CN114406448A - Femtosecond laser repair method for crack damage of large-size optical element - Google Patents
Femtosecond laser repair method for crack damage of large-size optical element Download PDFInfo
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- CN114406448A CN114406448A CN202210026039.5A CN202210026039A CN114406448A CN 114406448 A CN114406448 A CN 114406448A CN 202210026039 A CN202210026039 A CN 202210026039A CN 114406448 A CN114406448 A CN 114406448A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The invention discloses a femtosecond laser repair method for crack damage of a large-size optical element, belonging to the technical field of laser application. The invention shapes the Gaussian laser into a Bessel beam with time delay; placing a damaged area of quartz in the mask plate, wherein the area is an area to be removed; processing a micropore array with depth in a region to be removed by a Bessel beam at a single point; and (3) placing the quartz after laser modification in hydrofluoric acid, removing the modified cubic structure, and removing the crack area at the moment to realize femtosecond laser repair of crack damage of the large-size optical element. The invention utilizes the birefringent crystal to generate double pulses for the Gaussian laser, thereby enhancing the energy deposition efficiency of the laser in the material. And a high-length-diameter ratio Bessel beam is generated by using the cone lens and the 4f system, so that the modification length of the laser is enhanced. And the time-of-flight scanning is utilized to assist the mask plate in processing so as to realize the high-efficiency, large-area and high-consistency micropore array processing in the crack area.
Description
Technical Field
The invention relates to a femtosecond laser repair method for crack damage of a large-size optical element, belonging to the technical field of laser application.
Background
Fused silica is widely used in high power solid laser devices as optical elements such as lenses and windows. The high-power laser system must furthest promote laser flux under the prerequisite of steady operation, and high-power laser system energy often approaches optical element threshold value, and absorptive impurity, surface defect, impurity etc. can produce the damage under the laser irradiation condition in the optical element body. Laser-induced damage not only results in laser energy dissipation but also, if cracks are not processed in time, the damaged cracks grow in a geometric progression, damage the structure of the element, affect the performance of the element, and further result in the performance degradation of the optical system. Because large-caliber fused quartz has a long processing period and is expensive, and the time cost and the price cost are high when the fused quartz is frequently replaced, the damaged part on the optical element needs to be repaired.
Due to the hard and brittle characteristics of the fused quartz, when the fused quartz is acted on by a contact type machining method, edge breakage and microcracks can be generated, and the strength and the optical performance of the optical element are seriously influenced, so that the damaged area cannot be removed by the contact type machining method. The most common method for repairing fused silica optical components is CO2A laser repairing method. Despite CO2The laser melting repair of the surface damage point of the fused quartz can effectively improve the damage threshold, but the damage threshold is improved due to CO2The laser has strong thermal effect, and when the fused silica is irradiated, serious thermal stress and residual stress are generated, so that the performance of an optical element is influenced. Because the femtosecond laser has shorter pulse width, the time of photon absorption of electrons in the material is far shorter than the time of lattice relaxation, and the material can be regarded as non-thermal processing when single-point processing is adopted, thereby effectively avoiding the occurrence of thermal effect. In addition, the currently common femtosecond laser repair method can only be used for repairing cracks with the depth of less than 200 μm, but cannot be used for repairing the damage of the fused quartz cracks with larger size and deeper depth.
Disclosure of Invention
In order to solve the problem of crack damage with the depth of more than 500 mu m on an optical element, the invention mainly aims to provide a femtosecond laser repair method for the crack damage of a large-size optical element, wherein a double-pulse with a certain time delay is generated by Gaussian laser by utilizing a birefringent crystal, so that the energy deposition efficiency of the laser in a material is enhanced. And a high-length-diameter ratio Bessel beam is generated by using the cone lens and the 4f system, so that the modification length of the laser is enhanced. The time-of-flight scanning is utilized to assist the mask plate in processing, so that the high-efficiency, large-area and high-consistency micropore array processing is realized in a crack area, and the large-area and high-depth modification in the material is realized. And removing the modified crack region by using hydrofluoric acid assisted etching to repair the optical element.
