CN114367908A - Clamp ring polishing and grinding machine for semiconductor PVD equipment - Google Patents
Clamp ring polishing and grinding machine for semiconductor PVD equipment Download PDFInfo
- Publication number
- CN114367908A CN114367908A CN202210186981.8A CN202210186981A CN114367908A CN 114367908 A CN114367908 A CN 114367908A CN 202210186981 A CN202210186981 A CN 202210186981A CN 114367908 A CN114367908 A CN 114367908A
- Authority
- CN
- China
- Prior art keywords
- clamp ring
- cylinder
- pvd equipment
- ring polishing
- backup pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 14
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 9
- 230000006978 adaptation Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 238000005240 physical vapour deposition Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0092—Grinding attachments for lathes or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a Clamp ring polishing and grinding machine for semiconductor PVD equipment, which comprises a clamping block, a supporting plate, a cylinder and a rotating mechanism, wherein the cylinder is arranged on the rotating mechanism, the supporting plate is arranged at the top end of the cylinder, the supporting plate is circular, grooves are equidistantly arranged on the working surface of the supporting plate, the circular working surface of the supporting plate is divided into three equal sectors by the grooves, and clamping strips are arranged in the grooves.
Description
Technical Field
The invention relates to a Clamp ring polishing and grinding machine of a semiconductor PVD device.
Background
Semiconductor integrated circuit fabrication processes continue to advance rapidly, and the physical vapor deposition technique most commonly used today is vacuum ion plating. When ion plating is carried out in a vacuum ion plating machine, firstly, a reaction chamber of the plating machine is filled with inert gas, the pressure of the reaction chamber is kept within the range of 10 < -2 > to 10 < -3 > torr, and then the inert gas is used for generating glow discharge by using the voltage of 500-2000V. The Clamp ring is used for bearing a silicon wafer in a PVD (physical vapor deposition) process, 3 Pad surfaces of the Clamp ring are used for bearing the outer edge of the silicon wafer, ionized inert gas ions are used for bombarding a target material under the combined action of voltage and a magnetic field in a vacuum environment, so that the target material is ejected in the form of ions, atoms or molecules and is deposited on a base part to form a film, and conductor and non-conductor materials can be used as the target material to be sputtered according to different ionization power sources.
After the Clamp ring sand blasting operation is carried out, the smooth surface of the wafer is very easy to be damaged by error spraying, particularly, the Pad surface is a direct contact surface for supporting the silicon wafer, and the damage of the smooth surface can cause the whole silicon wafer to be scrapped in the PVD (physical vapor deposition) process, so that the grinding operation after sand blasting is very necessary.
Disclosure of Invention
The invention aims to provide a Clamp ring polishing and grinding machine of a semiconductor PVD device, which solves the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a semiconductor PVD equipment Clamp ring polishing polisher, includes and presss from both sides tight piece, backup pad, cylinder and rotary mechanism, the cylinder setting on rotary mechanism, the cylinder top is equipped with the backup pad, the backup pad is circular, and its working face equidistance is equipped with the recess, the recess separates into the circular working face of backup pad three fan-shaped that equals, is equipped with in the recess and presss from both sides tight rectangular.
Preferably, one section of the clamping block is a narrow cube and the other section is a wide cube.
Preferably, press from both sides tight rectangular one end and be equipped with 2 round holes, the equidistance is equipped with a plurality of square holes behind the round hole, and the internal diameter of square hole presss from both sides the outside diameter looks adaptation of the narrow square body of tight piece.
Preferably, a screw hole is formed between every two adjacent grooves and is connected with the supporting block through a bolt.
1. Compared with the prior art, the invention has the beneficial effects that: the invention relates to and provides a Clamp ring polishing and grinding machine for semiconductor PVD equipment, which can effectively Clamp a component, ensure that the component is always positioned in the center of a rotating table in the grinding process and cannot be driven to fly by the grinding friction force, thus ensuring the uniformity of integral grinding and improving the grinding quality and the safety of the component.
2. In the polishing process, personnel can not adjust the force applied by polishing due to worrying about the stress state of the product in different rotating areas, and the personnel safety of the personnel can not be threatened due to the fact that parts can splash out in the polishing process under extreme conditions.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic view of the structure of the clamping bar;
FIG. 4 is a schematic view of a clamping block;
fig. 5 is a support block.
In the figure: the device comprises a clamping block 1, a supporting plate 2, an air cylinder 3, a rotating mechanism 4 and a clamping strip 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a Clamp ring polishing and grinding machine for semiconductor PVD equipment comprises a clamping block 1, a supporting plate 2, a cylinder 3 and a rotating mechanism 4, wherein the cylinder 3 is arranged on the rotating mechanism 4, the supporting plate 2 is arranged at the top end of the cylinder 3, the supporting plate 2 is circular, grooves are formed in the working surface of the supporting plate 2 at equal intervals, the circular working surface of the supporting plate 2 is divided into three equal sectors by the grooves, and clamping strips 5 are arranged in the grooves; pressing from both sides 1 section of tight piece and being narrow square, another section is wide square, presss from both sides tight rectangular 5 one end and is equipped with 2 round holes, and the equidistance is equipped with a plurality of square holes behind the round hole, and the internal diameter of square hole presss from both sides the external diameter looks adaptation of the narrow square of tight piece 1, is equipped with the screw between every two adjacent recesses, and the screw passes through the bolted connection supporting shoe, presss from both sides 1 tops of tight piece and is equipped with PFA soft plastics.
