CN114531788B - Surface mounting method, system, terminal and storage medium for camera module chip - Google Patents
Surface mounting method, system, terminal and storage medium for camera module chip Download PDFInfo
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- CN114531788B CN114531788B CN202210154854.XA CN202210154854A CN114531788B CN 114531788 B CN114531788 B CN 114531788B CN 202210154854 A CN202210154854 A CN 202210154854A CN 114531788 B CN114531788 B CN 114531788B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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Abstract
The application discloses a mounting method, a mounting system, a mounting terminal and a mounting storage medium for a camera module chip, which belong to the field of precision assembly, wherein the method comprises the following steps: obtaining the position information of the welding point, and generating a glue drawing path according to the position information of the welding point; obtaining the position information of the gold wire, and coating solder paste on the tail part of the gold wire; and attaching the lens chip to the FPC board until the gold thread coincides with the welding point. The method and the device have the advantages that waste of production materials can be reduced, and production cost is reduced.
Description
Technical Field
The invention relates to the field of precision assembly, in particular to a mounting method, a mounting system and a mounting terminal for detecting the quality of welding spots of camera chip welding.
Background
With the development of science and technology, people have higher and higher requirements on production processes. At present, in a front stage process of camera line processing, a lens chip which is processed in advance needs to be mounted on an FPC board.
In the process of implementing the application, the inventor finds that at least the following problems exist in the technology: the traditional finished product rate is low, the waste of production materials is easily caused, and the production cost is increased; such as: the FPC board has good quality, but when the gold wires of the lens chip are dipped with the solder paste, the solder paste is leaked or the solder paste among the gold wires is adhered to each other, so that the lens chip is in short circuit on the FPC board, and the FPC board is scrapped; the PAD points of the FPC board are mutually adhered or lack, so that the lens chip has good quality, and when the solder paste dipping quality is good, the mounted product can still not be used, and the lens chip and the FPC board are wasted; gold thread dip in tin cream and FPC board all does not have quality problems, but because at the in-process of laminating, the position of camera lens chip and FPC board is just right, leads to gold thread and PAD to take place the skew for whole product is scrapped. For this reason, further improvement is awaited.
Disclosure of Invention
In order to reduce waste of production materials and production cost, the application provides a mounting method, a mounting system, a mounting terminal and a storage medium for a camera module chip.
In a first aspect, the present application provides a mounting method for a camera module chip, which adopts the following technical scheme:
a mounting method of a camera module chip comprises a lens chip and an FPC board matched with the lens chip, wherein a gold wire used for communicating a circuit is installed on the lens chip, a welding point matched with the gold wire is installed on the FPC board, and the method comprises the following steps:
obtaining position information of a welding point, and generating a glue drawing path according to the position information of the welding point;
obtaining the position information of the gold wire, and coating solder paste on the tail part of the gold wire;
and attaching the lens chip to the FPC board until the gold thread coincides with the welding point.
By adopting the technical scheme, the gold thread is coincided with the welding point, the yield is improved, and the condition that the positions of the lens chip and the FPC are not right opposite is reduced, so that the waste of production materials is reduced, and the production cost is reduced.
Optionally, obtaining the position information of the welding point, generating the glue drawing path according to the position information of the welding point, specifically includes:
obtaining position information of a welding point through an upward-looking camera, wherein the position information of the welding point comprises central point information of the welding point;
obtaining area information of a welding point through an upward-looking camera;
comparing the area information of the welding point with prestored area information to generate similarity numerical value information;
if the similarity numerical value information is larger than or equal to a preset value, acquiring central point information of the FPC board according to the central point information of the welding point, and generating a glue drawing path according to the central point information of the FPC board;
and skipping the FPC board if the similarity numerical value information is smaller than a preset value.
Through adopting above-mentioned technical scheme, can tentatively select qualified FPC board, reduce the condition that carries out follow-up processing operation based on the FPC board that is not conform to the production requirement, avoid leading to the condemned condition of product because of the FPC board is not conform to the production requirement to reduction in production cost.
Optionally, parameters of the glue drawing path are adjusted through a Halcon algorithm, so that the glue drawing path is independently edited, and the parameters of the glue drawing path comprise glue drawing speed, glue drawing thickness and glue drawing length.
By adopting the technical scheme, the glue drawing path can be independently edited, so that the glue drawing path is suitable for more production requirements and improves the practicability.
