CN114538107A - Automatic chip tray moving device and tray moving method thereof - Google Patents
Automatic chip tray moving device and tray moving method thereof Download PDFInfo
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- CN114538107A CN114538107A CN202210050539.2A CN202210050539A CN114538107A CN 114538107 A CN114538107 A CN 114538107A CN 202210050539 A CN202210050539 A CN 202210050539A CN 114538107 A CN114538107 A CN 114538107A
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- 239000000463 material Substances 0.000 claims description 15
- 230000000694 effects Effects 0.000 claims description 4
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- 230000008569 process Effects 0.000 abstract description 2
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- 238000005859 coupling reaction Methods 0.000 description 2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
Abstract
The invention discloses an automatic chip tray moving device and a tray moving method thereof, and the automatic chip tray moving device comprises a workbench, wherein an industrial personal computer main body is fixedly arranged at the front part of the workbench, an X-axis main body is fixedly arranged at the rear part of the upper part of the workbench, a Z1 shaft assembly and a Z2 shaft assembly are respectively arranged at two sides of the front part of the X-axis main body, a Y1 shaft driving assembly is fixedly arranged at one side of the upper part of the workbench, a first tray carrying bracket is arranged at the upper part of a Y1 shaft driving assembly, a Y2 shaft driving assembly is fixedly arranged at the other side of the upper part of the workbench, a second tray carrying bracket is arranged at the upper part of a Y2 shaft driving assembly, and a first lower CCD positioning system and a second lower CCD positioning system are fixedly arranged at the upper part of the workbench. The automatic positioning tray moving device can automatically position and move trays through the Z1 shaft assembly and the Z2 shaft assembly under the positioning of a CCD positioning system, reduces the process moving path due to the structural design, is beneficial to improving the placing accuracy, can improve the processing efficiency, and is reasonable in structural design and compact in structure.
Description
Technical Field
The invention relates to the technical field of chips, in particular to an automatic chip tray moving device and a tray moving method thereof.
Background
English integrated circuit: integrated circuit, abbreviated IC; or microcircuits (microcircuits), microchips (microchips), and chips/chips (chips) are one way to miniaturize circuits (including primarily semiconductor devices, including passive components, etc.) in electronics, and are often fabricated on the surface of semiconductor wafers.
In the chip course of working, in order to cooperate the material loading requirement of different technologies, need shift the chip between the charging tray of difference, then continue processing, current shifter is difficult to guarantee to put the precision, and the complicated removal inefficiency of structure.
Disclosure of Invention
The present invention is directed to solving one of the technical problems of the prior art or the related art.
Therefore, the technical scheme adopted by the invention is as follows:
an automatic chip tray moving device comprises a workbench, an industrial personal computer main body is fixedly arranged at the front part of the workbench, an operating system is movably arranged at one side of the workbench, an X-axis main body is fixedly arranged at the rear part of the upper part of the workbench, a Z1 shaft assembly and a Z2 shaft assembly which can independently move along the X-axis direction are respectively arranged at two sides of the front part of the X-axis main body, a Y1 shaft driving assembly is fixedly arranged at one side of the upper part of the workbench, a first tray carrying bracket which can be driven by a Y1 shaft driving assembly to move along the Y-axis direction is arranged at the upper part of the Y1 shaft driving assembly, a Y2 shaft driving assembly is fixedly arranged at the other side of the upper part of the workbench, a second tray carrying bracket which can be driven by a Y2 shaft driving assembly to move along the Y-axis direction is arranged at the upper part of the Y2 shaft driving assembly, a first lower CCD positioning system and a second lower CCD positioning system are fixedly arranged at the upper part of the workbench, the Z1 comprises a Z1 shaft CCD positioning system, the Z2 axis assembly includes a Z2 axis CCD positioning system.
