CN114551312A - Integrated automation line of piece about vertical CVD of volume production type - Google Patents

Integrated automation line of piece about vertical CVD of volume production type Download PDF

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Publication number
CN114551312A
CN114551312A CN202210157306.2A CN202210157306A CN114551312A CN 114551312 A CN114551312 A CN 114551312A CN 202210157306 A CN202210157306 A CN 202210157306A CN 114551312 A CN114551312 A CN 114551312A
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CN
China
Prior art keywords
feeding
automatic
blanking
support plate
silicon wafer
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Pending
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CN202210157306.2A
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Chinese (zh)
Inventor
刘翠翠
王祥远
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Jiangxi Hankefan Semiconductor Technology Co ltd
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Jiangxi Hankefan Semiconductor Technology Co ltd
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Priority to CN202210157306.2A priority Critical patent/CN114551312A/en
Publication of CN114551312A publication Critical patent/CN114551312A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a mass production type vertical CVD upper and lower piece integrated automatic production line, which comprises: the automatic feeding area, the automatic feeding and conveying rotary area, the automatic feeding rotary area, the automatic discharging rotary area and the automatic discharging rotary area are arranged on one side of the automatic feeding and conveying rotary area, and the automatic discharging rotary area, the automatic discharging rotary area and the automatic discharging rotary area are arranged on one side of the automatic feeding and conveying rotary area. According to the invention, the production line is divided into different areas, so that the messy production site planning is neat and beautiful, and the space occupied by the production line can be saved; the production efficiency is greatly improved, the labor intensity is reduced, and the labor input is reduced; the whole production line is reasonable in layout.

Description

Integrated automation line of piece about vertical CVD of volume production type
Technical Field
The invention relates to the technical field of silicon wafers, in particular to a mass production type vertical CVD upper and lower wafer integrated automatic production line.
Background
The monocrystalline silicon heterojunction solar cell has high conversion efficiency, and is recognized as one of the key technologies of the next-generation large-scale industrialization by the photovoltaic industry. One of the core apparatuses of amorphous silicon-coated thin film CVD apparatuses for producing heterojunction silicon wafers is a vertical HWCVD (hot wire chemical vapor deposition) apparatus. Most of the existing silicon wafer production processes adopt a man-machine semi-automatic processing or full-manual production mode, the production line layout is disordered, product logistics lines are complex and not simple enough, the efficiency is low, and the defects exist.
Disclosure of Invention
The present invention is directed to solve the above problems and to provide a mass production vertical CVD upper and lower wafer integrated automatic production line.
The technical scheme of the invention is as follows: a mass production type vertical CVD upper and lower piece integrated automatic production line comprises:
the automatic feeding and conveying system comprises a silicon wafer automatic feeding area, a small support plate automatic feeding and conveying rotary area, a large support plate automatic feeding rotary area, a large support plate automatic discharging and conveying rotary area, a small support plate automatic discharging and conveying rotary area and a silicon wafer automatic discharging area, wherein the small support plate automatic feeding and conveying rotary area and the small support plate automatic discharging and conveying rotary area are arranged side by side, the silicon wafer automatic feeding area, the large support plate automatic feeding area and the large support plate automatic conveying rotary area are arranged on one side of the small support plate automatic feeding and conveying rotary area, and the large support plate automatic discharging area, the large support plate automatic discharging rotary area and the silicon wafer automatic discharging area are arranged on one side of the small support plate automatic discharging and conveying rotary area.
Preferably, the automatic silicon wafer feeding area is provided with a basket feeding conveyor, a wafer placing machine, a silicon wafer feeding conveyor, a silicon wafer feeding gripper and a silicon wafer feeding robot, the wafer placing machine is arranged on one side of the basket feeding conveyor, the silicon wafer feeding conveyor is arranged on one side of the wafer placing machine, the silicon wafer feeding gripper is arranged on the silicon wafer feeding robot, and the silicon wafer feeding conveyor is arranged on one side of the silicon wafer feeding robot.
