CN114402030A - Composite and molded article - Google Patents
Composite and molded article Download PDFInfo
- Publication number
- CN114402030A CN114402030A CN202080065528.0A CN202080065528A CN114402030A CN 114402030 A CN114402030 A CN 114402030A CN 202080065528 A CN202080065528 A CN 202080065528A CN 114402030 A CN114402030 A CN 114402030A
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- CN
- China
- Prior art keywords
- group
- compound
- epoxy resin
- composite
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000002131 composite material Substances 0.000 title claims abstract description 94
- 239000003822 epoxy resin Substances 0.000 claims abstract description 124
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 124
- -1 siloxane compound Chemical class 0.000 claims abstract description 106
- 229910052751 metal Inorganic materials 0.000 claims abstract description 99
- 239000002184 metal Substances 0.000 claims abstract description 97
- 239000011342 resin composition Substances 0.000 claims abstract description 83
- 239000000843 powder Substances 0.000 claims abstract description 76
- 150000001875 compounds Chemical class 0.000 claims abstract description 56
- 239000000126 substance Substances 0.000 claims abstract description 53
- 125000004432 carbon atom Chemical group C* 0.000 claims description 34
- 125000000962 organic group Chemical group 0.000 claims description 18
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 125000003700 epoxy group Chemical group 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 125000001033 ether group Chemical group 0.000 claims description 9
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 229920001281 polyalkylene Polymers 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 238000001723 curing Methods 0.000 description 61
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 41
- 239000000047 product Substances 0.000 description 31
- 229910045601 alloy Inorganic materials 0.000 description 29
- 239000000956 alloy Substances 0.000 description 29
- 239000003795 chemical substances by application Substances 0.000 description 29
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 29
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 26
- 239000005011 phenolic resin Substances 0.000 description 26
- 238000012360 testing method Methods 0.000 description 25
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 24
- 239000002245 particle Substances 0.000 description 24
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 239000001993 wax Substances 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 16
- 238000000465 moulding Methods 0.000 description 16
- 239000000203 mixture Substances 0.000 description 15
- 229920003986 novolac Polymers 0.000 description 15
- 229920001296 polysiloxane Polymers 0.000 description 14
- 239000004305 biphenyl Substances 0.000 description 12
- 235000010290 biphenyl Nutrition 0.000 description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 12
- QFLWZFQWSBQYPS-AWRAUJHKSA-N (3S)-3-[[(2S)-2-[[(2S)-2-[5-[(3aS,6aR)-2-oxo-1,3,3a,4,6,6a-hexahydrothieno[3,4-d]imidazol-4-yl]pentanoylamino]-3-methylbutanoyl]amino]-3-(4-hydroxyphenyl)propanoyl]amino]-4-[1-bis(4-chlorophenoxy)phosphorylbutylamino]-4-oxobutanoic acid Chemical compound CCCC(NC(=O)[C@H](CC(O)=O)NC(=O)[C@H](Cc1ccc(O)cc1)NC(=O)[C@@H](NC(=O)CCCCC1SC[C@@H]2NC(=O)N[C@H]12)C(C)C)P(=O)(Oc1ccc(Cl)cc1)Oc1ccc(Cl)cc1 QFLWZFQWSBQYPS-AWRAUJHKSA-N 0.000 description 11
- 239000007822 coupling agent Substances 0.000 description 11
- 238000004898 kneading Methods 0.000 description 10
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 10
- 239000002994 raw material Substances 0.000 description 9
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 8
- 239000003063 flame retardant Substances 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 229910000859 α-Fe Inorganic materials 0.000 description 8
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- 125000003710 aryl alkyl group Chemical group 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 229940126214 compound 3 Drugs 0.000 description 7
- 235000014113 dietary fatty acids Nutrition 0.000 description 7
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000194 fatty acid Substances 0.000 description 7
- 229930195729 fatty acid Natural products 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 150000002430 hydrocarbons Chemical group 0.000 description 6
- 150000002736 metal compounds Chemical class 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 125000001624 naphthyl group Chemical group 0.000 description 6
- 238000001721 transfer moulding Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 125000003944 tolyl group Chemical group 0.000 description 5
- 125000005023 xylyl group Chemical group 0.000 description 5
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 4
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000004202 carbamide Substances 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000006038 hexenyl group Chemical group 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 4
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000000344 soap Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000006247 magnetic powder Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 235000013872 montan acid ester Nutrition 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- GAYWTJPBIQKDRC-UHFFFAOYSA-N 8-trimethoxysilyloctyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C(C)=C GAYWTJPBIQKDRC-UHFFFAOYSA-N 0.000 description 2
- 235000010919 Copernicia prunifera Nutrition 0.000 description 2
- 244000180278 Copernicia prunifera Species 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000004203 carnauba wax Substances 0.000 description 2
- 235000013869 carnauba wax Nutrition 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004200 microcrystalline wax Substances 0.000 description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
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- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
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- 238000002360 preparation method Methods 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
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- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 2
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- 125000004434 sulfur atom Chemical group 0.000 description 2
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 229940098697 zinc laurate Drugs 0.000 description 2
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 2
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- RDYWHMBYTHVOKZ-UHFFFAOYSA-N 18-hydroxyoctadecanamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCO RDYWHMBYTHVOKZ-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical class C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- NODRXLWVBKZXOO-UHFFFAOYSA-N 2-(hydroxymethyl)docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCC(CO)C(N)=O NODRXLWVBKZXOO-UHFFFAOYSA-N 0.000 description 1
- KHTJRKQAETUUQH-UHFFFAOYSA-N 2-(hydroxymethyl)octadecanamide Chemical compound CCCCCCCCCCCCCCCCC(CO)C(N)=O KHTJRKQAETUUQH-UHFFFAOYSA-N 0.000 description 1
- MSJIPWGDQODKSK-UHFFFAOYSA-N 2-[4-(2-hydroxyphenyl)phenyl]phenol Chemical compound OC1=CC=CC=C1C1=CC=C(C=2C(=CC=CC=2)O)C=C1 MSJIPWGDQODKSK-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CFGWPPPFYVFLLB-UHFFFAOYSA-N 5-carbamoyl-5-octadecyltricosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCC(C(N)=O)(CCCC(O)=O)CCCCCCCCCCCCCCCCCC CFGWPPPFYVFLLB-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
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- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
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- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910017060 Fe Cr Inorganic materials 0.000 description 1
- 229910002544 Fe-Cr Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
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- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
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- 238000010521 absorption reaction Methods 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
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- 150000001298 alcohols Chemical class 0.000 description 1
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- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
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- 229940063655 aluminum stearate Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- HIAAVKYLDRCDFQ-UHFFFAOYSA-L calcium;dodecanoate Chemical compound [Ca+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O HIAAVKYLDRCDFQ-UHFFFAOYSA-L 0.000 description 1
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- 239000013522 chelant Substances 0.000 description 1
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- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
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- 238000004891 communication Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
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- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
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- GFQOFGWPGYRLAO-UHFFFAOYSA-N dodecanamide;ethene Chemical compound C=C.CCCCCCCCCCCC(N)=O.CCCCCCCCCCCC(N)=O GFQOFGWPGYRLAO-UHFFFAOYSA-N 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- SWSBIGKFUOXRNJ-CVBJKYQLSA-N ethene;(z)-octadec-9-enamide Chemical compound C=C.CCCCCCCC\C=C/CCCCCCCC(N)=O.CCCCCCCC\C=C/CCCCCCCC(N)=O SWSBIGKFUOXRNJ-CVBJKYQLSA-N 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- FEEPBTVZSYQUDP-UHFFFAOYSA-N heptatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O FEEPBTVZSYQUDP-UHFFFAOYSA-N 0.000 description 1
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000004206 montan acid ester Substances 0.000 description 1
- TXSUIVPRHHQNTM-UHFFFAOYSA-N n'-(3-methylanilino)-n-phenyliminobenzenecarboximidamide Chemical compound CC1=CC=CC(NN=C(N=NC=2C=CC=CC=2)C=2C=CC=CC=2)=C1 TXSUIVPRHHQNTM-UHFFFAOYSA-N 0.000 description 1
- PECBPCUKEFYARY-ZPHPHTNESA-N n-[(z)-octadec-9-enyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCCCCCCC\C=C/CCCCCCCC PECBPCUKEFYARY-ZPHPHTNESA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- DJWFNQUDPJTSAD-UHFFFAOYSA-N n-octadecyloctadecanamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCCCCCCCCCCCCCC DJWFNQUDPJTSAD-UHFFFAOYSA-N 0.000 description 1
- ZCIJAGHWGVCOHJ-UHFFFAOYSA-N naphthalene phenol Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.C1=CC=CC2=CC=CC=C12.C1(=CC=CC=C1)O ZCIJAGHWGVCOHJ-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- ODNJVAVDJKOYFK-GRVYQHKQSA-L zinc;(9z,12z)-octadeca-9,12-dienoate Chemical compound [Zn+2].CCCCC\C=C/C\C=C/CCCCCCCC([O-])=O.CCCCC\C=C/C\C=C/CCCCCCCC([O-])=O ODNJVAVDJKOYFK-GRVYQHKQSA-L 0.000 description 1
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0856—Iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A composite comprising a metal element-containing powder and a resin composition, wherein the resin composition contains an epoxy resin and a compound having a siloxane bond, the content of the compound having a siloxane bond is 20 parts by mass or less per 100 parts by mass of the epoxy resin, and the compound having a siloxane bond contains a siloxane compound having a structure represented by the following chemical formula (1).
