CN114395284A - Putty powder and preparation method and application thereof - Google Patents
Putty powder and preparation method and application thereof Download PDFInfo
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- CN114395284A CN114395284A CN202210047777.8A CN202210047777A CN114395284A CN 114395284 A CN114395284 A CN 114395284A CN 202210047777 A CN202210047777 A CN 202210047777A CN 114395284 A CN114395284 A CN 114395284A
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- putty powder
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- 239000000843 powder Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000000839 emulsion Substances 0.000 claims abstract description 21
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 10
- -1 alkoxy silane Chemical compound 0.000 claims abstract description 9
- 239000006172 buffering agent Substances 0.000 claims abstract description 8
- 239000011863 silicon-based powder Substances 0.000 claims abstract description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 6
- 239000000440 bentonite Substances 0.000 claims abstract description 6
- 229910000278 bentonite Inorganic materials 0.000 claims abstract description 6
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910000077 silane Inorganic materials 0.000 claims abstract description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000001913 cellulose Substances 0.000 claims description 6
- 229920002678 cellulose Polymers 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- 239000000872 buffer Substances 0.000 claims description 5
- 229920001909 styrene-acrylic polymer Polymers 0.000 claims description 5
- 239000013530 defoamer Substances 0.000 claims description 4
- 239000000080 wetting agent Substances 0.000 claims description 4
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 3
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000011575 calcium Substances 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 3
- 239000001923 methylcellulose Substances 0.000 claims description 3
- 235000010981 methylcellulose Nutrition 0.000 claims description 3
- 229920002401 polyacrylamide Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 150000001718 carbodiimides Chemical class 0.000 claims description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 230000008439 repair process Effects 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims 3
- 229920001479 Hydroxyethyl methyl cellulose Polymers 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 15
- 238000005336 cracking Methods 0.000 description 12
- 239000000945 filler Substances 0.000 description 5
- 239000004568 cement Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910021487 silica fume Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000609 methyl cellulose Polymers 0.000 description 2
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 2
- 235000019796 monopotassium phosphate Nutrition 0.000 description 2
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 2
- 235000019799 monosodium phosphate Nutrition 0.000 description 2
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical group [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RFQOPUYDLCMQCE-UHFFFAOYSA-N 1-(2-hydroxyethyl)-5-nitropyrrole-2-carboxamide Chemical compound NC(=O)C1=CC=C([N+]([O-])=O)N1CCO RFQOPUYDLCMQCE-UHFFFAOYSA-N 0.000 description 1
- LWEAHXKXKDCSIE-UHFFFAOYSA-M 2,3-di(propan-2-yl)naphthalene-1-sulfonate Chemical group C1=CC=C2C(S([O-])(=O)=O)=C(C(C)C)C(C(C)C)=CC2=C1 LWEAHXKXKDCSIE-UHFFFAOYSA-M 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- 229910000388 diammonium phosphate Inorganic materials 0.000 description 1
- 235000019838 diammonium phosphate Nutrition 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000008363 phosphate buffer Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000001397 quillaja saponaria molina bark Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229930182490 saponin Natural products 0.000 description 1
- 150000007949 saponins Chemical class 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/34—Filling pastes
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G23/00—Working measures on existing buildings
- E04G23/02—Repairing, e.g. filling cracks; Restoring; Altering; Enlarging
- E04G23/0296—Repairing or restoring facades
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses putty powder and a preparation method and application thereof. The putty powder comprises a component A and a component B: the component A comprises the following components in parts by weight: 15-25 parts of heavy calcium carbonate, 25-43 parts of emulsion, 5-15 parts of micro silicon powder, 1-2 parts of bentonite, 4-15 parts of buffering agent, 2-3 parts of condensing agent and 8-12 parts of reinforcing agent; the component B comprises 5-15 parts of alkoxy silane. The putty powder has excellent crack resistance.
Description
Technical Field
The invention belongs to the technical field of putty powder, and particularly relates to putty powder as well as a preparation method and application thereof.
Background
With the development of economic society and the upgrade of consumer market, the usage amount of wall coatings as decorative materials for exterior walls of buildings is increasing year by year. However, the coating veneer of a plurality of building exterior walls can have the phenomena of peeling, cracking, falling off and the like after being used for a period of time. The reasons for the above phenomena are many, and in common speaking, "three-component paint and seven-component putty", among many reasons, the quality of the putty used for processing the wall base layer is a key factor.