Optionally, the obtaining of the position information of the gold wire and the coating of the solder paste on the tail of the gold wire specifically include:
obtaining position information of gold wires through a downward-looking camera, wherein the position information of the gold wires comprises length information of the gold wires, width information of the gold wires, area information of the gold wires, distance information between different gold wires and central point information of the gold wires;
generating gold wire central point connection information used for indicating that the central point of a gold wire and the central point of a diagonal gold wire are connected into a straight line according to the central point information of the gold wire, wherein the gold wire central point connection information comprises the central coordinate information of the straight line;
obtaining the central position information of the lens chip according to the central coordinate information of the straight line;
and coating solder paste on the tail of the gold wire.
By adopting the technical scheme, the central position information of the lens chip can be obtained, so that the lens chip can be conveniently and accurately pasted on the FPC board subsequently, and the production efficiency is improved.
Optionally, after the solder paste is coated on the tail of the gold wire, position information of the solder paste is obtained through a downward-looking camera, and the center position information of the lens chip is obtained again according to the center coordinate information of the straight line, wherein the position information of the solder paste comprises area information of the solder paste and distance information of the solder paste;
comparing the area information of the solder paste with prestored area numerical value range information to generate first tin dipping effect information, wherein the first tin dipping effect information comprises area passing information or area failing information;
if the area information of the solder paste is in the pre-stored area numerical value range information, the first tin dipping effect information is area passing information;
if the area information of the solder paste is not in the pre-stored area numerical value range information, the first tin dipping effect information is area non-passing information;
comparing the spacing information of the solder paste with prestored spacing numerical range information to generate second tin dipping effect information, wherein the second tin dipping effect information comprises spacing passing information or spacing failing information;
if the spacing information of the solder paste is in the pre-stored spacing numerical range information, the second tin dipping effect information is spacing passing information;
if the spacing information of the solder paste is not in the pre-stored spacing numerical range information, the second tin dipping effect information is spacing non-passing information;
if the first tin dipping effect information is area passing information and the second tin dipping effect information is interval passing information, generating tin dipping passing information;
if the first tin dipping effect information is area non-passing information or the second tin dipping effect information is interval non-passing information, the tin dipping non-passing information is generated.
Through adopting above-mentioned technical scheme, can tentatively select scribble the relatively poor gold thread of tin effect, reduce and carry out the condition of follow-up production and processing based on leaking the gold thread that dips in, even glue, glue more, less to improve the yield, reduce manufacturing cost.
Optionally, laminate the lens chip to the FPC board, until gold thread and welding point coincide mutually, specifically include:
obtaining rotation angle information of the FPC board through an upward-looking camera;
obtaining angle compensation information of the lens chip according to the rotation angle information;
obtaining position compensation information of the lens chip through the central position information of the FPC board;
and attaching the lens chip to the FPC board according to the position compensation information of the lens chip, the angle compensation information of the lens chip and the central position information of the lens chip until the gold thread is coincident with the welding point.
By adopting the technical scheme, the lens chip can be accurately attached to the FPC board, the gold threads and the welding points can be coincided, the yield is improved, and therefore the waste of production materials is reduced, and the production cost is reduced.
In a second aspect, the present application provides a mounting system for a camera module chip, which adopts the following technical scheme:
a mounting system for a camera module chip comprises,
a path generation module: the glue drawing path generation device is used for obtaining position information of a welding point and generating a glue drawing path according to the position information of the welding point;
coating a module: the position information of the gold wire is obtained, and solder paste is coated at the tail part of the gold wire according to the position information of the gold wire and the glue drawing path;
a fitting module: the lens chip is attached to the FPC board until the gold thread coincides with the welding point.
By adopting the technical scheme, the gold thread is coincided with the welding point, the yield is improved, and the condition that the positions of the lens chip and the FPC are not right opposite is reduced, so that the waste of production materials is reduced, and the production cost is reduced.
In a third aspect, the present application provides an intelligent terminal, which adopts the following technical scheme:
an intelligent terminal comprises a memory and a processor, wherein the memory is stored with a computer program which can be loaded by the processor and executes the method.
In a fourth aspect, the present application provides a computer-readable storage medium, which adopts the following technical solutions:
a computer-readable storage medium storing a computer program that can be loaded by a processor and executes the above-mentioned method.