Description
Technical Field
The present invention relates to a composite and a molded article.
Background
A composite including a metal powder and a resin composition is used as a raw material for various industrial products such as an inductor (inductor), an electromagnetic shield (electromagnetic shield), a bonded magnet (bonded magnet) and the like, depending on various physical properties of the metal powder (see patent document 1 mentioned below)
Prior art documents
Patent document
Patent document 1: japanese patent laid-open No. 2014-13803
Disclosure of Invention
Technical problem to be solved by the invention
Industrial products such as inductors are sometimes required to have resistance to heat or voltage. The invention aims to provide a composite capable of obtaining a molded body having both heat resistance and voltage resistance, and a molded body having the composite.
Means for solving the technical problem
The composite of one aspect of the present invention includes a metal element-containing powder and a resin composition, wherein the resin composition contains an epoxy resin and a compound having a siloxane bond (chemical compound), the content of the compound having a siloxane bond is 20 parts by mass or less with respect to 100 parts by mass of the epoxy resin, and the compound having a siloxane bond includes a siloxane compound having a structure represented by the following chemical formula (1).
In the chemical formula (1), n is an integer of 2-200, R1And R2Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms.
In the above composite according to one aspect of the present invention, the siloxane compound may further have a structural unit represented by the following chemical formula (2).
The chemistry describedIn the formula (2), R3Is an alkylene group having 1 to 10 carbon atoms.
The compound according to one aspect of the present invention may include a compound represented by the following chemical formula (3) as a siloxane compound.
In the chemical formula (3), n is an integer of 2-200, and m1And m2Each independently an integer of 1 to 200, R4、R5、R6And R7Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group or a polyalkylene ether group having 3 to 500 carbon atoms, R8And R9Each independently an alkylene group having 1 to 10 carbon atoms, R10And R11Each independently is a C1-10 valent hydrocarbon group that may contain an ether structure.
The composite according to one aspect of the present invention may include at least one of a biphenylene aralkyl (biphenylene ara) kyl type epoxy resin and an isocyanate-modified epoxy resin as the epoxy resin.
In the above composite according to one aspect of the present invention, the content of the metal element-containing powder may be 90% by mass or more and less than 100% by mass.
The molded article according to one aspect of the present invention includes the composite.
Effects of the invention
According to the present invention, there are provided a composite capable of obtaining a molded article having both heat resistance and voltage resistance, and a molded article provided with the composite.
Detailed Description
Preferred embodiments of the present invention will be described below. However, the present invention is not limited to the following embodiments.
< summary of the Compound >
The composite of the present embodiment includes a metal element-containing powder and a resin composition. The metal element-containing powder is composed of a plurality of (a plurality of) metal element-containing particles. The metal element-containing powder (metal element-containing particles) may contain at least one selected from the group consisting of metal monomers, alloys, and metal compounds, for example. The resin composition contains at least an epoxy resin and a compound having a siloxane bond. Compounds having siloxane bonds are sometimes labeled "siloxane compounds". The resin composition may contain other components in addition to the epoxy resin and the silicone compound. For example, the resin composition may contain a curing agent. The resin composition may also contain a curing accelerator. The resin composition may also contain additives. The resin composition may contain an epoxy resin, a silicone compound, a curing agent, a curing accelerator, and additives, and may be the remaining components (nonvolatile components) excluding the organic solvent and the metal element-containing powder. The additive is a component of the resin composition excluding the resin, the siloxane compound, the curing agent, and the curing accelerator. The additive is, for example, a coupling agent or a flame retardant. The resin composition may contain wax as an additive. The compound may be a powder (compound powder).
The compound of the present embodiment contains a predetermined amount of a silicone compound as one of the elastomers. Although the reason why the heat resistance and the voltage resistance of the molded article obtained from the composite by a predetermined amount of the siloxane compound are improved is not clear, the inventors speculate the following possibility. First, it is considered that the addition of the silicone compound improves the fluidity of the content component and suppresses the generation of internal voids (void) during molding. Second, it is considered that the compatibility between the metal element-containing powder and the epoxy resin is low, and the characteristics are degraded from the interface between the two, but the compatibility between the two can be improved by adding the siloxane compound. However, the effects of the present invention are not limited to the above.
The composite may include a metal element-containing powder and a resin composition attached to the surface of each metal element-containing particle constituting the metal element-containing powder. The resin composition may cover the entire surface of the particles, or may cover only a part of the surface of the particles. The composite may also include an uncured resin composition and a powder containing a metal element. The composite may also include a semi-cured product of the resin composition (e.g., a B-stage resin composition) and a powder containing a metal element. The composite may include both an uncured resin composition and a semi-cured product of the resin composition. The composite may also be composed of a powder containing a metal element and a resin composition.
The content of the metal element-containing powder in the composite may be 90 mass% or more and less than 100 mass%, 90 mass% or more and 99.8 mass% or less, 92 mass% or more and 99.5 mass% or less, 94 mass% or more and 98.5 mass% or less, or 94 mass% or more and 97.5 mass% or less with respect to the mass of the entire composite. The composite may also contain other filler materials (e.g., a filler of silica) in addition to the metal element-containing powder.
The content of the resin composition in the composite may be 0.2 mass% or more and 10 mass% or less, or 4 mass% or more and 6 mass% or less, based on the mass of the entire composite (for example, the total of the mass of the metal element-containing powder and the mass of the resin composition).
The content of the siloxane compound in the composite is 20 parts by mass or less based on 100 parts by mass of the epoxy resin, but may be 17.5 parts by mass or less, or may be 15 parts by mass or less. When the content of the siloxane compound is within the above range, the heat resistance and the voltage resistance of the molded article can be both satisfied. On the other hand, the lower limit of the content of the siloxane compound in the composite is not particularly limited, but from the viewpoint of moldability and the like, it may be 0.1 part by mass or more, or 5 parts by mass or more, or 7.5 parts by mass or more, or 10 parts by mass or more, relative to 100 parts by mass of the epoxy resin.
The average particle diameter of the metal element-containing powder is not particularly limited, and may be, for example, 1 μm or more and 300 μm or less. The average particle diameter can be measured by a particle size distribution meter, for example. The shape of each metal element-containing particle constituting the metal element-containing powder is not limited, and may be, for example, spherical, flat, prismatic, or needle-like. The composite may contain a plurality of kinds of metal element-containing powders having different average particle diameters.
