A conductive mechanism for a plating apparatus according to claim 3, wherein: the conductive assembly (2) further comprises two bearing seats arranged on the front side surface and the rear side surface of the bearing seat (21) and bearings arranged on the bearing seats, and the conductive roller (1) is connected to the two bearings in a penetrating mode.
5. The conductive mechanism for a plating apparatus according to claim 1, characterized in that: the outer arc length L1 of the blocking part (13) is less than the outer arc length L2 of the conductor (12).
6. Electroplating device, including electroplating bath (3), its characterized in that: -further comprising an electrically conductive mechanism according to any of claims 1-5 mounted in the plating bath (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210467809.XA CN114622263A (en) | 2022-04-29 | 2022-04-29 | Conductive mechanism for electroplating equipment and electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210467809.XA CN114622263A (en) | 2022-04-29 | 2022-04-29 | Conductive mechanism for electroplating equipment and electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114622263A true CN114622263A (en) | 2022-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210467809.XA Pending CN114622263A (en) | 2022-04-29 | 2022-04-29 | Conductive mechanism for electroplating equipment and electroplating device |
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| Country | Link |
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| CN (1) | CN114622263A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116988130A (en) * | 2023-09-25 | 2023-11-03 | 无锡釜川科技股份有限公司 | Horizontal roller type electroplating device |
| CN117144452A (en) * | 2023-10-07 | 2023-12-01 | 广东捷盟智能装备有限公司 | Electroplating mechanism for removing long copper of conductive roller |
-
2022
- 2022-04-29 CN CN202210467809.XA patent/CN114622263A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116988130A (en) * | 2023-09-25 | 2023-11-03 | 无锡釜川科技股份有限公司 | Horizontal roller type electroplating device |
| CN116988130B (en) * | 2023-09-25 | 2023-12-22 | 无锡釜川科技股份有限公司 | Horizontal roller type electroplating device |
| CN117144452A (en) * | 2023-10-07 | 2023-12-01 | 广东捷盟智能装备有限公司 | Electroplating mechanism for removing long copper of conductive roller |
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