CN117615568A - Intelligent wearing FPC anti-continuous tin production process - Google Patents
Intelligent wearing FPC anti-continuous tin production process Download PDFInfo
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- CN117615568A CN117615568A CN202311407993.XA CN202311407993A CN117615568A CN 117615568 A CN117615568 A CN 117615568A CN 202311407993 A CN202311407993 A CN 202311407993A CN 117615568 A CN117615568 A CN 117615568A
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 150
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 62
- 229910000679 solder Inorganic materials 0.000 claims abstract description 229
- 238000001514 detection method Methods 0.000 claims abstract description 138
- 230000003287 optical effect Effects 0.000 claims abstract description 92
- 230000007246 mechanism Effects 0.000 claims abstract description 47
- 238000007639 printing Methods 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 35
- 238000005476 soldering Methods 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 16
- 230000002265 prevention Effects 0.000 claims description 9
- 230000008569 process Effects 0.000 abstract description 29
- 230000008901 benefit Effects 0.000 abstract description 7
- 238000007689 inspection Methods 0.000 abstract description 6
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 6
- 238000004364 calculation method Methods 0.000 description 5
- 230000008439 repair process Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0817—Monitoring of soldering processes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to an intelligent wearing FPC anti-continuous tin production process, which comprises the following steps: optical inspection after printing solder paste, optical inspection after attaching and optical inspection after soldering. The FPC with the tin connection problem is timely withdrawn from the production flow through the production process, so that the FPC with the tin connection problem in the preamble process is prevented from flowing into the subsequent process, wasting production cost and even flowing into the client; according to the invention, accurate detection is realized only by comparing two parameters of the central point and the connected domain unit, so that the operation amount of the optical detection mechanism is reduced, and the detection speed and the detection precision are improved; the AOI detection method disclosed by the invention has the advantages of low energy consumption, high precision and high speed, and adopts a mode of combining AOI detection and X-ray detection for the intelligent wearable FPC with invisible bonding pads after components are attached, so that the bonding pad missing detection is reduced, and the accuracy of continuous tin detection is improved; the invention can also be used for detecting tin leakage and offset of the printed solder paste, and expands the detection range of solder paste problems in the welding process.
Description
Technical Field
The invention relates to the technical field of intelligent wearing FPC production, in particular to an intelligent wearing FPC tin connection preventing production process.
Background
The appearance of the intelligent wearing product enables the intelligent wearing FPC to have the characteristics of microminiaturized components and high-density assembly, and the surface mounting technology faces smaller component gaps and smaller pad spacing, so that larger points exist on the soldering technology, and the problem of tin connection is particularly remarkable. Under the condition that the intelligent wearable FPC has smaller pad spacing, engineers perform a great amount of experimental work on the optimization of soldering process parameters and more suitable soldering materials, and obtain a certain effect, but the problems of tin connection cannot be well avoided no matter the manual, semi-automatic or full-automatic soldering process is adopted. The soldering process comprises a plurality of production processes, under the condition that the tin connection problem is unavoidable, the current technology is difficult to find the tin connection problem in the earlier production processes, and tin connection products are often selected through AOI detection after welding is finished, so that the tin connection problem in the welding preamble process is caused, but the tin connection problem cannot be detected to enter the subsequent process, so that the production cost is wasted, and even the serious problem that the yield of the intelligent wearing FPC product is influenced by the fact that the intelligent wearing FPC product with the tin connection problem is not detected to the inflow client side due to the error rate of the AOI detection after welding is led to.
Disclosure of Invention
In order to solve the problem that the intelligent FPC wearing soldering tin process is easy to generate tin connection, and the problem that the tin connection is generated in a plurality of production flows of the soldering tin process but cannot be detected in time until the tin connection flows into subsequent production flows of the intelligent FPC wearing soldering tin process, the production cost is wasted, and even the tin connection is influenced by the fact that the tin connection flows into a client, the invention provides the intelligent FPC wearing tin connection preventing production process.