The present invention in a preferred example may be further configured to: the first lower CCD positioning system is positioned on one side of the first disc carrying bracket, and the second lower CCD positioning system is positioned on one side of the second disc carrying bracket;
the Z1 shaft assembly further comprises a first machine body arranged on one side of the front portion of the X shaft main body and a Z1 shaft suction head arranged on one side of the lower portion of the first machine body, the Z1 shaft CCD positioning system is arranged on the other side of the lower portion of the first machine body, and a first rotary driving piece for controlling the Z1 shaft suction head to rotate is arranged at the upper end of the Z1 shaft suction head;
z2 axle subassembly is still including installing in the anterior opposite side of X axle main part No. two organisms, setting up in the Z2 axle suction head of No. two organism lower part one sides, Z2 axle CCD positioning system sets up in No. two organism lower part opposite sides, the upper end of Z2 axle suction head is equipped with the rotatory No. two rotary driving spare of control Z2 axle suction head.
The present invention in a preferred example may be further configured to: y1 axle drive assembly and Y2 axle drive assembly locate on the workstation side by side, CCD positioning system locates between Y1 axle drive assembly and the Y2 axle drive assembly under a number, CCD positioning system locates one side that Y2 axle drive assembly kept away from Y1 axle drive assembly under No. two, and Z1 axle subassembly, Z2 axle subassembly, CCD positioning system and No. two lower CCD positioning system are located the coplanar.
The present invention in a preferred example may be further configured to: and rollers are movably arranged on four sides below the workbench.
The present invention in a preferred example may be further configured to: screw sleeves are fixedly connected to four sides of the lower portion of the workbench, screw rods are connected to the screw sleeves in an internal thread mode, and supporting plates are fixedly connected to the bottom ends of the screw rods.
The present invention in a preferred example may be further configured to: the X axle main part includes two X axle slide rails that extend along the X axle direction, sets up from top to bottom two X axle slide rails, Z1 axle subassembly and Z2 axle subassembly all with two X axle slide rail sliding connection.
The present invention in a preferred example may be further configured to: the Y1 axle drive assembly and the Y2 axle drive assembly both include Y axle lead screw, drive Y axle lead screw pivoted Y axle driving motor and two parallel arrangement's Y axle slide rail, year dish bracket No. one and No. two year dish brackets respectively with corresponding Y axle slide rail sliding connection to can be moved along the Y axle direction by the drive of corresponding Y axle lead screw.
The present invention in a preferred example may be further configured to: the side of the first disk carrying bracket and the side of the second disk carrying bracket are both provided with clamping components for fixing the disk carrying bracket.
The present invention in a preferred example may be further configured to: the clamping assembly comprises a clamping cylinder and an L-shaped clamping plate which is driven by the clamping cylinder to move up and down, and the clamping cylinder is arranged in an outward inclined mode.
The invention also provides an automatic chip tray moving method, which comprises the following steps:
step 100: placing a full-load tray loaded with chips on a tray carrier I, and conveying the tray carrier I to the position below a Z1 shaft component by a Y1 shaft driving component; placing the unloaded tray on a tray carrier II, and conveying the tray carrier II to the lower part of the Z2 shaft component by a Y2 shaft driving component;
step 200: a Z1-axis CCD positioning system is used for photographing and positioning a chip H1 to be taken out from a first disk carrier;
step 300: sucking the photographed chip H1 by the Z1 shaft suction head according to the positioning result of the Z1 shaft CCD positioning system;
step 400: the Z1 shaft assembly moves along the X-axis main body, so that the Z1 shaft suction head is positioned above the first lower CCD positioning system;
step 500: the first machine body controls the Z1 shaft suction head to move downwards, and a first CCD positioning system is used for photographing and positioning the chip H1 adsorbed by the Z1 shaft suction head;
step 600: a Z2-axis CCD positioning system is used for photographing and positioning the chip placing slot position on the no-load tray;
step 700: the Z1 shaft assembly adjusts the orientation of the chip H1 through the first rotary driving piece according to the positioning information of the first lower CCD positioning system and the Z2 shaft CCD positioning system, and then the chip H1 is placed in the corresponding chip placing groove;
step 800: and repeating the steps 100 to 700 until all the n chips (H1, H2.. Hn) of the full tray on the first tray carrier are transferred to the empty tray on the second tray carrier.
