CN114460449A - Low-temperature testing device and method for electromagnetic relay - Google Patents
Low-temperature testing device and method for electromagnetic relay Download PDFInfo
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- CN114460449A CN114460449A CN202111539508.5A CN202111539508A CN114460449A CN 114460449 A CN114460449 A CN 114460449A CN 202111539508 A CN202111539508 A CN 202111539508A CN 114460449 A CN114460449 A CN 114460449A
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/327—Testing of circuit interrupters, switches or circuit-breakers
- G01R31/3277—Testing of circuit interrupters, switches or circuit-breakers of low voltage devices, e.g. domestic or industrial devices, such as motor protections, relays, rotation switches
- G01R31/3278—Testing of circuit interrupters, switches or circuit-breakers of low voltage devices, e.g. domestic or industrial devices, such as motor protections, relays, rotation switches of relays, solenoids or reed switches
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Abstract
The application provides an electromagnetic relay low-temperature testing device and method, the device includes: the temperature control box is characterized in that a mounting hole is formed in the surface of the box body of the temperature control box, a shell of the electromagnetic relay is positioned inside the box body, the side wall of the shell is detachably connected with the side edge of the mounting hole, and a pin of the electromagnetic relay is positioned outside the box body; a temperature adjusting device is arranged in the box body and used for changing the temperature of the gas in the box body; a heating resistance wire wound around a middle portion of the pin, configured to change a temperature of the contact connected with the pin. The low-temperature testing device and method for the electromagnetic relay have the advantages of being simple in structure, easy and convenient to operate, high in universality, capable of reducing series resistance caused by external leads, reducing measuring errors, convenient to test different pins of the electromagnetic relay, and capable of achieving recurrence and positioning analysis of faults.
Description
Technical Field
The application relates to the technical field of relay testing, in particular to a low-temperature testing device and method for an electromagnetic relay.
Background
The electromagnetic relay is an electronic control device, and plays the roles of automatic regulation, safety protection, circuit conversion and the like in a circuit. In the aerospace field, the electromagnetic relay is generally required to have good working reliability at low temperature, but at low temperature, moisture in the electromagnetic relay can generate condensation, icing and other phenomena on a contact, so that the electromagnetic relay fails at low temperature, and the performance test of the electromagnetic relay at low temperature is very important.
The existing electromagnetic relay low-temperature testing device needs to arrange the electromagnetic relay into the low-temperature box for cooling, a long lead is connected to a detection device outside the low-temperature box for testing on a pin of the electromagnetic relay, and the series resistance of the lead is large, so that the error of a measuring result is large.
Disclosure of Invention
In view of the above, an objective of the present invention is to provide a device and a method for testing an electromagnetic relay at a low temperature to solve the above-mentioned technical problems.
In a first aspect of the present application, there is provided an electromagnetic relay low-temperature testing apparatus, including: the temperature control box is characterized in that a mounting hole is formed in the surface of the box body of the temperature control box, a shell of the electromagnetic relay is positioned inside the box body, the side wall of the shell is detachably connected with the side edge of the mounting hole, and a pin of the electromagnetic relay is positioned outside the box body; and a temperature adjusting device is arranged in the box body and used for changing the temperature of the gas in the box body.
Further, the mounting hole is a rectangular hole, elastic sealing gaskets are arranged on four sides of the rectangular hole, and the side wall of the shell is clamped on the elastic sealing gaskets.
Further, a heat insulation sheet is arranged between the pin and the shell.
Further, the electromagnetic relay low temperature test device still includes: a contact resistance tester electrically connected to the pin and configured to detect a contact resistance of a contact connected to the pin, the contact being located inside the housing.
Further, the electromagnetic relay low temperature test device still includes: a heating resistance wire wound around a middle portion of the pin, configured to change a temperature of the contact connected with the pin.
Further, the electromagnetic relay low temperature test device still includes: an infrared thermal imager configured to detect a temperature of the pin.
In a second aspect of the present application, there is provided a method for testing an electromagnetic relay at a low temperature, using the apparatus for testing an electromagnetic relay at a low temperature as described in the first aspect, the method comprising: installing the electromagnetic relay in the installation hole; setting the temperature of the temperature control box at a first temperature through the temperature adjusting device; detecting, by the contact resistance tester, the contact resistance of the contact connected with the pin.
