CN113739908A - Vibration and impact composite sensor based on MEMS chip - Google Patents
Vibration and impact composite sensor based on MEMS chip Download PDFInfo
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- CN113739908A CN113739908A CN202111039041.8A CN202111039041A CN113739908A CN 113739908 A CN113739908 A CN 113739908A CN 202111039041 A CN202111039041 A CN 202111039041A CN 113739908 A CN113739908 A CN 113739908A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H17/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
Abstract
The invention relates to a vibration and impact composite sensor based on an MEMS chip, which comprises an MEMS vibration accelerometer unit, a band-pass filter circuit unit, an ADC digital acquisition unit, a low-noise amplification signal conditioning unit and an adaptation IEPE output circuit interface unit, wherein the MEMS vibration accelerometer unit is used for acquiring the impact characteristic of tested equipment, realizing the detection of vibration acceleration signals of the tested equipment and simultaneously providing impact pulse signal detection; the band-pass filter circuit unit is used for carrying out narrow-band filtering around a resonance point on the pulse impact signal so as to inhibit out-of-band interference; the ADC digital acquisition unit is used for performing high-precision analog-to-digital conversion on acceleration analog signals including vibration and impact; the low-noise amplification signal conditioning unit is used for ultra-low noise processing and low-noise signal amplification processing of the acceleration analog signal; the low-noise amplifier signal conditioning unit outputs analog quantity to the adaptation IEPE output circuit interface unit; the interface unit of the adaptive IEPE output circuit is used for completing the conversion between the acceleration analog signal and the IEPE interface.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a vibration and impact composite sensor based on an MEMS chip.
Background
In the prior art, fault detection of industrial equipment is usually realized by adopting vibration monitoring. The traditional vibration monitoring of the industrial equipment is obtained through a vibration acceleration piezoelectric ceramic sensor, and the vibration acceleration signal obtained by the piezoelectric sensor of the pulse shock wave signal of the industrial equipment is usually low in strength and is submerged in a common vibration signal and is difficult to detect and identify. In addition, the traditional piezoelectric sensor only realizes the vibration acceleration piezoelectric sensing and has no impact vibration monitoring function.
Shock pulse waves refer to mechanical waves with very sharp rise and fall times that propagate in hard materials such as steel. The impact pulse sensor has significant advantages over conventional vibration sensors, one of the greatest advantages being that the impact pulse sensor can predict failure of the industrial equipment 3 to 7 months ahead.
Taking the fault detection of the bearing as an example, the impact pulse sensor ensures resonance at a certain frequency (such as 32kHz) through the combined action of hardware and software, so that the amplitude of the taken signal is 5-7 times larger than that of the signal obtained by a conventional vibration sensor, and therefore, when the bearing has slight fault, the impact pulse can capture a reliable signal; when the vibration sensor catches a bearing fault signal, the bearing fault is serious, and after the bearing is disassembled, the defects of the bearing can be obviously seen by naked eyes.
In the field of industrial applications, online health status inspection and fault predictive maintenance of industrial equipment is required. Wherein the vibration wave detection is mainly focused on the monitoring of critical faults of the industrial equipment, and the shock wave detection is mainly focused on the early fault monitoring of the industrial equipment. The sensor with the vibration wave detection technology and the shock wave detection technology can better perform the full-life-cycle health management early warning of the industrial equipment, and the economic loss and potential safety hazards caused by the unplanned shutdown are reduced to the maximum extent.
Disclosure of Invention
The invention aims to provide a vibration and impact composite sensor based on an MEMS (Micro-Electro-Mechanical System) chip, and the technical problem to be solved at least comprises how to design a novel vibration and impact composite sensor based on the MEMS chip, so that the vibration and pulse impact detection of industrial Mechanical equipment is integrated.
