CN114563902A - Projection optical machine and projection equipment - Google Patents
Projection optical machine and projection equipment Download PDFInfo
- Publication number
- CN114563902A CN114563902A CN202210239187.5A CN202210239187A CN114563902A CN 114563902 A CN114563902 A CN 114563902A CN 202210239187 A CN202210239187 A CN 202210239187A CN 114563902 A CN114563902 A CN 114563902A
- Authority
- CN
- China
- Prior art keywords
- heat
- housing
- heat dissipation
- optical element
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Projection Apparatus (AREA)
Abstract
The utility model provides a projection ray apparatus and projection equipment, the projection ray apparatus includes the casing, a plurality of optical element and radiator unit, be formed with accommodation space in the casing, a plurality of optical element dispose in accommodation space, and be located the illumination light path, radiator unit, including fan and an at least radiating piece, the fan disposes in accommodation space, the fan is used for providing the air current that circulates and pass through optical element in accommodation space, the radiating piece sets up on the casing, and at least part is located the route of flowing through of air current, and be located the air current entering side of one or more optical element. The optical element protection device overcomes the problems that the optical element is damaged and the service life is low due to high internal temperature of the projection light machine, and further achieves the effects of improving the heat dissipation and the service life of the optical element.
Description
Technical Field
The utility model belongs to the technical field of the projection, especially, relate to a projection ray apparatus and projection equipment.
Background
With the rapid development of projection technology, the brightness of the projection optical machine, which is a core component of the projection apparatus, is continuously increased, resulting in higher temperatures of the imaging chip and the optical elements of the projection optical machine, such as the lens, the fly-eye lens, the reflector, and the like. At present, the temperature of the imaging chip is generally controlled by a semiconductor refrigerating sheet, but the heat dissipation of an optical element in the projection optical machine cannot be considered, the optical element works in a high-temperature environment, the service life of the optical element is limited, and the performance of projection equipment is influenced.
Disclosure of Invention
The embodiment of the disclosure provides a projection light machine and projection equipment, which are used for solving the problems of damage to an optical element and short service life caused by high internal temperature of the projection light machine.
In a first aspect, an embodiment of the present disclosure provides a projection light machine, including:
a housing in which an accommodation space is formed;
a plurality of optical elements configured in the accommodating space and positioned on the illumination light path;
and the heat dissipation assembly comprises a fan and at least one heat dissipation piece, the fan is arranged in the accommodating space and used for providing airflow which circulates in the accommodating space and passes through the optical element, and the heat dissipation piece is arranged on the shell and at least partially positioned on a flowing path of the airflow and positioned on the airflow inlet side of one or more optical elements.
Optionally, the heat sink comprises a heat conduction device disposed on an inner surface of the housing.
Optionally, the heat dissipation member further includes a heat dissipation device disposed on the outer surface of the housing, and the heat conduction device and the heat dissipation device are respectively located on two side surfaces of the same portion of the housing.
Optionally, the heat dissipation assembly further includes a first semiconductor cooling fin disposed between the heat dissipation device and the housing; and/or the first semiconductor refrigeration sheet is arranged between the heat conducting device and the shell, and the first semiconductor refrigeration sheet is used for conducting heat of the heat conducting device to the heat dissipation device.
Optionally, the heat conducting device includes a plurality of fins, a heat dissipation channel is formed between adjacent fins, and a direction of the heat dissipation channel is parallel to the airflow direction.
Optionally, the optical elements include a fly-eye lens and a prism assembly sequentially disposed on the illumination light path, and the heat dissipation member is disposed on the gas flow inlet side of the fly-eye lens and/or the prism assembly.
Optionally, the optical elements further include a reflector located on the illumination light path, light emitted from the fly-eye lens is reflected by the reflector and enters the prism assembly, and the prism assembly is located on an air inlet side of the fan.
Optionally, the heat dissipation device further comprises an imaging chip, the imaging chip is located on the air inlet side of the fan, an imaging surface of the imaging chip is located on a flowing path of the air flow, the imaging surface is parallel to the flowing direction of the air flow, and one of the heat dissipation members is located on the air flow inlet side of the imaging chip.
Optionally, the heat dissipation assembly further includes a heat conduction layer, one side of the heat conduction layer is attached to the optical element, and the other side of the heat conduction layer is attached to the housing; and/or the optical element is connected with the shell through a fixing piece, one side of the heat conduction layer is attached to the optical element, and the other side of the heat conduction layer is attached to the fixing piece.
Optionally, the heat dissipation assembly further includes a flow guide member, a flow passage is formed between the flow guide member and the housing, and the air flow circulates in the flow passage.
Optionally, the air conditioner further comprises a fan arranged outside the housing, wherein the fan provides airflow acting outside the housing.
In a second aspect, an embodiment of the present disclosure further provides a projection apparatus, including a lens component and the projection light engine described in any of the above, where the lens component is disposed on a light exit side of an illumination light path of the projection light engine.
The embodiment of the utility model provides a pair of projection ray apparatus and projection equipment, through set up radiator unit in the casing, radiator unit includes fan and at least one radiating piece, the fan forms the air current that circulates through optical element in the accommodation space in the casing, take away the heat that optical element produced, dispel the heat to optical element, the radiating piece is outside with heat transfer in the casing, with dispel the heat to the casing inside, simultaneously with the air current entering side of radiating piece setting at one or more optical element, the temperature of the air current through optical element has been reduced, optical element's temperature has further been reduced, overcome and present lead to optical element to damage because of the inside high temperature of projection ray apparatus, the low-lived problem, and then reached the effect that improves optical element heat dissipation and life.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly introduced below. It is apparent that the drawings in the following description are only some embodiments of the disclosure, and that other drawings may be derived from those drawings by those skilled in the art without inventive effort.
For a more complete understanding of the present disclosure and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.
