CN114449756A

CN114449756A - Manipulating component carrier structures during temperature processing to inhibit deformation of the component carrier structures

Info

Publication number: CN114449756A
Application number: CN202011231684.8A
Authority: CN
Inventors: 黎振川
Original assignee: AT&S Chongqing Co Ltd
Current assignee: AT&S Chongqing Co Ltd
Priority date: 2020-11-06
Filing date: 2020-11-06
Publication date: 2022-05-06
Anticipated expiration: 2040-11-06
Also published as: TWM628025U; CN114449756B; KR200497050Y1; JP3235830U; KR20220001075U

Abstract

A handling device (100) for handling a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during temperature processing, wherein the handling device (100) comprises: a first clamp (108) and a second clamp (110) configured for receiving a component carrier structure (102) therebetween; an array of magnets (112) forming part of one of the first and second clamps (108, 110); and a plate (114) forming part of the other of the first clamp (108) and the second clamp (110), wherein the magnet (112) is configured to generate an attractive force with the plate (114) to inhibit deformation of the component carrier structure (102) therebetween.

Description

Manipulating component carrier structures during temperature processing to inhibit deformation of the component carrier structures

Technical Field

The invention relates to a handling device and a method for handling a component carrier structure during temperature processing, an arrangement and a reflow oven.

Background

As the product functionality of component carriers equipped with one or more electronic components grows and the miniaturization of such components, as well as the number of more and more components connected to the component carrier, such as printed circuit boards, increases, more and more powerful array-like components or packages with several components are being used, which have a plurality of contacts or connections and the spacing between these contacts is becoming smaller and smaller. In particular, the component carrier should have mechanical robustness and electrical reliability in order to be able to operate even under severe conditions.

In particular, deformation, bending or warping of the component carrier is an issue in terms of reliability and performance. This is particularly important during reflow soldering, especially when soldering is performed at the panel level.

Disclosure of Invention

A component carrier that can be manufactured with low warpage may be desirable.

According to an exemplary embodiment of the invention, a handling device is provided for handling a component carrier structure of a preform comprising a plurality of (in particular still integrally connected) component carriers during a temperature process (in particular in a reflow oven), wherein the handling device comprises: a first clamp and a second clamp configured to receive a component carrier structure therebetween; an array of magnets forming part of one of the first and second clamps; and a plate (in particular a metal plate, such as a continuous or substantially continuous metal plate, or another highly mechanically stable (preferably thermo-reoriented) material or body) forming part of the other of the first and second clamps, wherein the magnets are configured for generating an attractive force with the plate (e.g. with the plate itself when the plate is made of a metal material, or with magnets attached to the plate when the plate is made of a non-magnetic material) to inhibit deformation of the component carrier structure therebetween.

According to a further exemplary embodiment of the present invention, a handling device for a component carrier structure for a preform comprising a plurality of (in particular still integrally connected) component carriers during a temperature treatment (in particular in a reflow oven) is provided, wherein the handling device comprises: a first clamp and a second clamp configured to receive a component carrier structure therebetween; and a support structure forming part of at least one of the first and second clamps and comprising a plurality of rods arranged between preforms of different component carriers and supporting the component carrier structure.

According to a further exemplary embodiment of the present invention, an arrangement is provided, which comprises: an operating device having the above features; and a component carrier structure comprising a preform of a plurality of (in particular still integrally connected) component carriers accommodated between the first and second clamps.

According to a further exemplary embodiment of the present invention, a reflow oven for a component carrier structure of a preform comprising a plurality of component carriers is provided, wherein the reflow oven comprises: a handling device for handling a component carrier configuration having the above-mentioned features; and a heating unit for heating the handling device of the preform in which the component carrier is mounted.

According to a further exemplary embodiment of the invention, a method for manipulating a component carrier structure of a preform comprising a plurality of component carriers during temperature processing (in particular in a reflow oven) is provided, wherein the method comprises: accommodating the component carrier arrangement between a first clamp and a second clamp of a handling device (in particular a handling device having the above-mentioned features); generating an attractive force between an array of magnets forming part of one of the first and second clamps and a plate (preferably a metal plate) forming part of the other of the first and second clamps; and the handling device of the preform with the component carrier is heated for temperature treatment (in particular for reflow soldering).

According to a further exemplary embodiment of the invention, a method of handling a component carrier structure of a preform comprising a plurality of component carriers during temperature treatment (in particular in a reflow oven) is provided, wherein the component carrier structure is accommodated in a first and a second clamp of a handling device (in particular a handling device having the above-mentioned features), the component carrier structure is supported by a support structure of at least one of the first and second clamps, the support structure comprising a plurality of rods arranged between preforms of different component carriers, and the handling device is heated with the preforms of the component carriers for the temperature treatment (in particular for reflow soldering).

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and/or therein to provide mechanical support and/or electrical connection. In other words, the component carrier may be configured as a mechanical and/or electronic carrier for the component. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different ones of the above-mentioned types of component carriers.

In the context of the present application, the term "component carrier structure" may particularly denote a sheet which is handled and processed during manufacturing of a component carrier, for example a panel or an array of component carriers. In particular, the preforms of the component carrier may be integrally connected and may thus form part of an integral component carrier structure, for example, which may still be present at the panel level.

In the context of the present application, the term "handling device for handling a component carrier structure" may particularly denote an apparatus as follows: the apparatus is configured for holding a component carrier structure (such as a PCB panel) while the component carrier is being processed, in particular at high temperatures that may occur in a reflow oven. Such manipulation may be performed in a controlled manner, in particular for maintaining the component carrier structure in a predefined shape, position and orientation.

In the context of the present application, the term "clamp" may particularly denote a base or cover member configured for cooperating with another clamp to define a receiving space therebetween configured for holding a chip component carrier structure, such as a PCB panel. In other words, each clamp may contribute to a receiving space defined between two mating clamps and shaped and dimensioned to receive the component carrier structure. Furthermore, mating the clips may include providing in a manner that is capable of holding the clips together in a stable predefined configuration.

In the context of the present application, the term "deformation inhibiting" or "planarizing" the component carrier structure may particularly denote a tendency of attracting magnetic forces for inhibiting e.g. warping, bending and wrinkling of a PCB panel light sheet shaped component carrier structure, such as a PCB panel. To achieve this, the arrangement of the clamp may apply a force to the component carrier structure to keep the component carrier structure in a planar flat shape.

In the context of the present application, the term "bar" may particularly denote an elongated physical body, for example configured as a strip or web (web), and configured for supporting the component carrier structure while being accommodated between the clamps. For example, the width of each bar may be in the range of 0.1mm to 1mm, in particular in the range of 0.3mm to 0.5 mm.

In the context of the present application, the term "temperature treatment" may particularly denote a heat treatment or one or more processes (e.g. in a reflow oven) which are subject to (particularly significant) temperature variations of the component carrier structure.