In order to achieve the purpose, the invention provides a vibration and impact composite sensor based on an MEMS chip, which comprises an MEMS-based vibration accelerometer unit, a band-pass filter circuit unit, an ADC digital acquisition unit, a low-noise amplification signal conditioning unit and an adaptation IEPE output circuit interface unit, wherein the MEMS-based vibration accelerometer unit is connected with the band-pass filter circuit unit and is used for acquiring the impact characteristic of a tested device, realizing the detection of the vibration acceleration signal of the tested device and simultaneously providing the detection of an impact pulse signal; the band-pass filter circuit unit is used for carrying out narrow-band filtering around a resonance point on the pulse impact signal so as to inhibit out-of-band interference; the band-pass filter circuit unit is also respectively connected with the ADC digital acquisition unit and the low-noise amplifier signal conditioning unit, and the ADC digital acquisition unit is used for performing high-precision analog-to-digital conversion on acceleration analog signals including vibration and impact; the low-noise amplification signal conditioning unit is used for ultra-low noise processing and low-noise signal amplification processing of the acceleration analog signal; the low-noise amplifier signal conditioning unit is connected with the adaptive IEPE output circuit interface unit and outputs analog quantity to the adaptive IEPE output circuit interface unit; the adaptive IEPE output circuit interface unit is used for completing the conversion between the acceleration analog signal and the IEPE interface.
The vibration and impact composite sensor based on the MEMS chip further comprises a solid-state data temporary storage/continuous transmission unit, wherein the solid-state data temporary storage/continuous transmission unit is connected with the ADC digital acquisition unit and is used for temporary storage and continuous transmission of data and storage and recovery of data after power failure under special conditions.
The vibration and impact composite sensor based on the MEMS chip further comprises a data interaction dynamic cache unit, wherein the data interaction dynamic cache unit is connected with the ADC digital acquisition unit and used for temporarily storing and exchanging high-capacity intermediate data required by digital signal processing.
The vibration and impact composite sensor based on the MEMS chip further comprises an adaptive WIFI/BT4.2 output circuit interface unit, an adaptive LAN output circuit interface unit and a network control state query interaction unit; the ADC digital acquisition units are connected with the adaptive WIFI/BT4.2 output circuit interface unit and the adaptive LAN output circuit interface unit, and the ADC digital acquisition units output SPI/SDIO digital quantity to the adaptive WIFI/BT4.2 output circuit interface unit and the adaptive LAN output circuit interface unit; the adaptive WIFI/BT4.2 output circuit interface unit is used for wirelessly uploading the digital data of the sensor; the adaptive LAN output circuit interface unit is used for uploading the sensor digital data through an Ethernet LAN interface; the adaptive WIFI/BT4.2 output circuit interface unit and the adaptive LAN output circuit interface unit are both connected with the network control state query interaction unit, and the network control state query interaction unit is used for acquiring and configuring interaction between sensor parameters and remote user instructions.
The vibration and impact composite sensor based on the MEMS chip further comprises a safe encryption selectable module, and the safe encryption selectable module is connected with the solid-state data temporary storage/continuous transmission unit and used for encrypting the key of the sensor data.
The vibration and impact composite sensor based on the MEMS chip further comprises a structure fastening and rigid connecting unit, a low-power-consumption power supply wireless charging optional module and a sensing element module, wherein the structure fastening and rigid connecting unit is used for ensuring the maximum transmission and the minimum attenuation of vibration shock wave acceleration signals by adopting an exquisite structure design and a strong adhesive bonding process, and the low-power-consumption power supply wireless charging optional module is used for charging a sensor power module; the sensing element module is used for sensing temperature, humidity, pressure and/or air noise.
The vibration and impact composite sensor based on the MEMS chip comprises a vibration frequency band part of 0.1 Hz-10 KHz and an impact signal frequency band above 20 kHz.
The vibration and impact composite sensor based on the MEMS chip further comprises a mechanical mounting bolt, a metal shell device, an MEMS sensor insulation main substrate, a band-pass filter, a low-noise signal conditioning unit, a metal closed shell shielding cover, an IEPE matching interface output unit, two lead injection molding sealing bodies and two core threaded connection metal aviation plugs, wherein the mechanical mounting bolt is used for rigid connection between the composite sensor and the equipment to be tested, and the mechanical mounting bolt is in integral rigid connection with the metal shell device; the metal shell device is a metal protection shell outside the composite sensor; the MEMS sensor insulating main substrate is a metal insulating substrate used for a MEMS vibration accelerometer unit, and the MEMS sensor insulating main substrate is kept insulated from the metal shell device; the band-pass filter is the band-pass filter circuit unit; the low-noise signal conditioning unit is a low-noise amplification signal conditioning unit; the metal enclosure shielding case is used for shielding the composite sensor from external interference; the IEPE matching interface output unit is electrically connected with the adapting IEPE output circuit interface unit; the metal shell device and the metal closed shell shielding cover form a shielding shell; the two lead injection molding sealing bodies and the circuit board lead in the shielding shell are connected with the lead with shielding through the central hole, and the circuit board in the shielding shell is also connected with the band-pass filter; the two-core threaded connection metal aviation plug is internally connected with each other through the two lead injection molding sealing bodies.