Fig. 1 is a schematic diagram of a projection apparatus provided in an embodiment of the present disclosure.
Fig. 2 is an exploded view of a projection device provided in an embodiment of the present disclosure.
Fig. 3 is a side view of a light engine for projection provided in an embodiment of the present disclosure.
Fig. 4 is an axial view of a projection light engine provided in an embodiment of the disclosure.
Fig. 5 is a schematic diagram of a light projector according to an embodiment of the disclosure, in which a heat conducting layer is disposed.
Fig. 6 is a schematic view of a first arrangement of a first semiconductor chilling plate according to an embodiment of the present disclosure.
Fig. 7 is a schematic view of a second arrangement of the first semiconductor chilling plate according to the embodiment of the present disclosure.
Wherein the drawings are indexed as follows:
the projection optical machine 100, the housing 110, the accommodating space 111, the body 112, the cover plate 113, the optical element 120, the fly-eye lens 121, the prism assembly 122, the reflector 123, the fixing member 124, the heat dissipation assembly 130, the fan 131, the heat dissipation member 132, the heat conduction device 1320, the fins 1321, the heat dissipation channel 1322, the heat dissipation device 1323, the first semiconductor chilling plate 133, the heat conduction layer 134, the flow guide member 136, the flow channel 1360, the non-flow channel region 1110, the first flow guide plate 1361, the second flow guide plate 1362, the imaging chip 140, the heat dissipation device 141, the heat sink 1411, the second semiconductor chilling plate 1410, the thermal insulation cotton 1412, and the lens assembly 200.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. It is to be understood that the described embodiments are merely illustrative of some, and not restrictive, of the embodiments of the disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
The embodiment of the disclosure provides a projection light machine and projection equipment, so as to solve the problems of damage to an optical element and short service life caused by high internal temperature of the projection light machine. The following description will be made with reference to the accompanying drawings.
Aiming at the defects that in the prior art, as an optical element of the projection equipment is fixed on a shell of a projection light machine, the heat conduction and heat resistance between the optical element and the shell are high, the heat exchange between the optical element and the shell through heat radiation is not facilitated, the internal temperature of the projection light machine is higher, the heat dissipation of the optical element is not facilitated, the optical element works in a high-temperature environment, the service life of the optical element is shortened, and the performance of the projection equipment is influenced; the present disclosure can solve the problem of heat dissipation inside the housing 110 and the optical element 120 by disposing the heat dissipation assembly 130 inside the housing 110, wherein the heat dissipation assembly 130 includes the fan 131 and the heat dissipation member 132, the fan 131 forms an air flow inside the housing 110, the heat dissipation member 132 is disposed on the air inlet side of the optical element 120, the heat inside the housing 110 is transferred to the outside of the housing 110 through the heat dissipation member 132, and the air flow flows through the optical element 120, thereby reducing the temperature of the optical element 120, and improving the service life of the optical element 120.
Based on the above inventive concept, an embodiment of the present disclosure provides a projection apparatus, please refer to fig. 1, fig. 2 and fig. 3, in which fig. 1 is a schematic diagram of the projection apparatus provided in the embodiment of the present disclosure, fig. 2 is an exploded view of the projection apparatus provided in the embodiment of the present disclosure, and fig. 3 is a side view of a projection optical machine provided in the embodiment of the present disclosure. The projection apparatus includes a projection light engine 100 and a lens assembly 200, wherein the projection light engine 100 includes a housing 110, a plurality of optical elements 120, a heat dissipation assembly 130, an imaging chip 140, and a light source (not shown), the light source (not shown) is used for providing an illumination beam, the plurality of optical elements 120 are disposed on an illumination light path, the imaging chip 140 is used for converting the illumination beam into an image beam, and the imaging chip 140 may be a Liquid Crystal On Silicon (LCOS), a Liquid Crystal transmissive light valve (LCD), a Digital Micromirror Device (DMD), or the like. The lens assembly 200 is disposed on the light-emitting side of the illumination light path of the projector 100 for projecting image light beams. The lens assembly 200 may include one or more optical lenses having the same or different refractive powers and various combinations thereof, for example, non-planar lenses including biconcave lenses, biconvex lenses, meniscus lenses, convex-concave lenses, plano-convex lenses, plano-concave lenses, and the like and various combinations thereof. Of course, the lens assembly 200 may also include a planar optical lens to reflect or transmit radiation to project an image beam out of the projection device. However, the present disclosure does not limit the form of the lens assembly 200 and its kind. The light source (not shown) comprises a laser diode, such as an array of laser diodes. However, the present disclosure is not limited thereto.
For a more clear description of the structure of the light projector 100, the light projector 100 will be described with reference to the drawings.
Referring to fig. 2 and fig. 3, fig. 2 is an exploded view of a light engine for projection provided in an embodiment of the present disclosure, and fig. 3 is a side view of the light engine for projection provided in an embodiment of the present disclosure.
The light projection engine 100 provided by the embodiment of the disclosure includes a housing 110, a plurality of optical elements 120, and a heat dissipation assembly 130, wherein an accommodation space 111 is formed in the housing 110, the plurality of optical elements 120 are disposed in the accommodation space 111 and located on an illumination light path, the heat dissipation assembly 130 includes a fan 131 and at least one heat dissipation member 132, the fan 131 is disposed in the accommodation space 111, the fan 131 is configured to provide an airflow circulating in the accommodation space 111 and passing through the optical elements 120, and the heat dissipation member 132 is disposed on the housing 110 and at least partially located on a flow path of the airflow and located on an airflow entrance side of one or more optical elements 120. It can also be understood that the fan 131 is installed in the housing 110 and located in the accommodating space 111, after the fan 131 is started, an air flow is formed in the accommodating space 111, the air flow flows through the optical element 120, the heat of the optical element 120 is taken away by means of thermal convection, so as to cool the optical element 120, the heat dissipation member 132 is disposed on the housing 110, the air flow flows through the heat dissipation member 132, the heat dissipation member 132 transfers the temperature in the housing 110 to the outside of the housing 110 by means of heat conduction, so as to cool the air flow, the heat dissipation member 132 is disposed before the air inlet side of one, some, or all of the optical elements 120, the air flow that is cooled by the heat dissipation member 132 first cools the air flow that flows through the optical element 120, so as to take away more heat of the optical element 120, further improve the heat dissipation effect of the optical element 120, and prevent the optical element 120 from being damaged due to high temperature, the lifetime of the optical element 120 is improved.
