CN114340065A - Flexible heating film of electronic product and preparation method thereof - Google Patents
Flexible heating film of electronic product and preparation method thereof Download PDFInfo
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- CN114340065A CN114340065A CN202011061774.7A CN202011061774A CN114340065A CN 114340065 A CN114340065 A CN 114340065A CN 202011061774 A CN202011061774 A CN 202011061774A CN 114340065 A CN114340065 A CN 114340065A
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Abstract
A flexible heating film of an electronic product and a preparation method thereof are disclosed: a high-temperature-resistant heating material is arranged on a high-temperature-resistant insulating waterproof layer by a method of spraying, brushing, rolling, transfer printing and the like, nano resin and a volatile solvent are added, after printing, high-temperature purification and drying operation is carried out to volatilize the solvent, physical or mixed chemical bridging or bonding is carried out on the high-temperature-resistant heating material and the added nano inorganic resin, a high-purity heating layer is formed and attached to the high-temperature-resistant insulating waterproof layer, an electrode layer is adhered or printed on the heating layer and covered with the high-temperature-resistant insulating waterproof layer, and a flexible heating film with high radiant heat benefit is prepared, wherein the working temperature can reach 600 ℃. The invention improves the function of the high-temperature resistant heating material to the maximum extent, reduces the cost of using the high-temperature resistant heating material and the limitation of the manufacturing process, widely improves the products which can be used by the high-temperature resistant heating material by using a low-cost mode, and carries out the maximum industrial batch production.
Description
Technical Field
The invention relates to a flexible heating film of an electronic product and a preparation method thereof, in particular to a flexible heating film with high radiant heat benefit.
Background
According to the conventional 3C electronic products, such as electric heating furnaces, electric coffee makers, and water dispensers, the electric heating elements are used as heating sources, and as shown in fig. 1A and 1B, an electric heating plate 62 is disposed on a base 61 of an electric heating furnace 60, and the electric heating plate 62 provides a heat source through an electric heating copper pipe 63 in the base 61, so that not only is power consumed, but also the electric heating pipe 63 is provided with a device which needs to be matched with a cooling fan 64, a control circuit 65 and the like, and therefore, the electric heating furnace occupies a large space, and the height (thickness) of the base 61 cannot be reduced.
In recent years, due to the development of technology, electronic components are miniaturized, and the derived thermal management problem is also paid a certain attention, and many high thermal conductive materials such as silver, copper, graphite sheets and the like are widely researched by scientists. Among them, the heat conductive properties of graphite sheets are receiving great attention, and the graphite sheets have a heat conductivity superior to that of metals due to their special two-dimensional honeycomb lattice carbon atom structure, and thus are widely used in electronic components.
In the conventional process for producing graphite flakes, chemicals are used to increase the purity and density of graphite flakes, then a pressure greater than 30Mpa is applied to press the graphite flakes together to tightly bond the graphite flakes, and finally a high temperature of 1800 plus 3000 ℃ (DEG C) is applied for several hours to obtain a graphite heat-conducting substrate, thereby consuming a large amount of energy and having a long manufacturing time. Therefore, how to develop a graphite heat conduction material with simple process without using high pressure and high temperature process steps is a problem to be broken through by related technicians in the technical field.
However, the following three problems generally exist in the conventional graphene film transfer process: firstly, the method comprises the following steps: the graphene thin film is exposed to air for a long time before transfer, resulting in contamination of the surface in contact with air by airborne particles, and the conventional transfer method is to use this contaminated surface to fabricate devices. Secondly, the method comprises the following steps: in the traditional transfer method, the graphene film is transferred to the hard substrate, and the bonding force between the graphene and the substrate is only van der waals force, so that the graphene film is easy to fall off. Thirdly, the method comprises the following steps: the traditional transfer method needs complicated steps, and in the process of transferring the graphene film from the metal substrate to the needed substrate, the used materials are too many in variety, so that the graphene film is easily polluted on the surface in the transfer process, and the crystal structure of the graphene film is easily damaged. The three defects limit the large-scale production and utilization of the graphene film.