The mechanical mounting bolt is a standard mounting M8 or M6 bolt.
The shielding cover of the metal closed shell is adhered to the metal shell device through an insulating bracket isolation super glue or fastened through screws.
Advantageous effects
Compared with the prior art, the invention has the beneficial effects that:
the vibration and impact composite sensor based on the MEMS chip has the performance of a sensor of vibration acceleration and also has the performance of an impact pulse acceleration sensor. The invention designs a novel chip sensor integrating a weak signal low-noise amplifier circuit and a band-pass filter circuit based on a broadband MEMS accelerometer, the novel chip sensor is a composite sensor integrating vibration and pulse impact detection of industrial mechanical equipment, and the novel chip sensor has the remarkable advantages of low power consumption, small size, good low-frequency response, multiple functions and the like.
The MEMS is a micro device or system integrating micro sensors, micro actuators, micro mechanical structures, micro power sources, micro energy sources, signal processing and control circuits, high-performance electronic integrated devices, interfaces and communication, and has the characteristics of miniaturization, integration, intellectualization, diversification, mass production and the like. With the continuous increase of data pipeline and central processing capacity brought by high frequency communication, the application of MEMS will become more and more extensive, such as high frequency communication, biomedical, industrial science, consumer electronics, smart car, artificial intelligence, industry 4.0, smart home, etc.
MEMS devices are smaller in size, up to a centimeter and even just a few microns, relative to conventional machines. The MEMS process can be used for mass production with low cost by utilizing mature technologies and processes in the production of integrated circuits, so that the cost performance is greatly improved compared with the traditional mechanical manufacturing technology.
The invention provides a composite sensor integrating vibration of industrial mechanical equipment and pulse impact detection, which comprises two aspects of vibration acceleration detection and vibration impact detection of the sensor, wherein the vibration impact detection enables a resonance frequency band to be narrow enough, attenuation time to be short enough and amplification factor to be accurate enough through a resonance technology. The invention utilizes the broadband of the MEMS chip to obtain the vibration acceleration detection in the traditional sense, and simultaneously resonates the broadband low-energy impact signal of the fault point of the tested equipment to a narrow-frequency high-energy signal at a certain relatively fixed high-frequency position through the resonance point technology of the chip, thereby being beneficial to detecting the early fault of the equipment.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
Fig. 1 is a logic structure diagram of the vibration and impact composite sensor based on the MEMS chip.
Fig. 2 is a schematic diagram of the detection frequency band of the vibration and impact composite sensor based on the MEMS chip.
Fig. 3 is a mechanical structure diagram of the vibration and impact composite sensor based on the MEMS chip.
Detailed Description
The present invention is described in more detail below to facilitate an understanding of the present invention.
As shown in fig. 1, the vibration and shock composite sensor based on the MEMS chip of the present invention includes a MEMS-based vibration accelerometer unit, a band-pass filter circuit unit, an ADC digital acquisition unit, a low-noise amplification signal conditioning unit, and an adaptation IEPE output circuit interface unit, wherein the MEMS-based vibration accelerometer unit is connected to the band-pass filter circuit unit, and is configured to acquire a shock characteristic of a device under test, to implement detection of a vibration acceleration signal of the device under test, and to provide detection of a shock pulse signal; the band-pass filter circuit unit is used for carrying out narrow-band filtering on the pulse impact signal around a resonance point fm so as to inhibit out-of-band interference; the band-pass filter circuit unit is also respectively connected with the ADC digital acquisition unit and the low-noise amplifier signal conditioning unit.
