CN114359174A

CN114359174A - Conductive particle recognition method, conductive particle recognition device, electronic equipment and storage medium

Info

Publication number: CN114359174A
Application number: CN202111545102.8A
Authority: CN
Inventors: 殷亚男; 朱小明; 张鑫; 匡梦良; 许超
Original assignee: Suzhou Mega Technology Co Ltd
Current assignee: Suzhou Mega Technology Co Ltd
Priority date: 2021-12-16
Filing date: 2021-12-16
Publication date: 2022-04-15
Anticipated expiration: 2041-12-16
Also published as: CN114359174B; WO2023109446A1

Abstract

The embodiment of the invention provides a conductive particle identification method and device, electronic equipment and a storage medium. The method comprises the following steps: acquiring an image of a panel to be detected; identifying a suspected positive-engraving part and a suspected negative-engraving part in the image based on the gray-scale values of the pixels in the image; determining the contrast ratio of a suspected positive carving part and a suspected negative carving part in the predicted particles; and identifying, based at least on the contrast, a satisfactory one of the predicted particles and identifying the predicted particle as a conductive particle. The method avoids the interference of imaging noise, ensures the accuracy of the identification result of the conductive particles and reduces the possible errors. Meanwhile, the algorithm of the technical scheme is simple, easy to implement and small in required calculation amount, and the recognition efficiency of the conductive particles can be effectively improved. Therefore, the accuracy and efficiency of panel detection are improved, and the use experience of a user is improved.

Description

Conductive particle recognition method, conductive particle recognition device, electronic equipment and storage medium

Technical Field

The present invention relates to the field of panel detection technologies, and in particular, to a conductive particle identification method, a conductive particle identification apparatus, an electronic device, and a storage medium.

Background

Chip On Glass (COG for short) is a technology in which a driving circuit Chip is directly bonded On a Glass substrate, and is widely applied to various display products such as liquid crystal display and electroluminescence technologies. In the COG process, a Conductive pin of a driving circuit is aligned to an electrode (bump) on a glass substrate, an Anisotropic Conductive Film (ACF) is used as a bonding dielectric material, and the Conductive pin of the driving circuit is connected and conducted with the electrode on the glass substrate at a high temperature and a high voltage for a certain period of time. Similarly, the flexible circuit board On Glass (FPC On Glass, FOG for short) is a technique in which a flexible circuit board (FPC) is directly bonded to a Glass substrate, and the process is similar to COG. Similarly, a Chip On Film (COF) product is a chip package product formed by directly packaging a semiconductor chip on a flexible substrate and then bonding the flexible substrate to a glass plate, and the manufacturing process is similar to that of COG.

The panel inspection technology may be used to detect indentations of conductive particles in an anisotropic conductive film between a glass electrode and a core electrode including a chip for judging the quality of a panel according to a certain standard. The display function of the panel may be affected by the properties of the conductive particles. Therefore, in the process of detecting the panel, the identification and detection of the conductive particles are very important.

In the existing technical scheme for identifying conductive particles, the conductive particles in an image are generally directly identified only by the gray value of a pixel of the image. This is difficult to avoid being affected by various imaging noises. Therefore, the identification accuracy of the conductive particles is seriously reduced, the detection accuracy of the panel is further reduced, and the use experience of a user is influenced.

Disclosure of Invention

The present invention has been made in view of the above problems. According to an aspect of the present invention, there is provided a conductive particle identification method. The method comprises the following steps: acquiring an image of a panel to be detected; identifying a suspected positive carving part and a suspected negative carving part in the image based on the gray value of the pixel in the image, wherein the difference between the gray value of the suspected positive carving part and the gray value of the surrounding area is larger than a first preset value, and the difference between the gray value of the surrounding area of the suspected negative carving part and the gray value of the suspected negative carving part is larger than a second preset value; grouping the suspected positive carving parts and the suspected negative carving parts to obtain prediction particles, wherein each prediction particle comprises one suspected positive carving part and one suspected negative carving part; determining the contrast ratio of a suspected positive carving part and a suspected negative carving part in the predicted particles; and identifying, based at least on the contrast, a satisfactory one of the predicted particles and identifying the predicted particle as a conductive particle.

Illustratively, identifying satisfactory ones of the predicted particles and identifying the predicted particles as conductive particles based at least on the contrast includes: based on at least the contrast, identifying a predicted particle among the predicted particles that meets the sensitivity requirement and identifying the predicted particle as a conductive particle, wherein the contrast is positively correlated with the sensitivity.

Illustratively, identifying, based at least on the contrast, a predicted particle among the predicted particles that meets the sensitivity requirement and identifying the predicted particle as a conductive particle includes: calculating the sensitivity of at least part of the predicted particles according to the contrast of the suspected positive part and the suspected negative part in at least part of the predicted particles; providing the calculated sensitivity to a user; and setting a sensitivity threshold in response to a user's setting operation based on the calculated sensitivity; a predicted particle of the predicted particles that is greater than the sensitivity threshold is identified and the predicted particle is identified as a conductive particle.

Illustratively, identifying the suspected positive and negative sections in the image based on the gray-scale values of the pixels in the image comprises: positioning an electrode of a panel to be detected in the image based on the gray value of the pixel in the image; and performing image segmentation based on the gray scale values of the pixels of the electrodes to identify the suspected positive-engraving part and the suspected negative-engraving part.

Illustratively, identifying the suspected positive and negative sections in the image based on the gray-scale values of the pixels in the image comprises: positioning an electrode of a panel to be detected in the image; and performing image segmentation based on the gray values of the pixels of the electrodes to identify a suspected positive-engraving part and a suspected negative-engraving part; wherein, the electrode of the panel of waiting to detect in the location image includes: determining a position of the electrode based on the marker in the image; and adjusting the determined position in response to an operation by the user.