Therefore, the chinese application publication No. CN102807208A discloses a graphene film transfer method for improving the problems of the graphene film transfer process. The method is characterized in that: the graphene film is directly adhered to the polymer substrate, so that the graphene film and the polymer substrate form covalent bonding, and one surface of the graphene film, which is in contact with the growth substrate, is exposed and serves as an effective surface for manufacturing a functional device. The implementation steps of the technical scheme are as follows: step 1), melting or dissolving the polymer to make the polymer in a fluid state; step 2), coating the polymer in a fluid state on a substrate on which graphene grows, and curing the polymer; and 3) corroding the metal sheet by using a ferric chloride or ferric nitrate solution, cleaning the polymer film adhered with the graphene film, and drying or airing to obtain the graphene film transferred to the polymer material.
Next, a patent with chinese application publication No. CN105898907A discloses a graphene heating film and a method for preparing the same, which is characterized in that: the graphene film comprises a first insulating waterproof layer, an electrode layer, a heating film layer and a second insulating waterproof layer, wherein the first insulating waterproof layer, the electrode layer, the heating film layer and the second insulating waterproof layer are pasted into an integral structure, and the heating film layer is a graphene film. The implementation steps of the technical scheme are as follows: 1) manufacturing a graphene film; 2) covering the second insulating waterproof layer with adhesive; 3) bonding the second insulating waterproof layer and the graphene film into a whole; 4) removing the metal matrix on the graphene film; 5) adhering an electrode layer on the graphene film; 6) adhering a first insulating waterproof layer on the electrode layer; 7) and connecting the electrode layer with the lead.
However, the graphene prepared by the traditional graphene preparation method has more surface defects, graphene sheets are easy to fold and curl, so that the performance of the graphene is affected, and the surface of the reduced graphene is almost free of oxidation groups, so that the surface of the reduced graphene is hydrophobic, and the reduced graphene is easy to agglomerate in water and some common organic solvents and is easy to settle. At present, a plurality of methods for preparing a graphene heating film exist, but the preparation of a graphene film with excellent electrical properties and no pollution is difficult, and the main difficulty lies in how to transfer a graphene film onto a target substrate better, so that a complete, unbroken, stable and reliable graphene heating (heat conducting) film is prepared.
Moreover, the difficult problem of the graphene industry in heat dissipation spraying also includes: the problem that the high-purity graphene cannot be closely arranged after being sprayed; and the problem that the radiation emission is influenced by wrapping the graphene by the common resin coating in a stirring and mixing mode.
In addition, the thickness of the graphene heating (heat conducting) film is not easy to decrease, and most of the graphene heating (heat conducting) films are not flexible, so that a plurality of problems are generated and the graphene heating (heat conducting) film is difficult to implement when being applied to a 3C product, thereby greatly troubling the industry.
Therefore, how to solve the above problems of the conventional graphene heat-generating (heat-conducting) film is a main subject of the present invention.
Disclosure of Invention
The present invention is directed to a flexible heating film for electronic products and a method for manufacturing the same, which can improve the function of heating material particles (such as graphene) to the maximum extent and achieve the effect of high heat generation.
The invention further aims to provide a flexible heating film for electronic products and a preparation method thereof, which have the advantages of reducing the limitation of using heating material particles, widely improving the products which can be used by the heating material particles by using a coating mode, and carrying out industrial batch production to the greatest extent.
In order to achieve the above effects, the method adopted by the invention comprises the following steps:
a) providing a first high-temperature-resistant insulating waterproof layer, wherein the thickness of the first high-temperature-resistant insulating waterproof layer is a flexible body between 0.015 and 0.2 mm;
b) on this first high temperature resistant insulating waterproof layer, set up one deck high temperature resistant heating material thick liquid, this high temperature resistant heating material thick liquid's thickness is between 0.015 ~ 0.2mm, this high temperature resistant heating material thick liquid contains and is selected from: the heating material consists of heating material particles formed by any one or combination of carbon spheres, carbon fibers, graphite or particles thereof, graphene, carbon nanotubes, boron nitride, artificial diamond, alumina, zirconia, rare earth and heat conducting metal particles, wherein the weight ratio of the heating material particles is 15-70%, and the heating material particles are mixed with 25-60% by weight of nano resin and 5-25% by weight of solvent medium;
c) purifying, namely drying the high-temperature-resistant heating material slurry at the heat temperature of 120-150 ℃ for 30-50 minutes, volatilizing a medium and a solvent at high temperature to improve the purity, carrying out physical or mixed chemical bonding or bridging on the high-temperature-resistant heating material slurry and the first high-temperature-resistant insulating waterproof layer through nano resin, exposing heating material particles on the first high-temperature-resistant insulating waterproof layer to the maximum extent, closely arranging and stacking the heating material particles without being wrapped, and generating silicate ions through a shrinkage polymerization reaction of the nano resin so that the heating material particles are stably combined on the first high-temperature-resistant insulating waterproof layer to form a high-purity high-temperature-resistant heating layer;
d) an electrode layer is arranged on the heating layer, and the thickness of the electrode layer is between 0.015 and 0.2 mm;
e) covering a second high-temperature-resistant insulating waterproof layer on the electrode layer, wherein the thickness of the second high-temperature-resistant insulating waterproof layer is 0.015-0.2 mm; and
f) providing a lead to be electrically connected with the electrode layer, and preparing the flexible heating film with the thickness within 0.6 mm.