It can be understood that the projection light engine 100 includes a housing 110, a plurality of optical elements 120, and a heat dissipation assembly 130, where the housing 110 includes a body 112 with an opening on one side and a cover plate 113 sealed on the opening, the body 112 is a groove, the body 112 and the cover plate 113 enclose an accommodation space 111, the plurality of optical elements 120 are installed in the body 112, the plurality of optical elements 120 may include a prism, a reflector, a galvanometer, a fly-eye lens, etc., a specific type of the optical element 120 may be designed according to a type of the projection device, the plurality of optical elements 120 are all located on an illumination light path for changing a propagation direction of the illumination light beam, the heat dissipation assembly 130 includes a fan 131 and a heat dissipation member 132, the fan 131 may be an axial fan, a mini centrifugal fan, or a piezoelectric ceramic fan, a specific number, power, and model of the fan 131 may be set differently according to a size of an inner space of the housing 110, a number of the heat dissipation member 132 may also be set according to a size of the accommodation space 111, the present disclosure does not impose a limit on the number of the fans 131 and the heat sinks 132.
In some embodiments, the plurality of optical elements 120 includes a fly-eye lens 121 and a prism assembly 122 disposed in sequence in the illumination light path, and the heat sink 132 is disposed on the gas flow entry side of the fly-eye lens 121 and/or the prism assembly 122. It can also be understood that the optical elements 120 in the present disclosure include a fly-eye lens 121 and a prism assembly 122, the fly-eye lens 121 and the prism assembly 122 are installed inside the housing 110, a light source is disposed at the front end of the fly-eye lens 121, an illumination beam emitted from the light source is incident on the prism assembly 122 through the fly-eye lens 121, wherein, the number of the fly-eye lenses 121 can be multiple, the prism assembly 122 can also comprise multiple prisms, the number and the arrangement positions of the fly-eye lenses 121 and the prisms 122 are specified, depending on the type or style of projection device, one heat sink 132 may be provided, and when one heat sink 132 is provided, may be provided on the air flow entrance side of the fly-eye lens 121 or on the air flow entrance side of the prism assembly 122, a plurality of heat dissipation members 132 may also be provided, according to the use requirement, it can be arranged on the gas flow inlet side of the fly-eye lens 121 and the gas flow inlet side of a certain prism or all prisms of the prism assembly 122.
It is understood that a heat dissipation member 132 may be provided, and the heat dissipation member 132 may extend from the airflow inlet side of the fly-eye lens 121 to the airflow inlet side or the airflow outlet side of the prism assembly 122 to improve the heat dissipation effect of the optical element 120.
On the basis of the above embodiment, the optical elements 121 further include a reflector 123 located on the illumination light path, the light emitted from the fly-eye lens 121 is reflected by the reflector 123 and enters the prism assembly 122, the reflector 123 is located on the fly-eye lens 121 side, and the prism assembly 122 is located on the air intake side of the fan 131. It can also be understood that the optical elements 121 include a fly-eye lens 121, a reflecting mirror 123 and a prism assembly 122, which are located on the illumination light path, and the illumination light beams sequentially pass through the fly-eye lens 121, the reflecting mirror 123, the prism assembly 122 and the imaging chip 140 and then exit to the lens assembly 200 through the prism assembly 122. The imaging chip 140 in the above embodiments is an LCOS chip or a DMD chip. In other embodiments, the imaging chip 140 may also be an LCD chip. The air inlet of the fan 131 faces the prism assembly 122, one heat sink 132 is disposed between the airflow outflow side of the prism assembly 122 and the airflow inflow side of the fly-eye lens 121 to dissipate heat of the fly-eye lens 121, and the other heat sink 132 is disposed between the airflow outflow side of the reflector 123 and the airflow inflow side of the lens assembly 122 to dissipate heat of the lens assembly 122, it can be understood that the heat sink 132 may also be disposed between the airflow outflow side of the fly-eye lens 121 and the airflow inflow side of the reflector 123 to dissipate heat of the reflector 123, and the heat sink 132 is disposed on the airflow inflow side of the optical element 120 to provide a heat dissipation effect of the optical element 120, thereby improving the service life of the optical element 120, making it possible to use the fly-eye lens 121 made of plastic material in the high-brightness projection light engine 100, and reducing the cost of the projection light engine 100.
In some embodiments, the heat sink 132 includes a thermal conduction device 1320, the thermal conduction device 1320 being disposed on an inner surface of the housing 110. It can also be understood that the heat conducting device 1320 is disposed on the inner surface of the housing 110 and extends toward the inside of the housing 110, the heat conducting device 1320 is located on a path through which the airflow flows, the heat conducting device 1320 transfers heat of the airflow to the outside of the housing 110 in a heat conduction manner to cool the inside of the housing 110, the heat conducting device 1320 may be disposed on an airflow entering side of one, a plurality of or each optical element 120, so that after the temperature of the airflow flowing through the previous optical element 120 is raised, the airflow exchanges heat with the housing 110 through the heat conducting device 1320 to recover to a lower temperature, and then flows through the next optical element 120, thereby improving a heat dissipation effect on the optical element 120 and prolonging the service life of the optical element 120. In addition, a fan (not shown, optionally a fan) may be disposed outside the casing 110, the fan provides an airflow acting on the outside of the casing 110, the airflow outside the casing 110 flows through the outer surface of the casing 110, and the heat of the casing 110 is taken away by thermal convection, and the airflow provided by the fan further improves the heat dissipation effects of the device 1323 and the heat dissipation device 141, improves the imaging effect of the imaging chip 140, reduces the temperature of the optical element 120, improves the lifetime of the optical element 120, and improves the performance of the projection optical engine 100.