Illustratively, grouping the suspected positive and negative sections to obtain the predicted particle comprises: identifying as a predicted particle a suspected positive cut portion and a suspected negative cut portion that satisfy one or more of the following conditions: the distance between the suspected positive carving part and the suspected negative carving part is within a preset distance range; the arrangement direction of the suspected positive carving part and the suspected negative carving part is within a preset angle range.

Illustratively, grouping the suspected positive and negative sections to obtain the predicted particle comprises: taking one of the suspected positive carving part and the suspected negative carving part as a reference part and the other as a pending part, and executing the following operations; for each reference part, predicting the region of the undetermined part corresponding to the reference part according to the shadow direction of the conductive particles to obtain a predicted region; and determining a pending part corresponding to the reference part based on the prediction region so as to form a predicted particle by the reference part and the determined pending part.

Illustratively, predicting the region where the part to be determined corresponding to the reference part is located according to the shadow direction of the conductive particles comprises: determining a minimum envelope rectangle for the reference portion; and shifting the minimum envelope rectangle by a distance of k1 x d according to the shading direction of the conductive particles to obtain a second rectangle as a prediction region, wherein k1 represents a first scale factor, and d represents the diameter of the conductive particles.

Illustratively, predicting the region where the part to be determined corresponding to the reference part is located according to the shadow direction of the conductive particles comprises: calculating the center of the reference portion; calculating a position spaced from the center of the reference portion by k2 x d in the hatching direction based on the hatching direction of the conductive particles, wherein k2 represents a second proportionality coefficient, and d represents the diameter of the conductive particles; and determining a square area with the calculated position as the center and k3 × d as the side length to serve as a prediction area, wherein k3 represents a third scaling factor.

Illustratively, after identifying the suspected positive and negative portions in the image and before grouping the suspected positive and negative portions, the method further comprises: and performing morphological operation on the image, and eliminating an interference area so that the image only displays the identified suspected positive carving part and the suspected negative carving part.

According to another aspect of the present invention, there is also provided a conductive particle recognition apparatus, the apparatus including: the acquisition module is used for acquiring an image of a panel to be detected; the positive engraving and negative engraving identification module is used for identifying a suspected positive engraving part and a suspected negative engraving part in the image based on the gray value of the pixel in the image, wherein the difference value between the gray value of the suspected positive engraving part and the gray value of the surrounding area is larger than a first preset value, and the difference value between the gray value of the surrounding area of the suspected negative engraving part and the gray value of the suspected negative engraving part is larger than a second preset value; the grouping module is used for grouping the suspected positive carving part and the suspected negative carving part to obtain prediction particles, wherein each prediction particle comprises a suspected positive carving part and a suspected negative carving part; a contrast determining module for determining the contrast of the suspected positive part and the suspected negative part in the predicted particle; and a particle identification module for identifying, based at least on the contrast, a satisfactory predicted particle among the predicted particles and identifying the predicted particle as a conductive particle.

According to yet another aspect of the present invention, there is also provided an electronic device comprising a processor and a memory, wherein the memory has stored therein computer program instructions for executing the conductive particle identification method as described above when the computer program instructions are executed by the processor.

According to yet another aspect of the present invention, there is also provided a storage medium having stored thereon program instructions for performing the conductive particle identification method as described above when executed.

In the technical scheme, the phenomenon that each conductive particle comprises a positive etching part and a negative etching part, and the gray scales of the positive etching part and the negative etching part are different from the gray scale presented by the adhesive in the anisotropic conductive film is fully utilized, and the conductive particles are predicted and identified through the relationship between the positive etching part and the negative etching part of the conductive particles. The method avoids the interference of imaging noise, ensures the accuracy of the identification result of the conductive particles and reduces the possible errors. Meanwhile, the algorithm of the technical scheme is simple, easy to implement and small in required calculation amount, and the recognition efficiency of the conductive particles can be effectively improved. Therefore, the accuracy and efficiency of panel detection are improved, and the use experience of a user is improved.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent by describing in more detail embodiments of the present invention with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings, like reference numbers generally represent like parts or steps.

FIG. 1 shows a schematic flow diagram of a conductive particle identification method according to one embodiment of the invention;

FIG. 2 shows a partial schematic view of an image of a panel to be inspected according to one embodiment of the invention;

FIG. 3 shows a schematic flow chart of the steps of identifying suspected positive and negative sections in an image according to one embodiment of the present invention;

FIG. 4 shows a schematic flow chart of the steps of locating electrodes of a panel to be detected in an image according to one embodiment of the present invention;

FIG. 5 shows a schematic diagram of a user interface according to one embodiment of the invention;

FIG. 6 shows a schematic flow diagram of grouping suspected positive and negative sections to obtain predicted particles, according to one embodiment of the invention;

FIG. 7 is a schematic flow chart diagram illustrating the steps of predicting the area in which the pending portion corresponding to the reference portion is located, according to one embodiment of the present invention;

FIG. 8 is a schematic flow chart diagram illustrating the steps of predicting the area in which the pending section corresponding to the reference section is located according to another embodiment of the present invention;

FIG. 9 shows a schematic flow chart of the steps of identifying a predicted particle as a conductive particle according to one embodiment of the present invention;

FIG. 10 shows a schematic block diagram of a conductive particle identification apparatus according to an embodiment of the invention;

FIG. 11 shows a schematic block diagram of an electronic device according to an embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a subset of embodiments of the invention and not all embodiments of the invention, with the understanding that the invention is not limited to the example embodiments described herein. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the invention described herein without inventive step, shall fall within the scope of protection of the invention.