Preferably, the automatic feeding and conveying rotary area of the small support plate is provided with a plurality of small feeding support plates, a plurality of small support plate feeding conveyors and two small support plate feeding elevators, the plurality of small feeding support plates are placed on the small support plate feeding conveyors, and the small support plate feeding elevators are in butt joint with the small support plate feeding conveyors.
Preferably, the large-support-plate automatic feeding area is provided with a large-support-plate feeding gripper, a large-support-plate feeding robot and a plurality of transfer tables, the large-support-plate feeding gripper is arranged on the large-support-plate feeding robot, and the plurality of transfer tables are arranged between the small-support-plate automatic feeding conveying rotary area and the small-support-plate automatic discharging conveying rotary area.
Preferably, the large-carrier-plate automatic feeding rotary area is provided with a plurality of large feeding carrier plates, two feeding conveying frames, an I/N-side feeding conveying rotary table and an I/N-side blanking conveying rotary table, the plurality of large feeding carrier plates are arranged on the feeding conveying frames, and the feeding conveying frames are in butt joint with the I/N-side feeding conveying rotary table and the I/N-side blanking conveying rotary table.
Preferably, the large-support-plate automatic blanking area is provided with a large-support-plate blanking gripper and a large-support-plate blanking robot, and the large-support-plate blanking gripper is arranged on the large-support-plate blanking robot.
Preferably, the automatic blanking rotary area of the large support plate is provided with a plurality of blanking large support plates, two blanking conveying frames, an I/P side feeding conveying rotary table and an I/P side blanking conveying rotary table, the plurality of blanking large support plates are arranged on the blanking conveying frames, and the blanking conveying frames are in butt joint with the I/P side feeding conveying rotary table and the I/P side blanking conveying rotary table.
Preferably, the automatic blanking conveying rotary area of the small support plate is provided with a plurality of blanking small support plates, a plurality of blanking conveyors of the small support plates and two blanking elevators of the small support plates, the blanking small support plates are arranged on the blanking conveyors of the small support plates, and the blanking elevators of the small support plates are in butt joint with the blanking conveyors of the small support plates.
Preferably, the automatic silicon wafer blanking area is provided with a silicon wafer blanking robot, a silicon wafer blanking gripper, a silicon wafer blanking conveyor, a wafer inserting machine and a basket blanking conveyor, the silicon wafer blanking gripper is arranged on the silicon wafer blanking robot, the silicon wafer blanking robot is arranged on one side of the silicon wafer blanking conveyor, the wafer inserting machine is arranged on one side of the silicon wafer blanking conveyor, and the basket blanking conveyor is arranged on one side of the wafer inserting machine.
The invention has the beneficial effects that: according to the invention, the production line is divided into different areas, so that the messy production site planning is neat and beautiful, and the space occupied by the production line can be saved; through the combination of the automatic device, only equipment needs to be added when the productivity is increased, and the automatic device can be adapted to the requirements of carrier plates with various sizes and the productivity, thereby undoubtedly and greatly improving the production efficiency, reducing the labor intensity and reducing the labor investment; the whole production line is reasonable in layout, each region is independent and butted with each other, the performance is high, the fault rate is low, the maintenance time and the maintenance difficulty can be greatly reduced, and the economical and practical performance is high.
Drawings
FIG. 1 is a schematic layout of the present invention;
FIG. 2 is a perspective view of a small carrier loading conveyor in a preferred embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2 at X;
FIG. 4 is a top view of the conveyor mechanism in a preferred embodiment of the invention;
FIG. 5 is an enlarged view of a portion of FIG. 4 at Y;
FIG. 6 is a perspective view of a small carrier loading elevator in the preferred embodiment of the present invention;
FIG. 7 is a front view of a portion of the elevating conveyor mechanism in the preferred embodiment of the present invention;
fig. 8 is a top view of a part of the structure of the lifting conveying mechanism in the preferred embodiment of the invention.