In the above embodiment, the heat conducting device 1320 includes a plurality of fins 1321, and heat dissipation channels 1322 are formed between adjacent fins 1321, and the direction of the heat dissipation channels 1322 is parallel to the airflow method. It can also be understood that the heat conducting device 1320 includes a plurality of fins 1321 arranged at intervals, the fins 1321 are arranged on the inner surface of the housing 110, the fins 1321 extend toward the inside of the housing 110, the adjacent fins 1321 and the inner wall of the housing 110 enclose a slot-shaped heat dissipation channel 1322, the airflow generated by the fan 131 flows through the heat dissipation channel 1322, the flowing direction of the airflow in the heat dissipation channel 1322 is the same as the direction of the airflow flowing through the optical element 120, so as to avoid that the heat conducting device 1320 blocks the airflow flowing, so that airflow turbulence is caused, and the heat dissipation effect of the optical element 120 is affected. In addition, the length of the fin 1321 extends along the flowing direction of the airflow, the fin 1321 may be located between two optical elements 120, or may extend from the entrance side of one optical element 120 to the entrance side of the other optical element, the fin 1321 is made of a heat conductive material, the fin 1321 may be integrally formed with the housing 110 by injection molding, and as a modification, the fin 1321 may also be adhered to the inner surface of the housing 110 by a heat conductive adhesive.
In some embodiments, the heat dissipation member 132 further includes a heat dissipation device 1323, the heat dissipation device 1323 is disposed on the outer surface of the housing 110, and the thermal conduction device 1320 and the heat dissipation device 1323 are respectively disposed on two sides of the same portion of the housing 110 (in other embodiments, only one of the thermal conduction device 1320 and the heat dissipation device 1323 may be disposed). It can also be understood that the heat conducting device 1320 is disposed on the inner surface of the housing 110 and extends toward the inside of the housing 110, the heat conducting device 1320 is located on the path through which the airflow flows, the heat dissipating device 1323 is disposed on the outer surface of the housing 110 and extends toward the outside of the housing 110, the heat conducting device 1320 and the heat dissipating device 1323 are located on two sides of the same portion of the housing 110, the heat conducting device 1320 exchanges heat with the airflow in the housing 110 to transfer the heat in the housing 110 to the housing 110, and the heat dissipating device 1323 exchanges heat with the external environment of the housing 110 to dissipate the heat of the housing 110, thereby reducing the temperature of the housing 110, reducing the temperature inside the housing 110, reducing the influence of the heat dissipation problem on the optical element 120 and other devices in the housing 110, and improving the imaging effect of the projection apparatus. In addition, a fan can be arranged outside the housing 110, the fan provides airflow acting on the outside of the housing 110, the airflow outside the housing 110 flows through the heat dissipation device 1323, and heat of the heat dissipation device 1323 is taken away in a heat convection mode, so that the heat dissipation effect of the housing 110 is further improved.
Specifically, referring to fig. 4, fig. 4 is an axial view of a light projector according to an embodiment of the present disclosure. The heat conducting device 1320 and the heat dissipating device 1323 have the same structure, and both include a plurality of fins 1321, the plurality of fins 1321 located inside the housing 110 are arranged at intervals, the adjacent fins 1321 and the inner wall of the housing 110 enclose a groove-shaped heat dissipating channel 1322, the airflow generated by the fan 131 flows through the heat dissipating channel 1322, the flowing direction of the airflow in the heat dissipating channel 1322 is the same as the direction of the airflow flowing through the optical element 120, thereby avoiding the influence on the heat dissipating effect of the optical element 120 due to the turbulence of the airflow caused by the obstruction of the airflow caused by the heat conducting device 1320. The heat dissipation device 1323 includes a plurality of fins 1321 located outside the housing 110, the fins 1321 are arranged at intervals, the adjacent fins 1321 and the exterior of the housing 110 enclose a groove-shaped heat dissipation channel 1322, when the blower is arranged outside the housing 110, the flow direction of the airflow generated by the blower is the same as the direction of the heat dissipation channel 1322, so that the problem that the airflow is disturbed due to the arrangement of the heat dissipation device 1323 to block the airflow outside the housing 110, and the heat dissipation effect of the optical element 120 is affected is avoided.
Referring to fig. 6, fig. 6 is a schematic view of a first arrangement of a first semiconductor cooling plate according to an embodiment of the present disclosure.
In some embodiments, the heat dissipation assembly 130 further comprises a first semiconductor cooling sheet 133, the first semiconductor cooling sheet 133 being disposed between the heat conducting device 1320 and the housing 110 and being used for conducting heat of the heat conducting device 1320 to the heat dissipation device 1323. It can also be understood that the heat dissipation assembly 130 includes the heat dissipation member 132 and the first semiconductor cooling sheet 133, the heat conduction device 1320 is disposed on the inner surface of the housing 110, the first semiconductor cooling sheet 133 is disposed on the inner surface of the housing 110, the hot surface of the first semiconductor cooling sheet 133 is attached to the inner surface of the housing 110, and the hot surface of the first semiconductor cooling sheet 133 is disposed on the outer surface of the housing 110, and the cold surface of the first semiconductor cooling sheet 133 is attached to the heat conduction device 1320 through the heat conduction pad (not shown), that is, the cold surface of the first semiconductor cooling sheet 133 is attached to the fin 1321 separated from the inner surface of the housing 110, so as to form a micro air conditioning structure by using the first semiconductor cooling sheet 133, further reduce the temperature of the air flowing through the next optical element 120, and improve the heat dissipation effect of the optical element 120, the lifetime of the optical element 120 is improved.