Further, the electromagnetic relay low-temperature test method further comprises the following steps: reducing the temperature of the temperature control box from the first temperature to a second temperature through the temperature adjusting device; monitoring the contact resistance change of the contact through the contact resistance tester, and generating a first contact resistance temperature change curve.
Further, the electromagnetic relay low-temperature test method further comprises the following steps: setting the temperature of the contact connected with the pin at a third temperature through the heating resistance wire; detecting the contact resistance of the contact by the contact resistance tester.
Further, the electromagnetic relay low-temperature test method further comprises the following steps: the temperature of the contact is increased from the third temperature to a fourth temperature through the heating resistance wire; monitoring the contact resistance change of the contact through the contact resistance tester, and generating a second contact resistance temperature change curve.
From the above, the application provides the low-temperature testing device and the low-temperature testing method for the electromagnetic relay, the shell of the electromagnetic relay is detachably connected to the side edge of the mounting hole of the temperature control box, so that the shell of the electromagnetic relay is positioned in the box body, the pins of the electromagnetic relay are positioned outside the box body, the pins outside the box body can be directly measured during measurement, external leads from the inside of the box body to the outside of the box body are omitted, the series resistance is reduced, and the measured data are more accurate; the pins are arranged outside the box body, so that connection tests of different pins are facilitated, different electromagnetic relay test works are conveniently completed, connection operation in the box body is avoided, and time and labor are saved; the temperature of the gas in the box body can be changed by adjusting the temperature adjusting device, and the gas in the box body is contacted with the shell of the electromagnetic relay to carry out heat exchange, so that the temperature of the shell is changed, the use environment of the electromagnetic relay can be simulated, and the recurrence of the low-temperature failure fault of the electromagnetic relay is realized; the electromagnetic relay low-temperature testing device and the method have the advantages of simple structure, simplicity and convenience in operation, strong universality, reduction in series resistance caused by an external lead wire, reduction in measurement error, convenience in testing of different pins of the electromagnetic relay, and realization of fault reproduction and positioning analysis.
Drawings
In order to more clearly illustrate the technical solutions in the present application or the related art, the drawings needed to be used in the description of the embodiments or the related art will be briefly introduced below, and it is obvious that the drawings in the following description are only embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a low-temperature testing device for an electromagnetic relay according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of another electromagnetic relay low-temperature testing device according to an embodiment of the present application;
fig. 3 is a schematic flowchart of a low-temperature testing method for an electromagnetic relay according to an embodiment of the present application;
fig. 4 is a schematic flowchart of another electromagnetic relay low-temperature testing method according to an embodiment of the present application.
Reference numerals: 1. a temperature control box; 1-1, mounting holes; 1-2, a temperature adjusting device; 1-3, an elastic sealing gasket; 1-4, heat insulation sheets; 2. an electromagnetic relay; 2-1, a shell; 2-2, pins; 3. a contact resistance tester; 4. heating resistance wires; 5. an infrared thermal imager.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is further described in detail below with reference to the accompanying drawings in combination with specific embodiments.
It should be noted that technical terms or scientific terms used in the embodiments of the present application should have a general meaning as understood by those having ordinary skill in the art to which the present application belongs, unless otherwise defined. The use of "first," "second," and similar terms in the embodiments of the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
The electromagnetic relay is an electronic control device, it has control system and controlled system, usually applied in automatic control circuit, it is an automatic switch using smaller current and lower voltage to control larger current and higher voltage, so it plays the role of automatic regulation, safety protection, switching circuit, etc. in the circuit.
In the aerospace field, the electromagnetic relay is generally required to have good working reliability between 85 ℃ above zero and 55 ℃ below zero, but at low temperature, moisture in the relay can generate condensation, icing and other phenomena on contacts, so that contact resistance is increased, the electromagnetic relay fails at low temperature, and the performance of the electromagnetic relay at low temperature needs to be tested.