The purpose of the invention is realized by the following technical scheme:
the invention discloses a femtosecond laser repair method for crack damage of a large-size optical element, which comprises the following steps:
the method comprises the following steps: adjusting the light field to ensure that the energy of the light field is in Gaussian intensity distribution;
step two: enabling Gaussian laser to vertically enter the birefringent crystal, ensuring that the polarization direction of the laser and the fast axis direction of the birefringent crystal form 45 degrees, and shaping the Gaussian laser into two double-pulse sequences with preset time delay;
step three: the laser energy is adjusted through the attenuation sheet, and the optical element is prevented from being damaged after the conical lens is placed;
step four: placing a conical lens to ensure that the laser entering the conical lens vertically enters from the center of the conical lens, and shaping the double-pulse Gaussian laser into a large-scale double-pulse Bessel beam;
step five: placing a 4f system consisting of a plano-convex lens and an objective lens, and performing beam contraction on the large-scale double-pulse Bessel beam to generate a miniature double-pulse Bessel beam;
step six: placing a mask plate at a damaged area of the fused quartz to be removed;
step seven: under the condition that the upper surface of the fused quartz is ensured to be provided with holes by adjusting the translation table, adjusting the length of the Bessel region in the fused quartz, determining a pulse interval (the pulse interval is the scanning speed/the laser repetition frequency) by setting the scanning speed of the translation table and the laser repetition frequency, and processing the mask plate by using a flight time scanning mode to obtain a modified cubic structure;
step eight: and placing the sample after laser modification in hydrofluoric acid, removing the modified cubic structure, and removing the crack area at the moment to realize femtosecond laser repair of crack damage of the large-size optical element.
The invention discloses a femtosecond laser repair device for crack damage of a large-size optical element, which is used for realizing the femtosecond laser repair method for crack damage of the large-size optical element. Laser generated by the femtosecond laser system sequentially passes through the attenuation sheet, the birefringent crystal, the conical lens and the plano-convex lens to the dichroic mirror and is reflected by the dichroic mirror, and then passes through the objective lens to reach a fused quartz sample; the mask is arranged in a crack damage area of the fused quartz sample; placing a fused quartz sample on the surface of a six-degree-of-freedom translation table; the light source illuminates the fused quartz sample, and an image is collected by the CCD; the mechanical switch controls the on-off of the laser; the computer control system coordinates and controls the laser, the translation stage and the mechanical switch. And placing the sample after laser modification in hydrofluoric acid, removing the modified cubic structure, and removing the crack area at the moment to realize femtosecond laser repair of crack damage of the large-size optical element.
Has the advantages that:
1. according to the femtosecond laser repair method for crack damage of the large-size optical element, high-depth and high-continuity modification of the interior of fused quartz can be realized by shaping the Gaussian laser into the Bessel beam with the high length-diameter ratio, the single-pulse modification depth can reach more than 500 mu m, the problems of weak modification degree and shallow modification depth of the traditional objective lens and plano-convex lens in the fused quartz can be avoided, and the high-efficiency and large-size damage area can be removed conveniently.
2. The femtosecond laser repair method for the crack damage of the large-size optical element disclosed by the invention utilizes the femtosecond laser single-point processing micropore array to repair the crack damage of the fused quartz, so that the heat effect can be effectively avoided, and the generation of thermal stress and residual stress can be avoided. In addition, by adopting the mode of processing the micropore array, the etching can be diffused from the modified point to the periphery, the damaged area can be quickly removed, the etching time is effectively shortened, and the problems of damage to the sample caused by overlong etching time and irregular etching appearance possibly caused are solved.
3. According to the femtosecond laser repair method for crack damage of the large-size optical element, the double-pulse sequence is generated by using the birefringent crystal, so that the steps of adjusting space coincidence and pulse delay of a complex Michelson optical path can be avoided, the generation of the double-pulse sequence is greatly simplified, and the energy deposition efficiency in fused quartz is enhanced.
4. The femtosecond laser repair method for the crack damage of the large-size optical element disclosed by the invention adopts a flight time scanning mode, can avoid point-by-point processing of the micropore array and layer-by-layer scanning along the depth direction, and greatly improves the processing efficiency.
Drawings
Fig. 1 is a schematic optical path diagram of a femtosecond laser repair method for crack damage of a large-size optical element according to the present invention.
Fig. 2 is a schematic diagram of the principle of the femtosecond laser repairing method for crack damage of a large-size optical element according to the present invention. FIG. 2(a) is a schematic diagram of a method for processing a periodic array of micro-holes on a fused silica surface with the aid of a reticle using a double-pulse Bessel beam; FIG. 2(b) shows the fused silica etched by HF, starting from the modified region and proceeding to the surrounding etching; fig. 2(c) shows the profile after HF solution etching, with the modified regions completely removed and the corresponding damaged regions removed.
Fig. 3 is a schematic diagram of a scanning method according to the present invention.
The system comprises a 1-femtosecond laser system, a 2-attenuation sheet, a 3-mechanical switch, a 4-birefringent crystal, a 5-conical lens, a 6-plano-convex lens, a 7-CCD, an 8-dichroic mirror, a 9-objective lens, a 10-mask plate, an 11-fused quartz sample, a 12-six-degree-of-freedom translation stage, a 13-light source and a 14-computer control system.
Detailed Description
The invention is further described with reference to the following figures and examples.
Example 1
The device for realizing the method is characterized in that: the method comprises the following steps: the device comprises a femtosecond laser system 1, an attenuation sheet 2, a mechanical switch 3, a birefringent crystal 4, a conical lens 5, a plano-convex lens 6, a CCD7, a dichroic mirror 8, an objective lens 9, a mask plate 10, a fused quartz sample 11, a six-degree-of-freedom translation stage 12, a light source 13 and a computer control system 14. Laser generated by the femtosecond laser system 1 sequentially passes through the attenuation sheet 2, the birefringent crystal 4, the conical lens 5 and the plano-convex lens 6 to the dichroic mirror 8, is reflected and then passes through the objective lens 9 to reach a fused quartz sample 11; the mask 10 is arranged in a crack damage area of a fused quartz sample 11; the fused quartz sample 11 is arranged on the surface of a six-degree-of-freedom translation stage 12; the light source 13 illuminates the fused silica sample 11 as an image captured by the CCD 7; the mechanical switch 3 controls the on-off of the laser; the computer control system 14 coordinates and controls the femtosecond laser system 1, the translation stage 12 and the mechanical switch 3 through software.
The example used four-sided polished fused silica as the processing material, with dimensions of 50mm by 6mm by 4mm and the removed material dimensions of 2mm by 0.5 mm. The example includes the following steps:
(1) the optical path system adopted by the invention is shown in figure 1. The laser at the laser light outlet of the femtosecond laser system 1 is Gaussian laser with the pulse width of 50fs and the wavelength of 800nm, and the repetition frequency is adjustable between 1 Hz and 1000 Hz. The light path is adjusted firstly, so that the light field which is transmitted to the conical lens through the optical element is ensured to be in standard Gaussian distribution, otherwise, the radial energy uniformity of the Bessel light beam is influenced.
(2) Calcite with the thickness of 25.60mm is selected as the birefringent crystal 4, the birefringent crystal 4 is placed on a light path, the polarization direction of laser and the fast axis direction of the birefringent crystal form 45 degrees, the delay of two sub-pulses is 15.42ps, and the pulse delay can realize strong energy deposition on the fused quartz.
(3) The diameter of the diaphragm is adjusted to 6mm, and the laser energy is adjusted to 30mw by rotating the continuous attenuation sheet 2.
(4) The 2-degree conical lens 5 is installed, so that the laser is enabled to be vertically incident to the center of the conical lens, the generated Bessel area is longer, the energy density is lower, and effective processing of fused quartz cannot be realized.
(5) A 150mm plano-convex lens 6 and a 20X objective lens 9(NA ═ 0.45) were placed, and the distance between the plano-convex lens 6 and the objective lens 9 was secured to 159mm, and the light field was condensed by a 4f system to generate a miniature bessel beam.
(6) A 2mm x 2mm square copper mask 10 was placed on the fused silica 11 in the area to be removed. Because the moving process of the translation table 12 is acceleration-uniform speed-deceleration and the laser is kept normally open, the phenomenon of excessive accumulation of pulses can occur at two sides of a scanning rectangular area, and the mask plate 10 can be used for realizing effective control of a processing area. The scanning area is larger than the area of the mask plate, so that the action of the acceleration and deceleration process of the translation table on a fused quartz crack area can be avoided, and the uniform modification of the crack area is ensured.
(7) The schematic diagram of the periodic micropore array processed by the double-pulse Bessel is shown in FIG. 2(a), and the relative position of the Bessel region and the material is adjusted, so that the Bessel modified region in the fused silica is ensured to be 500 μm. The scanning mode is as shown in fig. 3, a raster type scanning path is adopted, the scanning area is set to be 3mm × 2mm, the scanning length in the horizontal direction is 3mm, and the scanning length in the vertical direction is 2 mm. The distance between the micropores in the horizontal direction is controlled by the repetition frequency and the moving speed of the translation stage 12, the repetition frequency is set to be 100Hz, the scanning speed is 1000 μm/s, the pulse distance in the horizontal direction is 10 μm at the moment, and after the line scanning in each horizontal direction is finished, the translation stage 12 is controlled to enable the fused quartz sample 11 to move 10 μm in the vertical direction, so that the distance between holes processed in the horizontal direction and the vertical direction can be guaranteed to be 10 μm. Because the existence of the mask plate 10 and the scanning area are larger than the area of the mask plate, excessive pulse accumulation caused by acceleration and deceleration of the translation table in the horizontal direction does not act on a fused quartz damage removal area, and the actual processing area is 2mm multiplied by 2 mm. The modified region at this time was a region of 2 mm. times.2 mm. times.0.5 mm of the micropore array.
(8) As shown in fig. 2(b), the sample with the modified region obtained in step (7) is etched in a 20% hydrofluoric acid solution by mass fraction, so as to obtain a groove of 2.1mm × 2.1mm × 0.43mm, as shown in fig. 2 (c). At the moment, the crack area on the fused quartz is removed, and after the fused quartz is repaired by the femtosecond laser, the damage threshold of the repair point is far higher than that of the damage point before the repair, so that the femtosecond laser repair of the crack damage of the large-size optical element is realized.
The above detailed description is intended to illustrate the objects, aspects and advantages of the present invention, and it should be understood that the above detailed description is only exemplary of the present invention and is not intended to limit the scope of the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (5)
1. A femtosecond laser repairing method for large-size optical element crack damage is characterized in that: shaping the Gaussian laser into a Bessel beam with time delay; placing a damaged area of quartz in the mask plate, wherein the area is an area to be removed; processing a micropore array with depth in a region to be removed by a Bessel beam at a single point; and (3) placing the quartz after laser modification in hydrofluoric acid, removing the modified cubic structure, and removing the crack area at the moment to realize femtosecond laser repair of crack damage of the large-size optical element.
2. The femtosecond laser repair method for crack damage of a large-size optical element as claimed in claim 1, wherein: and processing a micro-pore array with depth in a single point manner in a to-be-removed area by using a time-of-flight scanning mode through the Bessel beam, and removing the crack with the preset depth by adjusting the relative position of the Bessel area and the material.
3. The femtosecond laser repair method for crack damage of a large-size optical element as claimed in claim 1, wherein: the laser scanning area is set to be larger than the mask plate area, so that pulse accumulation caused by acceleration and deceleration of the translation table is guaranteed not to act on a quartz crack area, and uniform modification of materials is realized.
4. The femtosecond laser repair method for crack damage of a large-size optical element as claimed in claim 1, wherein: the double-pulse sequence is generated by the double-refraction crystal, and the Bessel beam with time delay is generated by matching with the cone lens and the 4f system, so that the single-pulse high depth-diameter ratio material modification is realized, the energy deposition efficiency is enhanced, and the subsequent etching is facilitated.
5. The femtosecond laser repair method for crack damage of a large-size optical element as claimed in claim 1, 2, 3 or 4, wherein: the femtosecond laser repair device for realizing the femtosecond laser repair method comprises a femtosecond laser system, an attenuation sheet, a mechanical switch, a birefringent crystal, a conical lens, a plano-convex lens, a CCD (charge coupled device), a dichroic mirror, an objective lens, a mask, a fused quartz sample, a six-degree-of-freedom translation stage, a light source and a computer control system; laser generated by the femtosecond laser system sequentially passes through the attenuation sheet, the birefringent crystal, the conical lens and the plano-convex lens to the dichroic mirror and is reflected by the dichroic mirror, and then passes through the objective lens to reach a fused quartz sample; the mask is arranged in a crack damage area of the fused quartz sample; placing a fused quartz sample on the surface of a six-degree-of-freedom translation table; the light source illuminates the fused quartz sample, and an image is collected by the CCD; the mechanical switch controls the on-off of the laser; the computer control system coordinately controls the laser, the translation table and the mechanical switch; and placing the sample after laser modification in hydrofluoric acid, removing the modified cubic structure, and removing the crack area at the moment to realize femtosecond laser repair of crack damage of the large-size optical element.
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| CN114985942A (en) * | 2022-07-11 | 2022-09-02 | 北京理工大学 | Method for achieving cross-scale mass leveling of hemispherical harmonic oscillator by reshaping femtosecond laser in airspace |
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