CN114318449A - Innovative process for plating thin gold on silver - Google Patents
Innovative process for plating thin gold on silver Download PDFInfo
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- CN114318449A CN114318449A CN202011089201.5A CN202011089201A CN114318449A CN 114318449 A CN114318449 A CN 114318449A CN 202011089201 A CN202011089201 A CN 202011089201A CN 114318449 A CN114318449 A CN 114318449A
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Abstract
The invention relates to the technical field of electroplating processing, in particular to an innovative process for plating thin gold on silver. The technical scheme adopted by the invention is as follows: the method comprises the following steps of conveying a product to be electroplated to an ultrasonic degreasing station through an automatic conveying line for ultrasonic degreasing operation; transferring the product subjected to ultrasonic degreasing to an electrolytic degreasing treatment device in an automatic conveying mode to perform electrolytic degreasing treatment; conveying the products subjected to electrolytic degreasing treatment to a washing tank in an automatic conveying manner for washing; and transferring the washed product to microetching treatment in an automatic conveying mode to carry out the microetching treatment on the surface of the product. The invention has the advantages that: the traditional gold plating is replaced by a mode of electroplating silver inside and electroplating a thin layer of gold outside during electroplating treatment, so that the production cost during electroplating is greatly reduced on the basis of ensuring the whole use performance, and the product safety during later use is also ensured.
Description
Technical Field
The invention relates to the technical field of electroplating processing, in particular to an innovative process for plating thin gold on silver.
Background
When electronic products are produced and processed, electroplating treatment is carried out on the basis of metals such as copper base materials, stainless steel base materials, iron base materials and the like, so that the electronic components have reliable service performance and can play a more stable role in use. For some electrical parts with higher performance requirements, gold plating treatment is needed when the electrical parts are used, the existing gold plating process is to directly perform gold plating treatment on the surfaces of products, although the requirements of later use are met, the overall treatment cost is higher, the overall gold plating cost is increased along with the increase of the gold price, and under the compression requirement of the overall cost of the products, the gold plating treatment process needs to be innovated to meet the requirements of cost reduction and product performance.
Disclosure of Invention
The invention aims to provide an innovative process for plating thin gold on silver, which adopts a brand-new processing technology and is integrally carried out by automatic other electroplating equipment, thereby ensuring better smoothness of the whole electroplating process and higher whole efficiency.
The technical scheme of the invention is as follows:
an innovative process for plating thin gold on silver is characterized in that: the method comprises the following steps of 1) conveying a product to be electroplated to an ultrasonic degreasing station through an automatic conveying line for ultrasonic degreasing operation; 2) transferring the product subjected to ultrasonic degreasing to an electrolytic degreasing treatment device in an automatic conveying mode to perform electrolytic degreasing treatment; 3) conveying the products subjected to electrolytic degreasing treatment to a washing tank in an automatic conveying manner for washing; 4) transferring the washed product to microetching treatment in an automatic conveying mode to carry out the microetching treatment on the surface of the product; 5) conveying the product in the previous step into an acid washing pool for acid washing treatment; 6) conveying the pickled product to a secondary washing tank for secondary washing in an automatic conveying mode; 7) carrying out surface drying treatment on the product subjected to secondary water washing, and then conveying the product to a nickel preplating treatment device for nickel preplating treatment; 8) directly conveying the product subjected to the nickel preplating treatment to a tertiary water washing treatment device in an automatic conveying mode to perform tertiary water washing treatment; 9) carrying out surface drying treatment on the product subjected to the three-time washing, and then conveying the product to pre-silver plating treatment equipment for pre-silver plating treatment; 10) conveying the product subjected to the pre-silvering treatment into a silvering tank to carry out integral silvering operation; 11) directly transferring the silver-plated product to gold-plating equipment in an automatic conveying mode for surface gold-plating treatment; 12) washing the gold-plated product for four times, and then conveying the gold-plated product to hot water washing treatment equipment for integral hot water washing treatment, wherein the hot water temperature range in the step is 55-65 ℃; 13) carrying out hole sealing treatment on the product subjected to hot water washing treatment; 14) carrying out integral drying operation on the product subjected to hole sealing treatment, wherein the temperature range in the drying process is 100-140 ℃; 15) and (4) automatically cooling the dried product, and then packaging to finish the whole electroplating operation.
Further, the current in the step 1) and the step 2) is more than 0.2A, and the temperature is 55-65 ℃ during the treatment.
Further, water is in a flowing state when water washing is performed in the step 3).
Further, the drying operation in the step 14 is performed in a drying box, and the continuous conveying operation is realized in cooperation with automatic conveying.
The invention has the beneficial effects that:
the invention adopts a brand new processing technology, the whole electroplating process is carried out by automatic electroplating equipment, the smoothness of the whole electroplating process is better, the whole efficiency is higher, the electroplating process is repeatedly cleaned before electroplating, and the use of pre-electroplating equipment is matched, the electroplating uniformity and the electroplating stability in the later electroplating process are ensured, the traditional gold plating is replaced by a mode of electroplating silver inside and electroplating a thin layer of gold outside during the electroplating process, the production cost in the electroplating process is greatly reduced on the basis of ensuring the whole use performance, and the product safety in the later use is also ensured.