The technical scheme adopted for solving the technical problems is as follows:
the invention provides an intelligent wearing FPC anti-continuous tin production process, which comprises the following steps: s1, optical detection after printing solder paste: comparing the intelligent wearing FPC image after the tin paste is printed with the intelligent wearing FPC image preset on the exposed bonding pad of the optical detection mechanism by using optical detection, judging whether the intelligent wearing FPC after the tin paste is printed has continuous tin, and if the intelligent wearing FPC after the tin paste is printed does not have continuous tin, entering a step S2; the step S1 specifically comprises the following steps: s11, acquiring an intelligent wearable FPC image after printing solder paste: after printing solder paste on a bonding pad of the intelligent wearing FPC, acquiring an intelligent wearing FPC image after the solder paste is printed by using optical detection, and acquiring each solder paste center point and each solder paste connected domain unit on the intelligent wearing FPC image after the solder paste is printed; s12, judging whether the intelligent wearable FPC after printing the solder paste has tin connection: if the number of solder paste center points on the intelligent wearing FPC image after the solder paste printing is consistent with the number of solder pad center points preset on the optical detection mechanism, the deviation value of each solder paste center point position and the corresponding solder pad center point position on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism is not more than the center point deviation threshold value, the number of solder paste connected domain units on the intelligent wearing FPC image after the solder paste printing is consistent with the number of solder pad connected domain units on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism, judging that no tin is connected on the intelligent wearing FPC after the solder paste printing, and entering step S2; otherwise, judging that the intelligent wearing FPC after the tin paste is printed has tin connection; s2, optical detection after surface mounting: comparing the intelligent wearing FPC image after the components are attached with the intelligent wearing FPC image preset on the exposed bonding pad of the optical detection mechanism by using optical detection, judging whether the intelligent wearing FPC after the components are attached is connected with tin, and if the intelligent wearing FPC after the components are attached with tin is not connected with tin, entering a step S3; s3, optical detection after welding: the intelligent wearing FPC image after being fed into the reflow soldering is obtained through optical detection and is compared with the intelligent wearing FPC image preset on the exposed bonding pad of the optical detection mechanism, whether the welded intelligent wearing FPC has continuous tin or not is judged, and if the continuous tin does not exist, the welded intelligent wearing FPC completes the production of continuous tin prevention.
The specific generation mode of each pad center point and each pad connected domain unit is as follows: and determining the center point of each pad in the intelligent wearing FPC image of the bare pad, and dividing the area surrounded by the boundary of each pad in the intelligent wearing FPC image of the bare pad into the pad connected domain units.
The specific production mode of each solder paste center point and each solder paste connected domain unit is that each solder paste center point in the intelligent wearing FPC image after the solder paste is printed is determined, and the area surrounded by each solder paste boundary in the intelligent wearing FPC image after the solder paste is printed is divided into the solder paste connected domain units.
The step S2 specifically comprises the following steps: s21, acquiring an intelligent wearable FPC image after mounting components: s1, judging that components are attached to an intelligent wearing FPC (flexible printed circuit) bonding pad without connecting tin, acquiring an intelligent wearing FPC image after the components are attached by using optical detection, and acquiring each solder paste center point and each solder paste connected domain unit on the intelligent wearing FPC image after the components are attached; s22, judging whether the intelligent wearable FPC after the components are attached has tin connection: if the number of solder paste center points on the intelligent wearing FPC image after the components are attached is consistent with the number of solder pad center points preset on the optical detection mechanism, the deviation value of each solder paste center point position and the corresponding solder pad center point position on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism does not exceed the deviation threshold value, the number of solder paste connected domain units on the intelligent wearing FPC image after the components are attached is consistent with the number of solder pad connected domain units on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism, no tin connection is judged on the intelligent wearing FPC after the components are attached, and step S3 is carried out; otherwise, judging that the intelligent wearable FPC after the components are attached has tin connection.
The step S3 specifically comprises the following steps: s31, acquiring welded intelligent wearable FPC images: sending the intelligent wearing FPC without tin after the components are judged to be attached to the intelligent wearing FPC into reflow soldering for soldering, and acquiring the soldered intelligent wearing FPC image by using optical detection to acquire each solder paste center point and each solder paste connected domain unit of the soldered intelligent wearing FPC image; s32, judging whether the welded intelligent wearable FPC has tin connection: if the number of solder paste center points on the welded intelligent wearing FPC image is consistent with the number of solder pad center points preset on the optical detection mechanism, the deviation value of each solder paste center point position and the corresponding solder pad center point position on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism does not exceed the deviation threshold value, and the number of solder paste connected domain units on the welded intelligent wearing FPC image is consistent with the number of solder pad connected domain units on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism, judging that no tin is connected on the welded intelligent wearing FPC, and completing tin connection prevention production; otherwise, judging that the intelligent wearable FPC solder paste has a problem after welding.