The composition or combination of the metal element-containing powder contained in the composite enables various characteristics such as electromagnetic characteristics of the compact formed from the composite to be freely controlled, and the compact can be used for various industrial products or raw materials thereof. Industrial products manufactured using the composite may be, for example, automobiles, medical devices, electronic devices, electrical devices, information communication devices, home electric appliances, audio devices, and general industrial devices. For example, when the composite contains a permanent magnet such as an Sm-Fe-N alloy or an Nd-Fe-B alloy as the metal element-containing powder, the composite can be used as a raw material for bonded magnets. When the composite contains a soft magnetic powder of Fe — Si — Cr system alloy or ferrite (ferrite) as the powder containing the metal element, the composite can be used as a raw material (e.g., magnetic core) of an inductor (e.g., EMI filter) or a transformer. When the composite contains iron and copper as the metal element-containing powder, a formed body (e.g., a sheet) formed of the composite can be used as an electromagnetic wave shield.
< composition of Complex >
(resin composition)
The resin composition has a function as a binder (binder) for the metal element-containing particles constituting the metal element-containing powder, and imparts mechanical strength to a molded body formed of the composite. For example, when the composite is molded at high pressure using a mold, the resin composition is filled between the metal element-containing particles to bond the metal element-containing particles to each other. By curing the resin composition in the molded body, the cured product of the resin composition causes the metal element-containing particles to be more firmly bonded to each other, and the mechanical strength of the molded body is improved.
The resin composition contains at least an epoxy resin as a thermosetting resin. The composite contains an epoxy resin having relatively excellent fluidity among thermosetting resins, and thus the fluidity, storage stability and moldability of the composite are improved. However, the composite may contain other resins in addition to the epoxy resin as long as the effects of the present invention are not impaired. For example, the resin composition may contain at least one of a phenol resin and a polyamideimide resin as the thermosetting resin. When the resin composition contains both an epoxy resin and a phenol resin, the phenol resin can function as a curing agent for the epoxy resin. The resin composition may also contain a thermoplastic resin. The thermoplastic resin may be, for example, at least one selected from the group consisting of acrylic resin, polyethylene, polypropylene, polystyrene, polyvinyl chloride, and polyethylene terephthalate. The resin composition may contain both a thermosetting resin and a thermoplastic resin. The resin composition may also contain a silicone resin.
The epoxy resin may be, for example, a resin having 2 or more epoxy groups in 1 molecule. The epoxy resin may be a resin having 3 or more epoxy groups in 1 molecule, for example. The epoxy resin may also be a multifunctional epoxy resin. The epoxy resin may be, for example, at least one selected from the group consisting of: biphenyl type epoxy resin, stilbene type epoxy resin, diphenylmethane type epoxy resin, sulfur atom containing type epoxy resin, novolak type epoxy resin, dicyclopentadiene type epoxy resin, salicylaldehyde type epoxy resin, naphthol and phenol type copolymerized epoxy resin, aralkyl type epoxy resin, bisphenol type epoxy resin, epoxy resin containing a bisphenol skeleton, alcohol type glycidyl ether type epoxy resin, glycidyl ether type epoxy resin of p-xylene and/or m-xylene modified phenolic resin, glycidyl ether type epoxy resin of terpene modified phenolic resin, cyclopentadiene type epoxy resin, glycidyl ether type epoxy resin of polycyclic aromatic ring modified phenolic resin, glycidyl ether type epoxy resin of phenolic resin containing a naphthalene ring, glycidyl ester type epoxy resin, glycidyl or methyl glycidyl type epoxy resin, epoxy resin of biphenyl type epoxy resin, stilbene type epoxy resin, diphenylmethane type epoxy resin, sulfur atom containing type epoxy resin, novolak type epoxy resin, dicyclopentadiene type epoxy resin, salicylaldehyde type epoxy resin, epoxy resin containing a naphthol skeleton, glycidyl ether type epoxy resin of an alcohol type and/or m-xylene modified phenolic resin, glycidyl ether type epoxy resin of a terpene modified phenolic resin, glycidyl ester type epoxy resin, or methyl glycidyl ester type epoxy resin, and a mixture of a biphenyl type epoxy resin and a mixture of a biphenyl type and a mixture of a biphenyl type and a mixture of a biphenyl type, Alicyclic epoxy resins, halogenated phenol novolac epoxy resins, o-cresol novolac epoxy resins, p-phenylene bisphenol epoxy resins, trimethylolpropane epoxy resins, and linear aliphatic epoxy resins obtained by oxidizing an olefin bond with a peroxy acid such as peracetic acid.
From the viewpoint of excellent flowability, the epoxy resin may be at least one selected from the group consisting of a biphenyl-type epoxy resin, an o-cresol novolac-type epoxy resin, a phenol novolac-type epoxy resin, a bisphenol-type epoxy resin, an epoxy resin having a bisphenol skeleton, a salicylaldehyde novolac-type epoxy resin, and a naphthol novolac-type epoxy resin.
The epoxy resin may be a crystalline epoxy resin. Although the crystalline epoxy resin has a relatively low molecular weight, the crystalline epoxy resin has a relatively high melting point and is excellent in fluidity. The crystalline epoxy resin (epoxy resin having high crystallinity) may be at least one selected from the group consisting of, for example, a hydroquinone-type epoxy resin, a bisphenol-type epoxy resin, a thioether-type epoxy resin, and a biphenyl-type epoxy resin. Commercially available products of the crystalline epoxy resin may be, for example, those selected from the group consisting of EPICLON 860, EPICLON 1050, EPICLON 1055, EPICLON 2050, EPICLON 3050, EPICLON 4050, EPICLON 7050, EPICLON HM-091, EPICLON HM-101, EPICLON N-730A, EPICLON-740, EPICLON-770, EPICLON-775, EPICLON N-865, EPICLON HP-4032D, EPICLON HP-7200L, EPICLON HP-7200H, EPICLON HP-7200HHH, EPICLON HP-4700, EPICLON HP-4710, EPICLON 477HP-0, EPICLON HP-5000, EPICLON HP-6000, EPICLON HP-353000, EPICLON HP-3000, EPICLON HP-363000, EPICLON HP-500, EPICLON-3000, EPICLON HP-363000, EPICLON-3000, EPICLON-3, EPICLON-363000, EPICLON-3000, EPICLON-500, EPICLON-3000, EPICLON-3, EPICLON-3000, EPICLON-500, EPICLON-369, EPICLON-3000, EPICLON-3, EPICLON-11, EPICLON-L-3000, EPICLON-3, EPICLON-9, EPICLON-L, EPICLON-9, EPICLON-L, EPICLON-9, EPICLON-L, EPICLON-9, EPICLON-L, EPICLON, NC-2000-L, XD-1000, NC-7000-L, NC-7300-L, EPPN-501H, EPPN-501HY, EPPN-502H, EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, CER-1020, EPPN-201, BREN-S, BREN-10S (trade name manufactured by Nippon Kayaku Co., Ltd., supra), YX-4000H, YL4121H, and YX-8800 (trade name manufactured by Mitsubishi Chemical Corporation, supra).
The resin composition may contain at least one of a biphenylene aralkyl type epoxy resin and an isocyanate modified epoxy resin as the epoxy resin, from the viewpoint that the molding shrinkage of the composite is easily reduced and the heat resistance and the voltage resistance of the molded article are easily improved. The resin composition may contain both a biphenylene aralkyl type epoxy resin and an isocyanate modified epoxy resin as the epoxy resin. A commercially available product of biphenylene aralkyl type epoxy resin may be, for example, NC-3000 manufactured by Nippon Kayaku Co., Ltd. A commercially available product of the isocyanate-modified epoxy resin may be, for example, AER-4001 manufactured by Asahi Kasei Corporation (formerly Asahi Kasei E-Materials Co., Ltd.). The resin composition may contain a polyfunctional epoxy resin, from the viewpoint that the heat resistance and the voltage resistance of the molded article are easily improved. Examples of commercially available products of the polyfunctional epoxy resin include VG-3101L manufactured by Printec Corporation.
The resin composition may contain one of the above epoxy resins. The resin composition may contain a plurality of epoxy resins as described above.
The curing agent is classified into a curing agent that cures an epoxy resin in a range from low temperature to room temperature, and a heat-curable curing agent that cures an epoxy resin with heating. Examples of the curing agent for curing the epoxy resin in a range from low temperature to room temperature include aliphatic polyamines, polyaminoamides, and polythiols. Examples of the heat-curable curing agent include aromatic polyamine, acid anhydride, phenol novolac resin, and Dicyandiamide (DICY).