Fig. 1 shows a schematic flow diagram of a conductive particle identification method 100 according to an embodiment of the invention. As shown in fig. 1, the method 100 includes the following steps.

Step S110, an image of the panel to be detected is acquired.

The image of the panel to be detected may be an original image acquired by an image acquisition device such as a camera in the panel detection system, or may be an image obtained after preprocessing the original image. The preprocessing operation may include all operations for more clearly performing panel detection. For example, the preprocessing operation may include a denoising operation such as filtering. The image may contain all or part of the electrodes in the panel to be detected.

Step S130, identifying a suspected positive-engraving part and a suspected negative-engraving part in the image based on the gray-scale values of the pixels in the image. The difference value between the gray values of the suspected positive carving part and the suspected negative carving part and the gray value of the surrounding area is larger than a preset value. Specifically, the difference between the gray value of the suspected positive-engraving part and the gray value of the surrounding area is greater than a first predetermined value, and the difference between the gray value of the surrounding area of the suspected negative-engraving part and the gray value of the suspected negative-engraving part is greater than a second predetermined value.

Fig. 2 shows a partial schematic view of an image of a panel to be inspected according to an embodiment of the invention. Included in the image of the panel to be inspected is an electrode area 210, such as the light gray rectangular area in fig. 2. The electrode area includes one or more conductive particles 220. The conductive particles generally include a positive-etched portion and a negative-etched portion. The male engraved portion and the female engraved portion are generated due to the following phenomena: when imaging is performed by using, for example, a differential interference microscope (DIC), the height difference between the conductive particles and the electrodes is converted into a gray scale difference, so that the brightness at a high place is increased, the brightness at a low place is decreased, the contrast between brightness and darkness is formed, and the stereoscopic effect is enhanced. The brightness of the positive engraved portion is high relative to the surrounding area, and the brightness of the negative engraved portion is low relative to the surrounding area. The surrounding region is a region where the adhesive in the simple anisotropic conductive film is located. Referring to fig. 2, it can be seen that the image includes a suspected positive portion 222 and a suspected negative portion 221. The pseudo-positive engraved portion 222 and the pseudo-negative engraved portion 221 are portions having a relief form, and the remaining smooth portions are peripheral regions of the conductive particles. The false positive tone portion 222 is brighter than its surrounding area, and the difference between the gray level value of the false positive tone portion 222 and the gray level value of its surrounding area is greater than a first predetermined value. The pseudo-intaglio portion 221 is darker than its surrounding area, and the difference between the gradation value of the surrounding area of the pseudo-intaglio portion 221 and the gradation value of the pseudo-intaglio portion 221 is larger than a second predetermined value. The first predetermined value and the second predetermined value may be different due to a difference in contrast of the image. For example, the first and second predetermined values may be 30 and 20, respectively, that is, the gray value of the suspected male portion is at least 30 greater than the gray value of its surrounding area, and the surrounding area of the suspected female portion is at least 20 greater than its own gray value. Any image segmentation method may be utilized to identify the suspected positive and negative portions of the image. For example, threshold-based image segmentation, grayscale histogram-based image segmentation, and the like. It is understood that the suspected positive and negative portions, which may not be the positive and negative portions of the real conductive particles, are identified based on the gray values in step S130. However, the suspected positive-cut portion includes a positive-cut portion of the real conductive particles, and the suspected negative-cut portion includes a negative-cut portion of the real conductive particles. In other words, the suspected positive engraved portion includes a true positive engraved portion and a false positive engraved portion that is erroneously recognized, and the suspected negative engraved portion includes a true negative engraved portion and a false negative engraved portion that is erroneously recognized.

Step S150, the suspected positive-carved part and the suspected negative-carved part are grouped to obtain the predicted particle. Wherein each predicted particle comprises a suspected positive portion and a suspected negative portion.

By way of example and not limitation, the suspected positive-engraving part and the suspected negative-engraving part on the image of the panel to be detected can be grouped by performing area division on the image. Each group comprises a suspected positive carving part and a suspected negative carving part which form a prediction particle. If only one suspected positive carving part and one suspected negative carving part are included in the same image area, the two parts form a group. If a plurality of suspected positive engraving parts and a plurality of suspected negative engraving parts exist in the same image area, one suspected positive engraving part and one suspected negative engraving part which are closest to each other can be used as a group according to the approaching principle.

Step S170, determining the contrast between the suspected positive and negative portions in the predicted particle.

And determining the contrast of the two parts according to the gray value of the suspected positive carving part and the gray value of the suspected negative carving part in the predicted particles. From an image perspective, contrast is a measure of the different brightness levels of a pixel. It is understood that the greater the value of the contrast, the more distinct the difference between the suspected positive and negative portions. For example, the gray value of the brightest pixel of the pseudo-positive engraved portion may be subtracted by the gray value of the darkest pixel of the pseudo-negative engraved portion, and the resulting difference may be used as the contrast between the pseudo-positive engraved portion and the pseudo-negative engraved portion.

For the conductive particles in the image of the panel to be detected, the contrast of the positive carving part and the negative carving part can directly reflect the sensitivity of the conductive particles. Namely, the contrast of the conductive particles and the sensitivity are in a non-linear positive correlation relationship.

And step S190, identifying the prediction particles meeting the requirements in the prediction particles and identifying the prediction particles as conductive particles at least based on the contrast.

As mentioned before, contrast is a measure of the different brightness levels of a pixel. For example, the predicted particle may be considered as a conductive particle when the contrast of the suspected positive portion and the suspected negative portion of the predicted particle meets a preset condition, for example, when the contrast of the suspected positive portion and the suspected negative portion of the predicted particle is greater than 40, the predicted particle may be identified as a conductive particle. That is, in step S190, the predicted particles meeting the contrast requirement among the predicted particles may be directly identified as the conductive particles. For example, particles with a contrast higher than a contrast threshold are conductive particles meeting the contrast requirement; otherwise it is not a conductive particle.

As previously mentioned, contrast is positively correlated with sensitivity. The contrast of the suspected positive and negative portions of the predicted particle may be indicative of the sensitivity of the predicted particle to some extent. For example, in one embodiment, step S190 may include, based on at least the contrast, identifying a predicted particle among the predicted particles that meets the sensitivity requirement and identifying the predicted particle as a conductive particle. Thus, the predicted particles meeting the sensitivity requirement can be simply identified based on the contrast, and the part of the predicted particles are conductive particles. The sensitivity requirement can be that the conductive particle detection function factory setting for most panels to be detected can be met, or the setting can be customized and modified by a user through a user interface. For example, the particles with sensitivity higher than the sensitivity threshold are conductive particles meeting the sensitivity requirement; otherwise it is not a conductive particle. The sensitivity is more sensitive to the user, and the conductive particles are identified through the sensitivity requirement, so that better experience can be brought to the user.

Fig. 3 shows a schematic flow chart of the step S130 of identifying the suspected positive and negative sections in the image according to one embodiment of the present invention. As shown in fig. 3, step S130 may include the following steps.

Step S131, positioning the electrode of the panel to be detected in the image based on the gray value of the pixel in the image.

Referring again to fig. 2, the light gray rectangular area in fig. 2 is the electrode area of the panel to be detected, and the surrounding area of the electrode area is dark gray, which is obviously different from the electrode area. Thus, for example, according to the difference of the gray values of the pixels in the image, the edge of the electrode of the panel to be detected can be determined, thereby realizing the positioning of the electrode.

Step S132, image segmentation is performed based on the gray-scale values of the pixels of the electrodes to identify the suspected positive-engraving part and the suspected negative-engraving part.

Illustratively, image segmentation may be performed according to a change in a gray value of a pixel of an electrode. As can be readily seen from fig. 2, the variation in the gray value of the pixels does not fluctuate much in most regions on the image. However, if the gray scale value in a certain region suddenly increases or decreases, the region is a suspected positive-carved part or a suspected negative-carved part. Image segmentation may be performed for the electrode regions on the image. The image segmentation operation may be implemented by using an edge detection method, in which a plurality of pixels with suddenly increased gray values are used as boundaries, and an area inside the boundaries is identified as a pseudo-positive portion. Similarly, a plurality of pixels whose gradation values suddenly become small are used as boundaries, and a region inside the boundary is identified as a pseudo-intaglio portion.

Since the effective conductive particles are distributed in the electrode, and the distinction between the suspected positive etching part and the suspected negative etching part is mainly related to the gray value of the pixel, the electrode is firstly positioned in the technical scheme, and then the image segmentation is carried out in the electrode. According to the technical scheme, the accuracy of the identified suspected positive carving part and the suspected negative carving part can be greatly guaranteed. And the identification operation is simple and the feasibility is high.

It will be appreciated that prior to identifying the conductive particles, the position of the electrode may first be located in the acquired image, followed by identifying the suspected positive and negative portions thereon for the electrode. The detection frame can be drawn for the electrode of the panel to be detected in the image in an automatic or manual mode, and the drawn detection frame is overlapped with the electrode boundary in the image as far as possible. In one embodiment, the position of the detection frame is generally considered to be the position of the electrode in the image when identifying the conductive particles. However, due to various errors, the drawn detection frame often cannot completely coincide with the electrode in the image. Thus, if the boundaries of the detection frame and the electrodes do not coincide, the detection result is affected. How to locate the position of the electrodes in the image will be described in detail below.

In another embodiment, the step S130 of identifying the suspected positive carving portion and the suspected negative carving portion in the image based on the gray-scale value of the pixel in the image may further include: and positioning an electrode of the panel to be detected in the image, and performing image segmentation based on the gray value of the pixel of the electrode to identify a suspected positive engraving part and a suspected negative engraving part. Wherein, the electrode of the panel to be detected in the positioned image may include: based on the markers in the image, the position of the electrodes is determined, after which the determined position may be adjusted in response to a user operation.

In particular, fig. 4 shows a schematic flow chart of the steps of positioning the electrodes of the panel to be detected in an image according to one embodiment of the invention. As shown in fig. 4, positioning the electrodes of the panel to be detected in the image may be achieved by the following steps S131a and S131 b.

Step S131a determines the position of the electrode based on the marker in the image.

For example, the panel to be detected may be provided with marks, which are usually provided on both sides of the electrode area. The position of the electrodes may be determined based on the markers in the image. For example, the marks include a left mark and a right mark. The area between the left mark and the right mark is the area where the electrode is located. The markers in the image may be obtained by, for example, manual or machine annotation. After the position of the mark in the image is determined, the position of the detection frame relative to the mark, for example, the coordinates of the top left vertex of the detection frame, can be determined, so that the position and the boundary of the detection frame can be determined.

Step S131b, in response to the user' S operation, adjusts the determined position.

Illustratively, the user can observe the image of the panel to be detected as shown in fig. 2 through the user interface. And the user may also activate a "calibration button" (not shown) in the user interface using an input device such as a mouse, keyboard, etc. After the calibration button is triggered, the boundaries of the electrodes in the image can be determined by the gray value difference in response to the user's manipulation. At this time, because the boundary of the electrode and the boundary of the detection frame are already determined, and the distance between the boundaries of the electrode and the detection frame can also be determined, the boundary of the detection frame can be moved to the position coinciding with the electrode boundary in the image in response to the operation of the user, so as to adjust the determined position of the electrode.

Therefore, the position of the electrode can be quickly identified based on the mark points in the image, the accuracy of the position of the electrode can be ensured through man-machine interaction operation, and meanwhile, the operation of a user is simple, and extra work cannot be brought to the user.

For example, after the suspected positive portion and the suspected negative portion in the image are identified in step S130 and before the suspected positive portion and the suspected negative portion are grouped in step S150, the method 100 may further include: step S140, performing morphological operations on the image, and eliminating the interference area to make the image only display the identified suspected positive and negative portions.

Illustratively, the morphological operations may include, for example, dilation, erosion, and the like. Specifically, for the dilation operation, each pixel in the image of the panel to be detected may be scanned by a structural element, and each pixel in the structural element and the pixel covered by the structural element are logically or-ed, and if both are 0, the pixel is 0, otherwise, the pixel is 1. Conversely, the erosion operation may scan each pixel in the image with a structuring element, and logically and each pixel in the structuring element with the pixel it covers, with the pixel being 1 if both are 1 and 0 otherwise. Typically, these two operations are performed sequentially.

Thereby, the image of the panel to be detected is smoothed. Not only can the interference area be eliminated, namely the noise point smaller than the structural element in the image is eliminated, so that the image only displays the identified suspected positive carving part and the suspected negative carving part. And the suspected positive carving part and the suspected negative carving part in the image can be ideally enlarged, so that better predicted particles are obtained.

Exemplarily, the step S150 of grouping the suspected positive and negative portions to obtain the predicted particle may be specifically realized by the following scheme. Grouping and identifying as a predicted particle suspected positive and negative segments that satisfy one or more of the following conditions: in the condition 1, the distance between a suspected positive carving part and a suspected negative carving part is in a preset range; and 2, setting the included angle between the arrangement directions of the suspected positive carving part and the suspected negative carving part within a preset angle range.

From the foregoing, it is possible to identify a plurality of suspected positive and negative sections. The distance between each suspected positive-cut portion and each suspected negative-cut portion can be calculated separately. And comparing the obtained distances with the set preset distance range. When the obtained distance is within the preset distance range, the suspected positive carving part and the suspected negative carving part corresponding to the distance can be identified as a predicted particle. FIG. 5 shows a schematic diagram of a user interface according to one embodiment of the invention. The user can carry out human-computer interaction through the user interface. In an embodiment, the preset range may be set by adjusting the operable control "distance between positive and negative signs" in fig. 5, for example, setting the operable control "distance between positive and negative signs" to 5, that is, the maximum value of the preset distance range is 5, which may indicate that when the distance between the suspected positive sign portion and the suspected negative sign portion is less than or equal to 5 pixels, both of them may be identified as one predicted particle. The numerical value can be adjusted by operating an arrow of the operable control after distance between the yin and yang, the maximum value of the preset distance range can be increased by operating the upward arrow, and the maximum value of the preset distance range can be decreased by operating the downward arrow.

Alternatively, after a plurality of suspected positive sections and suspected negative sections are identified, the arrangement direction of each suspected positive section and each suspected negative section may be determined separately. For an electrode, the direction of signal flow for the electrode is typically its length. The arrangement direction of the positive carving part and the negative carving part of the conductive particles is from top to bottom or from bottom to top. Thus, the angle between the line and the vertical line can be calculated by connecting the center of each suspected male portion with the center of each suspected female portion. And comparing the calculated included angle with a preset angle range, and identifying a suspected positive engraving part and a suspected negative engraving part corresponding to the included angle as a prediction particle when the obtained included angle is within the preset angle range. Similarly, the preset angle range can be set differently according to the user requirements. In the above two embodiments, a predicted particle includes a suspected positive portion and a suspected negative portion.

The technical scheme identifies the predicted particles based on the distance between the suspected positive carving part and the suspected negative carving part and/or the arrangement direction of the two parts. The implementation scheme is simple in logic and easy to implement, and the identified predicted particles are more accurate.

Fig. 6 shows a schematic flow chart of grouping the suspected positive and negative segments to obtain the predicted particle according to step S150 of one embodiment of the present invention. In this embodiment, one of the suspected positive-cut portion and the suspected negative-cut portion is used as a reference portion, and the other is used as a pending portion, and the following steps as shown in fig. 6 are performed. It is understood that any one of the suspected positive portion and the suspected negative portion can be used as a reference portion, the reference portion is determined, and the remaining one is determined as a pending portion.

Step S151, for each reference portion, predicting a region where a to-be-determined portion corresponding to the reference portion is located according to the shadow direction of the conductive particle, so as to obtain a predicted region.

For example, if a suspected positive-cut portion is taken as a reference portion, the suspected negative-cut portion is an undetermined portion. The shadow direction of the conductive particles can be set by using the operable control "shadow direction" in the user interface as shown in fig. 5, wherein "upper shadow" or "lower shadow" (not shown in the figure) can be set. Here, "upper shading" indicates that, for one conductive particle, the engraved portion is located above the engraved portion, and is displayed as dark on the upper side and light on the lower side in the image, that is, the shading is on the upper half of the particle. The meaning of the "lower shadow" setting can be understood by reading the description about the "upper shadow", and will not be described herein. Under the condition that a reference part, such as a suspected positive-engraving part, is known, the area where the suspected negative-engraving part corresponding to the suspected positive-engraving part is located can be predicted according to the shadow direction of the set conductive particles.