It can be understood that, when the heat dissipation device 1323 is not provided, the first semiconductor cooling sheet 133 is disposed between the heat conduction device 1320 and the housing 110 and is used for conducting heat of the heat conduction device 1320 to the housing 110, the first semiconductor cooling sheet 133 may be disposed on an inner surface or an outer surface of the housing 110, a position of the first semiconductor cooling sheet 133 attached to the housing 110 corresponds to a position of the heat conduction device 1320 on the housing 110, and the first semiconductor cooling sheet 133 is used for cooling the heat conduction device 1320, so that a temperature of an air flow flowing through the next optical element 120 is reduced, and a heat dissipation effect of the optical element 120 is improved.
Referring to fig. 7, fig. 7 is a schematic view of a second arrangement of the first semiconductor chilling plate according to the embodiment of the present disclosure.
In some embodiments, the heat dissipation assembly 130 further comprises a first semiconductor chilling plate 133, the first semiconductor chilling plate 133 is disposed between the heat sink device 1323 and the housing 110, and the first semiconductor chilling plate 133 is used to conduct heat of the thermal conduction device 1320 to the heat sink device 1323. It can also be understood that, when the heat dissipation assembly 130 includes the heat dissipation member 132 and the first semiconductor chilling plate 133, the heat dissipation device 1323 is disposed on the outer surface of the casing 110, the first semiconductor chilling plate 133 is located between the heat dissipation device 1323 and the outer surface of the casing 110, and the first semiconductor chilling plate 133 and the heat conduction device 1320 are located on two side surfaces of the same portion of the casing 110, the cold surface of the first semiconductor chilling plate 133 is attached to the outer surface of the casing 110, the first semiconductor chilling plate 133 is attached to the outer surface of the casing 110 through a heat conduction pad (not shown), the hot surface of the second semiconductor chilling plate 133 is attached to the heat dissipation device 1323, that is, the hot surface of the first semiconductor chilling plate 133 is attached to the fin 1321 separated from the outer surface of the casing 110, the heat conduction device 1320 transfers heat to the casing 110, the cold surface of the first semiconductor chilling plate 133 dissipates heat to the casing 110, thereby cooling the heat conduction device 1320, the heat of the hot surface of the first semiconductor cooling plate 133 is transferred to the heat dissipation device 1323, and is dissipated to the outside of the housing 110, and a micro air conditioning structure is formed by using the first semiconductor cooling plate 133, so that the temperature of the airflow flowing through the next optical element 120 is further reduced, the heat dissipation effect of the optical element 120 is improved, and the service life of the optical element 120 is prolonged.
In some embodiments, in order to solve the problem in the prior art that when the temperature of the imaging chip 140 is directly controlled by using a semiconductor cooling plate, because the imaging chip 140 is located in a portion inside the housing of the projection light machine, it is difficult to seal the imaging chip 140 due to the requirement of the optical path design, so that the temperature of the imaging chip 140 is lower than the temperature of the air inside the housing of the projection light machine, and the imaging chip is prone to dewing. By arranging the heat dissipation assembly 130 in the housing 110, the heat dissipation assembly 130 includes the fan 131, and the fan 131 forms an airflow inside the housing 110, and the airflow flows through the imaging surface of the imaging chip 140, thereby reducing the possibility of condensation. Referring to fig. 2, the projection optical engine 100 further includes an imaging chip 140, the imaging chip 140 is located on the air inlet side of the fan 131, an imaging surface of the imaging chip 140 is located on the flow path of the airflow, the imaging surface is parallel to the flow direction of the airflow, and a heat dissipation member 132 is located on the airflow inlet side of the imaging chip 140.
Specifically, an opening is formed in the housing 110, the imaging chip 140 is mounted at the opening, an imaging surface of the imaging chip 140 is located in the housing 110, the imaging surface is located at one side of the lens assembly 122, the imaging chip 140 converts the illumination beam into an image beam, a heat dissipation device 141 for dissipating heat of the imaging chip 140 is arranged at one side of the imaging chip 140 away from the imaging surface, the heat dissipation device 141 includes a heat insulation cotton 1412, a heat sink 1411 and a second semiconductor chilling plate 1410, a cold surface of the second semiconductor chilling plate 1410 is attached to one side surface of the imaging chip 140, a hot surface of the second semiconductor chilling plate 1410 is attached to the heat sink 1411, the heat insulation cotton 1412 is arranged around the second semiconductor chilling plate 1410 to separate the second semiconductor chilling plate 1410 from the housing 110, the second semiconductor chilling plate 1410 dissipates heat of the imaging chip 140, and airflow is formed in the housing 110 by the heat dissipation assembly 130 in the present disclosure, the air current flows through the imaging surface of imaging chip 140, the phenomenon of imaging surface dewing of imaging chip 140 is avoided, the performance of projection equipment is improved, in addition, imaging chip 140 is arranged on the air inlet side of fan 131, heat dissipation piece 132 is located the air current entering side of imaging chip 140, after the air current is dissipated through heat dissipation piece 132, the air current flows through the imaging surface of imaging chip 140, the heat dissipation effect of imaging chip 140 is improved, the reliability of imaging chip 140 is further improved, and the performance of projection equipment is improved.
Referring to fig. 5, fig. 5 is a schematic view of a light projector provided with a heat conducting layer according to an embodiment of the disclosure.