In summary, the present application includes at least one of the following beneficial technical effects:
the gold thread is coincided with the welding point, the yield is improved, and the situation that the positions of the lens chip and the FPC are not right opposite is reduced, so that the waste of production materials is reduced, and the production cost is reduced;
can tentatively select scribble the relatively poor gold thread of tin effect, reduce and carry out the condition of follow-up production and processing based on leaking the gold thread that dips in, even glue, glue more, less to improve the yield, reduce manufacturing cost.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present application.
Fig. 2 is a schematic structural diagram of an embodiment of the present application.
FIG. 3 is a schematic flow chart of a method according to an embodiment of the present application.
FIG. 4 is a sub-flowchart of S1 in an embodiment of the present application.
Fig. 5 is a sub-flowchart of S2 in an embodiment of the present application.
Fig. 6 is a flowchart of S25 to S294 of an embodiment of the present application.
Fig. 7 is a sub-flowchart of S3 in an embodiment of the present application.
FIG. 8 is a block diagram illustrating the architecture of a system according to an embodiment of the present application.
Description of reference numerals:
1. a path generation module; 2. coating a module; 3. a fitting module; 4. an FPC board; 41. a welding point; 5. a lens chip; 51. and (4) gold wires.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is further described in detail below with reference to fig. 1-8 and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The embodiment of the application discloses a mounting method of a camera module chip.
As shown in fig. 1 and 2, the shape of the FPC board 4 is adapted to the shape of the lens chip 5, and a plurality of gold wires 51 are mounted on the lens chip 5, and the gold wires 51 can be connected to a circuit and can conduct heat; a plurality of welding points 41 are arranged on the FPC board 4, and the shapes of the welding points 41 are matched with the shapes of the gold threads 51; as shown in fig. 3, the mounting method includes the steps of:
s1, obtaining position information of a welding point 41 and generating a glue drawing path;
specifically, before obtaining the position information of the welding point 41, the UV glue is first prepared according to the actual production requirement, and the UV glue is beneficial to fixing the main body of the subsequent lens chip 5 on the FPC board 4; then, the positional information of the bonding point 41 is obtained, and a dispensing path is generated based on the positional information of the bonding point 41.
As shown in fig. 3 and 4, S1 includes five substeps, i.e., S11, S12, S13, S14, and S15, and specifically includes:
s11, obtaining the position information of the welding point 41 through an upward-looking camera;
specifically, the solder joint 41 on the FPC board 4 is positioned by taking a picture with the upward-looking camera, and the positional information of the solder joint 41 includes the center point information of the solder joint 41.
S12, obtaining area information of the welding point 41 through an upward-looking camera;
specifically, the area information of the solder point 41 indicates the area size of the solder point 41 and the surface condition of the solder point 41.
S13, comparing the area information of the welding point 41 with prestored area information to generate similarity numerical value information;
specifically, the pre-stored area information represents a template drawing of a qualified product, and the similarity value information represents a degree of similarity between the beat drawing of the corresponding product and the template drawing of the qualified product.
S14, if the similarity numerical value information is larger than or equal to a preset value, obtaining the central point information of the FPC board 4 according to the central point information of the welding point 41, and generating a glue drawing path;
specifically, the preset value is adjusted according to the actual production requirement, and in the embodiment, a critical point is used as the preset value; if the similarity numerical value information is larger than or equal to the preset value, the photographed image of the corresponding product is similar to the template image of the qualified product, and the corresponding product is qualified; then, according to the center point information of the welding point 41, the center point information of the FPC board 4 is obtained, and the center point information of the FPC board 4 represents the center point coordinate of the FPC board 4; and generates a glue drawing path according to the central point information of the FPC board 4.
The parameters of the glue drawing path can be adjusted through an algorithm packaged in Halcon, and the glue drawing path can be independently edited; in this embodiment, the parameters of the painting path include painting speed, painting thickness and painting length.
S15, skipping the FPC board 4 if the similarity numerical information is smaller than a preset value;
specifically, if the similarity value information is smaller than the preset value, it indicates that there is a possibility that dirt adheres to the welding point 41 or that the welding point 41 has been damaged; skipping this FPC in the anterior segment process of camera flowing water processing, can reducing welding point 41 and being stained with the filth and making two welding points 41 link together, then cause the circuit short circuit for the condemned condition of product.
S2, obtaining the position information of the gold wire 51, and coating solder paste on the tail part of the gold wire 51;
as shown in fig. 3 and 5, S2 includes four substeps, i.e., S21, S22, S23, and S24, and specifically includes:
s21, obtaining the position information of the gold wire 51 through a downward-looking camera;
specifically, the gold wire 51 on the lens chip 5 is positioned by taking a picture with the downward-looking camera; the position information of the gold wire 51 includes length information of the gold wire 51, width information of the gold wire 51, area information of the gold wire 51, pitch information between two gold wires 51, and center point information of the gold wire 51.
