CN215947437U - Production device for electroplating conductive film - Google Patents
Production device for electroplating conductive film Download PDFInfo
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- CN215947437U CN215947437U CN202122135603.0U CN202122135603U CN215947437U CN 215947437 U CN215947437 U CN 215947437U CN 202122135603 U CN202122135603 U CN 202122135603U CN 215947437 U CN215947437 U CN 215947437U
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Abstract
The embodiment of the utility model provides a production device for electroplating a conductive film, which comprises: the electroplating device comprises a plurality of conductive grooves and a plurality of electroplating baths, wherein the conductive grooves and the electroplating baths are alternately arranged in the horizontal direction, a plurality of cathode rollers are arranged in the conductive grooves from top to bottom, each cathode roller comprises a conductive section and an insulating section, and a conductive film penetrates through gaps of the plurality of cathode rollers; an upper anode titanium blue and a lower anode titanium blue are symmetrically arranged in the electroplating bath, and the conductive film penetrates through a gap between the upper anode titanium blue and the lower anode titanium blue; the utility model can not only avoid the scratching of the electroplating film on the cathode roller, but also improve the copper plating efficiency.
Description
Technical Field
The utility model relates to the technical field of conductive film electroplating, in particular to a production device for conductive film electroplating.
Background
The conductive film is a multifunctional film with conductive performance, and is widely applied to batteries at present. And the most used electroplating process for producing the conductive film.
The utility model discloses the people discovers in the process of realizing this invention that prior art has the following problems:
in the electroplating process, when the film reaches the conductive roller from the electroplating bath, electroplating solution is brought onto the conductive roller, because the conductive roller is electrified with a cathode, a layer of copper film can be plated on the conductive roller, and in the following film walking process, because the bonding force between the copper film and the conductive roller is weak, the copper film can be easily attached to the film, when the film enters the electroplating bath again, the copper in the electroplating bath can be electroplated on the copper film and then fall off, so that the thickness of copper plated on the film is different, the sheet resistance of the film is affected, and the color of the film is different after the copper film falls off, the product appearance is affected, the electroplating solution brought from the electroplating bath can be evaporated on the conductive roller to form crystals, on one hand, the film can be punctured to cause product disqualification, on the other hand, more current gathered at the tip of the copper crystal can also be discharged at the tip as usual, thereby burning the film off.
Based on this, the utility model designs a production device for electroplating a conductive film to solve the problems.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a production apparatus for electroplating a conductive film, so as to solve the problems in the background art.
To achieve the above object, in a first aspect, an embodiment of the present invention provides a production apparatus for conductive film plating, including:
the electroplating device comprises a plurality of conductive grooves and a plurality of electroplating baths, wherein the conductive grooves and the electroplating baths are alternately arranged in the horizontal direction, a plurality of cathode rollers are arranged in the conductive grooves up and down, and a conductive film penetrates through gaps of the cathode rollers;
the electroplating bath is provided with an upper anode titanium blue and a lower anode titanium blue in an up-down symmetrical mode, and the conductive film penetrates through a gap between the upper anode titanium blue and the lower anode titanium blue. Because each conductive tank in the utility model adopts a plurality of cathode rollers, and the current on each cathode roller is relatively small by shunting through the plurality of cathode rollers, compared with a single cathode roller, the amount of copper or other metals plated on the cathode rollers can be reduced while the conductive film is plated with the same amount of copper or other metals in the same unit time.
In some possible embodiments, the cathode roll comprises conductive segments and insulating segments, wherein the middle segment of the cathode roll is an insulating segment and both ends of the cathode roll are conductive segments; alternatively, the conductive segments and the insulating segments of the cathode roll are alternately arranged. The structure of the cathode roller adopted by the embodiment of the utility model can prevent the copper crystal plated at the middle position of the cathode roller or form a layer of metal foil in the film moving process during electroplating, wherein the copper crystal has a sharp point part, so that on one hand, the copper crystal is prevented from puncturing a conductive film and forming a hole on the conductive film to cause low product percent of pass, and on the other hand, the phenomenon of point end point release can be avoided when excessive current is converged at a small point, thereby burning the originally small hole and even burning off the film.