In some embodiments, the heat dissipation assembly 130 further includes a thermally conductive layer 134, one side of the thermally conductive layer 134 is attached to the optical element 120, and the other side of the thermally conductive layer 134 is attached to the housing 110; and/or the optical element 120 is connected to the housing 110 by the fixing member 124, one side of the heat conducting layer 134 is attached to the optical element 120, and the other side of the heat conducting layer 134 is attached to the fixing member 124.
Specifically, the optical elements 121 include a fly-eye lens 121, a reflector 123 and a prism assembly 122 located on the illumination light path, the illumination light beam sequentially passes through the fly-eye lens 121, the reflector 123, the prism assembly 122 and the imaging chip 140 and then is emitted to the lens assembly 200 through the prism assembly 122, the fly-eye lens 121 is connected with the housing 110 through a heat conduction layer 134, and the heat conduction from the fly-eye lens 121 to the housing 110 is strengthened, so that the temperature of the fly-eye lens 121 is effectively reduced, the service life of the fly-eye lens 121 is prolonged, the use of the fly-eye lens 121 made of a plastic material in a high-brightness projection light machine is possible, and the cost of the projection light machine is reduced. The prism assembly 122 is connected with the housing 110 through the fixing member 124, the fixing member 124 is a spring plate structure or a clamping groove structure, the spring plate structure is fixed with the housing 110 through a screw, and compared with the case that the heat conduction resistance of the prism assembly 122 and the housing 110 is high, in the disclosure, the heat conduction layer 134 is arranged between the prism assembly 122 and the fixing member 124, the contact area between the prism assembly 122 and the spring plate structure is increased, the heat conduction resistance of the prism assembly 122 to the housing 110 is reduced, part of heat of the prism assembly 122 is transferred to the fixing member 124 through the heat conduction layer 134, and is transferred to the housing 110 through the fixing member 124 and is dissipated from the housing, and the problem of the prism assembly 122 is further reduced. In addition, the heat conduction layer 134 may be made of heat conductive foam, heat conductive pad with volatile inorganic or organic compounds, heat conductive glue, and other compressible materials.
Referring to fig. 3 and fig. 4, fig. 3 is a side view of a light engine provided in the embodiment of the present disclosure, and fig. 4 is an axial view of the light engine provided in the embodiment of the present disclosure.
In some embodiments, the heat dissipation assembly 130 further includes a flow guide 136, the flow guide 136 and the optical element 120 form a flow passage 1360 with the housing 110, and the airflow circulates through the flow passage 1360. It can also be understood that the flow guiding element 136 is disposed in the housing 110, the flow guiding element 136 and the optical element 120 are spaced from the inside of the housing 110, the flow guiding element 136 and the optical element 120 divide the accommodating space 111 in the housing 110 into the flow passage 1360 and the non-flow passage 1110, the fan 131 is installed in the flow passage 1360, and the sidewall of the flow passage 1360 utilizes a part of the structure of the housing 110 and the optical element 120, so that the housing 110 and the accommodating space 111 inside the housing 110 are reasonably utilized, the volume of the housing 110 does not need to be increased, the product structure is compact, and the installation and maintenance are convenient. Alternatively, the flow guide 136 may form the flow passage 1360 inside the housing 110, and the fan 131 and the optical element 120 may be installed inside the flow passage 1360.
On the basis of the above embodiment, the plurality of optical elements 121 include a fly eye lens 121, a reflecting mirror 123 and a prism assembly 122 located on the illumination light path, the illumination light beams sequentially pass through the fly eye lens 121, the reflecting mirror 123, the prism assembly 122 and the imaging chip 140 and then are emitted to the lens assembly 200 through the prism assembly 122, the guide member 136 includes a first guide plate 1361 and a second guide plate 1362, the first guide plate 1361 is installed on the housing 110, the first guide plate 1361 and the upper plate body of the housing 110 are arranged at intervals, the prism assembly 122 and the fan 131 are located above the first guide plate 1361, the fan 131 is installed on the upper surface of the prism 1361, the fan assembly 122 is located on the air inlet side of the fan 131, the lower surface of one end of the first guide plate 1361 has a plate body extending towards one side of the reflecting mirror 123, the extending plate body of the first guide plate 1361 and the upper end of the reflecting mirror 123 prevent the air flow from flowing out from the gap between the reflecting mirror 123 and the first guide plate 1361, the lower surface of the other end of the first guide plate 1361 has a plate body extending towards one side of the fly-eye lens 121, the extended plate body of the first guide plate 1361 is connected with the upper end of the fly-eye lens 121, the air flow is prevented from flowing out from the gap between the reflector 123 and the first guide plate 1361, a second guide plate 1362 is arranged between the lower end of the reflector 123 and the lower end of the fly-eye lens 121, the two ends of the second guide plate 1362 are respectively in eye contact with the reflector 123 and the fly-eye lens 121, the air flow is prevented from flowing out from the gap between the reflector 123 and the fly-eye lens 121 and the end of the second guide plate 1362, and the flow guide piece 136 is simple in structure, convenient to install and small in occupied space.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.
In the description of the present disclosure, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.
The foregoing detailed description has been provided for the optical projection engine and the projection device provided in the embodiments of the present disclosure, and specific examples are applied herein to explain the principles and embodiments of the present disclosure, and the above description of the embodiments is only used to help understand the method and the core idea of the present disclosure; meanwhile, for those skilled in the art, according to the idea of the present disclosure, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present description should not be construed as a limitation to the present disclosure.
Claims (12)
1. A projection light engine, comprising:
a housing having an accommodating space formed therein;
a plurality of optical elements configured in the accommodating space and positioned on the illumination light path;
and the heat dissipation assembly comprises a fan and at least one heat dissipation piece, the fan is arranged in the accommodating space and used for providing airflow which circulates in the accommodating space and passes through the optical element, and the heat dissipation piece is arranged on the shell and at least partially positioned on a flowing path of the airflow and positioned on the airflow inlet side of one or more optical elements.