The optical detection is AOI detection or X-ray detection, and if all bonding pads are visible after the intelligent wearing FPC is attached to the components, the steps S1, S2 and S3 all adopt AOI detection; if the intelligent wearable FPC is provided with a bonding pad with invisible surface after components are mounted, AOI detection is adopted in the step S1, and X-ray detection is adopted in the steps S2 and S3.
AOI detection adopts a laser radar triangular ranging method to carry out optical detection.
The production process of the anti-continuous tin can also be used for judging whether the tin leakage and the offset of the printed tin paste of the wearing FPC exist.
The specific mode of the tin connection prevention production process for judging whether tin leakage exists in the printed tin paste of the wearing FPC is as follows: after printing solder paste on a bonding pad of the intelligent wearing FPC, optical detection is used for obtaining each solder paste center point and each solder paste connected domain unit on the intelligent wearing FPC, and if the number of the solder paste center points of the intelligent wearing FPC is smaller than the number of the bonding pad center points preset in the optical detection mechanism, or the number of the solder paste connected domain units on the intelligent wearing FPC is smaller than the number of the bonding pad connected domain units preset in the optical detection mechanism, the problem of tin leakage of the printed solder paste of the intelligent wearing FPC is judged.
The specific mode of the anti-continuous tin production process for judging whether offset problem exists in the printed solder paste of the wearing FPC is as follows: after printing solder paste on a bonding pad of the intelligent wearing FPC, acquiring the position of each solder paste central point and the number of each solder paste connected domain unit on the intelligent wearing FPC by using optical detection, and judging that the printed solder paste of the intelligent wearing FPC has an offset problem if the distance of the position of the solder paste central point, which is not less than one of the positions of the solder paste central points, of the intelligent wearing FPC deviates from the position of the solder pad central point by more than a deviation threshold, wherein the deviation threshold is 1/4 of the minimum bonding pad spacing of the intelligent wearing FPC.
The beneficial effects of the invention include:
according to the invention, after tin paste is printed, after the soldering and the soldering are carried out respectively by adopting the optical detection mechanism in a plurality of stages of the welding process of the intelligent wearing FPC, the intelligent wearing FPC with the tin problem is detected to exit from the production flow of the welding process in time, so that the problem that the wearing FPC with the tin problem in the preamble process flows into the subsequent process flow to waste the production cost and even flows into the client to influence the production yield of the intelligent wearing product is prevented.
In the second aspect, the solder paste center point and the solder paste communicating region unit on the intelligent wearing FPC image at different process stages are respectively compared with the solder pad center point and the solder pad communicating region unit on the intelligent wearing FPC image of the bare solder pad, and accurate detection is realized only by using two parameters of the center point and the communicating region unit, so that the operation amount of an optical detection mechanism is reduced, and meanwhile, the detection speed and the detection precision are improved.
In the third aspect, the AOI detection method provided by the invention adopts a laser triangulation method, has the advantages of low energy consumption, high precision and high speed, and can be used for carrying out tin connection detection in a mode of combining AOI detection and X-ray detection by intelligently wearing an FPC (flexible printed circuit) with invisible bonding pads after mounting components, so that the bonding pad missing detection is reduced, and the accuracy of tin connection detection is improved.
In the fourth aspect, the anti-continuous tin production process of the invention can be used for detecting tin leakage and offset problems of the printed solder paste, and expands the solder paste problem detection range of the welding process.
Drawings
FIG. 1 is a flow chart of an intelligent wearable FPC anti-tin production process provided by an embodiment of the invention;
FIG. 2 is a flow chart of an optical inspection process after printing solder paste according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a pad center point and a pad connected domain unit structure in an intelligent wearable FPC image of a bare pad provided by an embodiment of the present invention;
fig. 4 is a schematic diagram of a solder paste center point and a solder paste connected domain unit structure in an intelligent wearable FPC image after printing solder paste according to an embodiment of the present invention;
FIG. 5 is a flow chart of a post-patch optical inspection process provided by an embodiment of the present invention;
fig. 6 is a flow chart of a post-weld optical inspection process provided by an embodiment of the present invention.