In some possible embodiments, the plurality of cathode rollers are arranged in parallel in the conductive groove and are rotatably connected with the conductive groove, and the plurality of cathode rollers are arranged in parallel to prevent the conductive film from wrinkling or deforming, so that the yield of the conductive film product is improved.
In some possible embodiments, a first anode porous roller and a second anode porous roller are symmetrically arranged at one end of the electroplating bath, the first anode porous roller is connected with the upper anode titanium blue through a first lead, the second anode porous roller is connected with the lower anode titanium blue through a second lead, and the anodes on the upper anode titanium blue and the lower anode titanium blue are electrically conducted to the first anode porous roller and the second anode porous roller through the lead connection, so that the first anode porous roller and the second anode porous roller are charged with anode electricity to perform auxiliary electroplating on the conductive film;
wherein the first anode porous roller and the second anode porous roller form a first micro electroplating space with a tank body of the electroplating tank.
In some possible embodiments, a third anode porous roller and a fourth anode porous roller are symmetrically arranged at the other end of the electroplating bath, the third anode porous roller is connected with the upper anode titanium blue through a third conducting wire, the fourth anode porous roller is connected with the lower anode titanium blue through a fourth conducting wire, and the conducting wires are used for conducting the anode electricity on the upper anode titanium blue and the lower anode titanium blue to the third anode porous roller and the fourth anode porous roller, so that the third anode porous roller and the fourth anode porous roller are provided with anode electricity, and further conducting auxiliary electroplating is carried out on the conducting thin film;
wherein the third anode porous roller and the fourth anode porous roller form a second micro-electroplating space with a tank body of the electroplating tank.
In some possible embodiments, the first anode porous roll, the second anode porous roll, the third anode porous roll and the fourth anode porous roll have the same structure, each anode porous roll comprising: the electroplating bath in the electroplating bath is in contact with the anode roller through the holes, so that an electroplating circulation loop is formed among the electroplating bath, the anode porous roller and the conductive film, and the conductive film is electroplated. Through increasing the porous roller of many pairs of positive poles, through being connected a plurality of porous rollers of positive pole respectively through wire and last positive pole titanium blue and lower positive pole titanium blue, not only great improvement conductive film's electroplating efficiency, can also keep apart the plating bath in the plating bath groove.
In some possible embodiments, metal balls are respectively arranged in the upper anode titanium blue and the lower anode titanium blue, and are used for supplementing metal ions in the plating solution and improving the plating quality of the conductive film.
In some possible embodiments, the upper half part of the first anode porous roller and the upper half part of the third anode porous roller are positioned outside the plating solution, and the lower half part of the first anode porous roller and the lower half part of the third anode porous roller are positioned in the plating solution, so as to isolate the plating solution in the plating tank, thereby ensuring the level of the plating solution in the plating tank.
In some possible embodiments, the cathode rollers are arranged in the conductive groove in two parallel rows in the film running direction; the conductive film passes through the gaps of the two rows of cathode rollers.
In some possible embodiments, the first row of cathode rolls and the second row of cathode rolls are symmetrically arranged up and down in a pair, or the first row of cathode rolls and the second row of cathode rolls are arranged in a V-shape.
The technical scheme has the following beneficial effects:
because each conductive tank in the embodiment of the utility model adopts a plurality of cathode rollers, and the current on each cathode roller is relatively small by shunting through the plurality of cathode rollers, compared with a single cathode roller, the amount of copper or other metals plated on the cathode rollers can be reduced while the conductive film is plated with the same amount of copper or other metals in the same unit time.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating an overall structure of a manufacturing apparatus for electroplating a conductive film according to an embodiment of the present invention;
FIG. 2A is a top view of a manufacturing apparatus for electroplating a conductive film according to an embodiment of the present invention;
FIG. 2B is a schematic structural diagram of an upper anode titanium blue according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a cathode roll according to an embodiment of the present invention;
FIG. 4 is a view showing the structure of a conductive bath and a bath body of an electroplating bath according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a manufacturing apparatus for electroplating a conductive film according to an embodiment of the present invention;
FIG. 6 is an enlarged cross-sectional view of an end portion of a cathode roll according to an embodiment of the present invention;
FIG. 7 is a structural view of a rotating shaft according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a conductive slot according to an embodiment of the present invention;
FIG. 9 is a cross-sectional view of a plating cell in accordance with an embodiment of the utility model;
FIG. 10 is a schematic view of the construction of an anode porous roll according to an embodiment of the present invention;
fig. 11 is a schematic view of an insulating sleeve with a plurality of holes according to an embodiment of the utility model.