When a curing agent that cures an epoxy resin in a range from low temperature to room temperature is used, the glass transition point of a cured product of the epoxy resin is low, and the cured product of the epoxy resin tends to be flexible. As a result, the molded article formed of the composite is also easily softened. On the other hand, from the viewpoint of improving the heat resistance of the molded body, the curing agent may preferably be a heat-curable curing agent, more preferably a phenol resin, and even more preferably a phenol novolac resin. In particular, by using a phenol novolac resin as a curing agent, a cured product of an epoxy resin having a high glass transition point can be easily obtained. As a result, the heat resistance and mechanical strength of the molded article are easily improved.
The phenol resin may be at least one selected from the group consisting of an aralkyl type phenol resin, a dicyclopentadiene type phenol resin, a salicylaldehyde type phenol resin, a novolak type phenol resin, a copolymerized type phenol resin of a benzaldehyde type phenol and an aralkyl type phenol, a p-xylene and/or m-xylene modified phenol resin, a melamine modified phenol resin, a terpene modified phenol resin, a dicyclopentadiene type naphthalene phenol resin, a cyclopentadiene modified phenol resin, a polycyclic aromatic ring modified phenol resin, a biphenyl type phenol resin, and a triphenylmethane type phenol resin, for example. The phenol resin may be a copolymer composed of 2 or more of the above. As a commercially available product of the phenol resin, for example, Tamanol 758 manufactured by Arakawa Chemical Industries, Ltd., or HP-850N manufactured by Hitachi Chemical Co., Ltd., can be used.
The phenol novolac resin may be, for example, a resin obtained by condensing or co-condensing a phenol and/or a naphthol with an aldehyde under an acidic catalyst. The phenol constituting the phenol novolac resin may be at least one selected from the group consisting of phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, bisphenol F, phenylphenol, and aminophenol, for example. The naphthol constituting the phenol novolac resin may be at least one selected from the group consisting of α -naphthol, β -naphthol, and dihydroxynaphthalene, for example. The aldehyde constituting the phenol novolac resin may be at least one selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde, for example. As a commercially available product of phenol novolac resin, there may be mentioned, for example, HF-3M, MEW-1800 manufactured by Meiwa plastics Industries, Ltd.
The curing agent may be a compound having 2 phenolic hydroxyl groups in 1 molecule, for example. The compound having 2 phenolic hydroxyl groups in 1 molecule may be, for example, at least one selected from the group consisting of resorcinol, catechol, bisphenol a, bisphenol F, and substituted or unsubstituted biphenol.
The resin composition may contain one of the above-mentioned phenol resins. The resin composition may further include a plurality of the above phenol resins. The resin composition may contain one of the above curing agents. The resin composition may contain a plurality of curing agents as described above.
The ratio of the active group (phenolic OH group) in the curing agent that reacts with the epoxy group in the epoxy resin may be preferably 0.5 to 1.5 equivalents, more preferably 0.6 to 1.4 equivalents, and still more preferably 0.8 to 1.2 equivalents, with respect to 1 equivalent of the epoxy group in the epoxy resin. When the ratio of active groups in the curing agent is less than 0.5 equivalent, it is difficult to obtain a sufficient elastic modulus of the obtained cured product. On the other hand, when the ratio of the active groups in the curing agent exceeds 1.5 equivalents, the mechanical strength of the molded article formed of the composite after curing tends to be lowered. However, even when the ratio of the active groups in the curing agent is outside the above range, the effects of the present invention can be obtained.
The curing accelerator (catalyst) is not limited as long as it is a composition that, for example, reacts with an epoxy resin to accelerate curing of the epoxy resin. The curing accelerator may be, for example, an imidazole such as alkyl-substituted imidazole or benzimidazole. The resin composition may be provided with a curing accelerator. The resin composition may be provided with a plurality of curing accelerators. By containing a curing accelerator in the resin composition, the moldability and releasability of the composite can be easily improved. Further, by containing a curing accelerator in the resin composition, the mechanical strength of a molded article (for example, an electronic component) produced using the composite is improved, or the storage stability of the composite in a high-temperature/high-humidity environment is improved. As commercially available products of imidazole-based curing accelerators, for example, at least one selected from the group consisting of 2MZ-H, C11Z, C17Z, 1, 2DMZ, 2E4MZ, 2PZ-PW, 2P4MZ, 1B2MZ, 1B2PZ, 2MZ-CN, C11Z-CN, 2E4MZ-CN, 2PZ-CN, C11Z-CNS, 2P4MHZ, TPZ and SFZ (above, trade name manufactured by Shikoku Chemicals Corporation) can be used. As the curing accelerator (catalyst), for example, a urea-based catalyst can be used. Examples of commercially available urea catalysts include U-CAT3512T manufactured by San-Apro Ltd.
The amount of the curing accelerator to be blended is not particularly limited as long as the curing accelerator can obtain a curing accelerating effect. However, from the viewpoint of improving curability and fluidity of the resin composition upon moisture absorption, the amount of the curing accelerator to be blended may be preferably 0.1 part by mass or more and 30 parts by mass or less, and more preferably 1 part by mass or more and 15 parts by mass or less, with respect to 100 parts by mass of the epoxy resin. The content of the curing accelerator is preferably 0.001 to 5 parts by mass based on 100 parts by mass of the total of the mass of the epoxy resin and the curing agent (for example, phenol resin). When the blending amount of the curing accelerator is less than 0.1 part by mass, it is difficult to obtain a sufficient curing accelerating effect. When the blending amount of the curing accelerator exceeds 30 parts by mass, the storage stability of the composite is liable to be lowered. However, the effects of the present invention can be obtained even when the blending amount and content of the curing accelerator are out of the above ranges.
The resin composition contains a compound having a siloxane bond (siloxane compound). The siloxane bond is a bond comprising 2 silicon atoms (Si) and 1 oxygen atom (O), and may be represented by-Si-O-Si-. The compound having a siloxane bond may be a polysiloxane compound. The resin composition may contain one kind of silicone compound, or may contain a plurality of kinds of silicone compounds. From the viewpoint that the molding shrinkage of the composite is likely to decrease and the heat resistance and the voltage resistance of the molded article are likely to be improved, the resin composition preferably contains a1 st siloxane compound described later as the siloxane compound. The resin composition may contain only the 1 st siloxane compound as the siloxane compound, or may further contain the 2 nd siloxane compound. The resin composition may contain both the 1 st siloxane compound and the 2 nd siloxane compound. The resin composition may contain a siloxane compound other than the 1 st siloxane compound and the 2 nd siloxane compound. The details of the 1 st and 2 nd siloxane compounds will be described below.
The 1 st siloxane compound may have a structural unit represented by the following chemical formula (1). A structural unit can be simply referred to as a "structure". The structural unit represented by the following chemical formula (1) may be referred to as "structural unit 1".
In the chemical formula (1), n is an integer of 2 to 200, R1And R2Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms.
Multiple R's present in the 1 st siloxane compound1May be the same as or different from each other. Multiple R's present in the 1 st siloxane compound2May be the same as or different from each other. R1And R2May be the same as or different from each other. The 1 st siloxane compound may have a repeating unit represented by the above chemical formula (1).
From the viewpoint that the molding shrinkage of the composite is likely to decrease and the heat resistance and the voltage resistance of the molded article are likely to be improved, the 1 st siloxane compound preferably further has a structural unit represented by the following chemical formula (2). The structural unit represented by the following chemical formula (2) may be referred to as "structural unit 2".
In the above chemical formula (2), R3Is an alkylene group having 1 to 10 carbon atoms.
The 1 st siloxane compound may have a plurality of structural units 2. Multiple R's present in the 1 st siloxane compound3May be the same as or different from each other. The 1 st siloxane compound may have a repeating unit represented by the above chemical formula (2).
The 1 st siloxane compound is preferably a compound represented by the following chemical formula (3) from the viewpoint that the molding shrinkage of the composite is easily reduced and the heat resistance and the voltage resistance of the molded article are easily improved. The compound represented by the following chemical formula (3) may be referred to as "compound 3".
In the above chemical formula (3), n is 2 to EAn integer of 200. m is1And m2Each independently is an integer of 1 to 200. R4、R5、R6And R7Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms. R8And R9Each independently an alkylene group having 1 to 10 carbon atoms. R10And R11Each independently is a C1-10 valent hydrocarbon group that may contain an ether structure. R10And R11Each of which is independently a 2-valent hydrocarbon group having 1 to 10 carbon atoms and which may contain an oxygen atom or may be bonded via an oxygen atom.
Plural R's present in Compound 34May be the same as or different from each other. Plural R's present in Compound 35May be the same as or different from each other. R4、R5、R6And R7May be the same as or different from each other. Plural R's present in Compound 38May be the same as or different from each other. Plural R's present in Compound 39May be the same as or different from each other. R8And R9May be the same as or different from each other. The weight average molecular weight (Mw) of the compound 3 may be, for example, 4000 to 20000.
Commercially available products of Compound 3 include, for example, DBL-C31 and DBL-C32 manufactured by Gelest, Inc.
The 2 nd siloxane compound preferably has a structural unit represented by the following chemical formula (4) and a structural unit represented by the following chemical formula (5) from the viewpoint that the molding shrinkage of the composite is easily reduced and the heat resistance and the voltage resistance of the molded article are easily improved. The structural unit represented by the following chemical formula (4) may be referred to as "structural unit 4". The structural unit represented by the following chemical formula (5) may be referred to as "structural unit 5".
In the above chemical formula (4), R12Is a C1-12 hydrocarbon group. R17An organic group having 1 or more carbon atoms.
R12Examples of the alkyl group include methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl groups; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R12Preferably methyl or phenyl.
The 2 nd siloxane compound may have a plurality of structural units 4. Multiple R's present in the 2 nd siloxane compound12May be the same as or different from each other. The 2 nd siloxane compound may have a repeating unit represented by the above chemical formula (4).
In the above chemical formula (5), R13And R14Each independently is a C1-12 hydrocarbon group.
R13Examples of the alkyl group include methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl groups; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R13Preferably methyl or phenyl.
R14Examples of the alkyl group include methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl groups; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R14Preferably methyl or phenyl.
The 2 nd siloxane compound may have a plurality of structural units 5. Multiple R's present in the 2 nd siloxane compound13May be the same as or different from each other. Multiple R's present in the 2 nd siloxane compound14May be the same as or different from each other. R13And R14May be the same as or different from each other. The 2 nd siloxane compound may have a repeating unit represented by the above chemical formula (5).
From the viewpoint of storage stability of the 2 nd siloxane compound, the terminal of the molecule of the 2 nd siloxane compound is preferably R12、R13、R14Any one of a hydroxyl group and an alkoxy group. Alkoxy can be, for example, methoxy, ethoxy, propoxy or butoxy.
The 2 nd siloxane compound preferably has a structural unit represented by the following chemical formula (6) from the viewpoint that the molding shrinkage of the composite is easily reduced and the heat resistance and the voltage resistance of the molded article are easily improved. The structural unit represented by the following chemical formula (6) may be referred to as "structural unit 6".
In the above chemical formula (6), R15Is a C1-12 hydrocarbon group. R16Is a 1-valent organic group having an epoxy group.
R15Examples of the alkyl group include methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl groups; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R13Preferably methyl or phenyl.
R16Examples thereof include 2, 3-epoxypropyl group, 3, 4-epoxybutyl group, 4, 5-epoxypentyl group, 2-epoxypropoxyethyl group, 3-epoxypropoxypropyl group, 4-epoxypropoxybutyl group, 2- (3, 4-epoxycyclohexyl) ethyl group, and 3- (3, 4-epoxycyclo groupHexyl) propyl, and the like. R16Preferably 3-glycidoxypropyl.
The 2 nd siloxane compound may have a plurality of structural units 6. Multiple R's present in the 2 nd siloxane compound15May be the same as or different from each other. Multiple R's present in the 2 nd siloxane compound16May be the same as or different from each other. The 2 nd siloxane compound may have a repeating unit represented by the above chemical formula (6).
From the viewpoint that the molding shrinkage of the composite is easily reduced and the heat resistance and the voltage resistance of the molded article are easily improved, the 2 nd siloxane compound is preferably a compound having at least 1 structural unit selected from the group consisting of a structural unit represented by the following chemical formula (7), a structural unit represented by the following chemical formula (8), a structural unit represented by the following chemical formula (9), and a structural unit represented by the following chemical formula (10). The structural unit represented by the following chemical formula (7) may be referred to as "structural unit 7". The structural unit represented by the following chemical formula (8) may be referred to as "structural unit 8". The structural unit represented by the following chemical formula (9) may be referred to as "structural unit 9". The structural unit represented by the following chemical formula (10) may be referred to as "structural unit 10". A compound having at least 1 structural unit selected from the group consisting of structural unit 7, structural unit 8, structural unit 9, and structural unit 10 described above is sometimes referred to as "compound 11". Compound 11 may have all of structural unit 7, structural unit 8, structural unit 9, and structural unit 10.
In the above chemical formula (9), R18An organic group having 1 or more carbon atoms.
In the above chemical formula (10), R19Is an organic group having 1 or more carbon atoms。
Compound 11 may have a plurality of structural units 7. Compound 11 may have a repeating unit represented by the above chemical formula (7). Compound 11 may have a plurality of structural units 8. Compound 11 may have a repeating unit represented by the above chemical formula (8). Compound 11 may have a plurality of structural units 9. Compound 11 may have a repeating unit represented by the above chemical formula (9). Compound 11 may have a plurality of structural units 10. Compound 11 may have a repeating unit represented by the above chemical formula (10).
A commercially available product of Compound 11 can be, for example, AY42-119 manufactured by Dow Corning Toray Co., Ltd.
The 2 nd siloxane compound may have an epoxy equivalent of 500 or more and 4000 or less or 1000 or more and 2500 or less. When the epoxy equivalent is within the above range, the fluidity of the composite is easily improved and the moldability is easily improved.
The softening point of the 2 nd siloxane compound is preferably 40 ℃ or higher and 120 ℃ or lower, and more preferably 50 ℃ or higher and 100 ℃ or lower. When the softening point is within the above range, the mechanical strength of the molded article formed of the composite is easily improved. The softening point of the 2 nd siloxane compound can be adjusted depending on the molecular weight, structure (for example, content ratio of each structural unit), kind of organic group bonded to silicon atom, and the like of the 2 nd siloxane compound. From the viewpoint of improving the fluidity of the composite, it is preferable to adjust the softening point according to the content of the aryl group in the 2 nd siloxane compound. The aryl group may be, for example, phenyl, tolyl, xylyl, naphthyl, biphenyl, or the like. Aryl is preferably phenyl. More preferably, the softening point is adjusted according to the content of phenyl groups in the 1-valent organic group bonded to the silicon atom in the 2 nd siloxane compound. The content of the phenyl group may be adjusted to preferably 60 mol% or more and 100 mol% or less, and more preferably 70 mol% or more and 85 mol% or less.
The weight average molecular weight (Mw) of the 2 nd siloxane compound may be 1000 or more and 30000 or less, preferably 2000 or more and 20000 or less, more preferably 3000 or more and 10000 or less. The weight average molecular weight (Mw) may be measured by Gel Permeation Chromatography (GPC), or may be a value converted using a standard polystyrene calibration curve. The 2 nd siloxane compound is preferably a random copolymer.
The resin composition may contain one or more of the above-described silicone compounds.
The coupling agent improves the adhesion between the resin composition and the metal element-containing particles constituting the metal element-containing powder, and improves the flexibility and mechanical strength of the molded article formed of the composite. The coupling agent may be at least one selected from the group consisting of a silane-based compound (silane coupling agent), a titanium-based compound, an aluminum compound (aluminum chelate), and an aluminum/zirconium-based compound, for example. The silane coupling agent may be at least one selected from the group consisting of epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, acid anhydride silane, and vinyl silane, for example. Particularly, an aminophenyl-based silane coupling agent is preferable. The resin composition may contain one or more of the above coupling agents.
