CN114340144B - Circuit board assembly, mobile terminal and preparation method of circuit board assembly - Google Patents
Circuit board assembly, mobile terminal and preparation method of circuit board assembly Download PDFInfo
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- CN114340144B CN114340144B CN202111682178.5A CN202111682178A CN114340144B CN 114340144 B CN114340144 B CN 114340144B CN 202111682178 A CN202111682178 A CN 202111682178A CN 114340144 B CN114340144 B CN 114340144B
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- 238000002360 preparation method Methods 0.000 title abstract description 20
- 238000004806 packaging method and process Methods 0.000 claims abstract description 58
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 48
- 238000003466 welding Methods 0.000 claims abstract description 26
- 238000005538 encapsulation Methods 0.000 claims description 79
- 229910000679 solder Inorganic materials 0.000 claims description 54
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 239000003292 glue Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 230000002787 reinforcement Effects 0.000 description 10
- 239000007788 liquid Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
Abstract
The embodiment of the application provides a circuit board assembly, a mobile terminal and a preparation method of the circuit board assembly, wherein the circuit board assembly comprises: a reinforcing layer having a bearing surface; the circuit board is arranged on the bearing surface of the reinforcing layer; the packaging layer is arranged on one side of the circuit board, which is away from the reinforcing layer, wherein the circuit board assembly comprises a stress area and a packaging area surrounding the stress area, welding spots are arranged in the packaging area and are positioned between the circuit board and the packaging layer, so that the circuit board is connected with the packaging layer through the welding spots, and the stress area is provided with a stress absorbing part so that the stress absorbing part can absorb deformation stress of the reinforcing layer of the stress area. The existence of welding spots in the packaging area can lead to unbalanced stress of the packaging area and the stress area, so that the reinforcing layer can be subjected to deformation stress in the stress area.
Description
Technical Field
The application relates to the technical field of circuit manufacturing equipment, in particular to a circuit board assembly, a mobile terminal and a preparation method of the circuit board assembly.
Background
The reinforced layer on the back of the part is designed to be thinner and thinner due to the space problem of the existing electronic products such as mobile phones, watches and the like. The mobile terminal comprises a circuit board and a ball grid array packaging layer for packaging the circuit board, after the circuit board is packaged by the ball grid array packaging layer, glue is dispensed on the periphery of the ball grid array packaging layer, the glue has certain fluidity before baking, and the glue flows between solder balls after dispensing. When the baking is finished after dispensing, the glue can shrink to generate tension when the glue is baked, so that the circuit board or the packaging layer is stressed and deformed, and further the electric connection of the circuit board is affected, and poor connection of the circuit board is caused.
Disclosure of Invention
The embodiment of the application provides a circuit board assembly, a mobile terminal and a preparation method of the circuit board assembly, and aims to improve the yield of the circuit board assembly.
Embodiments of a first aspect of the present application provide a circuit board assembly comprising: a reinforcing layer having a bearing surface; the circuit board is arranged on the bearing surface of the reinforcing layer; the packaging layer is arranged on one side of the circuit board, which is away from the reinforcing layer, wherein the circuit board assembly comprises a stress area and a packaging area surrounding the stress area, welding spots are arranged in the packaging area and are positioned between the circuit board and the packaging layer, so that the circuit board is connected with the packaging layer through the welding spots, and the stress area is provided with a stress absorbing part so that the stress absorbing part can absorb deformation stress of the reinforcing layer of the stress area.
According to an embodiment of the first aspect of the present application, the stress absorbing portion includes a protruding portion, and the protruding portion is located on a surface of the encapsulation layer facing the circuit board.
According to any of the foregoing embodiments of the first aspect of the present application, a height of the protrusion protruding from the surface of the package layer facing the circuit board is less than or equal to a height of the solder joint protruding from the package layer.
According to any of the foregoing embodiments of the first aspect of the present application, the projection is co-layer with the solder joint.
According to any of the foregoing embodiments of the first aspect of the present application, the shape of the projection is the same as the shape of the solder joint.
According to any of the foregoing embodiments of the first aspect of the present application, the size of the projection is the same as the size of the solder joint.
According to any of the foregoing embodiments of the first aspect of the present application, the plurality of projections are spaced apart in the stress region.
According to any of the foregoing embodiments of the first aspect of the present application, the plurality of solder joints are spaced apart in the package region, and a distance between two adjacent protruding portions is equal to a distance between two adjacent solder joints.
According to any of the foregoing embodiments of the first aspect of the present application, the number of the protruding portions is one, and a minimum distance between the protruding portions and the welding spot is greater than or equal to 0.3mm.
According to any of the foregoing embodiments of the first aspect of the present application, the orthographic projection shape of the protrusion on the encapsulation layer includes at least one of a circle and a polygon.