The reference numbers illustrate:
1. the device comprises a conductive groove, 11, a cathode roller, 111, a rotating shaft, 12, a through hole, 2, a plating groove, 21, upper anode titanium blue, 22, lower anode titanium blue, 23, a first upper anode porous roller, 24, a second lower anode porous roller, 25a, a first lead, 25b, a second lead, 25c, a third lead, 25d, a fourth lead, 26, a third upper anode porous roller, 27, a fourth upper anode porous roller, 28, a first micro-plating space, 29, a second micro-plating space, 201, an anode roller, 202, an insulating sleeve, 3 and a conductive film.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1 and fig. 2A, an embodiment of the present invention provides a production apparatus for conductive film electroplating, including a plurality of conductive tanks 1 and a plurality of electroplating tanks 2, where each conductive tank 1 and each electroplating tank 2 are alternately disposed in a horizontal direction, for example, a conductive film 3 sequentially passes through the conductive tanks 1, the electroplating tanks 2, and the conductive tanks 1 … …, and so on, one electroplating tank 2 is disposed between two conductive tanks 1, and one conductive tank 1 is disposed between two electroplating tanks 2. A plurality of cathode rollers 11 are arranged in the conductive tank 1, the cathode rollers 11 are alternately arranged up and down, and the conductive film 3 passes through the gaps of the cathode rollers 11 arranged up and down. Since each conductive tank 1 in the embodiment of the present invention employs a plurality of cathode rollers 11, and the current is divided by the plurality of cathode rollers 11, so that the current on each cathode roller 11 is relatively small, compared with a single cathode roller 11, the amount of copper or other metal plated on the cathode roller 11 can be reduced while the conductive film 3 is plated with the same amount of copper or other metal in the same unit time.
In some embodiments, each cathode roller 11 includes a conductive segment and an insulating segment, the conductive segment may be made of stainless steel or other conductive materials, as an example, the insulating segment in the middle of the cathode roller 11 is non-conductive, the conductive segments are at two ends, or the conductive segments and the insulating segments are alternately arranged, the cathode roller 11 is used as a cathode during electroplating, and the cathode is electrically conducted to the conductive film 3 through a plurality of cathode rollers 11; an upper anode titanium blue 21 and a lower anode titanium blue 22 are arranged in the electroplating bath 2, the upper anode titanium blue 21 and the lower anode titanium blue 22 are symmetrically arranged in the electroplating bath 2 in the vertical direction, as shown in fig. 2B, the upper anode titanium blue 21 and the lower anode titanium blue 22 have the same structure and are rectangular groove bodies, mounting seats are arranged at two ends of the electroplating bath 2, the end parts of the rectangular groove bodies are movably connected to the mounting seats, anode electrodes are connected to the surfaces of the mounting seats, and the anode electrodes are electrically conducted to the upper anode titanium blue 21 and the lower anode titanium blue 22 through the mounting seats, so that the upper anode titanium blue 21 and the lower anode titanium blue 22 are provided with anode electrodes; the upper anode titanium basket 21 can be immersed into half or 2/3 of the plating solution, and certainly can be immersed into the plating solution completely, which is related to the plating solution, the lower anode titanium blue 22 is immersed into the plating solution completely, a gap is left between the upper anode titanium blue 21 and the lower anode titanium blue 22, the conductive film 3 passes through the gap between the upper anode titanium blue 21 and the lower anode titanium blue 22, and the plating solution is arranged in the plating bath 2.
