CN114505629A - Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate - Google Patents
Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate Download PDFInfo
- Publication number
- CN114505629A CN114505629A CN202210252949.5A CN202210252949A CN114505629A CN 114505629 A CN114505629 A CN 114505629A CN 202210252949 A CN202210252949 A CN 202210252949A CN 114505629 A CN114505629 A CN 114505629A
- Authority
- CN
- China
- Prior art keywords
- electrode substrate
- mounting disc
- mounting
- ring
- quartz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
An electrode substrate fixing device for welding a hemispherical harmonic oscillator and an electrode substrate relates to a precision assembly detection system. The problem of assembly error that the heating problem that welding fixed hemisphere harmonic oscillator and electrode substrate can't avoid arouses is solved. The quartz electrode substrate clamping ring comprises an electrode substrate clamping ring, a heating pad, a heat insulation ring, a mounting disc and a fixed base which are coaxially arranged in sequence from top to bottom, wherein the mounting disc comprises a mounting disc substrate and a plurality of conductive spring pins, the heat insulation ring, the heating pad and a quartz electrode substrate are sequentially sleeved on the plurality of conductive spring pins, the electrode substrate clamping ring is fixedly connected onto the mounting disc substrate, an accommodating cavity is formed between the electrode substrate clamping ring and the mounting disc substrate, the heat insulation ring, the heating pad and the quartz electrode substrate are clamped by the electrode substrate clamping ring and the mounting disc substrate, the mounting disc substrate is fixedly connected onto the fixed base, and a quartz hemispherical resonator penetrates through a through hole in the electrode substrate clamping ring and is inserted onto the quartz electrode substrate. The invention is mainly used for fixing the electrode substrate.
Description
Technical Field
The invention relates to a precision assembly detection system, in particular to an electrode substrate fixing device for welding a hemispherical harmonic oscillator and an electrode substrate.
Background
The hemispherical resonator gyroscope is a novel solid-state vibrating gyroscope and has the characteristics of low power consumption, long service life, high stability and the like. In recent years, with the proposal and development of a hemispherical resonant gyroscope with a two-piece flat electrode structure, the number of parts of the hemispherical resonant gyroscope is further reduced on the basis of ensuring the original high precision, the volume of the hemispherical resonant gyroscope is further reduced, the production process is further simplified, and meanwhile, the hemispherical resonant gyroscope has the characteristics of wide range, high scale factor stability and the like under a full-angle working mode. At present, the hemispherical resonant gyroscope with the flat electrode structure is widely applied to fields of land, sea, weapon systems and the like.
The traditional hemispherical resonator gyroscope generally works in a force balance working mode, control force is applied to a specific direction of the harmonic oscillator through electrodes, standing waves are locked in the direction, the rotation of the quartz hemispherical harmonic oscillator along a symmetry axis is represented by the control force required by locking the azimuth angle of the standing waves, and the hemispherical resonator gyroscope at the moment is a rate gyroscope. The measuring range of the hemispherical resonator gyroscope in the force balance working mode is limited by the static control force, and the hemispherical resonator gyroscope is mainly applied to the fields of satellites, deep space exploration and the like.
In order to further expand the application field of the hemispherical resonant gyroscope, the hemispherical resonant gyroscope with the two sets of flat plate electrode structures is produced at the same time. Different from the traditional hemispherical resonator gyroscope working in a force balance mode, the two sets of hemispherical resonator gyroscopes with flat plate electrode structures work in a full-angle working mode, only amplitude control is applied to the quartz hemispherical resonator standing wave, the standing wave azimuth angle freely rotates, the rotation of the quartz hemispherical resonator along the symmetry axis is represented by the measured standing wave azimuth angle increment, and the hemispherical resonator gyroscope is a rate integral gyroscope at the moment. In the full-angle working mode, standing waves are not restrained and freely rotate, so that higher requirements are put on the assembly accuracy of the quartz hemispherical harmonic oscillator and the quartz electrode substrate.
At present, the domestic hemispherical resonance gyroscope assembly device is mainly used for three sets of hemispherical resonance gyroscopes with spherical electrode structures, which take an excitation cover, a hemispherical resonator and a reading base as core components, and is not suitable for two sets of hemispherical resonance gyroscopes with planar electrode structures.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the existing hemispherical resonator gyroscope assembly device is only suitable for three sets of hemispherical resonator gyroscopes with spherical electrode structures and is not suitable for two sets of hemispherical resonator gyroscopes with planar electrode structures, and the two sets of hemispherical resonator gyroscopes with planar electrode structures are sensitive to assembly errors and have the problem of assembly errors caused by heating problems which cannot be avoided by welding and fixing quartz hemispherical resonators and quartz electrode substrates in the assembly process; and further provides an electrode substrate fixing device for welding the hemispherical harmonic oscillator and the electrode substrate.
The technical scheme adopted by the invention for solving the technical problems is as follows:
an electrode substrate fixing device for welding a hemispherical harmonic oscillator and an electrode substrate comprises an electrode substrate clamping ring, a heating pad, a heat insulation ring, a mounting disc and a fixing base which are coaxially arranged from top to bottom, wherein a quartz electrode substrate is coaxially arranged between the electrode substrate clamping ring and the heating pad; the mounting disc include mounting disc base plate and many electrically conductive pogo pins, many electrically conductive pogo pins from the bottom of mounting disc base plate by supreme circumference cartridge down on the mounting disc base plate, heat-insulating ring, heating pad and quartz electrode base plate overlap in proper order on many electrically conductive pogo pins, electrode substrate snap ring rigid coupling on the mounting disc base plate, and form the holding chamber between electrode substrate snap ring and the mounting disc base plate, electrode substrate snap ring and mounting disc base plate will heat-insulating ring, heating pad and quartz electrode base plate chucking, mounting disc base plate rigid coupling on fixed baseplate, quartz hemisphere harmonic oscillator passes through-hole cartridge on the electrode substrate snap ring on quartz electrode base plate.
