CN114346919A - Ultrafine-granularity diamond grinding wheel and machining process thereof - Google Patents
Ultrafine-granularity diamond grinding wheel and machining process thereof Download PDFInfo
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Abstract
The invention discloses a diamond grinding wheel with superfine granularity and a processing technology thereof; the method comprises the steps of firstly reasonably proportioning the grain composition of the diamond grinding material to achieve the purpose of superfine grinding, then activating the surface of the diamond grinding material in a hydrochloric acid hot dipping mode, then volatilizing chloride salt at high temperature in a salt bath mode to provide an active reaction medium between the diamond grinding material and the coating metal powder, promoting the carbonization reaction of the diamond grinding material and the coating metal powder, enhancing the binding capacity of the coating on the surface of the diamond, enhancing the binding capacity of a ceramic binding agent and the diamond grinding material and improving the grinding efficiency of the diamond grinding material.
Description
Technical Field
The invention relates to the technical field of ceramic materials, in particular to an ultra-fine granularity diamond grinding wheel and a processing technology thereof.
Background
Diamond is the hardest substance known at present and has important application value in the abrasive industry, at present, the diamond abrasive is mainly made of artificial diamond, and like natural diamond, each carbon atom in the crystal is combined with four carbon atoms around the crystal in a covalent bond mode, and the diamond has high chemical inertness. The diamond is difficult to infiltrate and bond with other substances, and diamond particles on the diamond grinding wheel fall off and peel off when the diamond grinding wheel is prepared, so that the grinding wheel is damaged finally, and the grinding effect is lost.
Disclosure of Invention
The invention aims to provide an ultra-fine granularity diamond grinding wheel and a processing technology thereof, and aims to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme: an ultra-fine grain diamond grinding wheel having the following characteristics: the ultrafine-granularity diamond grinding wheel comprises the following components in parts by weight: 50-60 parts of modified diamond abrasive, 15-30 parts of ceramic bond and 3-5 parts of pore-forming agent.
Further, the modified diamond abrasive is a mixture of modified diamond abrasives with the grain size of 1-3 microns, 5-10 microns and 20-30 microns; the proportion of the 1-3 micron modified diamond abrasive, the 5-10 micron modified diamond abrasive and the 20-30 micron diamond abrasive is (25-30): (12-15): (13-15).
Further, the modified diamond abrasive material and the preparation process thereof comprise the following steps:
a. soaking the diamond abrasive material in deionized water, and cleaning by ultrasonic oscillation treatment at 20-30KHz for 10-20 min;
b. placing the cleaned diamond abrasive in a hydrochloric acid solution with the concentration of 0.5-1mol/L, soaking for 1-2h by ultrasonic treatment, cleaning for 2-3 times by using an acetone solution, cleaning by using pure water, after the cleaning is finished, placing the diamond abrasive in an oven, and drying at 80-120 ℃;
c. adding the dried diamond abrasive into a reaction vessel filled with sodium chloride and barium chloride, adding 10-15 parts of plating layer metal powder with the particle size of 3-10 mu m, fully stirring, uniformly mixing, introducing nitrogen for protection, heating to 800-900 ℃, and preserving heat for 1-2 h;
d. and after the heat preservation is finished, cooling the diamond abrasive to room temperature along with the furnace, repeatedly boiling and cleaning for 3-5 times by using pure water, oscillating and stirring by using ultrasonic waves, after the cleaning is finished, sending the diamond abrasive into an oven, and drying for 1-2 hours at the temperature of 100-.
The diamond has super-hard characteristics, so that the diamond has important application value in the abrasive industry, the main source of the diamond abrasive is artificial diamond at present, and like natural diamond, each carbon atom in the crystal is combined with four carbon atoms around the crystal in a covalent bond mode, and the diamond has high chemical inertness. By virtue of the unique crystal structure, the diamond crystal has strong resistance to external force and shows specific superhard performance macroscopically, but the diamond is difficult to infiltrate and bond with other substances due to the crystal structure, and due to the property, diamond particles on the diamond grinding wheel are separated and stripped when the diamond grinding wheel is prepared, so that the grinding wheel is damaged finally, and the grinding effect is lost.