Reference numerals:
1-intelligent wearing of an FPC; 2-bonding pads; 3-pad center point; a 4-pad connected domain unit; 5-a solder paste center point; and 6-solder paste connected domain units.
Detailed Description
The invention is further described below with reference to the drawings and detailed description.
The problem of tin connection in the surface mounting process stage is one of the production difficulties faced by the current intelligent FPC wearing. The surface mounting process mainly comprises the following steps: firstly, solder paste printing is carried out on an FPC solder paste, then electronic components are attached to the FPC solder paste printed solder paste according to requirements, and then the solder paste is melted by adopting a reflow soldering technology, so that the electronic components are fixed on the FPC, and a specific electric communication function is realized. Compared with the through hole inserting technology, the FPC produced by the surface mounting technology has the advantages that the electronic components and the welding spots are positioned on the same side, the weight and the size of the printed circuit board are greatly reduced, and the FPC assembly density is effectively improved. In the above process, tin connection is easy to generate in the solder paste printing stage, the electronic component mounting stage and the reflow soldering stage, the intelligent wearable FPC which generates tin connection needs to be withdrawn from the production process in time in each stage, so that the production cost is reduced, the detection efficiency is improved, and the withdrawn product after detection accords with the intelligent wearable FPC after repair and can be re-entered into the solder paste printing stage for soldering.
Referring to fig. 1 and 2, the invention provides an intelligent wearable FPC anti-tin production process, which comprises the following steps: s1, optical detection after printing solder paste: comparing the intelligent wearing FPC image after the tin paste is printed with the intelligent wearing FPC image preset on the exposed bonding pad of the optical detection mechanism by using optical detection, judging whether the intelligent wearing FPC after the tin paste is printed has continuous tin, and if the intelligent wearing FPC after the tin paste is printed does not have continuous tin, entering a step S2; the step S1 specifically comprises the following steps: s11, acquiring an intelligent wearable FPC image after printing solder paste: after printing solder paste on a bonding pad of the intelligent wearing FPC, acquiring an intelligent wearing FPC image after the solder paste is printed by using optical detection, and acquiring each solder paste center point and each solder paste connected domain unit on the intelligent wearing FPC image after the solder paste is printed; s12, judging whether the intelligent wearable FPC after printing the solder paste has tin connection: if the number of solder paste center points on the intelligent wearing FPC image after the solder paste printing is consistent with the number of solder pad center points preset on the optical detection mechanism, the deviation value of each solder paste center point position and the corresponding solder pad center point position on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism is not more than the center point deviation threshold value, the number of solder paste connected domain units on the intelligent wearing FPC image after the solder paste printing is consistent with the number of solder pad connected domain units on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism, judging that no tin is connected on the intelligent wearing FPC after the solder paste printing, and entering step S2; otherwise, judging that the intelligent wearing FPC after the tin paste is printed has tin connection; s2, optical detection after surface mounting: comparing the intelligent wearing FPC image after the components are attached with the intelligent wearing FPC image preset on the exposed bonding pad of the optical detection mechanism by using optical detection, judging whether the intelligent wearing FPC after the components are attached is connected with tin, and if the intelligent wearing FPC after the components are attached with tin is not connected with tin, entering a step S3; s3, optical detection after welding: the intelligent wearing FPC image after being fed into the reflow soldering is obtained through optical detection and is compared with the intelligent wearing FPC image preset on the exposed bonding pad of the optical detection mechanism, whether the welded intelligent wearing FPC has continuous tin or not is judged, and if the continuous tin does not exist, the welded intelligent wearing FPC completes the production of continuous tin prevention.