The polishing method comprises the following steps:
step one, closing a pneumatic valve, and enabling a clamping jaw of an air cylinder to be in an open state;
secondly, placing a Clamp ring component in the center of the placing surface, and inserting a clamping block into a proper position on the clamping strip;
and step three, opening the pneumatic valve, and driving a clamping jaw of the air cylinder to drive a clamping block to Clamp the Clamp ring.
Further, in step one, the air valve keeps the clamping jaw open mode in an unvented state.
Furthermore, in the second step, after the component is placed in the center of the placing surface, the slot can be selected according to the actual size to be inserted into the clamping block.
And further, in the third step, the cylinder is ventilated, and PFA soft plastic at the top end of the clamping block clamps the Clamp ring.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A Clamp ring polishing and grinding machine for semiconductor PVD equipment is characterized in that: including pressing from both sides tight piece (1), backup pad (2), cylinder (3) and rotary mechanism (4), cylinder (3) set up on rotary mechanism (4), cylinder (3) top is equipped with backup pad (2), backup pad (2) are circular, and its working face equidistance is equipped with the recess, and the recess separates into the circular working face of backup pad (2) three fan-shaped that equals, is equipped with in the recess and presss from both sides tight rectangular (5).
2. The semiconductor PVD equipment Clamp ring polishing sander as set forth in claim 1, wherein: one section of the clamping block (1) is a narrow cube, and the other section of the clamping block is a wide cube.
3. The semiconductor PVD equipment Clamp ring polishing sander as set forth in claim 1, wherein: press from both sides tight rectangular (5) one end and be equipped with 2 round holes, the equidistance is equipped with a plurality of square holes behind the round hole, and the internal diameter of square hole presss from both sides tight piece (1) narrow square external diameter looks adaptation.
4. The semiconductor PVD equipment Clamp ring polishing sander as set forth in claim 1, wherein: and a screw hole is arranged between every two adjacent grooves and is connected with the supporting block through a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210186981.8A CN114367908A (en) | 2022-02-28 | 2022-02-28 | Clamp ring polishing and grinding machine for semiconductor PVD equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210186981.8A CN114367908A (en) | 2022-02-28 | 2022-02-28 | Clamp ring polishing and grinding machine for semiconductor PVD equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114367908A true CN114367908A (en) | 2022-04-19 |
Family
ID=81145363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210186981.8A Pending CN114367908A (en) | 2022-02-28 | 2022-02-28 | Clamp ring polishing and grinding machine for semiconductor PVD equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114367908A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2298475A1 (en) * | 2009-09-22 | 2011-03-23 | SAV Spann-Automations-Normteiletechnik GmbH | Collet chuck for clamping and centering ring-shaped workpieces |
| CN102601644A (en) * | 2012-03-14 | 2012-07-25 | 常州宝菱重工机械有限公司 | Clamping device for ring-like parts in milling |
| CN106903528A (en) * | 2017-04-25 | 2017-06-30 | 江苏科技大学 | For the positioning clamping device and its application method of disk-like accessory processing |
| CN210731036U (en) * | 2019-10-18 | 2020-06-12 | 青岛强林机械科技有限公司 | Fixing table for fixing annular mould piece of tyre |
| CN214559175U (en) * | 2021-02-26 | 2021-11-02 | 宜昌长机科技有限责任公司 | Automatic aligning and clamping device for ring-shaped parts |
| CN113858068A (en) * | 2021-09-24 | 2021-12-31 | 江苏沃凯氟密封科技有限公司 | Fixing clamp for machining automobile sealing ring |
-
2022
- 2022-02-28 CN CN202210186981.8A patent/CN114367908A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2298475A1 (en) * | 2009-09-22 | 2011-03-23 | SAV Spann-Automations-Normteiletechnik GmbH | Collet chuck for clamping and centering ring-shaped workpieces |
| CN102601644A (en) * | 2012-03-14 | 2012-07-25 | 常州宝菱重工机械有限公司 | Clamping device for ring-like parts in milling |
| CN106903528A (en) * | 2017-04-25 | 2017-06-30 | 江苏科技大学 | For the positioning clamping device and its application method of disk-like accessory processing |
| CN210731036U (en) * | 2019-10-18 | 2020-06-12 | 青岛强林机械科技有限公司 | Fixing table for fixing annular mould piece of tyre |
| CN214559175U (en) * | 2021-02-26 | 2021-11-02 | 宜昌长机科技有限责任公司 | Automatic aligning and clamping device for ring-shaped parts |
| CN113858068A (en) * | 2021-09-24 | 2021-12-31 | 江苏沃凯氟密封科技有限公司 | Fixing clamp for machining automobile sealing ring |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20220419 |