Fig. 9 is a schematic view of a small carrier plate in a preferred embodiment of the present invention.
Reference numerals: a silicon wafer automatic feeding area A, a basket feeding conveyor 1, a sheet placing machine 2, a silicon wafer feeding conveyor 3, a silicon wafer feeding gripper 4, a silicon wafer feeding robot 5, a small carrier plate automatic feeding and conveying rotary area B, a small feeding carrier plate 6, a small carrier plate feeding conveyor 7, a first section frame 701, a first driving device 702, a first conveying belt 703, a first roller 704, a first baffle 705, a small carrier plate feeding lifter 8, a second section frame 81, a second driving device 82, a second conveying belt 83, a second roller 84, a third driving device 85, a second baffle 86, a supporting frame 87, a large carrier plate automatic feeding area C, a large carrier plate feeding gripper 9, a large carrier plate feeding robot 10, a transfer table 11, a large automatic feeding and conveying rotary area D, a large feeding carrier plate 12, a feeding conveyor frame 3, an I/N side feeding and conveying rotary table 14, an I/N side conveying rotary table 15, The automatic blanking system comprises a large support plate automatic blanking area E, a large support plate blanking gripper 16, a large support plate blanking robot 17, a large support plate automatic blanking rotary area F, a blanking large support plate 18, a blanking conveying frame 19, an I/P side feeding conveying rotary table 20, an I/P side blanking conveying rotary table 21, a small support plate automatic blanking conveying rotary area G, a blanking small support plate 22, a small support plate blanking conveyor 23, a small support plate blanking lifter 24, a silicon wafer automatic blanking area H, a silicon wafer blanking robot 25, a silicon wafer blanking gripper 26, a silicon wafer blanking conveyor 27, a wafer inserting machine 28 and a basket blanking conveyor 29.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 9, a mass production vertical CVD upper and lower wafer integrated automatic production line includes:
the automatic silicon wafer feeding and conveying system comprises a silicon wafer automatic feeding area A, a small support plate automatic feeding and conveying rotary area B, a large support plate automatic feeding area C, a large support plate automatic feeding rotary area D, a large support plate automatic blanking area E, a large support plate automatic blanking rotary area F, a small support plate automatic blanking conveying rotary area G and a silicon wafer automatic blanking area H, wherein the small support plate automatic feeding and conveying rotary area B and the small support plate automatic blanking conveying rotary area G are arranged side by side, the silicon wafer automatic feeding area A, the large support plate automatic feeding area C and the large support plate automatic conveying rotary area D are arranged on one side of the small support plate automatic feeding and conveying rotary area B, and the large support plate automatic blanking area E, the large support plate automatic blanking rotary area F and the silicon wafer automatic blanking area H are arranged on one side of the small support plate automatic blanking conveying rotary area G.
As a preferred embodiment of the present invention, it may also have the following additional technical features:
in the embodiment, the automatic silicon wafer feeding area A is provided with a basket feeding conveyor 1 and a wafer placing machine 2, the automatic conveying device comprises a silicon wafer feeding conveyor 3, a silicon wafer feeding gripper 4 and a silicon wafer feeding robot 5, wherein the silicon wafer feeding conveyor 2 is arranged on one side of a basket loading conveyor 1, the silicon wafer feeding conveyor 3 is arranged on one side of the silicon wafer feeding conveyor 2, the silicon wafer feeding gripper 4 is arranged on the silicon wafer feeding robot 5, the silicon wafer feeding conveyor 3 is arranged on one side of the silicon wafer feeding robot 5, an AGV trolley of the previous process transports a basket to the basket loading conveyor 1, the basket loading conveyor 1 conveys the basket to the silicon wafer feeding conveyor 2, the silicon wafer feeding conveyor 2 puts the silicon wafer to the silicon wafer feeding conveyor 3, the silicon wafer feeding conveyor 3 conveys the silicon wafer to a silicon wafer feeding gripper 4 gripping position, and the silicon wafer feeding robot 5 drives the silicon wafer feeding gripper 4 to convey the silicon wafer to a small loading plate 6 through gripping.