S22, generating the central point connection information of the gold wire 51 according to the central point information of the gold wire 51;
specifically, the gold wire 51 center point connection information indicates that the center point of each gold wire 51 is connected to the center point of the diagonal gold wire 51 to form a straight line, and the straight lines formed by connecting a plurality of diagonal lines have an intersection point; the connection information of the center points of the gold wires 51 includes center coordinate information of straight lines, which is obtained by averaging the center positions of a plurality of straight lines.
S23, obtaining the central position information of the lens chip 5 according to the central coordinate information of the straight line;
specifically, the center position information of the lens chip 5 is obtained from the center coordinate information of the straight line; .
S24, coating solder paste on the tail part of the gold wire 51;
specifically, the tail of the gold wire 51 is subjected to a solder paste application process.
As shown in fig. 6, after the step S24 is executed, 7 steps S25, S26, S27, S28, S29, S291, S292, S293 and S294 are executed, specifically:
s25, obtaining the position information of the solder paste through a downward-looking camera, and executing the step S23 again;
specifically, the position information of the solder paste includes area information of the solder paste and pitch information of the solder paste; in this embodiment, the downward-looking camera is another downward-looking camera for more accurate detection.
S26, comparing the area information of the solder paste with prestored area numerical value range information to generate first tin dipping effect information;
specifically, the pre-stored area numerical range information is adjusted according to actual production requirements; the first dipping effect information includes area passing information or area failing information.
S27, if the area information of the solder paste is in the pre-stored area numerical value range information, the first tin dipping effect information is area passing information;
specifically, if the area information of the solder paste is within the pre-stored area numerical value range information, the area of the solder paste is indicated to meet the production requirement, so that the condition of glue shortage is avoided.
S28, if the area information of the solder paste is not in the pre-stored area numerical value range information, the first tin dipping effect information is area non-passing information;
specifically, if the area information of the solder paste is not within the pre-stored area numerical value range information, the area of the solder paste is indicated to meet the production requirement, so that the condition of excessive glue is avoided.
S29, comparing the spacing information based on the solder paste with the pre-stored spacing numerical range information to generate second tin dipping effect information;
specifically, the pre-stored distance numerical range information is adjusted according to actual production requirements; the second dipping effect information includes pitch passing information or pitch failing information.
S291, if the spacing information of the solder paste is in the pre-stored spacing numerical range information, the second tin dipping effect information is spacing passing information;
specifically, if the spacing information of the solder paste is within the pre-stored spacing value range information, the spacing of the solder paste is in accordance with the production requirement, so that the condition of glue shortage is avoided.
S292, if the spacing information of the solder paste is not in the pre-stored spacing numerical range information, the second tin dipping effect information is spacing non-passing information;
specifically, if the spacing information of the solder pastes is not in the pre-stored spacing value range information, for example, the spacing between different solder pastes is 0mm, it indicates that the spacing of the solder pastes does not meet the production requirement, thereby avoiding the condition of glue connection.
S293, if the first tin dipping effect information is area passing information and the second tin dipping effect information is interval passing information, generating tin dipping passing information;
particularly, if first dip-tin effect information is area passing information and second dip-tin effect information is interval passing information, then it is better to explain the dip-tin effect, accords with the production requirement.
S294, if the first tin dipping effect information is area non-passing information or the second tin dipping effect information is interval non-passing information, generating tin dipping non-passing information;
particularly, if first dip in tin effect information for the area not pass through information or second dip in tin effect information for the interval not pass through information, then explain that the dip in tin effect is relatively poor, be not conform to the production requirement to the reduction is based on the gold thread that leaks to dip in, even glues, many glues, few glues and carries out the situation of production.
S3, attaching the lens chip 5 to the FPC board 4 until the gold wire 51 is superposed with the welding point 41;
as shown in fig. 3 and 7, S3 includes four substeps S31, S32, S33 and S34, and specifically includes:
s31, obtaining rotation angle information of the FPC board 4 through an upward-looking camera;
specifically, because the FPC boards 4 may rotate in different directions during the typesetting, each FPC board 4 is positioned in a specified visual field range by the upward-looking camera to obtain the rotation angle information of the lens chip 5, and the rotation angle information of the lens chip 5 represents the rotation angle of the FPC boards 4; if the FPC board 4 exceeds the specified visual field range, automatic skipping processing or alarm processing is executed according to the actual production requirement; in this embodiment, in order to reduce the downtime of the camera line processing and improve the production efficiency, five positions of the FPC boards 4 may be reserved between two FPC boards 4, and in other embodiments, two or three positions of the FPC boards 4 may be reserved.