2. The light engine of claim 1, wherein the heat sink comprises a thermal conduction device disposed on an inner surface of the housing.
3. The projection engine of claim 2, wherein the heat sink further comprises a heat sink device disposed on an outer surface of the housing, and the thermal conduction device and the heat sink device are respectively located on two sides of the same portion of the housing.
4. The light engine of claim 3, wherein the heat dissipation assembly further comprises a first semiconductor cooling plate disposed between the heat dissipation device and the housing; and/or the first semiconductor refrigeration sheet is arranged between the heat conducting device and the shell, and the first semiconductor refrigeration sheet is used for conducting heat of the heat conducting device to the heat radiating device.
5. The optical projection engine of claim 2, wherein the heat conducting device comprises a plurality of fins, and a heat dissipation channel is formed between adjacent fins, and the direction of the heat dissipation channel is parallel to the direction of the air flow.
6. The light engine of claim 1, wherein the plurality of optical elements comprise a fly-eye lens and a prism assembly sequentially disposed on the illumination light path, and the heat dissipation member is disposed on the airflow entering side of the fly-eye lens and/or the prism assembly.
7. The light engine of claim 6, wherein the plurality of optical elements further comprise a reflector in the illumination path, the light emitted from the fly-eye lens is reflected by the reflector to enter the prism assembly, and the prism assembly is located on the air inlet side of the fan.
8. The projection light machine according to claim 1, further comprising an imaging chip, wherein the imaging chip is located on an air inlet side of the fan, an imaging surface of the imaging chip is located on a flow path of the air flow, the imaging surface is parallel to a flow direction of the air flow, and one of the heat dissipation members is located on the air inlet side of the imaging chip.
9. The optical projection engine of claim 1, wherein the heat dissipation assembly further comprises a heat conductive layer, one side of the heat conductive layer is attached to the optical element, and the other side of the heat conductive layer is attached to the housing; and/or the optical element is connected with the shell through a fixing piece, one side of the heat conduction layer is attached to the optical element, and the other side of the heat conduction layer is attached to the fixing piece.
10. The optical projection engine of claim 1, wherein the heat dissipation assembly further comprises a flow guide member, a flow channel is formed between the flow guide member and the housing, and the air flow circulates in the flow channel.
11. The light engine of claim 1, further comprising a blower disposed outside the housing, the blower providing an airflow that acts on the outside of the housing.
12. A projection device comprising a lens assembly and the light engine of any of claims 1-11, the lens assembly disposed on a light exit side of an illumination path of the light engine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210239187.5A CN114563902B (en) | 2022-03-11 | 2022-03-11 | Projection optical machine and projection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210239187.5A CN114563902B (en) | 2022-03-11 | 2022-03-11 | Projection optical machine and projection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114563902A true CN114563902A (en) | 2022-05-31 |
| CN114563902B CN114563902B (en) | 2023-10-03 |
Family
ID=81717523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210239187.5A Active CN114563902B (en) | 2022-03-11 | 2022-03-11 | Projection optical machine and projection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114563902B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230102817A1 (en) * | 2021-09-29 | 2023-03-30 | Seiko Epson Corporation | Projector |
Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000228754A (en) * | 1999-02-05 | 2000-08-15 | Fujitsu General Ltd | Cooler for liquid crystal projector |
| JP2004341179A (en) * | 2003-05-15 | 2004-12-02 | Fuji Photo Optical Co Ltd | Image projection unit of liquid crystal projector |
| US20070247593A1 (en) * | 2006-04-21 | 2007-10-25 | Coretronic Corporation | Projector and heat dissipating device thereof |
| CN201007777Y (en) * | 2007-02-05 | 2008-01-16 | 胡先君 | Projector optical system radiating device |
| CN101111139A (en) * | 2006-07-21 | 2008-01-23 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101285996A (en) * | 2007-04-12 | 2008-10-15 | 中强光电股份有限公司 | Projection device and lamp source module |
| US20090207382A1 (en) * | 2008-02-20 | 2009-08-20 | Qisda Corporation | Projecting System |
| JP2010128030A (en) * | 2008-11-26 | 2010-06-10 | Hitachi Ltd | Projection image display device |
| TW201044097A (en) * | 2009-06-04 | 2010-12-16 | Delta Electronics Inc | Projection apparatus and cooling device thereof |
| JP2011099991A (en) * | 2009-11-06 | 2011-05-19 | Nippon Avionics Co Ltd | Projection type display device |
| US20130120716A1 (en) * | 2011-11-11 | 2013-05-16 | Hon Hai Precision Industr Co., Ltd. | Heat dissipation device of light engine |
| CN103115409A (en) * | 2013-03-06 | 2013-05-22 | 海南瑞尔电子科技有限公司 | Efficient electronic dehumidifier |
| CN103135326A (en) * | 2011-11-23 | 2013-06-05 | 鸿富锦精密工业（深圳）有限公司 | Cooling device for optical machine of projector |
| CN104049443A (en) * | 2014-07-11 | 2014-09-17 | 苏州佳世达光电有限公司 | Projector |
| CN110750025A (en) * | 2019-09-25 | 2020-02-04 | 深圳市火乐科技发展有限公司 | Heat dissipation device and projection equipment |
