CN114302562B - Processing method for preventing separation of hole walls of PCB and PCB - Google Patents
Processing method for preventing separation of hole walls of PCB and PCB Download PDFInfo
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- CN114302562B CN114302562B CN202111553525.4A CN202111553525A CN114302562B CN 114302562 B CN114302562 B CN 114302562B CN 202111553525 A CN202111553525 A CN 202111553525A CN 114302562 B CN114302562 B CN 114302562B
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Abstract
The invention relates to the technical field of circuit board production, and provides a processing method for preventing the separation of the hole walls of a PCB (printed circuit board) and the PCB. The processing method for preventing the separation of the hole walls of the PCB comprises the following steps: providing a substrate, wherein the substrate is provided with a molding area, and the molding area is provided with a molding boundary; drilling a coarsening hole on the substrate, wherein the hole wall of the coarsening hole is intersected with the forming boundary; and processing a slotted hole in the forming area of the substrate, wherein the hole wall of the slotted hole is superposed with the forming boundary. The processing method for preventing the separation of the hole wall of the PCB solves the problem of poor effect of improving the separation phenomenon of the hole wall of the metallized macro-hole and the metallized macro-groove in the prior art. The PCB board of the invention has the advantages of no hole wall separation phenomenon after being heated and better quality.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a processing method for preventing the separation of the hole wall of a PCB (printed circuit board) and the PCB.
Background
After the metallized macropores and the metallized macrocells on the PCB are heated through the processes of tin spraying, reflow soldering and wave soldering, the problems of separation of pore copper and base materials or board explosion and the like can be caused due to insufficient binding force of the pore copper and the base materials on the walls of the metallized macropores and the metallized macrocells, and the reliability of electronic products is seriously influenced.
At present, in order to prevent the problem of pore wall separation after the large metalized hole and the large metalized groove are heated, the following two methods are generally used for solving the problems: 1. baking before tin spraying, and reducing tin temperature to prevent hole wall separation; 2. reflow soldering and wave soldering are carried out to prevent the separation of the hole wall. However, the above two methods have poor effect of improving the separation phenomenon of the metallized macropore and the metallized macropore wall.
Disclosure of Invention
The invention provides a processing method for preventing the separation of the hole wall of a PCB (printed circuit board) and the PCB, and aims to solve the problem of poor effect of improving the separation phenomenon of the hole wall of a metalized large hole and a metalized large groove in the prior art.
The embodiment of the first aspect of the application provides a processing method for preventing the separation of the hole walls of a PCB, which comprises the following steps:
providing a substrate, wherein the substrate is provided with a molding area, and the molding area is provided with a molding boundary;
drilling a coarsening hole on the substrate, wherein the hole wall of the coarsening hole is intersected with the forming boundary;
and processing a slotted hole in the forming area of the substrate, wherein the hole wall of the slotted hole is superposed with the forming boundary.
In some of these embodiments, drilling a roughened hole in the substrate comprises: and drilling a plurality of coarsening holes on the substrate, wherein the plurality of coarsening holes are arranged at intervals along the forming boundary.
In some embodiments, the plurality of roughened holes are uniformly spaced along the shaped boundary.
In some embodiments, the distance between two adjacent roughened holes is 0.20mm-0.60mm.
In some embodiments, the roughened hole is a circular hole and the central axis of the roughened hole is located in the molding region.
In some of the embodiments, during the process of machining the slot in the molding area of the substrate, when the aperture of the slot is less than or equal to 6mm, the slot is drilled in the molding area of the substrate; and when the aperture of the slotted hole is larger than 6mm, routing the slotted hole in the forming area of the substrate.
In some embodiments, a drill bit with a diameter of 0.20mm to 0.60mm is used for drilling the roughened hole in the substrate.
In some embodiments, when the roughened hole is drilled on the substrate, the maximum distance between the hole wall of the roughened hole outside the molding region and the molding boundary is 0.025mm-0.05mm.
In some of these embodiments, the depth of the roughened holes is 50% to 100% of the depth of the slotted holes.
