CN114535589A - Preparation method of tungsten-copper heat sink component for optical module - Google Patents
Preparation method of tungsten-copper heat sink component for optical module Download PDFInfo
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- CN114535589A CN114535589A CN202210015222.5A CN202210015222A CN114535589A CN 114535589 A CN114535589 A CN 114535589A CN 202210015222 A CN202210015222 A CN 202210015222A CN 114535589 A CN114535589 A CN 114535589A
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- copper
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- 230000003287 optical effect Effects 0.000 title claims abstract description 53
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000002131 composite material Substances 0.000 claims abstract description 55
- 239000000843 powder Substances 0.000 claims abstract description 54
- 238000005245 sintering Methods 0.000 claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 46
- 238000001746 injection moulding Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000002245 particle Substances 0.000 claims abstract description 23
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000002994 raw material Substances 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000001694 spray drying Methods 0.000 claims abstract description 10
- 238000001238 wet grinding Methods 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 9
- 239000010937 tungsten Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 16
- 239000011230 binding agent Substances 0.000 claims description 16
- 238000001354 calcination Methods 0.000 claims description 16
- 229910052739 hydrogen Inorganic materials 0.000 claims description 16
- 239000001257 hydrogen Substances 0.000 claims description 16
- 239000002002 slurry Substances 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 10
- 238000005238 degreasing Methods 0.000 claims description 7
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 5
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000004321 preservation Methods 0.000 claims 1
- 239000007791 liquid phase Substances 0.000 abstract description 7
- 239000012071 phase Substances 0.000 abstract description 6
- 238000011049 filling Methods 0.000 abstract description 3
- 238000005469 granulation Methods 0.000 abstract description 3
- 230000003179 granulation Effects 0.000 abstract description 3
- 230000008707 rearrangement Effects 0.000 abstract description 3
- 239000007790 solid phase Substances 0.000 abstract description 3
- 238000001764 infiltration Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- UFMZWBIQTDUYBN-UHFFFAOYSA-N cobalt dinitrate Chemical compound [Co+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O UFMZWBIQTDUYBN-UHFFFAOYSA-N 0.000 description 2
- 229910001981 cobalt nitrate Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- 229910000360 iron(III) sulfate Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
- B22F9/22—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds using gaseous reductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
- B22F3/225—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/026—Spray drying of solutions or suspensions
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/045—Alloys based on refractory metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
Abstract
The invention discloses a preparation method of a tungsten-copper heat sink component for an optical module, which is used for preparing spherical composite powder based on wet grinding and spray drying granulation, wherein a copper phase and an activated sintering element are distributed in gaps of tungsten particles with nanometer sizes, and the sintering process not only has copper phase filling and tungsten particle rearrangement caused by a copper liquid phase, but also has solid-phase sintering of the tungsten powder particles, so that the sintering temperature and the production cost can be greatly reduced. The tungsten-copper heat sink component for the optical module is prepared by adopting an injection molding process, the raw material utilization rate is high, the size precision of parts is good, the thermal performance of the heat sink component is excellent, and the surface state is excellent.
Description
Technical Field
The invention belongs to the technical field of powder metallurgy, and particularly relates to a preparation method of a tungsten-copper heat sink component for an optical module.
Background
With the advent of the 5G era, the demand for high-power optical modules is increasing, and the power of a single optical module is also increasing, which puts higher requirements on the heat-conducting performance of a heat sink component of the optical module. The heat-conducting property of the existing Kovar alloy is difficult to meet the requirement, and the tungsten-copper (W-Cu) composite material with excellent heat-conducting property and low thermal expansion coefficient can meet the heat-conducting requirement. However, the heat sink member of the optical module is generally small in size, and the parts are thin and complicated in shape. The W-Cu composite material is prepared by adopting liquid phase sintering and infiltration methods. As W and Cu are not completely dissolved in a solid solution, the W-Cu composite material with high density is difficult to obtain by liquid phase sintering, and the heat conductivity of the W-Cu composite material prepared by liquid phase sintering is lower. In addition, although the infiltration method can prepare a high-density and high-performance W-Cu composite material, the infiltration method can only prepare a block body with a simple shape, and a large amount of processing is needed to prepare a heat sink component for an optical module, so that the material waste is large and the efficiency is low. Therefore, it is urgent to find a method for manufacturing a member which can be rapidly manufactured at low cost and with high material utilization and excellent thermal conductivity.
