CN114512562A - Double-glass assembly, packaging method thereof and electronic component - Google Patents

Double-glass assembly, packaging method thereof and electronic component Download PDF

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Publication number
CN114512562A
CN114512562A CN202210112199.1A CN202210112199A CN114512562A CN 114512562 A CN114512562 A CN 114512562A CN 202210112199 A CN202210112199 A CN 202210112199A CN 114512562 A CN114512562 A CN 114512562A
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Prior art keywords
glass
glass assembly
dual
packaging material
opening
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CN202210112199.1A
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CN114512562B (en
Inventor
王龙
毛云飞
魏梦娟
侯宏兵
周光大
林建华
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Foster Jiaxing New Material Co ltd
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Foster Jiaxing New Material Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a dual-glass assembly, a packaging method thereof and an electronic component. The packaging method comprises the following steps: laminating and laying the front layer of glass, the front layer of packaging adhesive film, the battery unit, the rear layer of packaging adhesive film and the rear layer of glass to obtain a laminated assembly, wherein the rear layer of glass is provided with an opening, the battery piece of the battery unit collects current through a bus bar, and the bus bar penetrates through the opening to be electrically connected with the junction box; filling the remaining part of the opening with a packaging material; and laminating the laminated assembly to obtain the double-glass assembly. Adopt packaging material to carry out the lamination to the lamination subassembly after filling the remaining part of the trompil on the back layer glass, reduced the risk that the battery piece broke on the one hand. On the other hand, back layer encapsulation glued membrane also can be thinner relatively to the cost is reduced, simultaneously, the trompil on the encapsulation material packing back layer glass makes the trompil more abundant by the filling with the synergism of back layer encapsulation glued membrane, thereby has reduced the hole site bubble.

Description

Double-glass assembly, packaging method thereof and electronic component
Technical Field
The invention relates to the technical field of photoelectricity, in particular to a dual-glass assembly, a packaging method of the dual-glass assembly and an electronic component.
Background
The double-sided battery double-glass assembly has high photoelectric conversion efficiency and excellent reliability because both the front side and the back side can generate electricity, and therefore, the double-sided battery double-glass assembly is developed rapidly in recent years. Wherein, the back glass of the dual-glass assembly is provided with an opening with the diameter of about 3cm at the lead, and the bus bar is led out from the opening and connected with the junction box.
In the double-sided battery dual-glass assembly lamination process, trompil department glued membrane all around can flow to trompil department, leads to the glued membrane on every side of the trompil to be thin partially, the cell piece fragmentation scheduling problem appears easily, simultaneously, because can't fill up the trompil to the glued membrane that trompil department flows, has the hole site bubble to influence double-sided battery dual-glass assembly's outward appearance, lead to double-sided battery dual-glass assembly's quality to degrade. In order to reduce the proportion of hole site bubbles and hole site splinters in the prior art, a high-thickness packaging adhesive film is used, and although the proportion of the hole site bubbles and the hole site splinters is relieved, the cost of the double-sided battery double-glass assembly is increased. Therefore, a new method is needed to solve the problems of hole site bubbles and hole site splinters, and simultaneously, the thickness of the adhesive film can be reduced, and the assembly cost can be reduced.
Disclosure of Invention
The invention mainly aims to provide a dual-glass assembly, a packaging method thereof and an electronic component, and aims to solve the problems of hole site bubbles, hole site splinters and high cost in the laminating process of the dual-glass assembly in the prior art.
In order to achieve the above object, according to one aspect of the present invention, there is provided an encapsulation method of a dual glass assembly, the encapsulation method including: laminating and laying the front layer of glass, the front layer of packaging adhesive film, the battery unit, the rear layer of packaging adhesive film and the rear layer of glass to obtain a laminated assembly, wherein the rear layer of glass is provided with an opening, the battery piece of the battery unit collects current through a bus bar, and the bus bar penetrates through the opening to be electrically connected with the junction box; filling the remaining part of the opening with a packaging material; and laminating the laminated assembly to obtain the double-glass assembly.
Further, the filling volume of the packaging material is 5-100% of the volume of the remaining part of the opening.