Specifically, the FPC with the tin connection problem is detected in time in different stages of the production process, so that on one hand, the problem that the FPC flows into a subsequent process and even flows into a client due to false detection can be avoided, and on the other hand, the problem that the FPC is repaired and reenters the production stage in time can be improved, and the final production yield of the FPC is improved. The present invention relates to a pad center point and a solder paste center point, which adopt the concept of geometric center centroid, an object such as a pad and a solder paste has uniform density, or the shape and density of the object have certain symmetry enough to determine the geometric center centroid, and a limited number of points always have geometric centers, and the geometric center point can be obtained by calculating the arithmetic average value of each coordinate component of the points. The center is the only minimum point of the square sum of the distances from one point to the limited points in the space, and the centroid position can be determined, namely the center point position of the bonding pad and the solder paste in the scheme. It should be noted that, judging whether to connect tin, comparing the number of connected domains with that of the bonding pads through the solder paste connected domain unit, but in actual production, if the printed solder paste is offset by two greatly, i.e. the offset between the center point of the solder paste and the center point of the bonding pad exceeds the offset threshold of the center point, then tin connection occurs along with collapse of the solder paste in a large proportion in the subsequent reflow soldering process, so that the intelligent wearable FPC is withdrawn from the current process as soon as possible to save the production cost, and the offset threshold of the center point and the minimum bonding pad spacing in the intelligent wearable FPC are set according to the precision requirement of the FPC product, preferably 1/4 of the minimum bonding pad spacing.
Further, referring to fig. 3, the specific generation manner of each pad center point 3 and each pad connected domain unit 4 is as follows: and determining the center point 3 of each pad in the intelligent wearing FPC1 image of the exposed pad 2, and dividing the area surrounded by the boundary of each pad 2 in the intelligent wearing FPC1 image of the exposed pad 2 into the pad communicating region units 4.
Specifically, the pad communication domain units 4 are not joined to each other. In the invention, an intelligent wearable FPC1 image of an original bare bonding pad 2 is selected and stored in an optical detection mechanism to be used as a comparison reference image.
Further, referring to fig. 4, the specific production mode of each solder paste center point 5 and each solder paste connected domain unit 6 is that each solder paste center point 5 in the image of the intelligent wearable FPC1 after printing the solder paste is determined, and the area surrounded by each solder paste boundary in the image of the intelligent wearable FPC1 after printing the solder paste is divided into the solder paste connected domain units 6.
Specifically, during the solder paste printing stage, when the missing image, the more tin, the less tin or the tin connection occurs, the number of the solder paste center points 5 is possibly different from the number of the solder pad center points 3, the number of the solder paste connected domain units 6 and the number of the solder pad connected domain units 4, so that the problem of the FPC in the part can be found through the number judgment, the comparison parameters are less, the calculation amount of the optical detection mechanism is less, and the calculation speed is high.
Further, referring to fig. 5, step S2 specifically includes: s21, acquiring an intelligent wearable FPC image after mounting components: s1, judging that components are attached to an intelligent wearing FPC (flexible printed circuit) bonding pad without connecting tin, acquiring an intelligent wearing FPC image after the components are attached by using optical detection, and acquiring each solder paste center point and each solder paste connected domain unit on the intelligent wearing FPC image after the components are attached; s22, judging whether the intelligent wearable FPC after the components are attached has tin connection: if the number of solder paste center points on the intelligent wearing FPC image after the components are attached is consistent with the number of solder pad center points preset on the optical detection mechanism, the deviation value of each solder paste center point position and the corresponding solder pad center point position on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism does not exceed the deviation threshold value, the number of solder paste connected domain units on the intelligent wearing FPC image after the components are attached is consistent with the number of solder pad connected domain units on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism, no tin connection is judged on the intelligent wearing FPC after the components are attached, and step S3 is carried out; otherwise, judging that the intelligent wearable FPC after the components are attached has tin connection.
Specifically, the method for judging whether continuous tin exists comprises the following steps: and judging that the intelligent wearing FPC has no tin connection, and simultaneously meeting 3 conditions, namely, the number of the central points is consistent, the central points do not exceed a deviation threshold value, and the comparison of connected domain units. Any one of the 3 conditions is not met, namely the intelligent wearing FPC is judged to have the continuous image problem.