The ADC digital acquisition unit is used for high-precision analog-to-digital conversion of acceleration analog signals including vibration and impact, and the sampling bit width of the ADC is not less than 24 bits and up to 32 bits; the band-pass filter circuit unit is used for separating acceleration vibration data of the industrial equipment of 0.1 Hz-10 kHz respectively through a band-pass digital filtering means and is used for a series of signal processing means for vibration monitoring; meanwhile, the band-pass filtering unit is also used for separating the narrow-band shock wave component surrounding the shock wave signal resonance point by means of band-pass digital filtering, and analyzing and extracting fault symptom characteristic information of the industrial equipment by a series of signal processing means such as envelope spectrum.
The low-noise amplification signal conditioning unit is used for ultra-low noise processing and low-noise signal amplification processing of the acceleration analog signal; the low-noise amplifier signal conditioning unit is based on an analog circuit, active filters are formed by carefully selecting low-noise low-temperature drift component materials (such as low-noise resistors) and selecting proper low-noise operational amplifiers, filtering parameters are dynamically adjusted according to the positions of resonance points of actual sensors, and out-of-band noise is reduced, so that fault sign characteristic information of industrial equipment is extracted to the maximum extent, the fault state of the industrial equipment is predicted more accurately, and full-life-cycle health management, energy conservation and efficiency improvement are performed on the industrial equipment in a ready manner.
The low-noise amplifier signal conditioning unit is connected with the adaptive IEPE output circuit interface unit and outputs analog quantity to the adaptive IEPE output circuit interface unit; the adaptive IEPE output circuit interface unit is used for completing the conversion between the acceleration analog signal and the IEPE interface. The IEPE interface integrates the low-power constant current source power supply and the transmission of the voltage output signal of the sensor, and supports the length signal of the cable line from dozens of meters to 150 meters to meet the requirement. Therefore, the special increase adapts IEPE output interface, increases the length of the cable wiring of sensor in order to meet the requirement of industrial equipment field.
The invention discloses an MEMS vibration accelerometer unit, which is a method for realizing a vibration and shock pulse composite sensor, can realize the detection of vibration acceleration signals of tested equipment, simultaneously provides shock pulse signal detection, realizes a multifunctional sensor for detecting mechanical vibration shock signals by combining vibration and shock pulses, and forms an integrated sensor chip unit.
The vibration and impact composite sensor based on the MEMS chip further comprises a solid-state data temporary storage/continuous transmission unit, wherein the solid-state data temporary storage/continuous transmission unit is connected with the ADC digital acquisition unit and is used for temporary storage and continuous transmission of data and storage and recovery of data after power failure under special conditions. The data of the solid-state data temporary storage/continuous transmission unit is a standardized data sample set of target characteristic symptom information of the shock vibration wave of the industrial equipment, extracted by a series of processes including low-noise signal conditioning, digital ADC (analog to digital converter) acquisition, digital signal algorithm processing and the like of the sensor, serves subsequent cloud computing of the industrial equipment data and the like, reduces data redundancy, reduces the scale of cloud computing big data, and improves efficiency.
The vibration and impact composite sensor based on the MEMS chip further comprises a data interaction dynamic cache unit, wherein the data interaction dynamic cache unit is connected with the ADC digital acquisition unit and used for temporarily storing and exchanging high-capacity intermediate data required by digital signal processing. The unit is mainly used for caching a large amount of data from the ADC digital acquisition unit, and simultaneously, temporarily storing and exchanging intermediate data required by signal algorithm processing according to the requirement of a standardized data sample set of target characteristic symptom information of shock vibration waves.
The vibration and impact composite sensor based on the MEMS chip further comprises an adaptive WIFI/BT4.2 output circuit interface unit, an adaptive LAN output circuit interface unit and a network control state query interaction unit; the ADC digital acquisition units are connected with the adaptive WIFI/BT4.2 output circuit interface unit and the adaptive LAN output circuit interface unit, and the ADC digital acquisition units output SPI/SDIO digital quantity to the adaptive WIFI/BT4.2 output circuit interface unit and the adaptive LAN output circuit interface unit; the adaptive WIFI/BT4.2 output circuit interface unit is used for wirelessly uploading the digital data of the sensor; and dynamically adjusting the interface form of wireless transmission according to the requirement of the data rate of the wireless data transmission. On the premise that the wireless transmission data rate is low and the data bandwidth requirement of the low-power Bluetooth is met, BT4.2 is preferentially selected; under the condition that wireless transmission needs a large data rate, a WIFI interface form is selected.