Therefore, in order to improve the wettability and the bonding property of the diamond abrasive and other materials, the diamond abrasive is modified, four valence bonds of most carbon atoms in the internal unit cell of the diamond are combined with the surrounding carbon atoms to form covalent bonds, but the boundary of the diamond abrasive has numerous broken bonds of the carbon atoms, so that the diamond abrasive can be combined with the surrounding materials, but the carbon element has poor activity, and needs to be activated. The method uses a hydrochloric acid solution with the concentration of 0.5-1mol/L to soak the diamond abrasive, uses ultrasonic oscillation in the soaking process to ensure that the diamond abrasive can be fully contacted with hydrochloric acid, and heats the solution to improve the reaction activity of the diamond abrasive and enhance the activation effect on carbon atoms.
After the diamond grinding material is activated by hydrochloric acid, a metal coating is prepared on the surface of the diamond grinding material in a salt bath mode, the salt used in the salt bath process is chloride, the chloride is molten and volatilizes after the temperature is increased to 800 ℃ of 700-.
After the salt bath is finished, more chloride ions and more impurities are remained on the surface of the diamond grinding material, and at the moment, the impurities are removed in a high-temperature boiling mode so as to achieve the purpose of pure grinding material.
Further, in the step c, the mixing amount of the sodium chloride and the barium chloride and the mixing amount of the diamond abrasive are (15-25) in parts by weight: (15-25): (50-60).
Further, the ceramic binder is an oxide particle mixture with the particle size of 10-30 μm, wherein the ceramic binder comprises the following components in parts by weight: 8-12 parts of silicon dioxide, 2-6 parts of boron oxide, 2-6 parts of aluminum oxide and 3-6 parts of titanium dioxide.
Further, the pore-forming agent is any one of walnut shell powder and charcoal powder with the particle size of 1-3 microns.
A processing technology of an ultra-fine granularity diamond grinding wheel comprises the following steps:
s1, placing diamond grinding materials in a ball mill, grinding the diamond grinding materials to required particle sizes respectively, weighing the diamond grinding materials with the corresponding particle sizes according to a weight ratio, and blending;
s2, modifying the blended diamond abrasive;
s3, uniformly mixing silicon dioxide, boron oxide, aluminum oxide and titanium dioxide, adding the mixture into a ball mill, grinding the mixture to a required particle size, taking the mixture out, transferring the mixture into a muffle furnace, heating the mixture to 1200-1500 ℃, calcining the mixture for 2-3h, cooling the mixture along with the furnace, standing the mixture, cooling the mixture, and grinding the mixture to the required particle size to obtain the ceramic bond;
s4, mixing the ceramic bond, the modified diamond abrasive and the pore-forming agent, pressing at room temperature to form a shape, and drying the pressed blank in a drying chamber at the temperature of 80-120 ℃ for 8-12 h;
s5, after drying, transferring the blank into a muffle furnace, heating to 450-;
s6, after the heat preservation is finished, cooling to 450-fold sand-adding 500 ℃ at the cooling rate of 2-3 ℃, preserving the heat for 1h, and then cooling to room temperature along with the furnace to obtain the superfine diamond grinding wheel.
Further, in step S4, the pressure applied during the press forming is 12-15 MPa.