Further, the step S3 specifically includes: s31, acquiring welded intelligent wearable FPC images: sending the intelligent wearing FPC without tin after the components are judged to be attached to the intelligent wearing FPC into reflow soldering for soldering, and acquiring the soldered intelligent wearing FPC image by using optical detection to acquire each solder paste center point and each solder paste connected domain unit of the soldered intelligent wearing FPC image; s32, judging whether the welded intelligent wearable FPC has tin connection: if the number of solder paste center points on the welded intelligent wearing FPC image is consistent with the number of solder pad center points preset on the optical detection mechanism, the deviation value of each solder paste center point position and the corresponding solder pad center point position on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism does not exceed the deviation threshold value, and the number of solder paste connected domain units on the welded intelligent wearing FPC image is consistent with the number of solder pad connected domain units on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism, judging that no tin is connected on the welded intelligent wearing FPC, and completing tin connection prevention production; otherwise, judging that the intelligent wearable FPC solder paste has a problem after welding.
It should be noted that, whether in the solder paste printing stage, the component mounting stage and the welding stage, the intelligent wearing FPC with the solder paste problem is judged to exit the current process flow in time for repair detection, and the intelligent wearing FPC is detected to be scrapped or is cleaned and then reentered into the solder paste printing stage for welding, so that the intelligent wearing FPC with the solder paste problem can be partially detected and is put into the production line again through repair, and the production yield of the intelligent wearing FPC is generally improved.
Further, the optical detection is AOI detection or X-ray detection, and if all bonding pads are visible after the intelligent wearing FPC is attached to the components, the steps S1, S2 and S3 all adopt AOI detection; if the intelligent wearable FPC is provided with a bonding pad with invisible surface after components are mounted, AOI detection is adopted in the step S1, and X-ray detection is adopted in the steps S2 and S3.
Specifically, the AOI detection and the X-RAY detection are all devices for detecting common defects encountered in the solder production process on the premise of not damaging an object to be detected, the AOI detection has the advantage of detecting the plane of the exposed part of the product, and the X-RAY detection has the advantage of penetrating the inside of the product to detect the covered part of the surface.
Further, AOI detection adopts a laser radar triangulation ranging method to carry out optical detection.
Specifically, an industrial camera is generally adopted for AOI detection, but the intelligent wearable FPC has the advantages of low energy consumption, high calculation speed and high detection precision due to small pad spacing and high element integration degree, and the adoption of the industrial camera can easily cause slow calculation speed to influence the detection efficiency, while the laser radar detection mode has the advantages of low energy consumption, high calculation speed and high detection precision.
Furthermore, the production process of preventing tin connection can also be used for judging whether tin leakage and offset problems exist in the printed tin paste of the wearing FPC. The specific mode of the tin connection prevention production process for judging whether tin leakage exists in the printed tin paste of the wearing FPC is as follows: after printing solder paste on a bonding pad of the intelligent wearing FPC, optical detection is used for obtaining each solder paste center point and each solder paste connected domain unit on the intelligent wearing FPC, and if the number of the solder paste center points of the intelligent wearing FPC is smaller than the number of the bonding pad center points preset in the optical detection mechanism, or the number of the solder paste connected domain units on the intelligent wearing FPC is smaller than the number of the bonding pad connected domain units preset in the optical detection mechanism, the problem of tin leakage of the printed solder paste of the intelligent wearing FPC is judged. The specific mode of the anti-continuous tin production process for judging whether offset problem exists in the printed solder paste of the wearing FPC is as follows: after printing solder paste on a bonding pad of the intelligent wearing FPC, acquiring the position of each solder paste central point and the number of each solder paste connected domain unit on the intelligent wearing FPC by using optical detection, and judging that the printed solder paste of the intelligent wearing FPC has an offset problem if the distance of the position of the solder paste central point, which is not less than one of the positions of the solder paste central points, of the intelligent wearing FPC deviates from the position of the solder pad central point by more than a deviation threshold, wherein the deviation threshold is 1/4 of the minimum bonding pad spacing of the intelligent wearing FPC.
Specifically, the invention adopts the process to compare the solder paste central point and the solder pad central point at each stage, and the solder paste connected domain unit and the solder pad connected domain unit at each stage, wherein the comparison content comprises the number and the position, and the central point and the connected domain are two parameters, so that other solder paste problems such as tin leakage, tin deficiency and offset can be judged.