Further, the above-mentioned encapsulating material is filled into the open pores in a granular form or a gel form.
Further, the volume of the particles of the above-mentioned encapsulating material in the form of particles is 10-6mm3～104mm3。
Further, the complex viscosity of the sealing material in the form of a gel is 300 pas to 105Pa · s, preferably 5200 to 9.26 × 104Pa·s。
Further, the packaging material is a cross-linking type packaging material or a non-cross-linking type packaging material in parts by weight, and the cross-linking type packaging material comprises: 100 parts by weight of a first matrix resin, 0.01-2 parts by weight of peroxide, 0.02-3 parts by weight of cross-linking aid and 0.02-3 parts by weight of a silane coupling agent; preferably, the first matrix resin is selected from a copolymer of ethylene and any one or more of vinyl acetate, propylene, butene, pentene, hexene or octene; preferably the peroxide is selected from the group consisting of isopropyl t-butylperoxycarbonate, 2, 5-dimethyl-2, 5- (di-t-butylperoxy) hexane, 2-ethylhexyl t-butylperoxycarbonate, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, 1-bis (t-amylperoxy) cyclohexane, 1-bis (t-butylperoxy) cyclohexane, 2-bis (t-butylperoxy) butane, t-amyl peroxy 2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-bis (benzoylperoxy) -hexane, t-amyl peroxy carbonate, and mixtures thereof, Any one or more of tert-butyl peroxy-3, 3, 5-trimethylhexanoate, preferably the co-crosslinking agent is selected from triallyl isocyanurate, triallyl cyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, ethoxylated glycerol triacrylate, propoxylated glycerol triacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, trimethylolpropane tetraacrylate, ditrimethylolpropane tetramethacrylate, propoxylated pentaerythritol tetraacrylate, 2,4, 6-tris (2-propenyloxy) -1,3, 5-triazine, tricyclodecane dimethanol diacrylate, propoxylated neopentyl glycol diacrylate, ethoxylated bisphenol A dimethacrylate, 2-butyl-2-ethyl-1, 3-propanediol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, preferably silane coupling agents selected from one or more of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltributylsilane, vinyltriacetoxysilane, vinyltris (. beta. -methoxyethoxy) silane, gamma-aminopropyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-glycidoxypropyltrimethylsilane, poly (ethyleneglycol) dimethacrylate, poly (ethyleneglycol) acrylate), poly (ethyleneglycol) acrylate, poly (ethyleneglycol) acrylate), poly (ethyleneglycol) acrylate, and poly (ethyleneglycol) acrylate), poly (ethyleneglycol) acrylate, and poly (ethyleneglycol) acrylate), poly (ethyleneglycol, and (ethyleneglycol) acrylate), and poly (ethyleneglycol) acrylate), and/or (ethyleneglycol) acrylate), any one or more of 3-aminopropyltrimethylsilane; the non-crosslinking type packaging material preferably comprises a silane-grafted second base resin, the grafting ratio of the silane-grafted second base resin is 0.01-10%, preferably 0.5-5%, the second base resin is preferably selected from one or more of PE, PP, EVA and POE, and the silane is preferably selected from one or more of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltributyl peroxide, vinyltriacetoxysilane, vinyltris (beta-methoxyethoxy) silane, gamma-aminopropyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-glycidoxypropyltrimethylsilane and 3-aminopropyltrimethylsilane.
Further, the melt index of the first matrix resin and the melt index of the second matrix resin are each independently 1 to 50g/10min, preferably 5 to 30g/10 min.
Further, the melting points of the first matrix resin and the second matrix resin are respectively and independently between 40 ℃ and 150 ℃.
According to another aspect of the present invention, there is provided a dual glass assembly obtained by the above-described encapsulation method.
According to another aspect of the invention, an electronic component is provided, and the electronic component comprises any one of a solar cell, a liquid crystal panel, an electroluminescent device, a plasma display device and a touch screen, and the electronic component comprises a dual-glass assembly, and the dual-glass assembly is the dual-glass assembly.