According to a feature of the previous disclosure, the first and second insulating and waterproof layers may be selected from: a PE film, a PVC film, a PET film, glass fiber or ceramic fiber paper, or a combination thereof.
According to the previously disclosed characteristics, the nanocoiesin is aqueous or oily. Wherein the aqueous nano resin is selected from: waterborne nano epoxy modified acrylic acid or waterborne nano organic silicon modified polyurethane. Wherein the oily nano resin is selected from: solvent type nano epoxy modified acrylic acid or solvent type nano organic silicon modified polyurethane.
According to the above disclosed features, the high temperature heat-conducting layer can be in a full-surface pattern or in a line pattern matching the shape of the electrode layer.
According to the previously disclosed features, the electrode layer may be formed of a conductive metal material.
According to the features disclosed above, the flexible heat-conducting film for electronic products made by the present invention comprises: the first high-temperature-resistant insulating waterproof layer is a flexible body with the thickness of 0.015-0.2 mm; the high-temperature-resistant heating layer is coated on the first high-temperature-resistant insulating waterproof layer, the thickness of the high-temperature-resistant heating layer is 0.015-0.2 mm, the high-temperature-resistant heating layer is provided with heating material particles, the heating material particles are exposed on the first high-temperature-resistant insulating waterproof layer and are closely arranged and stacked without being wrapped, and the heating material particles are stably combined on the first high-temperature-resistant insulating waterproof layer; an electrode layer, set up on the high temperature resistant heating layer, the thickness of the electrode layer is between 0.015-0.2 mm; the second high-temperature-resistant insulating waterproof layer covers the electrode layer, and the thickness of the second high-temperature-resistant insulating waterproof layer is 0.015-0.2 mm; and a lead electrically connected with the electrode layer to form a flexible heating film with a thickness within 0.6 mm.
By means of the technical characteristics disclosed above, the flexible heating film prepared by the invention has stable structure because the heating material particles and the nano resin are bonded or connected in a bridging manner physically or chemically by mixing. The high-purity heating material particles are sprayed, the solvent is volatilized, the heating material particles are exposed on the surface of a material, molecules carry out effective radiation emission and radiation transmission to achieve soaking and heat exchange, the heating effect is rapidly achieved, and the working temperature (heating range) can reach 600 ℃. Furthermore, the present invention solves the problems of thermal spraying in the industry by the technical means of purification, including: the problem that the high-purity heating material particles cannot be tightly arranged after being sprayed is solved; and the problem that radiation emission is influenced because the heating material particles are wrapped by the common resin coating in a stirring and mixing mode is solved.
Drawings
Fig. 1A is an external view of a conventional electric heating furnace.
Fig. 1B is an internal schematic view of a conventional electric heating furnace.
FIG. 2 is a flow chart of the preparation process of the present invention.
Fig. 3A is an exploded perspective view (one) of the first possible embodiment of the present invention.
Fig. 3B is an exploded perspective view (two) of the first possible embodiment of the present invention.
Fig. 3C is a combined perspective view of the first possible embodiment of the present invention.
Fig. 4A is an exploded perspective view (one) of a second possible embodiment of the present invention.
Fig. 4B is an exploded perspective view (two) of a second possible embodiment of the present invention.
Fig. 4C is a combined perspective view of a second possible embodiment of the present invention.
Fig. 5A is a reference view (one) of the usage state of the flexible heat-generating film of the present invention.