S32, obtaining angle compensation information of the lens chip 5 through the rotation angle information;
specifically, the angle compensation information of the lens chip 5 is obtained from the rotation angle information.
S33, obtaining position compensation information of the lens chip 5 through the center position information of the FPC board 4;
specifically, the upward-looking camera feeds back the rotation angle information and the center position information to the downward-looking camera; the position compensation information of the lens chip 5 is obtained by the center position information of the lens chip 5.
S34, attaching the lens chip 5 to the FPC board 4 according to the position compensation information of the lens chip 5, the angle compensation information of the lens chip 5 and the central position information of the lens chip 5 until the gold wire 51 is superposed with the welding point 41;
specifically, the offset of the distance and the offset of the angle are compensated by combining the position compensation information of the lens chip 5 and the angle compensation information of the lens chip 5, the lens chip 5 is attached to the FPC board 4, the gold wire 51 and the welding point 41 are accurately overlapped, and high-precision mounting is realized; and finally, integrally mounting the high-precision mounting finished product on the camera lens to complete processing.
The implementation principle of the mounting method of the camera module chip in the embodiment of the application is as follows: obtaining the position information of the welding point 41, and generating a gluing path according to the position information of the welding point 41; obtaining the position information of the gold wire 51, and coating solder paste on the tail part of the gold wire 51; the lens chip 5 is attached to the FPC board 4 until the gold wire 51 coincides with the soldering point 41.
The embodiment of the application also discloses a mounting system of the camera module chip.
Referring to fig. 8, the mounting system includes:
the generation path module 1: obtaining the position information of the welding point 41, and generating a gluing path according to the position information of the welding point 41;
coating the module 2: obtaining the position information of the gold wire 51, and coating solder paste on the tail part of the gold wire 51;
the attaching module 3: the lens chip 5 is attached to the FPC board 4 until the gold wire 51 coincides with the soldering point 41.
The embodiment of the application also discloses an intelligent terminal.
Specifically, the intelligent terminal comprises a memory and a processor, wherein the memory stores a computer program which can be loaded by the processor and executes the method.
The embodiment of the application also discloses a computer readable storage medium.
The storage medium stores a computer program that can be loaded by a processor and executes the method, and the storage medium may be a removable hard disk, a Read-only memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, or various media capable of storing program codes.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made in the structure, principle and structure according to the present application shall be covered by the protection scope of the present application.
Claims (7)
1. The mounting method of the camera module chip comprises a lens chip (5) and an FPC board (4) matched with the lens chip (5), wherein a gold wire (51) used for communicating circuits is installed on the lens chip (5), and a welding point (41) matched with the gold wire (51) is installed on the FPC board (4), and is characterized by comprising the following steps:
obtaining the position information of a welding point (41), and generating a glue drawing path according to the position information of the welding point (41);
obtaining the position information of the gold wire (51), and coating solder paste on the tail part of the gold wire (51);
attaching the lens chip (5) to the FPC board (4) until the gold wire (51) is superposed with the welding point (41);
the obtaining of the position information of the welding point (41) and the generating of the glue drawing path according to the position information of the welding point (41) specifically include:
obtaining position information of a welding point (41) through an upward-looking camera, wherein the position information of the welding point (41) comprises central point information of the welding point (41);
obtaining area information of the welding point (41) through an upward-looking camera;
comparing the area information of the welding point (41) with prestored area information to generate similarity numerical value information;
if the similarity numerical value information is larger than or equal to a preset value, obtaining the central point information of the FPC board (4) according to the central point information of the welding point (41), and generating a glue drawing path according to the central point information of the FPC board (4);
if the similarity numerical value information is smaller than a preset value, skipping over an FPC (4);
adjusting parameters of the glue drawing path through a Halcon algorithm to realize independent editing processing of the glue drawing path, wherein the parameters of the glue drawing path comprise glue drawing speed, glue drawing thickness and glue drawing length.