Compared with the prior art, the invention has the following beneficial effects: the method comprises the steps of firstly reasonably proportioning the grain composition of the diamond grinding material to achieve the purpose of superfine grinding, then activating the surface of the diamond grinding material in a hydrochloric acid hot dipping mode, then volatilizing chloride salt at high temperature in a salt bath mode to provide an active reaction medium between the diamond grinding material and the coating metal powder, promoting the carbonization reaction of the diamond grinding material and the coating metal powder, enhancing the binding capacity of the coating on the surface of the diamond, enhancing the binding capacity of a ceramic binding agent and the diamond grinding material and improving the grinding efficiency of the diamond grinding material.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
S1, placing diamond grinding materials into a ball mill, grinding the diamond grinding materials into particles with the particle sizes of 1-3 microns, 5-10 microns and 20-30 microns respectively, weighing 30 parts by weight of 1-3 microns diamond grinding materials, 15 parts by weight of 5-10 microns diamond grinding materials and 15 parts by weight of 20-30 microns diamond grinding materials, and uniformly mixing the materials to obtain the diamond grinding materials;
s2, modifying the diamond abrasive:
a. soaking the diamond abrasive material in deionized water, and performing ultrasonic oscillation treatment at the frequency of 30KHz for 20min to remove surface impurities;
b. placing the cleaned diamond abrasive in a hydrochloric acid solution with the concentration of 1mol/L, heating to 50 ℃, soaking for 2 hours by using ultrasonic treatment with the frequency of 20KHz, cleaning for 3 times by using an acetone solution after soaking, cleaning for 1 time by using pure water, placing the diamond abrasive in an oven after cleaning, and drying at 120 ℃;
c. adding the dried diamond grinding material into a reaction vessel filled with 20 parts of sodium chloride and 20 parts of barium chloride, adding 10 parts of tungsten metal powder with the particle size of 3-10 mu m, fully stirring, uniformly mixing, introducing nitrogen for protection, heating to 900 ℃, and preserving heat for 2 hours;
d. after the heat preservation is finished, cooling the diamond abrasive to room temperature along with the furnace, repeatedly boiling and cleaning for 3 times by using pure water, oscillating and stirring by using ultrasonic waves with the frequency of 20KHz, after the cleaning is finished, sending the diamond abrasive into an oven, and drying for 2 hours at 150 ℃ to obtain the modified diamond abrasive;
s3, preparing a ceramic bonding agent:
adding 12 parts of silicon dioxide, 6 parts of boron oxide, 6 parts of aluminum oxide and 6 parts of titanium dioxide into a ball mill, grinding the materials to a required particle size, fully and uniformly mixing, moving the materials into a muffle furnace, heating to 1500 ℃, calcining at a high temperature for 1.5h, taking out the materials, cooling, adding the materials into the ball mill, and grinding the materials to particles with the particle size of 10-30 mu m to obtain the ceramic bond;
s4, fully mixing the prepared modified diamond abrasive, ceramic bond and pore-forming agent, pressing the mixture into a blank at room temperature, and drying the blank in a drying chamber at the temperature of 80 ℃ for 12 hours;
s5, after drying, moving the blank into a muffle furnace, heating to 450 ℃ at a heating rate of 4 ℃, keeping the temperature for 1.5h, then continuing heating to 750 ℃ at a rate of 3 ℃/min, and keeping the temperature for 2 h;
s6, after the heat preservation is finished, cooling to 500 ℃ at the cooling rate of 3 ℃, preserving the heat for 1 hour, and then cooling to room temperature along with the furnace to obtain the superfine diamond grinding wheel.
Example 2
Compared with the embodiment 1, the embodiment increases the addition amount of the coating metal in the diamond abrasive modification process;
s1, placing diamond grinding materials into a ball mill, grinding the diamond grinding materials into particles with the particle sizes of 1-3 microns, 5-10 microns and 20-30 microns respectively, weighing 30 parts by weight of 1-3 microns diamond grinding materials, 15 parts by weight of 5-10 microns diamond grinding materials and 15 parts by weight of 20-30 microns diamond grinding materials, and uniformly mixing the materials to obtain the diamond grinding materials;
s2, modifying the diamond abrasive:
a. soaking the diamond abrasive material in deionized water, and performing ultrasonic oscillation treatment at the frequency of 30KHz for 20min to remove surface impurities;
b. placing the cleaned diamond abrasive in a hydrochloric acid solution with the concentration of 1mol/L, heating to 50 ℃, soaking for 2 hours by using ultrasonic treatment with the frequency of 20KHz, cleaning for 3 times by using an acetone solution after soaking, cleaning for 1 time by using pure water, placing the diamond abrasive in an oven after cleaning, and drying at 120 ℃;
