CN112077423A - Diffusion bonding method of aluminum magnesium alloy - Google Patents
Diffusion bonding method of aluminum magnesium alloy Download PDFInfo
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- CN112077423A CN112077423A CN202010864446.4A CN202010864446A CN112077423A CN 112077423 A CN112077423 A CN 112077423A CN 202010864446 A CN202010864446 A CN 202010864446A CN 112077423 A CN112077423 A CN 112077423A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K10/00—Welding or cutting by means of a plasma
- B23K10/02—Plasma welding
Abstract
The invention provides a diffusion bonding method of aluminum magnesium alloy, which comprises the following steps: and placing the Al-Cu-Si-Ni brazing filler metal layer between the two aluminum-magnesium alloys, and performing diffusion connection by adopting a spark plasma sintering process to obtain the aluminum-magnesium alloy connecting joint with a diffusion reaction layer. The diffusion bonding method of the aluminum magnesium alloy can be used for solving the problems of low joint strength, difficult precision control and low production efficiency in the existing aluminum magnesium alloy welding technology.
Description
Technical Field
The invention relates to the technical field of material welding, in particular to a diffusion bonding method of aluminum magnesium alloy.
Background
The aluminum-magnesium alloy has the characteristics of small specific gravity, high specific strength, good corrosion resistance, damage resistance and the like, and is one of the most ideal high-strength structural materials for aerospace, automobiles, ships and weaponry. For example, the materials of the radar waveguide cavity, the radiation plate and the micro-channel heat exchanger are all aluminum magnesium alloy such as 5A 06. The welding and manufacturing of the complex precise structure not only has the requirements of high strength, high reliability and high stability, but also needs to control the welding deformation within a strict range to meet the telecommunication transmission function with high precision, so that the development of a reliable aluminum magnesium alloy precise connection technology becomes a key problem to be solved urgently in application.
At present, the radar waveguide precision welding process is mainly vacuum brazing and diffusion welding. However, the aluminum alloy belonging to group 5, aluminum alloy 5a06, is one of the aluminum alloys that is the worst in suitability for vacuum brazing and diffusion welding. On one hand, because the vacuum brazing and diffusion welding time is long, magnesium in the base material is seriously volatilized in a vacuum environment, and the long-time high-temperature heat preservation can also cause the recrystallization, excessive growth or overburning of crystal grains, so that the structure performance of the base material is deteriorated; on the other hand, because the melting point of the base material is lower, the optional brazing filler metal component window is narrower, and the base material can be dissolved into the brazing filler metal in the brazing process; secondly, because of the high magnesium content, the interface to be welded is easy to form compact and stable Al2O3In addition to the oxide film, a continuous and denser MgO oxide film is easily formed. Because the thermal expansion coefficients of the oxide film and the aluminum alloy substrate are different, the oxide film can be broken under the action of thermal coupling, but the 5-series aluminum alloy has low strength and good plasticity, and the local interface stress of diffusion welding is lower compared with that of the 6-series aluminum alloy which can be processed and reinforced, and the oxide film is more difficult to break, so that atomic diffusion and metallurgical bonding are seriously hindered, the joint strength is low, the vibration reliability is poor, and the reliability is obviously insufficient when the aluminum alloy is used in an airborne missile-borne environment. Therefore, the welding process is strictly controlled or a novel welding process is developed, and the brazing filler metal which is suitable for the service environment and meets the requirements on wettability and strong plasticity is designedThe interlayer, which cleans the oxide film based on the dual principles of physics and chemistry, is a development trend for realizing the precision welding of 5A06 aluminum alloy.
The radar waveguide structure welding needs to solve the problem of poor weldability of aluminum magnesium alloys such as 5A06, and the like, and also relates to the technical and structural problems. In the brazing process, a thicker brazing filler metal layer is spread on a welding seam connecting surface and forms a fillet at the edge of the welding seam, so that the problems of poor precision control, flowing brazing filler metal to block a channel, large microwave loss and the like exist; in the vacuum diffusion welding process, in order to realize sufficient interface atomic diffusion and metallurgical bonding, the high-temperature pressure maintaining for several hours leads to serious plastic deformation and even creep deformation of a welding structural part, and the contradiction between the control of joint deformation and the improvement of the interface bonding rate is difficult to coordinate.
