CN101111139A - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
- Publication number
- CN101111139A CN101111139A CNA2006100617435A CN200610061743A CN101111139A CN 101111139 A CN101111139 A CN 101111139A CN A2006100617435 A CNA2006100617435 A CN A2006100617435A CN 200610061743 A CN200610061743 A CN 200610061743A CN 101111139 A CN101111139 A CN 101111139A
- Authority
- CN
- China
- Prior art keywords
- radiator
- heat abstractor
- fixed
- heat
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a heat eliminating device used for the heat elimination of the electronic elements, which comprises a radiator, a fan and a guide element, wherein a plurality of air flow channels are arranged on the radiator, the fan is positioned at one port of the air flow channel of the radiator, to provide strong convective current air flow, the guide element is positioned at the other port of the air flow channel of the radiator, to guide the heat elimination for other electronic elements through the air flow of the radiator, a card slot is arranged at the port of the radiator, and the guide element is provided with a locating piece for inserting a card into the card slot. The guide element guides the air flow to make the heat elimination for other electronic elements, to make use of the strong convective current air flow provided by the fan, thus meeting the requirements of heat elimination under the condition of electronic system miniaturization and strong function tendency.
Description
Technical field
The present invention relates to a kind of heat abstractor, relate in particular to a kind of heat abstractor that is used for electronic element radiating.
Background technology
Electronic component such as central processing unit etc. produce a large amount of heat in running, for guaranteeing the normal operation of electronic component, the heat of its generation need distribute in time.Usually, install a heat abstractor on this electronic component additional and think its heat radiation.
Heat abstractor commonly used comprises a metal base plate and the some radiating fins that extend from this base plate.This base plate adheres on heat-generating electronic elements and absorbs the heat that this electronic component produces, and then heat transferred is dispersed into surrounding space to fin.Yet development along with electronic industry, the running frequency and the function of electronic component promote day by day, its caloric value also increases thereupon, for satisfying the radiating requirements of this electronic component, above-mentioned heat abstractor installs a fan usually additional and provides the strong convection air-flow to above-mentioned fin, thereby improves the heat-sinking capability of this heat abstractor.Yet, need the electronic component of heat radiation more and more in the computer system, and its volume is also more and more littler, so above-mentioned heat abstractor needs further to improve to satisfy the radiating requirements of above-mentioned electronic component.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor of perfect heat-dissipating in fact.
A kind of heat abstractor, be used for electronic element radiating, it comprises a radiator, this radiator is provided with some gas channels, one fan is positioned at a port of this radiator gas channel to provide the strong convection air-flow to this radiator, one conducting element is positioned at this radiator gas channel another port, and to sentence the air-flow of guiding by this radiator be other electronic element radiatings, and this radiator is provided with a draw-in groove in this port one side, and this conducting element is formed with an inlay card and goes into the interior spacer of this draw-in groove.
Compared with prior art, above-mentioned conducting element is fixed to an end of radiator gas channel, and will be its heat radiation to other electronic components by the part air-flow guiding of fins group, the strong convection air-flow that said fans is provided is fully utilized, and satisfies the radiating requirements under electronic system miniaturization, the powerful trend.
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the stereogram of a fins group in the heat abstractor of the present invention.
Fig. 3 is the assembly drawing of Fig. 1.
Fig. 4 is Fig. 3 phantom.
Embodiment
See also Fig. 1, heat abstractor of the present invention is used to be opposite to electronic component (figure does not show) heat radiation on the circuit board (figure does not show).This heat abstractor comprises that a radiator 10, a fan 60, one are fixed to fan fixing member (indicating), and the conducting element 70 of being located at these radiator 10 1 sides of this radiator 10 with this fan 60.
