CN110614440B - Optical element CO2Laser remelting and gasification composite polishing method - Google Patents
Optical element CO2Laser remelting and gasification composite polishing method Download PDFInfo
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- CN110614440B CN110614440B CN201910820748.9A CN201910820748A CN110614440B CN 110614440 B CN110614440 B CN 110614440B CN 201910820748 A CN201910820748 A CN 201910820748A CN 110614440 B CN110614440 B CN 110614440B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
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Abstract
The invention relates to an optical element CO2The laser remelting and gasifying composite polishing method uses CO2The laser parallel scanning mode carries out remelting polishing and gasification polishing alternate layered scanning on the optical element by changing the laser power, the repetition frequency and the spot diameter, the scanning track directions of each layer are different, and the high-efficiency and high-precision polishing of the optical element is realized. The invention is suitable for the high-efficiency and high-precision polishing of various optical elements.
Description
Technical Field
The invention relates to optical element polishing, in particular to an optical element CO2A laser remelting and gasification composite polishing method.
Background
The polishing method of the optical element at present is divided into contact polishing and non-contact polishing according to whether the optical element is in direct contact with a processed workpiece, and mainly comprises air bag polishing, small tool polishing, ion beam polishing, laser polishing and the like, wherein the former belongs to contact polishing and is easy to embed impurities into the optical element, and the latter belongs to non-contact polishing and is free of pressure stress and small in residual stress. The laser polishing has no higher requirements on environment, target materials and the like unlike the magnetorheological polishing, and has the advantages of wide application range, convenient operation, high precision, high efficiency and the like.
According to different action modes of laser and substances, laser polishing can be divided into hot polishing and cold polishing, wherein the laser hot polishing adopts continuous long-wavelength laser or long-pulse laser, and the polishing purpose is realized by melting, evaporating and other methods by utilizing the heat effect generated by the action of the laser and the substances. The polishing of the surface of the optical element is generally realized by adopting a fusion type or a gasification type, but when the fusion polishing is adopted, factors such as the geometric shape of a molten pool and the residence time of light spots which influence the flow quantity need to be accurately controlled, when the gasification polishing is adopted, process parameters such as the incident light angle and the energy density need to be adjusted, and in order to realize the purpose of fine polishing, a layer-by-layer polishing method is needed no matter the fusion polishing or the gasification polishing is adopted. The main effective rate of the melt polishing is relatively low, and the melt polishing has the defects of residual thermal stress, easy pore formation and the like; the problems of higher polishing precision, difficult determination of laser incidence angle, difficult removal of ablation vapor, poor polishing effect and the like exist in gasification polishing.
Disclosure of Invention
The object of the present invention is to solve the above-mentioned disadvantages of the prior art and to provide an optical element CO2The laser remelting and gasification composite polishing method improves the polishing efficiency and quality of optical elements and does not introduce impurities. The method adopts a method of alternately carrying out melting polishing and evaporation polishing to realize the purposes of quick and fine polishing.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a polishing method for optical element comprises cleaning and drying optical element, and CO2Laser remelting polishing, CO2Laser gasification polishing by CO2And performing remelting polishing and gasification polishing on the surface of the optical element layer by layer alternately by using laser.
CO2The laser repairing method specifically comprises the following steps:
firstly, putting a sample into an ultrasonic cleaning device to be cleaned in a ten-thousand-level clean room, and then taking out the sample to be dried by a blower in a normal temperature mode;
secondly, placing the sample on a workbench and fixing the sample to ensure that the surface to be remelted and polished is vertical to the laser direction;
third, turning on CO2The laser system is used for drawing a graph of a scanning track, the area of a polishing area is 1.01-1.1 times of that of a surface to be polished of the sample, and the graph is led into the laser system;
fourthly, during remelting and polishing, adjusting laser power, frequency, duty ratio, spot diameter, defocusing amount and scanning speed;
fifthly, placing the sample on a workbench for fixing, ensuring that the gasification polishing parallel track is vertical to the re-melting polishing parallel track at the last time, and adjusting an included angle between the normal of the surface to be gasified and polished and the laser incident line direction;
sixthly, during the gasification polishing, adjusting the laser power, the frequency, the duty ratio, the spot diameter, the defocusing amount and the scanning speed;
seventhly, after one-time remelting polishing and gasification polishing alternate polishing are completed, repeating the second step to the fourth step, properly reducing the laser power of 3-5W in the fourth step when remelting polishing is performed each time, scanning speed is 3-5 mm/s, the polishing track direction is increased by 10-20 degrees compared with the last track direction, and the rest parameters are unchanged; and repeating the fifth step to the seventh step, gradually increasing the incident angle of the laser beam and the normal direction of the sample in the fifth step by 2-5 degrees during each gasification polishing, properly reducing the laser power by 3-5W in the seventh step, and sequentially performing layer-by-layer alternate polishing at the scanning speed of 3-5 mm/s.