According to any of the foregoing embodiments of the first aspect of the present application, the protrusion is white in color.
According to any of the foregoing embodiments of the first aspect of the present application, an area ratio of an orthographic projection area of the protrusion portion on the encapsulation layer to the stress area is greater than or equal to 0.6.
According to any of the preceding embodiments of the first aspect of the present application, the stress absorbing portion comprises an opening provided in the stiffening layer.
According to any of the preceding embodiments of the first aspect of the present application, the opening is formed by a recess of the bearing surface of the stiffening layer, or the opening is arranged through the stiffening layer.
According to any of the foregoing embodiments of the first aspect of the present application, the number of the openings is plural, and the plural openings are spaced apart in the stress region.
According to any of the foregoing embodiments of the first aspect of the present application, the orthographic projection area of each opening on the encapsulation layer is equal to the orthographic projection area of each solder joint on the encapsulation layer.
According to any of the foregoing embodiments of the first aspect of the present application, the orthographic projection shape of each opening on the encapsulation layer is equal to the orthographic projection shape of each solder joint on the encapsulation layer.
According to any of the foregoing embodiments of the first aspect of the present application, the plurality of solder joints are spaced apart in the package region, and a spacing between two adjacent openings is equal to a spacing between two adjacent solder joints.
According to any of the foregoing embodiments of the first aspect of the present application, the method further includes a packaging adhesive, where the packaging adhesive includes:
the first glue part surrounds the packaging layer and is connected between the packaging layer and the circuit board in a sealing way;
and the second adhesive part is positioned between the packaging layer and the circuit board in the stress area.
Embodiments of the second aspect of the present application further provide a mobile terminal, including the circuit board assembly provided in any of the embodiments of the first aspect.
The embodiment of the third aspect of the application also provides a preparation method of the circuit board assembly, which comprises the following steps:
a bulge part is arranged on the packaging layer and forms a stress absorption part;
welding spots are arranged on the periphery of the protruding part;
the packaging layer is connected with the circuit board, and the welding spots are connected between the packaging layer and the circuit board.
The embodiment of the third aspect of the application also provides a preparation method of the circuit board assembly, which comprises the following steps:
an opening is arranged on the reinforcing layer, and the opening forms a stress absorbing part;
disposing a circuit board on the stiffening layer;
the packaging layer is arranged on one side of the circuit board, which is away from the reinforcing layer, the surface of the packaging layer, which faces the circuit board, is provided with welding spots, and orthographic projection of the welding spots on the reinforcing layer is arranged around the opening.
In the circuit board assembly provided by the embodiment of the application, the circuit board assembly comprises a reinforcing layer, a circuit board and a packaging layer which are sequentially stacked. The encapsulation layer is provided with solder joints in the encapsulation area, so that when the encapsulation layer and the circuit board are connected with each other, the existence of solder joints in the encapsulation area can lead to unbalanced stress of the encapsulation area and the stress area, and the reinforcing layer can be subjected to deformation stress in the stress area. According to the embodiment of the application, the stress real receiving part is arranged in the stress area, and the stress absorbing part can absorb deformation stress, so that the deformation of the reinforcing layer is improved, and the yield of the circuit board assembly can be improved.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings, in which like or similar reference characters designate like or similar features.
Fig. 1 is a top view of a circuit board assembly provided in an embodiment of a first aspect of the present application;
FIG. 2 is a cross-sectional view at A-A in FIG. 1;
fig. 3 is a top view of a circuit board assembly according to another embodiment of the first aspect of the present application;
FIG. 4 is a cross-sectional view at B-B in FIG. 3;
fig. 5 is a top view of a circuit board assembly according to yet another embodiment of the first aspect of the present application;
FIG. 6 is a cross-sectional view at C-C in FIG. 5;
fig. 7 is a top view of a circuit board assembly according to yet another embodiment of the first aspect of the present application;
FIG. 8 is a cross-sectional view taken at D-D in FIG. 7;
fig. 9 is a schematic flow chart of a method for manufacturing a circuit board assembly according to an embodiment of a third aspect of the present application;
fig. 10 is a schematic flow chart of a method for manufacturing a circuit board assembly according to another embodiment of the third aspect of the present application.
Reference numerals illustrate:
10. a circuit board assembly;
100. a reinforcing layer; 100a, bearing surface; 110. an opening;
200. a circuit board;
300. an encapsulation layer; 310. welding spots; 320. a protruding portion;
400. a stress absorbing section;
500. packaging glue; 510. a first glue portion; 520. a second glue part;
FF. A packaging region; FA. Stress region.