In the context of the present application, the term "reflow oven" may particularly denote an apparatus for handling a component carrier structure, such as a PCB panel, during reflow soldering. In other words, the reflow oven may be configured for bringing the component carrier structure manipulated by the manipulation device to a temperature at which the solder of the component carrier structure may melt. In particular, the reflow oven may be configured for heating the component carrier structure to a temperature of at least 200 ℃, in particular at least 250 ℃, more in particular at least 270 or even 290 ℃ or more. The reflow oven may include multiple zones that may be individually controlled for temperature. For example, the reflow oven may comprise several heating zones followed by one or more cooling zones, wherein the component carrier structure may be moved through the reflow oven on a conveyor belt or the like, and thus may be subjected to a controlled time-temperature profile. The one or more heating units of the reflow oven may be embodied as one or more infrared heaters (which may transfer heat to the component carrier structure by radiation in the infrared wavelength range). The heating unit of the reflow oven that pushes the heated air towards the component carrier structure using one or more fans may be denoted as an infrared convection heating unit. Reflow soldering may refer to a process of temporarily attaching one or more electronic components to their contact pads using solder paste (such as a viscous mixture of powdered solder and flux), after which the entire assembly is subjected to controlled heating. The solder paste reflows in a molten state to form a permanent solder joint.

According to an exemplary embodiment of the invention, a processing device for processing a component carrier structure, such as a panel of a pre-form comprising a plurality of component carriers (such as PCBs, printed circuit boards) is provided, which processing device facilitates stabilizing the structure of the processed component carrier structure during high temperature processing, such as reflow soldering.

According to an exemplary embodiment of the first aspect of the invention, this may be achieved by holding the component carrier structure between two opposing clamps of the handling device, which clamps define the accommodation space of the component carrier structure and comprise a spatially distributed arrangement of magnets on one of the clamps. The magnet may utilize a (preferably metallic) plate of another clamp to generate the attractive force. Such a clamp arrangement can be manufactured simply and allows reliably preventing undesired buckling, wrinkling or bending of the manipulated component carrier structure. Thus, the component carrier structure can be given a well defined and stable configuration, allowing a highly accurate reflow soldering process.

According to an embodiment of the second aspect of the invention, the handling device comprising two cooperating clamps for handling the component carrier structure during heat treatment (e.g. reflow soldering) may be equipped with an arrangement of rods at least one of the clamps, which may in particular extend parallel and/or perpendicular to each other to define a mechanically stable support structure. This may ensure that the component carrier structure is reliably held in the predefined configuration during handling, so that undesired warping, wrinkling or bending of the component carrier structure may be reliably prevented. The rod array located at least one of the clamps may also have a positive influence on the thermal performance of the handling device during high temperature processing (e.g. around 100 ℃, in particular above 200 ℃) as a suitable heat transfer to the accommodated component carrier structure may be achieved by this design.

Thus, according to an exemplary embodiment of the invention, a handling device is provided, which comprises two mating clamps for holding and transporting a plate-type component carrier structure. The handling device may comprise a bottom clamp and a top clamp. The bottom clamp may include an embedded magnet capable of attracting the top clamp to the bottom clamp by magnetic force. An advantage of such a magnetic connection is that the component carrier structure can be easily attached to or detached from the handling device. Furthermore, undesired deformation (such as warping) of the plate-like component carrier structure can be reliably prevented. In addition to this, an undesired disassembly of the actuating device can be prevented by the magnetic biasing force. Furthermore, the effective heat capacity can be reduced by the frame-shaped design of at least one of the clamps, which can be provided by the provision of the rods. The component carrier, in particular the substrate or the printed circuit board, can be placed on a jig at the level of the panel and after a heat treatment, in particular a reflow treatment, the panel or the individual component carrier can be taken out of the jig.

Detailed description of exemplary embodiments

In the following, further exemplary embodiments of the handling device, the method, the arrangement and the reflow oven will be explained.

When the handling device is configured with an arrangement of cooperating magnets and metal plates, bars are provided, with recesses between the bars, which may cooperate for flattening and supporting the component carrier structure during handling in the reflow oven, while ensuring reliable reflow soldering. The mating metal plates and magnets may generate an attractive magnetic force, while the stem of at least one of the clamps may promote thermal performance. These two measures together ensure the production of a component carrier with high thermal, mechanical and electrical reliability.

In an embodiment, the array of magnets is formed as part of only one of the first or second fixtures, without the magnets being arranged at the respective other fixture. This may be appropriate, for example, when the further clamp comprises a metal plate.

In other embodiments, the array of magnets is formed as part of each of the first and second fixtures. For example, if no metal plate is used for the respective clamp, magnets may be provided on both clamps (in particular on both clamp plates). Instead of metal, non-metallic materials may be used for the plates. The non-metallic material may cooperate with a magnet to provide a magnetic force to manipulate the substrate.

In an embodiment, the plate is made of a material that supports heat distribution and/or redirection of the component carrier structure. Preferably, the plate is a metal plate. However, the plate may also comprise a material such as a glass composite.

In one embodiment, the magnet is attached to the support structure. Connecting the magnets to the support structure may ensure that an attractive magnetic force and a supporting mechanical force are provided at corresponding areas of the manipulation device, so that the corresponding forces may act together to keep the component carrier structure in a flat and predefined configuration while being able to reliably heat up. In particular, when the support structure comprises an array of first and second bars, which are oriented perpendicular to each other, a high mechanical retention force can be generated when the resulting grid-like arrangement cooperates with magnets arranged at the intersection of each horizontal bar with each vertical bar.

In an embodiment, the magnet forms part of a bottom clamp and the metal plate forms part of a top clamp. For example, the bottom clamp may include the entire arrangement of magnets and may not have a continuous metal plate, while the top clamp may include a substantially continuous metal plate and may not have magnets. Therefore, a high magnetic coupling force can be generated, however, the top clamp can be kept thin, which is advantageous in terms of stability. Furthermore, this configuration may ensure that the temperature gradient across the panel may be kept small.

In one embodiment, the magnet is made of a material having a curie temperature of at least 200 ℃, in particular at least 250 ℃. As known to those skilled in the art, the curie temperature or curie point is the temperature at which a material loses its permanent magnetic properties. To be suitable for use in a reflow oven, the curie temperature of the magnet should be higher than the temperature of the reflow soldering. When using magnets with curie temperatures above 250 ℃, the magnets and thus the entire manipulator may be suitable for reflow soldering.

In an embodiment, the force applied to the component carrier structure by the attraction force generated by the magnets and the metal plate is at least 10N, in particular at least 20N. By generating a force of at least 10N, and preferably at least 20N, the handling device may ensure that the sheet-shaped component carrier structure is reliably held in a flat or planar configuration and is not prone to bending or wrinkling during handling and in particular during reflow soldering. At the same time, such forces are sufficiently moderate to prevent an undesirable mechanical shock deterioration of the structure of the component carrier structure.

In one embodiment, the magnets are made of a permanent magnetic material. When the magnet is made of a permanent magnetic material, such as a ferromagnetic material or a ferrimagnetic material, it is sufficient to avoid the necessity of a permanent re-magnetization of the magnet. This results in a simple configuration of the operating device.

In an embodiment, the support structure is made of a thermally conductive material. For example, the material of the support structure may be made of a material having a thermal conductivity of at least 10W/mK, in particular at least 50W/mK, preferably at least 100W/mK. In a preferred embodiment, the metal clamp may be made of an aluminum alloy because it has a high thermal conductivity of, for example, 200W/mK or more. Generally, the higher the thermal conductivity, the better. For example, the support structure may be made of metal to provide such good thermal conductivity. Thus, for example, the grid-like support structure may thus serve to thermally balance potential temperature differences along the manipulated component carrier structure. For example, heat may be removed from hot spots of the component carrier structure by the support structure and may be provided to cold spots thereof. This avoids any undesirable thermal gradients of the component carrier structure, which may cause undesirable phenomena, such as warpage.

In an embodiment, the rods extend parallel to each other. For example, all the rods may extend parallel to each other, either horizontally or vertically. This may ensure a simple configuration of the handling device while at the same time ensuring a proper application of the supporting force from the handling device to the component carrier structure.

In another embodiment, the bars comprise first bars extending parallel to each other along a first direction and comprise second bars extending parallel to each other along a second direction perpendicular to the first direction, such that the bars form a grid with recesses. In particular, each recess in the grid may correspond to one component carrier or a central portion thereof. The surface portion of the respective component carrier corresponding to each recess may correspond to a component carrier region on which a component (such as a semiconductor die) is to be surface mounted. Solder paste may be applied to the component carrier areas. According to such a preferred configuration, the grid of rods extending in two perpendicular directions may form a grid for reliably supporting the component carrier structure. When the dimensions of each recess defined by the pair of first rods and the pair of second rods correspond to the dimensions of the currently manufactured component carrier or a preform of the component carrier, it can be ensured that the retaining means does not contact the component carrier structure in its functional part. In contrast to this, it can then be ensured that the support structure is only in contact with the component carrier structure to be planarized and supported in the region between such functionally useful areas of the component carrier.

In an embodiment, each of the first and second clamps comprises a pin exerting a connecting force from two opposite main surfaces onto (in particular pressing on) the component carrier structure. In particular, such a pin, which is clamped between the component carriers, may be the only physical body in direct physical contact with the component carrier structure accommodated in the handling device. Advantageously, the pins provided at one or both of the two clamps may define the position at which the component carrier structure is in direct physical contact with the handling device during use, e.g. clamped between the pins. Preferably, the component carrier structure may be free of any physical contact with the manipulation device at other locations than the pin. This can reliably prevent any damage of the component carrier structure at locations other than the pins during handling and reflow soldering.

In an embodiment, the pin of one of the first and second clamps including the magnet is integrally formed with the magnet. In other words, magnetic pins may be provided. The incorporation of the pin and the magnet by combining them into a common structure allows the manipulator to be compact and simple in construction. Furthermore, this may reduce the spacing between the magnet and the metal plate, so that the provision of the magnetic pin may also enhance the coupling force between the clamps and improve the force affecting the component carrier structure.

In an embodiment, at least part of the magnets are mounted on a grid at the intersections between first bars extending parallel to each other in a first direction and second bars extending parallel to each other in a second direction perpendicular to the first direction. The force transmission between the handling device and the component carrier structure is particularly advantageous when the magnets are mounted at their clamps at the intersections of a grid of said clamps.

In an embodiment, each of the first and second clamps comprises a support structure, each support structure comprising a plurality of rods, and in particular forming a grid. Preferably, a grid may be provided on both clamps, which grid may expose the preform of the component carrier on both opposite main surfaces of the component carrier during reflow soldering.

In an embodiment, only one of the first and second clamps comprises an array of magnets. This allows keeping the other clamp free of magnets-preferably the top clamp-simple and compact and allows reducing the thickness of the other clamp and of the entire handling device.

In an embodiment, only one of the first and second clamps comprises a metal plate. Advantageously, the clamp with magnets (preferably the bottom clamp) may be free of a continuous metal plate, which further contributes to the compact nature of the handling device.

In an embodiment, the first and second clamps are configured for applying a vertical fixing force to the component carrier structure only at a plurality of point connections, wherein in particular these point connections are located between preforms of adjacent component carriers. The point connection may be established by pins of the two clamps, which pins are preferably aligned with each other. Providing multiple point connections rather than large surface area connections may keep the clamping impact on the component carrier structure small.

In an embodiment, the heating unit is configured to heat the handling device of the preform with the component carrier up to at least 200 ℃, in particular at least 250 ℃. When the heating unit of the reflow oven is configured for heating the component carrier structure to above 200 ℃ and preferably above 250 ℃, the reflow oven may support reflow soldering by a multitude of different solder materials, which may be applied to the component carrier structure.

In an embodiment, a surface of each of the component carrier preforms is provided with solder paste prior to reflow soldering. For example, solder paste may be applied to the component carrier structure by printing or dispensing or by a stencil. In particular, the method may comprise surface mounting the component on solder paste of a preform of the component carrier before moving the component carrier structure in a reflow oven for reflow soldering. Such solder pastes may comprise solderable particles in a matrix of a solvent or the like. Such solder paste may be processed in a reflow oven to enable soldering of the component carrier structure, in particular its component carriers, with surface mounted components, such as capacitor components or semiconductor chips.

In an embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure(s) and electrically conductive layer structure(s), which is formed in particular by applying mechanical pressure and/or thermal energy. The mentioned stack may provide a plate-shaped component carrier which is capable of providing a large mounting surface for further components and which is still very thin and compact.

In an embodiment, the component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier still provides a large base for mounting components thereon. Further, in particular, a bare die is an example of an embedded electronic component, and can be easily embedded in a thin plate such as a printed circuit board because of its small thickness.

In an embodiment, the component carrier is configured as one of the group consisting of a printed circuit board, a substrate, in particular an IC substrate, and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-shaped component carrier, which is formed by laminating several electrically conductive layer structures with several electrically insulating layer structures (e.g. by applying pressure and/or by supplying thermal energy). As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg or FR4 material. The various conductive layer structures can be connected to one another in a desired manner by: forming a through-hole through the laminate, for example by laser drilling or mechanical drilling; and filling them partially or completely with conductive material, in particular copper, so as to form vias or any other through-hole connections. Filled vias connect the entire stack (through-hole connections extending through several layers or the entire stack), or filled vias connect at least two conductive layers, called vias. Similarly, optical interconnects may be formed through the layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that may be embedded in a printed circuit board, printed circuit boards are typically configured to accommodate one or more components on one or both opposing surfaces of a board-shaped printed circuit board. These components may be attached to the respective major surfaces by soldering. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers (e.g., glass fibers).

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a relatively small component carrier with respect to the PCB, on which one or more components may be mounted, and these components may serve as a connection medium between the chip(s) and another PCB. For example, the substrate may have substantially the same size as the components (in particular, electronic components) to be mounted thereon (e.g., in the case of Chip Scale Packages (CSPs)). More specifically, a baseplate may be understood as a carrier for electrical connections or electrical networks and a component carrier comparable to a Printed Circuit Board (PCB), but with a rather high density in laterally and/or vertically arranged connections. The lateral connections are, for example, conductive paths, while the vertical connections may be, for example, drilled holes. These lateral and/or vertical connections are arranged within the substrate and may be used to provide electrical, thermal and/or mechanical connection of a packaged or unpackaged component (such as a bare die), in particular an IC chip, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrate". The dielectric part of the substrate may be composed of a resin with reinforcing particles, such as reinforcing spheres, in particular glass spheres.

The substrate or interposer may comprise or consist of: at least one layer of glass; silicon (Si) and/or a photoimageable or dry-etchable organic material such as an epoxy-based build-up material (such as an epoxy-based build-up film) or a polymeric compound (which may or may not contain photosensitive and/or thermosensitive molecules), such as polyimide or polybenzoxazole.

In an embodiment, the at least one electrically insulating layer structure comprises at least one of the group consisting of: resins or polymers such as epoxy resins, cyanate ester resins, benzocyclobutene resins, bismaleimide-triazine resins, polyphenylene ether derivatives (e.g. based on polyphenylene ether, PPE), Polyimides (PI), Polyamides (PA), Liquid Crystal Polymers (LCP), Polytetrafluoroethylene (PTFE) and/or combinations thereof. Reinforcing structures, for example made of glass (multiple layers of glass), such as webs, fibers, spheres or other kinds of filler particles, may also be used to form the composite material. The combination of a semi-cured resin and a reinforcing agent (e.g., fibers impregnated with the above resin) is referred to as a prepreg. These prepregs are generally designated by their properties, for example FR4 or FR5, which are used to describe their flame retardant properties. Although prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based build-up materials (such as build-up films) or photoimageable dielectric materials, may be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and/or cyanate ester resins may be preferred. In addition to these polymers, low temperature co-fired ceramics (LTCC) or other low, ultra-low, or ultra-low DK materials can also be applied as electrically insulating structures in component carriers.

In an embodiment, the at least one conductive layer structure comprises at least one of the group consisting of: copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coated versions thereof are possible, in particular coated with a superconducting material or a conductive polymer, such as graphene or poly (3, 4-ethylenedioxythiophene) (PEDOT), respectively.

The at least one component, which may be surface mounted on the component carrier and/or may be embedded inside it, may be selected from the group consisting of: a non-conductive inlay, a conductive inlay (e.g., a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), a light guide element (e.g., a light guide or light guide connection), an electronic component, or a combination thereof. The inlay may be, for example, a metal block with or without a coating of insulating material (IMS inlay), which may be embedded or surface mounted for facilitating heat dissipation. Suitable materials are defined in terms of their thermal conductivity, which should be at least 2W/mK. Such materials are generally based on, but not limited to, metals, metal oxides and/or ceramics, such as copper, alumina (Al)₂O₃) Or aluminum nitride (AlN). Other geometries with increased surface area are also often used in order to increase the heat exchange capacity. Furthermore, the components may be active electronic components (having implemented at least one p-n junction), passive electronic components (such as resistors, inductors, or capacitors), electronic chips, storage devices (e.g., DRAM or other data storage), filters, integrated circuits (such as Field Programmable Gate Arrays (FPGA), Programmable Array Logic (PAL), General Array Logic (GAL), and Complex Programmable Logic Devices (CPLD)), signal processing components, power management components (such as Field Effect Transistors (FET), Metal Oxide Semiconductor Field Effect Transistors (MOSFET)Complementary Metal Oxide Semiconductor (CMOS), Junction Field Effect Transistor (JFET), or Insulated Gate Field Effect Transistor (IGFET), all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga)₂O₃) Indium gallium arsenide (InGaAs), and/or any other suitable inorganic compound), optoelectronic interface elements, light emitting diodes, opto-couplers, voltage converters (e.g., DC/DC converters or AC/DC converters), cryptographic components, transmitters and/or receivers, electromechanical converters, sensors, actuators, micro-electromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components may be embedded in the component carrier. For example, a magnetic element may be used as the component. Such magnetic elements may be permanent magnetic elements (such as ferromagnetic elements, antiferromagnetic elements, multiferroic elements or ferrimagnetic elements, e.g. ferrite cores) or may be paramagnetic elements. However, the component may also be an IC substrate, an interposer or another component carrier, for example in a board-to-board configuration. The component may be surface mounted on the component carrier and/or may be embedded within it. In addition, other components, in particular those which generate and emit electromagnetic radiation and/or which are sensitive to electromagnetic radiation propagating from the environment, may also be used as components.

In an embodiment, the component carrier is a laminate type component carrier. In such embodiments, the component carrier is a composite of multiple layers stacked and joined together by the application of pressure and/or heat.

After the treatment of the inner layer structure of the component carrier, one or both of the opposite main surfaces of the treated layer structure may be covered (in particular by lamination) symmetrically or asymmetrically with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, lamination may continue until the desired number of layers is achieved.

After the formation of the stack of electrically insulating layer structures and electrically conductive layer structures is completed, the resulting layer structure or component carrier may be subjected to a surface treatment.

In particular, an electrically insulating solder resist may be applied to one or both of the opposite main surfaces of the layer stack or the component carrier. For example, such a solder resist may be formed over the entire major surface and then patterned to expose one or more conductive surface portions that will be used to electrically couple the component carrier to the electronics periphery. The surface portion of the component carrier, in particular the surface portion comprising copper, which remains covered by the solder resist, can be effectively protected from oxidation or corrosion.

In terms of surface treatment, surface finishes may also be selectively applied to the exposed conductive surface portions of the component carrier. Such a surface modification may be an electrically conductive covering material on exposed electrically conductive layer structures (such as pads, electrically conductive tracks, etc., in particular comprising or consisting of copper) on the surface of the component carrier. If such exposed conductive layer structures are not protected, the exposed conductive component carrier material (particularly copper) may oxidize, thereby reducing the reliability of the component carrier. A surface modification may then be formed, for example as an interface between the surface mounted component and the component carrier. The surface modification has the function of protecting the exposed conductive layer structure, in particular the copper circuit, and enables a joining process with one or more components, for example by soldering. Examples of suitable materials for surface modification are Organic Solderability Preservative (OSP), chemical nickel immersion gold (ENIG), chemical nickel immersion palladium gold (ENIPIG), gold (in particular hard gold), chemical tin, nickel-gold, nickel-palladium, etc.

Drawings

The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.

Fig. 1 shows a sectional view of a part of an operating device according to an exemplary embodiment of the present invention.

Fig. 2 shows a side view of a component carrier structure before and after a heat treatment in a handling device according to an exemplary embodiment of the invention.

Fig. 3 shows a side view of the component carrier structure before and after heat treatment in a conventional handling device.

Fig. 4 shows a plan view of a bottom first clamp of a handling device according to an exemplary embodiment of the present invention.

Fig. 5 shows a plan view of a top side second clamp for cooperation with the first clamp according to fig. 4.

Fig. 6 shows a bottom-side first clamp of a handling device according to an exemplary embodiment of the present invention.

Fig. 7 shows a top side second clamp of a handling device comprising a first clamp according to fig. 6.

Fig. 8 shows different manufacturing stages to be performed during a method of manufacturing a component carrier according to an exemplary embodiment of the invention, including a reflow soldering stage.

Fig. 9 shows a detailed view of a rod of a second clamp of the manipulating device according to an exemplary embodiment of the present invention.

The illustration in the drawings is schematically. In different drawings, similar or identical elements are provided with the same reference signs.

Detailed Description

Exemplary embodiments will be described in further detail, before referring to the drawings, which will be summarized based on some basic considerations that the exemplary embodiments of the present invention have been developed.

According to an exemplary embodiment of the first aspect of the present invention, a handling device with two cooperating clamps may be provided for facilitating planarization of a chip part carrier structure during reflow soldering, wherein such handling device may comprise a magnet on one of the clamps and a metal plate on the other clamp. The attractive force between the magnet and the metal plate can then reliably prevent warping, wrinkling and bending of the component carrier structure. During reflow soldering, solder paste, solder bumps or any other solder on the component carrier structure may be melted in order to surface mount the component on a component carrier (such as a printed circuit board or an integrated circuit substrate) of the component carrier structure, in particular a panel comprising a preform of the component carrier which is still integrally connected.

According to an exemplary embodiment of the second aspect of the invention, a handling device for handling a component carrier structure during reflow soldering is provided, the handling device comprising a pair of opposing clamps, one clamp being arranged above the component carrier structure to be handled and the other clamp being arranged below the component carrier structure to be handled. At least one of the bottom clamp and the top clamp (and preferably both) may comprise, for example, a grid-shaped support structure for applying a supporting force to the component carrier structure. At the same time, the recess in the support structure may keep at least part of the preform of the component carrier exposed, which may facilitate heat transfer back during flow welding and may inhibit the risk of damaging the preform of the component carrier due to excessive contact with the handling device.

Preferably, a grid of first bars extending in a first direction and second bars extending in another (preferably perpendicular) direction may be provided at one or both of the two clamps. The arrangement of the bars may be configured according to the panel dimensions so that each opening of the grid may correspond to one printed circuit board or card or unit of the panel-type component carrier structure, for example. Thus, not only the individual component carrier but also the entire panel can be suitably supported by the grid. In particular when combining such a grid with an array of magnets on only one of the clamps, cooperating in an attractive manner with a metal plate on the other clamp, a simple and compact handling device can be provided, wherein in particular the thickness of the clamp with the metal plate (preferably the top clamp) can be made very small. By avoiding magnets on the top clamp (which are preferably very thin), appropriate stability can be achieved. Furthermore, the described configuration may ensure that no significant temperature gradients are generated across the panel. Preferably, the metal plate of the top clamp may be made of iron or an aluminum alloy, i.e. a material that can be magnetically attracted by the magnet of the other clamp. The magnets may be made of permanent magnetic material. During reflow soldering of the component carrier structure handled by the handling device, a temperature in the range of, for example, 200 ℃ to 290 ℃ may be applied. Preferably, the permanent magnetic material of the magnet is configured such that the attractive magnetic force of the magnet is maintained even at elevated temperatures. Therefore, a sufficiently high curie temperature magnetic material should be used. Due to the configuration of the handling device described above, the temperature profile of the component carrier structure during reflow soldering can be improved, in particular balanced.

Advantageously, each of the clamps may be provided with one or preferably more restraining pins which may clamp between the component carrier structures during use. Such pins may be positioned between surface regions of the component carrier structure where components, such as semiconductor dies, are to be mounted by soldering. Correspondingly, the region of the solder bump or the like may also be located separately from the region of the clamp in which the pin engages. This may ensure proper stability and protect the component carrier structure from damage. Preferably, the rods and pins of the support structure may be arranged at the division line of the component carrier structure, i.e. the area where the component carrier structure will subsequently be divided into individual component carriers. For example, the width of the bars may thus be in the range of 0.3mm to 0.5mm, i.e. the width of the grid lines may be very small.

When the support structure is configured as a grid comprising bars extending in a first direction and additional bars extending perpendicular thereto, the manipulator may be made particularly suitable for high temperature applications, as such a grid design may contribute to uniform heat supply, heat removal, heat balancing and heat spreading. In other words, a suitable heat conducting grid with a matrix-like array of recesses between the rods constituting the grid may contribute to the temperature balance over the entire component carrier structure.

For high performance component carrier applications, particularly with respect to printed circuit boards and integrated circuit substrates, it is desirable to comply with stringent specifications in terms of ground coplanarity (i.e., the level of warpage obtained). Meeting such demanding requirements often involves a substantial risk of reducing throughput.

To overcome such disadvantages, exemplary embodiments provide a manipulation device for manipulating a component carrier structure, such as a panel, which provides full mechanical support for the processed component carrier structure based on two cooperating clamps. In particular, such a handling device is capable of pressing or clamping each substrate unit of the component carrier structure in place during high temperature processing to obtain excellent results in terms of ground coplanarity. At the same time, the yield obtained can be significantly increased when producing the component carrier. In particular, exemplary embodiments of the present invention may improve efficiency and may keep manufacturing time short. Ground coplanarity can be achieved with very low effort. Accordingly, exemplary embodiments of the present invention provide a magnetic clamp pair for improving ground coplanarity of manufactured component carriers.

For example, one of the clamps may be equipped with a plurality of magnets, for example 80 pieces of magnet with a thickness of 2 mm. The magnets may be embedded in a bottom jig, for example 5mm thick, to hold the component carrier structure comprising a plurality of substrate units together with the top jig.

Furthermore, one or both of the clamps may be configured with a frame and bag design to ensure that the preforms of the component carriers of the component carrier structure are manufactured without shape bending during high temperature processing. In particular, providing a magnet embedded in the bottom clamp may support a uniform pressure exerted on the substrate unit from the top clamp. By the pocket design, each substrate unit can be supported by the bottom fixture. For example, a magnetic clamp with a pocket design may exert a force of about 20N on the substrate-type component carrier structure.

The handling device according to an exemplary embodiment of the present invention may ensure that all substrate units of the component carrier structure may be retained in shape without risk of bending or warping during high temperature processing, in particular during reflow soldering. Highly advantageously, ground coplanarity (i.e. the deviation of the ground or pad on the main surface of the stack from a horizontal orientation) can be significantly improved.

Fig. 1 shows a sectional view of a part of a manipulation device 100 according to an exemplary embodiment of the present invention.

A handling device 100, only partially shown in fig. 1, is used for handling a component carrier structure 102, such as a panel having dimensions of 12 x 18 square inches or more, of a preform, such as a Printed Circuit Board (PCB) or an Integrated Circuit (IC) substrate, comprising a plurality of component carriers 104, at an elevated temperature, for example at least 200 ℃, during a manufacturing process. The handling device 100 containing the component carrier configuration 102 may preferably be processed in a reflow oven (see reference numeral 106 in fig. 8).

In the illustrated embodiment, the handler 100 includes a first clamp 108 and a second clamp 110 that may be assembled to one another. The

clamps

108, 110 are configured for receiving the component carrier structure 102 between them. The first clamp 108 may be a bottom side clamp that supports the component carrier structure 102 from below. In contrast, the second clamp 110 may be a topside clamp arranged above the component carrier structure 102.

Advantageously, an array of magnets 112 forming part of the first clamp 108 may be provided for applying an attractive magnetic force to the second clamp 110. To make this possible, the second clamp 110 comprises a metal plate 114 (for example made of iron) that can be attracted by the magnet 112 of the first clamp 108. In the embodiment shown, the second clamp 110 does not have an embedded magnet. Thus, the magnets 112 may be configured to create an attractive force with the metal plate 114 to hold the

clamps

108, 110 with the component carrier structure 102 clamped in between. This configuration allows keeping the component carrier structure 102 flat during reflow soldering by suppressing any tendency to deform. In particular, any undesirable tendency to warp may be effectively suppressed, and excellent performance in terms of ground coplanarity may be obtained by the component carrier 104 being easily manufactured.

Fig. 1 shows a side view of the handling device 100 and in particular the position of the bottom first clamp 108 and the position of the top second clamp 110. The thickness D of the component carrier structure 102 to be handled by the handling device 100 may be, for example, about 0.6 mm. The component carrier structure 102 is held between constraining pins 124 formed at corresponding positions of both the bottom side first clamp 108 and the top side second clamp 110 such that respective portions of the component carrier structure 102 are engaged (e.g., clamped) between two opposing constraining pins 124 of the first clamp 108 and the second clamp 110, respectively.

Advantageously, the array of pins 124 of the first clamp 108 and the array of pins 124 of the second clamp 110 are spatially aligned with each other. This keeps the contact of the surface portions of the component carrier structure 102 with the

clamps

108, 110 small and ensures that the force transmission from the handling device 100 to the component carrier structure 102 does not lead to a deformation of the component carrier structure.

Thus, the arrangement of the aligned constraining pins 124 of the

clamps

108, 110 may ensure proper manipulation of the component carrier structure 102 at well-defined locations, while avoiding physical contact at other locations of the component carrier structure 102. This protects the portions of the component carrier structure 102 where the component carrier 104 is subsequently formed (i.e. after the manufacturing process is completed and after separation) from damage. In addition to the direct physical pin contact that holds the component carrier structure 102 in place and is applied by the mating restraining pin 124, the attractive magnetic force between the lower magnet 112 and the upper metal plate 114 may create a coupling force between the

clamps

108, 110. The fact that the pin 124 of the first clamp 108 is integrally formed with the magnet 112 further reduces the vertical distance between the magnet 112 and the metal plate 114, thereby also contributing to the high connection force.

As may be taken from fig. 1, the first clamp 108 and the second clamp 110 are configured for applying a vertical fixing force to the component carrier structure 102 only at a plurality of point connections. Advantageously, the point connections may be located between preforms of adjacent component carriers 104 (e.g. in the region of a separation line separating the panel into individual component carriers 104). By taking this measure it can be ensured that the component carrier 104 is not damaged by the clamping force exerted between the

clamps

108, 110 on the component carrier structure 102. Preferably, the point connections are established by alignment pins 124 on two opposite sides of the component carrier structure 102. Further advantageously, the pins 124 of the first clamp 108 are configured as magnetic pins, i.e. pins formed by the magnets 112.

A support grid 120 (not shown in fig. 1, but shown in fig. 4-7) formed by an array of posts 118 may further increase stability and may facilitate heat spreading and distribution during reflow soldering. Such a lattice structure may also be provided in the handling device 100 according to fig. 1.

Fig. 2 shows a side view of the component carrier arrangement 102 before and after a heat treatment in the handling device 100 according to an exemplary embodiment of the invention. Fig. 3 shows a side view of the component carrier structure 202 before and after heat treatment in a conventional handling device.

Referring first to the conventional method according to fig. 3, the processed component carrier structure 202 may be significantly deformed during the heat treatment. In particular, the center of the component carrier structure 202 may be susceptible to excessive bending, as schematically indicated by arrow 204. This may be due to the design of the manipulator clamp without any support in the centre of the panel. Therefore, the shape of the substrate cannot be appropriately controlled according to fig. 3, which may cause significant defects. In particular, thermal loads acting on the component carrier structure 202 during reflow soldering may often result in significant warpage of the component carrier structure 202.

To overcome such a drawback, a manipulation device 100 schematically illustrated in fig. 2 is provided according to an exemplary embodiment of the present invention. Due to the illustrated bag design, the component carrier structure 102 may remain substantially planar. Due to the precise holding of the group carrier structure 102 during reflow soldering, the handling device 100 ensures a substantially flat configuration of the properly supported component carrier structure 102, so that any tendency of warping, wrinkling or bending of the component carrier structure 102 can be strongly suppressed.

Fig. 4 shows a plan view of the bottom first clamp 108 of the handling device 100 according to an exemplary embodiment of the present invention. Fig. 5 shows a plan view of a top second gripper 110 of the handling device 100 with the first gripper 108 according to fig. 4.

As mentioned above, the handling device 100 is used for handling a component carrier structure 102 of a preform comprising a plurality of component carriers 104 in a reflow oven 106 during the manufacture of the component carrier 104. The handling device 100 comprises a first clamp 108 and a second clamp 110 configured for receiving the component carrier structure 102 therebetween.

Furthermore, a support structure 116 is provided at both the first clamp 108 and the second clamp 110. Each support structure 116 comprises a plurality of rods 118 which are arranged between the preforms of the different component carriers 104 (when the assigned component carrier structure 102 is assembled to the handling device 100) and which support the component carrier structure 102. Preferably, the support structure 116 may be made of a thermally conductive material to improve thermal management during reflow soldering. For example, the material of the support structure 116 of each of the

clamps

108, 110 may have a thermal conductivity of at least 10W/mK, preferably at least 50W/mK.

As described above, the first jig 108 is equipped with the plurality of magnets 112 for generating a magnetic force that attracts the metal plate 114 of the second jig 110. The magnet 112 and the metal plate 114 generate an attractive force to planarize the component carrier structure 102 therebetween. In the illustrated embodiment, the magnet 112 is coupled to a support structure 116 of the first clamp 108. Preferably, the magnet 112 is made of a permanent magnetic material. Advantageously, the magnet 112 is made of a material having a curie temperature of at least 250 ℃, such that the magnet 112 continues to generate an attractive magnetic force even at high temperatures, i.e., at the operating temperature of the reflow oven 106. The magnet 112 and the metal plate 114 may be configured such that the magnetic force applied to the component carrier structure 102 by the attractive force generated by the magnet 112 and the metal plate 114 is, for example, about 20N.

As shown in fig. 4 and 5, the rods 118 include first rods 118a extending parallel to each other along a first direction and include second rods 118b extending parallel to each other along a second direction perpendicular to the first direction, such that the

rods

118a, 118b form a grid 120 with recesses 122. Each recess 122 in the grid 120 may correspond to one component carrier 104 of the component carrier structure 102.

It is very advantageous that each of the first clamp 108 of fig. 4 and the second clamp 110 of fig. 5 comprises a pin 124, as shown in fig. 1, which applies a connecting force to the component carrier structure 102 from two opposite main surfaces. The pin 124 may be the only physical body of the handling device 100 that is in direct physical contact with the component carrier structure 102 housed in the handling device 100. This prevents the preforms of the component carrier 104 from being damaged during handling.

Additional holes may be opened in the first clamp 108, as indicated by reference numeral 150 in fig. 4, to further improve the backflow curve and handling. As indicated by reference numeral 112', edge magnets may be provided at corresponding locations of the first clamp 108 in close proximity to the component carrier structure 102. As indicated by reference numeral 154, the size of the manual actuation aperture may be increased (e.g., by forming one or more rectangular apertures) by the illustrated configuration of the bottom-side first clamp 108.

Referring now to fig. 5, the top cover or second clamp 110 may allow for widening of the aperture (see reference numeral 156) to further improve the temperature profile and handling of the component carrier structure 102. As indicated by reference numeral 158, additional holes (e.g. 5 x 5mm) may be opened during reflow soldering to optimize the temperature profile of the component carrier structure 102.

Fig. 6 shows a bottom-side first clamp 108 of the handling device 100 according to an exemplary embodiment of the present invention. Fig. 7 shows a top second clamp 110 of the handling device 100 comprising the first clamp 108 according to fig. 6.

As shown in fig. 6, each recess 122 of the first clamp 108 is shown corresponding to one component carrier 104 (e.g. a printed circuit board or an integrated circuit substrate) of the component carrier arrangement 102 being manipulated by the corresponding manipulation device 100. During component reflow, the illustrated frame-shaped first clamp 108 may apply a connection force of, for example, 20N to the component carrier structure 102 or the substrate. This is a sufficiently large value for ensuring the planarization of the component carrier structure 102 and a sufficiently small value for avoiding excessive mechanical impact on the component carrier structure 102 to reliably prevent damage.

Fig. 8 shows different manufacturing stages during a production line process for manufacturing a component carrier 104 according to an exemplary embodiment of the invention, including a reflow soldering stage.

As indicated by reference numeral 170, the panel-type component carrier structure may first be subjected to solder paste printing, during which solder paste may be printed onto desired surface portions of the component carrier structure.

As can be further seen from fig. 8, the component carrier structure may then be moved in the line conveyor direction 172. Next, the component carrier structure may be processed by a chip capacitor attaching unit that attaches a chip capacitor on the solder paste of each component carrier of the component carrier structure. This is indicated by reference numeral 174.

As can also be seen from fig. 9, the component carrier structure with applied solder paste and with the components (in the described embodiment chip capacitors) attached thereto can then be transported into a reflow oven 106, through which the component carrier structure held by the handling device according to an exemplary embodiment of the invention can then be transported. The reflow oven 106 is used for processing the component carrier structure and comprises a handling device and a heating unit 126 configured for heating the handling device holding the component carrier structure. By means of the heating unit 126, the handling device 100 with the component carrier structure 102 can be heated to preferably at least 250 ℃ for effective reflow soldering.

At the inlet side of the reflow oven 106, the component carrier structure may be assembled in a handling device, see reference numeral 176.

As shown in reference numeral 178, the component carrier arrangement in the handler can be unloaded from the handler after reflow soldering, i.e., at the exit side of the reflow oven 106.

The combination of the magnetic attraction mechanism between the

clamps

108, 110 and the above-described grid-type support structure 116 may be advantageously implemented during a high temperature reflow oven process. Due to this implementation, the ground coplanarity of the obtained component carrier can be significantly improved and the yield can be significantly increased.

Fig. 9 is a detailed view of the rod 118 of the second clamp 110 of the manipulating device 100 according to an exemplary embodiment of the present invention.

As shown, the rods 118 include first rods 118a extending parallel to one another along a first direction and include second rods 118b extending parallel to one another along a second direction perpendicular to the first direction, such that the

rods

118a, 118b form a grid 120 with recesses 122.

With respect to vertical rods 118b, each of the vertical rods may include a central rod portion 160 disposed between two peripheral rod portions 162. Advantageously, the central rod portion 160 may have a greater thickness than each of the two peripheral rod portions 162. For example, the central rod portion 160 may have a thickness of 5mm and a width L of 0.5 mm. Each of the peripheral bar portions 162 may have a thickness of 3mm and a width B of 0.25 mm. Other dimensions are also possible.

Referring to the horizontal rods 118a, each of them may accordingly comprise a central rod portion 164 arranged between two peripheral rod portions 166. Advantageously, the central rod portion 164 may have a greater thickness than the two peripheral rod portions 166. For example, the central rod portion 164 may have a thickness of 5mm and a width of 0.5 mm. Each of the peripheral rod portions 166 may have a thickness of 3mm and a width of 0.25 mm. Other dimensions are also possible.

Advantageously, the configuration of fig. 9 may result in a high rigidity of the second clamp 110.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined.

It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.

The implementation of the invention is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, many variations on the illustrated solution and the principles according to the invention are possible, even in the case of fundamentally different embodiments.

Claims

1. A handling device (100) for handling a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during temperature processing, wherein the handling device (100) comprises:

a first clamp (108) and a second clamp (110) configured for receiving the component carrier structure (102) therebetween;

an array of magnets (112) forming part of one of the first and second clamps (108, 110);

and a plate (114), the plate (114) forming part of the other of the first clamp (108) and the second clamp (110);

wherein the magnet (112) is configured for generating an attractive force with the plate (114) for inhibiting a deformation of the component carrier structure (102) located between the magnet and the plate.

2. The handling device (100) according to claim 1, comprising a support structure (116) forming part of at least one of the first clamp (108) and the second clamp (110), and comprising a plurality of rods (118) for being arranged between preforms of different component carriers (104) and supporting the component carrier structure (102).

3. A handling device (100) for handling a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during temperature processing, wherein the handling device (100) comprises:

and a support structure (116) forming part of at least one of the first clamp (108) and the second clamp (110), and comprising a plurality of rods (118) for being arranged between preforms of different component carriers (104) and supporting the component carrier structure (102).

4. The handling device (100) according to claim 3, comprising an array of magnets (112) forming part of one of the first clamp (108) and the second clamp (110), and comprising a plate (114), the plate (114) forming part of the other of the first clamp (108) and the second clamp (110); wherein the magnet (112) is configured for generating an attractive force with the plate (114) for inhibiting deformation of the component carrier structure (102) located between the magnet and the plate.

5. The handling device (100) according to any of claims 1 or 2 or 4, wherein said plate (114) is made of: the material facilitates thermal distribution and/or thermal reorientation of the component carrier structure (102).

6. The handling device (100) according to any of claims 1 or 2 or 4 or 5, wherein said plate (114) is a metal plate (114).

7. The handling device (100) according to any of claims 1 or 2 or 4 to 6, wherein said magnet (112) is connected to said support structure (116).

8. The handling device (100) according to any of claims 1 or 2 or 4 to 7, wherein the magnet (112) forms part of the first clamp (108) configured as a bottom side clamp, and wherein the plate (114) forms part of the second clamp (110) configured as a top side clamp.

9. The handling device (100) according to any of claims 1 or 2 or 4 to 8, wherein the magnet (112) is made of a material having a Curie temperature of at least 200 ℃, in particular at least 250 ℃.

10. The handling device (100) according to any one of claims 1 or 2 or 4 to 9, wherein an attraction force generated by the magnet (112) and the plate (114) and applied to the component carrier structure (102) is at least 10N, in particular at least 20N.

11. The steering device (100) of any of claims 1 or 2 or 4 to 10, wherein the magnet (112) comprises a permanent magnetic material.

12. The handling device (100) according to any of claims 2 to 11, wherein the support structure (116) is made of a thermally conductive material, in particular having a thermal conductivity of at least 10W/mK, more in particular at least 50W/mK, preferably at least 100W/mK.

13. The handling device (100) according to any of claims 2 to 12, wherein said bars (118) extend parallel to each other.

14. The handling device (100) according to any of claims 2 to 12, wherein the rods (118) comprise first rods (118a) extending parallel to each other along a first direction and the rods (118) comprise second rods (118b) extending parallel to each other along a second direction perpendicular to the first direction, such that the rods (118) form a grid (120) with recesses (122).

15. The steering device (100) according to claim 14, wherein at least one of said first rod (118a) and said second rod (118b) has a first portion arranged between two peripheral rod portions (162;

166) between the central rod portion (160; 164) wherein the central rod portion (160;

164) has a greater length than the two peripheral bar portions (162; 166) a large thickness of each of them.

16. The handling device (100) according to claim 14 or 15, wherein each recess (122) in the grid (120) corresponds to a component carrier (104).

17. The handling device (100) according to any one of claims 1 to 16, wherein each of the first clamp (108) and the second clamp (110) comprises a pin (124) which presses on the component carrier structure (102) from two opposite main surfaces, in particular the pin being the only physical body in direct physical contact with the component carrier structure (102) when the component carrier structure (102) is received in the handling device (100).

18. The steering device (100) of claim 17, wherein the pin (124) of the one of the first clamp (108) and the second clamp (110) that includes the magnet (112) is integrally formed with the magnet (112).

19. The handling device (100) according to any one of claims 1 to 18, wherein each of said first clamp (108) and said second clamp (110) comprises a support structure (116) comprising a plurality of bars (118), and in particular forming a grid (120).

20. The steering device (100) of any of claims 1-19, wherein only one of said first clamp (108) and said second clamp (110) comprises an array of magnets (112).

21. The manipulation device (100) of any one of claims 1-20, wherein only one of the first clamp (108) and the second clamp (110) comprises a plate (114).

22. The manipulation device (100) of any one of claims 1, 2 or 4 to 21, wherein at least a portion of the magnet (112) is mounted on a grid (120) at an intersection between a first bar (118a) extending parallel to one another in a first direction and a second bar (118b) extending parallel to one another in a second direction perpendicular to the first direction.

23. The handling device (100) according to any one of claims 1 to 22, wherein the first clamp (108) and the second clamp (110) are configured for applying a vertical fixing force to the component carrier structure (102) only at a plurality of point connections, wherein in particular the point connections are located between preforms of adjacent component carriers (104).

24. The handling device (100) according to any of claims 1 to 23, wherein an array of magnets (112) is formed as part of only one of the first clamp (108) or the second clamp (110), or an array of magnets (112) is formed as part of each of the first clamp (108) and the second clamp (110).

25. An arrangement, comprising:

the handling device (100) according to any of claims 1 to 24; and

a component carrier structure (102), the component carrier structure (102) comprising a preform of a plurality of component carriers (104) accommodated between the first clamp (108) and the second clamp (110).

26. The arrangement of claim 25, wherein the component carrier structure (102) comprises an integral plate structure comprising a preform of the connected component carrier (104).

27. Reflow oven (106) for a component carrier structure (102), the component carrier structure (102) comprising a plurality of preforms of component carriers (104), wherein the reflow oven (106) comprises:

handling device (100) according to any of claims 1 to 24 for handling the component carrier structure (102) during reflow soldering; and

a heating unit (126) configured for heating the component carrier structure (102) in the handling device (100) for reflow soldering.

28. Reflow oven (106) according to claim 27, wherein the heating unit (126) is configured for heating the component carrier structure (102) in the handling device (100) up to at least 200 ℃, in particular up to at least 250 ℃.

29. A method of manipulating a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during temperature processing, wherein the method comprises:

accommodating the component carrier structure (102) between a first clamp (108) and a second clamp (110) of a handling device (100), in particular a handling device (100) according to any one of claims 1 to 23;

generating an attractive force between an array of magnets (112) forming part of one of the first and second clamps (108, 110) and a plate (114) forming part of the other of the first and second clamps (108, 110); and

heating the component carrier arrangement (102) in the handling device (100), for example for reflow soldering.

30. A method of manipulating a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during temperature processing, wherein the method comprises:

accommodating the component carrier structure (102) between a first clamp (108) and a second clamp (110) of a handling device (100), in particular a handling device (100) according to any one of claims 1 to 24;

supporting the component carrier structure (102) by a support structure (116) of at least one of the first clamp (108) and the second clamp (110), the support structure comprising a plurality of rods (118) arranged between preforms of different component carriers (104); and

31. The method of claim 29 or 30, wherein the method comprises temperature treatment in a reflow oven (106).

32. The method of claim 30 or 31, wherein the method comprises: providing solder paste to a surface of each of the preforms of the component carriers (104) prior to reflow soldering.

33. The method of any one of claims 30 to 32, wherein the method comprises: prior to reflow soldering, the component is surface mounted on the solder paste.