With the development of a new generation of millimeter wave radar, the strict requirements of a millimeter wave waveguide precision structure on welding quality are further highlighted, and therefore, the bottlenecks of low production efficiency and low joint quality of vacuum brazing and diffusion welding of aluminum magnesium alloys such as 5A06 and the like are urgently needed to be broken through.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
Based on the technical problems in the background art, the invention provides an aluminum magnesium alloy diffusion connection method which can be used for solving the problems of low joint strength, difficulty in precision control and low production efficiency in the existing aluminum magnesium alloy welding technology such as 5A 06.
The invention provides a diffusion bonding method of aluminum magnesium alloy, which comprises the following steps: and placing the Al-Cu-Si-Ni brazing filler metal layer between the two aluminum-magnesium alloys, and performing diffusion connection by adopting a spark plasma sintering process to obtain the aluminum-magnesium alloy connecting joint with a diffusion reaction layer.
In the invention, the diffusion connection is carried out by the spark plasma sintering process, so that the method has the advantages of uniform heating, high temperature rise speed, low sintering temperature, short sintering time, high production efficiency, fine and uniform product structure and capability of keeping the natural state of raw materials, and finally, the high-density material can be obtained, and gradient materials and complex workpieces can be sintered.
The vacuum degree limit of the discharge plasma sintering furnace process can only reach 20Pa, and the vacuum degree limit can not meet the requirement of the aluminum-magnesium alloy welding of 5A06 and the like on high vacuum degree (1 multiplied by 10)-3MPa or less), in the present invention, the Al-Cu-Si-Ni brazing filler metal can assist in suppressing and removing the formation of a dense oxide film on the surface of an aluminum-magnesium alloy such as 5a 06. On one hand, under the brazing temperature of the spark plasma sintering process, the wettability of the molten brazing filler metal and the base metal is good, and the brazing filler metal is melted and flows to cover the surface of the base metal to play a role in isolation and protection; on the other hand, due to the fact that the thermal expansion coefficients of an aluminum magnesium alloy matrix such as 5A06 and the like and an oxide film are different, micro cracks generated inside the oxide film are loosened and broken under the combined action of welding thermal stress and loading stress of a spark plasma sintering process, the liquid brazing filler metal has adsorption and dissolution effects on the loosened oxide film, the brazing filler metal spreads on a base metal to enable the oxide film to float, and the brazing filler metal flows out of a welding line along with the melted brazing filler metal under the action of loading pressure.
In the invention, the Al-Cu-Si-Ni brazing filler metal layer is Al-Cu-Si ternary eutectic brazing filler metal, and CuAl is formed after the brazing filler metal is solidified2The phase and the Si particle phase can improve the strength of the joint, and Ni element which is infinitely miscible with Cu is added to change CuAl2The content and the form of intermetallic compounds are reduced, and CuAl is reduced2The resulting brittleness of the joint makes the joint stable in performance. In the invention, the Al-Cu-Si-Ni brazing filler metal is used to ensure that the connecting joint has the similar thermal mechanical property with the parent metal, thereby reducing the residual stress between the connecting joint and the parent metal and avoiding the formation of microcracks of the joint. Meanwhile, the brazing filler metal does not contain volatile elements, and is suitable for welding in a protective atmosphere furnace or in vacuum.
Preferably, the solid phase temperature of the Al-Cu-Si-Ni solder layer is 510-530 ℃, and the liquid phase temperature is 530-550 ℃.
Preferably, the chemical composition of the Al-Cu-Si-Ni solder layer is as follows: cu 18-22 wt%, Si4-6 wt%, Ni 1-3 wt%, and Al for the rest.
Preferably, the thickness of the Al-Cu-Si-Ni solder layer is 100-200 μm.
Preferably, in the diffusion bonding process, the vacuum degree is not higher than 50Pa, and the loading pressure is 0.3-6 MPa.
Preferably, in the diffusion bonding process, the heating rate is 30-50 ℃/min, the sintering temperature is 500-.
Preferably, in the diffusion bonding process, the cooling rate is 30-50 ℃/min.
In the present invention, the sintering temperature is selected to be 500-560 ℃ because the Al-Cu-Si-Ni solder layer is in an unmelted, partially melted and completely melted state under the conditions. When the brazing material is not melted, the method belongs to discharge plasma diffusion welding, an interface oxide film is purified through a plasma surface activation effect, atomic diffusion at an interface is induced through an electromigration effect and component gradient of the intermediate layer and a base material, and further contact resistance and Joule heat generation at the interface can be increased by means of the intermediate layer. When the intermediate layer material is completely melted, the method belongs to discharge plasma instantaneous liquid phase diffusion welding, the intermediate layer material has the functions of wetting a parent metal to hinder the growth of an oxide film, inducing atomic diffusion and generating alpha-Al + beta-Si + theta-Al through ternary eutectic reaction2The Cu strengthening phase.
Preferably, before diffusion bonding, the method further comprises the step of carrying out surface treatment on the surface to be bonded of the aluminum magnesium alloy and the surface to be bonded of the Al-Cu-Si-Ni solder layer, and removing an oxidation film and oil stains.
Preferably, the surface treatment specifically comprises: sequentially grinding, polishing, alkali washing, acid washing, ultrasonic cleaning and coating an active agent on the surface to be connected of the aluminum-magnesium alloy;
preferably, metallographic abrasive paper of 400#, 800#, 1000# and 1500# is sequentially adopted to polish the surface to be connected of the aluminum-magnesium alloy;
preferably, diamond grinding and polishing suspension with the grain diameter of 1-3.5 microns is adopted to polish the surface to be connected of the aluminum-magnesium alloy;
preferably, 5 wt% NaOH solution is adopted to carry out alkali washing on the surface to be connected of the aluminum-magnesium alloy, wherein the alkali washing time is 30 s;
preferably, HNO is used in a concentration of 30 wt%3Pickling the surface to be connected of the aluminum-magnesium alloy with the solution for 3 min;
preferably, ultrasonic cleaning is carried out on the surface to be connected of the aluminum-magnesium alloy by adopting an alcohol solution;
preferably, a diethylene glycol dimethyl ether active agent is adopted to coat the surface to be connected of the aluminum magnesium alloy;
in the invention, diethylene glycol dimethyl ether is coated on the surface of the parent metal before welding to play a role in inhibiting the growth of an oxide film.
The surface treatment specifically further comprises: sequentially grinding, polishing and ultrasonically cleaning the surface to be connected of the Al-Cu-Si-Ni solder layer;
preferably, metallographic abrasive paper of No. 400, No. 800 and No. 1000 is sequentially adopted to polish the surface to be connected of the Al-Cu-Si-Ni solder layer;
preferably, alcohol solution is adopted to polish the surface to be connected of the Al-Cu-Si-Ni solder layer;
preferably, the surface to be connected of the Al-Cu-Si-Ni solder layer is ultrasonically cleaned by adopting alcohol solution.
The diffusion bonding method of the aluminum magnesium alloy specifically comprises the following steps:
s1, sequentially grinding, polishing, alkali washing, acid washing, ultrasonic cleaning and coating an active agent on the surface to be connected of the aluminum-magnesium alloy to obtain the aluminum alloy to be connected; processing the Al-Cu-Si-Ni brazing filler metal into a shape matched with the surface to be connected of the aluminum-magnesium alloy, and sequentially grinding, polishing and ultrasonically cleaning to obtain an Al-Cu-Si-Ni brazing filler metal layer;
s2, assembling the two aluminum magnesium alloys to be connected and the Al-Cu-Si-Ni solder layers into a graphite mold according to the sequence of the aluminum magnesium alloy to be connected/the Al-Cu-Si-Ni solder layer/the aluminum magnesium alloy to be connected, then placing the assembled graphite mold into a discharge plasma sintering furnace, vacuumizing the sintering furnace at room temperature, loading to a preset pressure, heating to a sintering temperature, keeping the temperature and pressure, cooling and unloading to obtain the aluminum magnesium alloy connecting joint with the diffusion reaction layer.
The invention also provides an aluminum magnesium alloy connecting joint, which comprises: the aluminum-magnesium alloy diffusion reaction layer is formed by diffusion connection of two aluminum-magnesium alloys through an Al-Cu-Si-Ni brazing filler metal layer by a spark plasma sintering process.
Compared with the aluminum-magnesium alloy vacuum brazing using the Al-Cu-Si-Ni brazing filler metal, the diffusion connection method of the aluminum-magnesium alloy provided by the invention applies certain pressure by adopting a discharge plasma sintering furnace process, promotes the wetting and spreading of the brazing filler metal, and reduces the thickness of a brazing filler metal layer. Because the hardness (strength) of the brazing filler metal is lower than that of the base metal, the strength of the joint corresponding to a thin brazing layer is higher, and therefore the joint with better welding rate and joint mechanical property is obtained.
And according to the electromigration theory, the assistance of the current has a promoting effect on the atomic diffusion of the base metal and the brazing filler metal layer, so that the complete disappearance of the interface holes can be ensured in relatively low connection temperature and short heat preservation time. As seen from the joint structure, finer crystal grains are formed at the interface between the solidified crystals of the brazing filler metal layer and the base material, and it is considered that dynamic recrystallization is caused by thermoplastic deformation at this position. Due to the fact that the electric field accelerates atomic diffusion, the movement of dynamic recrystallization dislocation and the growth process of crystal grains are accelerated.
In conclusion, it can be seen that the welding time of the present invention is greatly shortened and CuAl is suppressed as compared with vacuum brazing and vacuum diffusion welding2The excessive growth of the intermetallic compound can not cause the thickening of the oxide layer of the connecting interface and the degradation of the texture and the performance such as the coarsening of crystal grains and the like of the parent metal due to long-term heating.
Finally, the thickness of the middle layer of the connecting joint obtained by the invention is only 20-50 μm, the highest tensile strength reaches 220MPa, and the joint deformation is very small. Therefore, the method solves the problems of low strength of the aluminum magnesium alloy vacuum brazing joint such as 5A06 and the like, large energy consumption, large deformation, material structure performance degradation and the like caused by long vacuum diffusion welding connection time, and greatly improves the connection quality and the production efficiency.
Drawings
FIG. 1 is a schematic view of a mold assembly and a subsequent process test flow chart;
FIG. 2 is a view of a diffusion weld object;
FIG. 3 is a graph of temperature and head displacement over time for a 5A06 aluminum alloy diffusion bonding process;
FIG. 4 is an electron microscope image of the interface of the connecting joint in example 1 of the present invention;
FIG. 5 is an electron microscope image of the interface of the connecting joint in example 2 of the present invention;
FIG. 6 is an electron microscope image of the interface of the connecting joint in example 3 of the present invention;
FIG. 7 is an electron microscope image of the interface of the connecting joint in example 4 of the present invention;
FIG. 8 is an electron microscope image of the interface of the connecting joint in example 5 of the present invention.
Detailed Description
Hereinafter, the technical solution of the present invention will be described in detail by specific examples, but these examples should be explicitly proposed for illustration, but should not be construed as limiting the scope of the present invention.