By applying the technical scheme of the invention, the packaging material is adopted to fill the residual part of the opening on the rear layer glass and then laminate the laminated assembly, so that the amount of the rear layer packaging adhesive film which needs to flow to the opening in the laminating process is reduced, the risk that the adhesive film around the opening is thin is further reduced, and the risk of breaking the battery piece is further reduced. On the other hand, back layer encapsulation glued membrane also can attenuate some relatively to the cost is reduced, simultaneously, trompil and back layer encapsulation glued membrane's synergism on the back layer glass are filled to the encapsulating material makes the trompil filled more abundant, thereby has reduced the hole site bubble, and is visible, adopts above-mentioned method of this application not only can reduce hole site bubble and hole site lobe of a leaf risk, can also reduce cost.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail with reference to examples.
As analyzed in the background art, the problems of hole site bubbles, hole site splinters and high cost exist in the laminating process of the dual-glass assembly in the prior art, and in order to solve the problems, the invention provides the dual-glass assembly, the packaging method thereof and the electronic component.
In an exemplary embodiment of the present application, there is provided a method of encapsulating a dual glass assembly, the method comprising: laminating and laying the front layer of glass, the front layer of packaging adhesive film, the battery unit, the rear layer of packaging adhesive film and the rear layer of glass to obtain a laminated assembly, wherein the rear layer of glass is provided with an opening, the battery piece of the battery unit collects current through a bus bar, and the bus bar penetrates through the opening to be electrically connected with the junction box; filling the remaining part of the opening with a packaging material; and laminating the laminated assembly to obtain the double-glass assembly.
Adopt packaging material to carry out the lamination to the lamination subassembly after filling the remaining part of the trompil on the back layer glass to reduce the back layer encapsulation glued membrane and need to the volume that the trompil flows at the lamination in-process, and then reduced the risk that the glued membrane around the trompil is thin partially, further reduced the risk of battery piece fragment. On the other hand, back layer encapsulation glued membrane also can attenuate some relatively to the cost is reduced, simultaneously, trompil and back layer encapsulation glued membrane's synergism on the back layer glass are filled to the encapsulating material makes the trompil filled more abundant, thereby has reduced the hole site bubble, and is visible, adopts above-mentioned method of this application not only can reduce hole site bubble and hole site lobe of a leaf risk, can also reduce cost.
If the filling volume of the packaging material to the volume of the remaining part of the opening is too small, although the risk of breaking the battery piece can be reduced to a certain extent, the thickness of the rear-layer packaging adhesive film is reduced too little, and the cost reduction effect is not obvious. Preferably, when the filling volume of the packaging material is 5% -100% of the volume of the remaining part of the opening, the packaging material can be effectively filled in the remaining part of the opening, the risk of breaking the battery piece is reduced, the thickness of the rear-layer packaging adhesive film is reduced as much as possible, and therefore the cost is reduced.
In one embodiment of the present application, the encapsulating material is filled into the openings in granular form or in gel form.
The back glass of the laminated assembly faces upwards, and for the opening on the back glass, the packaging material can be filled into the opening in a granular form under the action of gravity, and the packaging material in a colloidal form can be filled into the opening under the action of gravity and fluidity. In the specific operation, the form of the packaging material can be selected according to the actual situation so as to conveniently fill the packaging material into the open hole.
The diameter of the opening on the back layer glass is about 3-4 cm, and the particle volume of the encapsulation material in the granular form is preferably 10-6mm3～104mm3Therefore, the particle volume of the single-particle packaging material is ensured to be smaller than the thickness of the conventional rear layer glass, and the rear layer packaging adhesive film at the opening position is not broken in the process of laminating the laminated assemblyThe crack is beneficial to controlling the filling density of the granular packaging adhesive film in the remaining part of the open pore, and if the volume of the particles of the packaging material is larger, the larger the pores formed among the particles of the packaging material after the open pore is filled, the more adverse to realizing the one-hundred-percent filling of the volume of the remaining part of the open pore, so that the reduction of the thickness of the rear layer packaging adhesive film is limited, and the drift of the particles of the packaging material is easily caused due to the too small volume of the particles of the packaging material in the granular form, thereby polluting the environment.