Furthermore, the quartz electrode substrate is of a circular ring structure, a plurality of electrode through holes are uniformly formed in the quartz electrode substrate in the circumferential direction, a conductive needle cap is arranged in each electrode through hole, and the upper end of each conductive spring needle is inserted into the conductive needle cap.
Furthermore, the electrode substrate clamping ring is made of ceramic materials and comprises a first circular mounting disc and a plurality of clamping jaws, the plurality of clamping jaws are uniformly arranged on the inner side of the disc surface of the first circular mounting disc in the circumferential direction, the roots of the clamping jaws are fixed on the first circular mounting disc, the arms of the clamping jaws extend upwards vertically, the inner walls of the arms of the clamping jaws are aligned with the inner wall of the first circular mounting disc, the claw parts of the clamping jaws horizontally face the axis position of the first circular mounting disc, a through hole is formed among the claw parts of the clamping jaws, and the claw parts of the clamping jaws are abutted against the quartz electrode substrate; the first circular ring-shaped mounting disc and the plurality of clamping claws are integrally manufactured; a plurality of mounting through holes are uniformly formed in the first annular mounting disc in the circumferential direction, and the electrode substrate clamping ring is screwed on the mounting disc substrate through the mounting through holes and the fastening screws.
Furthermore, the lower end face of the claw part of the clamping claw is set to be a bevel face, an included angle between the upper end face of the quartz electrode substrate and the side wall is set to be a slope face, and the slope face on the quartz electrode substrate is matched with the bevel face of the claw part of the clamping claw.
Furthermore, the heating pad is of a circular ring structure, a plurality of openings are uniformly formed in the circumferential direction of the outer wall of the heating pad, and the conductive spring pins are located in the openings in the heating pad.
Furthermore, a positioning cylinder is inserted in the center of the heat insulation ring, and the top end of the positioning cylinder is inserted in the central through hole of the heating pad; a plurality of through holes are uniformly formed in the heat insulation ring in the circumferential direction, and the heat insulation ring is sleeved on the plurality of conductive spring needles through the plurality of through holes; the heat insulation ring is made of ceramic materials.
Furthermore, a circle of fixing base mounting holes, a circle of first elastic rubber ring mounting grooves, a circle of electrode substrate clamping ring mounting screw holes, a circle of second elastic rubber ring mounting grooves, a circle of conductive spring needle mounting holes and a center through hole are sequentially formed in the mounting disc substrate from outside to inside in the radial direction; the mounting disc base plate is mounted on the fixing base through a plurality of fastening screws and mounting holes of the fixing base, the electrode base plate clamping ring is in threaded connection with mounting screw holes of the electrode base plate clamping ring through a plurality of fastening screws, a conductive spring pin is inserted into each conductive spring pin mounting hole, and an elastic rubber ring is respectively embedded into the first elastic rubber ring mounting groove and the second elastic rubber ring mounting groove; the bottom end of the positioning cylinder is inserted into the central through hole of the mounting disc substrate.
Furthermore, the mounting disc substrate is made of stainless steel, an insulator is further inserted into each conductive spring pin mounting hole, the insulator completely covers the inner wall of each conductive spring pin mounting hole, the insulator is of a circular ring structure, and the conductive spring pins are inserted into the central through holes of the insulators.
Furthermore, the fixed base comprises a second circular ring-shaped mounting disc and a circular ring-shaped base, the circular ring-shaped base is mounted on the inner side of the disc surface on the second circular ring-shaped mounting disc, a plurality of wire grooves are uniformly formed in the circumferential direction on the side wall of the circular ring-shaped base, a cylinder is formed between every two adjacent wire grooves, and the top end of each cylinder is provided with a threaded hole; a plurality of mounting holes are uniformly formed in the second annular mounting disc in the circumferential direction, and the fixed base is mounted on the vibration isolation platform through the mounting holes and the fastening screws.
Furthermore, the fixed base is made of stainless steel.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention mainly aims at the precise assembly of two sets of hemispherical resonator gyroscopes with planar electrode structures, has stronger applicability and can realize the high-precision, high-efficiency and high-reliability welding of quartz hemispherical resonators and quartz electrode substrates;
2. the electrode substrate clamping ring and the heat insulation ring are made of ceramic materials with low temperature expansion coefficients, so that the phenomenon that the device deforms due to temperature rise in the welding process of the quartz hemispherical harmonic oscillator and the quartz electrode substrate is avoided, the relative position of the quartz hemispherical harmonic oscillator and the quartz electrode substrate is affected, and the welding precision of the quartz hemispherical harmonic oscillator and the quartz electrode substrate is higher;
3. because the inner wall of the clamping ring of the electrode substrate is designed in a chamfer way, namely the lower end surface of the claw part of the clamping ring is arranged in a chamfer way and is matched with a slope surface on the quartz electrode substrate, when the clamping ring of the electrode substrate in the device is connected with the mounting disc through 8 screws which are uniformly distributed in the circumferential direction, the quick and accurate alignment of the center of the clamping ring of the electrode substrate, the center of the quartz electrode substrate and the center of the mounting disc can be realized, and the reliable fixation of the quartz electrode substrate is realized; the device avoids the problems that a screw rod adjusting and fixing device needs to be adjusted repeatedly and cannot be locked, fully improves the fixing reliability of the quartz electrode substrate on the premise of ensuring the positioning precision of the quartz electrode substrate, and meanwhile, the welding assembly efficiency of the two sets of hemispherical resonance gyroscopes with the planar electrode structures is also improved remarkably;
4. according to the invention, the two rings of elastic rubber rings are arranged on the mounting disc, so that the damage of the clamping ring structure of the electrode substrate made of ceramic materials due to uneven stress when the clamping ring of the electrode substrate is screwed on the mounting disc through a screw can be avoided, and the device has higher reliability and longer service life;
5. in the invention, 8 conductive spring pins fixed on the mounting disc are connected with 8 electrodes on the quartz electrode substrate through conductive pin caps welded on the quartz electrode substrate, so that the relative positions of the quartz hemispherical harmonic oscillator and the quartz electrode substrate are monitored in real time, and the assembly precision of the two hemispherical resonant gyros with the planar electrode structure is further ensured;
6. the device is simple to operate, and the welding efficiency of the quartz hemispherical harmonic oscillator and the quartz electrode substrate is fully improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention to its proper form.