The existing putty is easy to fall off when being smeared on a wall surface, and cracks and peeling appear to influence the use function and the appearance of a building. Cracking is the most common putty defect, whether exterior wall putty or interior wall putty. There are many reasons why putty cracks. For newly constructed systems, the putty is still applied to the wall and then dried and cured, and the drying and curing process can be locally restricted in the process, and the restriction action causes pores or gaps to be generated at the restricted part; another cause of cracking is plastic shrinkage, which occurs when moisture on the surface of the putty rapidly volatilizes when the environment is at low humidity and high temperature and in the presence of wind. For a system constructed for a period of time, drying shrinkage is a common cause of cracks, and in addition, temperature, weathering and the like can cause cracks in the system.
How to reduce or prevent cracking of the putty is a technical problem to be solved urgently by the technical personnel in the field.
Disclosure of Invention
The first technical problem to be solved by the invention is as follows:
provides a putty powder. The putty powder has excellent crack resistance.
The second technical problem to be solved by the invention is:
provides a preparation method of the putty powder.
The third technical problem to be solved by the invention is:
the putty powder is applied.
In order to solve the first technical problem, the invention adopts the technical scheme that:
the putty powder comprises a component A and a component B:
the component A comprises the following components in parts by weight:
15-25 parts of heavy calcium carbonate, 25-43 parts of emulsion, 5-15 parts of micro silicon powder, 1-2 parts of bentonite, 4-15 parts of buffering agent, 2-3 parts of condensing agent and 8-12 parts of reinforcing agent;
the component B comprises 5-15 parts of alkoxy silane.
The putty powder does not contain cement, so that the putty powder can be placed for a long time without deterioration, and the waste of coating is avoided.
According to one embodiment of the invention, the emulsion comprises at least one of a styrene-acrylic emulsion and a silicone-acrylic emulsion.
According to one embodiment of the invention, the buffer is selected from a complex weak acid salt or a complex weak base salt.
According to one embodiment of the invention, the buffer is selected from the group consisting of sodium dihydrogen phosphate and potassium dihydrogen phosphate or disodium hydrogen phosphate and diammonium hydrogen phosphate to form a phosphate buffer pair in the putty to maintain the pH in the putty layer of the putty substantially constant, thereby reducing the attack of alkaline substances and avoiding cracking of the putty layer.
According to one embodiment of the invention, the reinforcing agent comprises at least one of polyacrylamide, cellulose, a defoamer and a wetting agent.
According to an embodiment of the present invention, the condensing agent includes at least one of a carbodiimide-based condensing agent, an organic phosphorus-based condensing agent, and an onium salt-based condensing agent.
According to one embodiment of the invention, the cellulose is selected from at least one of hydroxyethylcellulose, methylcellulose, hydroxypropylcellulose.
According to one embodiment of the invention, the defoamer is selected from silicone defoamers or polyether defoamers.
According to one embodiment of the invention, the wetting agent is selected from nekal, NP-10 or saponin powder.
According to one embodiment of the invention, the alkoxysilane comprises at least one of vinyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane and methyltriethoxysilane.
The component A and the component B are mixed when in use, after mixing, water is added into the powder, the alkoxy silane in the component B is hydrolyzed to generate silicon hydroxyl, and the silicon hydroxyl in the micro silicon powder in the component A are subjected to condensation reaction in an aqueous solution to form the organic silicon resin. The organic silicon resin and the emulsion in the component A form an interpenetrating network structure, and because the putty powder filler has small using amount and does not contain easily-cured components such as cement and the like, only a small amount of filler is filled in a network structure space in the interpenetrating network structure, so that the elasticity of the interpenetrating network structure cannot be damaged, and based on the filler powder, the putty powder has excellent elasticity, shrinkage stress and crack resistance.
In order to solve the second technical problem, the invention adopts the technical scheme that:
a method for preparing the putty powder comprises the following steps:
mixing the heavy calcium, the emulsion, the micro silicon powder, the bentonite, the buffering agent condensing agent, the polypropylene fiber and the reinforcing agent to obtain the component A;
and mixing the component A and the component B to obtain the putty powder.
In another aspect of the invention, the invention also provides an application of the putty powder in wall surface repair.
One of the technical solutions has at least one of the following advantages or beneficial effects:
1. the putty powder is added with a buffering agent, and the buffering agent can keep the pH value in the putty layer basically unchanged, so that the corrosion of alkaline substances is reduced, and the cracking of the putty layer is avoided.
2. The putty powder comprises a component A and a component B, wherein the component A and the component B are mixed when in use, water is added into the powder after mixing, alkoxy silane in the component B is hydrolyzed to generate silicon hydroxyl, and the silicon hydroxyl is subjected to condensation reaction with silicon hydroxyl in the micro silicon powder in the component A in an aqueous solution to form the organic silicon resin. Organosilicon resin can form interpenetrating network structure with the emulsion among the A component, because filler quantity is less in the putty powder, and does not contain easy curing composition such as cement, consequently in the interpenetrating network structure, only a small amount of filler fills in the network structure space to can not destroy the elasticity of interpenetrating network structure, based on this, putty powder has good elasticity, shrinkage stress and crack resistance nature.
3. The putty powder does not contain cement, so that the putty powder can be placed for a long time without deterioration, and the waste of coating is avoided.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of the present invention.
In the examples and the comparative examples, the weight ratio of the styrene-acrylic emulsion to the silicone-acrylic emulsion in the emulsion is 1: 1.
in the examples and comparative examples, the styrene-acrylic emulsion was an Issman Neocryl XK-102 styrene-acrylic emulsion; the silicone-acrylate emulsion is raw SD-528 silicone-acrylate emulsion.
In the examples and the comparative examples, the microsilica is 95 microsilica.
In the examples and comparative examples, the buffer is selected from the following raw materials in parts by weight of 1: 1 sodium dihydrogen phosphate and potassium dihydrogen phosphate.
In the examples and comparative examples, 4-dimethylaminopyridine was used as the condensing agent.
In the examples and the comparative examples, the weight parts of polyacrylamide, cellulose, defoamer and wetting agent in the reinforcing agent are sequentially 2: 4: 0.5: 0.5.
in the examples and the comparative examples, the weight ratio of hydroxyethyl cellulose to methyl cellulose in the cellulose was 1: 3.
The putty powder is prepared by the following method in the following examples and comparative examples, and the components are weighed according to the weight parts in the table 1-2; the method comprises the following specific steps:
mixing the heavy calcium, the emulsion, the micro silicon powder, the bentonite, the buffering agent, the condensing agent, the polypropylene fiber and the reinforcing agent to obtain the component A;
and mixing the component A and the component B to obtain the putty powder.
TABLE 1
TABLE 2
Performance testing
The putty powders prepared in the embodiments 1-11 and the comparative examples 1-3 are subjected to dynamic cracking resistance and adhesion level detection, and the specific detection results are shown in table 3, wherein the dynamic cracking resistance is tested by referring to JG/T157-containing-material 2009, and the dynamic cracking resistance index requires that the base layer crack is less than 0.3 mm; the adhesion rating is specifically carried out according to the following method: firstly, a blade is used for scratching 10 multiplied by 10 lmm multiplied by lmm small grids on the surface of a wall sample, each line needs to be deep to the bottom layer of putty, then, No. 3M600 gummed paper is stuck on the small grid to be tested and is spread by hands, one end of the gummed tape is grabbed by the hands, the gummed paper is quickly pulled off in the vertical direction, the operation is repeated for 3 times, the condition of the small grids is observed, and the total falling area of the wall surface is calculated, and the results are shown in a table 3.
TABLE 3
| Group of | Dynamic cracking resistance/mm | Grade of adhesion |
| Example 1 | 0.14 | 4B |
| Example 2 | 0.12 | 4B |
| Example 3 | 0.16 | 3B |
| Example 4 | 0.11 | 4B |
| Example 5 | 0.10 | 4B |
| Example 6 | 0.08 | 5B |
| Example 7 | 0.06 | 5B |
| Example 8 | 0.05 | 5B |
| Example 9 | 0.07 | 5B |
| Example 10 | 0.09 | 4B |
| Example 11 | 0.10 | 4B |
| Comparative example 1 | 0.19 | 3B |
| Comparative example 2 | 0.18 | 2B |
| Comparative example 3 | 0.21 | 3B |
Note: the corresponding adhesion grades in Table 3 are divided into 5B-no outer wall falling, 4B-total outer wall falling area less than 5%, 3B-total outer wall falling area between 5% and 15%, and 2B-total outer wall falling area between 15% and 35%.
As can be seen from Table 3, the dynamic cracking resistance of example 3 is poorer than that of examples 1 and 2, and the network structure in the putty is filled too fully by using the surface silica fume and the reinforcing agent in too high amount, so that the elasticity of the putty is damaged; the dynamic crack resistance of examples 9-11 is inferior to that of example 8, the amount of surface alkoxysilane should not be too high, and the putty can achieve the best results when the weight parts of vinyltrimethoxysilane, 3-aminopropyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane are 6, 4 and 1, respectively. In addition, as can be seen from comparative example 1, when no silica fume is added, the component B in the putty can not play a role, namely a network structure can not be formed in the putty; comparative example 2 has no buffer added, and has a large influence on the cracking resistance of the putty; comparative example 3 no alkoxysilane was added and the network structure could not be formed as well.