Detailed Description
Features and exemplary embodiments of various aspects of the present application are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing an example of the present application. In the drawings and the following description, at least some well-known structures and techniques are not shown in order to avoid unnecessarily obscuring the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In the description of the present application, it is to be noted that, unless otherwise indicated, the meaning of "plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The directional terms appearing in the following description are all directions shown in the drawings and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected. The specific meaning of the terms in the present application can be understood as appropriate by one of ordinary skill in the art.
For a better understanding of the present application, a circuit board assembly, a mobile terminal, and a method of manufacturing the circuit board assembly according to embodiments of the present application are described in detail below with reference to fig. 1 to 10.
Referring to fig. 1 and 2 together, fig. 1 is a top view of a circuit board assembly 10 according to an embodiment of the first aspect of the present application, and fig. 2 is a cross-sectional view at A-A in fig. 1.
As shown in fig. 1 and 2, a circuit board assembly 10 provided in an embodiment of the present application includes: a stiffening layer 100 having a bearing surface 100a; a circuit board 200 disposed on the bearing surface 100a of the reinforcing layer 100; the packaging layer 300 is disposed on a side of the circuit board 200 facing away from the stiffening layer 100, wherein the circuit board assembly 10 includes a stress area FA and a packaging area FF surrounding the stress area FA, a solder joint 310 is disposed in the packaging area FF, and the solder joint 310 is located between the circuit board 200 and the packaging layer 300, so that the circuit board 200 is connected to the packaging layer 300 through the solder joint 310, and the stress area FA is provided with a stress absorbing portion 400, so that the stress absorbing portion 400 can absorb deformation stress of the stiffening layer 100 in the stress area FA.
The parting line of the package region FF and the stress region FA is illustrated in fig. 1 by a dash-dot line, which does not constitute a structural limitation of the circuit board assembly 10 of the embodiment of the present application.
In the circuit board assembly 10 provided in the embodiment of the present application, the circuit board assembly 10 includes the reinforcing layer 100, the circuit board 200, and the encapsulation layer 300, which are sequentially stacked. The encapsulation layer 300 is provided with solder joints 310 in the encapsulation area FF, so that when the encapsulation layer 300 and the circuit board 200 are connected to each other, the presence of solder joints 310 in the encapsulation area FF may result in an unbalanced stress in the encapsulation area FF and the stress area FA, resulting in that the stiffening layer 100 may be subjected to deformation stress in the stress area FA. In the embodiment of the present application, the stress area FA is provided with a stress receiving portion, and the stress absorbing portion 400 can absorb deformation stress, so as to improve deformation of the reinforcing layer 100 and improve yield of the circuit board assembly 10.
There are various ways in which the stiffening layer 100 is arranged, for example, the material of the stiffening layer 100 comprises a steel sheet, so that the stiffening layer 100 can provide good support to the circuit board 200.
The circuit board 200 is arranged in various ways, and the circuit board 200 is, for example, a flexible circuit board 200, so that the circuit board 200 has better flexibility and deformability, and the stability of connection between the circuit board 200 and the packaging layer 300 is improved.
The package layer 300 may be disposed in various manners, for example, the material of the package layer 300 includes a metal material. Optionally, the encapsulation layer 300 comprises a metal layer and a non-metal layer, the non-metal layer being located on the side of the metal layer facing away from the circuit board 200 to be able to provide good protection to the circuit board 200.
In some alternative embodiments, with continued reference to fig. 1 and 2, the circuit board assembly 10 further includes an encapsulant 500, the encapsulant 500 comprising: a first adhesive portion 510 surrounding the encapsulation layer 300 and hermetically connected between the encapsulation layer 300 and the circuit board 200; the second adhesive part 520 is disposed between the package layer 300 and the circuit board 200 in the stress area FA.
In these alternative embodiments, the first adhesive portion 510 of the encapsulation adhesive 500 is disposed around the encapsulation layer 300, and the first adhesive portion 510 can ensure the tightness between the encapsulation layer 300 and the circuit board 200. The second glue part 520 is located in the stress area FA, and when the second glue part 520 is changed from a liquid state to a solid state in the preparation process of the circuit board assembly 10, the volume of the second glue part 520 is reduced so as to apply stress to the circuit board 200 towards the encapsulation layer 300, and the stress absorption part 400 can absorb the stress due to the stress area FA, so that the deformation of the circuit board 200 can be improved, the deformation of the reinforcing layer 100 can be improved, and the yield of the circuit board assembly 10 can be improved.
With continued reference to fig. 1 and 2, the stress absorbing portion 400 includes a protrusion 320, where the protrusion 320 is located on a surface of the encapsulation layer 300 facing the circuit board 200.
In these alternative embodiments, the stress absorbing portion 400 is a protrusion portion 320, and the protrusion portion 320 is located on the encapsulation layer 300, and when the encapsulation layer 300 is connected to the circuit board 200 by using the solder joint 310, the protrusion portion 320 can provide support to the circuit board 200 in the stress area FA, so as to improve the deformation of the circuit board 200 in the stress area FA, further reduce the deformation stress to which the reinforcement layer 100 is subjected, and improve the service life of the reinforcement layer 100 and the yield of the circuit board assembly 10.
In addition, when the stress area FA is provided with the second glue part 520, the second glue part 520 is changed from a liquid state to a solid state during the manufacturing process of the circuit board assembly 10, the volume is reduced, and the stress towards the encapsulation layer 300 is applied to the circuit board 200, the stress towards the reinforcing layer 100 can be applied to the circuit board 200 by the protrusion 320, and the stress applied by the protrusion 320 and the stress applied by the second glue part 520 cancel each other, so that the deformation of the circuit board 200 can be improved, the deformation of the reinforcing layer 100 can be improved, and the yield of the circuit board assembly 10 can be improved.
In some alternative embodiments, the height of the protrusion 320 protruding from the surface of the encapsulation layer 300 facing the circuit board 200 is less than or equal to the height of the solder joint 310 protruding from the encapsulation layer 300.
In these alternative embodiments, when the height of the protrusion 320 is less than or equal to the height of the solder joint 310, it can be ensured that the solder joint 310 is stably connected between the circuit board 200 and the encapsulation layer 300 without affecting the stability of the relative positions of the solder joint 310 and the circuit board 200 due to the provision of the protrusion 320.
In some alternative embodiments, the projections 320 are prepared in the same layer as the solder joints 310.
In these alternative embodiments, when the circuit board assembly 10 is manufactured, the same material may be used to continuously manufacture the solder joint 310 after the protrusion 320 is manufactured, so that the manufacturing difficulty of the circuit board assembly 10 is reduced and the manufacturing efficiency of the circuit board assembly 10 is improved without resetting the material and the manufacturing equipment.
When the protrusion 320 is prepared in the same layer as the welding spot 310, the shape and size of the protrusion 320 may be different from those of the welding spot 310.
In other alternative embodiments, the shape of the protrusion 320 is the same as the shape of the weld spot 310. The protrusion 320 and the welding spot 310 can be prepared and formed by adopting an approximate preparation process, so that the preparation process of the circuit board assembly 10 is further simplified, the preparation difficulty of the circuit board assembly 10 is reduced, and the preparation efficiency of the circuit board assembly 10 is improved.
In still other alternative embodiments, the size of the protrusion 320 is the same as the size of the weld spot 310. The protrusion 320 and the welding spot 310 can be prepared and formed by adopting an approximate preparation process, so that the preparation process of the circuit board assembly 10 is further simplified, the preparation difficulty of the circuit board assembly 10 is reduced, and the preparation efficiency of the circuit board assembly 10 is improved.
In yet other alternative embodiments, with continued reference to fig. 1 and 2, the shape of the protrusion 320 is the same as the shape of the weld spot 310, and the size of the protrusion 320 is the same as the size of the weld spot 310. The protrusion 320 and the welding spot 310 can be manufactured and formed by the same manufacturing process, so that the manufacturing process of the circuit board assembly 10 is further simplified, the manufacturing difficulty of the circuit board assembly 10 is reduced, and the manufacturing efficiency of the circuit board assembly 10 is improved.
The number of the protruding portions 320 may be one or more, when the number of the protruding portions 320 is plural, the protruding portions 320 are distributed at intervals in the stress area FA, so that the stress of the circuit board 200 at different positions in the central area is more balanced, the deformation stress of the reinforcing layer 100 at different positions in the central area is more balanced, the deformation of the reinforcing layer 100 is further improved, and the yield of the circuit board assembly 10 is improved.
In some alternative embodiments, referring to fig. 1 and 2, the plurality of pads 310 are spaced apart in the package region FF, and the spacing between two adjacent protrusions 320 is equal to the spacing between two adjacent pads 310.
In these alternative embodiments, the arrangement manner of the plurality of protruding portions 320 is the same as that of the plurality of solder joints 310, so that the stress of the circuit board 200 in different positions of the packaging region FF and the stress region FA is more balanced, the deformation stress of the reinforcing layer 100 in different positions of the packaging region FF and the stress region FA is more balanced, the deformation of the reinforcing layer 100 is further improved, and the yield of the circuit board assembly 10 is improved.
Alternatively, with continued reference to fig. 1 and 2, the spacing between adjacent solder joints 310 and protrusions 320 is equal to the spacing between adjacent protrusions 320. In these alternative embodiments, the spacing between two adjacent protruding portions 320, the spacing between two adjacent welding points 310, and the spacing between two adjacent welding points 310 and protruding portions 320 are all equal, so that the stress balance of the circuit board 200 can be further improved, the deformation stress suffered by the reinforcing layer 100 is more balanced, the deformation of the reinforcing layer 100 is further improved, and the yield of the circuit board assembly 10 is improved.
Referring to fig. 3 and 4 together, fig. 3 is a top view of a circuit board assembly 10 according to another embodiment of the first aspect of the present application, and fig. 4 is a cross-sectional view at B-B in fig. 3. The parting line of the package region FF and the stress region FA is schematically shown by a dash-dot line in fig. 3, which does not constitute a structural limitation of the circuit board assembly 10 of the embodiment of the present application.
In other alternative embodiments, as shown in fig. 3 and 4, the number of the protrusions 320 may be one, and the minimum distance between the protrusions 320 and the welding points 310 is greater than or equal to 0.3mm.
In these alternative embodiments, the provision of the protrusion 320 can simplify the structure of the circuit board assembly 10, simplify the manufacturing process of the circuit board assembly 10, reduce the manufacturing difficulty of the circuit board assembly 10 and improve the manufacturing efficiency of the circuit board assembly 10. The minimum distance between the protrusion 320 and the solder joint 310 is greater than or equal to 0.3mm, i.e., the safe distance between the protrusion 320 and the solder joint 310 is maintained, so that the protrusion 320 can be prevented from affecting the preparation of the solder joint 310, and the yield of the circuit board assembly 10 is ensured.
When the number of the protruding portions 320 is one, the protruding portions 320 may be disposed in various ways on the encapsulation layer 300, for example, the front projection shape of the protruding portions 320 on the encapsulation layer 300 includes at least one of a circle and a polygon. Optionally, the orthographic projection shape of the protruding portion 320 on the encapsulation layer 300 is rectangular, which can simplify the structure of the protruding portion 320, reduce the manufacturing difficulty of the circuit board assembly 10, and improve the manufacturing efficiency of the circuit board assembly 10.
In some alternative embodiments, the protrusion 320 is white in color. The shapes of the surfaces of the circuit board 200 and the package layer 300 are generally dark, and when the color of the protrusion 320 is white, the boundary of the protrusion 320 on the surface of the package layer 300 or the circuit board 200 is more obvious, so that the preparation difficulty of the subsequent process can be reduced.
In some alternative embodiments, the area ratio of the orthographic projected area of the protrusion 320 to the stress area FA on the encapsulation layer 300 is greater than or equal to 0.6. In these alternative embodiments, the larger size of the protrusion 320 can better improve the deformation of the circuit board 200 in the stress area FA, better improve the deformation stress to which the stiffening layer 100 is subjected, reduce the risk of deformation of the stiffening layer 100, and improve the yield of the circuit board assembly 10.
Referring to fig. 5 and 6 together, fig. 5 is a top view of a circuit board assembly 10 according to still another embodiment of the first aspect of the present application, and fig. 6 is a cross-sectional view at C-C in fig. 5. The parting line of the package region FF and the stress region FA is illustrated by a dash-dot line in fig. 5, which does not constitute a structural limitation of the circuit board assembly 10 of the embodiment of the present application.
In still other alternative embodiments, as shown in fig. 5 and 6, the stress absorbing portion 400 comprises an opening 110 provided in the stiffening layer 100. The position of the stiffening layer 100 and the position of the openings 110 provided on the stiffening layer 100 are schematically indicated with dashed lines in fig. 5. The dashed lines do not constitute structural limitations of the circuit board assembly 10 of the embodiments of the present application.
In these alternative embodiments, the opening 110 is provided on the stiffening layer 100, so that the structural strength of the stiffening layer 100 in the stress area FA can be reduced, the stiffening layer 100 in the stress area FA is more easily deformed, so that the deformation stress suffered by the stiffening layer 100 is not diffused from the stress area FA to the packaging area FF, the deformation stress suffered by the stiffening layer 100 in the packaging area FF is improved, the connection between the circuit board 200 and the packaging layer 300 is prevented from being affected by the deformation of the stiffening layer 100 in the packaging area FF, and the yield of the circuit component is further improved.
In addition, when the stress area FA is provided with the second glue portion 520, and the second glue portion 520 is changed from a liquid state to a solid state in the preparation process of the circuit board assembly 10, when the stress towards the encapsulation layer 300 is applied to the circuit board 200, the stress is not transmitted to the reinforcing layer 100 due to the fact that the opening 110 is arranged in the stress area FA of the reinforcing layer 100, that is, the stress is not diffused from the stress area FA to the encapsulation area FF, deformation stress of the reinforcing layer 100 in the encapsulation area FF can be improved, and the connection between the circuit board 200 and the encapsulation layer 300 is prevented from being influenced by deformation of the reinforcing layer 100 in the encapsulation area FF, so that the yield of the circuit assembly is further improved.