FIG. 1 is a schematic view of the assembled overall structure of the present invention;
FIG. 2 is an exploded view of the structure of the present invention;
FIG. 3 is a schematic structural view of a mounting plate;
FIG. 4 is a vertical cross-sectional view of FIG. 1;
FIG. 5 is an enlarged view of a portion of FIG. 4 at A;
fig. 6 is a partially enlarged view of B in fig. 4.
In the figure: 1-electrode substrate snap ring; 1-1-a first circular mounting disc; 1-1-1-installing a through hole; 1-2-jaw; 2-heating the mat; 2-1-a gap; 3-heat insulation ring; 4-mounting a disc; 4-1-mounting a disk substrate; 4-1-1-fixing a base mounting hole; 4-1-2-a first elastic rubber ring mounting groove; 4-1-3-electrode substrate snap ring installation screw hole; 4-1-4-a second elastic rubber ring mounting groove; 4-1-5-conductive spring pin mounting holes; 4-1-6-central through hole; 4-2-conductive pogo pins; 4-4-insulators; 5-fixing the base; 5-1-a second circular mounting disc; 5-1-1-mounting holes; 5-2-ring-shaped base; 5-2-1-wire groove; 5-2-2-cylinder; 5-2-3-threaded hole; 6-a fastening screw; 7-quartz hemispherical harmonic oscillator; 8-quartz electrode substrate; 8-1-conductive needle cap.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and the following embodiments are used for illustrating the present invention and are not intended to limit the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 6, an embodiment of the present application provides an electrode substrate fixing device for welding a hemispherical resonator and an electrode substrate, including an electrode substrate clamping ring 1, a heating pad 2, a heat insulating ring 3, a mounting disc 4 and a fixing base 5, which are coaxially arranged from top to bottom, wherein a quartz electrode substrate 8 is coaxially arranged between the electrode substrate clamping ring 1 and the heating pad 2;
the mounting disc 4 comprises a mounting disc substrate 4-1 and a plurality of conductive spring pins 4-2, the conductive spring pins 4-2 are inserted on the mounting disc substrate 4-1 from bottom to top in the circumferential direction from the bottom of the mounting disc substrate 4-1, the heat insulation ring 3, the heating pad 2 and the quartz electrode substrate 8 are sequentially sleeved on the conductive spring pins 4-2, the electrode substrate snap ring 1 is fixedly connected on the mounting disc substrate 4-1, an accommodating cavity is formed between the electrode substrate snap ring 1 and the mounting disc substrate 4-1, namely the heat insulation ring 3, the heating pad 2 and the quartz electrode substrate 8 are positioned in the accommodating cavity between the electrode substrate snap ring 1 and the mounting disc substrate 4-1, the heat insulation ring 3, the heating pad 2 and the quartz electrode substrate 8 are tightly clamped by the electrode substrate snap ring 1 and the mounting disc substrate 4-1, the coaxial precision of the electrode substrate clamping ring 1, the quartz electrode substrate 8, the heating pad 2, the heat insulation ring 3 and the mounting disc substrate 4-1 is guaranteed, the quartz hemispherical harmonic oscillator 7 and the quartz electrode substrate 8 can be prevented from deforming due to temperature rise in the welding process, and further the relative position between the quartz hemispherical harmonic oscillator 7 and the quartz electrode substrate 8 is changed, the mounting disc substrate 4-1 is fixedly connected to the fixed base 5, and the quartz hemispherical harmonic oscillator 7 penetrates through a through hole in the electrode substrate clamping ring 1 and is inserted into the quartz electrode substrate 8.
In the embodiment, the fixing base 5 is arranged at the bottommost layer of the fixing device, so that the stability of the whole device is guaranteed, the quartz electrode substrate 8, the heat insulation ring 3 and the heating pad 2 can be roughly aligned in the center through the conductive spring pins 4-2 fixed on the mounting disc 4, and then the quartz hemispherical resonator 7 and the quartz electrode substrate 8 are accurately and reliably positioned through the connection between the electrode substrate clamping ring 1 and the mounting disc substrate 4-1, so that the relative position precision between the quartz hemispherical resonator and the quartz electrode substrate in the welding process is guaranteed.
In this embodiment, before the hemispherical quartz resonator 7 and the quartz electrode substrate 8 are welded, solder (viscous slurry) is uniformly applied to the to-be-welded position of the center rod of the hemispherical quartz resonator 7 and the inner wall of the central resonator mounting hole of the quartz electrode substrate 8 in advance, and the heating pad 2 is used for realizing the heating function of the quartz electrode substrate 8 to be welded, so that the temperature of the quartz electrode substrate 8 can reach 300 ℃, the solder filled in advance is melted, and the welding of the hemispherical quartz resonator 7 and the quartz electrode substrate 8 is completed.
In a possible implementation scheme, the quartz electrode substrate 8 is in a ring-shaped structure, a plurality of electrode through holes are uniformly formed in the circumferential direction of the quartz electrode substrate 8, a conductive needle cap 8-1 is arranged in each electrode through hole, and the upper end of the conductive spring needle 4-2 is inserted into the conductive needle cap 8-1.