Detailed Description
The utility model provides an innovative technology of plating thin gold on silver, it is through adopting brand-new processing technology, it is whole to go on through other electroplating device of automation, it is better to have ensured the smoothness nature of whole electroplating process, holistic efficiency is higher, the multiple cleaning before electroplating is handled in carrying out the electroplating treatment in-process, and the use of electroplating device in advance is cooperated, electroplating uniformity and electroplating stability when having ensured later stage electroplating process, adopt inside electroplating silver and the mode of outside electroplating a layer thin gold replaces traditional gilding when carrying out electroplating treatment, greatly reduced the manufacturing cost when electroplating on the basis of having ensured whole performance, product security when also having ensured later stage use, the problem that the cost needs the compression in the prior art has been solved. The method comprises the following steps of 1) conveying a product to be electroplated to an ultrasonic degreasing station through an automatic conveying line for ultrasonic degreasing operation; 2) transferring the product subjected to ultrasonic degreasing to an electrolytic degreasing treatment device in an automatic conveying mode to perform electrolytic degreasing treatment; the first two steps can carry out thorough degreasing treatment on the surface of the product to be electroplated, and the overall electroplating stability during later electroplating is guaranteed. 3) Conveying the products subjected to electrolytic degreasing treatment to a washing tank in an automatic conveying manner for washing; ensuring better surface cleanliness. 4) Transferring the washed product to microetching treatment in an automatic conveying mode to carry out the microetching treatment on the surface of the product; can process the top layer of product, the space when making the later stage electroplate is bigger, and the thickness of guarantee plating layer is more stable, and it is littleer also to have ensured the product size after whole electroplating simultaneously. 5) Conveying the product in the previous step into an acid washing pool for acid washing treatment; 6) conveying the pickled product to a secondary washing tank for secondary washing in an automatic conveying mode; 7) carrying out surface drying treatment on the product subjected to secondary water washing, and then conveying the product to a nickel preplating treatment device for nickel preplating treatment; 8) directly conveying the product subjected to the nickel preplating treatment to a tertiary water washing treatment device in an automatic conveying mode to perform tertiary water washing treatment; the early preparation during electroplating is completed after three times of treatment and three times of water washing, and reliable guarantee is provided for later electroplating. 9) Carrying out surface drying treatment on the product subjected to the three-time washing, and then conveying the product to pre-silver plating treatment equipment for pre-silver plating treatment; 10) conveying the product subjected to the pre-silvering treatment into a silvering tank to carry out integral silvering operation; 11) directly transferring the silver-plated product to gold-plating equipment in an automatic conveying mode for surface gold-plating treatment; 12) washing the gold-plated product for four times, and then conveying the gold-plated product to hot water washing treatment equipment for integral hot water washing treatment, wherein the hot water temperature range in the step is 55-65 ℃; the stability of the gold-plated layer can be guaranteed to be better, the product performance is more stable when the gold-plated layer is used in the later period, and the service life is longer. 13) Carrying out hole sealing treatment on the product subjected to hot water washing treatment; 14) carrying out integral drying operation on the product subjected to hole sealing treatment, wherein the temperature range in the drying process is 100-140 ℃; the whole efficiency when carrying out drying process is higher has been ensured, also can not cause the influence to the product simultaneously, has ensured the whole security of stoving in-process. 15) And (4) automatically cooling the dried product, and then packaging to finish the whole electroplating operation.
Preferably, the current in the step 1) and the step 2) is more than 0.2A, and the temperature is 55-65 ℃ in the treatment process, so that the degreasing treatment efficiency in the two steps can be higher, the treatment can be more thorough, and the time can be saved for the electroplating operation in the later step.
Preferably, the water in the step 3) is in a flowing state, so that the product can be cooled when the product is washed, the operation of cooling the product separately is avoided, and the treatment efficiency is improved.
Preferably, the drying operation in the step 14 is performed in the drying box, and the continuous conveying operation is realized by matching with automatic conveying, so that the overall smoothness in the processing process is better, the manual operation is reduced, the labor cost is reduced, and the overall efficiency of post-processing is ensured.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications or substitutions can be made without departing from the principle of the present invention, and these modifications or substitutions should also be considered as the protection scope of the present invention.