In the embodiment of the utility model, anode electricity is provided by the upper anode titanium blue 21 and the lower anode titanium blue 22, and cathode electricity is provided for the conductive film 3 by the plurality of cathode rollers 11, so that an electroplating circulation loop is formed among the upper anode titanium blue 21, the lower anode titanium blue 22, the plating solution and the conductive film 3 to electroplate the conductive film 3; in addition, because the middle of the cathode roller 11 adopted by the embodiment of the utility model is the insulating section which is not conductive, and the two ends are the conducting sections, or the conducting sections and the insulating sections are alternately arranged, compared with the traditional cathode roller, namely the cathode roller is made of stainless steel, the structure of the cathode roller 11 can prevent a layer of metal from being plated, a metal crystal from being plated or a layer of metal foil from being formed at the middle position of the cathode roller in the film-moving process because the cathode roller is plated with copper, for example, during electroplating, and the metal crystal has a sharper tip part and can pierce through the film to form holes on the film, so that the product percent of pass is low; on the other hand, when excessive current is converged to a small point, the phenomenon of point placement at the tip can be formed, so that the originally small hole is burnt to be large, and even the thin film is burnt off; moreover, the plurality of cathode rollers 11 are adopted to achieve the effect of shunting, each cathode roller 11 has smaller current, and compared with a single cathode roller 11, the amount of copper plated on the cathode rollers 11 can be further reduced while the conductive film 3 is plated with the same amount of copper in the same unit time.
In some embodiments, the conductive segments and the insulating segments of the cathode roller 11 can be alternately arranged, so that copper plating or other metals on the cathode roller 11 can be reduced, and metal crystals have sharp points, which can pierce through the film to form holes on the film, thereby reducing the product yield; on the other hand, when excessive current is converged to a small point, the phenomenon of point placement at the tip can be formed, so that the originally small hole is burnt to be large, and even the thin film is burnt off; the conductivity can be improved, and the electroplating efficiency can be improved.
As shown in fig. 3, 4, 5, 6 and 7, in the present embodiment, a plurality of through holes 12 are disposed on two sides of the conductive tank 1, and a plurality of cathode rollers 11 are disposed in parallel in the conductive tank 1 through the plurality of through holes 12 and are rotatably connected to the conductive tank 1, for example, by respectively mounting rotating shafts 111 at two ends of the cathode rollers 11, the cathode rollers 11 are rotatably connected to the conductive tank 1 through the rotating shafts 111, and by disposing the plurality of cathode rollers 11 in the rotating tank 1 in parallel, the conductive film can be effectively prevented from being wrinkled or deformed during the film-feeding process.
In some embodiments, the cathode rollers 11 are arranged in the conductive tank 1 in two parallel rows in the film running direction, and the conductive film 3 passes through the gaps between the two rows of cathode rollers 11; as an example, in the film running direction, the plurality of cathode rolls 11 may be disposed in the conductive bath 1 in a vertically symmetrical (aligned) manner at positions one by one, or may be disposed in the conductive bath 1 in a V-shape as shown in fig. 2A, that is, two rows of upper and lower cathode rolls 11 are disposed to cross each other in the film running direction. Here, the specific number and the up-and-down arrangement of the cathode rods 11 are related to the structure of the conductive tank 1 and the magnitude of the current required in the electroplating process, and are not limited herein.
As shown in fig. 8 and 9, in some embodiments, a first anode porous roll 23 and a second anode porous roll 24 are symmetrically disposed up and down at one end of the plating bath 2, the conductive thin film 3 passes through a gap between the first anode porous roll 23 and the second anode porous roll 24, the first anode porous roll 23 is connected to the upper anode titanium blue 21 by a first wire 25a, and the second anode porous roll 24 is connected to the lower anode titanium blue 22 by a second wire 25 b. In the electroplating process, anode electricity on the upper anode titanium blue 21 and the lower anode titanium blue 22 can be respectively conducted to the first anode porous roller 23 and the second anode porous roller 24 through conducting wires, so that the first anode porous roller 23 and the second anode porous roller 24 are electrified with the anode electricity during electroplating, an electroplating loop is formed among the conductive film 3, the electroplating solution and the first anode porous roller 23 and the second anode porous roller 24, and the electroplating is carried out on the conductive film 3, so that the electroplating efficiency is improved;
wherein, a first micro-plating space 28 is formed between the first anode porous roller 23 and the second anode porous roller 24 and the bath body of the plating bath 2, and a micro-plating system is formed in the first micro-plating space 28 by the first anode porous roller 23 with a plurality of holes and the first micro-plating space 28 formed between the second anode porous roller 24 with a plurality of holes and the bath body of the plating bath 2, thereby not only preventing the conductive film 3 from being corroded, but also further improving the plating efficiency; in addition, when the conductive film 3 enters the conductive tank 1, the metal in the plating solution brought to the upper surface of the conductive film 3 is plated on the conductive film 3, thereby preventing the plating solution with metal ions from being brought to the cathode rod 11 by the conductive film 3, avoiding the cathode rod 11 from being plated with metal, and improving the plating quality.