The compound may contain a flame retardant for the purpose of environmental safety, recyclability, molding processability and low cost of the compound. The flame retardant may be at least one selected from the group consisting of a bromine-based flame retardant, a bulb (bulb) flame retardant, a hydrated metal compound-based flame retardant, a silicone-based flame retardant, a nitrogen-containing compound, a hindered amine compound, an organic metal compound, and an aromatic engineering plastic, for example. The resin composition may contain one or more of the above flame retardants.
When a molded body is formed from the composite using a mold, the resin composition may contain wax. The wax improves the fluidity of the composite at the time of molding (for example, transfer molding) of the composite, and functions as a release agent. The wax may be at least one of a fatty acid such as a higher fatty acid and a fatty acid ester.
The wax may be, for example, at least one selected from the group consisting of: fatty acids such as montanic acid, stearic acid, 12-hydroxystearic acid (12-oxystearic acid) and lauric acid, and esters thereof; fatty acid salts such as zinc stearate, calcium stearate, barium stearate, aluminum stearate, magnesium stearate, calcium laurate, zinc linoleate, calcium ricinoleate, zinc 2-ethylhexanoate and the like; fatty acid amides such as stearic acid amide, oleic acid amide, erucic acid amide, behenic acid amide, palmitic acid amide, lauric acid amide, hydroxystearic acid amide, methylene bis stearic acid amide, ethylene bis lauric acid amide, distearyl adipic acid amide, ethylene bis oleic acid amide, dioleyl adipic acid amide, N-stearyl stearic acid amide, N-oleyl stearic acid amide, N-stearyl erucic acid amide, hydroxymethyl stearic acid amide, and hydroxymethyl behenic acid amide; fatty acid esters such as butyl stearate; alcohols such as ethylene glycol and stearyl alcohol; polyethers containing polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and modified products thereof; silicone compounds such as silicone oil and silicone grease; fluorine compounds such as fluorine-based oils, fluorine-based greases, and fluorine-containing resin powders; and waxes such as paraffin wax, polyethylene wax, amide wax, polypropylene wax, ester wax, carnauba (carnauba), and microcrystalline wax (micro wax). Examples of commercially available montanic acid esters include LICOWAX-OP manufactured by Clariant Chemicals co. For example, Carnauba wax No.1 manufactured by CERARICA NODA Co., Ltd. is a commercially available product of a natural wax.
Examples of the release agent include metal soaps formed by bonding long-chain fatty acids such as montanic acid, stearic acid, 12-hydroxystearic acid, and lauric acid to metals. Examples of commercially available metal soaps include Powder Base L manufactured by NOF CORPORATION.
(Metal element-containing powder)
The metal element-containing powder (metal element-containing particles) may contain at least one selected from the group consisting of metal monomers, alloys, and metal compounds, for example. The metal element-containing powder may contain, for example, at least one selected from the group consisting of a metal monomer, an alloy, and a metal compound. The alloy may include at least one selected from the group consisting of a solid solution, a eutectic, and an intermetallic compound. The alloy may be, for example, stainless steel (e.g., Fe-Cr alloy, Fe-Ni-Cr alloy, etc.). The metal compound may be, for example, an oxide such as ferrite. The metal element-containing powder may contain one metal element or a plurality of metal elements. The metal element contained in the metal element-containing powder may be, for example, a base metal element, a noble metal element, a transition metal element, or a rare earth element. The composite may contain one kind of metal-containing powder, or may contain a plurality of kinds of metal-containing powders having different compositions.
The powder containing the metal element is not limited to the above composition. The metal element contained in the metal element-containing powder may be, for example, at least one selected from the group consisting of iron (Fe), copper (Cu), titanium (Ti), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), aluminum (Al), tin (Sn), chromium (Cr), barium (Ba), strontium (Sr), lead (Pb), silver (Ag), praseodymium (Pr), neodymium (Nd), samarium (Sm), and dysprosium (Dy). The metal element-containing powder may further contain an element other than the metal element. The elemental metal-containing powder may contain, for example, oxygen (O), beryllium (Be), phosphorus (P), boron (B), or silicon (Si). The metal element-containing powder may be a magnetic powder. The powder containing the metallic element may be a soft magnetic alloy or a ferromagnetic alloy. The metal element-containing powder may be, for example, a magnetic powder selected from at least one of the group consisting of an Fe — Si-based alloy, an Fe — Si — Al-based alloy (Sendust), an Fe — Ni-based alloy (Permalloy), an Fe — Cu — Ni-based alloy (Permalloy), an Fe — Co-based alloy (iron cobalt alloy (permandr)), an Fe — Cr — Si-based alloy (electromagnetic stainless steel), an Nd — Fe — B-based alloy (rare earth magnet), an Sm — Fe — N-based alloy (rare earth magnet), an Al — Ni — Co-based alloy (alnico magnet), and a ferrite. The ferrite may be, for example, spinel ferrite, hexagonal ferrite or garnet ferrite. The metal element-containing powder may Be a copper alloy such as a Cu-Sn alloy, a Cu-Sn-P alloy, a Cu-Ni alloy, or a Cu-Be alloy. The powder containing a metal element may contain one of the elements and the composition, or may contain a plurality of the elements and the composition.
The metal element-containing powder may also be Fe monomer. The powder containing the metal element may be an alloy containing iron (Fe-based alloy). The Fe-based alloy may be, for example, an Fe-Si-Cr-based alloy or an Nd-Fe-B-based alloy. The metal element-containing powder may be at least one of amorphous iron powder and carbonyl iron powder. When the metal element-containing powder contains at least either of Fe alone and an Fe-based alloy, a compact having a high space factor (space factor) and excellent magnetic properties can be easily produced from the composite. The powder containing the metal element may be an Fe amorphous alloy. As a commercial product of the Fe amorphous alloy powder, for example, at least one selected from the group consisting of AW2-08, kuumet-6B 2, kuumet 9a4-II (trade name manufactured by Epson Atmix Corporation, above), DAP MS3, DAP MS7, DAP MSA10, DAP PB, DAP PC, DAP MKV49, DAP 410L, DAP 430L, DAP HYB series (trade name manufactured by Daido Steel co., ltd., above), MH45D, MH28D, MH25D, and MH20D (trade name manufactured by Kobe Steel, ltd., above) can be used.
< method for producing composite >
In the production of the composite, the metal element-containing powder and the resin composition (each component constituting the resin composition) are mixed while heating. For example, the metal element-containing powder and the resin composition may be kneaded by a kneader, a roll, a stirrer, or the like while being heated. The resin composition is attached to a part or the whole of the surface of the metal element-containing particles constituting the metal element-containing powder by heating and mixing the metal element-containing powder and the resin composition, thereby coating the metal element-containing particles, and a part or the whole of the epoxy resin in the resin composition becomes a semi-cured product. As a result, a complex was obtained. The composite may also be obtained by further adding wax to the powder obtained by heating and mixing the metal element-containing powder and the resin composition. The resin composition and the wax may be mixed in advance.
In the kneading, a powder containing a metal element, a curing agent such as a siloxane compound, an epoxy resin, or a phenol resin, a curing accelerator, and a coupling agent may be kneaded in a tank. The metal element-containing powder, the siloxane compound, and the coupling agent may be put into a tank and mixed, and then the epoxy resin, the curing agent, and the curing accelerator may be put into the tank and the raw materials in the tank may be kneaded. After the silicone compound, the epoxy resin, the curing agent, and the coupling agent are kneaded in the tank, the curing accelerator may be put into the tank, and the raw materials in the tank may be further kneaded. A mixed powder of an epoxy resin, a curing agent, and a curing accelerator (resin mixed powder) may be prepared in advance, and then the metal element-containing powder, the siloxane compound, and the coupling agent may be kneaded to prepare a metal mixed powder, and then the metal mixed powder and the resin mixed powder may be kneaded.