Step S152, based on the prediction area, determining the undetermined part corresponding to the reference part, so as to form the predicted particle by the reference part and the determined undetermined part.

The pending portion corresponding to the reference portion may be determined within the prediction region. In the above example where the suspected positive portion is the reference portion, the suspected negative portion corresponding to the suspected positive portion may be determined in the obtained prediction region. If the predicted region does not contain the suspected intaglio portion, no predicted particle is present. On the contrary, if the predicted area contains the suspected negative part, the suspected negative part and the suspected positive part can form a predicted particle.

Therefore, the predicted particle can be directly determined through the shadow direction of the conductive particle based on the imaging rule of the conductive particle. The method is simple and easy to implement. In addition, the shadow directions of the conductive particles can be set differently by a user according to the actual acquisition condition of the image of the panel to be detected, and the accurate identification of the predicted particles can be realized for different images.

Fig. 7 is a schematic flowchart of step S151 of predicting a region where a pending portion corresponding to the reference portion is located according to an embodiment of the present invention. As shown in fig. 7, step S151 may be implemented by the following steps.

In step S151a, a minimum envelope rectangle for the reference portion is determined.

The description will be made by taking the reference part as the positive part. The suspected positive part may be an irregular figure, and the minimum envelope rectangle of the suspected positive part can be determined by an algorithm such as OpenCV. The algorithm for calculating the minimum envelope rectangle is not limited in this application, and any existing or future algorithm that can determine the minimum envelope rectangle of the reference portion is within the scope of the present application.

In step S151b, the minimum envelope rectangle is shifted by a distance of k1 × d according to the shadow direction of the conductive particles to obtain a second rectangle as the prediction region. Where k1 represents the first scaling factor and d represents the diameter of the conductive particles.

According to the shadow direction of the conductive particles, for example, the conductive particles are set as "upper shadow", and then the second rectangle obtained by moving the determined minimum envelope rectangle upward by a distance of k1 × d is used as the prediction region. If "lower shading" is set, the determined minimum envelope rectangle is shifted downward by a distance of k1 × d to obtain a second rectangle as a prediction region. It will be appreciated that the user may set k1 to any value between 0.5 and 1 as required to ensure the validity of the prediction region.

In the technical scheme, the condition limitation that the suspected positive carving part and the suspected negative carving part are identified into one prediction particle is added, namely the limitation of the diameter and the shadow direction of the conductive particle. The phenomenon that when the distances of the plurality of suspected positive carving parts and the plurality of suspected negative carving parts are close to each other, the plurality of suspected negative carving parts are mistakenly identified as one predicted particle is avoided, and the accuracy and the reliability of the obtained predicted particle are guaranteed.

Fig. 8 shows a schematic flow chart of the step of predicting the area in which the pending section corresponding to the reference section is located according to another embodiment of the present invention. As shown in fig. 8, step S151 may also be implemented by the following steps.

Step S151c, the center of the reference portion is calculated.

Still taking the example that the reference portion is a suspected positive portion, the center of the suspected positive portion can be calculated. In the present application, no limitation is made to the algorithm for calculating the center of the reference portion, and any existing or future calculation method or scheme that can be implemented for the center of the reference portion is within the protection scope of the present application.

In step S151d, a position distant from the center of the reference portion by k2 × d in the hatching direction is calculated based on the hatching direction of the conductive particles. Where k2 represents the second scaling factor and d represents the diameter of the conductive particle.

Illustratively, for example, the direction of the shadow of the conductive particle is set to "upper shadow", and a position above the reference portion and at a distance k2 × d from the center of the reference portion is calculated, which can be represented by position coordinates. Similarly to k1, the user can set k2 to any value between 0.5 and 1 according to actual needs to ensure the reasonableness of the prediction area.

In step S151e, a square region is determined with the calculated position as the center and k3 × d as the side length, as a prediction region, where k3 represents a third scaling factor.

Using the position obtained by the above calculation as the center, and taking k3 × d as the side length, a square region can be determined as a prediction region. A pending portion, i.e. in the above example a suspected intaglio portion, is determined in the prediction region. Wherein k3 can also be set to any reasonable value between 0.7 and 1.3.

The scheme is used as an alternative implementation scheme of the technical scheme, not only is the accuracy of the obtained predicted particles ensured, but also the complex operation of calculating the minimum envelope rectangle of the geometric image is avoided, and the algorithm is replaced by a simpler solution scheme, so that the solution is easier to realize.

Fig. 9 shows a schematic flow diagram of step S190 of identifying the predicted particle as a conductive particle according to one embodiment of the present invention. As shown in fig. 9, step S190 may include the following steps.

And step S191, calculating the sensitivity of at least part of the prediction particles according to the contrast of the suspected positive part and the suspected negative part in at least part of the prediction particles.

As mentioned above, the contrast of the conductive particles is positively correlated to their sensitivity. The sensitivity of the conductive particles can be calculated from their contrast based on a mathematical relationship.

Step S192, the calculated sensitivity is provided to the user.

Illustratively, the sensitivity obtained by the above calculation may be provided to the user through a user interface so that the user may perform subsequent operations based on the sensitivity. It will be appreciated that the data may be provided to the user in the form of probability distribution data of the calculated sensitivities to give the user a clearer picture of the sensitivity of the predicted particles in the current image.

In step S193, in response to a setting operation by the user based on the calculated sensitivity, a sensitivity threshold is set.