An embodiment of the second aspect of the present application provides a PCB, which is manufactured by using the processing method for preventing the separation of the hole walls of the PCB as described in the first aspect.
The processing method for preventing the separation of the hole walls of the PCB provided by the embodiment of the first aspect of the application has the following beneficial effects: the coarsening holes with the intersected hole walls and the forming boundaries are drilled on the substrate, and the slotted holes with the coincident hole walls and the forming boundaries are processed in the forming area of the substrate, so that the contact area of the subsequent hole copper and the hole walls of the slotted holes can be increased, the bonding force between the hole copper and the hole walls of the slotted holes is improved, the phenomenon of hole wall separation after the hole copper and the slotted holes are heated is avoided, and the problem of poor effect of improving the phenomenon of hole wall separation of a metalized large hole and a metalized large groove in the prior art is solved.
According to the PCB board, the coarsening holes with the intersected hole walls and the forming boundaries are drilled on the substrate in the processing process, and the slotted holes with the coincident hole walls and the forming boundaries are processed in the forming area of the substrate, so that the contact area between the hole copper of the finished PCB board and the hole walls of the slotted holes is large, the binding force between the hole copper and the hole walls of the slotted holes is high, the phenomenon of hole wall separation cannot occur after the hole copper and the slotted holes are heated, and the quality is good.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a flow chart of a method of manufacturing a PCB to prevent separation of the hole walls of the PCB in one embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a substrate according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of the substrate shown in FIG. 2 after the roughening holes are drilled in the substrate;
FIG. 4 is a schematic structural diagram of a substrate with a slot formed therein as shown in FIG. 3;
FIG. 5 is a schematic view of the structure of the substrate shown in FIG. 3 after the slot is processed;
FIG. 6 is a schematic structural diagram of a substrate according to a second embodiment of the present invention;
FIG. 7 is a schematic structural diagram of the substrate shown in FIG. 6 after the roughening holes are drilled in the substrate;
FIG. 8 is a schematic structural diagram of a substrate with slots formed in the substrate shown in FIG. 7;
FIG. 9 is a schematic view of the structure of the substrate shown in FIG. 7 after processing the slot holes.
The designations in the figures mean:
10. a substrate; 11. a molding area; 111. forming a boundary; 20. roughening the hole; 30. a slot hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In order to explain the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.
Referring to fig. 1 to 9, an embodiment of a first aspect of the present application provides a processing method for preventing separation of hole walls of a PCB board, including:
s10: a substrate 10 is provided, the substrate 10 has a molding region 11, and the molding region 11 has a molding boundary 111.
Specifically, the substrate 10 is a substrate 10 manufactured through conventional processes such as cutting, inner layer wiring, inner layer AOI, and pressing.
In the cutting process, the required core plate size is cut according to the inner core plate required by the pressing structure required by a customer. In the inner layer circuit procedure, the circuit of each layer of the inner layer core board is manufactured according to the inner layer wiring design of a customer. And in the inner layer AOI procedure, whether each inner layer circuit meets the design requirement of the product is detected completely. In the pressing process, the mixed pressure is not allowed in the same pressing opening, the expansion and contraction are controlled within +/-3 mil, the dielectric thickness of the back drilling layer is controlled within +/-10%, and the plate thickness is controlled within +/-5%.
It is understood that the substrate 10 may have one, two or more molding regions 11, and the molding regions 11 may have a regular shape or an irregular shape.
S20: a roughened hole 20 is drilled in the substrate 10, and the hole wall of the roughened hole 20 intersects the forming boundary 111.
Specifically, the substrate 10 may be processed by a drilling machine to drill the roughened hole 20 on the substrate 10. The intersection of the hole wall of the roughened hole 20 and the forming boundary 111 can be understood as that most of the hole wall of the roughened hole 20 is located in the forming region 11, and the rest of the hole wall is located outside the forming region 11; or, most of the hole walls of the roughened holes 20 are located outside the forming area 11, and the rest of the hole walls are located in the forming area 11; alternatively, half of the roughened holes 20 may be located outside the molding region 11, and the rest of the roughened holes may be located outside the molding region 11.