The kneading time depends on the type of kneading machine, the volume of the kneading machine, and the amount of the composite produced, and is, for example, preferably 1 minute or more, more preferably 2 minutes or more, and still more preferably 3 minutes or more. The kneading time is preferably 20 minutes or less, more preferably 15 minutes or less, and still more preferably 10 minutes or less. When the kneading time is less than 1 minute, kneading is insufficient to impair moldability of the composite, and the degree of curing of the composite varies. When the kneading time exceeds 20 minutes, for example, the resin composition (for example, an epoxy resin or a phenol resin) is cured in the tank, and the fluidity and moldability of the composite are easily impaired. When the raw materials in the tank are kneaded by a kneader while being heated, the heating temperature may be, for example, a temperature at which a semi-cured product of the epoxy resin (B-stage epoxy resin) is produced and the production of a cured product of the epoxy resin (C-stage epoxy resin) is suppressed. The heating temperature may also be a temperature lower than the activation temperature of the curing accelerator. The heating temperature is, for example, preferably 50 ℃ or higher, more preferably 60 ℃ or higher, and still more preferably 70 ℃ or higher. The heating temperature is preferably 150 ℃ or lower, more preferably 120 ℃ or lower, and still more preferably 110 ℃ or lower. When the heating temperature is within the above range, the resin composition in the tank is softened and easily coats the surfaces of the metal element-containing particles constituting the metal element-containing powder, so that a semi-solidified material of the epoxy resin is easily produced, and complete curing of the epoxy resin during kneading is easily suppressed.
< shaped article >
The molded body of the present embodiment may include the composite. The molded article may contain at least one selected from the group consisting of an uncured resin composition, a semi-cured product of a resin composition (a resin composition in stage B), and a cured product of a resin composition (a resin composition in stage C). The molded article may be a cured product of the composite.
< method for producing molded article >
The method for producing a molded article according to the present embodiment may include a step of pressing the composite in a mold. The method for producing the molded article may include only the step of pressing the composite in the mold, or may include other steps in addition to the step. The method for producing a molded body may further include a first step, a second step, and a third step. The details of each step will be described below.
In the first step, a composite is produced by the above method.
In the second step, a molded body (a B-stage molded body) is obtained by pressing the composite in a mold. Here, the resin composition is filled between the particles of the respective metal-containing elements constituting the metal-containing powder. The resin composition functions as a binder (binding agent) to bind the metal element-containing particles to each other.
As the second step, transfer molding of the composite may be performed. In the transfer molding, the composite may be pressurized at a pressure of 5MPa or more and 50MPa or less. The higher the molding pressure, the more easily a molded article having excellent mechanical strength tends to be obtained. In consideration of mass productivity of the molded body and the life of the mold, the molding pressure is preferably 8MPa or more and 20MPa or less. The density of the molded article formed by transfer molding may be preferably 75% or more and 86% or less, more preferably 80% or more and 86% or less, with respect to the true density of the composite. When the density of the molded body is 75% or more and 86% or less, a molded body excellent in mechanical strength is easily obtained. In the transfer molding, the second step and the third step may be performed in a lump.
In the third step, the compact is solidified by heat treatment to obtain a C-stage compact. Since the compound of the present embodiment contains a silicone compound which is one of the elastomers, the elasticity of the entire compound is reduced, and the stress acting on the compound due to the molding shrinkage (heat curing) of the compound is reduced. As a result, the molding shrinkage of the composite decreases in the process of forming a molded body by thermosetting the composite. As described above, the mechanism is not clear, but since the compound of the present embodiment contains a predetermined amount of a silicone compound which is one of elastomers, the heat resistance and the voltage resistance of the molded article obtained from the compound are improved. The temperature of the heat treatment may be a temperature at which the resin composition in the molded body is sufficiently cured. The temperature of the heat treatment may be preferably 100 ℃ or more and 300 ℃ or less, and more preferably 110 ℃ or more and 250 ℃ or less. In order to suppress oxidation of the metal element-containing powder in the compact, it is preferable to perform the heat treatment under an inert atmosphere. When the heat treatment temperature exceeds 300 ℃, the metal element-containing powder is oxidized or the cured resin is deteriorated due to a trace amount of oxygen inevitably contained in the heat treatment atmosphere. The holding time of the heat treatment temperature may be preferably several minutes or more and 10 hours or less, and more preferably 3 minutes or more and 8 hours or less, in order to suppress oxidation of the metal element-containing powder and deterioration of the cured resin and to sufficiently cure the resin composition.
Examples
The present invention will be described in further detail below with reference to examples and comparative examples, but the present invention is not limited to these examples.
(example 1)
[ preparation of the Complex ]
50g of biphenylene aralkyl type epoxy resin, 50g of polyfunctional epoxy resin, 14.5g of phenol novolac resin 1 (curing agent), 23.6g of phenol novolac resin 2 (curing agent), 5.9g of urea catalyst (curing accelerator), 7.5g of zinc laurate type metal soap (mold release agent), 2.0g of montanic acid ester (mold release agent (wax)), and 4.0g of natural wax (mold release agent (wax)) were charged into a plastic (poly) container. The resin mixture was prepared by mixing these raw materials in a plastic container for 10 minutes. The resin mixture corresponds to all the components of the resin composition excluding the siloxane compound and the coupling agent.
As the biphenylene aralkyl type epoxy resin, NC-3000 manufactured by Nippon Kayaku co.
VG-3101L manufactured by Printec Corporation was used as the polyfunctional epoxy resin.
As the phenol novolak resin 1, HF-3M manufactured by Meiwa plastics Industries, Ltd.
As the phenol novolac resin 2, MEW-1800 manufactured by Meiwa Plastic Industries, ltd.
As the urea catalyst, U-CAT3512T manufactured by San-Apro Ltd.
As the zinc laurate-based metal soap, Powder Base L manufactured by NOF CORPORATION was used.
As montanic acid ester, LICOWAX-OP manufactured by Clariant Chemicals co.
As the natural wax, Carnauba wax No.1 manufactured by cerarcica NODA co.
Amorphous iron powder 1 and amorphous iron powder 2 were uniformly mixed for 5 minutes by a pressure double-shaft kneader (Nihon screw Manufacturing co., ltd., capacity 5L) to prepare 3741g of metal element-containing powder. The content of the amorphous iron powder 1 in the metal element-containing powder was 82 mass%. The content of the amorphous iron powder 2 in the metal element-containing powder was 18 mass%. To the metal element-containing powder in the biaxial kneader were added 1.9g of methacryloyloxyoctyltrimethoxysilane (coupling agent), 1.9g of 3-mercaptopropyltrimethoxysilane (coupling agent), and 15g of caprolactone-modified dimethylsilicone (compound having siloxane bond). Then, the contents of the biaxial kneader were heated to 90 ℃ and mixed for 10 minutes while maintaining the temperature. Then, the resin mixture was added to the contents of the biaxial kneader, and the contents were melted/kneaded for 15 minutes while maintaining the temperature of the contents at 120 ℃. After the kneaded product obtained by the above melting/kneading is cooled to room temperature, the kneaded product is pulverized by a hammer into a kneaded product having a predetermined particle size. The term "melt" as used herein means the melting of at least a part of the resin composition in the contents of the biaxial kneader. The metal element-containing powder in the composite does not melt during the preparation of the composite.
As the amorphous iron powder 1, KUAMET 9A4-II 053C03 (average particle diameter 24 μm) manufactured by Epson Atmix Corporation was used.
As the amorphous iron powder 2, AW2-08 (average particle diameter 5.3 μm) manufactured by Epson Atmix Corporation was used.
KBM-5803, manufactured by Shin-Etsu Chemical Co., Ltd., was used as methacryloyloxyoctyltrimethoxysilane.
As 3-mercaptopropyltrimethoxysilane, KBM-803 manufactured by Shin-Etsu Chemical Co., Ltd.
As the caprolactone-modified dimethylsilicone, DBL-C32 manufactured by Gelest, inc. The caprolactone-modified dimethylsilicone is a compound represented by the above chemical formula (3).
The compound of example 1 was prepared by the above method. The content of the metal element-containing powder in the composite was 95.5 mass%.