In order to further improve the electroplating efficiency, a third anode porous roller 26 and a fourth anode porous roller 27 may be symmetrically arranged on the other end of the electroplating tank 2, the conductive film 3 passes through a gap between the third anode porous roller 26 and the fourth anode porous roller 27, the third anode porous roller 26 is connected with the upper anode titanium blue 21 through a third conducting wire 25c, and the fourth anode porous roller 27 is connected with the lower anode titanium blue 22 through a fourth conducting wire 25 d. In the electroplating process, anode electricity on the upper anode titanium blue 21 and the lower anode titanium blue 22 can be respectively conducted to the third anode porous roller 26 and the fourth anode porous roller 27 through conducting wires, so that the third anode porous roller 26 and the fourth anode porous roller 27 are provided with the anode electricity during electroplating, an electroplating loop is formed among the conductive film 3, the electroplating solution, the third anode porous roller 26 and the fourth anode porous roller 27, and the electroplating loop is used for electroplating the conductive film 3, so that the electroplating efficiency is further improved;
wherein, a second micro-plating space 29 is formed between the third anode porous roller 26 and the fourth anode porous roller 27 and the bath body of the plating bath 2, and a micro-plating system is formed in the second micro-plating space 29 through the third anode porous roller 26 with a plurality of holes and the second micro-plating space 29 formed between the fourth anode porous roller 27 with a plurality of holes and the bath body of the plating bath 2, so that the conductive film 3 can be prevented from being corroded, and the plating efficiency can be further improved; in addition, when the conductive film 3 enters the conductive tank 1, the metal in the plating solution brought to the upper surface of the conductive film 3 is plated on the conductive film 3, thereby preventing the plating solution with metal ions from being brought to the cathode rod 11 by the conductive film 3, avoiding the cathode rod 11 from being plated with metal, and improving the plating quality.
As shown in fig. 10 and fig. 11, in this embodiment, the first anode porous roll 23, the second anode porous roll 24, the third anode porous roll 26 and the fourth anode porous roll 27 have the same structure, and each of them includes an anode roll 201 and an insulating sleeve 202 with a plurality of holes, the insulating sleeve 202 with a plurality of holes is wrapped on the outer side of the anode roll 201, both ends of each anode porous roll are provided with rotating shafts, which can be rotatably connected with the through holes in the electroplating bath 2 through the rotating shafts, the plating solution in the electroplating bath 2 contacts with the anode roll 201 through the plurality of holes for the purpose of electroplating near the edge of the roll, each anode porous roll is internally made of titanium alloy or other materials, the thickness of the insulating sleeve 202 is generally 1-8mm, in this embodiment 2mm, the insulating sleeve 202 is provided with a plurality of holes, the holes are used when the anode porous roll contacts with the plating solution, and acts as an anode in contact with the internal titanium alloy of the anode roll, thereby forming a plating circulation circuit loop with the plating solution and the conductive thin film 3 to plate the conductive thin film 3.
