CN114340144A - Circuit board assembly, mobile terminal and preparation method of circuit board assembly - Google Patents
Circuit board assembly, mobile terminal and preparation method of circuit board assembly Download PDFInfo
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- CN114340144A CN114340144A CN202111682178.5A CN202111682178A CN114340144A CN 114340144 A CN114340144 A CN 114340144A CN 202111682178 A CN202111682178 A CN 202111682178A CN 114340144 A CN114340144 A CN 114340144A
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- board assembly
- packaging
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- 238000002360 preparation method Methods 0.000 title abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims abstract description 65
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 41
- 238000003466 welding Methods 0.000 claims abstract description 32
- 238000010521 absorption reaction Methods 0.000 claims abstract description 12
- 238000005728 strengthening Methods 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 52
- 238000005538 encapsulation Methods 0.000 claims description 41
- 238000004519 manufacturing process Methods 0.000 claims description 32
- 239000003292 glue Substances 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 4
- 230000002787 reinforcement Effects 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Abstract
The embodiment of the application provides a circuit board assembly, a mobile terminal and a preparation method of the circuit board assembly, wherein the circuit board assembly comprises: the reinforcing layer is provided with a bearing surface; the circuit board is arranged on the bearing surface of the strengthening layer; the packaging layer is arranged on one side, away from the reinforcing layer, of the circuit board, the circuit board assembly comprises a stress area and a packaging area surrounding the stress area, welding spots are arranged in the packaging area, the welding spots are located between the circuit board and the packaging layer, the circuit board is connected with the packaging layer through the welding spots, and the stress area is provided with a stress absorption portion, so that the stress absorption portion can absorb the deformation stress of the reinforcing layer of the stress area. The welding spots in the packaging area can lead to unbalanced stress in the packaging area and the stress area, and the reinforcing layer can be subjected to deformation stress in the stress area.
Description
Technical Field
The application relates to the technical field of circuit manufacturing equipment, in particular to a circuit board assembly, a mobile terminal and a preparation method of the circuit board assembly.
Background
The reinforcing layer on the back of the part is designed to be thinner and thinner due to the space problem of the existing electronic products such as mobile phones, watches and the like. The mobile terminal comprises a circuit board and a ball grid array packaging layer used for packaging the circuit board, glue is needed to be dispensed on the peripheral side of the ball grid array packaging layer after the circuit board is packaged by the ball grid array packaging layer, the glue has certain fluidity before baking, and the glue flows between soldering tin balls after dispensing. When the glue is dispensed and baked, the glue shrinks and generates tensile force when the glue is baked, so that the stress deformation of the circuit board or the packaging layer is caused, the electric connection of the circuit board is influenced, and the connection of the circuit board is poor.
Disclosure of Invention
The embodiment of the application provides a circuit board assembly, a mobile terminal and a preparation method of the circuit board assembly, and aims to improve the yield of the circuit board assembly.
An embodiment of a first aspect of the present application provides a circuit board assembly, including: the reinforcing layer is provided with a bearing surface; the circuit board is arranged on the bearing surface of the strengthening layer; the packaging layer is arranged on one side, away from the reinforcing layer, of the circuit board, the circuit board assembly comprises a stress area and a packaging area surrounding the stress area, welding spots are arranged in the packaging area, the welding spots are located between the circuit board and the packaging layer, the circuit board is connected with the packaging layer through the welding spots, and the stress area is provided with a stress absorption portion, so that the stress absorption portion can absorb the deformation stress of the reinforcing layer of the stress area.
According to an embodiment of the first aspect of the present application, the stress absorbing portion includes a protruding portion located on a surface of the encapsulation layer facing the circuit board.
According to any of the embodiments of the first aspect of the present application, a height of the protrusion from the package layer toward the circuit board surface is less than or equal to a height of the protrusion from the package layer of the solder joint.
According to any of the preceding embodiments of the first aspect of the present application, the projections are prepared in the same layer as the solder joints.
According to any of the preceding embodiments of the first aspect of the present application, the shape of the projection is the same as the shape of the spot weld.
According to any of the preceding embodiments of the first aspect of the present application, the size of the projection is the same as the size of the spot weld.
According to any one of the preceding embodiments of the first aspect of the present application, the plurality of protrusions are spaced apart in the stress region.
According to any one of the preceding embodiments of the first aspect of the present application, the plurality of solder joints are spaced apart in the package region, and a distance between two adjacent protrusions is equal to a distance between two adjacent solder joints.