Disclosure of Invention
The invention aims to provide a preparation method of a tungsten-copper heat sink component for an optical module, and the prepared tungsten-copper heat sink component for the optical module has the characteristics of high heat conductivity and low thermal expansion coefficient.
The invention adopts the technical scheme that the preparation method of the tungsten-copper heat sink component for the optical module comprises the following components in percentage by mass: 8-22% of copper, 0.05-1.0% of activated sintering element and the balance of tungsten, and is specifically implemented according to the following steps:
step 1, taking tungsten powder, a copper source and an activated sintering element source as raw materials, uniformly mixing the raw materials according to a certain proportion by wet grinding to prepare slurry, preparing the slurry into spherical composite powder by utilizing spray drying equipment, and calcining and reducing the spherical composite powder in hydrogen to obtain spherical W/Cu/activated sintering element composite powder;
step 2, mixing the spherical W/Cu/activated sintering element composite powder and a binder at the temperature of 150-170 ℃ for 2-4 hours, wherein the volume ratio of the powder to the binder is 45: 55-65: 35, and preparing an injection molding feed;
step 3, preparing a blank body in the shape of the tungsten-copper heat sink component for the required optical module on injection molding equipment by using the feed;
and 4, degreasing the injection molding blank, and sintering at high temperature to obtain the tungsten-copper heat sink component for the optical module.
The invention is also characterized in that:
in the step 1, the activated sintering element is at least one of soluble Ni, Fe, Co and Pd metal salts.
The particle size of the tungsten powder is 0.2-1 μm.
In the step 1, the copper source is one or a mixture of copper nitrate, copper sulfate and copper chloride.
In the step 1, the particle size of the spherical composite powder is 15-50 mu m, and the sphericity rate is more than 95%.
The calcining process of calcining the spherical composite powder in hydrogen in the step 1 is heating to 400 ℃, the heating rate is 1-5 ℃/min, keeping the temperature for 2h, then heating to 800 ℃ at the speed of 5 ℃/min, and keeping the temperature for 2 h.
The binder in the step 2 is a wax-based binder.
Step 4, the high-temperature sintering process comprises the following steps: sintering for 1-4 h in 1100-1250 ℃ hydrogen atmosphere.
The heat conductivity of the tungsten-copper heat sink component for the optical module is more than or equal to 200 W.m-1·K-1Coefficient of thermal expansion less than or equal to 8.0 x 10-6and/K, the relative density is more than or equal to 98 percent.
The invention has the beneficial effects that:
1) the invention prepares the spherical composite powder based on wet grinding and spray drying granulation, the copper phase and the activated sintering element are distributed in the gaps of the tungsten particles with nanometer size, the sintering process not only has copper phase filling and tungsten particle rearrangement caused by the copper liquid phase, but also has solid phase sintering of the nanometer tungsten powder particles, thereby greatly reducing the sintering temperature and the production cost.
2) The tungsten-copper heat sink component for the optical module is prepared by adopting an injection molding process, the raw material utilization rate is high, the size precision of parts is good, the thermal performance of the heat sink component is excellent, and the surface state is excellent.