Because in the prior art, a squeeze roll is arranged before the conductive film 3 enters the cathode rod 11 from the electroplating bath 2, because the squeeze roll is made of non-conductive materials such as rubber, a micro electroplating space is formed by the squeeze roll and the side wall of the electroplating bath 2, a part of plating solution exists in the space, when the conductive film 3 enters the micro electroplating space from the conductive bath 1, because the micro electroplating space only has a cathode electrode and does not have an anode electrode, electroplating can not be carried out, and because the plating solution is acidic, the conductive film 3 can be corroded to a certain extent; the first anode porous roller 23, the second anode porous roller 24, the third anode porous roller 26 and the fourth anode porous roller 27 are respectively formed by arranging a plurality of holes on the anode roller, and an electroplating circulation loop can be formed in the micro electroplating space by arranging a plurality of anode porous rollers to replace extrusion rollers, so that the conductive film 3 is prevented from being corroded; in addition, the plating solution in the common plating bath is carried to the upper surface of the cathode rod 11 along the conductive film 3, thereby causing copper plating on the cathode bar 11, and in the present application, the first micro plating spaces 28 and the second micro plating spaces 29 formed on both sides of the plating bath 2 by the first anode multi-hole roll 23 having a plurality of holes and the second anode multi-hole roll 24 having a plurality of holes, the third anode multi-hole roll 26 having a plurality of holes and the fourth anode multi-hole roll 27 having a plurality of holes, micro-plating systems are formed in the first micro-plating space 28 and the second micro-plating space 29, when the conductive film 3 enters the conductive tank 1, copper in the plating solution brought onto the conductive film 3 is plated on the conductive film 3, thereby preventing the plating solution with copper from being brought to the cathode rod 11 by the conductive film 3, avoiding the cathode rod 11 from being plated with copper, and simultaneously improving the plating efficiency.
In this embodiment, the metal to be plated is copper, and since the concentration of metal ions is reduced during the copper plating process, metal balls may be disposed in the upper anode titanium blue 21 and the lower anode titanium blue 22 in order to supplement the metal ions during the plating process in time.
The cathode roller structure adopted by the embodiment of the utility model can prevent the middle part of the conductive roller from being plated with metal crystals or forming a layer of metal foil in the film moving process in the electroplating process, wherein the metal crystals have sharp points, so that the thin film is prevented from being pierced, holes are formed in the thin film, the product percent of pass is low, and the phenomenon of point placement is avoided when excessive current is converged at a small point, so that the originally small holes are burnt out, and even the thin film is burnt out.
The use of multiple cathode rolls allows for a lower current on each cathode roll, which further reduces the amount of metal plated on the conductive rolls when the conductive film is plated with the same amount of metal per unit time compared to a single cathode roll.
Through increasing a plurality of pairs of anodes and being porous, through being connected a plurality of anode rollers with last positive pole titanium blue and lower positive pole titanium blue respectively through the wire, not only improved conductive film's electroplating efficiency greatly, can also keep apart the plating bath in the plating bath groove.
The production device for electroplating the conductive film provided by the utility model has the following working principle:
in this embodiment, the conductive tank 1 and the electroplating tank 2 are alternately arranged in the horizontal direction, the conductive film 3 sequentially passes through the conductive tank 1 and the electroplating tank 2, two rows of cathode rollers 11 are arranged in the conductive tank 1 in parallel in the film running direction, each row is provided with a plurality of cathode rollers 11, the plurality of cathode rollers 11 in the upper and lower rows are arranged in a V shape or are symmetrically arranged one by one in the upper and lower rows, the conductive film 3 penetrates through a gap between the two rows of cathode rollers 11 arranged in the upper and lower rows, two ends of the cathode rollers 11 are conductive sections made of stainless steel or other conductive materials, the middle of the cathode rollers is nonconductive, or the conductive sections and the insulating sections are alternately arranged, the cathode rollers 11 are used as cathodes in the electroplating process, and the cathodes are provided for the conductive film 3 through the plurality of cathode rollers 11. And an electroplating circulation loop is formed by the electroplating solution in the electroplating bath, the upper anode titanium blue 21, the lower anode titanium blue 22 and the conductive film 3, so that the electroplating of the conductive film 3 is realized.
In the embodiment of the utility model, the two ends of the cathode roller 11 are conductive segments made of stainless steel or other conductive materials, the middle of the cathode roller is non-conductive, or the conductive segments and the insulating segments are alternately arranged, so that compared with the traditional cathode roller, namely the cathode roller is made of stainless steel, the structure of the cathode roller 11 can prevent the phenomenon that in the process of film running, for example, copper plating is carried out, a layer of copper is plated at the middle position of the cathode roller, copper crystals are plated or a layer of copper foil is formed, the copper crystals have sharp points, on one hand, the film can be punctured, holes are formed in the film, the qualified rate of products is low, on the other hand, when too much current is converged at a small point, the phenomenon that the original small hole is enlarged, and even the film is blown off; moreover, the plurality of cathode rollers are adopted to play a role in shunting, the current on each cathode roller is smaller, and compared with a single cathode roller, the copper plating amount on the conductive roller can be further reduced while the conductive film is plated with the same amount of copper in the same unit time.