According to any of the preceding embodiments of the first aspect of the present application, the number of protrusions is one, and the minimum distance between a protrusion and a weld is greater than or equal to 0.3 mm.
According to any one of the preceding embodiments of the first aspect of the present application, the orthographic shape of the protrusion on the encapsulation layer includes at least one of a circle and a polygon.
According to any one of the preceding embodiments of the first aspect of the present application, the color of the projections is white.
According to any of the preceding embodiments of the first aspect of the present application, the area ratio of the orthographic projection area of the protrusion on the encapsulation layer to the area of the stress region is greater than or equal to 0.6.
According to any of the preceding embodiments of the first aspect of the present application, the stress absorbing portion comprises an opening provided in the stiffening layer.
According to any of the embodiments of the first aspect of the present application, the opening is formed by recessing the bearing surface of the stiffening layer, or the opening is disposed through the stiffening layer.
According to any one of the preceding embodiments of the first aspect of the present application, the number of the openings is plural, and the plural openings are spaced apart in the stress region.
According to any of the preceding embodiments of the first aspect of the present application, an area of an orthographic projection of each opening on the encapsulation layer is equal to an area of an orthographic projection of each solder joint on the encapsulation layer.
According to any of the preceding embodiments of the first aspect of the present application, an orthographic shape of each opening on the encapsulation layer is equal to an orthographic shape of each solder joint on the encapsulation layer.
According to any one of the previous embodiments of the first aspect of the present application, the plurality of solder joints are spaced apart in the package region, and the distance between two adjacent openings is equal to the distance between two adjacent solder joints.
According to any one of the preceding embodiments of the first aspect of the present application, further comprising an encapsulation glue, the encapsulation glue comprising:
the first glue part surrounds the packaging layer and is connected between the packaging layer and the circuit board in a sealing mode;
and the second glue part is positioned in the stress area and between the packaging layer and the circuit board.
Embodiments of the second aspect of the present application further provide a mobile terminal, including the circuit board assembly provided in any of the embodiments of the first aspect.
Embodiments of the third aspect of the present application further provide a method for manufacturing a circuit board assembly, including:
arranging a bulge on the packaging layer, wherein the bulge forms a stress absorption part;
welding spots are arranged on the peripheral side of the convex part;
the encapsulation layer is connected to the circuit board, and the solder joints are connected between the encapsulation layer and the circuit board.
Embodiments of the third aspect of the present application further provide a method for manufacturing a circuit board assembly, including:
an opening is arranged on the strengthening layer, and the opening forms a stress absorbing part;
arranging the circuit board on the reinforcing layer;
the sealing and packaging layer is arranged on one side, away from the reinforcing layer, of the circuit board, welding spots are arranged on the surface, facing the circuit board, of the packaging layer, and the orthographic projection of the welding spots on the reinforcing layer is arranged around the opening.
In the circuit board assembly provided by the embodiment of the application, the circuit board assembly comprises a reinforcing layer, a circuit board and an encapsulation layer which are sequentially stacked. The packaging layer is provided with welding spots in the packaging area, so that when the packaging layer is connected with the circuit board, the welding spots in the packaging area can cause unbalanced stress of the packaging area and the stress area, and the reinforcing layer can be subjected to deformation stress in the stress area. According to the embodiment of the application, the stress real-receiving part is arranged in the stress area, and the stress absorbing part can absorb deformation stress, so that the deformation of the reinforcing layer is improved, and the yield of the circuit board assembly can be improved.
Drawings
Other features, objects, and advantages of the present application will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like or similar reference characters identify the same or similar features.
Fig. 1 is a top view of a circuit board assembly provided in an embodiment of a first aspect of the present application;
FIG. 2 is a cross-sectional view taken at A-A of FIG. 1;
fig. 3 is a top view of a circuit board assembly according to another embodiment of the first aspect of the present application;
FIG. 4 is a cross-sectional view taken at B-B of FIG. 3;
fig. 5 is a top view of a circuit board assembly according to yet another embodiment of the first aspect of the present application;
FIG. 6 is a cross-sectional view taken at C-C of FIG. 5;
fig. 7 is a top view of a circuit board assembly according to yet another embodiment of the first aspect of the present application;
FIG. 8 is a cross-sectional view taken at D-D of FIG. 7;
fig. 9 is a schematic flow chart illustrating a method for manufacturing a circuit board assembly according to an embodiment of the third aspect of the present application;
fig. 10 is a schematic flow chart of a manufacturing method of a circuit board assembly according to another embodiment of the third aspect of the present application.
Description of reference numerals:
10. a circuit board assembly;
100. a reinforcing layer; 100a, a bearing surface; 110. an opening;
200. a circuit board;
300. a packaging layer; 310. welding spots; 320. a projection;
400. a stress absorbing portion;
500. packaging glue; 510. a first glue portion; 520. a second glue portion;
FF. A packaging area; FA. A stress region.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In the description of the present application, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like, indicate an orientation or positional relationship that is merely for convenience in describing the application and to simplify the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The directional terms appearing in the following description are directions shown in the drawings and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.
For better understanding of the present application, a circuit board assembly, a mobile terminal, and a method of manufacturing the circuit board assembly according to embodiments of the present application are described in detail below with reference to fig. 1 to 10.
Referring to fig. 1 and fig. 2 together, fig. 1 is a top view of a circuit board assembly 10 according to an embodiment of the first aspect of the present application, and fig. 2 is a cross-sectional view taken along line a-a in fig. 1.
As shown in fig. 1 and 2, a circuit board assembly 10 provided in an embodiment of the present application includes: a reinforcing layer 100 having a supporting surface 100 a; a circuit board 200 disposed on the supporting surface 100a of the stiffening layer 100; the package layer 300 is disposed on a side of the circuit board 200 away from the stiffening layer 100, wherein the circuit board assembly 10 includes a stress region FA and a package region FF surrounding the stress region FA, a solder joint 310 is disposed in the package region FF, the solder joint 310 is located between the circuit board 200 and the package layer 300, so that the circuit board 200 is connected to the package layer 300 through the solder joint 310, and the stress region FA is disposed with a stress absorption portion 400, so that the stress absorption portion 400 can absorb a deformation stress of the stiffening layer 100 of the stress region FA.
The boundary between the package region FF and the stress region FA is indicated by a dashed line in fig. 1, and the dashed line does not form a structural limitation on the circuit board assembly 10 of the embodiment of the present application.
In the circuit board assembly 10 provided in the embodiment of the present application, the circuit board assembly 10 includes a stiffening layer 100, a circuit board 200, and an encapsulation layer 300, which are sequentially stacked. The encapsulation layer 300 is provided with solder joints 310 in the encapsulation region FF, so that when the encapsulation layer 300 and the circuit board 200 are connected to each other, the presence of the solder joints 310 in the encapsulation region FF may cause an imbalance between the stress of the encapsulation region FF and the stress region FA, resulting in a deformation stress of the stiffening layer 100 in the stress region FA. In the embodiment of the present application, the stress absorbing portion 400 is disposed in the stress area FA, and the stress absorbing portion 400 can absorb the deformation stress, so as to improve the deformation of the reinforcing layer 100 and improve the yield of the circuit board assembly 10.
The stiffening layer 100 may be disposed in various ways, for example, the material of the stiffening layer 100 includes a steel sheet, so that the stiffening layer 100 can provide good support for the circuit board 200.
The circuit board 200 may be disposed in various ways, and the circuit board 200 is, for example, a flexible circuit board 200, so that the circuit board 200 has better flexibility and deformability, and the connection stability between the circuit board 200 and the encapsulation layer 300 is improved.
The encapsulation layer 300 may be disposed in various ways, for example, the material of the encapsulation layer 300 includes a metal material. Optionally, the package layer 300 includes a metal layer and a non-metal layer, and the non-metal layer is located on a side of the metal layer facing away from the circuit board 200 to provide good protection for the circuit board 200.
In some alternative embodiments, with continued reference to fig. 1 and 2, the circuit board assembly 10 further includes an encapsulant 500, the encapsulant 500 including: a first adhesive part 510 surrounding the encapsulation layer 300 and hermetically connected between the encapsulation layer 300 and the circuit board 200; and a second glue portion 520 disposed in the stress area FA and between the package layer 300 and the circuit board 200.
In these alternative embodiments, the first glue portion 510 of the packaging glue 500 is disposed around the packaging layer 300, and the first glue portion 510 can ensure the sealing property between the packaging layer 300 and the circuit board 200. The second glue portion 520 is located in the stress area FA, and when the second glue portion 520 changes from a liquid state to a solid state in the manufacturing process of the circuit board assembly 10, the volume of the second glue portion 520 is reduced to apply a stress to the circuit board 200 toward the encapsulation layer 300, and since the stress absorption portion 400 is disposed in the stress area FA, the stress absorption portion 400 can absorb the stress, so that the deformation of the circuit board 200 can be improved, the deformation of the reinforcement layer 100 can be improved, and the yield of the circuit board assembly 10 can be improved.