Please consult Fig. 2 to Fig. 4 simultaneously, above-mentioned radiator 10 comprises a base plate 110 and the fins group 130 that places on this base plate 110.The upper surface of this base plate 110 have a higher part (indicate) and be positioned at these higher part three sides one than lower part (sign).This fins group 130 places the higher part office of this base plate 110.The top of this fins group 130 is combined with a top board 170.This fins group 130 comprises some fins, forms gas channel (not indicating) between the adjacent fin.Each fin comprises a body 131 and from this body last lower hem 133 of extending of edge-perpendicular up and down, the last lower hem 133 of these some fins forms the faying face of binding base plate 110 and top board 170 respectively.One side of each fin is provided with a wedge-formed incision (not indicating), and the otch of these some fins forms the wedge shape draw-in groove 135 in conjunction with above-mentioned conducting element 70.Two heat pipes 150 that roughly are " U " shape connect this base plate 110 and this top board 170.Each heat pipe 150 comprise one first heat transfer segment 151, one with second heat transfer segment 153 and the linkage section 155 that is connected this first heat transfer segment 151 and second heat transfer segment 153 of these first heat transfer segment, 151 almost parallels.This linkage section 155 is approximately perpendicular to this first and second heat transfer segment 151,153.The junction of this first and second heat transfer segment 151,153 and linkage section 155 roughly is fillet.The higher part of this base plate 110 is arranged with two parallel grooves 111, and this base plate 110 is provided with corresponding two breach 113 in the two ends of this two groove 111.First heat transfer segment 151 of this two heat pipe 150 is bonded in two grooves 111 of this base plate 110.This top board 170 is provided with two parallel grooves 171 separately.Second heat transfer segment 153 of this two heat pipe 150 is bonded in two grooves 171 of this top board 170.Two linkage sections 155 of this two heat pipe 150 are positioned at a side of this fins group 130.This fins group is respectively equipped with two grooves 134 in the junction of corresponding these heat pipe 150 first and second heat transfer segment 151,153 of ora terminalis and linkage section 155 about in the of 130.
Fan fixing member comprises pair of brackets 50.Each support 50 comprises that a panel 510 reaches from the vertically extending location-plate 530 of this panel 510 one side edge.Another opposite edges of this panel 510 roughly are " C " shape.The upper and lower end parts of this panel 510 is respectively equipped with a fixing hole 511, with fan attachment 60.Outside vertical extent one stator 513 of the following ora terminalis of this panel 510, this stator 513 are provided with a perforate (not indicating) and for a screw (figure does not show) this support 50 are fixed on the base plate 110.The upper end of this location-plate 530 is provided with a through hole (not indicating) and for a screw 533 this support 50 is fixed on the top board 170 of radiator 10.This two support 50 is fixed to two corners of radiator 10 respectively, and wherein, this location-plate 530 is positioned at the outside of above-mentioned fins group 130 outermost fins, the gas channel of these panel 510 corresponding above-mentioned fins group 130 and be fixed in a side of fins group 130.Two panels 510 of this two support 50 are relative, form the port (not indicating) of corresponding gas channel therebetween, and 60 pairs in this fan should be fixed on this two panel 510 by screw (not indicating) by port.
Above-mentioned conducting element 70 is fixed in an other side of above-mentioned fins group 130 with respect to said fans 60.This conducting element 70 comprises that a baffler 730 reaches the upwardly extending a pair of fixed arm 710 of top edge two ends difference from this baffler 730, and wherein this baffler 730 is inclined to set with respect to this fixed arm 710.The top edge middle part of this baffler 730 extends upward a spacer 731 between said fixing arm 710.The upper end of each fixed arm 710 is provided with a perforation 711, this conducting element 70 is fixed to the top board 170 of above-mentioned radiator 10 by a screw 80.
See also Fig. 3 and Fig. 4, two fixed arms 710 of above-mentioned conducting element 70 are fixed to the relative both sides of above-mentioned fins group 130, the spacer 731 of this baffler 730 is embedded in the draw-in groove 135 of this fins group 130, thus the gas channel that 730 pairs of this bafflers should fins group 130 and be fixed in this fins group one side under oblique.