Because the prior art is provided with the squeeze roll before the conductive film 3 enters the cathode roll 11 from the electroplating bath 2, because the squeeze roll is made of non-conductive materials such as rubber, the squeeze roll and the side wall of the electroplating bath 2 form a micro space, a part of plating solution exists in the space, when the conductive film 3 enters the micro space from the conductive bath 1, because the micro space only has a cathode electrode and does not have an anode electrode, electroplating can not be carried out, and because the plating solution is acidic, the conductive film 3 can be corroded to a certain extent, the application can form an electroplating circulating loop in the micro space by respectively forming a plurality of holes on the anode roll to form a first anode porous roll 23, a second anode porous roll 24, a third anode porous roll 26 and a fourth anode porous roll 27, and by arranging a plurality of anode porous rolls to replace the squeeze roll, thereby preventing corrosion of the conductive film 3; in addition, the plating solution in the common plating bath is carried to the upper surface of the cathode rod 11 along the conductive film 3, thereby causing copper plating on the cathode bar 11, and in the present application, a first micro plating space 28 and a second micro plating space 29 are formed on both sides of the plating bath 2 by a first anode multi-hole roll 23 having a plurality of holes and a second anode multi-hole roll 24 having a plurality of holes, a third anode multi-hole roll 26 having a plurality of holes and a fourth anode multi-hole roll 27 having a plurality of holes, the micro-plating systems are respectively formed in the two micro-plating spaces, when the conductive film 3 enters the conductive tank 1, copper in the plating solution brought to the upper surface of the conductive film 3 is plated on the conductive film 3, thereby preventing the plating solution with copper from being brought to the cathode rod 11 by the conductive film 3, avoiding the cathode rod 11 from being plated with copper, and simultaneously improving the plating efficiency. According to the electroplating production device of the conductive film, provided by the embodiment of the utility model, in the electroplating process, the middle position of the conductive roller can be prevented from being plated with the metal crystal or forming a layer of metal foil in the film moving process, the metal crystal has a sharp point part, on one hand, the film is prevented from being pierced, and a hole is formed on the film, so that the product percent of pass is low, on the other hand, the point placing phenomenon can be avoided when excessive current is converged at a small point, and therefore, the originally small hole is burnt, and even the film is burnt off.
The use of multiple cathode rolls allows for a lower current on each cathode roll, which further reduces the amount of metal plated on the conductive rolls when the conductive film is plated with the same amount of metal per unit time compared to a single cathode roll.
Through increasing a plurality of pairs of anodes and being porous, through being connected a plurality of anode rollers with last positive pole titanium blue and lower positive pole titanium blue respectively through the wire, not only great improvement conductive film's electroplating efficiency, can also keep apart the plating bath in the plating bath groove.
Through increasing the porous roller of many pairs of positive poles, through being connected a plurality of positive poles roller respectively through wire and last positive pole titanium blue and lower positive pole titanium blue, not only improved conductive film's electroplating efficiency greatly, can also keep apart the plating solution in the plating bath groove.
In the description of the embodiments of the present invention, it should be noted that the terms "upper, lower, inner and outer" and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus should not be construed as limiting the present invention. Furthermore, the terms first, second, or third are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted, connected" and the like are to be understood broadly, for example: can be fixedly connected, detachably connected or integrally connected; they may be mechanically, electrically, or directly connected, or indirectly connected through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
While the utility model has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the utility model not be limited to the particular embodiments disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A production apparatus for electroplating a conductive film, comprising:
the electroplating device comprises a plurality of conductive grooves (1) and a plurality of electroplating baths (2), wherein the conductive grooves (1) and the electroplating baths (2) are alternately arranged in the horizontal direction, a plurality of cathode rollers (11) are arranged in the conductive grooves (1) up and down, and a conductive film (3) penetrates through gaps of the cathode rollers (11);
the electroplating bath (2) is provided with an upper anode titanium blue (21) and a lower anode titanium blue (22) in a vertical symmetrical mode, and the conductive film (3) penetrates through a gap between the upper anode titanium blue (21) and the lower anode titanium blue (22).