The existing relay low-temperature testing device needs to arrange the whole relay in a low-temperature box for cooling, a long lead is connected to a pin and is connected to a detection device outside the low-temperature box for testing, the pin contact resistance of an electromagnetic relay is usually in the milliohm level, and the measurement error of the electromagnetic relay is large due to the large series resistance of an external lead; and different pins of the electromagnetic relay are tested, and the adjustment and connection are required to be carried out in the low-temperature box, so that the operation is inconvenient, and time and labor are wasted.
The in-process discovery that realizes this application can consider further design the low-temperature box, only carries out temperature control to electromagnetic relay's shell, and makes electromagnetic relay's pin expose in the low-temperature box outside, saves longer pin wiring, also is convenient for connect the operation to different pins, solves the big problem of measuring error.
The technical solution of the present application is described in detail below by specific examples with reference to fig. 1 to 4.
Some embodiments of the present application provide an electromagnetic relay low temperature testing apparatus, as shown in fig. 1, including: the temperature control box 1 is characterized in that a mounting hole 1-1 is formed in the surface of the box body of the temperature control box 1, a shell 2-1 of the electromagnetic relay 2 is positioned inside the box body, the side wall of the shell 2-1 is detachably connected with the side edge of the mounting hole 1-1, and a pin 2-2 of the electromagnetic relay 2 is positioned outside the box body; a temperature adjusting device 1-2 is arranged in the box body, and the temperature adjusting device 1-2 is used for changing the temperature of gas in the box body.
The installation hole 1-1 can be obtained by modifying the surface of the existing temperature control box 1, and the installation hole 1-1 arranged on the surface of the box is matched with the shape of the shell 2-1 of the electromagnetic relay 2, so that the integral structure and the use of the temperature control box 1 are not influenced; after the electromagnetic relay 2 is tested, the electromagnetic relay 2 can be detached and a heat insulation plug is arranged to block the mounting hole 1-1, so that other temperature control tests can be carried out, and the manufacturing cost is reduced.
The shell 2-1 of the electromagnetic relay 2 is detachably connected to the side edge of the mounting hole 1-1 of the temperature control box 1, so that the shell 2-1 of the electromagnetic relay 2 is located inside the box body, the pin 2-2 of the electromagnetic relay 2 is located outside the box body, the pin 2-2 outside the box body can be directly connected to the electromagnetic relay 2 for measurement when the electromagnetic relay is measured, an external lead wire connecting the inside of the box body to the outside of the box body is omitted, the series resistance caused by the external lead wire is reduced, the test error is reduced, and the measured data is more accurate.
The pins 2-2 are arranged outside the box body of the temperature control box 1, so that connection testing of different pins 2-2 is facilitated, testing work of different electromagnetic relays 2 is conveniently completed, connection operation of the pins 2-2 in the box body is avoided, and time and labor are saved.
The temperature adjusting device 1-2 is, for example, a cold air pump or a hot air pump, and the cold air pump can be used when the electromagnetic relay 2 is subjected to a low-temperature test, specifically, the cold air pump is not limited, the temperature of the gas in the box body can be changed by adjusting the temperature adjusting device 1-2, and the gas in the box body is contacted with the shell 2-1 of the electromagnetic relay 2 to perform heat exchange, so that the temperature of the shell 2-1 is changed, the use environment of the electromagnetic relay 2 is simulated, and the process of low-temperature failure fault of the electromagnetic relay 2 is repeated. The temperature control range of the temperature adjusting device 1-2 can be from-60 ℃ to-90 ℃, and is not limited specifically.
The electromagnetic relay low-temperature testing device is simple in structure, simple and convenient to operate and high in universality, reduces series resistance caused by an external lead, reduces measuring errors, and is convenient to test different pins 2-2 of the electromagnetic relay 2.
In some embodiments, as shown in fig. 1, the mounting hole 1-1 is a rectangular hole, the four sides of the rectangular hole are provided with elastic sealing gaskets 1-3, and the side walls of the housing 2-1 are clamped on the elastic sealing gaskets 1-3.
The elastic sealing gasket 1-3 is, for example, a silica gel gasket, and is not particularly limited, the silica gel gasket is arranged on four sides of the rectangular hole, on one hand, the casing 2-1 is clamped by the box body and the silica gel gasket in a squeezing manner, so that the casing 2-1 of the electromagnetic relay 2 is positioned in the box body, and the pin 2-2 of the electromagnetic relay 2 is positioned outside the box body; on the other hand, a sealed environment is formed inside the box body, and the heat exchange effect between the shell 2-1 and the air inside the box body is improved.
In some embodiments, as shown in FIG. 2, a thermal shield 1-4 is disposed between the pin 2-2 and the housing 2-1.
As shown in fig. 2, the electromagnetic relay 2 is clamped in the rectangular hole, so that the side wall and the bottom surface of the shell 2-1 are positioned in the box body, the top surface of the shell 2-1 is exposed to the outside, the heat exchange between the outside of the box body and the top surface of the shell 2-1 can be isolated by arranging the heat insulating sheets 1-4, the temperature balance of the shell 2-1 is ensured, each surface of the shell 2-1 is positioned in the box body of the temperature control box 1, and only the pin 2-2 of the electromagnetic relay 2 is exposed; the heat insulation sheets 1 to 4 can be asbestos nets, foam plates or the like, and are not limited specifically, the width of the heat insulation sheets 1 to 4 is equal to that of the rectangular holes, and the length of the heat insulation sheets 1 to 4 is greater than or equal to that of the rectangular holes.
In some embodiments, as shown in fig. 2, the electromagnetic relay low-temperature testing apparatus further includes: a contact resistance tester 3 electrically connected to the pin 2-2 and configured to detect a contact resistance of a contact connected to the pin 2-2, the contact being located inside the housing 2-1.
The contact resistance tester 3 is designed by combining a high-frequency switching power supply technology and a digital circuit technology according to a new electric power execution standard DL/T845.4-2004, is suitable for measuring the contact resistance of the switch control equipment, has accurate measurement and stable performance, and meets the requirements of field switch maintenance and contact resistance test of electric power and power supply departments.
The contact resistance tester 3 is connected with the two pins 2-2 of the electromagnetic relay 2, so that the contact resistance between the contacts correspondingly connected with the two pins 2-2 can be tested, for example, the contacts correspondingly connected with the two pins 2-2 are normally open contacts, the corresponding theoretical value of the contact resistance is infinite, if the contacts correspondingly connected with the two pins 2-2 are normally closed contacts, the corresponding theoretical value of the contact resistance is zero, the conduction performance between the contacts can be known by testing the contact resistance, and further, the abnormal condition of the contacts is quantitatively analyzed.
In some embodiments, as shown in fig. 2, the electromagnetic relay low-temperature testing apparatus further includes: and a heating resistance wire 4 wound in the middle of the pin 2-2 and configured to change the temperature of the contact connected with the pin 2-2.
The heating resistance wire 4 is, for example, an iron-chromium-aluminum spiral resistance wire, and is not particularly limited, the heating resistance wire 4 can generate a heat effect by current passing through a resistance body to electrically heat the pins 2-2, so that the heating effect is more uniform, the heat efficiency is high, and the environmental pollution is less. The heating temperature is, for example, from-5 ℃ to-30 ℃, and is not particularly limited.
The pin 2-2 is heated through the heating resistance wire 4, the temperature of the pin 2-2 can be changed, and then the temperature of a contact connected with the pin 2-2 is changed, when the electromagnetic relay 2 is used in a low-temperature environment, an internal contact is maintained at a certain temperature, for example, 15 ℃ above zero, and the temperature of the contact is higher than the temperature of the external environment, the temperature of the contact is changed through the heating resistance wire 4, the real use condition of the electromagnetic relay 2 can be further simulated, the failure fault of the electromagnetic relay 2 can be more accurately analyzed, comparison can be carried out by setting different contact temperatures, the change relation between the electrical parameters of the contact and the temperature can be analyzed, the electrical parameters can be contact resistance, contact voltage drop and the like, and limitation is not particularly carried out.
In some embodiments, as shown in fig. 2, the electromagnetic relay low-temperature testing apparatus further includes: an infrared thermal imager 5 configured to detect the temperature of the pin 2-2.
The infrared thermal imager 5 is a device that converts an image of the temperature distribution of a subject into a visible image by detecting infrared radiation of the subject and performing signal processing using an infrared thermal imaging technique.
The infrared imager does not need to be in direct contact with the pin 2-2, the temperature of the pin 2-2 can be obtained only by scanning the pin 2-2, the temperature of the contact is further obtained, comparison between the temperature of the contact and electrical parameters is facilitated, and the infrared imager is better in operation and accurate in data compared with a patch type thermometer for measuring the temperature of the pin 2-2 due to the fact that the size of the pin 2-2 is small.
The description of the present application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the application in the form disclosed. Many modifications and variations will be apparent to practitioners skilled in this art. The embodiment was chosen and described in order to best explain the principles of the application and the practical application, and to enable others of ordinary skill in the art to understand the application for various embodiments with various modifications as are suited to the particular use contemplated.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the context of the present application, also features in the above embodiments or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of brevity.
Based on the same inventive concept, the present application further provides a method for testing a low temperature of an electromagnetic relay, as shown in fig. 3, using the apparatus for testing a low temperature of an electromagnetic relay as shown in fig. 1 and fig. 2, the method comprising the following steps:
s101, installing the electromagnetic relay 2 in the installation hole 1-1.
The shell 2-1 of the electromagnetic relay 2 is positioned in the box body, so that the shell 2-1 is conveniently cooled; and the pin 2-2 of the electromagnetic relay 2 is positioned outside the box body, so that the contact connected with the pin 2-2 can be measured conveniently.
And S102, setting the temperature of the temperature control box 1 at a first temperature through the temperature adjusting device 1-2.
The first temperature is, for example, 10 ℃ below zero, 20 ℃ below zero, or 30 ℃ below zero, and is not particularly limited and is used for simulating a low-temperature environment when the housing 2-1 is used.
The temperature inside the temperature control box 1 can be obtained by testing through a patch type thermometer.
S103, detecting the contact resistance of the contact connected with the pin 2-2 through the contact resistance tester 3.
The contact resistance measured in the step S103 is the contact resistance of the contact point connected with the pin 2-2 at the first temperature of the case 2-1, and since the pin 2-2 is arranged outside the temperature control box 1, an external lead from the inside to the outside of the box body is omitted, so that the measured contact resistance is more accurate.
And S104, reducing the temperature of the temperature control box 1 from the first temperature to a second temperature through the temperature adjusting device 1-2.
The second temperature is, for example, 40 ℃ below zero, 50 ℃ below zero, or 60 ℃ below zero, and is not particularly limited, and is used for simulating a process of low-temperature failure of the electromagnetic relay 2 along with the reduction of the external environment temperature.
The temperature reduction operation can be performed step by step from the first temperature to the second temperature, for example, from minus 10 ℃ to minus 60 ℃ of the first temperature, and the temperature reduction operation can be performed sequentially according to minus 10 ℃, minus 20 ℃, minus 30 ℃, minus 40 ℃, minus 50 ℃ and minus 60 ℃, so that the data comparison is convenient.
And S105, monitoring the contact resistance change of the contact through the contact resistance tester 3, and generating a first contact resistance temperature change curve.
The first contact resistance temperature change curve is a change relation curve of the contact resistance of the contact connected with the pin 2-2 and the temperature of the shell 2-1 in the process that the electromagnetic relay 2 is reduced from the first temperature to the second temperature, so that the low-temperature failure characteristic of the contact can be analyzed, and the contact fault can be conveniently reproduced.
In some embodiments, when the temperature of the temperature control box 1 is reduced to a low-temperature failure phenomenon of the electromagnetic relay 2, the contact resistance of the normally closed contact at this time is changed greatly, for example, the contact resistance is increased from 1 milliohm to 500 milliohm, and the failure temperature and the failure degree of the contact can be obtained from the first contact resistance temperature change curve, so that the contact fault can be favorably located and analyzed, and the electromagnetic relay 2 can be further improved subsequently.
The failure degree may be a change percentage of the contact resistance, and the failure temperature may be a temperature of the case 2-1 when the change percentage reaches a preset value, for example, 300%, and is not limited specifically.
In some embodiments, the pins 2-2 of the same type of the electromagnetic relay 2 are multiple groups, and the pins 2-2 of the same type may be subjected to a contact resistance test, for example, the pins 2-2 connected to the normally closed contact may be subjected to a test respectively, so as to obtain respective first contact resistance temperature change curves, and the difference between the different pins 2-2 of the same type may be analyzed by comparing the first contact resistance temperature change curves.
In some embodiments, as shown in fig. 4, the electromagnetic relay low-temperature testing method includes the following steps:
s201, installing the electromagnetic relay 2 in the installation hole 1-1.
The shell 2-1 of the electromagnetic relay 2 is positioned in the box body, so that the shell 2-1 is conveniently cooled; and the pin 2-2 of the electromagnetic relay 2 is positioned outside the box body, so that the contact connected with the pin 2-2 can be measured conveniently.
S202, setting the temperature of the temperature control box 1 at a first temperature through the temperature adjusting device 1-2.
The first temperature is, for example, 10 ℃ below zero, 20 ℃ below zero, or 30 ℃ below zero, and is not particularly limited and is used for simulating a low-temperature environment when the housing 2-1 is used.
And S203, setting the temperature of the contact connected with the pin 2-2 at a third temperature through the heating resistance wire 4.
The third temperature is, for example, 5 ℃ above zero, 10 ℃ above zero, or 15 ℃ above zero, and is not particularly limited, and is used to more truly simulate the temperature of the contact of the electromagnetic relay 2 when in use.
When the electromagnetic relay 2 is used in a low-temperature environment, the temperature of the contacts is maintained at a certain temperature, for example, 15 ℃ above zero due to the fact that the internal contacts are electrified to generate heat and the like, the temperature of the contacts is higher than the temperature of the external environment, the temperature of the contacts is changed through the heating resistance wire 4, the service condition of the electromagnetic relay 2 can be further simulated, the failure fault of the electromagnetic relay 2 can be more accurately analyzed, different contact temperatures can be set for comparison, and the change relation between the electrical parameters of the contacts and the temperature can be analyzed.
And S204, detecting the contact resistance of the contact through the contact resistance tester 3.
The contact resistance measured in the step S204 is the contact resistance of the contact connected with the pin 2-2 when the contact is at the third temperature and the shell 2-1 is at the first temperature, and as the pin 2-2 is arranged outside the temperature control box 1, an external lead from the inside to the outside of the box body is omitted, so that the measured contact resistance is more accurate; due to the fact that the pin 2-2 is heated, the measured contact resistance is closer to the contact resistance of the contact in a real environment.
And S205, increasing the temperature of the contact from the third temperature to a fourth temperature through the heating resistance wire 4.
The fourth temperature is, for example, 20 ℃ above zero, 25 ℃ above zero, 30 ℃ above zero, 35 ℃ above zero, or 40 ℃ above zero, and the variation relationship between the electrical property of the contact and the contact temperature is compared by heating the contact without limitation.
The temperature can be gradually increased from the third temperature to the fourth temperature, for example, from-10 ℃ above the third temperature to-30 ℃ above the fourth temperature, and the temperature can be sequentially decreased by-10 ℃, 15 ℃, 20 ℃, 25 ℃ above zero, and 30 ℃ above zero, thereby facilitating data comparison.
The temperature of the contact can be obtained by testing the temperature of the pin 2-2 by the infrared thermal imager 5, and the measured temperature of the pin 2-2 is equal to the temperature of the contact.
S206, monitoring the contact resistance change of the contact through the contact resistance tester 3, and generating a second contact resistance temperature change curve.
The second contact resistance temperature change curve is a change relation curve of the contact resistance of the contact and the contact temperature in the process that the shell 2-1 of the electromagnetic relay 2 is maintained at the first temperature and the contact of the electromagnetic relay 2 is increased from the third temperature to the fourth temperature, and the change characteristic of the contact along with the temperature can be analyzed.
In some embodiments, the contact resistance of the contact increases as the temperature of the contact increases, and when the temperature of the contact reaches the melting point of the contact material, the contact resistance decreases due to the melting of the contact, and the temperature-dependent characteristics of the contact can be analyzed from the second contact resistance temperature change curve, so that the electromagnetic relay 2 can be further improved later.
In some embodiments, the pins 2-2 of the same type of the electromagnetic relay 2 are multiple groups, and the pins 2-2 of the same type may be subjected to a contact resistance test, for example, the pins 2-2 connected to the normally closed contact may be subjected to a test respectively to obtain respective second contact resistance temperature change curves, and the difference between the different pins 2-2 of the same type may be analyzed by comparing the second contact resistance temperature change curves.
It should be noted that the method of this embodiment may be applied to a distributed scenario, and is completed by cooperation of multiple devices. In such a distributed scenario, one of the multiple devices may only perform one or more steps of the method of the embodiment, and the multiple devices interact with each other to complete the method.
It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments described above and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the context of the present application, technical features in the above embodiments or in different embodiments may also be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application described above, which are not provided in detail for the sake of brevity.
In addition, well-known power/ground connections to other components may or may not be shown in the figures provided for simplicity of illustration and discussion, and so as not to obscure the embodiments of the application. Further, devices may be shown in block diagram form in order to avoid obscuring embodiments of the application, and this also takes into account the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the embodiments of the application are to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details are set forth in order to describe example embodiments of the application, it will be apparent to one skilled in the art that the embodiments of the application can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description. The present embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present application are intended to be included within the scope of the present application.
Claims (10)
1. A low temperature testing device for an electromagnetic relay is characterized by comprising:
the temperature control box is characterized in that a mounting hole is formed in the surface of the box body of the temperature control box, a shell of the electromagnetic relay is positioned inside the box body, the side wall of the shell is detachably connected with the side edge of the mounting hole, and a pin of the electromagnetic relay is positioned outside the box body; and a temperature adjusting device is arranged in the box body and used for changing the temperature of the gas in the box body.
2. The electromagnetic relay low-temperature testing device according to claim 1, wherein the mounting hole is a rectangular hole, elastic sealing gaskets are arranged on four sides of the rectangular hole, and side walls of the housing are clamped on the elastic sealing gaskets.
3. The apparatus of claim 1, wherein a thermal shield is disposed between the pin and the housing.
4. The electromagnetic relay cryogenic test device of claim 1, further comprising: a contact resistance tester electrically connected to the pin and configured to detect a contact resistance of a contact connected to the pin, the contact being located inside the housing.
5. The electromagnetic relay cryogenic test device of claim 4, further comprising: a heating resistance wire wound around a middle portion of the pin, configured to change a temperature of the contact connected with the pin.
6. The electromagnetic relay cryogenic test device of claim 1, further comprising: an infrared thermal imager configured to detect a temperature of the pin.
7. An electromagnetic relay low-temperature test method using the electromagnetic relay low-temperature test apparatus according to claim 5, the method comprising:
installing the electromagnetic relay in the installation hole;
setting the temperature of the temperature control box at a first temperature through the temperature adjusting device;
detecting, by the contact resistance tester, the contact resistance of the contact connected with the pin.
8. The method for testing the electromagnetic relay at low temperature according to claim 7, further comprising:
reducing the temperature of the temperature control box from the first temperature to a second temperature through the temperature adjusting device;
monitoring the contact resistance change of the contact through the contact resistance tester, and generating a first contact resistance temperature change curve.
9. The method for testing the electromagnetic relay at low temperature according to claim 7, further comprising:
setting the temperature of the contact connected with the pin at a third temperature through the heating resistance wire;
detecting the contact resistance of the contact by the contact resistance tester.
10. The method for testing the electromagnetic relay at low temperature according to claim 9, further comprising:
the temperature of the contact is increased from the third temperature to a fourth temperature through the heating resistance wire;
monitoring the contact resistance change of the contact through the contact resistance tester, and generating a second contact resistance temperature change curve.
Priority Applications (1)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117970094A (en) * | 2024-01-31 | 2024-05-03 | 哈尔滨工业大学 | Simple load test device for atmosphere environment of sealed electromagnetic relay and use process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117970094A (en) * | 2024-01-31 | 2024-05-03 | 哈尔滨工业大学 | Simple load test device for atmosphere environment of sealed electromagnetic relay and use process |
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