Further, the following steps are also included between step 600 and step 700:
step 610: a Z2 shaft suction head sucks the material cover placed in the chip rotating groove according to the positioning result of the Z2 shaft CCD positioning system;
step 620: the Z2 shaft assembly moves along the X-axis main body, so that the Z2 shaft suction head is positioned above the second lower CCD positioning system;
step 630: the second machine body controls the Z2 shaft suction head to move downwards, and a second CCD positioning system is used for photographing and positioning the material cover adsorbed by the Z2 shaft suction head;
step 710 is further included after step 700: the Z2 axle subassembly is according to the location information of No. two CCD positioning systems down and Z2 axle CCD positioning system, returns the material lid to corresponding chip and places in the trench after adjusting the position of material lid through No. two rotary driving piece.
By adopting the technical scheme, the invention has the beneficial effects that:
according to the invention, the Z1 shaft assembly and the Z2 shaft assembly which can independently move along the X axis are arranged on two sides of the front part of the X axis main body, the first tray carrying bracket and the second tray carrying bracket which can move along the Y axis are arranged, and the first CCD positioning system and the second CCD positioning system are respectively arranged on the side edges of the first tray carrying bracket and the second tray carrying bracket, so that the trays can be automatically positioned and moved through the Z1 shaft assembly and the Z2 shaft assembly, the process moving path is reduced by the structural design, the placing accuracy is favorably improved, the processing efficiency is improved, the structural design of the equipment is reasonable, the structure is simple and compact, the program design difficulty is reduced, and the manufacturing cost is lower.
Drawings
FIG. 1 is a schematic overall structure diagram of one embodiment of the present invention;
FIG. 2 is a schematic view of the outer structure of the X-axis body according to one embodiment of the present invention;
FIG. 3 is a schematic view of a Z1 axle assembly according to one embodiment of the present invention;
FIG. 4 is a schematic view of a Z2 axle assembly according to one embodiment of the present invention
FIG. 5 is an external view of a Y1 axle drive assembly according to one embodiment of the present invention;
FIG. 6 is an external view of a Y2 axle drive assembly according to one embodiment of the present invention;
FIG. 7 is a schematic view of a lower CCD positioning system according to an embodiment of the present invention;
fig. 8 is a side view of one embodiment of the present invention.
Reference numerals:
1. a work table; 2. an industrial personal computer main body; 3. an X-axis body; 4. a Z1 shaft assembly; 31. an X-axis slide rail; 41. a first machine body; 42. a Z1 shaft tip; 43. a Z1 axis CCD positioning system; 44. a first rotary driving member; 5. a Z2 shaft assembly; 51. a second machine body; 52. a Z2 shaft tip; 53. a Z2 axis CCD positioning system; 54. a second rotary driving member; 6. a first lower CCD positioning system; 7. a first carrier tray bracket; 8. a Y1 axis drive assembly; 9. a second tray carrier; 10. a Y2 axis drive assembly; 11. a second lower CCD positioning system; 12. a threaded sleeve; 13. a screw; 14. a support disc; 15. a roller; 16. and (4) operating the system.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.
It is to be understood that this description is made only by way of example and not as a limitation on the scope of the invention.
The following describes a chip automatic tray moving device provided by some embodiments of the present invention with reference to the accompanying drawings.
The first embodiment is as follows:
referring to fig. 1-8, the automatic chip tray moving device provided by the invention comprises a workbench 1, an industrial personal computer main body 2 is fixedly mounted at the front part of the workbench 1, an operating system 16 is movably mounted at one side of the workbench 1, an X-axis main body 3 is fixedly mounted at the rear part of the upper part of the workbench 1, a Z1 shaft assembly 4 and a Z2 shaft assembly 5 which can independently move along the X-axis direction are respectively arranged at two sides of the front part of the X-axis main body 3, a Y1 shaft driving assembly 8 is fixedly mounted at one side of the upper part of the workbench 1, a first tray carrier bracket 7 which can be driven by the Y1 shaft driving assembly 8 to move along the Y-axis direction is arranged at the upper part of the Y1 shaft driving assembly 8, a Y2 shaft driving assembly 10 is fixedly mounted at the other side of the upper part of the workbench 1, a second tray carrier bracket 9 which can be driven by the Y2 shaft driving assembly 10 to move along the Y-axis direction is arranged at the upper part of the Y2 shaft driving assembly 10, a first CCD positioning system 6 is fixedly mounted at the upper part of the workbench 1, and the first lower CCD positioning system 6 is positioned at one side of the first tray carrying bracket 7, the second lower CCD positioning system 11 is fixedly arranged at the upper part of the workbench 1, and the second lower CCD positioning system 11 is positioned at one side of the second tray carrying bracket 9.
Specifically, the Z1 shaft assembly 4 comprises a first machine body 41 arranged on one side of the front part of the X shaft main body 3, a Z1 shaft suction head 42 arranged on one side of the lower part of the first machine body 41, and a Z1 shaft CCD positioning system 43 arranged on the other side of the lower part of the first machine body 41, wherein a first rotary driving member 44 for controlling the rotation of the Z1 shaft suction head 42 is arranged at the upper end of the Z1 shaft suction head 42; the Z2 shaft assembly 5 comprises a second machine body 51 arranged on the other side of the front part of the X shaft main body 3, a Z2 shaft suction head 52 arranged on one side of the lower part of the second machine body 51 and a Z2 shaft CCD positioning system 53 arranged on the other side of the lower part of the second machine body 51, wherein a second rotary driving piece 54 for controlling the Z2 shaft suction head 52 to rotate is arranged at the upper end of the Z2 shaft suction head 52.
In this embodiment, the Y1 axle drive assembly 8 and the Y2 axle drive assembly 10 are arranged on the workstation 1 side by side, the first lower CCD positioning system 6 is arranged between the Y1 axle drive assembly 8 and the Y2 axle drive assembly 10, the second lower CCD positioning system 11 is arranged on one side of the Y2 axle drive assembly 10 far away from the Y1 axle drive assembly 8, and the Z1 axle assembly 4, the Z2 axle assembly 5, the first lower CCD positioning system 6 and the second lower CCD positioning system 11 are located on the same plane. Through the structure, the equipment is reasonable in structural design, simple and compact in structure, beneficial to automatic operation, lower in programming difficulty and lower in manufacturing cost.
Further, equal movable mounting in four sides of below of workstation 1 has gyro wheel 15, the equal rigid coupling in four sides of below of workstation 1 has swivel nut 12, swivel nut 12 female connection has screw rod 13, the bottom rigid coupling of screw rod 13 has supporting disk 14, the setting of gyro wheel 15, be convenient for remove equipment, owing to be provided with swivel nut 12, and rotate screw rod 13 and make its decline, supporting disk 14 descends along with screw rod 13, then can fix a position on ground, can improve the stability of workstation 1, the aversion appears when avoiding workstation 1 to use.
Furthermore, an operating system 16 is movably installed on one side of the workbench 1.
Specifically, the X-axis main body 3 includes two X-axis slide rails 31 extending along the X-axis direction, the two X-axis slide rails 31 are disposed up and down, and the Z1 shaft assembly 4 and the Z2 shaft assembly 5 are both connected to the two X-axis slide rails 31 in a sliding manner. The Y1 axle drive assembly 8 and the Y2 axle drive assembly 10 are respectively provided with a Y-axis screw rod, a Y-axis drive motor for driving the Y-axis screw rod to rotate and two Y-axis slide rails arranged in parallel, and the first disc carrying bracket 7 and the second disc carrying bracket 9 are respectively connected with the corresponding Y-axis slide rails in a sliding manner and can be driven by the corresponding Y-axis screw rod to move along the Y-axis direction.
Furthermore, all be equipped with the centre gripping subassembly that is used for fixed year dish in the week side of year dish bracket 7 and No. two year dish brackets 9, the centre gripping subassembly includes centre gripping cylinder and the L shaped clamp plate of activity from top to bottom by the drive of centre gripping cylinder, the centre gripping cylinder leans out the setting.
The invention also provides an automatic chip tray moving method, which comprises the following steps:
step 100: placing a full-load tray loaded with chips on a tray carrier bracket 7, wherein the tray carrier bracket 7 is conveyed to the position below a Z1 shaft component 4 by a Y1 shaft driving component 8; placing an empty tray on a tray carrier bracket 9, wherein the tray carrier bracket 9 is conveyed to the position below the Z2 shaft component 5 by a Y2 shaft driving component 10;
step 200: the Z1 axis CCD positioning system 43 takes a picture of the chip H1 to be taken out from the first disk carrier 7 and positions the chip;
step 300: the Z1 shaft suction head 42 sucks the photographed chip H1 according to the positioning result of the Z1 shaft CCD positioning system 43;
step 400: the Z1 shaft assembly 4 is moved along the X-axis body 3 so that the Z1 shaft tip 42 is positioned above the first lower CCD positioning system 6;
step 500: the first machine body 41 controls the Z1 shaft suction head 42 to move downwards, and a chip H1 adsorbed by the Z1 shaft suction head 42 is photographed and positioned through the first lower CCD positioning system 6;
step 600: the Z2-axis CCD positioning system 53 is used for photographing and positioning the chip placing slot on the empty tray;
step 700: the Z1 shaft assembly 4 adjusts the orientation of the chip H1 through the first rotary driving piece 44 according to the positioning information of the first lower CCD positioning system 6 and the Z2 shaft CCD positioning system 53, and then the chip H1 is placed into the corresponding chip placing groove;
step 800: steps 100 to 700 are repeated until all the n chips (H1, H2.. Hn) of a full tray on the tray carrier 7 are transferred to an empty tray on the tray carrier 9.
For the empty tray provided with the cover, the following steps are also included between the step 600 and the step 700:
step 610: the Z2 shaft suction head 52 sucks the material cover placed in the chip rotating groove according to the positioning result of the Z2 shaft CCD positioning system 53;
step 620: the Z2 shaft assembly 5 moves along the X-axis main body 3, so that the Z2 shaft suction head 52 is positioned above the second lower CCD positioning system 11;
step 630: the second machine body 51 controls the Z2 shaft suction head 52 to move downwards, and the material cover adsorbed by the Z2 shaft suction head 52 is photographed and positioned through the second lower CCD positioning system 11;
step 710 is further included after step 700: the Z2 shaft assembly 5 adjusts the position of the material cover through the second rotary driving piece 54 according to the positioning information of the second lower CCD positioning system 6 and the Z2 shaft CCD positioning system 53, and then the material cover is returned to the corresponding chip placing groove position.
The reverse operation can be realized during the actual work, namely, a full-load tray loaded with chips can be placed on the second tray carrier 9, an empty-load tray is placed in the first tray carrier 7, and the chips need to be transferred from the second tray carrier to the first tray carrier.
In the present invention, the term "plurality" means two or more unless explicitly defined otherwise. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It will be understood that when an element is referred to as being "mounted to," "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the claims and their equivalents.
Claims (10)
1. The utility model provides an automatic dish device that moves of chip, includes workstation (1), its characterized in that, industrial computer main part (2) are adorned admittedly to the front portion of workstation (1), one side movable mounting of workstation (1) has operating system (16), X axle main part (3) are adorned admittedly to the upper portion rear of workstation (1), the anterior both sides of X axle main part (3) are equipped with respectively can follow Z1 axle subassembly (4) and Z2 axle subassembly (5) of X axle direction independent activity, upper portion one side of workstation (1) is adorned admittedly Y1 axle drive assembly (8), the upper portion of Y1 axle drive assembly (8) is provided with and carries a dish bracket (7) that can be driven along the activity of Y axle direction by Y1 axle drive assembly (8), the upper portion opposite side of workstation (1) is adorned admittedly Y2 axle drive assembly (10), the upper portion of Y2 axle drive assembly (10) is provided with can be driven by Y2 axle drive assembly (10) and carries a dish bracket (7) along the activity of Y axle direction (9) The upper portion of the workbench (1) is fixedly provided with a first lower CCD positioning system (6), the upper portion of the workbench (1) is fixedly provided with a second lower CCD positioning system (11), the Z1 shaft assembly (4) comprises a Z1 shaft CCD positioning system (43), and the Z2 shaft assembly (5) comprises a Z2 shaft CCD positioning system (53).