c. adding the dried diamond grinding material into a reaction vessel filled with 20 parts of sodium chloride and 20 parts of barium chloride, adding 15 parts of tungsten metal powder with the particle size of 3-10 mu m, fully stirring, uniformly mixing, introducing nitrogen for protection, heating to 900 ℃, and preserving heat for 2 hours;
d. after the heat preservation is finished, cooling the diamond abrasive to room temperature along with the furnace, repeatedly boiling and cleaning for 3 times by using pure water, oscillating and stirring by using ultrasonic waves with the frequency of 20KHz, after the cleaning is finished, sending the diamond abrasive into an oven, and drying for 2 hours at 150 ℃ to obtain the modified diamond abrasive;
s3, preparing a ceramic bonding agent:
adding 12 parts of silicon dioxide, 6 parts of boron oxide, 6 parts of aluminum oxide and 6 parts of titanium dioxide into a ball mill, grinding the materials to a required particle size, fully and uniformly mixing, moving the materials into a muffle furnace, heating to 1500 ℃, calcining at a high temperature for 1.5h, taking out the materials, cooling, adding the materials into the ball mill, and grinding the materials to particles with the particle size of 10-30 mu m to obtain the ceramic bond;
s4, fully mixing the prepared modified diamond abrasive, ceramic bond and pore-forming agent, pressing the mixture into a blank at room temperature, and drying the blank in a drying chamber at the temperature of 80 ℃ for 12 hours;
s5, after drying, moving the blank into a muffle furnace, heating to 450 ℃ at a heating rate of 4 ℃, keeping the temperature for 1.5h, then continuing heating to 750 ℃ at a rate of 3 ℃/min, and keeping the temperature for 2 h;
s6, after the heat preservation is finished, cooling to 500 ℃ at the cooling rate of 3 ℃, preserving the heat for 1 hour, and then cooling to room temperature along with the furnace to obtain the superfine diamond grinding wheel.
Example 3
This example reduced the hydrochloric acid concentration compared to example 1.
S1, placing diamond grinding materials into a ball mill, grinding the diamond grinding materials into particles with the particle sizes of 1-3 microns, 5-10 microns and 20-30 microns respectively, weighing 30 parts by weight of 1-3 microns diamond grinding materials, 15 parts by weight of 5-10 microns diamond grinding materials and 15 parts by weight of 20-30 microns diamond grinding materials, and uniformly mixing the materials to obtain the diamond grinding materials;
s2, modifying the diamond abrasive:
a. soaking the diamond abrasive material in deionized water, and performing ultrasonic oscillation treatment at the frequency of 30KHz for 20min to remove surface impurities;
b. placing the cleaned diamond abrasive in a hydrochloric acid solution with the concentration of 0.5mol/L, heating to 50 ℃, soaking for 2 hours by using ultrasonic treatment with the frequency of 20KHz, cleaning for 3 times by using an acetone solution after soaking, cleaning for 1 time by using pure water, placing the diamond abrasive in an oven after cleaning, and drying at 120 ℃;
c. adding the dried diamond grinding material into a reaction vessel filled with 20 parts of sodium chloride and 20 parts of barium chloride, adding 10 parts of tungsten metal powder with the particle size of 3-10 mu m, fully stirring, uniformly mixing, introducing nitrogen for protection, heating to 900 ℃, and preserving heat for 2 hours;
d. after the heat preservation is finished, cooling the diamond abrasive to room temperature along with the furnace, repeatedly boiling and cleaning for 3 times by using pure water, oscillating and stirring by using ultrasonic waves with the frequency of 20KHz, after the cleaning is finished, sending the diamond abrasive into an oven, and drying for 2 hours at 150 ℃ to obtain the modified diamond abrasive;
s3, preparing a ceramic bonding agent:
adding 12 parts of silicon dioxide, 6 parts of boron oxide, 6 parts of aluminum oxide and 6 parts of titanium dioxide into a ball mill, grinding the materials to a required particle size, fully and uniformly mixing, moving the materials into a muffle furnace, heating to 1500 ℃, calcining at a high temperature for 1.5h, taking out the materials, cooling, adding the materials into the ball mill, and grinding the materials to particles with the particle size of 10-30 mu m to obtain the ceramic bond;
s4, fully mixing the prepared modified diamond abrasive, ceramic bond and pore-forming agent, pressing the mixture into a blank at room temperature, and drying the blank in a drying chamber at the temperature of 80 ℃ for 12 hours;
s5, after drying, moving the blank into a muffle furnace, heating to 450 ℃ at a heating rate of 4 ℃, keeping the temperature for 1.5h, then continuing heating to 750 ℃ at a rate of 3 ℃/min, and keeping the temperature for 2 h;
s6, after the heat preservation is finished, cooling to 500 ℃ at the cooling rate of 3 ℃, preserving the heat for 1 hour, and then cooling to room temperature along with the furnace to obtain the superfine diamond grinding wheel.