During use, the base plate 110 applying heat-generating electronic elements of above-mentioned radiator 10 and absorb the heat that this electronic component produces, the part heat on this base plate 110 directly is passed to fins group 130, and the part heat is passed to top board 170 and fins group 130 by heat pipe 150.60 pairs in fan should fins group 130 gas channel provide the strong convection air-flow to this fins group 130, directly be distributed to surrounding space by the part air-flow behind the gas channel, and the part air-flow of corresponding above-mentioned conducting element 70 bafflers 730 around under the guiding of baffler 730, blowing to other electronic components and be its heat radiation.
Compared with prior art, above-mentioned baffler 730 will be its heat radiation to other electronic components by the part air-flow guiding of fins group 130, the strong convection air-flow that said fans 60 is provided is fully utilized, and satisfies the radiating requirements under electronic system miniaturization, the powerful trend.
Claims (10)
1. heat abstractor, be used for electronic element radiating, it comprises a radiator, this radiator is provided with some gas channels, one fan is positioned at a port of this radiator gas channel to provide the strong convection air-flow to this radiator, it is characterized in that: comprise that also the air-flow that a conducting element that is positioned at above-mentioned radiator gas channel another port passes through this radiator with guiding is other electronic element radiatings, this radiator is provided with a draw-in groove in this port one side, and this conducting element is formed with an inlay card and goes into the interior spacer of this draw-in groove.
2. heat abstractor as claimed in claim 1 is characterized in that: described conducting element comprises a baffler and two fixed arms that extend from these baffler two ora terminalis, and this two fixed arm is fixed to the relative both sides of this radiator.
3. heat abstractor as claimed in claim 2 is characterized in that: described spacer is formed by further extension of described baffler between described two fixed arms.
4. heat abstractor as claimed in claim 3 is characterized in that: described baffler and described radiator bevel extend.
5. as each described heat abstractor among the claim 1-4, it is characterized in that: described radiator comprises some fins, form described gas channel between adjacent fin, a lateral edges place of each fin is provided with a kerf, and the otch of these some fins forms the draw-in groove of the described spacer of inlay card.
6. heat abstractor as claimed in claim 5 is characterized in that: the otch of described fin is wedge shape.
7. heat abstractor as claimed in claim 5 is characterized in that: described radiator comprises that one is bonded to the base plate and the top board that is bonded to this fin top of described fin bottom.
8. heat abstractor as claimed in claim 7 is characterized in that: described radiator comprises at least one heat pipe that connects described base plate and described top board.
9. as each described heat abstractor among the claim 1-4, it is characterized in that: described fan is fixed to a side of described radiator by two supports, this two support comprises two relative surfaces plate that is positioned at this radiator one side and two location-plates that are positioned at the in addition relative both sides of this radiator that extend from this panel, and this fan is fixed to this two panel.
10. heat abstractor as claimed in claim 9 is characterized in that: the further extension one of described panel is fixed to the stator of described radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100617435A CN100534282C (en) | 2006-07-21 | 2006-07-21 | Heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100617435A CN100534282C (en) | 2006-07-21 | 2006-07-21 | Heat radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101111139A true CN101111139A (en) | 2008-01-23 |
| CN100534282C CN100534282C (en) | 2009-08-26 |
Family