Fig. 5B is a reference diagram (ii) of the usage state of the flexible heat-generating film of the present invention.
Fig. 6 is a structural sectional view of the flexible heat generating film of the present invention.
Fig. 7A is a cross-sectional view of fig. 6 taken along line 7A-7A.
Fig. 7B is an enlarged view of a portion of the structure of fig. 7A.
Fig. 8 is a sectional view of the high temperature resistant heat generating layer of the present invention.
FIG. 9 is a schematic view showing the temperature and time for the purification operation of the high temperature resistant heat generating layer of the present invention.
FIG. 10 is an electron microscope photograph of the high temperature resistant heat generating layer of the present invention.
FIG. 11 is a reference view showing a state in which the flexible heating film of the present invention is used in an electric heating furnace.
FIG. 12 is a reference view showing a state in which the flexible heating film of the present invention is used in a thermal insulating mattress.
Fig. 13 is a reference view of a state that the flexible heating film of the present invention is used in a floor heating.
Fig. 14 is a reference view showing a state in which the flexible heat generating film of the present invention is used in a heating pipe.
List of reference numerals: 10-a first high temperature resistant insulating waterproof layer; 20-high temperature resistant heating layer; 20 a-high temperature resistant heating material slurry; 21-a nano resin; 22-particles of a heat-generating material; 30-an electrode layer; 31-a wire; 40-a second high-temperature-resistant insulating waterproof layer; 50-flexible heating film; 51-an electric heating furnace; 52-heat preservation cushion; 53-ground heating; 54-heating tube
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention.
First, referring to fig. 1 to 14, a method for manufacturing a flexible heating film of an electronic product according to the present invention includes the following steps:
a) providing a first high-temperature-resistant insulating waterproof layer 10, wherein the thickness of the first high-temperature-resistant insulating waterproof layer 10 is a flexible body between 0.015 and 0.2 mm; in this embodiment, the first high temperature resistant insulating and waterproof layer 10 is selected from the group consisting of: a PE film, a PVC film, a PET film, a glass fiber or a ceramic fiber paper, or a combination thereof, but not limited thereto. In this embodiment, the glass fiber) is an inorganic non-metallic material with excellent performance, and has the advantages of good insulation, strong heat resistance, good corrosion resistance, and high mechanical strength. It has a softening point of 500-750 ℃, a boiling point of 1000 ℃ and a density of 2.4-2.76 g/cm3The tensile strength is 6.3-6.9 g/d in the standard state, the wet state is 5.4-5.8 g/d, and the density is 2.54g/cm3It has good heat resistance, has no influence on strength when the temperature reaches 300 ℃, has excellent electric insulation, is a high-grade electric insulation material, and is also used for heat insulation materials. Therefore, the glass fiber is the best choice for the first high temperature resistant insulating waterproof layer 10.
b) As shown in fig. 3A to 3C, a layer of heat-resistant exothermic material slurry 20a is disposed on the first heat-resistant insulating waterproof layer 10, and the following "disposing" method of the present invention includes: the methods of spraying, brushing, rolling, pad printing, and transferring are not described herein, but are not limited thereto.
The thickness of the high-temperature resistant heating material slurry 20a is between 0.015 and 0.2mm, and the high-temperature resistant heating material slurry 20a comprises the following components: the heating material particles 22 are composed of carbon spheres, carbon fibers, graphite or particles thereof, graphene, carbon nanotubes, boron nitride, artificial diamond, alumina, zirconia, rare earth and heat conducting metal particles, wherein the weight ratio of the particles 22 is 15-70%, and the particles are mixed with 25-60% by weight of nano resin 21 and 5-25% by weight of solvent medium; in this embodiment, the nano resin 21 may be water-based or oil-based; wherein the aqueous nano resin 21 is selected from the group consisting of: waterborne nano epoxy modified acrylic or waterborne nano organic silicon modified polyurethane and the like. The oily nano resin is selected from the following: solvent type nano epoxy modified acrylic acid or solvent type nano organic silicon modified polyurethane. The solvent is selected from the group consisting of: the components of esters, ketones and alcohols are adjusted according to the preparation method.
c) Purifying, drying the high temperature resistant heating material slurry 20a at a heat temperature of 120-150 ℃ for 30-50 minutes to volatilize a medium such as a solvent at a high temperature so as to improve the purity, wherein the high temperature resistant heating material slurry 20a and the first high temperature resistant insulating waterproof layer 10 are physically or chemically bonded or bridged through a nano resin 21, so that the heating material particles 22 are exposed on the first high temperature resistant insulating waterproof layer 10 to the maximum extent and are closely arranged and stacked without being wrapped, and the nano resin 21 generates silicate ions through a glycidyl polymerization reaction (shown in the following chemical reaction formula):
accordingly, the thermal material particles 22 are stably bonded to the first high temperature resistant insulating waterproof layer 10, as shown in fig. 3B, to form a high purity high temperature resistant heat generating layer 20; in this embodiment, the high temperature resistant heating layer 20 is formed by drying and purifying the high temperature resistant heating material slurry 20 a.
The above-disclosed "purification" is the most important feature of the present invention, and the term "purification" refers to separating impurities from a mixture to improve the purity of the mixture. FIG. 9 is a schematic view showing the temperature and time for the purification operation of the high temperature resistant heat generating layer according to the present invention; since the purity of the heat-generating material particles 22 is one hundred percent, the heat-generating material particles 22 are attached to the first high-temperature-resistant insulating and waterproof layer 10, and thus, a medium such as the nano resin 21, the solvent, the auxiliary …, etc. must be added to attach the heat-generating material particles by spraying or printing, and after the attachment, the high-temperature-resistant heat-generating material slurry 20a is dried at a high temperature of 120 to 150 ℃ for 30 to 50 minutes, so that the medium and the solvent can be volatilized by the purification operation of the present invention, and the purity of the heat-generating material particles 22 can be more than 95%. If the temperature and time are not controlled properly, the effect of the purification operation is affected, and the heat-generating material particles 22 and the nano-resin 21 cannot be bridged by chemical reaction, thereby achieving the effect of stable structure.
Furthermore, as shown in fig. 8, after the high-purity graphene 22 is sprayed, a solvent or other medium is volatilized, the graphene 22 is exposed and attached to the surface of the first high-temperature-resistant insulating and waterproof layer 10 (material) through the nano resin 21, and the molecules of the heating material particles 22 perform effective radiation emission and radiation transmission to achieve uniform heating and heat exchange, thereby rapidly achieving a heating effect. Therefore, the most important technical means of "purification" in the present invention can solve the problems of heat dissipation spraying in the industry including: first, the problem that the high-purity exothermic material particles 22 cannot be closely arranged after spraying is solved. Secondly, the problem that radiation emission is influenced because the heating material particles 22 are wrapped by common resin coating in a stirring and mixing mode is solved.
d) An electrode layer 30 is adhered or printed on the high temperature resistant heating layer 20, and the thickness of the electrode layer is between 0.015 and 0.2 mm; in the present embodiment, the electrode layer 30 is made of a conductive metal material, and may include means such as attaching a copper foil or printing a silver paste, but is not limited thereto.
In the first embodiment, as shown in fig. 3A to 3C, the high temperature resistant heating layer 20 is fully distributed, but not limited thereto. As another example, in the second embodiment, as shown in fig. 4A to 4C, the high temperature resistant heating layer 20 may be in a line shape matching the shape of the electrode layer 30. This is because the high temperature resistant heating layer 20 has excellent thermal conductivity and can radiate heat energy, so that the line pattern can also perform effective radiation emission.
e) Covering a second high temperature resistant insulating waterproof layer 40 on the electrode layer 30, wherein the thickness of the second high temperature resistant insulating waterproof layer 40 is a flexible body between 0.015 and 0.2 mm; in this embodiment, the second high temperature resistant insulating and waterproof layer 40 is selected from the group consisting of: a PE film, a PVC film, a PET film, a glass fiber or a ceramic fiber paper, or a combination thereof, but not limited thereto.
f) Providing a lead 31 electrically connected to the electrode layer 30, the lead 31 connecting the anode and the cathode, conducting electricity and then generating heat by short circuit, and preparing a flexible heat conducting film 50 with a thickness within 0.6 mm.
As shown in fig. 6, the flexible heating film 50 of the electronic product manufactured according to the above disclosed features of the present invention comprises: the first high-temperature-resistant insulating waterproof layer 10 is a flexible body with the thickness of 0.015-0.2 mm, and the second high-temperature-resistant insulating waterproof layer 10 is a flexible body with the thickness of 0.015-0.2 mm; a high temperature resistant heating layer 20 coated on the first high temperature resistant insulating waterproof layer 10, the thickness of the high temperature resistant heating layer 20 is 0.015-0.2 mm, and the heating material particles 22 are exposed on the first high temperature resistant insulating waterproof layer 10, closely arranged and stacked without being wrapped, so that the heating material particles 22 are stably combined on the first high temperature resistant insulating waterproof layer 10; an electrode layer 30 adhered or printed on the high temperature resistant heating layer 20, the thickness of the electrode layer is between 0.015 and 0.2 mm; a second high temperature resistant insulating waterproof layer 40 covering the electrode layer 30, the second high temperature resistant insulating waterproof layer 40 being a flexible body with a thickness of 0.015-0.2 mm; and a wire 31 electrically connected to the electrode layer 30 to form a flexible heating film 50 with a thickness of 0.6mm or less, and a working temperature (heating range) of 600 ℃ is achieved, so that the flexible heating film is an excellent heating material.
Based on the above preparation method, the flexible heating film 50 prepared by the present invention has the following effects:
the flexible heating film 50 of the present invention is physically or chemically bonded or bridged with the nano resin 21 through the heating material particles 22, so that the structure is stable; after the high-purity graphene is sprayed, the solvent is volatilized, the heating material particles 22 are exposed on the surface of the material, molecules carry out effective radiation emission and radiation transmission to achieve soaking and heat exchange, an excellent heating effect is achieved, and the working temperature (heating range) can reach 600 ℃. Therefore, the present invention solves the problems of thermal spraying in the industry by the technical means of purification, including: the problem that the traditional high-purity heating material particles 22 cannot be tightly arranged after being coated is solved; and solves the problem that radiation emission is influenced by the fact that the heating material particles 22 are wrapped by common resin coating in a stirring and mixing mode.
The thickness of the flexible heat-conducting film 50 can be within 0.6mm, and the flexible heat-conducting film is thin and flexible. Therefore, the flexible thermal conductive film 50 of the present invention can be bent as shown in fig. 5A, or rolled into a circular tube as shown in fig. 5B, so that the product applicability of the flexible thermal conductive film 50 of the present invention can be widely expanded. For example: as disclosed in fig. 11, a reference diagram of a state that the flexible heating film 50 is used in an electric heating furnace 51; or as disclosed in fig. 12, the state of the flexible heating film 50 used in the thermal pad 52 is shown in the figure; or as disclosed in fig. 13, the flexible heating film 50 is used in a floor heating 53; of course, as shown in fig. 14, the flexible heat-conducting film 50 can be used in a state of heating the tube 54; since the flexible heating film 50 can be rolled into a circular tube shape, the heating tube 54 of the water heater can be heated. Therefore, the flexible heating film 50 of the present invention can replace the conventional copper tube or rare earth heating method, and is more convenient to use and has a lower cost.
It should be understood, however, that the drawings and detailed description thereto are merely exemplary of the invention, and that various modifications and equivalent arrangements included within the spirit and scope of the present invention will be apparent to those skilled in the art from this disclosure.
Claims (10)
1. A preparation method of a flexible heating film of an electronic product is characterized by comprising the following steps:
a) providing a first high-temperature-resistant insulating waterproof layer, wherein the thickness of the first high-temperature-resistant insulating waterproof layer is a flexible body between 0.015 and 0.2 mm;
b) on this first high temperature resistant insulating waterproof layer, set up one deck high temperature resistant heating material thick liquid, this high temperature resistant heating material thick liquid's thickness is between 0.015 ~ 0.2mm, this high temperature resistant heating material thick liquid contains and is selected from: the heating material consists of heating material particles formed by any one or combination of carbon spheres, carbon fibers, graphite or particles thereof, graphene, carbon nanotubes, boron nitride, artificial diamond, alumina, zirconia, rare earth and heat conducting metal particles, wherein the weight ratio of the heating material particles is 15-70%, and the heating material particles are mixed with 25-60% by weight of nano resin and 5-25% by weight of solvent medium;
c) purifying, namely drying the high-temperature-resistant heating material slurry at the heat temperature of 120-150 ℃ for 30-50 minutes, volatilizing a medium and a solvent at high temperature to improve the purity, carrying out physical or mixed chemical bonding or bridging on the high-temperature-resistant heating material slurry and the first high-temperature-resistant insulating waterproof layer through nano resin, exposing heating material particles on the first high-temperature-resistant insulating waterproof layer to the maximum extent, closely arranging and stacking the heating material particles without being wrapped, and generating silicate ions through a shrinkage polymerization reaction of the nano resin so that the heating material particles are stably combined on the first high-temperature-resistant insulating waterproof layer to form a high-purity high-temperature-resistant heating layer;
d) an electrode layer is arranged on the heating layer, and the thickness of the electrode layer is between 0.015 and 0.2 mm;
e) covering a second high-temperature-resistant insulating waterproof layer on the electrode layer, wherein the thickness of the second high-temperature-resistant insulating waterproof layer is 0.015-0.2 mm; and
f) providing a lead to be electrically connected with the electrode layer, and preparing the flexible heating film with the thickness within 0.6 mm.
2. The method for preparing a flexible heating film for electronic products according to claim 1, wherein in the steps a) and e), the first and second high temperature-resistant insulating and waterproof layers are selected from: a PE film, a PVC film, a PET film, glass fiber or ceramic fiber paper, or a combination thereof.
3. The method for preparing a flexible heating film for electronic products as claimed in claim 1, wherein the nano resin is water-based or oil-based in step b).
4. The method for preparing a flexible heating film for electronic products as claimed in claim 3, wherein the aqueous nano resin is selected from the group consisting of: waterborne nano epoxy modified acrylic acid or waterborne nano organic silicon modified polyurethane.
5. The method for preparing the flexible heating film of the electronic product as claimed in claim 3, wherein the oily nano resin is selected from: solvent type nano epoxy modified acrylic acid or solvent type nano organic silicon modified polyurethane.
6. The method as claimed in claim 1, wherein in step c), the high temperature resistant heating layer is fully distributed or has a line shape matching the shape of the electrode layer.
7. The method for preparing a flexible heating film for electronic products as claimed in claim 1, wherein in step d), the electrode layer is made of conductive metal material.
8. An electronic product flexible heat-generating film manufactured by the manufacturing method of any one of claims 1 to 7, comprising:
the first high-temperature-resistant insulating waterproof layer is a flexible body with the thickness of 0.015-0.2 mm;
the high-temperature-resistant heating layer is coated on the first high-temperature-resistant insulating waterproof layer, the thickness of the high-temperature-resistant heating layer is 0.015-0.2 mm, the high-temperature-resistant heating layer is provided with heating material particles, the heating material particles are exposed on the first high-temperature-resistant insulating waterproof layer and are closely arranged and stacked without being wrapped, and the heating material particles are stably combined on the first high-temperature-resistant insulating waterproof layer;
an electrode layer, set up on the high temperature resistant heating layer, the thickness of the electrode layer is between 0.015-0.2 mm;
the second high-temperature-resistant insulating waterproof layer covers the electrode layer, and the thickness of the second high-temperature-resistant insulating waterproof layer is 0.015-0.2 mm; and
a lead wire electrically connected with the electrode layer to form a flexible heating film with a thickness within 0.6 mm.
9. The flexible heating film as claimed in claim 8, wherein the heat-resistant layer is a full-surface pattern or a line pattern matching the shape of the electrode layer.
10. An electronic product flexible heat-generating film according to claim 8, wherein the electrode layer is made of a conductive metal material.
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| CN106083051A (en) * | 2016-06-15 | 2016-11-09 | 黄志良 | High conductive graphite heat dissipation film processing technology |
| WO2018034488A1 (en) * | 2016-08-19 | 2018-02-22 | 주식회사 히톨로지 | Flexible planar heating element and method for manufacturing same |
| CN213783621U (en) * | 2020-09-30 | 2021-07-23 | 深圳市为什新材料科技有限公司 | Flexible heating film of electronic product |
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| CN106083051A (en) * | 2016-06-15 | 2016-11-09 | 黄志良 | High conductive graphite heat dissipation film processing technology |
| WO2018034488A1 (en) * | 2016-08-19 | 2018-02-22 | 주식회사 히톨로지 | Flexible planar heating element and method for manufacturing same |
| CN213783621U (en) * | 2020-09-30 | 2021-07-23 | 深圳市为什新材料科技有限公司 | Flexible heating film of electronic product |
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