Example 4
Compared with the embodiment 1, the embodiment reduces the addition amount of sodium chloride and barium chloride in the diamond abrasive modification process;
s1, placing diamond grinding materials into a ball mill, grinding the diamond grinding materials into particles with the particle sizes of 1-3 microns, 5-10 microns and 20-30 microns respectively, weighing 30 parts by weight of 1-3 microns diamond grinding materials, 15 parts by weight of 5-10 microns diamond grinding materials and 15 parts by weight of 20-30 microns diamond grinding materials, and uniformly mixing the materials to obtain the diamond grinding materials;
s2, modifying the diamond abrasive:
a. soaking the diamond abrasive material in deionized water, and performing ultrasonic oscillation treatment at the frequency of 30KHz for 20min to remove surface impurities;
b. placing the cleaned diamond abrasive in a hydrochloric acid solution with the concentration of 1mol/L, heating to 50 ℃, soaking for 2 hours by using ultrasonic treatment with the frequency of 20KHz, cleaning for 3 times by using an acetone solution after soaking, cleaning for 1 time by using pure water, placing the diamond abrasive in an oven after cleaning, and drying at 120 ℃;
c. adding the dried diamond grinding material into a reaction vessel filled with 20 parts of sodium chloride and 20 parts of barium chloride, adding 10 parts of tungsten metal powder with the particle size of 3-10 mu m, fully stirring, uniformly mixing, introducing nitrogen for protection, heating to 900 ℃, and preserving heat for 2 hours;
d. after the heat preservation is finished, cooling the diamond abrasive to room temperature along with the furnace, repeatedly boiling and cleaning for 3 times by using pure water, oscillating and stirring by using ultrasonic waves with the frequency of 20KHz, after the cleaning is finished, sending the diamond abrasive into an oven, and drying for 2 hours at 150 ℃ to obtain the modified diamond abrasive;
s3, preparing a ceramic bonding agent:
adding 12 parts of silicon dioxide, 6 parts of boron oxide, 6 parts of aluminum oxide and 6 parts of titanium dioxide into a ball mill, grinding the materials to a required particle size, fully and uniformly mixing, moving the materials into a muffle furnace, heating to 1500 ℃, calcining at a high temperature for 1.5h, taking out the materials, cooling, adding the materials into the ball mill, and grinding the materials to particles with the particle size of 10-30 mu m to obtain the ceramic bond;
s4, fully mixing the prepared modified diamond abrasive, ceramic bond and pore-forming agent, pressing the mixture into a blank at room temperature, and drying the blank in a drying chamber at the temperature of 80 ℃ for 12 hours;
s5, after drying, moving the blank into a muffle furnace, heating to 450 ℃ at a heating rate of 4 ℃, keeping the temperature for 1.5h, then continuing heating to 750 ℃ at a rate of 3 ℃/min, and keeping the temperature for 2 h;
s6, after the heat preservation is finished, cooling to 500 ℃ at the cooling rate of 3 ℃, preserving the heat for 1 hour, and then cooling to room temperature along with the furnace to obtain the superfine diamond grinding wheel.
