CN114340226A - PCB manufacturing method and PCB - Google Patents
PCB manufacturing method and PCB Download PDFInfo
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- CN114340226A CN114340226A CN202111638367.2A CN202111638367A CN114340226A CN 114340226 A CN114340226 A CN 114340226A CN 202111638367 A CN202111638367 A CN 202111638367A CN 114340226 A CN114340226 A CN 114340226A
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- daughter board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 40
- 238000010030 laminating Methods 0.000 claims abstract description 24
- 238000002844 melting Methods 0.000 claims abstract description 3
- 230000008018 melting Effects 0.000 claims abstract description 3
- 239000010408 film Substances 0.000 claims description 85
- 239000013039 cover film Substances 0.000 claims description 17
- 238000003475 lamination Methods 0.000 claims description 17
- 239000002390 adhesive tape Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 238000000608 laser ablation Methods 0.000 claims description 6
- 238000011282 treatment Methods 0.000 claims description 6
- 238000006087 Brown hydroboration reaction Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 abstract description 32
- 229920005989 resin Polymers 0.000 abstract description 32
- 238000011049 filling Methods 0.000 abstract description 22
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 15
- 238000013461 design Methods 0.000 description 9
- 238000004381 surface treatment Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
The invention relates to the technical field of PCBs, and discloses a PCB and a manufacturing method thereof. A method of fabricating a PCB, comprising: providing a release film layer, a prepreg, a first sub-board and a second sub-board; at least one of the first sub-board and the second sub-board is provided with at least two through holes; the outer-layer board surface of the target daughter board provided with the through holes is coated with a covering film in an attached mode, air holes are formed in the covering film at the positions corresponding to the through holes, and the aperture of each air hole is smaller than that of the corresponding through hole; laminating and laminating the release film layer, the first sub-board, the prepreg, the second sub-board and the release film layer in sequence, wherein the prepreg flows in a melting manner to fill the through hole in the laminating process; and removing the release film layer and the covering film. The embodiment of the invention can prevent the resin overflowing from the orifice of the former through hole (the through hole filled with the resin firstly) of the two adjacent through holes from flowing into the orifice of the latter through hole (the through hole filled with the resin later) to a certain extent, thereby obtaining good hole filling quality and improving the minimum hole spacing capability.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a PCB manufacturing method and a PCB.
Background
With the continuous development of P sheet materials and the increasing level of call and attention of clients to the reduction of production cost, the PCB with the M + N structure and the daughter board with the resin plug hole design can more and more adopt the lamination flow glue hole filling technology to cancel the resin plug hole process of the daughter board, thereby achieving the purpose of reducing the production cost.
The laminated gummosis hole filling technology is characterized in that a release film layer, a first daughter board, a prepreg, a second daughter board and the release film layer are sequentially laminated and pressed, and in the high-temperature pressing process, the prepreg melts and flows into through holes formed in the first daughter board and/or the second daughter board from the hole bottom, so that the gummosis hole filling effect is achieved.
However, the current lamination flow filling technology is easy to have bad phenomena such as filling holes and cavities, which are mainly due to the following reasons:
different aperture designs of the through holes on the daughter board, inner layer circuit designs and other factors can cause the difference of the flow rate of the hole filling resin, so that the time consumed by filling the through holes with the resin is inconsistent, namely the sequence is provided;
meanwhile, in the process of pressing different daughter boards into a mother board by using the release film layers, fine gaps are generated between the daughter boards and the release film layers on the outer layers of the daughter boards due to low matching density, and the gaps provide a way for resin diffusion;
therefore, the resin in the first through hole filled first flows along the path and then flows into the openings of other nearby second through holes which are not filled yet, so that the resin flows into the second through holes from the openings and the two ends of the hole bottom simultaneously, air is easy to remain in the second through holes, and hole filling cavities are caused.
The filled hole will cause various product quality problems such as reliability risk of the subsequent pofv (plating over filled via) cap.
Therefore, there is a need for an improved lamination flow-through hole-filling technique to improve the hole-filling quality.