The openings 110 may be arranged in various ways, and the openings 110 may be formed by recessing the surface of the stiffening layer 100, for example, the openings 110 may be formed by recessing the bearing surface 100a of the stiffening layer 100 in a direction away from the circuit board 200, so that the stress area FA is at least partially arranged between the stiffening layer 100 and the circuit board 200 at intervals, and stress applied to the circuit board 200 is not transferred to the stiffening layer 100. Alternatively, the opening 110 may be formed by recessing the reinforcing layer 100 away from the surface of the circuit board 200 toward the circuit board 200, so as to reduce the structural strength of the reinforcing layer 100 at the location of the opening 110.
In other alternative embodiments, the openings 110 are arranged through the stiffening layer 100 such that the stress of the circuit board 200 in the stress area FA is not transferred to the stiffening layer 100.
With continued reference to fig. 5 and 6, the number of openings 110 may be one, for example, and the minimum distance between one opening 110 and the solder joint 310 may be greater than or equal to 0.3mm, so that the openings 110 may not affect the preparation of the solder joint 310. The area ratio of the area of one opening 110 to the area of the stress area FA is greater than or equal to 0.6, so that the stress area FA is provided with a sufficiently large opening 110, and the deformation problem of the stiffening layer 100 is better improved.
Referring to fig. 7 and 8, fig. 7 is a top view of a circuit board assembly 10 according to still another embodiment of the first aspect of the present application, and fig. 8 is a cross-sectional view at C-C in fig. 7. The parting line of the package region FF and the stress region FA is illustrated by a dash-dot line in fig. 7, which does not constitute a structural limitation of the circuit board assembly 10 of the embodiment of the present application. The position information of the stiffening layer 100 and the position information of the openings 110 in the stiffening layer 100 are illustrated in fig. 7 by dashed lines, which do not constitute structural limitations of the encapsulation layer 300.
In other alternative embodiments, as shown in fig. 7 and 8, the number of openings 110 is plural, and the plural openings 110 are spaced apart in the stress area FA.
In these alternative embodiments, the plurality of openings 110 are spaced apart within the stress area FA, which on the one hand can increase the structural strength of the stiffening layer 100, so that the stiffening layer 100 can provide better protection to the circuit board 200. In addition, the plurality of openings 110 distributed at intervals make the stress of the stiffening layer 100 in the stress area FA more balanced and better improve the deformation of the stiffening layer 100.
In some alternative embodiments, the orthographic projection area of each opening 110 on the encapsulation layer 300 is equal to the orthographic projection area of each solder joint 310 on the encapsulation layer 300, so that the stress of the stiffening layer 100 is more balanced.
In some alternative embodiments, the orthographic projection shape of each opening 110 on the encapsulation layer 300 is equal to the orthographic projection shape of each solder joint 310 on the encapsulation layer 300, so that the stress of the stiffening layer 100 is more balanced.
In some alternative embodiments, the plurality of solder joints 310 are spaced apart in the encapsulation region FF, and the spacing between two adjacent openings 110 is equal to the spacing between two adjacent solder joints 310, so that the stress of the stiffening layer 100 is more balanced.
Embodiments of the second aspect of the present application provide a mobile terminal comprising the circuit board assembly 10 of any of the embodiments of the first aspect described above. Since the mobile terminal in the embodiment of the present application includes the above-mentioned circuit board assembly 10, the mobile terminal in the embodiment of the present application has the beneficial effects of the above-mentioned circuit board assembly 10, and will not be described herein again.
Embodiments of the third aspect of the present application also provide a method for manufacturing a circuit board assembly 10, where the circuit board assembly 10 may be the circuit board assembly 10 provided in any one of the embodiments of the first aspect.
For example, the circuit board 200 is the circuit board assembly 10 shown in fig. 1 to 4, please refer to fig. 9, and the method for manufacturing the circuit board assembly 10 includes:
step S01: the protrusion 320 is disposed on the encapsulation layer 300, and the protrusion 320 forms the stress absorbing portion 400.
Step S02: a welding point 310 is provided at the circumferential side of the protrusion 320.
Step S03: the encapsulation layer 300 is connected to the circuit board 200, and the solder joints 310 are connected between the encapsulation layer 300 and the circuit board 200.
In the method for manufacturing the circuit board assembly 10 provided in the embodiment of the present application, the protruding portion 320 is first manufactured on the packaging layer 300, and then the solder joint 310 is manufactured on the peripheral side of the protruding portion 320, so that the manufacturing of the protruding portion 320 does not affect the solder joint 310, and the packaging layer 300 is connected to the circuit board 200 after the solder joint 310 is manufactured, so that the retention time of the solder joint 310 can be reduced, and the deformation of the solder joint 310 can be reduced. In addition, by providing the protrusion 320, when the encapsulation layer 300 is connected to the circuit board 200 by using the solder joint 310, the protrusion 320 can provide support to the circuit board 200 in the stress area FA, improve the deformation of the circuit board 200 in the stress area FA, further reduce the deformation stress to which the reinforcement layer 100 is subjected, and improve the service life of the reinforcement layer 100 and the yield of the circuit board assembly 10.
Optionally, the circuit board 200 is further disposed on the stiffening layer 100 before step S03. Then in step S03 the encapsulation layer 300 is arranged on the side of the circuit board 200 facing away from the stiffening layer 100. Protection can be provided to the circuit board 200 by providing the stiffening layer 100.
Optionally, after step S03, an encapsulant 500 may be further disposed, for example, the encapsulant 500 is disposed on a peripheral side of the encapsulation layer 300, and a portion of the encapsulant 500 surrounds the encapsulation layer 300 and is hermetically connected between the encapsulation layer 300 and the circuit board 200 to form a first encapsulant portion 510, and a portion of the encapsulant 500 flows into the stress area FA between the encapsulation layer 300 and the circuit board 200 to form a second encapsulant portion 520. When the second glue portion 520 changes from a liquid state to a solid state, the volume is reduced and the stress towards the encapsulation layer 300 is applied to the circuit board 200, the protrusion 320 can apply the stress towards the reinforcement layer 100 to the circuit board 200, the stresses cancel each other, the deformation of the circuit board 200 can be improved, the deformation of the reinforcement layer 100 can be improved, and the yield of the circuit board assembly 10 can be improved.
In other alternative embodiments, the circuit board 200 is the circuit board assembly 10 shown in fig. 5 to 8, please refer to fig. 10, and the method for manufacturing the circuit board assembly 10 includes:
step S01': an opening 110 is provided in the stiffening layer 100, the opening 110 forming a stress absorbing portion 400.
Step S02': the circuit board 200 is disposed on the stiffening layer 100.
Step S03': the encapsulation layer 300 is arranged on one side of the circuit board 200 facing away from the reinforcing layer 100, the surface of the encapsulation layer 300 facing towards the circuit board 200 is provided with welding spots 310, and the orthographic projection of the welding spots 310 on the reinforcing layer 100 is arranged around the opening 110.
In the method for manufacturing the circuit board assembly 10 provided in the embodiment of the present application, the opening 110 is first manufactured on the reinforcing layer 100, and the opening 110 forms the stress absorbing portion 400. The circuit board 200 is then disposed on the stiffener layer 100 and the encapsulation layer 300 is disposed on the circuit board 200. The opening 110 is arranged on the reinforcing layer 100, so that the structural strength of the reinforcing layer 100 in the stress area FA can be reduced, the reinforcing layer 100 in the stress area FA is more easily deformed, deformation stress received by the reinforcing layer 100 cannot be diffused from the stress area FA to the packaging area FF, deformation stress received by the reinforcing layer 100 in the packaging area FF is improved, connection of the circuit board 200 and the packaging layer 300 due to deformation of the reinforcing layer 100 in the packaging area FF is avoided, and the yield of circuit components is further improved.
Optionally, after step S03', an encapsulant 500 may be further disposed, for example, the encapsulant 500 is disposed on a peripheral side of the encapsulation layer 300, and a portion of the encapsulant 500 surrounds the encapsulation layer 300 and is hermetically connected between the encapsulation layer 300 and the circuit board 200 to form a first encapsulant portion 510, and a portion of the encapsulant 500 flows into the stress area FA between the encapsulation layer 300 and the circuit board 200 to form a second encapsulant portion 520. When the second glue portion 520 changes from a liquid state to a solid state, the volume is reduced and the stress towards the encapsulation layer 300 is applied to the circuit board 200, since the reinforcement layer 100 is provided with the opening 110 in the stress area FA, the stress is not transferred to the reinforcement layer 100, and is not diffused from the stress area FA to the encapsulation area FF, so that the deformation stress of the reinforcement layer 100 in the encapsulation area FF can be improved, the connection between the circuit board 200 and the encapsulation layer 300 due to the deformation of the reinforcement layer 100 in the encapsulation area FF is avoided, and the yield of the circuit assembly is further improved.
While the present application has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the present application. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (19)
1. A circuit board assembly, comprising:
a reinforcing layer having a bearing surface;
the circuit board is arranged on the bearing surface of the reinforcing layer;
the packaging layer is arranged on one side of the circuit board, which is away from the reinforcing layer,
wherein the circuit board assembly includes a stress region and a packaging region surrounding the stress region; welding spots are arranged in the packaging area and are positioned between the circuit board and the packaging layer, so that the circuit board is connected with the packaging layer through the welding spots; the stress region is provided with a stress absorbing portion comprising an opening provided in the stiffening layer such that the stress absorbing portion is capable of absorbing deformation stress of the stiffening layer of the stress region.
2. The circuit board assembly of claim 1, wherein the stress absorbing portion comprises a protrusion located on a surface of the encapsulation layer facing the circuit board.
3. The circuit board assembly of claim 2, wherein a height of the protrusion protruding from the package layer toward the circuit board surface is less than or equal to a height of the solder joint protruding from the package layer.
4. The circuit board assembly of claim 2, wherein the projection is prepared in the same layer as the solder joint.
5. The circuit board assembly of claim 4, wherein the shape of the protrusion is the same as the shape of the solder joint and/or the size of the protrusion is the same as the size of the solder joint.
6. The circuit board assembly of claim 4, wherein a plurality of said projections are spaced apart in said stress region.
7. The circuit board assembly of claim 6, wherein a plurality of said solder joints are spaced apart in said package area and a spacing between adjacent two of said projections is equal to a spacing between adjacent two of said solder joints.
8. The circuit board assembly of claim 2, wherein the number of projections is one and a minimum distance between the projections and the solder joint is greater than or equal to 0.3mm.
9. The circuit board assembly of claim 8, wherein the orthographic projection shape of the protrusion on the encapsulation layer comprises at least one of a circle, a polygon.
10. The circuit board assembly of claim 9, wherein the protrusion is white in color.
11. The circuit board assembly of claim 9, wherein an area ratio of an orthographic projected area of the protrusion on the encapsulation layer to the stress region is greater than or equal to 0.6.
12. The circuit board assembly of claim 1, wherein the opening is formed by a surface depression of the stiffening layer or the opening is disposed through the stiffening layer.
13. The circuit board assembly of claim 1, wherein the number of openings is a plurality and a plurality of the openings are spaced apart in the stress region.
14. The circuit board assembly of claim 13, wherein an orthographic projected area of each of the openings on the encapsulation layer is equal to an orthographic projected area of each of the solder joints on the encapsulation layer.
15. The circuit board assembly of claim 13, wherein an orthographic projection shape of each of the openings on the encapsulation layer is equal to an orthographic projection shape of each of the solder joints on the encapsulation layer.
16. The circuit board assembly of claim 13, wherein a plurality of said solder joints are spaced apart in said package region, and wherein a spacing between adjacent two of said openings is equal to a spacing between adjacent two of said solder joints.
17. The circuit board assembly of claim 1, further comprising an encapsulation glue, the encapsulation glue comprising:
the first glue part surrounds the packaging layer and is connected between the packaging layer and the circuit board in a sealing way;
and the second adhesive part is positioned in the stress area and between the packaging layer and the circuit board.
18. A mobile terminal comprising the circuit board assembly of any one of claims 1-17.
19. A method of manufacturing a circuit board assembly, comprising:
providing an opening in the stiffening layer, the opening forming a stress absorbing portion;
disposing a circuit board on the stiffening layer;
the packaging layer is arranged on one side, deviating from the reinforcing layer, of the circuit board, welding spots are arranged on the surface, facing the circuit board, of the packaging layer, and orthographic projection of the welding spots on the reinforcing layer surrounds the opening.
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| CN202111682178.5A CN114340144B (en) | 2021-12-28 | 2021-12-28 | Circuit board assembly, mobile terminal and preparation method of circuit board assembly |
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| CN202111682178.5A CN114340144B (en) | 2021-12-28 | 2021-12-28 | Circuit board assembly, mobile terminal and preparation method of circuit board assembly |
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| CN114340144B true CN114340144B (en) | 2024-02-02 |
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| JP2011198810A (en) * | 2010-03-17 | 2011-10-06 | Renesas Electronics Corp | Mounting structure and mounting method for semiconductor device |
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| US7719108B2 (en) * | 2005-01-10 | 2010-05-18 | Lockheed Martin Corporation | Enhanced reliability semiconductor package |
| JP6726309B2 (en) * | 2017-01-05 | 2020-07-22 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | Highly reliable electronic package structure, circuit board and device |
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| JPH05343472A (en) * | 1992-06-05 | 1993-12-24 | Nec Corp | Flip-chip mounting structure of electronic component |
| CN101128087A (en) * | 2006-08-18 | 2008-02-20 | 富士通株式会社 | Circuit substrate and semiconductor device |
| JP2011198810A (en) * | 2010-03-17 | 2011-10-06 | Renesas Electronics Corp | Mounting structure and mounting method for semiconductor device |
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| CN214256758U (en) * | 2021-06-15 | 2021-09-21 | 荣耀终端有限公司 | Electronic component, circuit board assembly and electronic equipment |
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| CN114340144A (en) | 2022-04-12 |
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