Comparative example 1
In contrast to example 1, this comparative example did not modify the diamond abrasive;
s1, placing diamond grinding materials into a ball mill, grinding the diamond grinding materials into particles with the particle sizes of 1-3 microns, 5-10 microns and 20-30 microns respectively, weighing 30 parts by weight of 1-3 microns diamond grinding materials, 15 parts by weight of 5-10 microns diamond grinding materials and 15 parts by weight of 20-30 microns diamond grinding materials, and uniformly mixing the materials to obtain the diamond grinding materials;
s2, preparing a ceramic bonding agent:
adding 12 parts of silicon dioxide, 6 parts of boron oxide, 6 parts of aluminum oxide and 6 parts of titanium dioxide into a ball mill, grinding the materials to a required particle size, fully and uniformly mixing, moving the materials into a muffle furnace, heating to 1500 ℃, calcining at a high temperature for 1.5h, taking out the materials, cooling, adding the materials into the ball mill, and grinding the materials to particles with the particle size of 10-30 mu m to obtain the ceramic bond;
s3, fully mixing the prepared diamond abrasive, ceramic bond and pore-forming agent, pressing the mixture into a blank at room temperature, and drying the blank in a drying chamber at the temperature of 80 ℃ for 12 hours;
s4, after drying, moving the blank into a muffle furnace, heating to 450 ℃ at a heating rate of 4 ℃, keeping the temperature for 1.5h, then continuing heating to 750 ℃ at a rate of 3 ℃/min, and keeping the temperature for 2 h;
and S5, after the heat preservation is finished, cooling to 500 ℃ at the cooling rate of 3 ℃, preserving the heat for 1 hour, and cooling to room temperature along with the furnace to obtain the superfine diamond grinding wheel.
Comparative example 2
Compared with example 1, this comparative example did not use hydrochloric acid to pretreat the diamond powder;
s1, placing diamond grinding materials into a ball mill, grinding the diamond grinding materials into particles with the particle sizes of 1-3 microns, 5-10 microns and 20-30 microns respectively, weighing 30 parts by weight of 1-3 microns diamond grinding materials, 15 parts by weight of 5-10 microns diamond grinding materials and 15 parts by weight of 20-30 microns diamond grinding materials, and uniformly mixing the materials to obtain the diamond grinding materials;
s2, modifying the diamond abrasive:
a. soaking the diamond abrasive material in deionized water, and performing ultrasonic oscillation treatment at the frequency of 30KHz for 20min to remove surface impurities;
b. after cleaning, placing the diamond abrasive in an oven, and drying at 120 ℃;
c. adding the dried diamond grinding material into a reaction vessel filled with 20 parts of sodium chloride and 20 parts of barium chloride, adding 10 parts of tungsten metal powder with the particle size of 3-10 mu m, fully stirring, uniformly mixing, introducing nitrogen for protection, heating to 900 ℃, and preserving heat for 2 hours;
d. after the heat preservation is finished, cooling the diamond abrasive to room temperature along with the furnace, repeatedly boiling and cleaning for 3 times by using pure water, oscillating and stirring by using ultrasonic waves with the frequency of 20KHz, after the cleaning is finished, sending the diamond abrasive into an oven, and drying for 2 hours at 150 ℃ to obtain the modified diamond abrasive;
s3, preparing a ceramic bonding agent:
adding 12 parts of silicon dioxide, 6 parts of boron oxide, 6 parts of aluminum oxide and 6 parts of titanium dioxide into a ball mill, grinding the materials to a required particle size, fully and uniformly mixing, moving the materials into a muffle furnace, heating to 1500 ℃, calcining at a high temperature for 1.5h, taking out the materials, cooling, adding the materials into the ball mill, and grinding the materials to particles with the particle size of 10-30 mu m to obtain the ceramic bond;
s4, fully mixing the prepared modified diamond abrasive, ceramic bond and pore-forming agent, pressing the mixture into a blank at room temperature, and drying the blank in a drying chamber at the temperature of 80 ℃ for 12 hours;
s5, after drying, moving the blank into a muffle furnace, heating to 450 ℃ at a heating rate of 4 ℃, keeping the temperature for 1.5h, then continuing heating to 750 ℃ at a rate of 3 ℃/min, and keeping the temperature for 2 h;
s6, after the heat preservation is finished, cooling to 500 ℃ at the cooling rate of 3 ℃, preserving the heat for 1 hour, and then cooling to room temperature along with the furnace to obtain the superfine diamond grinding wheel.