The user may make sensitivity requirement settings using an operable control "sensitivity" in the user interface as shown in fig. 5. For example, the sensitivity threshold is increased by operating the upward arrow, and the sensitivity threshold is decreased by operating the downward arrow. In one embodiment of the present application, the sensitivity threshold may be set to any integer between 0 and 100, which may be customized by the user as desired, and "27" shown in fig. 5 is merely exemplary and does not constitute a limitation of the sensitivity threshold in the present application. In this step, the user can set different sensitivity thresholds according to the requirements of the panel to be detected. Assuming that the quality requirement of the panel to be detected is high, a high sensitivity threshold value can be set on the basis of the current calculated sensitivity; otherwise, the other way round.

In step S194, a predicted particle larger than the sensitivity threshold among the predicted particles is identified, and the predicted particle is identified as a conductive particle.

As previously described, a greater value of the sensitivity of the predicted particle indicates that the predicted particle is more likely to be a conductive particle. For example, when the sensitivity obtained by the calculation is greater than a sensitivity threshold set by the user, the predicted particle may be identified as a conductive particle. Otherwise, the particles are not conductive particles.

According to the technical scheme, the sensitivity of the predicted particle can be calculated based on the contrast of the suspected positive carving part and the suspected negative carving part of the predicted particle, and then the sensitivity can be provided for a user so that the user can set a sensitivity threshold value according to the sensitivity to identify the predicted particle. In the scheme, a user can perform self-defined setting on the sensitivity threshold value based on the current image of the panel to be detected, so that the requirements of different users are met. Based on the calculated sensitivity of the predicted particle and the set sensitivity threshold, ideal identification of the predicted particle can be achieved.

According to another aspect of the present invention, there is also provided a conductive particle recognition apparatus. Fig. 10 shows a schematic block diagram of a conductive particle identification apparatus 1000 according to an embodiment of the present invention. As shown in fig. 10, the apparatus 1000 includes an acquisition module 1010, an intaglio identification module 1020, a grouping module 1030, a determination contrast module 1040, and a particle identification module 1050.

The obtaining module 1010 is configured to obtain an image of a panel to be detected.

The positive-engraving and negative-engraving identification module 1020 is configured to identify a suspected positive-engraving portion and a suspected negative-engraving portion in the image based on gray-scale values of pixels in the image. The difference between the gray value of the suspected positive carving part and the gray value of the surrounding area is larger than a first preset value, and the difference between the gray value of the surrounding area of the suspected negative carving part and the gray value of the suspected negative carving part is larger than a second preset value.

The grouping module 1030 is configured to group the suspected positive portion and the suspected negative portion to obtain the predicted particle. Wherein each predicted particle comprises a suspected positive portion and a suspected negative portion.

The determine contrast module 1040 is configured to determine a contrast of the suspected positive portion and the suspected negative portion of the predicted particle.

The particle identification module 1050 is configured to identify a predicted particle among the predicted particles that meets the sensitivity requirement based on at least the contrast and identify the predicted particle as a conductive particle. Wherein the contrast is positively correlated with the sensitivity.

According to another aspect of the invention, an electronic device is also provided. FIG. 11 shows a schematic block diagram of an electronic device 1100 according to an embodiment of the invention. As shown in fig. 11, the electronic device 1100 includes a processor 1110 and a memory 1120. The memory 1120 has stored therein computer program instructions for performing the conductive particle identification method 100 as described above when executed by the processor 1110.

According to still another aspect of the present invention, there is also provided a storage medium. On the storage medium are stored program instructions which, when executed, are adapted to perform the conductive particle identification method 100 as described above. The storage medium may include, for example, a storage component of a tablet computer, a hard disk of a personal computer, Read Only Memory (ROM), Erasable Programmable Read Only Memory (EPROM), portable compact disk read only memory (CD-ROM), USB memory, or any combination of the above storage media. The computer-readable storage medium may be any combination of one or more computer-readable storage media.

A person skilled in the art can understand specific implementation schemes of the conductive particle recognition apparatus, the electronic device, and the storage medium by reading the above description related to the conductive particle recognition method, and details are not described herein for brevity.

Although the illustrative embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the foregoing illustrative embodiments are merely exemplary and are not intended to limit the scope of the invention thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the scope or spirit of the present invention. All such changes and modifications are intended to be included within the scope of the present invention as set forth in the appended claims.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described device embodiments are merely illustrative, and for example, the division of the units is only one logical functional division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another device, or some features may be omitted, or not executed.

In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

Similarly, it should be appreciated that in the description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the invention and aiding in the understanding of one or more of the various inventive aspects. However, the method of the present invention should not be construed to reflect the intent: that the invention as claimed requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.

It will be understood by those skilled in the art that all of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where such features are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.

Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

The various component embodiments of the invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. It will be appreciated by those skilled in the art that a microprocessor or Digital Signal Processor (DSP) may be used in practice to implement some or all of the functions of some of the blocks in the conductive particle identification apparatus according to embodiments of the present invention. The present invention may also be embodied as apparatus programs (e.g., computer programs and computer program products) for performing a portion or all of the methods described herein. Such programs implementing the present invention may be stored on computer-readable media or may be in the form of one or more signals. Such a signal may be downloaded from an internet website or provided on a carrier signal or in any other form.

It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.