The above description is only an example of the present invention and is not intended to limit the scope of the present invention, and all equivalent modifications made by the present invention as described in the specification of the present invention or directly or indirectly applied to the related technical fields are included in the scope of the present invention.
Claims (10)
1. The putty powder is characterized in that: comprises a component A and a component B:
the component A comprises the following components in parts by weight:
15-25 parts of heavy calcium carbonate, 25-43 parts of emulsion, 5-15 parts of micro silicon powder, 1-2 parts of bentonite, 4-15 parts of buffering agent, 2-3 parts of condensing agent and 8-12 parts of reinforcing agent;
the component B comprises 5-15 parts of alkoxy silane.
2. The putty powder of claim 1, further comprising: the emulsion comprises at least one of styrene-acrylic emulsion and silicone-acrylic emulsion.
3. The putty powder of claim 1, further comprising: the buffer is selected from a complex weak acid salt or a complex weak base salt.
4. The putty powder of claim 1, further comprising: the condensing agent includes at least one of a carbodiimide-based condensing agent, an organic phosphorus-based condensing agent, and an onium salt-based condensing agent.
5. The putty powder of claim 1, further comprising: the reinforcing agent includes at least one of polyacrylamide, cellulose, a defoamer, and a wetting agent.
6. The putty powder of claim 5, further comprising: the cellulose is at least one selected from hydroxyethyl cellulose, methyl cellulose and hydroxypropyl cellulose.
7. The putty powder of claim 5, further comprising: the defoaming agent is at least one of organic silicon defoaming agent and polyether defoaming agent.
8. The putty powder of claim 1, further comprising: the alkoxy silane comprises at least one of vinyl trimethoxy silane, 3-aminopropyl trimethoxy silane, 3-mercaptopropyl trimethoxy silane and methyl triethoxy silane.
9. A method of preparing the putty powder of any one of claims 1 to 8, comprising: the method comprises the following steps:
mixing the heavy calcium, the emulsion, the micro silicon powder, the bentonite, the buffering agent condensing agent, the polypropylene fiber and the reinforcing agent to obtain the component A;
and mixing the component A and the component B to obtain the putty powder.
10. Use of the putty powder of any one of claims 1 to 8 in wall repair.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210047777.8A CN114395284A (en) | 2022-01-17 | 2022-01-17 | Putty powder and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210047777.8A CN114395284A (en) | 2022-01-17 | 2022-01-17 | Putty powder and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
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| CN114395284A true CN114395284A (en) | 2022-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210047777.8A Pending CN114395284A (en) | 2022-01-17 | 2022-01-17 | Putty powder and preparation method and application thereof |
Country Status (1)
| Country | Link |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103408986A (en) * | 2012-12-31 | 2013-11-27 | 嘉宝莉化工集团股份有限公司 | Waterborne inorganic slurry interior wall putty and preparation method thereof |
| CN104725920A (en) * | 2015-02-09 | 2015-06-24 | 毛小文 | Waterproof color putty powder and application method thereof |
| CN105585886A (en) * | 2016-03-02 | 2016-05-18 | 李金平 | External wall insulation putty |
| CN110982327A (en) * | 2019-12-20 | 2020-04-10 | 苏州弗克技术股份有限公司 | High-strength anti-cracking interior wall putty paste |
| CN112759972A (en) * | 2021-02-18 | 2021-05-07 | 卡本科技集团股份有限公司 | Aging-resistant yellowing-resistant solvent-free epoxy putty and preparation method thereof |
| CN113502078A (en) * | 2021-07-01 | 2021-10-15 | 德爱威（中国）有限公司 | Environment-friendly fireproof inorganic interior wall coating and preparation method thereof |
-
2022
- 2022-01-17 CN CN202210047777.8A patent/CN114395284A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103408986A (en) * | 2012-12-31 | 2013-11-27 | 嘉宝莉化工集团股份有限公司 | Waterborne inorganic slurry interior wall putty and preparation method thereof |
| CN104725920A (en) * | 2015-02-09 | 2015-06-24 | 毛小文 | Waterproof color putty powder and application method thereof |
| CN105585886A (en) * | 2016-03-02 | 2016-05-18 | 李金平 | External wall insulation putty |
| CN110982327A (en) * | 2019-12-20 | 2020-04-10 | 苏州弗克技术股份有限公司 | High-strength anti-cracking interior wall putty paste |
| CN112759972A (en) * | 2021-02-18 | 2021-05-07 | 卡本科技集团股份有限公司 | Aging-resistant yellowing-resistant solvent-free epoxy putty and preparation method thereof |
| CN113502078A (en) * | 2021-07-01 | 2021-10-15 | 德爱威（中国）有限公司 | Environment-friendly fireproof inorganic interior wall coating and preparation method thereof |
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