In this embodiment, the small carrier automatic feeding and conveying rotary area B is provided with a plurality of small feeding carriers 6, a plurality of small carrier feeding conveyors 7 and two small carrier feeding elevators 8, the plurality of small feeding carriers 6 are placed on the small carrier feeding conveyors 7, the small carrier feeding elevators 8 are in butt joint with the small carrier feeding conveyors 7, the small feeding carriers 6 are conveyed to the gripping positions of the large carrier feeding grippers 9 by the small carrier feeding conveyors 7, the small feeding carriers 6 after the silicon wafers are gripped are conveyed back to the taking and placing positions of the silicon wafer feeding grippers 4 by the plurality of small carrier feeding conveyors 7 and the two feeding elevating conveyors 8, the small carrier feeding conveyors 7 are used for conveying the small feeding carriers 6 and can simultaneously convey the upper and lower carriers in different directions, the small feeding conveyors 7 comprise first section frames 701 and two first conveying structures, the two first conveying mechanisms are arranged up and down on the first section frames 701, the conveying mechanism comprises a first driving device 702, a plurality of first conveying belts 703, a plurality of first rollers 704 and two first baffles 705, the first driving device 702 and the two first baffles 705 are arranged on the first profile rack 701, the first rollers 704 are rotatably arranged on the first profile rack 701, and the first conveying belts 703 are connected with the two first rollers 704 or the first rollers 704 and the first driving device 702. Specifically, the first driving device 702 is a servo motor, the first driving device 702 operates to drive the first conveyor belt 703, the first conveyor belt 703 drives the first roller 704 to rotate, and further drives the carrier plate to move, and the first baffle 705 prevents the carrier plate from falling off from the first roller 704; the small carrier plate feeding lifter 8 is used for receiving the small carrier plate 6 fed by the small carrier plate feeding conveyor 7 and conveying the small carrier plate 6 to the small carrier plate feeding conveyor 7 in a reverse direction, the small carrier plate feeding lifter 8 comprises a second profile frame 81, a second driving device 82 and a second conveying mechanism, the second driving device 82 is used for driving the second conveying mechanism to move on the second profile frame 81, the second conveying mechanism comprises a plurality of second conveying belts 83, a plurality of second rollers 84, a third driving device 85, two second baffle plates 86 and a supporting frame 87, the third driving device 85 and the two second baffle plates 86 are arranged on the supporting frame 87, the second rollers 84 are rotatably arranged on the supporting frame 87, and the second conveying belts 83 are connected with the two second rollers 84 or the second rollers 84 and the third driving device 85. Specifically, the second driving device 82 includes an air cylinder 821, a connecting plate 822 and a plurality of guide rails 823, the guide rails 823 are disposed on the second profile frame 81, the connecting plate 822 is connected with the supporting frame 87 and the air cylinder 821, a protruding portion on a side of the supporting frame 87 is connected with the guide rails 823 in a sliding manner, the air cylinder 821 works to drive the connecting plate 822 to move up and down, and further drive the supporting frame 87 to move up and down, so that the carrier plate moves from top to bottom or moves from bottom to top and is conveyed onto the first roller 704, the third driving device 85 is a servo motor, and the third driving device 85 works to drive the second conveyor belt 83 to rotate, and further drive the second roller 84 to rotate; the small loading carrier plate 6 and the small unloading carrier plate 22 have the same structure,
in this embodiment, the large-support-plate automatic feeding area C is provided with a large-support-plate feeding gripper 9, a large-support-plate feeding robot 10 and a plurality of transfer tables 11, the large-support-plate feeding gripper 9 is arranged on the large-support-plate feeding robot 10, the plurality of transfer tables 11 are arranged between the small-support-plate automatic feeding and conveying rotary area B and the small-support-plate automatic discharging and conveying rotary area G, the large-support-plate feeding robot 10 drives the large-support-plate feeding gripper 9 to grip a silicon wafer from the small-support-plate feeding 6 onto the large-support-plate feeding 12 (first feeding) or the large-support-plate feeding robot 10 drives the large-support-plate feeding gripper 9 to grip a silicon wafer from the large-support-plate feeding 12 onto the large-support-plate feeding rotary area 11, and then the large-support-plate feeding robot 10 drives the large-support-plate feeding gripper 9 to grip a silicon wafer from the small-plate feeding 6 onto the large-support-plate feeding 12 (second feeding).
In this embodiment, the large carrier automatic loading rotary area D is provided with a plurality of large loading carriers 12, two loading conveyors 13, an I/N side loading conveyor rotary table 14 and an I/N side unloading conveyor rotary table 15, a plurality of large loading carriers 12 are arranged on the loading conveyors 13, the loading conveyors 13 are butted with the I/N side loading conveyor rotary table 14 and the I/N side unloading conveyor rotary table 15, one loading conveyor 13 transfers the large loading carriers 12 to the I/N side loading rotary table 14, the I/N side loading rotary table 14 adjusts the turning direction of the large loading carriers 12 and transfers them to another loading conveyor 13, the loading conveyor 13 transfers the large loading carriers 12 to the I/N side unloading conveyor rotary table 15, the I/N side unloading conveyor rotary table 15 adjusts the turning direction of the large loading carriers 12 and transfers them to the first loading conveyor 13, the loaded large carrier plate 12 returns to the initial position.
In this embodiment, the large-support-plate automatic blanking area E is provided with a large-support-plate blanking gripper 16 and a large-support-plate blanking robot 17, the large-support-plate blanking gripper 16 is arranged on the large-support-plate blanking robot 17, the large-support-plate blanking robot 17 drives the large-support-plate blanking gripper 16 to grab a silicon wafer from the middle turntable 11 and place the silicon wafer on the blanking large support plate 18 (first feeding) or the large-support-plate blanking robot 17 drives the large-support-plate blanking gripper 16 to grab the silicon wafer from the blanking large support plate 18 and place the silicon wafer on the blanking small support plate 22, and then the large-support-plate blanking robot 17 drives the large-support-plate blanking gripper 16 to grab the silicon wafer from the middle turntable 11 and place the silicon wafer on the blanking large support plate 18 (second feeding).
In this embodiment, the large carrier automatic blanking revolving area F is provided with a plurality of blanking large carriers 18, two blanking carriages 19, an I/P side feeding conveying revolving platform 20 and an I/P side blanking conveying revolving platform 21, a plurality of blanking large carriers 18 are arranged on the blanking carriages 19, the blanking carriages 19 are butted with the I/P side feeding conveying revolving platform 20 and the I/P side blanking conveying revolving platform 21, one blanking carriage 19 conveys the blanking large carriers 18 to the I/P side feeding conveying revolving platform 20, the I/P side feeding conveying revolving platform 20 adjusts the turning direction of the blanking large carriers 18 and conveys the same to the other blanking carriage 19, the blanking carriage 9 conveys the blanking large carriers 18 to the I/P side blanking conveying revolving platform 21, the I/P side blanking conveying revolving platform 21 adjusts the turning direction of the blanking large carriers 18 and conveys the same to the first blanking carriage 19, the blanking large carrier plate 18 returns to the initial position. Specifically, the blanking large carrier plate 18 and the loading large carrier plate 12 are both provided with a placing groove for placing silicon wafers.
In this embodiment, the automatic unloading conveying rotary area G for small carrier plates is provided with a plurality of unloading small carrier plates 22, a plurality of small carrier plate unloading conveyors 23 and two small carrier plate unloading elevators 24, the unloading small carrier plates 22 are arranged on the small carrier plate unloading conveyors 23, the small carrier plate unloading elevators 24 are in butt joint with the small carrier plate unloading conveyors 23, the unloading small carrier plates 22 are conveyed to the silicon wafer unloading grasping position through the unloading small carrier plate conveyors 23, and the unloading small carrier plates 22 are conveyed back to the large carrier plate unloading grasping hand 16 grasping position through the plurality of unloading small carrier plate conveyors 23 and the two small carrier plate unloading elevators 24 after grasping. Specifically, the blanking small carrier plate 22 has the same structure as the loading small carrier plate 6; the small carrier plate blanking conveyor 23 has the same structure as the small carrier plate feeding conveyor 7; the small carrier plate blanking lifter 24 has the same structure as the small carrier plate feeding lifter 8.
In this embodiment, the silicon wafer automatic blanking area H is provided with a silicon wafer blanking robot 25, a silicon wafer blanking gripper 26, a silicon wafer blanking conveyor 27, a wafer inserting machine 28 and a basket blanking conveyor 29, the silicon wafer blanking gripper 26 is arranged on the silicon wafer blanking robot 25, the silicon wafer blanking robot 25 is arranged on one side of the silicon wafer blanking conveyor 27, the wafer inserting machine 28 is arranged on one side of the silicon wafer blanking conveyor 27, the basket blanking conveyor 29 is arranged on one side of the wafer inserting machine 28, the silicon wafer blanking robot 25 drives the silicon wafer blanking gripper 26 to grab a silicon wafer from a small blanking support plate 22 and place the silicon wafer on the silicon wafer blanking conveyor 27, the silicon wafer blanking conveyor 27 transfers the silicon wafer to place the wafer inserting machine 28, the wafer inserting machine 28 inserts the wafer and then transfers a basket to the basket loading conveyor 29, and the basket conveyor 29 transfers the basket to a next procedure placing part AGV.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (9)

1. The utility model provides a piece integrated automation line about vertical CVD of volume production type which characterized in that includes:
a silicon chip automatic feeding area (A), a small support plate automatic feeding and conveying rotary area (B), a large support plate automatic feeding area (C), a large support plate automatic feeding rotary area (D), a large support plate automatic blanking area (E), a large support plate automatic blanking rotary area (F), a small support plate automatic blanking and conveying rotary area (G) and a silicon chip automatic blanking area (H), the small carrier plate automatic feeding and conveying rotary area (B) and the small carrier plate automatic blanking and conveying rotary area (G) are arranged side by side, the automatic silicon wafer feeding area (A), the automatic large carrier plate feeding area (C) and the automatic large carrier plate conveying rotary area (D) are arranged on one side of the automatic small carrier plate feeding and conveying rotary area (B), the automatic blanking area (E) of the large support plate, the automatic blanking rotary area (F) of the large support plate and the automatic blanking area (H) of the silicon wafer are arranged on one side of the automatic blanking conveying rotary area (G) of the small support plate.
2. The automatic production line for mass production of vertical CVD upper and lower wafers according to claim 1, wherein: the automatic silicon wafer feeding area (A) is provided with a basket feeding conveyor (1), a wafer placing machine (2), a silicon wafer feeding conveyor (3), a silicon wafer feeding gripper (4) and a silicon wafer feeding robot (5), the wafer placing machine (2) is arranged on one side of the basket feeding conveyor (1), the silicon wafer feeding conveyor (3) is arranged on one side of the wafer placing machine (2), the silicon wafer feeding gripper (4) is arranged on the silicon wafer feeding robot (5), and the silicon wafer feeding conveyor (3) is arranged on one side of the silicon wafer feeding robot (5).
3. The automatic production line for mass production of vertical CVD upper and lower wafers according to claim 1, wherein: the automatic feeding and conveying rotary area (B) of the small carrier plates is provided with a plurality of small feeding carrier plates (6), a plurality of small feeding carrier plate feeding conveyors (7) and two small feeding carrier plate feeding elevators (8), the small feeding carrier plates (6) are placed on the small feeding carrier plates (7), and the small feeding carrier plates feeding elevators (8) are in butt joint with the small feeding carrier plates (7).
4. The automatic production line for mass production of vertical CVD upper and lower wafers according to claim 1, wherein: the automatic material loading district (C) of big support plate is provided with big support plate material loading tongs (9), big support plate material loading robot (10) and a plurality of transfer table (11), big support plate material loading tongs (9) set up on big support plate material loading robot (10), a plurality of transfer table (11) set up automatic material loading of little support plate is carried between gyration district (B) and the automatic unloading of little support plate is carried between gyration district (G).
5. The automatic production line for mass production of vertical CVD upper and lower wafers according to claim 1, wherein: the automatic loading rotary area (D) of the large carrier plate is provided with a plurality of loading large carrier plates (12), two loading conveying racks (13), an I/N side loading conveying rotary table (14) and an I/N side unloading conveying rotary table (15), the loading large carrier plates (12) are arranged on the loading conveying racks (13), and the loading conveying racks (13) are in butt joint with the I/N side loading conveying rotary table (14) and the I/N side unloading conveying rotary table (15).
6. The automatic production line for mass production of vertical CVD upper and lower wafers according to claim 1, wherein: the automatic blanking area (E) of the large carrier plate is provided with a large carrier plate blanking gripper (16) and a large carrier plate blanking robot (17), and the large carrier plate blanking gripper (16) is arranged on the large carrier plate blanking robot (17).
7. The automatic production line for mass production of vertical CVD upper and lower wafers according to claim 1, wherein: the automatic unloading revolving area (F) of big support plate is provided with a plurality of big support plate of unloading (18), two unloading carriage (19), the conveying revolving platform of the material loading of the I/P side (20) and the conveying revolving platform of the unloading of the I/P side (21), a plurality of big support plate of unloading (18) set up on the unloading carriage (19), unloading carriage (19) butt joint the conveying revolving platform of the material loading of the I/P side (20) with the conveying revolving platform of the material unloading of the I/P side (21).
8. The automatic production line for mass production of vertical CVD upper and lower wafers according to claim 1, wherein: the automatic unloading of little support plate is carried gyration district (G) and is provided with a plurality of unloading little support plate (22), a plurality of little support plate unloading conveyer (23) and two little support plate unloading elevators (24), unloading little support plate (22) set up on little support plate unloading conveyer (23), little support plate unloading elevator (24) with little support plate unloading conveyer (23) butt joint.
9. The automatic production line for mass production of vertical CVD upper and lower wafers according to claim 1, wherein: the automatic silicon wafer blanking area (H) is provided with a silicon wafer blanking robot (25), a silicon wafer blanking gripper (26), a silicon wafer blanking conveyor (27), a wafer inserting machine (28) and a basket blanking conveyor (29), wherein the silicon wafer blanking gripper (26) is arranged on the silicon wafer blanking robot (25), the silicon wafer blanking robot (25) is arranged on one side of the silicon wafer blanking conveyor (27), the wafer inserting machine (28) is arranged on one side of the silicon wafer blanking conveyor (27), and the basket blanking conveyor (29) is arranged on one side of the wafer inserting machine (28).
CN202210157306.2A 2022-02-21 2022-02-21 Integrated automation line of piece about vertical CVD of volume production type Pending CN114551312A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210157306.2A CN114551312A (en) 2022-02-21 2022-02-21 Integrated automation line of piece about vertical CVD of volume production type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210157306.2A CN114551312A (en) 2022-02-21 2022-02-21 Integrated automation line of piece about vertical CVD of volume production type

Publications (1)

Publication Number Publication Date
CN114551312A true CN114551312A (en) 2022-05-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210157306.2A Pending CN114551312A (en) 2022-02-21 2022-02-21 Integrated automation line of piece about vertical CVD of volume production type

Country Status (1)

Country Link
CN (1) CN114551312A (en)

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