ID=39042976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100617435A Expired - Fee Related CN100534282C (en) | 2006-07-21 | 2006-07-21 | Heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100534282C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102688055A (en) * | 2011-03-23 | 2012-09-26 | Ge医疗***环球技术有限公司 | Data acquisition system and CT (Computed Tomography) equipment using same |
| CN106558562A (en) * | 2016-11-21 | 2017-04-05 | 武汉精立电子技术有限公司 | A kind of high power load metal-oxide-semiconductor heat abstractor |
| CN106923857A (en) * | 2017-04-27 | 2017-07-07 | 上海联影医疗科技有限公司 | The detector module and detection instrument of detection instrument |
| CN109668346A (en) * | 2017-12-28 | 2019-04-23 | 杭州大和热磁电子有限公司 | A kind of novel semi-conductor refrigeration radiating module |
| CN110531836A (en) * | 2018-05-24 | 2019-12-03 | 技嘉科技股份有限公司 | Radiator for radiating to pyrotoxin |
| CN114563902A (en) * | 2022-03-11 | 2022-05-31 | 深圳市火乐科技发展有限公司 | Projection optical machine and projection equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2490700Y (en) * | 2001-07-17 | 2002-05-08 | 富准精密工业(深圳)有限公司 | Cooling device |
| CN2524273Y (en) * | 2001-07-17 | 2002-12-04 | 富骅企业股份有限公司 | CPU radiator |
| US6967845B2 (en) * | 2003-11-05 | 2005-11-22 | Cpumate Inc. | Integrated heat dissipating device with curved fins |
| CN2752958Y (en) * | 2004-09-03 | 2006-01-18 | 东莞莫仕连接器有限公司 | Heat radiator with flow guide structure |
| CN2770091Y (en) * | 2004-12-24 | 2006-04-05 | 富准精密工业(深圳)有限公司 | Radiator |
-
2006
- 2006-07-21 CN CNB2006100617435A patent/CN100534282C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102688055A (en) * | 2011-03-23 | 2012-09-26 | Ge医疗***环球技术有限公司 | Data acquisition system and CT (Computed Tomography) equipment using same |
| CN106558562A (en) * | 2016-11-21 | 2017-04-05 | 武汉精立电子技术有限公司 | A kind of high power load metal-oxide-semiconductor heat abstractor |
| CN106923857A (en) * | 2017-04-27 | 2017-07-07 | 上海联影医疗科技有限公司 | The detector module and detection instrument of detection instrument |
| CN109668346A (en) * | 2017-12-28 | 2019-04-23 | 杭州大和热磁电子有限公司 | A kind of novel semi-conductor refrigeration radiating module |
| CN110531836A (en) * | 2018-05-24 | 2019-12-03 | 技嘉科技股份有限公司 | Radiator for radiating to pyrotoxin |
| CN114563902A (en) * | 2022-03-11 | 2022-05-31 | 深圳市火乐科技发展有限公司 | Projection optical machine and projection equipment |
| CN114563902B (en) * | 2022-03-11 | 2023-10-03 | 深圳市火乐科技发展有限公司 | Projection optical machine and projection equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100534282C (en) | 2009-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101610657B (en) | Heat radiating device | |
| US7675752B2 (en) | Electronic apparatus | |
| CN201084085Y (en) | Fan installation apparatus | |
| US7369412B2 (en) | Heat dissipation device | |
| CN100534282C (en) | Heat radiating device | |
| US7212404B2 (en) | Integrated heat sink device | |
| CN201138463Y (en) | Computer system with wind-guiding cowl | |
| CN101959390B (en) | Combined wind scooper | |
| US8787021B2 (en) | Memory cooler | |
| US20110051358A1 (en) | Removable airflow guide assembly for a computer system | |
| CN101146424A (en) | Heat radiator | |
| CN201438286U (en) | Foolproof device of heat radiation system | |
| CN101193542A (en) | Heat radiation device and wind guide sheet | |
| CN201230438Y (en) | Combination of heat radiating device | |
| CN102045989A (en) | Heat pipe radiating module | |
| US20160360641A1 (en) | Electronic device | |
| CN102378550A (en) | Radiating device | |
| CN1979378A (en) | Radiating apparatus | |
| CN105792599A (en) | Radiating apparatus | |
| CN102316700A (en) | Air guiding cover suitable for simultaneously dissipating heat of a plurality of electronic components and electronic device having air guiding cover | |
| US6198629B1 (en) | Circuit board and computer system for enhanced cooling | |
| CN100482059C (en) | Heat radiator | |
| US6614657B2 (en) | Heat sink for cooling an electronic component of a computer | |
| CN101115368A (en) | Heat radiating device | |
| CN102789289A (en) | Computer radiating system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090826 Termination date: 20140721 |
|
| EXPY | Termination of patent right or utility model |