Further, the optical element includes fused silica glass, KDP, or K9.
Further, in the first step, the ultrasonic cleaning solution is absolute ethyl alcohol or acetone.
Further, in the fourth step, CO2The laser related parameters are as follows: the laser power is 10-50W, the frequency is 1-20 kHz, the duty ratio is 1% -10%, the diameter of a light spot is 1-5 mm, the defocusing amount is 5-50mm, and the scanning speed is 5-50 mm/s.
Furthermore, in the fifth step, the included angle between the normal of the surface to be gasified and the incident line direction of the laser is 45-80 degrees.
Further, in the sixth step, CO2The laser related parameters are as follows: the laser power is 50-100W, the frequency is 1-20 kHz, the duty ratio is 1% -10%, the diameter of a light spot is 0.01-0.1 mm, the defocusing amount is 1-10 mm, and the scanning speed is 50-1000 mm/s.
Compared with the prior art, the invention has the following remarkable advantages:
1. in an ultra-clean room environment where the laser polishing device is located, the surface of the optical element is cleaned by the ultrasonic cleaner, and the surface is dried by the blower at normal temperature, so that the operation is simple, convenient and efficient, secondary pollution to the optical element in the transportation process is avoided, and the surface of the optical element cannot be damaged in any form;
2. by using CO2Remelting and gasifying composite polishing is carried out by the laser, and new impurities cannot be introduced;
3. the method of limiting and fixing the optical element is adopted, the operation is convenient, and no clamping force is generated;
4. by using CO2The laser carries out remelting and gasification combined polishing, does not generate polishing pressure, and only generates smaller internal stress during remelting and polishing;
5、CO2the laser scanning motion track adopts parallel motion modes with different angles, the scanning is uniform, the operation is simple and easy, and the intermediate frequency can be reduced. The scanning area is larger than the surface to be polished of the optical element, so that the influence on the polishing quality when the laser energy rises or falls is avoided;
6、CO2the laser remelting and gasification composite polishing method references the advantages of the laser remelting and gasification composite polishing method, and simultaneously skillfully avoids the respective defects, thereby providing a new way for high-efficiency and high-precision polishing.
Drawings
FIG. 1 is a CO of the present invention2Laser polishing intent.
In the figure 1 is CO2The laser instrument, 2 are the beam expanding mirror, 3 are the optical gate, 4 are the diaphragm, 5 are the dichroic mirror, 6 are the speculum, 7 are the CCD system, 8 are the plastic mirror, 9 are the mirror that shakes, 10 are the focusing mirror, 11 are the suction nozzle, 12 samples, 13 right angle wedge fixed stations, 14 electronic translation platforms.
FIG. 2 is a schematic view of sample fixation according to the present invention. In fig. 2, 15 is a fixing jig.
FIG. 3 is a schematic view of the angle between the incident laser beam and the normal of the sample for vapor polishing according to the present invention. In fig. 3, 16 is the incident laser beam, and θ is the angle between the incident laser beam and the normal of the sample.
Fig. 4 is a schematic diagram of parallel scanning trajectories.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
the invention can be widely applied to the fine polishing of optical elements with various surface shapes and materials, such as quartz and crystal optical elements with planes, spherical surfaces, cylindrical surfaces, non-rotating surfaces, aspheric surfaces and the like, in particular to optical elements with surfaces with complex shapes.
The principle and basis of the invention are as follows: fused silica glass for 10.6 μm wavelength CO2The laser energy has better absorption performance, when the laser energy is greater than a melting threshold value and lower than a gasification threshold value, the viscosity of the glass is reduced, and the melted wave crest glass flows to a wave trough under the action of surface tension, so that the surface roughness is reduced; when the laser energy is higher than the gasification threshold, the glass surface is irradiated by an incident angle forming a certain angle with the glass surface method, the wave crest is irradiated by the laser to be gasified, and the wave trough is not irradiated by the laser to be gasified, so that the purpose of reducing the surface roughness is achieved. Because the larger the molten pool is during melting and polishing, the longer the residence time is, the smoother the surface is, but the generated stress is also larger, the lower the processing efficiency is, and during gasification and polishing, if irradiation is carried out along the normal direction of the glass surface, the peaks and the valleys are removed simultaneously, so that the purpose of reducing the roughness can not be achieved, therefore, the incident light is adopted to enter at a certain angle with the normal direction of the glass surface, and the higher the incident angle is, the better the precision is, but the higher the incident angle is, the higher the requirements on the device and the related detection means are, and in addition, the smaller the light spot diameter is, the better the gasification and polishing effect is, the peaks and the valleys are not easily removed simultaneously, but. Therefore, in order to fully exert the respective advantages of remelting and gasifying polishing, the method combining large-spot remelting and polishing and small-spot gasifying polishing is adopted to quickly reduce the surface roughness of the fused quartz.
The device in figure 1 of the invention takes gasification polishing as an example, and the working process is as follows: the sample 12 is fixed on the right-angle wedge-shaped fixed table 13 by the fixing clamp 15 in fig. 2, the right-angle wedge-shaped fixed table 13 is also fixed on the electric translation table 14 in the same way, and CO is started2In the laser 1, light rays respectively pass through a beam expanding lens 2, an optical gate 3 and a diaphragm 4 along a light path diagram shown in fig. 1 to reach a dichroic mirror 5, most of the light rays are reflected to a shaping mirror 8, and after passing through a field lens consisting of a vibrating mirror 9 and a focusing mirror 10, laser passes through a field lens with a transparent upper endThe air suction nozzle 11 focuses on the surface of the sample 12, and after polishing is finished, the CCD system 7 observes the processed surface appearance of the sample 12 through a light path system composed of the reflecting mirror 6, the dichroic mirror 5 and the like.
Example 1
Subjecting an optical element to CO2Laser remelting and gasification composite polishing, wherein the substrate material is fused quartz. The experiment is carried out in the presence of CO2The laser polishing device is carried out in a ten thousand grade clean room. Firstly, cleaning the surface of an optical element by using an ultrasonic cleaner, then drying the optical element by using a blower in a normal temperature mode, placing a sample 12 on an electric translation table 14 shown in figure 1, fixing the sample by adopting a mode shown in figure 2, starting a laser 1, and adjusting laser parameters: the laser power is 40W, the frequency is 10kHz, the duty ratio is 5%, the spot diameter is 4mm, the defocusing amount is 10mm, the track interval is 0.08mm, the scanning speed is 40mm/s, the parallel track shown in figure 3 is drawn, the laser system is guided in, the set laser parameters are determined, the workpiece is positioned to the initial processing position through the CCD observation system, and then the remelting polishing is carried out on the optical element. After polishing, take off the sample and install on right angle wedge fixed station 13, guarantee to wait that the contained angle between gasification polishing surface normal and the laser incident line direction is 45, the position that the sample was placed will be confirmed gasification polishing parallel track and the remelting polishing parallel track of last time is mutually perpendicular, adjusts laser parameter: the laser power is 80W, the frequency is 15kHz, the duty ratio is 3%, the spot diameter is 0.1mm, the defocusing amount is 8mm, the track interval is 0.08mm, the scanning speed is 1000mm/s, the gasification polishing track is determined to be perpendicular to the last remelting polishing track through a CCD observation system, the set laser parameters are determined to carry out gasification polishing, and primary remelting and gasification alternate layer-by-layer polishing are completed. During remelting and polishing each time, the laser power is reduced by 5W, the scanning speed is reduced by 5mm/s, the polishing track direction is increased by 10 degrees compared with the last track direction, and other parameters are unchanged; and increasing the incident angle of the laser beam and the normal direction of the sample by 5 degrees during each subsequent gasification polishing, reducing the laser power by 3W, scanning at the speed of 3mm/s, and sequentially and alternately remelting and gasification polishing layer by layer.
The remelting and gasification composite polishing method does not introduce impurities in the processing process, and can remove the original impurities on the subsurface of the optical element. The cleaning and drying method adopted in the polishing process step does not damage the optical element and has no pollution. The remelting and gasification composite polishing method adopts layer-by-layer alternate polishing, and the polishing tracks are different every time, so that the intermediate frequency of the optical element can be effectively reduced.
When the remelting and gasification combined polishing method is used for remelting and polishing, the laser energy and the laser speed are gradually reduced, and the corresponding gasification polishing incidence angle is changed from small to large, so that the processing efficiency and the processing precision are effectively improved.
Claims (6)
1. Optical element CO2The laser remelting and gasification composite polishing method is characterized by comprising the steps of cleaning and drying an optical element and CO2Laser remelting polishing, CO2Laser gasification polishing by CO2Remelting and polishing the surface of the optical element layer by layer alternately by laser and carrying out gasification polishing; CO 22The laser repairing method specifically comprises the following steps:
firstly, putting a sample into an ultrasonic cleaning device to be cleaned in a ten-thousand-level clean room, and then taking out the sample to be dried by a blower in a normal temperature mode;
secondly, placing the sample on a workbench and fixing the sample to ensure that the surface to be remelted and polished is vertical to the laser direction;
third, turning on CO2The laser system is used for drawing a graph of a scanning track, the area of a polishing area is 1.01-1.1 times of that of a surface to be polished of the sample, and the graph is led into the laser system;
fourthly, during remelting and polishing, adjusting laser power, frequency, duty ratio, spot diameter, defocusing amount and scanning speed;
fifthly, placing the sample on a workbench for fixing, ensuring that the gasification polishing parallel track is vertical to the re-melting polishing parallel track at the last time, and adjusting an included angle between the normal of the surface to be gasified and polished and the laser incident line direction;
sixthly, during the gasification polishing, adjusting the laser power, the frequency, the duty ratio, the spot diameter, the defocusing amount and the scanning speed;
seventhly, after one-time remelting polishing and gasification polishing alternate polishing are completed, repeating the second step to the fourth step, wherein when remelting polishing is performed each time, the laser power in the fourth step is properly reduced by 3-5W, the scanning speed is 3-5 mm/s, the polishing track direction rotates 10-20 degrees compared with the last track direction, and other parameters are unchanged; and repeating the fifth step to the seventh step, gradually increasing the incident angle of the laser beam and the normal direction of the sample in the fifth step by 2-5 degrees during each gasification polishing, properly reducing the laser power by 3-5W in the seventh step, and sequentially performing layer-by-layer alternate polishing at the scanning speed of 3-5 mm/s.
2. Optical element CO according to claim 12The laser remelting and gasification combined polishing method is characterized in that the optical element comprises fused quartz glass, KDP or K9.
3. Optical element CO according to claim 12The laser remelting and gasification composite polishing method is characterized in that in the first step, the ultrasonic cleaning liquid is absolute ethyl alcohol or acetone.
4. Optical element CO according to claim 12The laser remelting and gasification combined polishing method is characterized in that in the fourth step, CO2The laser related parameters are as follows: the laser power is 10-50W, the frequency is 1-20 kHz, the duty ratio is 1% -10%, the diameter of a light spot is 1-5 mm, the defocusing amount is 5-50mm, and the scanning speed is 5-50 mm/s.
5. Optical element CO according to claim 12The laser remelting and gasification composite polishing method is characterized in that in the fifth step, the included angle between the normal of the surface to be gasified and polished and the incident line direction of laser is 45-80 degrees.
6. Optical element CO according to claim 12The laser remelting and gasification combined polishing method is characterized in that in the sixth step, CO is used2The laser related parameters are as follows: the laser power is 50-100W, the frequency is 1-20 kHz, the duty ratio is 1% -10%, and the light is emittedThe spot diameter is 0.01-0.1 mm, the defocusing amount is 1-10 mm, and the scanning speed is 50-1000 mm/s.
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| CN112589263A (en) * | 2020-12-11 | 2021-04-02 | 浙江工业大学 | Evaporation-fusion composite laser polishing method for metal surface with peak clipping and valley filling |
| CN113500297A (en) * | 2021-06-21 | 2021-10-15 | 深圳信息职业技术学院 | Laser polishing method and laser polishing equipment |
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| JP3044188B2 (en) * | 1996-02-15 | 2000-05-22 | 核燃料サイクル開発機構 | Laser decontamination method |
| CN101524819A (en) * | 2009-02-03 | 2009-09-09 | 广东工业大学 | Composite technique for polishing sapphire by using green and ultraviolet laser |
| FR2977182B1 (en) * | 2011-07-01 | 2013-07-12 | Commissariat Energie Atomique | PROCESS FOR PRODUCING AN OPTICAL COMPONENT FOR REMOVING SURFACE DEFECTS |
| CN105772947B (en) * | 2016-03-23 | 2017-10-20 | 中国科学院上海光学精密机械研究所 | Double light sources are combined laser beam burnishing device |
| CN106756989B (en) * | 2016-11-22 | 2021-02-02 | 昆明七零五所科技发展有限责任公司 | Laser composite manufacturing technology of part |
| CN107225328A (en) * | 2017-04-14 | 2017-10-03 | 北京航空航天大学 | A kind of single step pulse laser polishing method for metal surface |
| CN107081640B (en) * | 2017-06-27 | 2019-04-02 | 中国工程物理研究院激光聚变研究中心 | Method for manufacturing optical element |
| CN107498176B (en) * | 2017-08-02 | 2019-05-14 | 中国科学院光电研究院 | A kind of the excimer laser polishing and detection method of porous ceramics |
| CN107452607A (en) * | 2017-08-02 | 2017-12-08 | 武汉大学 | A kind of wafer laser grinding system and method |
| CN109514076B (en) * | 2018-12-18 | 2020-04-14 | 北京工业大学 | Picosecond-nanosecond laser composite asynchronous ceramic polishing process method |
| CN109693039B (en) * | 2018-12-27 | 2021-07-16 | 北京航空航天大学 | Method for laser polishing of surface of silicon wafer |
| CN109590603A (en) * | 2019-01-07 | 2019-04-09 | 中国科学院上海光学精密机械研究所 | The laser beam polishing method of fused quartz optical glass |
| CN109516697A (en) * | 2019-01-11 | 2019-03-26 | 中国科学院上海光学精密机械研究所 | The laser polishing method of mobile phone display screen glass |
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