Claims (4)
1. An innovative process for plating thin gold on silver is characterized in that: the method comprises the following steps of 1) conveying a product to be electroplated to an ultrasonic degreasing station through an automatic conveying line for ultrasonic degreasing operation; 2) transferring the product subjected to ultrasonic degreasing to an electrolytic degreasing treatment device in an automatic conveying mode to perform electrolytic degreasing treatment; 3) conveying the products subjected to electrolytic degreasing treatment to a washing tank in an automatic conveying manner for washing; 4) transferring the washed product to microetching treatment in an automatic conveying mode to carry out the microetching treatment on the surface of the product; 5) conveying the product in the previous step into an acid washing pool for acid washing treatment; 6) conveying the pickled product to a secondary washing tank for secondary washing in an automatic conveying mode; 7) carrying out surface drying treatment on the product subjected to secondary water washing, and then conveying the product to a nickel preplating treatment device for nickel preplating treatment; 8) directly conveying the product subjected to the nickel preplating treatment to a tertiary water washing treatment device in an automatic conveying mode to perform tertiary water washing treatment; 9) carrying out surface drying treatment on the product subjected to the three-time washing, and then conveying the product to pre-silver plating treatment equipment for pre-silver plating treatment; 10) conveying the product subjected to the pre-silvering treatment into a silvering tank to carry out integral silvering operation; 11) directly transferring the silver-plated product to gold-plating equipment in an automatic conveying mode for surface gold-plating treatment; 12) washing the gold-plated product for four times, and then conveying the gold-plated product to hot water washing treatment equipment for integral hot water washing treatment, wherein the hot water temperature range in the step is 55-65 ℃; 13) carrying out hole sealing treatment on the product subjected to hot water washing treatment; 14) carrying out integral drying operation on the product subjected to hole sealing treatment, wherein the temperature range in the drying process is 100-140 ℃; 15) and (4) automatically cooling the dried product, and then packaging to finish the whole electroplating operation.
2. The innovative process of thin gold plating on silver of claim 1, characterized by: the current in the step 1) and the step 2) is more than 0.2A, and the temperature is 55-65 ℃ during the treatment.
3. The innovative process of thin gold plating on silver of claim 1, characterized by: the water when the water washing is performed in the step 3) is in a flowing state.
4. The innovative process of thin gold plating on silver of claim 1, characterized by: the drying operation in the step 14 is performed in a drying box, and the continuous conveying operation is realized by matching with automatic conveying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011089201.5A CN114318449A (en) | 2020-10-12 | 2020-10-12 | Innovative process for plating thin gold on silver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011089201.5A CN114318449A (en) | 2020-10-12 | 2020-10-12 | Innovative process for plating thin gold on silver |
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| Publication Number | Publication Date |
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| CN114318449A true CN114318449A (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011089201.5A Withdrawn CN114318449A (en) | 2020-10-12 | 2020-10-12 | Innovative process for plating thin gold on silver |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1591989A (en) * | 2003-08-30 | 2005-03-09 | 富士康(昆山)电脑接插件有限公司 | Terminal and its electroplating method |
| TW200510578A (en) * | 2003-09-03 | 2005-03-16 | Hon Hai Prec Ind Co Ltd | Terminal and method of plating the same |
| CN102808203A (en) * | 2012-08-31 | 2012-12-05 | 成都宏明双新科技股份有限公司 | Gold-plating process using gold potassium citrate |
| CN104451619A (en) * | 2014-12-31 | 2015-03-25 | 共青城超群科技股份有限公司 | SMD LED packaging substrate electroplating structure and electroplating technology thereof |
| CN105839158A (en) * | 2016-05-19 | 2016-08-10 | 苏州市美能五金镀饰有限公司 | Continuous electroplating technology |
| CN107059081A (en) * | 2017-05-31 | 2017-08-18 | 东莞市诚志电子有限公司 | A kind of nickel plating process for electroplating nickeline |
| CN109853011A (en) * | 2019-04-09 | 2019-06-07 | 江苏澳光电子有限公司 | A kind of silver plating process |
| CN110306220A (en) * | 2019-07-23 | 2019-10-08 | 淮阴工学院 | Connector electroplating technology |
| CN111188070A (en) * | 2020-01-22 | 2020-05-22 | 惠州中京电子科技有限公司 | Manufacturing method for electroplating nickel, silver and gold on IC packaging board |
-
2020
- 2020-10-12 CN CN202011089201.5A patent/CN114318449A/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1591989A (en) * | 2003-08-30 | 2005-03-09 | 富士康(昆山)电脑接插件有限公司 | Terminal and its electroplating method |
| TW200510578A (en) * | 2003-09-03 | 2005-03-16 | Hon Hai Prec Ind Co Ltd | Terminal and method of plating the same |
| CN102808203A (en) * | 2012-08-31 | 2012-12-05 | 成都宏明双新科技股份有限公司 | Gold-plating process using gold potassium citrate |
| CN104451619A (en) * | 2014-12-31 | 2015-03-25 | 共青城超群科技股份有限公司 | SMD LED packaging substrate electroplating structure and electroplating technology thereof |
| CN105839158A (en) * | 2016-05-19 | 2016-08-10 | 苏州市美能五金镀饰有限公司 | Continuous electroplating technology |
| CN107059081A (en) * | 2017-05-31 | 2017-08-18 | 东莞市诚志电子有限公司 | A kind of nickel plating process for electroplating nickeline |
| CN109853011A (en) * | 2019-04-09 | 2019-06-07 | 江苏澳光电子有限公司 | A kind of silver plating process |
| CN110306220A (en) * | 2019-07-23 | 2019-10-08 | 淮阴工学院 | Connector electroplating technology |
| CN111188070A (en) * | 2020-01-22 | 2020-05-22 | 惠州中京电子科技有限公司 | Manufacturing method for electroplating nickel, silver and gold on IC packaging board |
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Application publication date: 20220412 |