| CN110750027A (en) * | 2019-09-29 | 2020-02-04 | 深圳市火乐科技发展有限公司 | Projector with a light source |
| CN211348977U (en) * | 2020-02-07 | 2020-08-25 | 中强光电股份有限公司 | Optical machine module and projector |
| JP2021021783A (en) * | 2019-07-25 | 2021-02-18 | キヤノン株式会社 | Optical housing, and projection type display device including the same |
| CN112764303A (en) * | 2021-01-18 | 2021-05-07 | 深圳瑞视达科技有限公司 | Liquid crystal screen heat radiation structure of projection optical machine |
| CN213545026U (en) * | 2020-12-14 | 2021-06-25 | 深圳市科金明电子股份有限公司 | Heat abstractor and projecting apparatus of projecting apparatus |
| WO2021218739A1 (en) * | 2020-04-30 | 2021-11-04 | 青岛海信激光显示股份有限公司 | Optical engine and laser projection device |
| CN113727082A (en) * | 2021-08-20 | 2021-11-30 | 深圳亮仔光电科技有限公司 | Active intelligent heat dissipation device and projector sealing machine |
-
2022
- 2022-03-11 CN CN202210239187.5A patent/CN114563902B/en active Active
Patent Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000228754A (en) * | 1999-02-05 | 2000-08-15 | Fujitsu General Ltd | Cooler for liquid crystal projector |
| JP2004341179A (en) * | 2003-05-15 | 2004-12-02 | Fuji Photo Optical Co Ltd | Image projection unit of liquid crystal projector |
| US20070247593A1 (en) * | 2006-04-21 | 2007-10-25 | Coretronic Corporation | Projector and heat dissipating device thereof |
| CN101111139A (en) * | 2006-07-21 | 2008-01-23 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN201007777Y (en) * | 2007-02-05 | 2008-01-16 | 胡先君 | Projector optical system radiating device |
| CN101285996A (en) * | 2007-04-12 | 2008-10-15 | 中强光电股份有限公司 | Projection device and lamp source module |
| US20090207382A1 (en) * | 2008-02-20 | 2009-08-20 | Qisda Corporation | Projecting System |
| JP2010128030A (en) * | 2008-11-26 | 2010-06-10 | Hitachi Ltd | Projection image display device |
| TW201044097A (en) * | 2009-06-04 | 2010-12-16 | Delta Electronics Inc | Projection apparatus and cooling device thereof |
| JP2011099991A (en) * | 2009-11-06 | 2011-05-19 | Nippon Avionics Co Ltd | Projection type display device |
| US20130120716A1 (en) * | 2011-11-11 | 2013-05-16 | Hon Hai Precision Industr Co., Ltd. | Heat dissipation device of light engine |
| CN103135326A (en) * | 2011-11-23 | 2013-06-05 | 鸿富锦精密工业（深圳）有限公司 | Cooling device for optical machine of projector |
| CN103115409A (en) * | 2013-03-06 | 2013-05-22 | 海南瑞尔电子科技有限公司 | Efficient electronic dehumidifier |
| CN104049443A (en) * | 2014-07-11 | 2014-09-17 | 苏州佳世达光电有限公司 | Projector |
| JP2021021783A (en) * | 2019-07-25 | 2021-02-18 | キヤノン株式会社 | Optical housing, and projection type display device including the same |
| CN110750025A (en) * | 2019-09-25 | 2020-02-04 | 深圳市火乐科技发展有限公司 | Heat dissipation device and projection equipment |
| CN110750027A (en) * | 2019-09-29 | 2020-02-04 | 深圳市火乐科技发展有限公司 | Projector with a light source |
| CN211348977U (en) * | 2020-02-07 | 2020-08-25 | 中强光电股份有限公司 | Optical machine module and projector |
| WO2021218739A1 (en) * | 2020-04-30 | 2021-11-04 | 青岛海信激光显示股份有限公司 | Optical engine and laser projection device |
| CN213545026U (en) * | 2020-12-14 | 2021-06-25 | 深圳市科金明电子股份有限公司 | Heat abstractor and projecting apparatus of projecting apparatus |
| CN112764303A (en) * | 2021-01-18 | 2021-05-07 | 深圳瑞视达科技有限公司 | Liquid crystal screen heat radiation structure of projection optical machine |
| CN113727082A (en) * | 2021-08-20 | 2021-11-30 | 深圳亮仔光电科技有限公司 | Active intelligent heat dissipation device and projector sealing machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230102817A1 (en) * | 2021-09-29 | 2023-03-30 | Seiko Epson Corporation | Projector |
| US11841611B2 (en) * | 2021-09-29 | 2023-12-12 | Seiko Epson Corporation | Projector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114563902B (en) | 2023-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4227969B2 (en) | Projection display | |
| JP7301680B2 (en) | Heat dissipation module and projection device | |
| US20110025986A1 (en) | Projector and lens thereof | |
| JP2012181386A (en) | Reflection type optical element cooling device and reflection type optical element unit | |
| CN114563902B (en) | Projection optical machine and projection equipment | |
| JP2003057754A (en) | Cooler and projector provided with it | |
| JPH04125538A (en) | Cooling device for polarizing plate and liquid crystal panel | |
| TW201319720A (en) | Heat dissipation device of porjector optical mechanical | |
| CN103135326A (en) | Cooling device for optical machine of projector | |
| CN101907820A (en) | DMD (Digital Mirror Device) heat-radiation structure and projector applied same | |
| CN112782916A (en) | Totally-enclosed optical machine with vertical heat dissipation and projector thereof | |
| CN111856855B (en) | Optical machine module and projector | |
| CN212623547U (en) | Lighting imaging device of laser projector | |
| CN212276202U (en) | Projector | |
| JP4860663B2 (en) | Liquid crystal unit cooling method | |
| CN219872093U (en) | Laser projection device and laser projection system | |
| CN114594647B (en) | Projection ray apparatus and projection equipment | |
| CN219590658U (en) | Projector optical machine device | |
| CN217787584U (en) | Projection optical machine and projection equipment | |
| CN110967897A (en) | Projection type display device | |
| CN217443724U (en) | Projection optical machine and projection equipment | |
| CN220305614U (en) | Closed ray apparatus convenient to heat dissipation | |
| US20240012317A1 (en) | Projection device and heat dissipation module thereof | |
| CN219758647U (en) | Projection optical machine | |
| CN117784503A (en) | Projection apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |