CN114543978A - Vibration impact sensor based on 485 bus - Google Patents
Vibration impact sensor based on 485 bus Download PDFInfo
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- CN114543978A CN114543978A CN202210024047.6A CN202210024047A CN114543978A CN 114543978 A CN114543978 A CN 114543978A CN 202210024047 A CN202210024047 A CN 202210024047A CN 114543978 A CN114543978 A CN 114543978A
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- 230000008054 signal transmission Effects 0.000 claims abstract description 14
- 238000004088 simulation Methods 0.000 claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 13
- 230000036541 health Effects 0.000 claims description 12
- 238000001914 filtration Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 6
- 230000035939 shock Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
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- 238000004891 communication Methods 0.000 description 3
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- 230000009286 beneficial effect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H17/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
Abstract
One embodiment of the invention discloses a 485 bus-based vibration impact sensor, which comprises: the vibration simulation device comprises a sensitive device module, a signal transmission line and a data processing module, wherein the sensitive module is used for collecting vibration simulation signals and impact simulation signals and sending the vibration simulation signals and the impact simulation signals to the data processing module through the signal transmission line, and the data processing module is used for processing the vibration simulation signals and the impact simulation signals so as to output vibration values and impact values. The double-shaft +/-50 g vibration and double-shaft +/-5000 g impact signals can be measured at high precision at the same time, and digital signals are output.
Description
Technical Field
The present invention relates to the field of sensors. And more particularly to a 485 bus based vibratory impulse sensor.
Background
The sensor is used as an essential product in the aircraft development process and is responsible for collecting environmental parameters. With the continuous and deep development process of the integration and digitization of the aircraft, the traditional single-function analog sensor cannot meet the requirements of multifunction and digitization of parameter acquisition on the aircraft. Vibration and impact are used as main mechanical environment parameters on the device, the characteristics of high frequency response exist in acquisition and processing of the vibration and the impact, and the bus system communication mode on the device also leads out the requirements of a bus system sensor.
Disclosure of Invention
In view of the above, a first embodiment of the present invention provides a 485-bus based vibratory impact sensor, comprising:
a sensitive device module, a signal transmission line and a data processing module, wherein,
the sensitive module is used for collecting vibration analog signals and impact analog signals and sending the vibration analog signals and the impact analog signals to the data processing module through the signal transmission line,
the data processing module is used for processing the vibration analog signal and the impact analog signal so as to output a vibration value and an impact value.
In one particular embodiment, the sensor module includes a first accelerometer module, a second accelerometer module, and a housing, wherein,
the first accelerometer module is used for collecting vibration analog signals,
the second accelerometer module is configured to collect an impact simulation signal, and,
the first accelerometer module and the second accelerometer module are fixed in the inner cavity of the shell through heat-conducting insulating glue.
In a specific embodiment, the signal transmission line is a radio frequency coaxial line.
In one embodiment, the data processing module comprises an analog-to-digital conversion module, an ARM processor, an HDLC module, and a 485 interface circuit, wherein,
the analog-to-digital conversion module is used for converting the vibration analog signal and the impact analog signal into a vibration digital signal and an impact digital signal,
the ARM processor is used for processing the vibration digital signal and the impact digital signal according to preset resolution parameters, conversion coefficient parameters and filtering parameters to obtain a vibration value and an impact value,
the HDLC module is used for carrying out HDLC protocol encapsulation on the vibration value and the impact value,
and the 485 interface circuit is used for converting the vibration value and the impact value after the HDLC protocol is encapsulated into 485 standard protocol data.
In one embodiment, the sensor further comprises an indicating device, and the indicating device sends out a prompt when the ARM processor detects that the vibration value and the impact value exceed the preset health threshold.
In a particular embodiment, the first accelerometer module and the second accelerometer module have different ranges.
In one embodiment, the analog-to-digital conversion module is an AD7682 chip.