Disclosure of Invention
The invention aims to provide a PCB manufacturing method and a PCB, and aims to solve the problem of poor hole filling quality in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of fabricating a PCB, comprising:
providing a release film layer, a prepreg, a first sub-board and a second sub-board;
at least one of the first sub-board and the second sub-board is provided with at least two through holes; covering films are attached to the outer-layer board surfaces of the target sub-boards with the through holes formed in the first sub-board and the second sub-board, air holes are formed in the positions, corresponding to the through holes, of the covering films respectively, and the aperture of each air hole is smaller than that of the corresponding through hole;
laminating and laminating the release film layer, the first sub-board, the prepreg, the second sub-board and the release film layer in sequence, wherein the prepreg flows in a melting manner to fill the through hole in the laminating process;
and after the lamination is pressed, removing the release film layer and the covering film.
Optionally, the cover film is attached to a local area of the outer layer board surface, and the local area covers a distribution area of the through holes and is larger than an area of the through holes.
Optionally, the air holes and the corresponding through holes are coaxially arranged.
Optionally, the cover film is a dry film or an adhesive tape.
Optionally, when the cover film is an adhesive tape, the manufacturing method of the vent hole comprises the following steps:
and the adhesive tape is provided with the air holes in a laser ablation mode.
Optionally, when the cover film is a dry film, the method for manufacturing the air holes comprises the following steps:
forming the air holes in the dry film in a laser ablation manner;
or, only the area of the dry film corresponding to the air holes is removed through an exposure and development mode, and the air holes are formed.
Optionally, removing the dry film by an exposure and development method or a plate grinding method; and removing the adhesive tape by adopting a tearing mode or a plate grinding mode.
Optionally, before the lamination is performed, the surface of the target daughter board which is subjected to lamination with the release film layer is processed to reduce a gap formed by the target daughter board and the surface of the release film layer in a matching manner;
and simultaneously, before laminating and laminating, respectively treating the surfaces of the first daughter board and the second daughter board which are laminated with the prepreg so as to improve the bonding force between the first daughter board and the prepreg and between the second daughter board and the prepreg.
Optionally, the processing the surface of the target daughter board pressed with the release film layer, and the processing the surface of the first daughter board and the surface of the second daughter board pressed with the prepreg with respect to the first daughter board and the second daughter board respectively include:
firstly, pasting an anti-plating film on the surface of the target daughter board pressed with the release film layer;
performing brown oxidation treatment on the first sub-board and the second sub-board;
and finally, removing the anti-plating film on the surface of the target daughter board.
A PCB, wherein the PCB is manufactured according to any of the above PCB manufacturing methods.
Compared with the prior art, the invention has the beneficial effects that:
according to the embodiment of the invention, the cover film provided with the air holes is pasted on the outer layer board surface of the target daughter board, the air holes are formed in the hole opening positions of the through holes, and the hole diameters of the air holes are smaller than those of the through holes in the corresponding positions, so that the hole opening diameters of the through holes are reduced, and the resin flowing from the hole bottom (with larger hole diameter) to the hole opening (with smaller hole diameter) is partially blocked at the hole opening positions in the subsequent lamination glue flowing process, so that the precipitation speed of the resin at the hole opening is reduced.
Therefore, the embodiment of the invention can prevent the resin overflowing from the orifice of the former through hole (the through hole filled with the resin firstly) of the two adjacent through holes from flowing into the orifice of the latter through hole (the through hole filled with the resin later) to a certain extent, so that the latter always keeps the glue filling direction filled from the hole bottom upwards, the resin is prevented from flowing into the latter through the orifice and the two end parts of the hole bottom simultaneously, the air remained in the latter through the hole after the glue filling is finished is effectively avoided, the good hole filling quality is finally obtained, and the product quality is improved. Meanwhile, due to the fact that the process reduces the glue flowing influence between two adjacent through holes, the minimum distance design of the through holes can be further reduced on the basis of the conventional design, and the minimum hole distance capacity is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a PCB according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a method for manufacturing a PCB according to an embodiment of the present invention.
Fig. 3 is a flowchart of another PCB manufacturing method according to an embodiment of the present invention.
Fig. 4 is a schematic view of a difference between surface appearances of the target daughter board and the release film layer before and after the surface treatment according to the embodiment of the present invention.