In one embodiment of the present application, the complex viscosity of the sealing material in a gel form is 300 pas to 105Pa · s, preferably 5200 to 9.26 × 104Pa·s。
The complex viscosity range of the encapsulating material is obtained by testing with a rheometer under the conditions of 160 ℃ and 0.5% deformation and the shearing frequency of 1 rad/s.
The packing material in the form of gel fills the opening by virtue of its fluidity, for example, it can be filled into the opening by glue filling. If the viscosity of the packaging material in the colloidal form is too large, the flowability of the packaging material is too small, so that the packaging material in the colloidal form is not favorable for being filled into the open pores, and if the viscosity of the packaging material in the colloidal form is too small, the flowability of the packaging material is too large, so that the packaging material at the open pores is easy to diffuse from the open pores to the periphery in the laminating process, the packaging material filled into the open pores is reduced, the buffering of the pressure applied to the open pores is not favorable, and the risk of breaking the battery piece at the open pores is still easy to cause. The preferred encapsulating material of the above viscosity both makes it easy to fill the opening and ensures its cushioning effect against the pressure to which the opening is subjected.
In an embodiment of the present application, the encapsulant is a cross-linking encapsulant or a non-cross-linking encapsulant, and the cross-linking encapsulant includes: 100 parts by weight of a first matrix resin, 0.01-2 parts by weight of peroxide, 0.02-3 parts by weight of cross-linking aid and 0.02-3 parts by weight of a silane coupling agent; preferably, the first matrix resin is selected from a copolymer of ethylene and any one or more of vinyl acetate, propylene, butene, pentene, hexene or octene; preferably the peroxide is selected from the group consisting of isopropyl t-butylperoxycarbonate, 2, 5-dimethyl-2, 5- (di-t-butylperoxy) hexane, 2-ethylhexyl t-butylperoxycarbonate, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, 1-bis (t-amylperoxy) cyclohexane, 1-bis (t-butylperoxy) cyclohexane, 2-bis (t-butylperoxy) butane, t-amyl peroxy 2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-bis (benzoylperoxy) -hexane, t-amyl peroxy carbonate, and mixtures thereof, Any one or more of tert-butyl peroxy-3, 3, 5-trimethylhexanoate; preferred co-crosslinking agents are selected from the group consisting of triallylisocyanurate, triallylcyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, ethoxylated glycerol triacrylate, propoxylated glycerol triacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, trimethylolpropane tetraacrylate, ditrimethylolpropane tetramethacrylate, propoxylated pentaerythritol tetraacrylate, 2,4, 6-tris (2-propenyloxy) -1,3, 5-triazine, tricyclodecane dimethanol diacrylate, trimethylolpropane triacrylate, propoxylated pentaerythritol tetraacrylate, 2,4, 6-tris (2-propenyloxy) -1,3, 5-triazine, tricyclodecane dimethanol diacrylate, trimethylolpropane triacrylate, and mixtures thereof, Any one or more of propylene glycol diacrylate, ethoxylated bisphenol A dimethacrylate, 2-butyl-2-ethyl-1, 3-propanediol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate and polyethylene glycol dimethacrylate; preferably, the silane coupling agent is selected from any one or more of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltri-tert-butylhydroperoxide, vinyltriacetoxysilane, vinyltris (beta-methoxyethoxy) silane, gamma-aminopropyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-glycidoxypropyltrimethylsilane and 3-aminopropyltrimethylsilane; the non-crosslinked encapsulating material preferably comprises a silane-grafted second base resin, the grafting ratio of the silane-grafted second base resin is preferably 0.01-10%, and preferably 0.5-5%, the second base resin is preferably selected from one or more of PE, PP, EVA and POE, and the silane is preferably selected from one or more of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltributyl peroxide, vinyltriacetoxysilane, vinyltris (beta-methoxyethoxy) silane, gamma-aminopropyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-glycidoxypropyltrimethylsilane and 3-aminopropyltrimethylsilane.
The preferable composition of the packaging material is kept consistent with that of the rear layer packaging adhesive film as much as possible, so that the integration of the opening packaging material and the layer packaging adhesive film in the laminating process is facilitated, and the problems of cell fragment and hole position bubbles of the battery piece at the opening position are solved better. Wherein, the cross-linking type packaging material and the non-cross-linking type packaging material can be made into the granular packaging material.
In one embodiment of the present application, the melt index of the first matrix resin and the melt index of the second matrix resin are each independently 1 to 50g/10min, preferably 5 to 30g/10 min.
The melt index of the first matrix resin (second matrix resin) is too small, the flowability of the packaging material is too poor, the melt index of the first matrix resin (second matrix resin) is too large, the flowability of the packaging material is too good, and the flowability of the packaging material is too poor and too good, so that the integration of the packaging material and a rear-layer packaging adhesive film is not facilitated, therefore, the first matrix resin (second matrix resin) within the above melt index range is preferred, and the problems of cell fragment at the opening position and hole position air bubbles are further facilitated to be reduced.
In one embodiment of the present application, the melting points of the first matrix resin and the second matrix resin are each independently between 40 ℃ and 150 ℃.
If the melting point of the first matrix resin (the second matrix resin) is too low, the dual-glass assembly is easy to creep in the outdoor use process; if the melting point of the first matrix resin (second matrix resin) is too high, the first matrix resin is not melted during lamination, and the cell sheet may be crushed after pressurization. In order to enable the encapsulated dual glass assembly to have the capability of resisting thermal creep, the melting point of the first matrix resin (the second matrix resin) is preferably controlled to be 40-150 ℃.
In another exemplary embodiment of the present application, a dual glass assembly is provided, which is obtained by the encapsulation method described above.
By adopting the packaging method, the risk of breaking the battery piece in the laminating process of the laminated assembly is reduced, and the cost is reduced, so that the double-glass assembly has high quality and low cost.
In another exemplary embodiment of the present application, an electronic component is provided, and the electronic component includes any one of a solar cell, a liquid crystal panel, an electroluminescent device, a plasma display device, and a touch screen, and the electronic component includes a dual glass assembly, and the dual glass assembly is the dual glass assembly described above.
The electronic component comprising the dual-glass assembly has better performance and lower cost.
The advantageous effects of the present application will be described below with reference to specific examples and comparative examples.
Example 1
The packaging material is a cross-linking type packaging material and comprises 100 parts by weight of ethylene-vinyl acetate copolymer (first matrix resin), 0.5 part by weight of tert-butyl peroxyisopropyl carbonate and 0.8 part by weight of triallyl isocyanurate; and 0.5 parts by weight of vinyltriethoxysilane.
Preparing the packaging material into granular form, wherein the granule volume is 10mm3The ethylene-vinyl acetate copolymer has a melt index of 15g/10min and a melting point of 75 ℃.
Laminating and laying the front layer of glass, the front layer of packaging adhesive film, the battery unit, the rear layer of packaging adhesive film and the rear layer of glass to obtain a laminated assembly with the rear layer of glass facing upwards, and electrically connecting the bus bar with the junction box through the opening of the rear layer of glass; and filling the granular packaging material into the remaining part of the opening hole, and laminating to obtain the dual-glass assembly. Wherein the filling volume of the packaging material is 50% of the volume of the remaining part of the opening, and the thickness of the rear-layer packaging adhesive film is 610 μm.
Example 2
Example 2 differs from example 1 in that,
the fill volume of the encapsulant was 5% of the volume of the remaining portion of the opening, resulting in a dual glass assembly.
Example 3
Example 3 differs from example 1 in that,
the filling volume of the packaging material is 100% of the volume of the remaining part of the opening, and the dual-glass assembly is finally obtained.
Example 4
Example 4 differs from example 1 in that,
the fill volume of the encapsulant was 4% of the volume of the remaining portion of the opening, resulting in a dual glass assembly.
Example 5
Example 5 differs from example 1 in that,
the granular form of the encapsulating material has a particle volume of about 10-6mm3And finally obtaining the double-glass assembly.
Example 6
Example 6 differs from example 1 in that,
the granular form of the encapsulating material has a particle volume of about 104mm3And finally obtaining the double-glass assembly.
Example 7
Example 7 differs from example 1 in that,
the volume of the particles of the encapsulating material in granular form is about 0.9X 10-6mm3And finally obtaining the double-glass assembly.
Example 8
Example 8 differs from example 1 in that,
the packaging material comprises 100 parts by weight of ethylene-octene copolymer, 2 parts by weight of tert-butyl peroxy-2-ethylhexyl carbonate and 3 parts by weight of triallyl cyanurate; and 3 parts by weight of vinyltrimethoxysilane, and finally obtaining the dual-glass assembly.
Example 9
Example 9 differs from example 1 in that,
the packaging material comprises 50 parts by weight of ethylene-vinyl acetate copolymer, 50 parts by weight of ethylene-butylene copolymer, 0.01 part by weight of tert-amyl peroxycarbonate and 0.02 part by weight of pentaerythritol propoxide tetraacrylate; and 0.02 part by weight of 3-aminopropyltrimethylsilane, to finally obtain the dual glass assembly.
Example 10
Example 10 differs from example 1 in that,
the first matrix resin of the packaging material is ethylene-vinyl acetate copolymer, the melt index of the first matrix resin is 50g/10min, the melting point of the first matrix resin is 40 ℃, and the dual-glass assembly is finally obtained.
Example 11
Example 11 differs from example 1 in that,
the first matrix resin of the packaging material is an ethylene-octene copolymer, the melt index of the ethylene-octene copolymer is 1g/10min, the melting point of the ethylene-octene copolymer is 65 ℃, and the dual-glass assembly is finally obtained.
Example 12
Example 12 differs from example 1 in that,
the first matrix resin of the packaging material is ethylene-butylene copolymer, the melt index of the first matrix resin is 5g/10min, the melting point of the first matrix resin is 75 ℃, and the dual-glass assembly is finally obtained.
Example 13
Example 13 differs from example 1 in that,
the first matrix resin of the packaging material is 50 wt% of ethylene-octene copolymer and 50 wt% of ethylene-butene copolymer, the melt index of the packaging material is 30g/10min, the melting point of the packaging material is 75 ℃, and the dual-glass assembly is finally obtained.
Example 14
Example 14 differs from example 1 in that,
the packaging material is in a colloidal form, and the opening is filled with the packaging material in a glue filling mode, so that the double-glass assembly is finally obtained.
Example 15
The packaging material is non-crosslinked packaging material, bagThe packaging material is prepared into a granular form, and the volume of the granules is 10mm3. Laminating and laying the front layer of glass, the front layer of packaging adhesive film, the battery unit, the rear layer of packaging adhesive film and the rear layer of glass to obtain a laminated assembly with the rear layer of glass facing upwards, and electrically connecting the bus bar with the junction box through the opening of the rear layer of glass; and filling the granular packaging material into the remaining part of the opening hole, and laminating to obtain the dual-glass assembly. Wherein the filling volume of the packaging material is 50% of the volume of the remaining part of the opening, and the thickness of the rear-layer packaging adhesive film is 610 μm.
Example 16
Example 16 differs from example 15 in that,
the packaging material is a non-crosslinking packaging material and comprises vinyl trimethoxy silane grafted ethylene-octene copolymer, wherein the grafting rate of vinyl trimethoxy silane is 5%, and the dual-glass assembly is finally obtained.
Example 17
Example 17 differs from example 15 in that,
the packaging material is a non-crosslinking packaging material and comprises vinyl trimethoxy silane grafted ethylene-octene copolymer, wherein the grafting rate of vinyl trimethoxy silane is 0.5%, and the dual-glass assembly is finally obtained.
Example 18
Example 18 differs from example 15 in that,
the packaging material is a non-crosslinking packaging material and comprises vinyl trimethoxy silane grafted ethylene-octene copolymer, wherein the grafting rate of the vinyl trimethoxy silane is 0.01%, and the dual-glass assembly is finally obtained.
Example 19
Example 19 differs from example 15 in that,
the packaging material is a non-crosslinking packaging material and comprises vinyl trimethoxy silane grafted ethylene-octene copolymer, wherein the grafting rate of the vinyl trimethoxy silane is 10%, and the dual-glass assembly is finally obtained.
Example 20
Example 20 differs from example 15 in that,
the packaging material is vinyl trimethoxy silane grafted ethylene-vinyl acetate copolymer, the melting point of the packaging material is 40 ℃, and the dual-glass assembly is finally obtained.
Example 21
Example 21 differs from example 15 in that,
the packaging material is PP grafted by vinyl trimethoxy silane, the melting point of the packaging material is 150 ℃, and the dual-glass assembly is finally obtained.
Example 22
Example 22 differs from example 15 in that,
the packaging material is PP grafted by vinyl trimethoxy silane, the melting point of the packaging material is 160 ℃, and the dual-glass assembly is finally obtained.
Example 23
Example 23 differs from example 15 in that,
the non-crosslinked packaging material is in a colloidal form, and the dual-glass assembly is finally obtained.
Example 24
Example 24 differs from example 23 in that,
the viscosity of the non-crosslinked encapsulating material was adjusted to 3.61X 10 by adjusting the molecular weight of the vinyltrimethoxysilane grafted ethylene-octene copolymer4Pa.s, and finally obtaining the dual-glass assembly.
Example 25
Example 25 differs from example 23 in that,
the viscosity of the non-crosslinked encapsulating material was adjusted to 9.26X 10 by adjusting the molecular weight of the vinyltrimethoxysilane grafted ethylene-octene copolymer4Pa.s, and finally obtaining the dual-glass assembly.
Example 26
Example 26 differs from example 23 in that,
the viscosity of the non-crosslinked encapsulating material is adjusted to 300 pas by adjusting the molecular weight of the vinyl trimethoxy silane grafted ethylene-octene copolymer, and finally the dual-glass assembly is obtained.
Example 27
Example 27 differs from example 23 in that,
the viscosity of the non-crosslinked encapsulating material is adjusted to 10 by adjusting the molecular weight of the vinyltrimethoxysilane grafted ethylene-octene copolymer5Pa.s, and finally obtaining the dual-glass assembly.
Example 28
Example 28 differs from example 23 in that,
the viscosity of the non-crosslinked encapsulating material was adjusted to 1.2X 10 by adjusting the molecular weight of the vinyltrimethoxysilane grafted ethylene-octene copolymer5Pa.s, and finally obtaining the dual-glass assembly.
Example 29
Example 29 differs from example 23 in that,
the viscosity of the non-crosslinked encapsulation material is 290 pas by adjusting the molecular weight of the vinyl trimethoxy silane grafted ethylene-octene copolymer, and finally the dual-glass assembly is obtained.
Comparative example 1
Comparative example 1 is different from example 1 in that,
and filling the open hole to finally obtain the dual-glass assembly.
The dual glass assemblies obtained in the above examples 1 to 29 and comparative example 1 were subjected to the cell breakage rate and the hole site air bubble test, the adhesion between the encapsulating material and the glass was tested, and the test results are shown in table 1.
TABLE 1
Figure BDA0003495414360000101
Figure BDA0003495414360000111
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects:
adopt packaging material to carry out the lamination to the lamination subassembly after filling the remaining part of the trompil on the back layer glass to reduce the back layer encapsulation glued membrane and need to the volume that the trompil flows at the lamination in-process, and then reduced the risk that the glued membrane around the trompil is thin partially, further reduced the risk of battery piece fragment. On the other hand, back layer encapsulation glued membrane also can attenuate some relatively to the cost is reduced, simultaneously, trompil and back layer encapsulation glued membrane's synergism on the back layer glass are filled to the encapsulating material makes the trompil filled more abundant, thereby has reduced the hole site bubble, and is visible, adopts above-mentioned method of this application not only can reduce hole site bubble and hole site lobe of a leaf risk, can also reduce cost.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A packaging method of a dual glass assembly is characterized by comprising the following steps:
stacking and laying a front layer of glass, a front layer of packaging adhesive film, a battery unit, a rear layer of packaging adhesive film and a rear layer of glass to obtain a laminated assembly, wherein the rear layer of glass is provided with an opening, a battery piece of the battery unit collects current through a bus bar, and the bus bar penetrates through the opening to be electrically connected with a junction box;
filling the remaining part of the opening with a packaging material;
and laminating the laminated assembly to obtain the dual-glass assembly.
2. The method of claim 1, wherein the fill volume of the encapsulant material is between 5% and 100% of the volume of the remaining portion of the opening.
3. The encapsulation method according to claim 1 or 2, wherein the encapsulating material is filled into the open pores in a granular form or a gel form.
4. The encapsulation method according to claim 3, wherein the granular form of the encapsulating material has a particle volume of 10-6mm3～104mm3。
5. The encapsulation method according to claim 3, wherein the complex viscosity of the encapsulating material in the gel-like form is 300 Pa-s to 105Pa · s, preferably 5200 to 9.26 × 104Pa·s。
6. The encapsulation method according to claim 3, wherein the encapsulation material is a cross-linking type encapsulation material or a non-cross-linking type encapsulation material in parts by weight,
the cross-linking type encapsulating material includes:
100 parts by weight of a first base resin;
0.01 to 2 parts by weight of a peroxide;
0.02-3 parts by weight of an auxiliary crosslinking agent; and
0.02-3 parts by weight of a silane coupling agent;
preferably, the first matrix resin is selected from a copolymer of ethylene and any one or more of vinyl acetate, propylene, butene, pentene, hexene or octene;
preferably, the peroxide is selected from the group consisting of isopropyl t-butylperoxycarbonate, 2, 5-dimethyl-2, 5- (bis-t-butylperoxy) hexane, 2-ethylhexyl t-butylperoxycarbonate, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, 1-bis (t-amylperoxy) cyclohexane, 1-bis (t-butylperoxy) cyclohexane, 2-bis (t-butylperoxy) butane, t-amyl peroxy 2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-bis (benzoylperoxy) -hexane, t-amyl peroxycarbonate, and mixtures thereof, Any one or more of tert-butyl peroxy-3, 3, 5-trimethylhexanoate;
preferably, the co-crosslinking agent is selected from the group consisting of triallylisocyanurate, triallylcyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, ethoxylated glycerol triacrylate, propoxylated glycerol triacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, trimethylolpropane tetraacrylate, ditrimethylolpropane tetramethacrylate, propoxylated pentaerythritol tetraacrylate, 2,4, 6-tris (2-propenyloxy) -1,3, 5-triazine, tricyclodecane dimethanol diacrylate, triallyl cyanurate, trimethylolpropane triacrylate, ethoxylated glycerol triacrylate, propoxylated pentaerythritol tetraacrylate, trimethylolpropane tetraacrylate, 2,4, 6-tris (2-propenyloxy) -1,3, 5-triazine, tricyclodecane dimethanol diacrylate, trimethylolpropane triacrylate, and mixtures thereof, Any one or more of propylene glycol diacrylate, ethoxylated bisphenol A dimethacrylate, 2-butyl-2-ethyl-1, 3-propanediol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate and polyethylene glycol dimethacrylate;
preferably, the silane coupling agent is selected from any one or more of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltriperoxy-tert-butyl silane, vinyltriacetoxysilane, vinyltris (beta-methoxyethoxy) silane, gamma-aminopropyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-glycidoxypropyltrimethylsilane and 3-aminopropyltrimethylsilane;
preferably, the non-crosslinked encapsulation material comprises a silane-grafted second base resin, the grafting ratio of the silane-grafted second base resin is 0.01-10%, preferably 0.5-5%, the second base resin is selected from one or more of PE, PP, EVA and POE, and the silane is selected from one or more of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltributyl peroxide, vinyltriacetoxysilane, vinyltris (beta-methoxyethoxy) silane, gamma-aminopropyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-glycidoxypropyltrimethylsilane and 3-aminopropyltrimethylsilane.
7. The encapsulation method according to claim 6, wherein the first matrix resin and the second matrix resin each independently have a melt index of 1 to 50g/10min, preferably 5 to 30g/10 min.
8. The encapsulation method according to claim 6, wherein the melting points of the first matrix resin and the second matrix resin are each independently between 40 ℃ and 150 ℃.
9. A dual glass assembly, characterized in that it is obtained by the encapsulation method according to any one of claims 1 to 8.
10. An electronic component, the electronic component includes any one in solar cell, liquid crystal display panel, electroluminescent device, plasma display device, touch-sensitive screen, electronic component includes dual glass assembly, its characterized in that, dual glass assembly is claim 9 dual glass assembly.
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