In the embodiment, the number of the conductive spring pins 4-2 is 8, the 8 conductive spring pins 4-2 fixed on the mounting plate 4 are connected with 8 electrodes on the quartz electrode substrate through the conductive pin caps 8-1 welded on the quartz electrode substrate 8, wherein, the inner surface and the lip edge of the quartz hemispherical harmonic oscillator 7 are plated with conductive metal film layers, 8 electrodes are uniformly distributed on the upper surface of the quartz electrode substrate 8 along the circumferential direction, each electrode and the lip edge of the quartz hemispherical harmonic oscillator can be equivalent to a flat capacitor, the capacitance values of 8 equivalent plate capacitors which are uniformly distributed in the circumferential direction are measured by a capacitance detection circuit, the relative distance between the lip edge of the quartz hemispherical harmonic oscillator and the upper surface of the quartz electrode substrate can be calculated, therefore, the relative position of the quartz hemispherical harmonic oscillator 7 and the quartz electrode substrate 8 is monitored in real time, and the assembly precision of the two hemispherical harmonic oscillators with the planar electrode structures is further ensured.
In a possible implementation scheme, the electrode substrate clamping ring 1 is made of ceramic materials and comprises a first circular mounting disc 1-1 and a plurality of clamping jaws 1-2, the clamping jaws 1-2 are uniformly arranged on the inner side of the upper disc surface of the first circular mounting disc 1-1 in the circumferential direction, the root parts of the clamping jaws 1-2 are fixed on the first circular mounting disc 1-1, the arm parts of the clamping jaws 1-2 extend vertically upwards, the inner walls of the arm parts of the clamping jaws 1-2 are aligned with the inner wall of the first circular mounting disc 1-1, the claw parts of the clamping jaws 1-2 horizontally face the axis position of the first circular mounting disc 1-1, a through hole is formed between the claw parts of the clamping jaws 1-2, and the claw parts of the clamping jaws 1-2 are abutted to a quartz electrode substrate 8;
the first circular ring-shaped mounting disc 1-1 and the plurality of clamping jaws 1-2 are integrally manufactured;
a plurality of mounting through holes 1-1-1 are uniformly formed in the first annular mounting disc 1-1 in the circumferential direction, and the electrode substrate clamping ring 1 is in threaded connection with the mounting disc substrate 4-1 through the mounting through holes 1-1-1 and the fastening screws 6.
In this embodiment, the electrode substrate snap ring 1 is made of ceramic, so that deformation of the electrode substrate snap ring 1 caused by temperature change in the welding process of the quartz hemispherical resonator 7 and the quartz electrode substrate 8 can be avoided, changes in the relative positions of the quartz hemispherical resonator 7 and the quartz electrode substrate 8 in the welding process can be avoided, and the welding precision can be improved.
In the embodiment, the number of the clamping jaws 1-2 arranged on the electrode substrate clamping ring 1 is 8, and the 8 clamping jaws 1-2 are circumferentially and uniformly distributed, so that the structural damage of the electrode substrate clamping ring 1 caused by nonuniform stress of the electrode substrate clamping ring 1 and the mounting disc substrate 4-1 in the mounting process is avoided, and the reliability and the service life of the device are improved.
In a possible implementation mode, the lower end face of the claw part 1-2 is set to be a chamfered face, an included angle between the upper end face and the side wall of the quartz electrode substrate 8 is set to be a slope face, and the slope face on the quartz electrode substrate 8 is matched with the chamfered face of the claw part 1-2.
The clamping jaws 1-2 in the embodiment adopt a chamfer design for the quartz electrode substrate 8 to be welded, so that the center of the quartz electrode substrate 8 can be quickly and accurately aligned with the center of the mounting disc 4 in the fastening process, and the welding precision and the welding efficiency are fully improved.
In a possible implementation scheme, the heating pad 2 is of a circular ring structure, a plurality of gaps 2-1 are uniformly formed in the circumferential direction of the outer wall of the heating pad 2, and the conductive spring pins 4-2 are positioned in the gaps 2-1 on the heating pad 2.
In a possible embodiment, a positioning cylinder is inserted in the center of the heat insulation ring 3, and the top end of the positioning cylinder is inserted into the central through hole of the heating pad 2; a plurality of through holes are uniformly formed in the heat insulation ring 3 in the circumferential direction, and the heat insulation ring 3 is sleeved on the plurality of conductive spring needles 4-2 through the plurality of through holes; the heat insulation ring 3 is made of ceramic materials.
The heat insulating ring 3 is made of ceramic materials in the embodiment, so that the speed of heat generated by the heating pad 2 transferred to the mounting disc 4 can be reduced, the deformation of the mounting disc substrate made of metal materials caused by temperature change is reduced, and the welding precision of the device is ensured.
In a possible embodiment, a circle of fixing base mounting holes 4-1-1, a circle of first elastic rubber ring mounting grooves 4-1-2, a circle of electrode substrate clamping ring mounting screw holes 4-1-3, a circle of second elastic rubber ring mounting grooves 4-1-4, a circle of conductive spring pin mounting holes 4-1-5 and a central through hole 4-1-6 are sequentially formed in the mounting disc substrate 4-1 from outside to inside in the radial direction; the mounting disc substrate 4-1 is mounted on a fixing base 5 through a plurality of fastening screws 6 and fixing base mounting holes 4-1-1, the overall stability of the device is ensured, the electrode substrate clamping ring 1 is screwed in the electrode substrate clamping ring mounting screw holes 4-1-3 through the plurality of fastening screws 6 and is aligned with the center of the mounting disc 4, the high-precision positioning and fixing functions of the heat insulation ring 3, the heating pad 2, the quartz hemispherical harmonic oscillator 7 to be welded and the quartz electrode substrate 8 are realized, a conductive spring pin 4-2 is inserted into each conductive spring pin mounting hole 4-1-5, and an elastic rubber ring 4-3 is respectively embedded in each first elastic rubber ring mounting groove 4-1-2 and each second elastic rubber ring mounting groove 4-1-4; the bottom end of the positioning cylinder is inserted into a central through hole 4-1-6 of the mounting disc substrate 4-1.