The stress absorption portion 400 can be disposed in various ways, and in some alternative embodiments, with reference to fig. 1 and fig. 2, the stress absorption portion 400 includes a protrusion 320, and the protrusion 320 is located on a surface of the package layer 300 facing the circuit board 200.
In these alternative embodiments, the stress absorbing portion 400 is a protrusion 320, and the protrusion 320 is located on the package layer 300, when the package layer 300 is connected to the circuit board 200 by the solder 310, the protrusion 320 can provide support for the circuit board 200 in the stress region FA, so as to improve the deformation of the circuit board 200 in the stress region FA, further reduce the deformation stress applied to the stiffening layer 100, and improve the service life of the stiffening layer 100 and the yield of the circuit board assembly 10.
In addition, when the stress area FA is provided with the second adhesive portion 520, the second adhesive portion 520 changes from a liquid state to a solid state in the preparation process of the circuit board assembly 10, the volume is reduced, and the stress towards the encapsulation layer 300 is applied to the circuit board 200, the stress towards the reinforcing layer 100 can be applied to the circuit board 200 by the protrusion portion 320, and the stress applied by the protrusion portion 320 and the stress applied by the second adhesive portion 520 are offset with each other, so that the deformation of the circuit board 200 can be improved, the deformation of the reinforcing layer 100 can be improved, and the yield of the circuit board assembly 10 can be improved.
In some alternative embodiments, the height of the protrusion 320 protruding from the surface of the packaging layer 300 facing the circuit board 200 is less than or equal to the height of the protrusion of the solder joint 310 from the packaging layer 300.
In these alternative embodiments, when the height of the protrusion 320 is less than or equal to the height of the solder joint 310, it can be ensured that the solder joint 310 is stably connected between the circuit board 200 and the packaging layer 300, and the stability of the relative position between the solder joint 310 and the circuit board 200 is not affected by the provision of the protrusion 320.
In some alternative embodiments, the projections 320 are fabricated in the same layer as the solder joints 310.
In these alternative embodiments, when the circuit board assembly 10 is prepared, the solder joints 310 can be continuously prepared by using the same material after the protrusion 320 is prepared, and there is no need to reset the material and the preparation equipment, so that the preparation difficulty of the circuit board assembly 10 can be reduced, and the preparation efficiency of the circuit board assembly 10 can be improved.
When the protrusion 320 is prepared in the same layer as the welding spot 310, the shape and size of the protrusion 320 may be different from the welding spot 310.
In other alternative embodiments, the shape of the protrusion 320 is the same as the shape of the weld 310. The protruding portion 320 and the solder joint 310 can be manufactured and molded by an approximate manufacturing process, so that the manufacturing process of the circuit board assembly 10 is further simplified, the manufacturing difficulty of the circuit board assembly 10 is reduced, and the manufacturing efficiency of the circuit board assembly 10 is improved.
In still other alternative embodiments, the size of the protrusion 320 is the same as the size of the weld 310. The protruding portion 320 and the solder joint 310 can be manufactured and molded by an approximate manufacturing process, so that the manufacturing process of the circuit board assembly 10 is further simplified, the manufacturing difficulty of the circuit board assembly 10 is reduced, and the manufacturing efficiency of the circuit board assembly 10 is improved.
In still other alternative embodiments, with continued reference to fig. 1 and 2, the shape of protrusion 320 is the same as the shape of solder 310, and the size of protrusion 320 is the same as the size of solder 310. The convex part 320 and the welding spot 310 can be manufactured and molded by the same manufacturing process, so that the manufacturing process of the circuit board assembly 10 is further simplified, the manufacturing difficulty of the circuit board assembly 10 is reduced, and the manufacturing efficiency of the circuit board assembly 10 is improved.
The number of the protrusions 320 may be one or more, and when the number of the protrusions 320 is multiple, the protrusions 320 are distributed at intervals in the stress area FA, so that the stress of the circuit board 200 at different positions in the central area is more balanced, and the deformation stress of the stiffening layer 100 at different positions in the central area is more balanced, thereby further improving the deformation of the stiffening layer 100 and increasing the yield of the circuit board assembly 10.
In some alternative embodiments, with reference to fig. 1 and fig. 2, the solder joints 310 are spaced apart in the package region FF, and the distance between two adjacent protrusions 320 is equal to the distance between two adjacent solder joints 310.
In these optional embodiments, the arrangement of the plurality of protrusions 320 is the same as the arrangement of the plurality of solder joints 310, so that the stress of the circuit board 200 at different positions of the package region FF and the stress region FA is more balanced, the deformation stress of the stiffening layer 100 at different positions of the package region FF and the stress region FA is more balanced, the deformation of the stiffening layer 100 is further improved, and the yield of the circuit board assembly 10 is improved.
Alternatively, with continued reference to fig. 1 and 2, the spacing between adjacent solder joints 310 and protrusions 320 is equal to the spacing between two adjacent protrusions 320. In these alternative embodiments, the distance between two adjacent protrusions 320, the distance between two adjacent solder joints 310, and the distance between two adjacent solder joints 310 and protrusions 320 are all equal, so that the stress balance of the circuit board 200 can be further improved, the deformation stress of the stiffening layer 100 is more balanced, the deformation of the stiffening layer 100 is further improved, and the yield of the circuit board assembly 10 is improved.
Referring to fig. 3 and 4 together, fig. 3 is a top view of a circuit board assembly 10 according to another embodiment of the first aspect of the present application, and fig. 4 is a cross-sectional view taken at B-B in fig. 3. The boundary between the package region FF and the stress region FA is indicated by a dashed line in fig. 3, and the dashed line does not form a structural limitation on the circuit board assembly 10 of the embodiment of the present application.
In other alternative embodiments, as shown in fig. 3 and 4, the number of the protrusions 320 may be one, and the minimum distance between the protrusions 320 and the welding point 310 is greater than or equal to 0.3 mm.
In these alternative embodiments, providing one protrusion 320 can simplify the structure of the circuit board assembly 10, simplify the manufacturing process of the circuit board assembly 10, reduce the difficulty of manufacturing the circuit board assembly 10, and improve the manufacturing efficiency of the circuit board assembly 10. The minimum distance between the protrusion 320 and the solder joint 310 is greater than or equal to 0.3mm, that is, a safe distance is maintained between the protrusion 320 and the solder joint 310, so that the protrusion 320 can be prevented from affecting the preparation of the solder joint 310, and the yield of the circuit board assembly 10 can be ensured.
When there is one protrusion 320, the orthographic projection shape of the protrusion 320 on the encapsulation layer 300 can be set in various ways, for example, the orthographic projection shape of the protrusion 320 on the encapsulation layer 300 includes at least one of a circle and a polygon. Optionally, the shape of the orthographic projection of the protrusion 320 on the encapsulation layer 300 is rectangular, which can simplify the structure of the protrusion 320, reduce the difficulty in manufacturing the circuit board assembly 10, and improve the manufacturing efficiency of the circuit board assembly 10.
In some alternative embodiments, the color of the projection 320 is white. The shapes of the surfaces of the circuit board 200 and the packaging layer 300 are dark colors, and when the color of the protrusion 320 is white, the boundary of the protrusion 320 on the surface of the packaging layer 300 or the circuit board 200 is more obvious, so that the preparation difficulty of the subsequent process can be reduced.
In some alternative embodiments, the ratio of the orthographic projection area of the protrusion 320 on the encapsulation layer 300 to the area of the stress region FA is greater than or equal to 0.6. In these alternative embodiments, the size of the protrusion 320 is larger, so as to better improve the deformation of the circuit board 200 in the stress region FA, better improve the deformation stress to which the stiffening layer 100 is subjected, reduce the risk of deformation of the stiffening layer 100, and improve the yield of the circuit board assembly 10.
Referring to fig. 5 and fig. 6 together, fig. 5 is a top view of a circuit board assembly 10 according to still another embodiment of the first aspect of the present application, and fig. 6 is a cross-sectional view taken at C-C in fig. 5. The boundary between the package region FF and the stress region FA is indicated by a dashed line in fig. 5, and the dashed line does not form a structural limitation on the circuit board assembly 10 of the embodiment of the present application.
In still other alternative embodiments, as shown in fig. 5 and 6, the stress absorbing portion 400 includes an opening 110 disposed in the stiffening layer 100. The position of the stiffening layer 100 and the position of the openings 110 provided in the stiffening layer 100 are indicated by dashed lines in fig. 5. The dashed lines are not meant to be structural limitations of the circuit board assembly 10 of the embodiments of the present application.
In these optional embodiments, the openings 110 are disposed on the stiffening layer 100, which can reduce the structural strength of the stiffening layer 100 in the stress region FA, and the stiffening layer 100 in the stress region FA is more easily deformed, so that the deformation stress applied to the stiffening layer 100 is not diffused from the stress region FA to the package region FF, thereby improving the deformation stress applied to the stiffening layer 100 in the package region FF, preventing the connection between the circuit board 200 and the package layer 300 from being affected by the deformation of the stiffening layer 100 in the package region FF, and further improving the yield of circuit components.
In addition, when the stress region FA is provided with the second glue portion 520, and in the preparation process of the circuit board assembly 10, the second glue portion 520 changes from a liquid state to a solid state to apply a stress to the circuit board 200 toward the package layer 300, since the reinforcing layer 100 is provided with the opening 110 in the stress region FA, the stress is not transferred to the reinforcing layer 100, and is not diffused to the package region FF from the stress region FA, so that the deformation stress applied to the reinforcing layer 100 in the package region FF can be improved, the connection between the circuit board 200 and the package layer 300 is prevented from being affected by the deformation of the reinforcing layer 100 in the package region FF, and the yield of the circuit assembly is further improved.
The openings 110 may be formed by recessing the surface of the stiffening layer 100, for example, the openings 110 may be formed by recessing the carrying surface 100a of the stiffening layer 100 along a direction away from the circuit board 200, so that at least a portion of the stress region FA is spaced between the stiffening layer 100 and the circuit board 200, and the stress applied to the circuit board 200 is not transferred to the stiffening layer 100. Alternatively, the opening 110 may be formed by recessing the surface of the stiffening layer 100 away from the circuit board 200 toward the circuit board 200, so as to reduce the structural strength of the stiffening layer 100 at the position of the opening 110.
In other alternative embodiments, the opening 110 is disposed through the stiffening layer 100, so that the stress of the circuit board 200 in the stress region FA is not transferred to the stiffening layer 100.
The number of the openings 110 can be set in various ways, and with continued reference to fig. 5 and 6, the number of the openings 110 is, for example, one, and the minimum distance between one opening 110 and the solder joint 310 is greater than or equal to 0.3mm, so that the openings 110 do not affect the preparation of the solder joint 310. The ratio of the area of one opening 110 to the area of the stress area FA is greater than or equal to 0.6, so as to ensure that the opening 110 is sufficiently large in the stress area FA, thereby better improving the deformation problem of the stiffening layer 100.
Referring to fig. 7 and 8 together, fig. 7 is a top view of a circuit board assembly 10 according to a further embodiment of the first aspect of the present application, and fig. 8 is a cross-sectional view taken at D-D in fig. 7. The boundary between the package region FF and the stress region FA is indicated by a dashed line in fig. 7, and the dashed line does not form a structural limitation on the circuit board assembly 10 of the embodiment of the present application. In fig. 7, the position information of the stiffening layer 100 and the position information of the opening 110 in the stiffening layer 100 are illustrated by dashed lines, which do not form a structural limitation of the package layer 300.
In other alternative embodiments, as shown in fig. 7 and 8, the number of the openings 110 is multiple, and the multiple openings 110 are spaced apart in the stress area FA.
In these alternative embodiments, the plurality of openings 110 are spaced in the stress region FA, which can improve the structural strength of the stiffening layer 100 on the one hand, so that the stiffening layer 100 can provide better protection for the circuit board 200. In addition, the plurality of openings 110 distributed at intervals make the stress of the stiffening layer 100 in the stress region FA more balanced, and better improve the deformation of the stiffening layer 100.
In some alternative embodiments, the orthographic projection area of each opening 110 on the packaging layer 300 is equal to the orthographic projection area of each solder joint 310 on the packaging layer 300, so that the stress of the stiffening layer 100 is more balanced.
In some alternative embodiments, the shape of the orthographic projection of each opening 110 on the packaging layer 300 is equal to the shape of the orthographic projection of each solder joint 310 on the packaging layer 300, so that the stress of the stiffening layer 100 is more balanced.
In some alternative embodiments, the plurality of solder joints 310 are spaced apart in the package region FF, and the spacing between two adjacent openings 110 is equal to the spacing between two adjacent solder joints 310, so that the stress of the stiffening layer 100 is more balanced.
Embodiments of the second aspect of the present application provide a mobile terminal, including the circuit board assembly 10 of any one of the embodiments of the first aspect. Because the mobile terminal according to the embodiment of the present application includes the circuit board assembly 10, the mobile terminal according to the embodiment of the present application has the beneficial effects of the circuit board assembly 10, and details are not repeated herein.
Embodiments of the third aspect of the present application further provide a method for manufacturing a circuit board assembly 10, where the circuit board assembly 10 may be the circuit board assembly 10 provided in any of the embodiments of the first aspect.
For example, the circuit board 200 is the circuit board assembly 10 shown in fig. 1 to 4, and referring to fig. 9, the method for manufacturing the circuit board assembly 10 includes:
step S01: a protrusion 320 is provided on the encapsulation layer 300, and the protrusion 320 forms a stress absorbing part 400.
Step S02: a welding spot 310 is provided on the peripheral side of the projection 320.
Step S03: the encapsulation layer 300 is coupled to the circuit board 200 and the solder joints 310 are coupled between the encapsulation layer 300 and the circuit board 200.
In the method for manufacturing the circuit board assembly 10 according to the embodiment of the present application, the protruding portion 320 is first manufactured on the encapsulation layer 300, and then the solder joint 310 is manufactured on the peripheral side of the protruding portion 320, so that the manufacturing of the protruding portion 320 does not affect the solder joint 310, and after the solder joint 310 is manufactured, the encapsulation layer 300 is connected to the circuit board 200, which can reduce the remaining time of the solder joint 310 and the deformation of the solder joint 310. In addition, by providing the protrusion 320, when the package layer 300 is connected to the circuit board 200 by the solder joint 310, the protrusion 320 can provide support for the circuit board 200 in the stress region FA, so as to improve the deformation of the circuit board 200 in the stress region FA, thereby reducing the deformation stress applied to the stiffening layer 100, and improving the service life of the stiffening layer 100 and the yield of the circuit board assembly 10.
Optionally, before step S03, the method further includes disposing the circuit board 200 on the stiffening layer 100. Then in step S03, the encapsulation layer 300 is disposed on the side of the circuit board 200 facing away from the stiffening layer 100. Protection can be provided to the circuit board 200 by providing the stiffening layer 100.
Optionally, after step S03, an encapsulant 500 may be further provided, for example, the encapsulant 500 is provided on the peripheral side of the encapsulant layer 300, a part of the encapsulant 500 surrounds the encapsulant layer 300 and is hermetically connected between the encapsulant layer 300 and the circuit board 200 to form a first adhesive portion 510, and a part of the encapsulant 500 forms a second adhesive portion 520 by flowing into a stress area FA between the encapsulant layer 300 and the circuit board 200. When the second glue portion 520 changes from liquid to solid, the volume is reduced and the stress towards the package layer 300 is applied to the circuit board 200, the protrusion 320 can apply the stress towards the reinforcing layer 100 to the circuit board 200, and the stresses are offset, so that the deformation of the circuit board 200 can be improved, the deformation of the reinforcing layer 100 can be improved, and the yield of the circuit board assembly 10 can be improved.
In other alternative embodiments, the circuit board 200 is the circuit board assembly 10 shown in fig. 5 to 8, and referring to fig. 10, the method for manufacturing the circuit board assembly 10 includes:
step S01': an opening 110 is provided in the stiffening layer 100, and the opening 110 forms a stress absorbing portion 400.
Step S02': the circuit board 200 is disposed on the stiffening layer 100.
Step S03': the encapsulation layer 300 is disposed on a side of the circuit board 200 away from the stiffening layer 100, a solder joint 310 is disposed on a surface of the encapsulation layer 300 facing the circuit board 200, and an orthographic projection of the solder joint 310 on the stiffening layer 100 is disposed around the opening 110.
In the method for manufacturing the circuit board assembly 10 according to the embodiment of the present application, the opening 110 is first formed on the stiffening layer 100, and the stress absorbing portion 400 is formed in the opening 110. Then, the circuit board 200 is disposed on the stiffening layer 100, and the package layer 300 is disposed on the circuit board 200. The openings 110 are formed in the reinforcing layer 100, so that the structural strength of the reinforcing layer 100 in the stress region FA can be reduced, the reinforcing layer 100 in the stress region FA is more easily deformed, the deformation stress applied to the reinforcing layer 100 cannot be diffused to the package region FF from the stress region FA, the deformation stress applied to the reinforcing layer 100 in the package region FF is improved, the phenomenon that the connection between the circuit board 200 and the package layer 300 is affected due to the deformation of the reinforcing layer 100 in the package region FF is avoided, and the yield of circuit components is further improved.
Optionally, after step S03', an encapsulant 500 may be further provided, for example, the encapsulant 500 is provided on the peripheral side of the encapsulant layer 300, a part of the encapsulant 500 surrounds the encapsulant layer 300 and is hermetically connected between the encapsulant layer 300 and the circuit board 200 to form a first adhesive portion 510, and a part of the encapsulant 500 forms a second adhesive portion 520 by flowing into a stress area FA between the encapsulant layer 300 and the circuit board 200. When the second glue portion 520 changes from liquid to solid, the volume is reduced and the stress towards the package layer 300 is applied to the circuit board 200, since the opening 110 is formed in the stress region FA of the reinforcing layer 100, the stress is not transmitted to the reinforcing layer 100, and is not diffused from the stress region FA to the package region FF, the deformation stress applied to the reinforcing layer 100 in the package region FF can be improved, the deformation of the reinforcing layer 100 in the package region FF is prevented from affecting the connection between the circuit board 200 and the package layer 300, and the yield of the circuit assembly is further improved.
While the application has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the application. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.
Claims (10)
1. A circuit board assembly, comprising:
the reinforcing layer is provided with a bearing surface;
the circuit board is arranged on the bearing surface of the reinforcing layer;
a packaging layer arranged on one side of the circuit board departing from the strengthening layer,
wherein the circuit board assembly comprises a stress region and an encapsulation region surrounding the stress region; welding spots are arranged in the packaging area and are positioned between the circuit board and the packaging layer, so that the circuit board is connected with the packaging layer through the welding spots; the stress region is provided with a stress absorbing portion so that the stress absorbing portion can absorb deformation stress of the reinforcing layer of the stress region.
2. The circuit board assembly of claim 1, wherein the stress absorbing portion comprises a protrusion portion located on a surface of the encapsulation layer facing the circuit board;
preferably, the height of the protruding part protruding from the packaging layer towards the surface of the circuit board is less than or equal to the height of the solder joint protruding from the packaging layer.
3. The circuit board assembly of claim 2, wherein the projections are prepared in the same layer as the solder joints;
preferably, the shape of the protruding part is the same as that of the welding spot, and/or the size of the protruding part is the same as that of the welding spot;
preferably, a plurality of the convex parts are distributed at intervals in the stress area;
preferably, a plurality of the welding spots are distributed at intervals in the packaging area, and the distance between two adjacent protrusions is equal to the distance between two adjacent welding spots.
4. The circuit board assembly of claim 2, wherein the number of the projections is one, and the minimum distance between the projections and the solder joints is greater than or equal to 0.3 mm;
preferably, an orthographic projection shape of the convex part on the packaging layer comprises at least one of a circle and a polygon;
preferably, the color of the convex part is white;
preferably, the area ratio of the orthographic projection area of the convex part on the packaging layer to the stress area is greater than or equal to 0.6.
5. The circuit board assembly of claim 1, wherein the stress absorbing portion comprises an opening disposed in the stiffening layer;
preferably, the opening is formed by a surface depression of the reinforcement layer, or the opening is disposed through the reinforcement layer.
6. The circuit board assembly of claim 5, wherein the number of the openings is plural, and the plural openings are spaced apart in the stress region;
preferably, the orthographic projection area of each opening on the packaging layer is equal to the orthographic projection area of each welding spot on the packaging layer;
preferably, the orthographic projection shape of each opening on the packaging layer is equal to the orthographic projection shape of each welding spot on the packaging layer;
preferably, a plurality of the welding spots are distributed at intervals in the packaging area, and the distance between two adjacent openings is equal to the distance between two adjacent welding spots.
7. The circuit board assembly of claim 1, further comprising an encapsulation adhesive, the encapsulation adhesive comprising:
the first glue part surrounds the packaging layer and is connected between the packaging layer and the circuit board in a sealing mode;
and the second glue part is arranged in the stress area and positioned between the packaging layer and the circuit board.
8. A mobile terminal, characterized in that it comprises a circuit board assembly according to any one of claims 1-7.
9. A method of making a circuit board assembly, comprising:
arranging a bulge on the packaging layer, wherein the bulge forms a stress absorption part;
welding spots are arranged on the peripheral side of the protruding part;
the packaging layer is connected to a circuit board, and the welding points are connected between the packaging layer and the circuit board.
10. A method of making a circuit board assembly, comprising:
providing an opening in the stiffening layer, the opening forming a stress absorbing portion;
arranging a circuit board on the reinforcing layer;
the packaging layer is arranged on one side, away from the reinforcing layer, of the circuit board, the packaging layer faces the surface of the circuit board, welding spots are arranged on the surface of the circuit board, and orthographic projections of the welding spots on the reinforcing layer encircle the opening.
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| CN202111682178.5A CN114340144B (en) | 2021-12-28 | 2021-12-28 | Circuit board assembly, mobile terminal and preparation method of circuit board assembly |
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| CN202111682178.5A CN114340144B (en) | 2021-12-28 | 2021-12-28 | Circuit board assembly, mobile terminal and preparation method of circuit board assembly |
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| CN114340144B (en) | 2024-02-02 |
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