(other examples and comparative examples)
Compounds of other examples and comparative examples were prepared in the same manner as in example 1, except that the raw material formulation was changed as shown in table 1. Evaluation on the composites of each example was performed in the same manner as in example 1. KBM-403 shown in Table 1 is 3-glycidoxypropyltrimethoxysilane prepared by Shin-Etsu Chemical Co., Ltd.
[ evaluation ]
The following evaluations were performed using the composites of the examples and comparative examples. The results are shown in Table 1.
(evaluation of Heat resistance: 250 ℃ C. bending test)
Test pieces were obtained by transfer molding the compounds of examples and comparative examples at a mold temperature of 175 ℃, a molding pressure of 13.5MPa, and a curing time of 360 seconds, and then post-curing (post cure) at 175 ℃ for 5.5 hours. The test piece had dimensions of 80mm in vertical width, 10mm in horizontal width and 3.0mm in thickness.
The test piece was subjected to a 3-point support type bending test using an Autograph with a thermostatic bath. AGS-500A manufactured by Shimadzu Corporation was used as the Autograph. The temperature of the thermostatic bath was 250 ℃. In the bending test, one of the faces of the test piece was supported by 2 fulcrums. A load was applied to the other surface of the test piece at a central position between 2 supporting points. The load when the test piece was broken was measured. The bending test was carried out under the following measurement conditions.
Distance Lv between 2 fulcrums: 64.0 +/-0.5 mm
Head speed (head speed): 2.0. + -. 0.2 mm/min
Chart speed (chart speed): 100 mm/min
Chart full scale (chart full scale): 490N (50kgf)
The bending strength σ (unit: MPa) was calculated from the following equation (A). The flexural modulus E (unit: GPa) was calculated from the following equation (B). The bending elongation ε (unit:%) was calculated from the following numerical formula (C). In the following numerical expression, "P" represents the load (unit: N) when the test piece is broken. "Lv" is the distance (unit: mm) between 2 fulcrums. "W" represents the lateral width (unit: mm) of the test piece. "t" is the thickness (unit: mm) of the test piece. "F/Y" is the slope (unit: N/mm) of the straight line portion of the load-deflection curve. "s" is the deflection (unit: mm) of the test piece immediately before the test piece is broken.
σ＝(3×P×Lv)/(2×W×t2) (A)
E＝[Lv3/(4×W×t3)]×(F/Y) (B)
ε＝(600×s×t)/Lv2 (C)
(evaluation of Voltage resistance: Voltage resistance test)
The composite materials of the examples and comparative examples were transfer-molded at a mold temperature of 175 ℃, a molding pressure of 13.5MPa, and a curing time of 360 seconds, and then post-cured at 175 ℃ for 5.5 hours, to thereby prepare test pieces having a thickness of 2.0 mm.
In the withstand voltage test, a stainless steel plate to which a ground wire is connected, a conductive rubber plate, a test piece, and a stainless steel electrode having a diameter of 10mm to which a high-voltage wire is connected are disposed in this order on an insulating plate. The high-voltage wire and the grounding wire are respectively connected to a high-voltage output terminal and a grounding terminal of the high-voltage amplifier. The waveform output of the function generator is inputted to a high-voltage amplifier, and a test voltage is generated so as to be boosted at a rate of 10V per second from 0V to 2000V at maximum, and applied to a test piece. The voltage at the time when the current passed through the test piece exceeded 10mA was read. Next, stainless steel electrodes were disposed at different positions on the test piece, and a voltage was similarly applied. The test piece was repeatedly subjected to the above-described operation a predetermined number of times, and the average value of the read voltages was defined as the withstand voltage (insulation breakdown voltage: V/mm) of the test piece.
[ Table 1]
Industrial applicability
The composite of the present invention can provide a molded article having both heat resistance and voltage resistance, and therefore has a high industrial value.
Claims (6)
1. A composite comprising a metal element-containing powder and a resin composition,
the resin composition contains an epoxy resin and a compound having a siloxane bond,
the content of the compound having a siloxane bond is 20 parts by mass or less per 100 parts by mass of the epoxy resin,
the compound having a siloxane bond includes a siloxane compound having a structure represented by the following chemical formula (1),
in the chemical formula (1), n is an integer of 2-200, R1And R2Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms,An alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms.
2. The composite according to claim 1, wherein,
the siloxane compound further has a structural unit represented by the following chemical formula (2),
in the chemical formula (2), R3Is an alkylene group having 1 to 10 carbon atoms.
3. The compound according to claim 1 or 2, comprising a compound represented by the following chemical formula (3) as the siloxane compound,
in the chemical formula (3), n is an integer of 2-200, and m1And m2Each independently an integer of 1 to 200, R4、R5、R6And R7Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group or a polyalkylene ether group having 3 to 500 carbon atoms, R8And R9Each independently an alkylene group having 1 to 10 carbon atoms, R10And R11Each independently is a C1-10 valent hydrocarbon group that may contain an ether structure.
4. The composite according to any one of claims 1 to 3, comprising at least one of a biphenylene aralkyl type epoxy resin and an isocyanate modified epoxy resin as the epoxy resin.
5. The complex according to any one of claims 1 to 4,
the content of the metal element-containing powder is 90 mass% or more and less than 100 mass%.
6. A shaped body provided with the composite according to any one of claims 1 to 5.
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| JP2019219060 | 2019-12-03 | ||
| JP2019-219060 | 2019-12-03 | ||
| PCT/JP2020/044901 WO2021112135A1 (en) | 2019-12-03 | 2020-12-02 | Compound and molded object |
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| CN114402030A true CN114402030A (en) | 2022-04-26 |
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| CN202080065528.0A Pending CN114402030A (en) | 2019-12-03 | 2020-12-02 | Composite and molded article |
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| JP (1) | JPWO2021112135A1 (en) |
| KR (1) | KR20220111255A (en) |
| CN (1) | CN114402030A (en) |
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| US20230331980A1 (en) * | 2020-10-05 | 2023-10-19 | Sumitomo Bakelite Co., Ltd. | Resin molding material, molded product, and method for producing molded product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1167513A (en) * | 1997-08-11 | 1999-03-09 | Seiko Epson Corp | Rare earth bonded magnet |
| JP2010138384A (en) * | 2008-11-12 | 2010-06-24 | Hitachi Chem Co Ltd | Encapsulating liquid epoxy resin composition, electronic component device including element encapsulated with the encapsulating liquid epoxy resin composition, and wafer level chip size package |
| CN109971122A (en) * | 2011-05-13 | 2019-07-05 | 日立化成株式会社 | Epoxy resin molding material for encapsulation and electronic part apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06163225A (en) * | 1992-11-20 | 1994-06-10 | Sumitomo Metal Mining Co Ltd | Composition for bond magnet and bond magnet |
| JP6159512B2 (en) | 2012-07-04 | 2017-07-05 | 太陽誘電株式会社 | Inductor |
| CN104371617A (en) * | 2013-08-12 | 2015-02-25 | 何书凤 | Production method of glue for filling casting slits |
| KR20230145239A (en) * | 2018-05-31 | 2023-10-17 | 가부시끼가이샤 레조낙 | Composition and molded object |
-
2020
- 2020-12-02 CN CN202080065528.0A patent/CN114402030A/en active Pending
- 2020-12-02 WO PCT/JP2020/044901 patent/WO2021112135A1/en active Application Filing
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- 2020-12-02 JP JP2021562690A patent/JPWO2021112135A1/ja active Pending
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1167513A (en) * | 1997-08-11 | 1999-03-09 | Seiko Epson Corp | Rare earth bonded magnet |
| JP2010138384A (en) * | 2008-11-12 | 2010-06-24 | Hitachi Chem Co Ltd | Encapsulating liquid epoxy resin composition, electronic component device including element encapsulated with the encapsulating liquid epoxy resin composition, and wafer level chip size package |
| CN109971122A (en) * | 2011-05-13 | 2019-07-05 | 日立化成株式会社 | Epoxy resin molding material for encapsulation and electronic part apparatus |
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| JPWO2021112135A1 (en) | 2021-06-10 |
| KR20220111255A (en) | 2022-08-09 |
| WO2021112135A1 (en) | 2021-06-10 |
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