In the embodiment, the number of the fixing base mounting holes 4-1-1 is 8, the number of the electrode substrate clamping ring mounting screw holes 4-1-3 is 8, and the number of the conductive spring pin mounting holes 4-1-5 is 8;
in the embodiment, the electrode substrate clamping ring 1 is made of ceramic, and when the electrode substrate clamping ring 1 is connected with the mounting disc 4, the structure damage caused by uneven stress on the electrode substrate clamping ring 1 is prevented, so that elastic rubber ring mounting grooves are respectively designed on the inner side and the outer side of the electrode substrate clamping ring mounting screw hole, the damage of the electrode substrate clamping ring 1 in the mounting process is prevented by arranging the elastic rubber rings 4-3, the reliability of the device is improved, and the service life of the device is prolonged;
in the embodiment, the conductive spring pin mounting holes 4-1-5 correspond to the electrode through holes of the quartz electrode substrate 8 to be welded, the central through holes 4-1-6 correspond to the central rods of the quartz hemispherical harmonic oscillators 7 to be welded, and application expansion of the device can be realized.
In a possible implementation scheme, the mounting disc substrate 4-1 is made of stainless steel, an insulator 4-4 is inserted into each conductive spring pin mounting hole 4-1-5, the insulator 4-4 completely covers the inner wall of each conductive spring pin mounting hole 4-1-5, the insulator 4-4 is of a circular structure, and the conductive spring pin 4-2 is inserted into a central through hole of the insulator 4-4.
In the embodiment, the mounting disc substrate 4-1 is made of stainless steel, the conductive spring needle 4-2 needs to be insulated and reliably connected with the mounting disc substrate 4-1 by means of the insulator 4-4, and the conductive spring needle 4-2 can be reliably connected with the quartz electrode substrate 8 welded with the conductive needle cap 8-1, namely, the function of leading out an electrode is realized.
In a possible implementation scheme, the fixed base 5 comprises a second circular ring-shaped mounting disk 5-1 and a circular ring-shaped base 5-2, the circular ring-shaped base 5-2 is mounted on the inner side of the upper disk surface of the second circular ring-shaped mounting disk 5-1, a plurality of wire grooves 5-2-1 are uniformly formed in the circumferential direction on the side wall of the circular ring-shaped base 5-2, a cylinder 5-2-2 is formed between every two adjacent wire grooves 5-2-1, and a threaded hole 5-2-3 is formed in the top end of each cylinder;
a plurality of mounting holes 5-1-1 are uniformly formed in the second annular mounting disc 5-1 in the circumferential direction, and the fixed base 5 is mounted on the vibration isolation platform through the mounting holes 5-1-1 and the screws.
In a possible embodiment, the fixed base 5 is made of stainless steel.
In the embodiment, the fixed base 5 is made of stainless steel, the self weight of the fixed base can keep the stability of the whole device, 16 mounting holes 5-1-1 are uniformly distributed in the circumferential direction on the second annular mounting disc 5-1, and when higher requirements on factors such as vibration and the like are met, the fixed base 5 can be placed on the vibration isolation platform through the mounting holes 5-1-1, so that the influence of external environmental factors on the welding process is further reduced.
In the embodiment, 8 wire grooves are uniformly distributed in the circumferential direction of the fixing base 5 and auxiliary test equipment can be placed in the internal space of the fixing base to further expand the function of the device, and 8 threaded holes 5-2-3 in the top end of the column 5-2-2 are used for fixing the mounting disc 4.
The fixing device in the invention has the following advantages:
firstly, the quartz electrode substrate fixing device provided by the invention is a special welding assembly fixing device for two sets of plane electrode structure hemispherical resonator gyroscopes, has better applicability, and can provide help for development and batch production of two sets of plane electrode structure hemispherical resonator gyroscopes.
Secondly, the ceramic core component is adopted, the influence of heating on the precision of the fixing device in the welding process is fully solved, the quartz electrode substrate to be welded is quickly and accurately positioned through a special clamping claw structure design, and meanwhile, the elastic rubber ring and other designs are introduced, so that the structural damage of the device in the use process is avoided.
The device is a novel quartz electrode substrate fixing device capable of realizing rapid, high-precision and high-reliability welding of the quartz hemispherical harmonic oscillator and the quartz electrode substrate, and compared with the existing method, the device is stronger in applicability, can fully improve the welding assembly precision and the welding assembly efficiency, and has important significance for development of the hemispherical resonant gyroscope.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (10)
1. The utility model provides a be used for hemisphere harmonic oscillator and electrode substrate welded electrode substrate fixing device which characterized in that: the quartz electrode substrate heating device comprises an electrode substrate clamping ring (1), a heating pad (2), a heat insulation ring (3), a mounting disc (4) and a fixed base (5) which are coaxially arranged from top to bottom, wherein a quartz electrode substrate (8) is coaxially arranged between the electrode substrate clamping ring (1) and the heating pad (2);
the mounting disc (4) comprises a mounting disc substrate (4-1) and a plurality of conductive spring needles (4-2), the conductive spring needles (4-2) are inserted on the mounting disc substrate (4-1) from bottom to top in the circumferential direction from the bottom of the mounting disc substrate (4-1), the heat insulation ring (3), the heating pad (2) and the quartz electrode substrate (8) are sequentially sleeved on the conductive spring needles (4-2), the electrode substrate clamping ring (1) is fixedly connected on the mounting disc substrate (4-1), an accommodating cavity is formed between the electrode substrate clamping ring (1) and the mounting disc substrate (4-1), the heat insulation ring (3), the heating pad (2) and the quartz electrode substrate (8) are tightly clamped by the electrode substrate clamping ring (1) and the mounting disc substrate (4-1), the mounting disc substrate (4-1) is fixedly connected on the fixed base (5), the quartz hemispherical harmonic oscillator (7) passes through the through hole on the electrode substrate clamping ring (1) and is inserted on the quartz electrode substrate (8).