Example 1
A method of diffusion bonding a 5a06 aluminum alloy, comprising:
s1, cutting the 5A06 aluminum alloy material into a 5A06 aluminum alloy cylindrical sample with the diameter of 9.8mm and the height of 10mm by using an electric spark wire, and sequentially grinding the surface to be connected of the sample by using dry grinding abrasive paper of No. 400, No. 800, No. 1000 and No. 1500 until the roughness of the surface to be connected is below Ra1.6; polishing with diamond grinding and polishing suspension with particle size of 1.5 μm to obtain bright surface, washing the polished sample with alkali in 5 wt% NaOH solution for 30s, and adding 30 wt% HNO3Cleaning the surface with the solution for 3min until the surface is bright, then ultrasonically cleaning the surface with an alcohol solution, drying the surface at room temperature, coating the surface to be connected of the sample with diethylene glycol dimethyl ether, and drying the surface at room temperature to obtain 5A06 aluminum alloy to be connected;
s2, cutting Al-Cu-Si-Ni brazing filler metal (the chemical composition is Cu 20 wt%, Si 5 wt%, Ni 2 wt% and the balance is Al) into wafers with the diameter of 9.8mm and the thickness of 150 mu m by laser, sequentially grinding 400#, 800# and 1000# dry abrasive paper on the wafers, polishing the two sides of the wafers by using an alcohol solution, then putting the wafers into the alcohol solution for ultrasonic cleaning, and drying the wafers at room temperature to obtain a brazing filler metal intermediate layer;
s3, referring to the die assembly diagram shown in FIG. 1, assembling two to-be-connected 5A06 aluminum alloy and brazing filler metal interlayers into a graphite die according to the sequence of graphite punch-graphite gasket-to-be-connected 5A06 aluminum alloy-brazing filler metal interlayer-to-be-connected 5A06 aluminum alloy-graphite gasket-graphite punch, and then putting the assembled die into a discharge plasma sintering furnace; adjusting the loading pressure to 0.3MPa (100N), pumping the vacuum degree in the furnace to 20Pa, and performing discharge plasma diffusion connection, wherein the parameters of the operation program of the control equipment are set as follows: heating to 520 ℃ at a heating rate of 40 ℃/min, preserving heat for 10min, then cooling along with the furnace to a temperature of less than or equal to 50 ℃ in the furnace cavity, and taking out the graphite mold to obtain the 5A06 aluminum alloy diffusion connection joint, wherein in the discharge plasma diffusion connection process, the temperature measurement of the thermocouple and the pressure head displacement curve are shown in figure 3.
The present example realizes the rapid formation of a welding interface by the effective combination of the low melting point intermediate layer and the spark plasma sintering surface activation, thereby obtaining a 5a06 aluminum alloy diffusion bonded joint, the electron micrograph of the interface of which is shown in fig. 4, and the result shows that the joint is not welded locally.
Joint tensile testing was performed using a model CMT5105 universal tester. Processing the welded joint into a shape shown in figure 1, wherein the gauge length of a tensile sample is 6mm, the thickness and the width are both 2mm, sequentially grinding 400#, 800# and 1000# dry grinding abrasive paper to polish the two sides of the welded joint until the two sides of the welded joint show silvery white metallic luster, and stretching at the speed of 0.5mm/min to finally obtain the joint with the tensile strength of 30 MPa.
Example 2
A diffusion bonding method of 5A06 aluminum alloy is the same as that of example 1, except that in step S3, the loading pressure is adjusted to 0.3MPa (100N), the degree of vacuum in the furnace is pumped to 20Pa to perform discharge plasma diffusion bonding, and the parameters for controlling the operation program of the apparatus are set as follows: raising the temperature to 530 ℃ at the heating rate of 40 ℃/min, preserving the heat for 10min, then cooling along with the furnace until the temperature in the furnace cavity is less than or equal to 50 ℃, and taking out the graphite mold to obtain the 5A06 aluminum alloy diffusion connection joint.
An electron micrograph of the 5a06 aluminum alloy diffusion bonded joint interface obtained in this example is shown in fig. 5, and the result shows that the local interface is not bonded. The test shows that the tensile strength of the joint is 90 MPa.
Example 3
A diffusion bonding method of 5A06 aluminum alloy, which is the same as in example 1, except that in step S3, the loading pressure is adjusted to 0.3MPa (100N), the degree of vacuum in the furnace is pumped to 20Pa, and the discharge plasma diffusion bonding is performed, and the parameters for controlling the operation program of the apparatus are set as follows: raising the temperature to 540 ℃ at the heating rate of 40 ℃/min, preserving the heat for 10min, then cooling along with the furnace until the temperature in the furnace cavity is less than or equal to 50 ℃, and taking out the graphite mold to obtain the 5A06 aluminum alloy diffusion connection joint.
An electron microscope image of the 5a06 aluminum alloy diffusion bonded joint interface obtained in this example is shown in fig. 6, and the result shows that the welding rate is relatively low. The test shows that the tensile strength of the joint is 120 MPa.
Example 4
A diffusion bonding method of 5A06 aluminum alloy, which is the same as in example 1, except that in step S3, the loading pressure is adjusted to 6MPa (2000N), the degree of vacuum in the furnace is pumped to 20Pa, and the discharge plasma diffusion bonding is performed, and the parameters of the control equipment operation program are set as follows: raising the temperature to 540 ℃ at the heating rate of 40 ℃/min, preserving the heat for 10min, then cooling along with the furnace until the temperature in the furnace cavity is less than or equal to 50 ℃, and taking out the graphite mold to obtain the 5A06 aluminum alloy diffusion connection joint.
An electron microscope image of the interface of the 5a06 aluminum alloy diffusion bonded joint obtained in this example is shown in fig. 7, and the result shows that the intermetallic compound phase content at the interface layer of the brazing filler metal is high, the dispersion distribution is fine, no holes exist at the interface, the welding is good, and the crystal grains inside the brazing filler metal are broken and plastically deformed under the action of pressure, and the fine crystal grains of several micrometers appear. The joint tensile strength was determined to be 229 MPa.
Example 5
A diffusion bonding method of 5A06 aluminum alloy is the same as that of example 1, except that in step S3, the loading pressure is adjusted to 4MPa (1300N), the degree of vacuum in the furnace is pumped to 20Pa, and the discharge plasma diffusion bonding is performed, and the parameters of the control equipment operation program are set as follows: raising the temperature to 550 ℃ at the heating rate of 40 ℃/min, preserving the heat for 10min, then cooling along with the furnace until the temperature in the furnace cavity is less than or equal to 50 ℃, and taking out the graphite mold to obtain the 5A06 aluminum alloy diffusion connection joint.
An electron micrograph of the 5a06 aluminum alloy diffusion bonded joint interface obtained in this example is shown in fig. 8, and the results show that there is no local weld. The test shows that the tensile strength of the joint is 77 MPa.
Referring to examples 1 to 5, the present invention realizes diffusion bonding of 5a06 aluminum alloy having an Al — Cu — Si — Ni brazing filler metal as an intermediate layer by current-assisted diffusion welding in a short time. The brazing filler metal intermediate layer has the similar thermal physical property and the similar thermal expansion coefficient with the base metal, thereby avoiding the generation of cracks and having good interface connection effect. The solder has good wettability, can inhibit the generation of an oxide film in the welding process, and avoids the oxide film from obstructing the diffusion bonding process. The effect of improving the welding rate and the performance of the joint can be achieved by adjusting the diffusion bonding process parameters, the middle layer becomes thinner as the welding temperature rises, the middle layer is thickest at 520 ℃ but only about 40-50 mu m, the interface is completely welded at the optimal temperature of 540 ℃ and the optimal pressure of 6MPa, and the joint strength reaches 229MPa and exceeds the yield strength of 5A06 aluminum alloy. The invention can prepare the complex 5A06 aluminum alloy connecting piece with high strength and small deformation, and solves the problem of difficult welding of the 5A06 aluminum alloy precision structure.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. A diffusion bonding method of an aluminum magnesium alloy, comprising: and placing the Al-Cu-Si-Ni brazing filler metal layer between the two aluminum-magnesium alloys, and performing diffusion connection by adopting a spark plasma sintering process to obtain the aluminum-magnesium alloy connecting joint with a diffusion reaction layer.
2. The method of claim 1, wherein the Al-Cu-Si-Ni solder layer has a solidus temperature of 510-530 ℃ and a liquidus temperature of 530-550 ℃.
3. The diffusion bonding method of an aluminum-magnesium alloy according to claim 1 or 2, wherein the Al-Cu-Si-Ni solder layer has a chemical composition of: cu 18-22 wt%, Si4-6 wt%, Ni 1-3 wt%, and Al for the rest.