The above description is only for the specific embodiment of the present invention or the description thereof, and the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the protection scope of the present invention. The protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A conductive particle identification method, the method comprising:

acquiring an image of a panel to be detected;

identifying a suspected male carving part and a suspected female carving part in the image based on the gray value of the pixel in the image, wherein the difference between the gray value of the suspected male carving part and the gray value of the surrounding area is larger than a first preset value, and the difference between the gray value of the surrounding area of the suspected female carving part and the gray value of the suspected female carving part is larger than a second preset value;

grouping the suspected positive carving parts and the suspected negative carving parts to obtain prediction particles, wherein each prediction particle comprises a suspected positive carving part and a suspected negative carving part;

determining the contrast ratio of a suspected positive carving part and a suspected negative carving part in the predicted particles; and

based on at least the contrast, identifying a satisfactory predicted particle of the predicted particles and identifying the predicted particle as a conductive particle.

2. The method of claim 1, wherein identifying satisfactory ones of the predicted particles and identifying the predicted particles as conductive particles based at least on the contrast comprises:

based on at least the contrast, identifying a predicted particle among the predicted particles that meets a sensitivity requirement and identifying the predicted particle as a conductive particle, wherein the contrast is positively correlated with the sensitivity.

3. The method of claim 2, wherein the identifying, based at least on the contrast, ones of the predicted particles that meet sensitivity requirements and identifying the predicted particles as conductive particles comprises:

calculating the sensitivity of at least part of the prediction particles according to the contrast of a suspected positive carving part and a suspected negative carving part in at least part of the prediction particles;

providing the calculated sensitivity to a user; and

setting a sensitivity threshold in response to a user's setting operation based on the calculated sensitivity;

identifying a predicted particle of the predicted particles that is greater than the sensitivity threshold and identifying the predicted particle as a conductive particle.

4. The method of claim 1, wherein the identifying the suspected positive and negative portions in the image based on the gray scale values of the pixels in the image comprises:

positioning the electrode of the panel to be detected in the image based on the gray value of the pixel in the image; and

performing image segmentation based on gray values of pixels of the electrode to identify the suspected positive-engraving portion and the suspected negative-engraving portion.

5. The method of claim 1, wherein the identifying the suspected positive and negative portions in the image based on the gray scale values of the pixels in the image comprises:

positioning the electrodes of the panel to be detected in the image; and

performing image segmentation based on gray values of pixels of the electrodes to identify the suspected positive-engraving part and the suspected negative-engraving part;

wherein the positioning of the electrodes of the panel to be detected in the image comprises:

determining a position of the electrode based on a marker in the image; and

the determined position is adjusted in response to an operation by a user.

6. The method of claim 1, wherein the grouping the suspected positive and negative segments to obtain predicted particles comprises:

identifying as a predicted particle a suspected positive cut portion and a suspected negative cut portion that satisfy one or more of the following conditions:

the distance between the suspected positive carving part and the suspected negative carving part is within a preset distance range;

the arrangement direction of the suspected positive carving part and the suspected negative carving part is within a preset angle range.

7. The method of claim 1, wherein the grouping the suspected positive and negative segments to obtain predicted particles comprises:

taking one of the suspected positive carving part and the suspected negative carving part as a reference part and the other one as a to-be-determined part, and executing the following operations;

for each reference part, predicting the region of the undetermined part corresponding to the reference part according to the shadow direction of the conductive particles to obtain a predicted region;

and determining a pending part corresponding to the reference part based on the prediction region so as to form the predicted particle by the reference part and the determined pending part.

8. The method of claim 7, wherein the predicting the area where the part to be determined corresponding to the reference part is located according to the shadow direction of the conductive particles comprises:

determining a minimum envelope rectangle for the reference portion; and

shifting the minimum envelope rectangle by a distance of k1 x d according to the shading direction of the conductive particles to obtain a second rectangle as the prediction region, wherein k1 represents a first scale factor and d represents the diameter of the conductive particles.

9. The method of claim 7, wherein the predicting the area where the part to be determined corresponding to the reference part is located according to the shadow direction of the conductive particles comprises:

calculating the center of the reference portion;

calculating a position spaced from the center of the reference portion by k2 x d in the shadow direction according to the shadow direction of the conductive particle, wherein k2 represents a second proportionality coefficient, and d represents the diameter of the conductive particle;

and determining a square area with the calculated position as the center and k3 × d as the side length as the prediction area, wherein k3 represents a third scaling factor.

10. The method of claim 1, wherein after identifying the suspected positive and negative portions in the image and before said grouping the suspected positive and negative portions, the method further comprises:

and performing morphological operation on the image, and eliminating an interference area to enable the image to only display the identified suspected positive carving part and the suspected negative carving part.

11. A conductive particle identification apparatus, the apparatus comprising:

the acquisition module is used for acquiring an image of a panel to be detected;

the positive engraving and negative engraving identification module is used for identifying a suspected positive engraving part and a suspected negative engraving part in the image based on the gray value of the pixel in the image, wherein the difference value between the gray value of the suspected positive engraving part and the gray value of the surrounding area is larger than a first preset value, and the difference value between the gray value of the surrounding area of the suspected negative engraving part and the gray value of the suspected negative engraving part is larger than a second preset value;

a grouping module, configured to group the suspected positive part and the suspected negative part to obtain predicted particles, where each predicted particle includes one suspected positive part and one suspected negative part;

a contrast determining module for determining the contrast of the suspected positive part and the suspected negative part in the predicted particle; and

and the particle identification module is used for identifying the predicted particles meeting the contrast requirement in the predicted particles and identifying the predicted particles as conductive particles at least based on the contrast.

12. An electronic device comprising a processor and a memory, wherein the memory has stored therein computer program instructions for execution by the processor to perform a conductive particle identification method as claimed in any one of claims 1 to 10.

13. A storage medium having stored thereon program instructions for performing, when executed, the conductive particle identification method of any one of claims 1 to 10.