The adaptive LAN output circuit interface unit is used for uploading the sensor digital data through an Ethernet LAN interface; when the wired digital data transmission condition is provided, the wired transmission is stable and reliable compared with a wireless transmission mode through a LAN interface.
The adaptive WIFI/BT4.2 output circuit interface unit and the adaptive LAN output circuit interface unit are both connected with the network control state query interaction unit, and the network control state query interaction unit is used for acquiring and configuring interaction between sensor parameters and remote user instructions. The functional unit can be used according to the complex and changeable requirements of users and sites, flexibly and conveniently configure preset multiple site working modes and adapt to various working conditions.
The vibration and impact composite sensor based on the MEMS chip further comprises a safe encryption selectable module, and the safe encryption selectable module is connected with the solid-state data temporary storage/continuous transmission unit and used for encrypting the key of the sensor data. The safety encryption selectable module is embedded with a hardware accelerator optimized by a safety algorithm, and an encryption safety algorithm is solidified in the safety encryption selectable module.
The vibration and impact composite sensor based on the MEMS chip further comprises a structure fastening and rigid connecting unit, a low-power-consumption power supply wireless charging optional module and a sensing element module, wherein the structure fastening and rigid connecting unit is used for ensuring the maximum transmission and the minimum attenuation of vibration shock wave acceleration signals by adopting an exquisite structure design and a strong glue bonding process.
The low-power-consumption power supply wireless charging optional module is used for charging the sensor power supply module; the sensing element module is used for sensing parameters such as temperature, humidity, pressure, air noise and the like. The analysis of the variation trend of parameters such as temperature, humidity, pressure, air noise and the like of the monitored part of the industrial equipment is helpful for reflecting the health state of the industrial equipment from different angles, but the effect of the analysis is not as direct and effective as the monitoring of the vibration shock wave, and the analysis is only used as an auxiliary reference.
The vibration and impact composite sensor based on the MEMS chip has the characteristics of miniaturization, integration, intellectualization, diversification, batch and the like, and has the irreplaceable advantages of the traditional vibration sensor.
The impulse pulses from the device under test are short in time duration in the time domain, typically a few microseconds to tens of microseconds, but very wide in frequency domain. The resonance frequency of the vibration and impact composite sensor based on the MEMS chip enables the impact pulse far beyond the vibration frequency (above 20 kHz) to be amplified by multiple times, so that the impact pulse is easy to detect. Unlike the vibration sensor arranged in the straight line segment of the sensitivity curve of the vibration sensor, the frequency range is generally 0.1-10 KHz.
As shown in FIG. 2, the MEMS chip-based vibration and shock composite sensor of the present invention comprises a vibration frequency band portion of 0.1 Hz-10 KHz, and further comprises a shock signal frequency band (above 20 kHz) located near a resonance frequency far higher than the vibration frequency, so that the vibration frequency range from the tested device and the pulse shock resonance frequency sub-band from the tested device do not overlap in the frequency domain and are simultaneously detected. In fig. 2, f1 to f 1: 0.1 Hz-10 kHz; fm is generally designed to be greater than 20 kHz.
As shown in fig. 3, the MEMS chip-based vibration and impact composite sensor of the present invention further includes a mechanical mounting bolt 1, a metal housing device 2, an MEMS sensor insulating main substrate 3, a band pass filter 4, a low noise signal conditioning unit 5, a metal enclosure shielding case 6, an IEPE matching interface output unit 7, a two-wire injection molding sealing body 8, and a two-core threaded connection metal aviation plug 9, where the mechanical mounting bolt 1 is used for rigid connection between the composite sensor and a device under test, and the mechanical mounting bolt 1 and the metal housing device 2 are connected by an integral rigid body; the metal shell device 2 is a metal protection shell outside the composite sensor; the MEMS sensor insulating main substrate 3 is a metal insulating substrate for a MEMS vibration accelerometer unit, and the MEMS sensor insulating main substrate 3 is kept insulated from the metal case device 2; the band-pass filter 4 is the band-pass filter circuit unit; the low-noise signal conditioning unit 5 is the low-noise amplifying signal conditioning unit; low noise, more precisely, the choice of low noise components, such as low noise resistors; low noise amplifier refers to a low noise amplifier.
The metal enclosure shielding case 6 is used for shielding the composite sensor from external interference; the IEPE matching interface output unit 7 is electrically connected with the adapting IEPE output circuit interface unit; the two lead injection molding sealing bodies 8 are connected with a lead of a circuit board in a shielding shell (the shielding shell is formed by the metal shell device 2 and a shielding cover of a metal closed shell) through a central hole, and the circuit board in the shielding shell is connected with the band-pass filter 4; the two-core threaded connection metal aviation plug 9 is internally connected with each other through the two lead injection molding sealing bodies 8.
In a preferred embodiment, part of the circuits of the MEMS sensor insulating main substrate 3, the band-pass filter 4, the low-noise signal conditioning unit 5, the IEPE matching interface output unit 7 and the two-wire injection molding sealing body 8 are partially combined into one circuit unit for processing. The signal connections between the circuit units are suggested to be connected by means of flexible cables. In the overall structure design, on the basis of guaranteeing whole rigidity, the holistic quality is reduced as far as possible to be favorable to coming from the high-quality conduction of the vibration impact of equipment under test to the sensor of furthest, reduce the adverse effect of decay.
The mechanical mounting bolt 1 is a standard mounting M8/M6 bolt.
The shielding case 6 of the metal enclosure shell and the metal protection shell outside the sensor (namely the metal shell device 2) are bonded by isolating strong glue of an insulating bracket or fastened by screws.
The accelerometer based on the MEMS chip has very good ultralow frequency characteristic; meanwhile, a wider frequency range is obtained; through the resonance point and the structural design of the MEMS chip (the design of the resonance point mainly depends on the rigid structural design, namely the outer shell adopts a stainless steel 306L material, the inner shell adopts a hard aluminum material in consideration of weight reduction requirements, the outer shell and the inner shell are isolated by adopting high-temperature-resistant high-insulation epoxy resin, the outer shell, the inner shell and the insulation epoxy resin are bonded by high-strength high-temperature-resistant anaerobic strong glue, and the interface adopts a 3015 double-needle interface which meets the American military standard), the impact property of the tested equipment can be obtained.
The foregoing describes preferred embodiments of the present invention, but is not intended to limit the invention thereto. Modifications and variations of the embodiments disclosed herein may be made by those skilled in the art without departing from the scope and spirit of the invention.
Claims (10)
1. The vibration and impact composite sensor based on the MEMS chip is characterized by comprising an MEMS vibration-based accelerometer unit, a band-pass filter circuit unit, an ADC digital acquisition unit, a low-noise amplification signal conditioning unit and an adaptation IEPE output circuit interface unit, wherein the MEMS vibration-based accelerometer unit is connected with the band-pass filter circuit unit and is used for acquiring the impact characteristic of the tested equipment, realizing the detection of the vibration acceleration signal of the tested equipment and simultaneously providing an impact pulse signal for detection; the band-pass filter circuit unit is used for carrying out narrow-band filtering around a resonance point on the pulse impact signal so as to inhibit out-of-band interference; the band-pass filter circuit unit is also respectively connected with the ADC digital acquisition unit and the low-noise amplifier signal conditioning unit, and the ADC digital acquisition unit is used for performing high-precision analog-to-digital conversion on acceleration analog signals including vibration and impact; the low-noise amplification signal conditioning unit is used for ultra-low noise processing and low-noise signal amplification processing of the acceleration analog signal; the low-noise amplifier signal conditioning unit is connected with the adaptive IEPE output circuit interface unit and outputs analog quantity to the adaptive IEPE output circuit interface unit; the adaptive IEPE output circuit interface unit is used for completing the conversion between the acceleration analog signal and the IEPE interface.
2. The MEMS chip based vibration and shock combi sensor of claim 1, further comprising a solid state data temporary storage/retransmission unit connected to the ADC digital acquisition unit for temporary storage and retransmission of data and for saving and restoring data after power failure in special situations.