4. The diffusion bonding method of aluminum magnesium alloy according to any of claims 1 to 3, wherein the thickness of the Al-Cu-Si-Ni solder layer is 100-200 μm.
5. The diffusion bonding method of an aluminum-magnesium alloy according to any one of claims 1 to 4, wherein a degree of vacuum is not higher than 50Pa and a load pressure is 0.3 to 6MPa during the diffusion bonding.
6. The diffusion bonding method of Al-Mg alloy according to any of claims 1-5, wherein the temperature rise rate is 30-50 ℃/min, the sintering temperature is 500-560 ℃, and the holding time is 5-10 min.
7. The diffusion bonding method of an aluminum-magnesium alloy according to any one of claims 1 to 6, wherein a temperature decrease rate is 30 to 50 ℃/min during the diffusion bonding.
8. A diffusion bonding method of Al-Mg alloy according to any one of claims 1 to 7, further comprising surface treatment of the surface to be bonded of Al-Mg alloy and the surface to be bonded of Al-Cu-Si-Ni solder layer to remove oxide film and oil stains before diffusion bonding.
9. The diffusion bonding method of an aluminum-magnesium alloy according to claim 8, wherein the surface treatment specifically includes: sequentially grinding, polishing, alkali washing, acid washing, ultrasonic cleaning and coating an active agent on the surface to be connected of the aluminum-magnesium alloy;
preferably, metallographic abrasive paper of 400#, 800#, 1000# and 1500# is sequentially adopted to polish the surface to be connected of the aluminum-magnesium alloy;
preferably, diamond grinding and polishing suspension with the grain diameter of 1-3.5 microns is adopted to polish the surface to be connected of the aluminum-magnesium alloy;
preferably, 5 wt% NaOH solution is adopted to carry out alkali washing on the surface to be connected of the aluminum-magnesium alloy, wherein the alkali washing time is 30 s;
preferably, HNO is used in a concentration of 30 wt%3Pickling the surface to be connected of the aluminum-magnesium alloy with the solution for 3 min;
preferably, ultrasonic cleaning is carried out on the surface to be connected of the aluminum-magnesium alloy by adopting an alcohol solution;
preferably, a diethylene glycol dimethyl ether active agent is adopted to coat the surface to be connected of the aluminum magnesium alloy;
the surface treatment specifically further comprises: sequentially grinding, polishing and ultrasonically cleaning the surface to be connected of the Al-Cu-Si-Ni solder layer;
preferably, metallographic abrasive paper of No. 400, No. 800 and No. 1000 is sequentially adopted to polish the surface to be connected of the Al-Cu-Si-Ni solder layer;
preferably, alcohol solution is adopted to polish the surface to be connected of the Al-Cu-Si-Ni solder layer;
preferably, the surface to be connected of the Al-Cu-Si-Ni solder layer is ultrasonically cleaned by adopting alcohol solution.
10. An aluminum magnesium alloy attach fitting, comprising: the aluminum-magnesium alloy diffusion reaction layer is formed by diffusion connection of two aluminum-magnesium alloys through an Al-Cu-Si-Ni brazing filler metal layer by a spark plasma sintering process.
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| CN113857479A (en) * | 2021-09-15 | 2021-12-31 | 浙江大学 | Preparation method of titanium metal component based on powder injection molding |
| CN114012235A (en) * | 2021-11-02 | 2022-02-08 | 贵州永红航空机械有限责任公司 | Diffusion welding method for TA2 material microchannel radiator |
| CN115255606A (en) * | 2022-06-21 | 2022-11-01 | 北京科技大学 | Copper and graphite diffusion bonding method containing aluminum interlayer |
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| CN113857479A (en) * | 2021-09-15 | 2021-12-31 | 浙江大学 | Preparation method of titanium metal component based on powder injection molding |
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| CN115255606B (en) * | 2022-06-21 | 2023-07-25 | 北京科技大学 | Diffusion connection method for copper and graphite of aluminum-containing intermediate layer |
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