Comparative example 3
Compared with example 1, the comparative example does not add sodium chloride and barium chloride;
s1, placing diamond grinding materials into a ball mill, grinding the diamond grinding materials into particles with the particle sizes of 1-3 microns, 5-10 microns and 20-30 microns respectively, weighing 30 parts by weight of 1-3 microns diamond grinding materials, 15 parts by weight of 5-10 microns diamond grinding materials and 15 parts by weight of 20-30 microns diamond grinding materials, and uniformly mixing the materials to obtain the diamond grinding materials;
s2, modifying the diamond abrasive:
a. soaking the diamond abrasive material in deionized water, and performing ultrasonic oscillation treatment at the frequency of 30KHz for 20min to remove surface impurities;
b. placing the cleaned diamond abrasive in a hydrochloric acid solution with the concentration of 1mol/L, heating to 50 ℃, soaking for 2 hours by using ultrasonic treatment with the frequency of 20KHz, cleaning for 3 times by using an acetone solution after soaking, cleaning for 1 time by using pure water, placing the diamond abrasive in an oven after cleaning, and drying at 120 ℃;
c. adding the dried diamond grinding material into a reaction vessel filled with 20 parts of sodium chloride and 20 parts of barium chloride, adding 10 parts of tungsten metal powder with the particle size of 3-10 mu m, fully stirring, uniformly mixing, introducing nitrogen for protection, heating to 900 ℃, and preserving heat for 2 hours;
d. after the heat preservation is finished, cooling the diamond abrasive to room temperature along with the furnace, repeatedly boiling and cleaning for 3 times by using pure water, oscillating and stirring by using ultrasonic waves with the frequency of 20KHz, after the cleaning is finished, sending the diamond abrasive into an oven, and drying for 2 hours at 150 ℃ to obtain the modified diamond abrasive;
s3, preparing a ceramic bonding agent:
adding 12 parts of silicon dioxide, 6 parts of boron oxide, 6 parts of aluminum oxide and 6 parts of titanium dioxide into a ball mill, grinding the materials to a required particle size, fully and uniformly mixing, moving the materials into a muffle furnace, heating to 1500 ℃, calcining at a high temperature for 1.5h, taking out the materials, cooling, adding the materials into the ball mill, and grinding the materials to particles with the particle size of 10-30 mu m to obtain the ceramic bond;
s4, fully mixing the prepared modified diamond abrasive, ceramic bond and pore-forming agent, pressing the mixture into a blank at room temperature, and drying the blank in a drying chamber at the temperature of 80 ℃ for 12 hours;
s5, after drying, moving the blank into a muffle furnace, heating to 450 ℃ at a heating rate of 4 ℃, keeping the temperature for 1.5h, then continuing heating to 750 ℃ at a rate of 3 ℃/min, and keeping the temperature for 2 h;
s6, after the heat preservation is finished, cooling to 500 ℃ at the cooling rate of 3 ℃, preserving the heat for 1 hour, and then cooling to room temperature along with the furnace to obtain the superfine diamond grinding wheel.
Grinding experiments were carried out using the diamond grinding wheels prepared in examples 1 to 4 and comparative examples 1 to 3 using an ultra-precision grinding machine to grind the surface roughness of the workpiece;
the grindability of the diamond grinding wheels prepared in the examples 1 to 4 and the comparative examples 1 to 3 is detected by using a Walter400combi type cylindrical grinding machining center, the grinding workpiece is a monocrystalline silicon rod, the single-side grinding amount is 3mm, the grinding time is 30min, the rotating speed is 3500rpm, and the grinding consumption ratio of the grinding silicon rod volume to the grinding wheel consumption volume is calculated;
the results of the measurements are shown in the following table:
through comparison between the embodiment 1 and the embodiment 2, the abrasion ratio of the grinding wheel is further increased after the addition amount of the metal powder of the coating is increased, and the bonding firmness of diamond particles is enhanced;
through comparison of the embodiment 1, the embodiment 3, the comparative example 1 and the comparative example 2, the hydrochloric acid treatment time and concentration in the diamond particle modification process have important influence on the diamond activation degree, the diamond activation degree is enhanced and the bonding capability is increased along with the time extension;
through comparison of examples 1 and 4 and comparative examples 1 and 3, the chloride salt plays a role of a medium in the carbonization and bonding process of the diamond and the metal powder and can assist the bonding of the coated metal powder and the diamond particles.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A kind of ultra-fine granularity diamond emery wheel, characterized by; the ultrafine-granularity diamond grinding wheel comprises the following components in parts by weight: 50-60 parts of modified diamond abrasive, 15-30 parts of ceramic bond and 3-5 parts of pore-forming agent.
2. The ultra-fine grain diamond grinding wheel according to the material claim 1, characterized in that: the modified diamond abrasive is a mixture of modified diamond abrasives with the grain sizes of 1-3 microns, 5-10 microns and 20-30 microns; the proportion of the 1-3 micron modified diamond abrasive, the 5-10 micron modified diamond abrasive and the 20-30 micron diamond abrasive is (25-30): (12-15): (13-15).
3. The ultra-fine grain diamond grinding wheel according to the material claim 1, characterized in that: the preparation process of the modified diamond abrasive material comprises the following steps:
a. soaking the diamond abrasive material in deionized water, and cleaning by ultrasonic oscillation treatment at 20-30KHz for 10-20 min;
b. placing the cleaned diamond abrasive in a hydrochloric acid solution with the concentration of 0.5-1mol/L, soaking for 1-2h by ultrasonic treatment, cleaning for 2-3 times by using an acetone solution, cleaning by using pure water, after the cleaning is finished, placing the diamond abrasive in an oven, and drying at 80-120 ℃;
c. adding the dried diamond abrasive into a reaction vessel filled with sodium chloride and barium chloride, adding 10-15 parts of plating layer metal powder with the particle size of 3-10 mu m, fully stirring, uniformly mixing, introducing nitrogen for protection, heating to 800-900 ℃, and preserving heat for 1-2 h;
d. and after the heat preservation is finished, cooling the diamond abrasive to room temperature along with the furnace, repeatedly boiling and cleaning for 3-5 times by using pure water, oscillating and stirring by using ultrasonic waves, after the cleaning is finished, sending the diamond abrasive into an oven, and drying for 1-2 hours at the temperature of 100-.
4. The ultra-fine grain diamond grinding wheel according to the material claim 3, characterized in that: in the step c, the proportion of the addition amount of the sodium chloride and the barium chloride to the addition amount of the diamond grinding material is (15-25): (15-25): (50-60).
5. The ultra-fine grain diamond grinding wheel according to the material claim 3, characterized in that: in the step c, the plating metal powder is any one of tungsten, titanium, molybdenum and chromium metal powder with the grain diameter of 3-10 μm.
6. The ultra-fine grain diamond grinding wheel according to the material claim 1, characterized in that: the ceramic binder is an oxide particle mixture with the particle size of 10-30 mu m, and comprises the following components in parts by weight: 8-12 parts of silicon dioxide, 2-6 parts of boron oxide, 2-6 parts of aluminum oxide and 3-6 parts of titanium dioxide.
7. The ultra-fine grain diamond grinding wheel according to the material claim 1, characterized in that: the pore-forming agent is any one of walnut shell powder and charcoal powder with the particle size of 1-3 microns.
8. The processing technology of the diamond grinding wheel with the ultrafine granularity is characterized by comprising the following steps:
s1, placing diamond grinding materials in a ball mill, grinding the diamond grinding materials to required particle sizes respectively, weighing the diamond grinding materials with the corresponding particle sizes according to a weight ratio, and blending;
s2, modifying the blended diamond abrasive;
s3, uniformly mixing silicon dioxide, boron oxide, aluminum oxide and titanium dioxide, adding the mixture into a ball mill, grinding the mixture to a required particle size, taking the mixture out, transferring the mixture into a muffle furnace, heating the mixture to 1200-1500 ℃, calcining the mixture for 2-3h, cooling the mixture along with the furnace, standing the mixture, cooling the mixture, and grinding the mixture to the required particle size to obtain the ceramic bond;
s4, mixing the ceramic bond, the modified diamond abrasive and the pore-forming agent, pressing at room temperature to form a shape, and drying the pressed blank in a drying chamber at the temperature of 80-120 ℃ for 8-12 h;
s5, after drying, transferring the blank into a muffle furnace, heating to 450-;
s6, after the heat preservation is finished, cooling to 450-fold sand-adding 500 ℃ at the cooling rate of 2-3 ℃, preserving the heat for 1h, and then cooling to room temperature along with the furnace to obtain the superfine diamond grinding wheel.
9. The process of claim 8, wherein the diamond grinding wheel with ultra-fine particle size comprises: in the step S4, the pressure applied during the press molding is 12 to 15 MPa.
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