2. The automatic chip tray moving device according to claim 1, wherein the first lower CCD positioning system (6) is positioned at one side of the first tray carrying bracket (7), and the second lower CCD positioning system (11) is positioned at one side of the second tray carrying bracket (9);
the Z1 shaft assembly (4) further comprises a first machine body (41) arranged on one side of the front portion of the X shaft main body (3) and a Z1 shaft suction head (42) arranged on one side of the lower portion of the first machine body (41), the Z1 shaft CCD positioning system (43) is arranged on the other side of the lower portion of the first machine body (41), and a first rotary driving piece (44) for controlling the Z1 shaft suction head (42) to rotate is arranged at the upper end of the Z1 shaft suction head (42);
z2 axle subassembly (5) are still including installing in No. two organism (51) of X axle main part (3) front portion opposite side, set up in No. two Z2 axle suction head (52) of organism (51) lower part one side, Z2 axle CCD positioning system (53) set up in No. two organism (51) lower part opposite sides, the upper end of Z2 axle suction head (52) is equipped with the rotatory driving piece (54) No. two of control Z2 axle suction head (52).
3. The automatic chip tray moving device according to claim 1, wherein the Y1 shaft driving assembly (8) and the Y2 shaft driving assembly (10) are arranged on the workbench (1) side by side, the first lower CCD positioning system (6) is arranged between the Y1 shaft driving assembly (8) and the Y2 shaft driving assembly (10), the second lower CCD positioning system (11) is arranged on one side of the Y2 shaft driving assembly (10) far away from the Y1 shaft driving assembly (8), and the Z1 shaft assembly (4), the Z2 shaft assembly (5), the first lower CCD positioning system (6) and the second lower CCD positioning system (11) are positioned on the same plane.
4. The automatic chip tray moving device according to claim 1, wherein screw sleeves (12) are fixedly connected to four sides of the lower portion of the workbench (1), screw rods (13) are connected to the screw sleeves (12) in an internal thread mode, and supporting plates (14) are fixedly connected to the bottom ends of the screw rods (13).
5. The automatic chip tray moving device according to claim 1, wherein the X-axis body (3) comprises two X-axis slide rails (31) extending along the X-axis direction, the two X-axis slide rails (31) are arranged up and down, and the Z1 shaft assembly (4) and the Z2 shaft assembly (5) are both connected with the two X-axis slide rails (31) in a sliding manner.
6. The automatic chip tray moving device according to claim 1, wherein each of the Y1-axis driving assembly (8) and the Y2-axis driving assembly (10) comprises a Y-axis lead screw, a Y-axis driving motor for driving the Y-axis lead screw to rotate, and two Y-axis slide rails arranged in parallel, and the first tray carrier (7) and the second tray carrier (9) are respectively connected with the corresponding Y-axis slide rails in a sliding manner and can be driven by the corresponding Y-axis lead screw to move along the Y-axis direction.
7. The automatic chip tray moving device according to claim 1, wherein clamping components for fixing the tray are arranged on the peripheral sides of the first tray carrier (7) and the second tray carrier (9).
8. The automatic tray moving device for the chips as claimed in claim 7, wherein the clamping assembly comprises a clamping cylinder and an L-shaped clamping plate driven by the clamping cylinder to move up and down, and the clamping cylinder is arranged obliquely outwards.
9. A chip automatic tray moving method is characterized by comprising the following steps:
step 100: placing a full-load tray loaded with chips on a tray carrier (7), wherein the tray carrier (7) is conveyed to the lower part of a Z1 shaft component (4) by a Y1 shaft driving component (8); placing the idle tray on a second tray carrier (9), wherein the second tray carrier (9) is conveyed to the position below a Z2 shaft assembly (5) by a Y2 shaft driving assembly (10);
step 200: a Z1-axis CCD positioning system (43) is used for photographing and positioning a chip H1 to be taken out from a first disk carrier (7);
step 300: a Z1 shaft suction head (42) sucks the photographed chip H1 according to the positioning result of a Z1 shaft CCD positioning system (43);
step 400: the Z1 shaft assembly (4) moves along the X-axis main body (3) to enable the Z1 shaft suction head (42) to be positioned above the first lower CCD positioning system (6);
step 500: the first machine body (41) controls the Z1 shaft suction head (42) to move downwards, and a first CCD positioning system (6) is used for photographing and positioning a chip H1 adsorbed by the Z1 shaft suction head (42);
step 600: a Z2-axis CCD positioning system (53) is used for photographing and positioning the chip placing slot on the empty tray;
step 700: the Z1 shaft assembly (4) adjusts the position of the chip H1 through the first rotary driving piece (44) according to the positioning information of the first lower CCD positioning system (6) and the Z2 shaft CCD positioning system (53), and then the chip H1 is placed into the corresponding chip placing groove;
step 800: and (5) repeating the steps (100) to (700) until all the n chips (H1, H2.. Hn) with full trays on the first tray carrier (7) are transferred to the empty trays on the second tray carrier (9).
10. The method for automatically transferring the chip according to claim 9, wherein the following steps are further included between step 600 and step 700:
step 610: a Z2 shaft suction head (52) sucks the material cover placed in the chip rotating groove according to the positioning result of a Z2 shaft CCD positioning system (53);
step 620: the Z2 shaft assembly (5) moves along the X-axis main body (3) to enable the Z2 shaft suction head (52) to be positioned above the second lower CCD positioning system (11);
step 630: the second machine body (51) controls the Z2 shaft suction head (52) to move downwards, and a material cover adsorbed by the Z2 shaft suction head (52) is photographed and positioned through the second CCD positioning system (11);
step 710 is further included after step 700: and the Z2 shaft assembly (5) adjusts the position of the material cover through the second rotary driving piece (54) according to the positioning information of the second lower CCD positioning system (6) and the Z2 shaft CCD positioning system (53) and then returns the material cover to the corresponding chip placing groove.
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CN202210050539.2A CN114538107A (en) | 2022-01-17 | 2022-01-17 | Automatic chip tray moving device and tray moving method thereof |
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CN110844156A (en) * | 2018-08-21 | 2020-02-28 | 无锡沃格自动化科技股份有限公司 | Automatic braider of SMD product |
CN112259458A (en) * | 2020-10-23 | 2021-01-22 | 浙江热刺激光技术有限公司 | Chip sintering method and device, electronic equipment and readable storage medium |
CN113426701A (en) * | 2021-05-31 | 2021-09-24 | 大族激光科技产业集团股份有限公司 | Chip detecting and sorting equipment |
CN214718550U (en) * | 2021-05-31 | 2021-11-16 | 苏州展德自动化设备有限公司 | Automatic detection precision balance device with compact layout |
CN214718501U (en) * | 2021-05-31 | 2021-11-16 | 苏州展德自动化设备有限公司 | Automatic detection balance device with compact layout and high efficiency |
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US20100257727A1 (en) * | 2007-12-03 | 2010-10-14 | Panasonic Corporation | Chip mounting system |
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CN106332538A (en) * | 2015-06-30 | 2017-01-11 | 万润科技股份有限公司 | Method and apparatus for conveying electronic component carrier |
CN107369609A (en) * | 2016-05-11 | 2017-11-21 | 万润科技股份有限公司 | Wafer residual glue cleaning method and device |
CN107662818A (en) * | 2017-10-26 | 2018-02-06 | 苏州均华精密机械有限公司 | Fully automatic high-speed tray filling machine |
CN110844156A (en) * | 2018-08-21 | 2020-02-28 | 无锡沃格自动化科技股份有限公司 | Automatic braider of SMD product |
CN112259458A (en) * | 2020-10-23 | 2021-01-22 | 浙江热刺激光技术有限公司 | Chip sintering method and device, electronic equipment and readable storage medium |
CN113426701A (en) * | 2021-05-31 | 2021-09-24 | 大族激光科技产业集团股份有限公司 | Chip detecting and sorting equipment |
CN214718550U (en) * | 2021-05-31 | 2021-11-16 | 苏州展德自动化设备有限公司 | Automatic detection precision balance device with compact layout |
CN214718501U (en) * | 2021-05-31 | 2021-11-16 | 苏州展德自动化设备有限公司 | Automatic detection balance device with compact layout and high efficiency |
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