2. The electrode substrate fixing device for welding the hemispherical resonator with the electrode substrate as claimed in claim 1, wherein: the quartz electrode substrate (8) is of a circular ring structure, a plurality of electrode through holes are uniformly formed in the quartz electrode substrate (8) in the circumferential direction, a conductive needle cap (8-1) is arranged in each electrode through hole, and the upper end of each conductive spring needle (4-2) is inserted into the corresponding conductive needle cap (8-1).
3. The electrode substrate fixing device for welding the hemispherical resonator with the electrode substrate as claimed in claim 2, wherein: the electrode substrate clamping ring (1) is made of ceramic materials and comprises a first annular mounting disc (1-1) and a plurality of clamping jaws (1-2), the plurality of clamping jaws (1-2) are uniformly arranged on the inner side of the upper disc surface of the first circular mounting disc (1-1) in the circumferential direction, the root part of the clamping jaw (1-2) is fixed on the first circular ring-shaped mounting disc (1-1), the arm part of the clamping jaw (1-2) extends vertically upwards, the inner wall of the arm part of the claw (1-2) is aligned with the inner wall of the first circular mounting disc (1-1), the claw part of the claw (1-2) horizontally faces to the axis position of the first circular mounting disc (1-1), a through hole is formed among the claw parts of the claws (1-2), and the claw parts of the claws (1-2) are abutted against the quartz electrode substrate (8);
the first circular ring-shaped mounting disc (1-1) and the plurality of clamping jaws (1-2) are integrally manufactured;
a plurality of mounting through holes (1-1-1) are uniformly formed in the first annular mounting disc (1-1) in the circumferential direction, and the electrode substrate clamping ring (1) is screwed on the mounting disc substrate (4-1) through the mounting through holes (1-1-1) and the fastening screws (6).
4. The electrode substrate fixing device for welding the hemispherical resonator with the electrode substrate as claimed in claim 3, wherein: the lower end face of the claw part of the claw (1-2) is set to be a beveled surface, an included angle between the upper end face and the side wall of the quartz electrode substrate (8) is set to be a slope surface, and the slope surface on the quartz electrode substrate (8) is matched with the beveled surface of the claw part of the claw (1-2).
5. The electrode substrate fixing device for welding the hemispherical resonator with the electrode substrate as claimed in claim 4, wherein: the heating pad (2) is of a circular ring structure, a plurality of notches (2-1) are uniformly formed in the circumferential direction of the outer wall of the heating pad (2), and the conductive spring pins (4-2) are located in the notches (2-1) on the heating pad (2).
6. The electrode substrate fixing device for welding the hemispherical resonator with the electrode substrate as claimed in claim 5, wherein: a positioning cylinder is inserted in the center of the heat insulation ring (3), and the top end of the positioning cylinder is inserted in the central through hole of the heating pad (2); a plurality of through holes are uniformly formed in the heat insulation ring (3) in the circumferential direction, and the heat insulation ring (3) is sleeved on the plurality of conductive spring pins (4-2) through the plurality of through holes; the heat insulation ring (3) is made of ceramic materials.
7. The electrode substrate fixing device for welding the hemispherical resonator with the electrode substrate as claimed in claim 6, wherein: a circle of fixed base mounting holes (4-1-1), a circle of first elastic rubber ring mounting grooves (4-1-2), a circle of electrode substrate clamping ring mounting screw holes (4-1-3), a circle of second elastic rubber ring mounting grooves (4-1-4), a circle of conductive spring needle mounting holes (4-1-5) and a central through hole (4-1-6) are sequentially formed in the mounting disc substrate (4-1) from outside to inside in the radial direction; the mounting disc base plate (4-1) is mounted on the fixing base (5) through a plurality of fastening screws (6) and fixing base mounting holes (4-1-1), the electrode base plate clamping ring (1) is in threaded connection with the electrode base plate clamping ring mounting screw holes (4-1-3) through the fastening screws (6), a conductive spring needle (4-2) is inserted into each conductive spring needle mounting hole (4-1-5), and an elastic rubber ring (4-3) is embedded into each first elastic rubber ring mounting groove (4-1-2) and each second elastic rubber ring mounting groove (4-1-4); the bottom end of the positioning cylinder is inserted into a central through hole (4-1-6) of the mounting disc substrate (4-1).
8. The electrode substrate fixing device for welding the hemispherical resonator with the electrode substrate as claimed in claim 7, wherein: the mounting disc base plate (4-1) is made of stainless steel, an insulator (4-4) is further inserted into each conductive spring pin mounting hole (4-1-5), the insulator (4-4) completely covers the inner wall of each conductive spring pin mounting hole (4-1-5), the insulator (4-4) is of a circular structure, and the conductive spring pins (4-2) are inserted into central through holes of the insulators (4-4).
9. The electrode substrate fixing device for welding the hemispherical resonator with the electrode substrate as claimed in claim 8, wherein: the fixed base (5) comprises a second circular ring-shaped mounting disc (5-1) and a circular ring-shaped base (5-2), the circular ring-shaped base (5-2) is mounted on the inner side of the disc surface on the second circular ring-shaped mounting disc (5-1), a plurality of wire grooves (5-2-1) are uniformly formed in the circumferential direction on the side wall of the circular ring-shaped base (5-2), a cylinder (5-2-2) is formed between every two adjacent wire grooves (5-2-1), and a threaded hole (5-2-3) is formed in the top end of each cylinder;
a plurality of mounting holes (5-1-1) are uniformly formed in the second annular mounting disc (5-1) in the circumferential direction, and the fixed base (5) is mounted on the vibration isolation platform through the mounting holes (5-1-1) and the fastening screws.