Drawings
FIG. 1 is a typical microstructure diagram of a tungsten-copper heat sink component for an optical module prepared by the method of the present invention
FIG. 2 is a typical microstructure morphology of a micron W/Cu composite powder sintered at 1350 ℃ in the prior art.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Example 1
The invention relates to a preparation method of a tungsten-copper heat sink component for an optical module, which is implemented by the following steps:
tungsten powder with the particle size of 0.5 mu m, copper sulfate and nickel nitrate are used as raw materials, and the raw materials are subjected to wet grinding according to the weight ratio of W to Cu: uniformly mixing Ni (79.8: 20: 0.2) in a mass ratio to prepare slurry, and preparing the slurry into spherical composite powder by using spray drying equipment; then calcining and reducing the spherical composite powder in hydrogen to obtain spherical W/Cu/activated sintering element composite powder, wherein the calcining temperature is 400 ℃, the heating rate is 1 ℃/min, after the temperature is kept for 2h, the temperature is raised to 800 ℃ at the speed of 5 ℃/min, the temperature is kept for 2h, and the spherical composite powder with the particle size of 25 mu m is obtained, and the sphericity rate is 95.5%; mixing the spherical W/Cu/activated sintering element composite powder and a wax-based binder at 150 ℃ for 2h, wherein the volume ratio of the powder to the wax-based binder is 58:42, and preparing an injection molding feed; preparing a blank body in the shape of the tungsten-copper heat sink component for the required optical module on injection molding equipment by using the feed; degreasing the injection molding blank, and sintering at 1150 ℃ in a hydrogen atmosphere at high temperature to obtain the tungsten-copper heat sink component for the optical module.
Prepared tungsten-copper heat sink component for optical module has heat conductivity of 220 W.m-1·K-1Coefficient of thermal expansion of 7.8X 10-6The relative density was 98.5%.
Example 2
The invention relates to a preparation method of a tungsten-copper heat sink component for an optical module, which is implemented by the following steps:
tungsten powder with the particle size of 0.4 mu m, copper sulfate and ferric sulfate are used as raw materials, the raw materials are uniformly mixed according to the mass ratio of W to Cu to Fe of 79.65 to 20 to 0.35 by wet grinding to prepare slurry, and then spray drying equipment is used for preparing the slurry into spherical composite powder; then calcining and reducing the spherical composite powder in hydrogen to obtain spherical W/Cu/activated sintering element composite powder, wherein the calcining temperature is 400 ℃, the heating rate is 2 ℃/min, after the temperature is kept for 2h, the temperature is raised to 800 ℃ at 5 ℃/min, the temperature is kept for 2h, the spherical composite powder with the particle size of 18 mu m is obtained, and the sphericity rate is 96.5%; mixing the spherical W/Cu/activated sintering element composite powder and a wax-based binder at 150 ℃ for 2h, wherein the volume ratio of the powder to the wax-based binder is 50:50, and preparing an injection molding feed; preparing a blank body in the shape of the tungsten-copper heat sink component for the required optical module on injection molding equipment by using the feed; and degreasing the injection molding blank, and sintering the degreased injection molding blank for 2h at a high temperature in a hydrogen atmosphere at 1100 ℃ to obtain the tungsten-copper heat sink component for the optical module.
The prepared tungsten-copper heat sink component for the optical module has the thermal conductivity of 215 W.m-1·K-1Coefficient of thermal expansion of 7.5X 10-6The relative density was 99.0%.
Example 3
The invention relates to a preparation method of a tungsten-copper heat sink component for an optical module, which is implemented by the following steps:
tungsten powder with the particle size of 0.8 mu m, copper nitrate and nickel sulfate are used as raw materials, the raw materials are uniformly mixed according to the mass ratio of W to Cu to Ni of 84.5 to 15 to 0.5 by wet grinding to prepare slurry, and the slurry is prepared into spherical composite powder by utilizing spray drying equipment, wherein the sphericity ratio is 95.0%; then calcining and reducing the spherical composite powder in hydrogen to obtain spherical W/Cu/activated sintering element composite powder, wherein the calcining process comprises the steps of heating the spherical composite powder to 400 ℃ at room temperature at the heating rate of 3 ℃/min, keeping the temperature for 2h, heating the spherical composite powder to 800 ℃ at the heating rate of 5 ℃/min, and keeping the temperature for 2h to obtain the spherical composite powder with the particle size of 30 mu m; mixing the spherical W/Cu/activated sintering element composite powder and a binder at 150 ℃ for 2h, wherein the volume ratio of the powder to the wax-based binder is 58:42, and preparing an injection molding feed; preparing a blank body in the shape of the tungsten-copper heat sink component for the required optical module on injection molding equipment by using the feed; and degreasing the injection molding blank, and sintering the degreased injection molding blank at 1180 ℃ for 2.5 hours in a hydrogen atmosphere at a high temperature to obtain the tungsten-copper heat sink component for the optical module.
Prepared tungsten-copper heat sink component for optical module has heat conductivity of 205 W.m-1·K-1Coefficient of thermal expansion of 7.0X 10-6The relative density was 99.0%.
Example 4
The invention relates to a preparation method of a tungsten-copper heat sink component for an optical module, which is implemented by the following steps:
tungsten powder with the particle size of 0.25 mu m, copper nitrate and cobalt nitrate are used as raw materials, the raw materials are uniformly mixed according to the mass ratio of W to Cu to Co of 89.8 to 10 to 0.2 by wet grinding to prepare slurry, and then spray drying equipment is utilized to prepare the slurry into spherical composite powder; then calcining and reducing the spherical composite powder in hydrogen to obtain spherical W/Cu/activated sintering element composite powder, wherein the calcining process comprises the steps of heating the spherical composite powder to 400 ℃ at room temperature at the heating rate of 4 ℃/min, keeping the temperature for 2h, heating the spherical composite powder to 800 ℃ at the heating rate of 5 ℃/min, and keeping the temperature for 2h to obtain the spherical composite powder with the particle size of 20 mu m, wherein the sphericity is 97.5%; mixing the spherical W/Cu/activated sintering element composite powder and a binder at 160 ℃ for 2h, wherein the volume ratio of the powder to the binder is 48:52, and preparing an injection molding feed; preparing a blank body in the shape of the tungsten-copper heat sink component for the required optical module on injection molding equipment by using the feed; and degreasing the injection molding blank, and sintering the degreased injection molding blank for 3h in a hydrogen atmosphere at a high temperature of 1200 ℃ to obtain the tungsten-copper heat sink component for the optical module.
Thermal conductivity of prepared tungsten-copper heat sink component for optical module is 201 W.m-1·K-1Coefficient of thermal expansion of 5.2X 10-6The relative density was 98.5%.
Example 5
The invention relates to a preparation method of a tungsten-copper heat sink component for an optical module, which is implemented by the following steps:
tungsten powder with the particle size of 0.25 mu m, copper nitrate and cobalt nitrate are used as raw materials, the raw materials are uniformly mixed according to the mass ratio of W to Cu to Co of 79.75 to 20 to 0.25 by wet grinding to prepare slurry, and the slurry is prepared into spherical composite powder by utilizing spray drying equipment, wherein the spherical rate is 98.0%; then calcining and reducing the spherical composite powder in hydrogen to obtain spherical W/Cu/activated sintering element composite powder, wherein the calcining process comprises the steps of heating the spherical composite powder to 400 ℃ at room temperature at the heating rate of 5 ℃/min, keeping the temperature for 2h, heating the spherical composite powder to 800 ℃ at the heating rate of 5 ℃/min, and keeping the temperature for 2h to obtain spherical composite powder with the particle size of 20 mu m; mixing the spherical W/Cu/activated sintering element composite powder and a binder for 2 hours at 160 ℃, wherein the volume ratio of the powder to the binder is 48:52, and preparing an injection molding feed; preparing a blank body in the shape of the tungsten-copper heat sink component for the required optical module on injection molding equipment by using the feed; degreasing the injection molding blank, and sintering the degreased injection molding blank for 3h at 1125 ℃ in a hydrogen atmosphere at a high temperature to obtain the tungsten-copper heat sink component for the optical module.
The thermal conductivity of the prepared tungsten-copper heat sink component for the optical module is 225 W.m-1·K-1Coefficient of thermal expansion of 7.5X 10-6The relative density was 99.5%.
The microstructure of the material obtained according to example 1 is shown in FIG. 1, and it can be seen from FIG. 1 that the W-20Cu composite material can achieve full densification only after being sintered at 1150 ℃; in contrast, as shown in fig. 2, the microstructure of the mixed powder of micrometer W (5 μm)/Cu (5 μm) in the prior art after liquid phase sintering at 1350 ℃ shows that a large number of pores still exist in the sintered W-Cu composite material, which greatly reduces the thermal conductivity of the W-Cu composite material.
Through the mode, the preparation method of the tungsten-copper heat sink component for the optical module is used for preparing the spherical composite powder based on wet grinding and spray drying granulation, the copper phase and the activated sintering element are distributed in gaps of tungsten particles with nanometer sizes, and the sintering process not only has copper phase filling and tungsten particle rearrangement caused by a copper liquid phase, but also has solid-phase sintering of the tungsten powder particles, so that the sintering temperature and the production cost can be greatly reduced. The tungsten-copper heat sink component for the optical module is prepared by adopting an injection molding process, the raw material utilization rate is high, the size precision of parts is good, the thermal performance of the heat sink component is excellent, and the surface state is excellent.
Claims (9)
1. The preparation method of the tungsten-copper heat sink component for the optical module is characterized in that the tungsten-copper heat sink component for the optical module comprises the following components in percentage by mass: 8-22% of copper, 0.05-1.0% of activated sintering element and the balance of tungsten, and is specifically implemented according to the following steps:
step 1, taking tungsten powder, a copper source and an activated sintering element source as raw materials, uniformly mixing the raw materials according to a certain proportion by wet grinding to prepare slurry, preparing the slurry into spherical composite powder by utilizing spray drying equipment, and calcining and reducing the spherical composite powder in hydrogen to obtain spherical W/Cu/activated sintering element composite powder;
step 2, mixing the spherical W/Cu/activated sintering element composite powder and a binder at the temperature of 150-170 ℃ for 2-4 hours, wherein the volume ratio of the powder to the binder is 45: 55-65: 35, and preparing an injection molding feed;
step 3, preparing a blank body in the shape of the tungsten-copper heat sink component for the required optical module on injection molding equipment by using the feed;
and 4, degreasing the injection molding blank, and sintering at high temperature to obtain the tungsten-copper heat sink component for the optical module.
2. The method for manufacturing a tungsten-copper heat sink component for an optical module according to claim 1, wherein the activated sintering element in step 1 is at least one of soluble Ni, Fe, Co, Pd metal salts.
3. The method for manufacturing a tungsten-copper heat sink member for an optical module according to claim 1, wherein the tungsten powder has a particle size of 0.2 to 1 μm.
4. The method for preparing a tungsten-copper heat sink component for an optical module as claimed in claim 1, wherein the copper source in step 1 is one or more of copper nitrate, copper sulfate and copper chloride.
5. The method for manufacturing a tungsten-copper heat sink component for an optical module according to claim 1, wherein the spherical composite powder in step 1 has a particle size of 15 to 50 μm and a sphericity of > 95%.
6. The method for preparing the tungsten-copper heat sink component for the optical module according to claim 1, wherein the calcining process for calcining the spherical composite powder in hydrogen in the step 1 is heating to 400 ℃, the heating rate is 1-5 ℃/min, and after 2 hours of heat preservation, heating to 800 ℃ at 5 ℃/min and preserving heat for 2 hours.
7. The method for manufacturing a tungsten-copper heat sink member for an optical module as claimed in claim 1, wherein the adhesive in step 2 is a wax-based adhesive.
8. The method for preparing the tungsten-copper heat sink component for the optical module according to claim 1, wherein the high-temperature sintering process in step 4 is as follows: sintering for 1-4 h in 1100-1250 ℃ hydrogen atmosphere.
9. The method for manufacturing a W-Cu heat sink member for an optical module as claimed in claim 1, wherein the W-Cu heat sink member for an optical module has a thermal conductivity of 200W-m or more-1·K-1Coefficient of thermal expansion less than or equal to 8.0 x 10-6and/K, the relative density is more than or equal to 98 percent.
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5439638A (en) * | 1993-07-16 | 1995-08-08 | Osram Sylvania Inc. | Method of making flowable tungsten/copper composite powder |
| JPH10280064A (en) * | 1997-04-09 | 1998-10-20 | Toho Kinzoku Kk | Manufacture of alloy of tungsten and/or molybdenum and copper |
| US5842108A (en) * | 1997-03-04 | 1998-11-24 | Korea Institute Of Machinery & Materials | Mechano-chemical process for production of high density and ultrafine W/Cu composite material |
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