2. The mounting method of the camera module chip according to claim 1, wherein the obtaining of the position information of the gold wire (51) and the applying of the solder paste on the tail of the gold wire (51) specifically include:
obtaining position information of gold wires (51) by a downward-looking camera, wherein the position information of the gold wires (51) comprises length information of the gold wires (51), width information of the gold wires (51), area information of the gold wires (51), distance information between different gold wires (51) and central point information of the gold wires (51);
according to the center point information of the gold wires (51), generating gold wire (51) center point connection information for indicating that the center point of the gold wire (51) and the center point of the diagonal gold wire (51) are connected into a straight line, wherein the gold wire (51) center point connection information comprises the center coordinate information of the straight line;
obtaining the central position information of the lens chip (5) according to the central coordinate information of the straight line;
solder paste is coated on the tail of the gold wire (51).
3. The mounting method of the camera module chip according to claim 2, wherein after the solder paste is coated on the tail of the gold wire (51), the position information of the solder paste is obtained by a downward-looking camera, and the center position information of the lens chip (5) is obtained by performing the center coordinate information according to the straight line again, wherein the position information of the solder paste comprises the area information of the solder paste and the distance information of the solder paste;
comparing the area information of the solder paste with prestored area numerical value range information to generate first tin dipping effect information, wherein the first tin dipping effect information comprises area passing information or area failing information;
if the area information of the solder paste is in the pre-stored area numerical value range information, the first tin dipping effect information is area passing information;
if the area information of the solder paste is not in the pre-stored area numerical value range information, the first tin dipping effect information is area non-passing information;
comparing the spacing information of the solder paste with prestored spacing numerical range information to generate second tin dipping effect information, wherein the second tin dipping effect information comprises spacing passing information or spacing failing information;
if the spacing information of the solder paste is within the pre-stored spacing numerical value range information, the second tin dipping effect information is spacing passing information;
if the spacing information of the solder paste is not in the pre-stored spacing numerical range information, the second tin dipping effect information is spacing non-passing information;
if the first tin dipping effect information is area passing information and the second tin dipping effect information is interval passing information, generating tin dipping passing information;
if first tin dipping effect information is the area and does not pass through information or second tin dipping effect information is the interval and does not pass through information, then the tin dipping is generated and does not pass through information.
4. The method for mounting a camera module chip according to claim 1, wherein the attaching the lens chip (5) to the FPC board (4) until the gold wire (51) coincides with the bonding point (41) specifically comprises:
obtaining rotation angle information of the FPC board (4) through an upward-looking camera;
obtaining angle compensation information of the lens chip (5) according to the rotation angle information;
obtaining position compensation information of a lens chip (5) through the central position information of the FPC board (4);
and attaching the lens chip (5) to the FPC board (4) according to the position compensation information of the lens chip (5), the angle compensation information of the lens chip (5) and the central position information of the lens chip (5) until the gold thread (51) is coincident with the welding point (41).
5. A mounting system of a camera module chip, characterized in that the mounting method of claim 1 is adopted, the system comprises,
generation path module (1): the glue drawing path generation device is used for obtaining the position information of the welding point (41) and generating a glue drawing path according to the position information of the welding point (41);
coating module (2): obtaining the position information of the gold wire (51), and coating solder paste on the tail part of the gold wire (51);
bonding module (3): and attaching the lens chip (5) to the FPC board (4) until the gold wire (51) is superposed with the welding point (41).
6. An intelligent terminal, comprising a memory and a processor, the memory having stored thereon a computer program that can be loaded by the processor and that executes the method according to any one of claims 1 to 4.
7. A computer-readable storage medium, in which a computer program is stored which can be loaded by a processor and which executes the method of any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210154854.XA CN114531788B (en) | 2022-02-21 | 2022-02-21 | Surface mounting method, system, terminal and storage medium for camera module chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210154854.XA CN114531788B (en) | 2022-02-21 | 2022-02-21 | Surface mounting method, system, terminal and storage medium for camera module chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114531788A CN114531788A (en) | 2022-05-24 |
| CN114531788B true CN114531788B (en) | 2023-03-24 |
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| JP6277754B2 (en) * | 2014-02-06 | 2018-02-14 | オムロン株式会社 | Quality control system and internal inspection device |
| CN105101637A (en) * | 2015-07-13 | 2015-11-25 | 格科微电子（上海）有限公司 | Method for rapidly welding camera module |
| CN105606620A (en) * | 2016-01-29 | 2016-05-25 | 广州立为信息技术服务有限公司 | PCBA welding spot detection method and system based on vision |
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