3. The MEMS chip-based vibration and impact composite sensor according to claim 1, further comprising a data interaction dynamic buffer unit, wherein the data interaction dynamic buffer unit is connected to the ADC digital acquisition unit, and is configured to temporarily store and exchange large-capacity intermediate data required for digital signal processing.
4. The MEMS chip based vibration and shock combi sensor as claimed in claim 1, further comprising an adaptive WIFI/BT4.2 output circuit interface unit, an adaptive LAN output circuit interface unit, and a network control status query interaction unit; the ADC digital acquisition units are connected with the adaptive WIFI/BT4.2 output circuit interface unit and the adaptive LAN output circuit interface unit, and the ADC digital acquisition units output SPI/SDIO digital quantity to the adaptive WIFI/BT4.2 output circuit interface unit and the adaptive LAN output circuit interface unit; the adaptive WIFI/BT4.2 output circuit interface unit is used for wirelessly uploading the digital data of the sensor; the adaptive LAN output circuit interface unit is used for uploading the sensor digital data through an Ethernet LAN interface; the adaptive WIFI/BT4.2 output circuit interface unit and the adaptive LAN output circuit interface unit are both connected with the network control state query interaction unit, and the network control state query interaction unit is used for acquiring and configuring interaction between sensor parameters and remote user instructions.
5. The MEMS chip based vibration and shock combi sensor of claim 1 further comprising a secure encryption option module coupled to the solid state data staging/retransmission unit for key encryption processing of sensor data.
6. The MEMS chip based vibration and shock combi sensor of claim 1, further comprising a structural fastening and rigid connection unit for ensuring maximum transmission and minimum attenuation of vibration shock wave acceleration signals using a delicate structural design and a strong glue bonding process, a low power wireless charging option module for charging a sensor power module, and a sensing element module; the sensing element module is used for sensing temperature, humidity, pressure and/or air noise.
7. The MEMS chip based vibration and shock combi sensor according to any of claims 1 to 6, wherein the MEMS chip based vibration and shock combi sensor comprises a vibration band portion of 0.1Hz to 10KHz and a shock signal band above 20 KHz.
8. The MEMS chip based vibration and impact combi sensor of any one of claims 1 to 6, further comprising a mechanical mounting bolt, a metal housing means, a MEMS sensor insulating primary substrate, a band pass filter, a low noise signal conditioning, a metal enclosure shielding, an IEPE matching interface output, a two wire injection molded seal, and a two-core threaded metal boat plug, wherein the mechanical mounting bolt is used for the rigid body connection of the combi sensor to a device under test, and the mechanical mounting bolt is integrally rigid body connected to the metal housing means; the metal shell device is a metal protection shell outside the composite sensor; the MEMS sensor insulating main substrate is a metal insulating substrate used for a MEMS vibration accelerometer unit, and the MEMS sensor insulating main substrate is kept insulated from the metal shell device; the band-pass filter is the band-pass filter circuit unit; the low-noise signal conditioning unit is a low-noise amplification signal conditioning unit; the metal enclosure shielding case is used for shielding the composite sensor from external interference; the IEPE matching interface output unit is electrically connected with the adapting IEPE output circuit interface unit; the metal shell device and the metal closed shell shielding cover form a shielding shell; the two lead injection molding sealing bodies and the circuit board lead in the shielding shell are connected with the lead with shielding through the central hole, and the circuit board in the shielding shell is also connected with the band-pass filter; the two-core threaded connection metal aviation plug is internally connected with each other through the two lead injection molding sealing bodies.
9. The MEMS chip-based vibration and shock composite sensor according to claim 8, wherein the mechanical mounting bolts are standard mounting M8 or M6 bolts.
10. The MEMS chip-based vibration and shock combi sensor of claim 8, wherein the metal enclosure shield and the metal housing means are isolated by an insulating bracket, such as a super glue bond or a screw fastening.
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| CN114543978A (en) * | 2022-01-11 | 2022-05-27 | 北京电子工程总体研究所 | Vibration impact sensor based on 485 bus |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114509108A (en) * | 2022-01-06 | 2022-05-17 | 北京电子工程总体研究所 | Vibration and impact composite sensor |
| CN114543978A (en) * | 2022-01-11 | 2022-05-27 | 北京电子工程总体研究所 | Vibration impact sensor based on 485 bus |
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