In a specific embodiment, the data processing module further comprises a power supply module for supplying power to the analog-to-digital conversion circuit, the ARM processor, the HDLC module, and the 485 interface circuit.
A second embodiment of the present invention provides a method for obtaining a 485 bus based vibration impact value, including:
the sensitive module collects vibration analog signals and impact analog signals and sends the vibration analog signals and the impact analog signals to the data processing module through the signal transmission line,
and the data processing module processes the vibration analog signal and the impact analog signal so as to output a vibration value and an impact value.
In one embodiment, the analog-to-digital conversion module converts the vibration analog signal and the impact analog signal into a vibration digital signal and an impact digital signal,
the ARM processor processes the vibration digital signal and the impact digital signal according to preset resolution parameters, conversion coefficient parameters and filtering parameters to obtain a vibration value and an impact value,
the HDLC module carries out HDLC protocol encapsulation on the vibration value and the impact value,
and the 485 interface circuit converts the vibration value and the impact value after the HDLC protocol is encapsulated into 485 standard protocol data.
The invention has the following beneficial effects:
the invention provides a 485 bus-based vibration impact sensor which can measure double-shaft +/-50 g vibration and double-shaft +/-5000 g impact signals at the same time with high precision and output digital signals; resolution configuration, conversion coefficient configuration, filtering parameter configuration and health parameter configuration are carried out through an external interface, software filtering of vibration and impact signals is achieved, the requirements that the frequency response of the vibration signals is higher than-3 dB within the range of 10-2000 Hz, and the frequency response of the impact signals is higher than-3 dB within the range of 10-5000 Hz are met; the system also has a health monitoring function, can monitor vibration and impact signals in real time, and judges the health state of a measured object.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 shows a schematic view of a 485 bus based vibratory impact sensor according to one embodiment of the invention;
FIG. 2 shows a schematic structural diagram of a sensitive device module according to an embodiment of the present invention;
fig. 3 shows a flowchart of a method for obtaining a 485 bus based vibration shock value according to one embodiment of the invention.
Detailed Description
In order to make the technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1, one embodiment of the present invention provides a 485 bus based vibratory impact sensor, comprising:
a sensor module 10, a signal transmission line 20 (not shown), a data processing module 30, wherein,
the sensitive module is used for collecting vibration analog signals and impact analog signals and sending the vibration analog signals and the impact analog signals to the data processing module through the signal transmission line,
the data processing module is used for processing the vibration analog signal and the impact analog signal so as to output a vibration value and an impact value.
In one particular embodiment, the sensor module includes a first accelerometer module, a second accelerometer module, and a housing, wherein,
the first accelerometer module is used for collecting vibration simulation signals,
the second accelerometer module is configured to collect an impact simulation signal, and,
as shown in fig. 2, the first accelerometer module and the second accelerometer module are fixed in the inner cavity of the housing by using a heat conducting insulating adhesive, for example, GD414 heat conducting insulating adhesive is used to bond the circuit board in the inner cavity of the housing.
For more precise acquisition of the vibration analog signal and the shock analog signal, in an alternative embodiment, the first accelerometer module and the second accelerometer module have different ranges, for example, the first accelerometer is a MEMS micro accelerometer chip with a range of ± 50g, and the second accelerometer is a MEMS micro accelerometer chip with a range of ± 5000 g.
In a specific embodiment, the signal transmission line is a radio frequency coaxial line to prevent the analog quantity signal from being interfered during transmission.
In one embodiment, the data processing module comprises an analog-to-digital conversion module, an ARM processor, an HDLC module, and a 485 interface circuit, wherein,
the analog-to-digital conversion module is used for converting the vibration analog signal and the impact analog signal into a vibration digital signal and an impact digital signal, and for example, the analog-to-digital conversion module selects an AD7682 chip.
The ARM processor is used for processing the vibration digital signal and the impact digital signal according to preset resolution parameters, conversion coefficient parameters and filtering parameters to obtain the vibration value and the impact value, for example, the ARM processor selects a Cortex-M4 series MCU to realize software filtering of signals and meet the frequency response range of the vibration and impact signals. For example, preset resolution parameters, conversion coefficients, filtering parameters and health parameters are input through an external interface, so that software filtering of vibration and impact signals is realized, the frequency response of the vibration signals is higher than-3 dB within the range of 10-2000 Hz, and the frequency response of the impact signals is higher than-3 dB within the range of 10-5000 Hz.
The HDLC module is used for carrying out HDLC protocol encapsulation on the vibration value and the impact value, for example, the HDLC module is an FPGA and is controlled by an ARM processor to carry out bottom layer signal logic operation.
The 485 interface circuit is used for converting the vibration value and the impact value after the HDLC protocol is encapsulated into 485 standard protocol data, for example, 2 Max3491 chips are selected for the 485 interface circuit to realize synchronous half-duplex 485 communication, the communication rate is 6Mbps, and the data link layer follows the HDLC protocol.
The sensor also comprises an indicating device, when the ARM processor detects that the vibration value and the impact value exceed a preset health threshold value, a prompt can be sent, for example, the preset vibration health threshold value is 40g, when the ARM processor detects that the vibration value exceeds a measuring range, for example, 50g, the alarm can be sent, so that vibration and impact signals can be monitored in real time, and the health state of a detected object can be judged.
The data processing module further comprises a power supply module, and the power supply module is used for supplying power to the analog-to-digital conversion circuit, the ARM processor, the HDLC module and the 485 interface circuit, for example, the power supply module adopts TPS71550DCKR to realize power supply voltage conversion, and adopts ADR02BKSZ to realize internal reference power supply conversion.
The 485 bus-based vibration impact sensor provided by the embodiment can measure the vibration of two axes +/-50 g and the impact signal of two axes +/-5000 g at high precision simultaneously, and outputs a digital signal; resolution configuration, conversion coefficient configuration, filtering parameter configuration and health parameter configuration are carried out through an external interface, software filtering of vibration and impact signals is achieved, the requirements that the frequency response of the vibration signals is higher than-3 dB within the range of 10-2000 Hz, and the frequency response of the impact signals is higher than-3 dB within the range of 10-5000 Hz are met; the system also has a health monitoring function, can monitor vibration and impact signals in real time, and judges the health state of a measured object.
Corresponding to the sensor of the above embodiment, as shown in fig. 2, an embodiment of the present invention further provides a method for acquiring a 485 bus-based vibration impact value, including:
the sensitive module collects vibration analog signals and impact analog signals and sends the vibration analog signals and the impact analog signals to the data processing module through the signal transmission line,
and the data processing module processes the vibration analog signal and the impact analog signal so as to output a vibration value and an impact value.
In one embodiment, the analog-to-digital conversion module converts the vibration analog signal and the impact analog signal into a vibration digital signal and an impact digital signal,
the ARM processor processes the vibration digital signal and the impact digital signal according to preset resolution parameters, conversion coefficient parameters and filtering parameters to obtain a vibration value and an impact value,
the HDLC module carries out HDLC protocol encapsulation on the vibration value and the impact value,
and the 485 interface circuit converts the vibration value and the impact value after the HDLC protocol is encapsulated into 485 standard protocol data.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (10)
1. A 485-bus based vibratory impact sensor, comprising:
a sensitive device module, a signal transmission line and a data processing module, wherein,
the sensitive module is used for collecting vibration analog signals and impact analog signals and sending the vibration analog signals and the impact analog signals to the data processing module through the signal transmission line,
the data processing module is used for processing the vibration analog signal and the impact analog signal so as to output a vibration value and an impact value.
2. The sensor of claim 1, wherein the sensor module comprises a first accelerometer module, a second accelerometer module, and a housing, wherein,
the first accelerometer module is used for collecting vibration simulation signals,
the second accelerometer module is configured to collect an impact simulation signal, and,
the first accelerometer module and the second accelerometer module are fixed in the inner cavity of the shell through heat-conducting insulating glue.
3. The sensor of claim 1, wherein the signal transmission line is a radio frequency coaxial line.
4. The sensor of claim 1, wherein the data processing module comprises an analog-to-digital conversion module, an ARM processor, an HDLC module, and a 485 interface circuit, wherein,
the analog-to-digital conversion module is used for converting the vibration analog signal and the impact analog signal into a vibration digital signal and an impact digital signal,
the ARM processor is used for processing the vibration digital signal and the impact digital signal according to preset resolution parameters, conversion coefficient parameters and filtering parameters to obtain a vibration value and an impact value,
the HDLC module is used for carrying out HDLC protocol encapsulation on the vibration value and the impact value,
and the 485 interface circuit is used for converting the vibration value and the impact value after the HDLC protocol is encapsulated into 485 standard protocol data.
5. The sensor of claim 4, further comprising an indicating device that issues a reminder when the ARM processor detects that the vibration and shock values exceed a preset health threshold.
6. The sensor of claim 2, wherein the first and second accelerometer modules have different ranges.
7. The sensor of claim 4, wherein the analog-to-digital conversion module is an AD7682 chip.
8. The sensor of claim 4, wherein the data processing module further comprises a power module for powering the analog-to-digital conversion circuit, the ARM processor, the HDLC module, and the 485 interface circuit.
9. A method for obtaining a 485 bus-based vibration impact value is characterized by comprising the following steps:
the sensitive module collects vibration analog signals and impact analog signals and sends the vibration analog signals and the impact analog signals to the data processing module through the signal transmission line,
and the data processing module processes the vibration analog signal and the impact analog signal so as to output a vibration value and an impact value.
10. The method of claim 9, wherein an analog-to-digital conversion module converts the vibration analog signal and the impact analog signal into a vibration digital signal and an impact digital signal,
the ARM processor processes the vibration digital signal and the impact digital signal according to preset resolution parameters, conversion coefficient parameters and filtering parameters to obtain a vibration value and an impact value,
the HDLC module carries out HDLC protocol encapsulation on the vibration value and the impact value,
and the 485 interface circuit converts the vibration value and the impact value after the HDLC protocol is encapsulated into 485 standard protocol data.
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Citations (6)
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CN101368869A (en) * | 2008-09-28 | 2009-02-18 | 唐德尧 | Generalized resonance composite sensor for vibration impact detection |
JP2013205265A (en) * | 2012-03-29 | 2013-10-07 | Genetec Corp | Measuring instrument |
CN205333118U (en) * | 2016-01-18 | 2016-06-22 | 唐智科技湖南发展有限公司 | Broad sense resonance capacitanc compound sensor that detects vibration and strike |
CN209927282U (en) * | 2019-03-22 | 2020-01-10 | 唐智科技湖南发展有限公司 | Pantograph state monitoring system |
CN112539826A (en) * | 2020-12-04 | 2021-03-23 | 中嵌科技(北京)有限公司 | Vibration and impact pulse composite sensor |
CN113739908A (en) * | 2021-09-06 | 2021-12-03 | 中嵌科技(北京)有限公司 | Vibration and impact composite sensor based on MEMS chip |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101368869A (en) * | 2008-09-28 | 2009-02-18 | 唐德尧 | Generalized resonance composite sensor for vibration impact detection |
JP2013205265A (en) * | 2012-03-29 | 2013-10-07 | Genetec Corp | Measuring instrument |
CN205333118U (en) * | 2016-01-18 | 2016-06-22 | 唐智科技湖南发展有限公司 | Broad sense resonance capacitanc compound sensor that detects vibration and strike |
CN209927282U (en) * | 2019-03-22 | 2020-01-10 | 唐智科技湖南发展有限公司 | Pantograph state monitoring system |
CN112539826A (en) * | 2020-12-04 | 2021-03-23 | 中嵌科技(北京)有限公司 | Vibration and impact pulse composite sensor |
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