The intelligent FPC that dresses produces and even tin, and the root that its problem produced is various, including the setting problem of technological parameter, the design problem that FPC produced, the selection problem of solder paste material to and intelligent FPC itself pad interval's characteristic of dressing, if: the wave soldering tin connection phenomenon is generated because the process design of the circuit board is more and more complex and the lead pin spacing is more and more dense. Wherein changing the pad design is a solution. Such as decreasing the pad size, increasing the length of the bump side, increasing the flux activity/decreasing the lead extension are also solutions. And (3) the molten tin after wave soldering wets the surface of the circuit board to form a tin connection phenomenon between component pins. The main reason for this is that the inner diameter of the empty solder pad is too large or the outer diameter of the pins of the component is too small. The method aims at various sources of the generated continuous problems, on one hand, the sources of the problems can be respectively optimized to reduce continuous tin, and on the other hand, the intelligent wearable FP C continuous tin problem is reduced and the production yield is improved by implementing the continuous tin prevention production process.
It will be apparent to those skilled in the art from this disclosure that various other changes and modifications can be made which are within the scope of the invention as defined in the appended claims.
It should be noted that: the embodiments described above are only some, but not all, embodiments of the invention. As used in the examples and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Claims (10)
1. The intelligent wearing FPC tin connection preventing production process is characterized by comprising the following steps of:
s1, optical detection after printing solder paste: comparing the intelligent wearing FPC image after the tin paste is printed with the intelligent wearing FPC image preset on the exposed bonding pad of the optical detection mechanism by using optical detection, judging whether the intelligent wearing FPC after the tin paste is printed has continuous tin, and if the intelligent wearing FPC after the tin paste is printed does not have continuous tin, entering a step S2; the step S1 specifically comprises the following steps:
s11, acquiring an intelligent wearable FPC image after printing solder paste: after printing solder paste on a bonding pad of the intelligent wearing FPC, acquiring an intelligent wearing FPC image after the solder paste is printed by using optical detection, and acquiring each solder paste center point and each solder paste connected domain unit on the intelligent wearing FPC image after the solder paste is printed;
s12, judging whether the intelligent wearable FPC after printing the solder paste has tin connection: if the number of solder paste center points on the intelligent wearing FPC image after the solder paste printing is consistent with the number of solder pad center points preset on the optical detection mechanism, the deviation value of each solder paste center point position and the corresponding solder pad center point position on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism is not more than the center point deviation threshold value, the number of solder paste connected domain units on the intelligent wearing FPC image after the solder paste printing is consistent with the number of solder pad connected domain units on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism, judging that no tin is connected on the intelligent wearing FPC after the solder paste printing, and entering step S2; otherwise, judging that the intelligent wearing FPC after the tin paste is printed has tin connection;
s2, optical detection after surface mounting: comparing the intelligent wearing FPC image after the components are attached with the intelligent wearing FPC image preset on the exposed bonding pad of the optical detection mechanism by using optical detection, judging whether the intelligent wearing FPC after the components are attached is connected with tin, and if the intelligent wearing FPC after the components are attached with tin is not connected with tin, entering a step S3;
s3, optical detection after welding: the intelligent wearing FPC image after being fed into the reflow soldering is obtained through optical detection and is compared with the intelligent wearing FPC image preset on the exposed bonding pad of the optical detection mechanism, whether the welded intelligent wearing FPC has continuous tin or not is judged, and if the continuous tin does not exist, the welded intelligent wearing FPC completes the production of continuous tin prevention.
2. The intelligent wearable FPC anti-tin production process according to claim 1, wherein the specific production modes of the center point of each bonding pad and each bonding pad connected domain unit are as follows: and determining the center point of each pad in the intelligent wearing FPC image of the bare pad, and dividing the area surrounded by the boundary of each pad in the intelligent wearing FPC image of the bare pad into the pad connected domain units.
3. The intelligent wearing FPC anti-continuous tin production process according to claim 2, wherein the specific production mode of each solder paste center point and each solder paste connected domain unit is that each solder paste center point in the intelligent wearing FPC image after the solder paste is printed is determined, and the area surrounded by each solder paste boundary in the intelligent wearing FPC image after the solder paste is printed is divided into the solder paste connected domain units.