Illustration of the drawings: the structure comprises a release film layer 1, a prepreg 2, a first sub-board 3, a second sub-board 4, a through hole 5, a covering film 6 and an air vent 7.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and fig. 2, an embodiment of the present invention provides a method for manufacturing a PCB, including:
wherein, at least one of first daughter board 3 and second daughter board 4 has seted up two at least through-holes 5, and opens the target daughter board that is equipped with through-hole 5 in first daughter board 3 and the second daughter board 4, and the outer face facing of target daughter board has covered and covers membrane 6, covers membrane 6 and seted up bleeder vent 7 respectively in the corresponding position of each through-hole 5, and the aperture of bleeder vent 7 is less than the aperture of corresponding through-hole 5.
It should be noted that, the outer-layer board surface of the target daughter board specifically refers to a side board surface of the outer layer of the board surface of the two opposite sides of the target daughter board after the target daughter board and the other daughter boards are pressed into the mother board.
And 102, laminating and laminating the release film layer 1, the first sub-board 3, the prepreg 2, the second sub-board 4 and the release film layer 1 in sequence, wherein the prepreg 2 is melted and flows to fill the through hole 5 in the laminating process.
And 103, removing the release film layer 1 and the covering film 6 after laminating and laminating.
According to the embodiment of the invention, the cover film 6 provided with the air holes 7 is pasted on the outer layer board surface of the target daughter board, the air holes 7 are formed in the hole opening positions of the through holes 5, and the hole diameters of the air holes 7 are smaller than those of the through holes 5 in the corresponding positions, so that the hole opening diameters of the through holes 5 are reduced, and in the subsequent lamination glue flowing process, resin flowing from the hole bottom (with larger hole diameter) to the hole opening (with smaller hole diameter) is partially blocked at the hole opening positions, so that the precipitation speed of the resin at the hole opening is reduced.
Therefore, the embodiment of the invention can prevent the resin overflowing from the orifice of the former through hole (the through hole 5 filled with the resin first) of the two adjacent through holes 5 from flowing into the orifice of the latter through hole (the through hole 5 filled with the resin later) to a certain extent, so that the latter always keeps the glue filling direction filled from the hole bottom upwards, and the resin is prevented from flowing into the latter through the orifice and the two ends of the hole bottom simultaneously, thereby effectively preventing the latter from remaining air inside after the glue filling is finished, finally obtaining good hole filling quality and improving the quality of products. Meanwhile, due to the fact that the process reduces the influence of glue flowing between two adjacent through holes 5, the minimum distance design of the through holes 5 can be further reduced on the basis of the conventional design, and the minimum hole distance capacity is effectively improved.
In an alternative embodiment, the cover film 6 is attached to a local area of the outer board surface, and the local area needs to cover the distribution area of the through holes 5 and is larger than the area of the through holes 5. In this way, some material costs can be saved. Of course, in another embodiment, the cover film 6 may be attached to the entire outer layer board surface of the target daughter board.
In order to realize good gluey effect that hinders, bleeder vent 7 and the coaxial setting of the through-hole 5 that corresponds can guarantee like this to cover film 6 and can play good gluey effect of hindering in the whole circumferencial direction homoenergetic of through-hole 5, avoid at lamination gummosis in-process current through-hole 5 and the adjacent other through-holes 5 of its periphery all directions produce the influence.
For example, the cover film 6 used in the embodiment of the present invention is specifically a dry film or an adhesive tape, and may be made of other materials capable of resisting high temperature.
When the cover film 6 is a dry film, the specific manufacturing methods of the air holes 7 are two types: firstly, a laser ablation mode is adopted, and an air hole 7 is formed in a covering film 6; second, only the region of the dry film corresponding to the airing hole 7 is removed by the exposure developing method, and the airing hole 7 is formed. Subsequently, the dry film can be removed by: and removing by adopting an exposure and development mode or a plate grinding mode.
When the cover film 6 is specifically an adhesive tape, the specific manufacturing method of the air holes 7 comprises the following steps: and the adhesive tape is provided with the air holes in a laser ablation mode. Subsequently, the removing method of the adhesive tape can be as follows: and removing by adopting a tearing way or a plate grinding way.
Referring to fig. 3, an embodiment of the present invention further provides another method for manufacturing a PCB, including:
wherein, at least one of first daughter board 3 and second daughter board 4 has seted up two at least through-holes 5, and opens the target daughter board that is equipped with through-hole 5 in first daughter board 3 and the second daughter board 4, and the outer face facing of target daughter board has covered and covers membrane 6, covers membrane 6 and seted up bleeder vent 7 respectively in the corresponding position of each through-hole 5, and the aperture of bleeder vent 7 is less than the aperture of corresponding through-hole 5.
It should be noted that, the outer-layer board surface of the target daughter board specifically refers to a side board surface of the outer layer of the board surface of the two opposite sides of the target daughter board after the target daughter board and the other daughter boards are pressed into the mother board.
meanwhile, the surfaces of the first sub-board 3 and the second sub-board 4 which are pressed with the prepreg 2 are respectively treated so as to improve the binding force between the first sub-board 3 and the prepreg 2 and between the second sub-board 4 and the prepreg 2.
According to the preset lamination sequence of the release film layer 1, the first daughter board 3, the prepreg 2, the second daughter board 4 and the release film layer 1, the outer surface of the target daughter board provided with the through hole 5 is in contact with the release film layer 1, if a large gap is formed between the outer surface of the target daughter board and the release film layer, in the subsequent lamination glue flowing process, the glue flowing filled into the through hole 5 overflows through the gap, and various adverse phenomena are caused. Therefore, in the embodiment of the invention, before the board stacking operation, the surface of the outer surface of the target sub-board is subjected to surface treatment in advance to reduce a gap generated by matching between the target sub-board and the release film layer 1, so that the glue flowing amount of the orifice of the through hole 5 is reduced.
And 203, laminating and laminating the release film layer 1, the first sub-board 3, the prepreg 2, the second sub-board 4 and the release film layer 1 in sequence, wherein the prepreg 2 is melted and flows to fill the through hole 5 in the laminating process.
And 204, removing the release film layer 1 and the covering film 6 after laminating and laminating.
On one hand, the cover film 6 provided with the air holes 7 is attached to the outer-layer board surface of the target sub-board, the air holes 7 are formed in the hole opening positions of the through holes 5, and the hole diameters of the air holes 7 are smaller than the hole diameters of the through holes 5 in the corresponding positions, so that the hole opening diameters of the through holes 5 are reduced, and in the subsequent lamination glue flowing process, resin flowing from the hole bottom (with a larger hole diameter) to the hole opening (with a smaller hole diameter) is partially blocked at the hole opening positions, so that the precipitation speed of the resin at the hole opening is reduced, the phenomenon that air is still remained in the through holes 5 filled with the resin after the glue filling is completed can be effectively avoided, and finally, good hole filling quality is obtained, and the product quality is improved. Meanwhile, due to the fact that the process reduces the influence of glue flowing between two adjacent through holes 5, the minimum distance design of the through holes 5 can be further reduced on the basis of the conventional design, and the minimum hole distance capacity is effectively improved.
On the other hand, in the hole filling process provided by the embodiment of the invention, the matching tightness between the target daughter board and the release film layer 1 is improved in a surface treatment mode, and a resin precipitation and diffusion path is shortened, so that the overflow amount of resin is further effectively reduced, and the generation probability of a hole filling cavity phenomenon is reduced. Meanwhile, because the binding force between the first sub-board 3 and the prepreg 2 and between the second sub-board 4 and the prepreg 2 is improved by a surface treatment mode, the layering phenomenon can be avoided, the reliability of the product is improved,
in an alternative embodiment, the processing of the surface of the target sub-board laminated with the release film layer 1 and the processing of the surfaces of the first sub-board 3 and the second sub-board 4 laminated with the prepreg 2 respectively includes:
firstly, pasting an anti-plating film on the surface of the target daughter board pressed with the release film layer 1;
performing brown oxidation treatment on the first sub-board 3 and the second sub-board 4;
and finally removing the anti-plating film on the surface of the target daughter board.
In the method, because the coating-preventing treatment is firstly carried out on the outer surfaces of the first sub-board 3 and/or the second sub-board 4 provided with the through holes 5, and then the whole first sub-board 3 and the whole second sub-board 4 are browned, in the browning treatment process, the outer surfaces coated with the coating-preventing films on the first sub-board 3 and the second sub-board 4 cannot be browned, and the inner surfaces not coated with the coating-preventing films are browned, so that the selective browning is realized. Based on this, because the outer surface coated with the anti-coating film can not be browned, the outer surface keeps lower roughness, thereby reducing the roughness difference between the target daughter board and the release film layer 1, as shown in fig. 4, improving the matching tightness of the target daughter board and the release film layer, and effectively reducing and controlling the resin diffusion path.
Through experimental verification, the situation that resin phase separation migrates into other holes is not seen through hole plugging AOI scanning and slicing analysis.
Through tests, the pore wall spacing capability of different pore diameter collocation can be improved by more than 5 times by adopting a method of selecting browning (control variables, namely the browning conditions, the plate thickness factors, the lamination programs and the like are the same, and the variables are the pore diameter and the pore wall spacing). Examples are: the daughter board thickness is 1.7mm, the aperture is 0.35mm and is matched with 0.25mm, the hole wall spacing capability-the no-separated phase-splitting resin plugging hole can be improved from 1.0mm to 0.2mm, and the effect can cover more than 95% of customer requirements.
It is understood that, besides the above-mentioned selective browning treatment, in other embodiments, other conventional surface treatments capable of reducing roughness may be adopted to reduce the gap generated by the matching of the target daughter board and the release film layer 1, and the invention is not limited in this respect.
Illustratively, the release film layer 1 may be specifically a copper foil. In the step of laminating, the smooth surface of the copper foil faces the first sub-board 3 or the second sub-board 4 adjacent to the copper foil. The reason is that the smooth copper foil has low roughness, small contact area with the resin of the prepreg 2, easy board disassembly and no residue, and the conventional organic release film layer 1 has large brittleness and is fragile and not suitable for use after being laminated.
Further, the anti-plating film can be equal to the surface area of the target daughter board, covers the whole surface of the target daughter board and pressed from the type film layer 1, so that the whole surface of the target daughter board and pressed from the type film layer 1 can keep lower roughness, and the matching tightness of the whole target daughter board and the type film layer 1 can be increased.
In order to save material cost, the anti-plating film can be smaller than the surface area of the target daughter board, and only the through hole 5 region of the surface of the target daughter board pressed with the release film layer 1 is covered, so that the target daughter board is ensured to have good fit tightness with the release film layer 1 in the through hole 5 region at the lowest, and the overflow of resin in the through hole 5 is reduced.
Based on the same inventive concept, the embodiment of the invention also provides a PCB which is manufactured according to the manufacturing method. Due to the adoption of the special manufacturing method, the manufactured PCB has good hole filling quality, and the risk of generating adverse phenomena is reduced.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for manufacturing a PCB is characterized by comprising the following steps:
providing a release film layer, a prepreg, a first sub-board and a second sub-board;
at least one of the first sub-board and the second sub-board is provided with at least two through holes; covering films are attached to the outer-layer board surfaces of the target sub-boards with the through holes formed in the first sub-board and the second sub-board, air holes are formed in the positions, corresponding to the through holes, of the covering films respectively, and the aperture of each air hole is smaller than that of the corresponding through hole;
laminating and laminating the release film layer, the first sub-board, the prepreg, the second sub-board and the release film layer in sequence, wherein the prepreg flows in a melting manner to fill the through hole in the laminating process;
and after the lamination is pressed, removing the release film layer and the covering film.
2. The method for manufacturing the PCB of claim 1, wherein the cover film is attached to a local area of the outer layer board surface, and the local area covers a distribution area of the through holes and is larger than an area of the through holes.
3. The method of claim 1, wherein the air holes are coaxially disposed with the corresponding through holes.
4. The method for manufacturing a PCB according to claim 1, wherein the cover film is a dry film or an adhesive tape.
5. The method for manufacturing a PCB according to claim 4, wherein when the cover film is an adhesive tape, the method for manufacturing the vent hole comprises the following steps:
and the adhesive tape is provided with the air holes in a laser ablation mode.
6. The method for manufacturing a PCB according to claim 4, wherein when the cover film is a dry film, the method for manufacturing the vent hole comprises the following steps:
forming the air holes in the dry film in a laser ablation manner;
or, only the area of the dry film corresponding to the air holes is removed through an exposure and development mode, and the air holes are formed.
7. The method for manufacturing a PCB according to claim 4, wherein the dry film is removed by exposure and development or plate grinding; and removing the adhesive tape by adopting a tearing mode or a plate grinding mode.
8. The method for manufacturing a PCB of claim 1, wherein before the lamination, the surface of the target daughter board laminated with the release film layer is processed to reduce a gap formed by the surface of the target daughter board and the release film layer;
and simultaneously, before laminating and laminating, respectively treating the surfaces of the first daughter board and the second daughter board which are laminated with the prepreg so as to improve the bonding force between the first daughter board and the prepreg and between the second daughter board and the prepreg.
9. The method for manufacturing the PCB according to claim 8, wherein the processing the surface of the target daughter board laminated with the release film layer and the processing the surfaces of the first daughter board and the second daughter board laminated with the prepreg respectively comprises:
firstly, pasting an anti-plating film on the surface of the target daughter board pressed with the release film layer;
performing brown oxidation treatment on the first sub-board and the second sub-board;
and finally, removing the anti-plating film on the surface of the target daughter board.
10. A PCB manufactured according to the method of manufacturing a PCB of any of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111638367.2A CN114340226B (en) | 2021-12-29 | 2021-12-29 | PCB manufacturing method and PCB |
| PCT/CN2022/099792 WO2023123904A1 (en) | 2021-12-29 | 2022-06-20 | Pcb manufacturing method and pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111638367.2A CN114340226B (en) | 2021-12-29 | 2021-12-29 | PCB manufacturing method and PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114340226A true CN114340226A (en) | 2022-04-12 |
| CN114340226B CN114340226B (en) | 2024-05-07 |
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|---|---|---|---|
| CN202111638367.2A Active CN114340226B (en) | 2021-12-29 | 2021-12-29 | PCB manufacturing method and PCB |
Country Status (2)
| Country | Link |
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| CN (1) | CN114340226B (en) |
| WO (1) | WO2023123904A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023123903A1 (en) * | 2021-12-29 | 2023-07-06 | 生益电子股份有限公司 | Process for filling holes with flowing adhesives during lamination, and pcb |
| WO2023123904A1 (en) * | 2021-12-29 | 2023-07-06 | 生益电子股份有限公司 | Pcb manufacturing method and pcb |
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|---|---|---|---|---|
| JP2003324275A (en) * | 2002-04-30 | 2003-11-14 | Ngk Spark Plug Co Ltd | Method of manufacturing wiring board |
| CN101888749A (en) * | 2010-06-28 | 2010-11-17 | 王爱军 | Process for laminating PCB with internal through-hole structure |
| CN103596369A (en) * | 2013-11-14 | 2014-02-19 | 广州杰赛科技股份有限公司 | Method for manufacturing rigid-flexible board with blind groove |
| KR101980102B1 (en) * | 2019-01-16 | 2019-05-20 | 신덕전자(주) | Method for Manufacturing Rigid-Flexible PCB |
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| CN112930043A (en) * | 2021-01-29 | 2021-06-08 | 生益电子股份有限公司 | PCB ink hole plugging method and PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340226B (en) * | 2021-12-29 | 2024-05-07 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
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2021
- 2021-12-29 CN CN202111638367.2A patent/CN114340226B/en active Active
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- 2022-06-20 WO PCT/CN2022/099792 patent/WO2023123904A1/en unknown
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| JP2003324275A (en) * | 2002-04-30 | 2003-11-14 | Ngk Spark Plug Co Ltd | Method of manufacturing wiring board |
| CN101888749A (en) * | 2010-06-28 | 2010-11-17 | 王爱军 | Process for laminating PCB with internal through-hole structure |
| CN103596369A (en) * | 2013-11-14 | 2014-02-19 | 广州杰赛科技股份有限公司 | Method for manufacturing rigid-flexible board with blind groove |
| KR101980102B1 (en) * | 2019-01-16 | 2019-05-20 | 신덕전자(주) | Method for Manufacturing Rigid-Flexible PCB |
| CN111741615A (en) * | 2020-06-17 | 2020-10-02 | 深圳崇达多层线路板有限公司 | Method for pressing and filling glue of blind hole with high thickness-diameter ratio |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023123903A1 (en) * | 2021-12-29 | 2023-07-06 | 生益电子股份有限公司 | Process for filling holes with flowing adhesives during lamination, and pcb |
| WO2023123904A1 (en) * | 2021-12-29 | 2023-07-06 | 生益电子股份有限公司 | Pcb manufacturing method and pcb |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023123904A1 (en) | 2023-07-06 |
| CN114340226B (en) | 2024-05-07 |
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