2. A production apparatus for electroplating a conductive film according to claim 1, characterized in that: the cathode roller (11) comprises a conductive section and an insulating section, wherein the middle section of the cathode roller (11) is the insulating section, and two ends of the cathode roller (11) are the conductive sections; alternatively, the conductive segments and the insulating segments of the cathode roll (11) are alternately arranged.
3. A production apparatus for electroplating a conductive film according to claim 2, characterized in that: the cathode rollers (11) are arranged in the conductive groove (1) in parallel and are rotationally connected with the conductive groove (1).
4. A production apparatus for electroplating a conductive film according to claim 1, characterized in that: a first anode porous roller (23) and a second anode porous roller (24) are symmetrically arranged at one end of the electroplating bath (2), the first anode porous roller (23) is connected with the upper anode titanium blue (21) through a first lead (25a), and the second anode porous roller (24) is connected with the lower anode titanium blue (22) through a second lead (25 b);
wherein a first micro-plating space (28) is formed between the first anode porous roller (23) and the second anode porous roller (24) and the tank body of the plating tank (2).
5. A production apparatus for conductive thin film plating according to claim 4, characterized in that the other end of said plating tank (2) is symmetrically provided with a third anode porous roller (26) and a fourth anode porous roller (27), said third anode porous roller (26) is connected with said upper anode titanium blue (21) through a third lead (25c), said fourth anode porous roller (27) is connected with said lower anode titanium blue (22) through a fourth lead (25 d);
wherein a second micro-plating space (29) is formed between the third anode porous roller (26) and the fourth anode porous roller (27) and the bath body of the plating bath (2).
6. A production apparatus for electroconductive thin film plating according to claim 5, wherein said first anode porous roller (23), said second anode porous roller (24), said third anode porous roller (26) and said fourth anode porous roller (27) have the same structure, each anode porous roller comprising: the electroplating bath device comprises an anode roller (201) and an insulating sleeve (202) which is wrapped on the outer side of the anode roller (201) and provided with a plurality of holes, wherein the electroplating bath in the electroplating bath (2) is in contact with the anode roller (201) through the holes.
7. A production apparatus for plating a conductive film according to any one of claims 1 to 6, characterized in that: and metal balls are respectively arranged in the upper anode titanium blue (21) and the lower anode titanium blue (22) and are used for supplementing metal ions in the plating solution.
8. A production apparatus for electroplating a conductive film according to claim 5, wherein: the upper half part of the first anode porous roller (23) and the upper half part of the third anode porous roller (26) are positioned outside plating solution, and the lower half part of the first anode porous roller (23) and the lower half part of the third anode porous roller (26) are positioned in the plating solution and used for isolating the plating solution in the plating tank (2).
9. A production apparatus for electroplating a conductive film according to claim 3, characterized in that: the cathode rollers (11) are arranged in the conductive groove (1) in parallel in two rows in the film running direction;
the conductive film (3) passes through the gap between the two rows of cathode rollers (11).
10. A production apparatus for electroplating a conductive film according to claim 9, characterized in that: the first row of cathode rollers (11) and the second row of cathode rollers (11) are symmetrically arranged up and down in a one-to-one manner, or the first row of cathode rollers (11) and the second row of cathode rollers (11) are arranged in a V shape.
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| CN202122135603.0U CN215947437U (en) | 2021-09-06 | 2021-09-06 | Production device for electroplating conductive film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113737256A (en) * | 2021-09-06 | 2021-12-03 | 重庆金美新材料科技有限公司 | Production device and production method for electroplating conductive film |
| WO2024051152A1 (en) * | 2022-09-07 | 2024-03-14 | 重庆金美新材料科技有限公司 | Flexible foil production system |
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2021
- 2021-09-06 CN CN202122135603.0U patent/CN215947437U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113737256A (en) * | 2021-09-06 | 2021-12-03 | 重庆金美新材料科技有限公司 | Production device and production method for electroplating conductive film |
| WO2024051152A1 (en) * | 2022-09-07 | 2024-03-14 | 重庆金美新材料科技有限公司 | Flexible foil production system |
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