4. The intelligent wearable FPC anti-tin production process according to claim 1, wherein the step S2 specifically comprises:
s21, acquiring an intelligent wearable FPC image after mounting components: s1, judging that components are attached to an intelligent wearing FPC (flexible printed circuit) bonding pad without connecting tin, acquiring an intelligent wearing FPC image after the components are attached by using optical detection, and acquiring each solder paste center point and each solder paste connected domain unit on the intelligent wearing FPC image after the components are attached;
s22, judging whether the intelligent wearable FPC after the components are attached has tin connection: if the number of solder paste center points on the intelligent wearing FPC image after the components are attached is consistent with the number of solder pad center points preset on the optical detection mechanism, the deviation value of each solder paste center point position and the corresponding solder pad center point position on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism does not exceed the deviation threshold value, the number of solder paste connected domain units on the intelligent wearing FPC image after the components are attached is consistent with the number of solder pad connected domain units on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism, no tin connection is judged on the intelligent wearing FPC after the components are attached, and step S3 is carried out; otherwise, judging that the intelligent wearable FPC after the components are attached has tin connection.
5. The intelligent wearable FPC anti-tin production process according to claim 1, wherein the step S3 specifically comprises:
s31, acquiring welded intelligent wearable FPC images: sending the intelligent wearing FPC without tin after the components are judged to be attached to the intelligent wearing FPC into reflow soldering for soldering, and acquiring the soldered intelligent wearing FPC image by using optical detection to acquire each solder paste center point and each solder paste connected domain unit of the soldered intelligent wearing FPC image;
s32, judging whether the welded intelligent wearable FPC has tin connection: if the number of solder paste center points on the welded intelligent wearing FPC image is consistent with the number of solder pad center points preset on the optical detection mechanism, the deviation value of each solder paste center point position and the corresponding solder pad center point position on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism does not exceed the deviation threshold value, and the number of solder paste connected domain units on the welded intelligent wearing FPC image is consistent with the number of solder pad connected domain units on the intelligent wearing FPC image of the exposed solder pad in the optical detection mechanism, judging that no tin is connected on the welded intelligent wearing FPC, and completing tin connection prevention production; otherwise, judging that the intelligent wearable FPC solder paste has a problem after welding.
6. The intelligent wearing FPC anti-tin production process according to claim 1, wherein the optical detection is AOI detection or X-ray detection, and if all pads are visible after the intelligent wearing FPC is attached to the components, steps S1, S2, S3 all adopt AOI detection; if the intelligent wearable FPC is provided with a bonding pad with invisible surface after components are mounted, AOI detection is adopted in the step S1, and X-ray detection is adopted in the steps S2 and S3.
7. The intelligent wearable FPC anti-tin production process according to claim 6, wherein the AOI detection is optical detection by adopting a laser radar triangulation method.
8. The intelligent wearable FPC anti-continuous tin production process according to claim 1, wherein the anti-continuous tin production process can be used for judging whether tin leakage and offset problems exist in the wearable FPC printing tin paste.
9. The intelligent wearable FPC anti-continuous tin production process according to claim 8, wherein the specific mode for judging whether the tin leakage problem exists in the wearable FPC printing tin paste is as follows:
after printing solder paste on a bonding pad of the intelligent wearing FPC, optical detection is used for obtaining each solder paste center point and each solder paste connected domain unit on the intelligent wearing FPC, and if the number of the solder paste center points of the intelligent wearing FPC is smaller than the number of the bonding pad center points preset in the optical detection mechanism, or the number of the solder paste connected domain units on the intelligent wearing FPC is smaller than the number of the bonding pad connected domain units preset in the optical detection mechanism, the problem of tin leakage of the printed solder paste of the intelligent wearing FPC is judged.
10. The intelligent wearable FPC anti-continuous tin production process of claim 8, wherein the specific way for judging whether the wearable FPC printing tin paste has the offset problem is as follows:
after printing solder paste on a bonding pad of the intelligent wearing FPC, acquiring the position of each solder paste central point and the number of each solder paste connected domain unit on the intelligent wearing FPC by using optical detection, and judging that the printed solder paste of the intelligent wearing FPC has an offset problem if the distance of the position of the solder paste central point, which is not less than one of the positions of the solder paste central points, of the intelligent wearing FPC deviates from the position of the solder pad central point by more than a deviation threshold, wherein the deviation threshold is 1/4 of the minimum bonding pad spacing of the intelligent wearing FPC.
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