10. The electrode substrate fixing device for welding the hemispherical resonator with the electrode substrate as claimed in claim 9, wherein: the fixed base (5) is made of stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210252949.5A CN114505629B (en) | 2022-03-15 | 2022-03-15 | Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210252949.5A CN114505629B (en) | 2022-03-15 | 2022-03-15 | Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114505629A true CN114505629A (en) | 2022-05-17 |
| CN114505629B CN114505629B (en) | 2022-12-06 |
Family
ID=81553425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210252949.5A Active CN114505629B (en) | 2022-03-15 | 2022-03-15 | Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114505629B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115452005A (en) * | 2022-10-28 | 2022-12-09 | 四川图林科技有限责任公司 | Optical path adjusting system during gyroscope assembly |
| CN117190996A (en) * | 2023-09-08 | 2023-12-08 | 中国科学院长春光学精密机械与物理研究所 | Hemispherical resonant gyroscope based on stress-free bonding and assembly method thereof |
| CN117300286A (en) * | 2023-11-29 | 2023-12-29 | 中国船舶集团有限公司第七〇七研究所 | Vacuum welding equipment and welding method for hemispherical resonator gyroscope |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020085598A1 (en) * | 2000-12-28 | 2002-07-04 | Shaw Mark A. | Low cost optical bench having high thermal conductivity |
| EP2008966A2 (en) * | 2007-06-27 | 2008-12-31 | Sumitomo Precision Products Co., Ltd. | MEMS device formed inside hermetic chamber having getter film |
| US20110001222A1 (en) * | 2008-02-18 | 2011-01-06 | Nozomu Nishimura | Electronic device, layered substrate, and methods of manufacturing same |
| WO2013070767A1 (en) * | 2011-11-07 | 2013-05-16 | Apple Inc. | Dual orientation electronic connector with external contacts |
| CN103644901A (en) * | 2013-12-05 | 2014-03-19 | 中国电子科技集团公司第二十六研究所 | Assembly fixture and assembly detection system for sensitive meter of hemispherical resonator gyro |
| CN103674060A (en) * | 2013-11-28 | 2014-03-26 | 哈尔滨工业大学 | Output compensation method and system of hemispherical resonator gyro |
| CN205290233U (en) * | 2016-01-11 | 2016-06-08 | 苏州波发特电子科技有限公司 | Positioning mechanism is used in harmonic oscillator welding |
| CN205290232U (en) * | 2016-01-11 | 2016-06-08 | 苏州波发特电子科技有限公司 | Fixed establishment is used in harmonic oscillator welding |
| CN106153028A (en) * | 2016-08-04 | 2016-11-23 | 上海交通大学 | Inside and outside discrete distributed gyroscope of bipolar electrode and preparation method thereof |
| CN205847208U (en) * | 2016-07-18 | 2016-12-28 | 应达利电子股份有限公司 | Resonator, pedestal and pedestal group with capacitance-resistance loop |
| CN107014366A (en) * | 2017-03-30 | 2017-08-04 | 中国人民解放军国防科学技术大学 | A kind of cylindrical shell oscillation gyro based on static excitation with detection |
| CN108731660A (en) * | 2018-03-28 | 2018-11-02 | 东南大学 | A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode |
| CN109813340A (en) * | 2019-02-21 | 2019-05-28 | 哈尔滨工业大学 | Hemispherical reso nance gyroscope signal detection system and the detection method for considering detecting electrode Form and position error |
| CN209030174U (en) * | 2018-12-23 | 2019-06-25 | 研创科技（惠州）有限公司 | A kind of resonator puts quartz chip combination bindiny mechanism |
| CN211457100U (en) * | 2020-03-10 | 2020-09-08 | 杭州鸿星电子有限公司 | Quartz resonator base with built-in thermistor |
| CN111878068A (en) * | 2020-05-11 | 2020-11-03 | 中国科学院地质与地球物理研究所 | High-temperature solid-state resonance gyroscope and drilling measurement system composed of same |
| CN113868792A (en) * | 2021-09-18 | 2021-12-31 | 湖北航天技术研究院总体设计所 | Semi-ring type resonance gyroscope and manufacturing method thereof |
| CN114105075A (en) * | 2021-11-12 | 2022-03-01 | 中国电子科技集团公司第二十六研究所 | Micro-hemispherical gyroscope structure of curved surface electrode and preparation method thereof |
-
2022
- 2022-03-15 CN CN202210252949.5A patent/CN114505629B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020085598A1 (en) * | 2000-12-28 | 2002-07-04 | Shaw Mark A. | Low cost optical bench having high thermal conductivity |
| EP2008966A2 (en) * | 2007-06-27 | 2008-12-31 | Sumitomo Precision Products Co., Ltd. | MEMS device formed inside hermetic chamber having getter film |
| US20110001222A1 (en) * | 2008-02-18 | 2011-01-06 | Nozomu Nishimura | Electronic device, layered substrate, and methods of manufacturing same |
| WO2013070767A1 (en) * | 2011-11-07 | 2013-05-16 | Apple Inc. | Dual orientation electronic connector with external contacts |
| CN103674060A (en) * | 2013-11-28 | 2014-03-26 | 哈尔滨工业大学 | Output compensation method and system of hemispherical resonator gyro |
| CN103644901A (en) * | 2013-12-05 | 2014-03-19 | 中国电子科技集团公司第二十六研究所 | Assembly fixture and assembly detection system for sensitive meter of hemispherical resonator gyro |
| CN205290233U (en) * | 2016-01-11 | 2016-06-08 | 苏州波发特电子科技有限公司 | Positioning mechanism is used in harmonic oscillator welding |
| CN205290232U (en) * | 2016-01-11 | 2016-06-08 | 苏州波发特电子科技有限公司 | Fixed establishment is used in harmonic oscillator welding |
| CN205847208U (en) * | 2016-07-18 | 2016-12-28 | 应达利电子股份有限公司 | Resonator, pedestal and pedestal group with capacitance-resistance loop |
| CN106153028A (en) * | 2016-08-04 | 2016-11-23 | 上海交通大学 | Inside and outside discrete distributed gyroscope of bipolar electrode and preparation method thereof |
| CN107014366A (en) * | 2017-03-30 | 2017-08-04 | 中国人民解放军国防科学技术大学 | A kind of cylindrical shell oscillation gyro based on static excitation with detection |
| CN108731660A (en) * | 2018-03-28 | 2018-11-02 | 东南大学 | A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode |
| CN209030174U (en) * | 2018-12-23 | 2019-06-25 | 研创科技（惠州）有限公司 | A kind of resonator puts quartz chip combination bindiny mechanism |
| CN109813340A (en) * | 2019-02-21 | 2019-05-28 | 哈尔滨工业大学 | Hemispherical reso nance gyroscope signal detection system and the detection method for considering detecting electrode Form and position error |
| CN211457100U (en) * | 2020-03-10 | 2020-09-08 | 杭州鸿星电子有限公司 | Quartz resonator base with built-in thermistor |
| CN111878068A (en) * | 2020-05-11 | 2020-11-03 | 中国科学院地质与地球物理研究所 | High-temperature solid-state resonance gyroscope and drilling measurement system composed of same |
| CN113868792A (en) * | 2021-09-18 | 2021-12-31 | 湖北航天技术研究院总体设计所 | Semi-ring type resonance gyroscope and manufacturing method thereof |
| CN114105075A (en) * | 2021-11-12 | 2022-03-01 | 中国电子科技集团公司第二十六研究所 | Micro-hemispherical gyroscope structure of curved surface electrode and preparation method thereof |
Non-Patent Citations (8)
| Title |
|---|
| 伊国兴等: "半球谐振陀螺控制及补偿技术", 《宇航学报》 * |
| 张挺等: "半球陀螺谐振子的金属化镀膜工艺技术研究", 《压电与声光》 * |
| 文路等: "半球谐振陀螺静电驱动建模与分析", 《压电与声光》 * |
| 李绍良等: "基于幅频响应特性的半球谐振子频率裂解与固有刚度轴方位角测定方法", 《飞控与探测》 * |
| 李陟等: "半球陀螺封装激光焊"错边"现象探析", 《压电与声光》 * |
| 李鼎等: "半球谐振陀螺在海洋导航定位中的应用", 《导航定位学报》 * |
| 蒋春桥等: "基于平板电极的半球谐振陀螺全角技术研究", 《压电与声光》 * |
| 赖小明等: "半球谐振陀螺平台***稳定回路设计", 《弹箭与制导学报》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115452005A (en) * | 2022-10-28 | 2022-12-09 | 四川图林科技有限责任公司 | Optical path adjusting system during gyroscope assembly |
| CN115452005B (en) * | 2022-10-28 | 2023-01-10 | 四川图林科技有限责任公司 | Optical path adjusting system during gyroscope assembly |
| CN117190996A (en) * | 2023-09-08 | 2023-12-08 | 中国科学院长春光学精密机械与物理研究所 | Hemispherical resonant gyroscope based on stress-free bonding and assembly method thereof |
| CN117190996B (en) * | 2023-09-08 | 2024-04-16 | 中国科学院长春光学精密机械与物理研究所 | Hemispherical resonant gyroscope based on stress-free bonding and assembly method thereof |
| CN117300286A (en) * | 2023-11-29 | 2023-12-29 | 中国船舶集团有限公司第七〇七研究所 | Vacuum welding equipment and welding method for hemispherical resonator gyroscope |
| CN117300286B (en) * | 2023-11-29 | 2024-01-30 | 中国船舶集团有限公司第七〇七研究所 | Vacuum welding equipment and welding method for hemispherical resonator gyroscope |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114505629B (en) | 2022-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114505629B (en) | Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate | |
| CN112414389B (en) | Harmonic oscillator of hemispherical resonator gyroscope and signal acquisition structure thereof | |
| CN114409276B (en) | Fixing device for welding quartz hemispherical harmonic oscillator and quartz electrode substrate | |
| US20130160578A1 (en) | Gyroscope and method of fabricating a resonator for a gyroscope | |
| CN108413952A (en) | Hemispherical resonator mode axis and quality factor detection device | |
| CN114636410B (en) | Umbrella-shaped hemispherical harmonic oscillator with variable wall thickness and hemispherical resonant gyroscope | |
| RU2007125894A (en) | SMALL SIZE SOLID WAVE GYROSCOPE | |
| CN114396926A (en) | Hemispherical resonance gyroscope | |
| CN109212262A (en) | A kind of high-temperature piezoelectric acceleration transducer based on lateral vibration mode | |
| CN116164720A (en) | Spherical gap adjusting device and method based on hemispherical resonant gyro sensitive component | |
| CN102779707A (en) | Assembling method for quality analytical instrument with four-pole rods | |
| CN112414388B (en) | Hemispherical resonant gyroscope capacitor structure for angular parameter detection and processing method | |
| CN111912399A (en) | Miniature gyroscope sensitive unit with improved scale factor and gyroscope | |
| CN114636411B (en) | Non-uniform wall thickness phi-shaped hemispherical harmonic oscillator and hemispherical harmonic gyroscope | |
| CN217716435U (en) | Hemispherical resonance gyroscope base | |
| CN218066520U (en) | Hemispherical resonator gyroscope | |
| Yuan et al. | High precision assembly and welding method for flat-electrode hemispherical resonator gyro | |
| CN107932057A (en) | A kind of aero-engine power turbine torch measuring system assembly method | |
| CN117490669A (en) | Device and method for trimming quality factor of harmonic oscillator of resonance gyroscope | |
| CN221037445U (en) | Hemispherical resonator gyro excitation and detection device | |
| CN111044023B (en) | Large-range high-overload metal cylindrical resonance gyroscope for bombs | |
| CN113865573B (en) | Gyro structure based on piezoelectric/capacitive drive detection | |
| CN118293897A (en) | Hemispherical resonant gyro with integrated structure | |
| CN114573219B (en) | Harmonic oscillator pose adjusting device for welding harmonic oscillator and electrode substrate | |
| CN117889836A (en) | Hemispherical resonator gyroscope with external spherical electrode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |