CN114540765A - Diamond/copper composite material heat sink coated with metal titanium-copper layer and preparation method thereof - Google Patents
Diamond/copper composite material heat sink coated with metal titanium-copper layer and preparation method thereof Download PDFInfo
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- CN114540765A CN114540765A CN202011337089.2A CN202011337089A CN114540765A CN 114540765 A CN114540765 A CN 114540765A CN 202011337089 A CN202011337089 A CN 202011337089A CN 114540765 A CN114540765 A CN 114540765A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a diamond/copper composite material heat sink coated with a metal titanium-copper layer and a preparation method thereof, belonging to the technical field of heat management materials. The diamond/copper composite material heat sink coated with the metal titanium-copper layer comprises the diamond/copper composite material heat sink, wherein a titanium layer and a copper layer are sequentially arranged on the surface of the heat sink from inside to outside, and the thickness of the titanium layer and the thickness of the copper layer are several micrometers to hundreds of micrometers. Firstly plating a titanium layer on the surface of the diamond/copper composite material heat sink through a vacuum micro-evaporation plating or magnetron sputtering process, then immersing the diamond/copper composite material heat sink into a copper or copper alloy solution, standing for a period of time, removing the diamond/copper composite material heat sink from the copper or copper alloy solution, and naturally cooling to obtain the diamond/copper composite material heat sink coated with the metal titanium-copper layer. The diamond/copper composite material heat sink prepared by the invention has the advantages of uniform surface metal layer, high bonding strength and low surface roughness, meets the welding requirement of subsequent engineering application, and can exert the excellent performance of high-heat-conducting materials more easily.
Description
Technical Field
The invention relates to a diamond/copper composite material heat sink coated with a metal titanium-copper layer and a preparation method thereof, belonging to the technical field of heat management materials.
Background
The diamond/copper composite material as a fourth generation electronic packaging material has the characteristics of high heat conductivity and low expansion, the heat conductivity of the material is higher than 550W/mK, and the density is lower than 5.0g/cm3The material is ideal heat dissipation material, but because the material contains harder diamond and softer copper phase, the surface roughness Ra of the processed device is difficult to reach within 1 micron, which greatly influences the spreading of solder in the later period. Nickel is generally chemically plated on the surface of the diamond/copper heat sink to improve surface roughness, but nickel is hard and not easy to be secondarily refined, and the most important nickel layer has low thermal conductivity. Therefore, the invention selects a composite plating process to solve the problems, and the layer of metal has the highest heat conductivity and is easy to carry out secondary processing, so that the purpose of reducing the surface roughness of the heat sink can be achieved through the secondary processing.
Disclosure of Invention
Aiming at the problems, the invention provides the diamond/copper composite material heat sink coated with the metal titanium-copper layer, the heat sink can be used for silver-copper brazing, the solder spreading performance is good, the penetration rate is high, the bonding strength is good, and the excellent heat dissipation performance of the heat sink is fully exerted.
The diamond/copper composite material heat sink coated with the metal titanium-copper layer comprises the diamond/copper composite material heat sink, wherein the surface of the heat sink is sequentially provided with the metal titanium layer and the copper layer from inside to outside, and the thicknesses of the metal titanium layer and the copper layer are several micrometers to hundreds of micrometers.
Further, the thickness of the titanium layer on the surface of the diamond/copper composite material heat sink coated with the metal titanium-copper layer is 1-5 microns, and the thickness of the copper layer is more than 10 microns; preferably 40-110 microns.
Further, the copper layer is a metal copper or copper alloy layer, and the copper alloy may be an alloy such as Cu-Ti, Cu-Cr, Cu-B, etc.
Further, the titanium layer is plated by vacuum micro-evaporation plating or magnetron sputtering process.
Furthermore, the diamond/copper composite material comprises 20-80% of diamond by volume, and the diamond particle size is 20-300 microns.
The preparation method of the diamond/copper composite material heat sink with the surface coated with the metal titanium-copper layer comprises the following steps:
(1) plating a titanium layer on the surface of the diamond/copper composite material heat sink by a vacuum micro-evaporation plating or magnetron sputtering process;
(2) immersing the heat sink sheet in the step (1) into the copper or copper alloy melt, standing for a period of time, and removing the heat sink sheet from the copper or copper alloy melt;
(3) and vertically placing the heat sink sheet removed from the molten metal, and naturally cooling to obtain the diamond/copper composite material heat sink sheet coated with titanium-copper on the surface.
The process steps of coating or plating the titanium layer and the copper layer in the above method are performed in a vacuum or inert gas atmosphere.
In the step (2), the temperature of the copper or copper alloy melt is 1100-1300 ℃; the immersion and standing time of the hot sinking piece in the copper or copper alloy melt is 20-40 min.
The invention has the advantages that the surface roughness is improved by coating titanium-copper on the surface of the diamond/copper composite material heat sink, the original surface roughness Ra can be reduced from 1 micron to the roughness lower than 0.5 micron, and the spreadability of the solder at the later stage is greatly improved, so that the penetration rate of a chip is improved, and the high heat conduction and heat dissipation performance of the diamond/copper composite material is fully exerted.
According to the invention, titanium is used for priming, the titanium and the diamond and copper phases in the diamond/copper composite material are well combined, the binding force between the metal layer and the diamond/copper substrate is improved through the Ti layer, and the Ti layer is easy to combine with the outer copper alloy; and can be easily combined with molten metal when copper or copper alloy is impregnated, and the bonding strength is high. Meanwhile, the selected copper element has high thermal conductivity, the influence of the plating layer on the thermal conductivity of the heat sink is greatly reduced, the copper is easy to process in the later period, and the finish of the processed surface is high.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a diamond/copper composite heat sink coated with a titanium-copper metal layer.
Fig. 2 is a schematic cross-sectional view of a diamond/copper composite heat sink coated with a metallic titanium-copper layer prepared in example 1.
Description of the main reference numerals:
1 diamond/copper composite material heat sink 2 titanium layer
3 copper or copper alloy layer
Detailed Description
As shown in figure 1, when the diamond/copper composite heat sink coated with the metal titanium-copper layer is prepared, firstly, the diamond/copper composite heat sink is coated with a titanium layer through vacuum micro-evaporation plating or magnetron sputtering, and the thickness of the titanium layer is controlled to be between 1 and 5 microns. And then immersing the diamond/copper composite heat sink with the titanium layer into the molten copper or copper alloy, controlling the plating thickness of the copper or copper alloy by adjusting the temperature and the immersion time of the molten liquid, wherein the plating thickness is more than 10 microns, removing the heat sink out of the molten metal, vertically placing the heat sink, and naturally cooling to obtain the diamond/copper composite heat sink coated with the metal titanium-copper layer. The entire plating process is performed in vacuum or inert gas. Wherein the copper alloy can be Cu-Ti, Cu-Cr, Cu-B and other alloys.
As shown in fig. 2, the diamond/copper composite heat sink coated with a metallic titanium-copper layer according to the present invention is composed of a diamond/copper composite heat sink 1 with high thermal conductivity, a coated titanium layer 2 and a copper or copper alloy layer 3. The diamond/copper composite material heat sink has optional shape and thickness, the titanium layer has thickness of 1-5 microns, and the copper or copper alloy has thickness greater than 10 microns.
Example 1:
selecting a diamond/copper composite material heat sink of 10 x 1, plating titanium on the surface of the heat sink by adopting a vacuum micro-evaporation plating process, wherein the thickness of a titanium layer is 1 micron, then immersing a heat sink sheet into a copper Cu-B melt which is vacuum smelted, keeping stand for 30min at the temperature of 1100 ℃, removing the melt, vertically placing, naturally cooling, and plating a copper layer with the thickness of 100-110 microns. The surface of the diamond/copper composite material heat sink coated with the metal titanium-copper layer can be finely polished for the second time, and the surface Ra is less than 0.2 micrometer.
Example 2:
selecting a 10 x 2 diamond/copper composite material heat sink, plating titanium on the surface of the heat sink by adopting a magnetron sputtering process, wherein the thickness of a titanium layer is 1.5 microns, then immersing a heat sink sheet into a copper melt which is smelted in vacuum, keeping the temperature of the copper melt at 1200 ℃, standing for 20min, vertically placing the heat sink sheet after the melt is removed, and naturally cooling the heat sink sheet, wherein the thickness of a plated copper layer is 50-55 microns. The obtained diamond/copper composite material coated with the metal titanium-copper layer has high surface smoothness, and Ra is less than 0.4 micrometer.
Example 3:
selecting a 140 x 32 x 2 diamond/copper composite material heat sink, plating titanium on the surface of the heat sink by a vacuum micro-evaporation plating process, wherein the thickness of a titanium layer is 4 microns, then immersing a heat sink sheet into a Cu-Cr melt liquid which is vacuum smelted, keeping stand for 40min at the temperature of 1250 ℃, vertically placing after removing the melt liquid, and naturally cooling, wherein the thickness of the plated copper layer is 60-70 microns. After the secondary fine polishing of the surface of the diamond/copper composite material heat sink coated with the metal titanium-copper layer, Ra is less than 0.2 micrometer.
Example 4:
selecting a diamond/copper composite material heat sink of 20 x 10 x 1.5, plating titanium on the surface of the heat sink by adopting a magnetron sputtering process, wherein the thickness of a titanium layer is 2 microns, then immersing a heat sink sheet into a Cu-Ti melt which is smelted in vacuum, keeping the temperature of the copper melt at 1300 ℃, standing for 20min, removing the melt, vertically placing, and naturally cooling, wherein the thickness of a plated copper layer is 40-50 microns. The obtained diamond/copper composite material coated with the metal titanium-copper layer has high surface smoothness, and Ra is less than 0.3 micrometer.
The diamond/copper heat sink surface of the present invention is coated with a metallic titanium layer and a copper layer with a thickness of several microns to several hundred microns. Firstly plating a titanium layer on the surface of the diamond/copper composite heat sink by a vacuum micro-evaporation plating or magnetron sputtering process, then immersing the diamond/copper composite heat sink into copper or copper alloy melt, moving the diamond/copper composite heat sink out of the copper or copper alloy melt after standing for a period of time, and naturally cooling to obtain the diamond/copper composite heat sink coated with the metal titanium-copper layer. The diamond/copper composite material heat sink prepared by the invention has the advantages of uniform surface metal layer, high bonding strength and low surface roughness, meets the welding requirement of subsequent engineering application, and can exert the excellent performance of high-heat-conducting materials more easily.
Claims (10)
1. A diamond/copper composite heat sink coated with a metal titanium-copper layer is characterized in that: the diamond/copper composite heat sink comprises a diamond/copper composite heat sink, wherein a titanium layer and a copper layer are sequentially arranged on the surface of the heat sink from inside to outside, and the thickness of the titanium layer and the copper layer is several micrometers to hundreds of micrometers.
2. The diamond/copper composite heat sink coated with metallic titanium-copper layer as recited in claim 1 wherein: the thickness of the titanium layer is 1-5 microns, and the thickness of the copper layer is more than 10 microns.
3. The diamond/copper composite heat sink coated with metallic titanium-copper layer as recited in claim 2 wherein: the thickness of the copper layer is 40-110 microns.
4. The diamond/copper composite heat sink coated with metallic titanium-copper layer as recited in claim 3 wherein: the copper layer is a metal copper or copper alloy layer.
5. The diamond/copper composite heat sink coated with metallic titanium-copper layer as recited in claim 4 wherein: the copper alloy is Cu-Ti, Cu-Cr or Cu-B alloy.
6. The diamond/copper composite heat sink coated with metallic titanium-copper layer as recited in claim 1 wherein: the titanium layer is plated through a vacuum micro-evaporation plating or magnetron sputtering process.
7. The method of fabricating a titanium-copper metal coated diamond/copper composite heat sink as in claims 1-6, comprising the steps of:
(1) plating a titanium layer on the surface of the diamond/copper composite material heat sink by a vacuum micro-evaporation plating or magnetron sputtering process;
(2) immersing the heat sink in the step (1) into the copper or copper alloy melt, standing for a period of time, and removing the heat sink from the copper or copper alloy melt;
(3) and vertically placing the heat sink removed from the molten metal, and naturally cooling to obtain the diamond/copper composite material heat sink sheet coated with titanium-copper on the surface.
8. The method of claim 7 wherein the diamond/copper composite heat sink having a titanium-copper coated metal layer is prepared by: the process for preparing the titanium layer and the copper layer is performed in a vacuum or inert gas atmosphere.
9. The method of claim 7 wherein the diamond/copper composite heat sink having a titanium-copper coated metal layer is prepared by: the temperature of the copper or copper alloy melt is 1100-1300 ℃.
10. The method of claim 7 wherein the diamond/copper composite heat sink having a titanium-copper coated metal layer is prepared by: the heat sink is immersed in the copper or copper alloy melt for 20-40 min.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011337089.2A CN114540765A (en) | 2020-11-25 | 2020-11-25 | Diamond/copper composite material heat sink coated with metal titanium-copper layer and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011337089.2A CN114540765A (en) | 2020-11-25 | 2020-11-25 | Diamond/copper composite material heat sink coated with metal titanium-copper layer and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101768706A (en) * | 2010-01-05 | 2010-07-07 | 北京科技大学 | Preparation method of diamond particle reinforced copper-based composite material parts with high volume fraction |
| JP2013098491A (en) * | 2011-11-04 | 2013-05-20 | Sumitomo Electric Ind Ltd | Heat sink, method of manufacturing heat sink, semiconductor device and semiconductor module |
| CN103276265A (en) * | 2013-06-09 | 2013-09-04 | 北京科技大学 | Method for preparing free-standing diamond film-diamond particles-metallic composite material |
| CN206799715U (en) * | 2017-05-24 | 2017-12-26 | 西安炬光科技股份有限公司 | A kind of metallization structure of diamond particles enhancing metal-base composites |
| CN110690122A (en) * | 2019-10-12 | 2020-01-14 | 合肥圣达电子科技实业有限公司 | Processing method of metal shell for packaging electronic component |
-
2020
- 2020-11-25 CN CN202011337089.2A patent/CN114540765A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101768706A (en) * | 2010-01-05 | 2010-07-07 | 北京科技大学 | Preparation method of diamond particle reinforced copper-based composite material parts with high volume fraction |
| JP2013098491A (en) * | 2011-11-04 | 2013-05-20 | Sumitomo Electric Ind Ltd | Heat sink, method of manufacturing heat sink, semiconductor device and semiconductor module |
| CN103276265A (en) * | 2013-06-09 | 2013-09-04 | 北京科技大学 | Method for preparing free-standing diamond film-diamond particles-metallic composite material |
| CN206799715U (en) * | 2017-05-24 | 2017-12-26 | 西安炬光科技股份有限公司 | A kind of metallization structure of diamond particles enhancing metal-base composites |
| CN110690122A (en) * | 2019-10-12 | 2020-01-14 | 合肥圣达电子科技实业有限公司 | Processing method of metal shell for packaging electronic component |
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