S30: a slot 30 is formed in a molding region 11 of a substrate 10, and a wall of the slot 30 overlaps a molding boundary 111.
Specifically, after the slot hole 30 is processed in the forming region 11 of the substrate 10, the roughening hole 20 is disposed at the edge of the slot hole 30 and is communicated with the slot hole 20, the hole wall of the slot hole 30 is connected with the hole wall of the roughening hole 20 located outside the forming region 11, and the hole walls located outside the forming region 11 can increase the contact area between the subsequent hole copper and the hole wall of the slot hole 30, so that the bonding force between the hole copper and the hole wall of the slot hole 30 is improved, and the phenomenon of hole wall separation after the hole copper is heated is avoided.
The slot 30 may be of any shape. Referring to fig. 2 to 5, in the first embodiment, a circular slot 30 with a large aperture can be processed in the molding region 11 of the substrate 10, and the hole copper has a good bonding force with the wall of the slot 30.
Referring to fig. 6 to 9, in the second embodiment, a square slot 30 with a large aperture can be formed in the molding region 11 of the substrate 10, and the bonding force between the hole copper and the wall of the slot 30 is also better.
According to the processing method for preventing the separation of the hole wall of the PCB, the coarsening hole 20 with the hole wall intersected with the forming boundary 111 is drilled on the substrate 10, and the slotted hole 30 with the hole wall overlapped with the forming boundary 111 is processed in the forming area 11 of the substrate 10, so that the contact area of the subsequent hole copper and the hole wall of the slotted hole 30 can be increased, the bonding force between the hole copper and the hole wall of the slotted hole 30 is improved, the phenomenon of hole wall separation after the hole copper is heated is avoided, and the problem of poor effect of improving the separation phenomenon of the metallized big hole and the metallized big slotted hole 30 wall in the prior art is solved; in addition, by drilling the roughened hole 20 with the hole wall intersecting with the forming boundary 111 on the substrate 10, and then machining the slot 30 with the hole wall coinciding with the forming boundary 111 in the forming region 11 of the substrate 10, when machining the slot 30 in the forming region 11 of the substrate 10, the problem of the burr caused by the large-area contact of the cutter with the plate body of the substrate 10 to generate resistance and the excessive abrasion of the cutter can be avoided.
Optionally, after the slot 30 is processed in the forming region 11 of the substrate 10, the substrate 10 may be subjected to conventional processes such as copper plate deposition, pulse plating, back drilling, resin plugging, copper plate deposition, outer layer circuit, outer layer etching, outer layer AOI, solder mask, text, tin spraying, forming, testing, FQC, FQA, packaging, and the like to manufacture a PCB.
In the copper plate deposition process, the PCB product with a high aspect ratio is manufactured by using a horizontal copper deposition method, and the slot 30 is plated with copper by using the copper plate deposition method to form the PTH slot 30. In the pulse electroplating process, copper is normally thickened, the depth capacity is controlled to be 90%, and meanwhile, the hole wall of the PTH and the hole ring are thickened to the design requirement.
In the back drilling process, the depth control precision of a back drilling machine platform is controlled to be +/-0.05 mm by the special back drilling drill tip, and the Cpk capacity needs to meet the requirement that the Cpk capacity is more than or equal to 1.33. The alignment of back drilling is less than 0.075mm. In the resin hole plugging process, resin hole plugging is normally made, resin grinding is performed by 100% resin hole plugging AOI inspection, and whether the problems of hole plugging failure and back drilling leakage exist is determined.
In the copper plate deposition process, the copper plate is normally manufactured, and in the outer layer circuit process, the copper plate is normally etched. In the outer layer etching process, etching is normally carried out, and the line width and the line distance are controlled according to FA parameters.
In the outer layer AOI procedure, 100% full inspection is carried out to confirm whether the outer layer circuit meets the design requirements of the product. And in the solder mask process, normally manufacturing screen printing solder mask oil, exposing and developing. In the character process, silk-screen characters are normally manufactured and post-cured.
In the tin spraying procedure, the tin spraying parameters are normal, and the tin temperature is not required to be reduced for preventing the upper hole wall from being separated. In the forming procedure, a milling cutter is used for milling the required size of the client. In the testing procedure, the insulation and the conductivity of the PCB are required to be tested normally.
In the FQC procedure, plates are checked as required for routine FQC testing. In the FQA step, the plate is inspected according to the conventional FQA inspection requirements. And in the packaging process, packaging and delivering the qualified products.
After the processing method for preventing the PCB hole wall separation in the embodiment of the application is adopted, the problem caused by the hole wall separation is prevented in a mode of reducing the tin temperature without baking before tin spraying, so that the problems that the cost is increased due to the baking process for increasing the tin spraying process and the rough appearance of a tin surface is poor due to the reduction of the tin temperature are solved.
Referring to fig. 3 and 7, in some embodiments, the drilling of the roughened holes on the substrate 1020 includes: a plurality of roughened holes 20 are drilled in the substrate 10, and the plurality of roughened holes 20 are spaced along the molding boundary 111.
By adopting the scheme, the contact area between the subsequent hole copper and the hole wall of the slotted hole 30 can be further increased, so that the bonding force between the hole copper and the hole wall of the slotted hole 30 is improved, and the phenomenon of hole wall separation after the hole copper is heated is avoided.
Referring again to fig. 3 and 7, in some embodiments, a plurality of roughened holes 20 are uniformly spaced along the forming boundary 111.
By adopting the above scheme, the bonding force between the hole copper and the hole wall of the slot 30 along the direction of the forming boundary 111 is uniform, and the bonding force is better.
In some embodiments, the distance between two adjacent roughened holes 20 is 0.20mm-0.60mm, such as 0.20mm, 0.25mm, 0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, etc.
Through adopting above-mentioned scheme, can avoid because of the undersize of alligatoring hole 20 interval, alligatoring hole 20 is too intensive to lead to the increase of the drilling quantity of alligatoring hole 20, drilling efficiency is lower, drilling cost is higher, also can avoid because of the too big interval of alligatoring hole 20, alligatoring hole 20 is too sparse and leads to the area that alligatoring hole 20 is located the outside pore wall of shaping region 11 less, the risk that pore copper and the pore wall of the slotted hole 30 that leads to and pore copper separation that the area of contact of the pore wall that is located the outside of shaping region 11 reduces has been reduced.
In some of these embodiments, the roughened hole 20 is a circular hole and the central axis of the roughened hole 20 is located within the molding region 11.
By adopting the scheme, the roughened hole 20 can be processed more conveniently, and the consumption of hole copper in the subsequent copper plate deposition process can be reduced.
In some embodiments, during the process of processing the slot 30 in the forming region 11 of the substrate 10, when the aperture of the slot 30 is less than or equal to 6mm, the slot 30 is drilled in the forming region 11 of the substrate 10, i.e. the slot 30 is processed in the drilling process, and the type A drilling machine (drilling machine with better precision, CPK is greater than or equal to 1.67) is used for production, and the hole position precision Cpk is greater than or equal to 1.33.
When the aperture of the slot 30 is larger than 6mm, the slot 30 is milled in the forming area 11 of the substrate 10, i.e. the slot 30 is processed in the milling process, and precision control needs to be paid attention to during milling. Wherein, drilling process can be located behind the pressfitting process, and gong board process can be followed drilling process afterwards.
By adopting the scheme, the processing of the slotted hole 30 can be more convenient, quicker and more efficient aiming at the slotted holes 30 with different apertures.
In some embodiments, the roughened holes 20 are drilled in the substrate 10 using 0.20mm to 0.60mm diameter drill bits, such as 0.20mm, 0.25mm, 0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, and 0.60mm diameter drill bits.
By adopting the above scheme, the bonding force between the subsequent hole copper and the hole wall of the coarsening hole 20 positioned outside the forming area 11 due to the overlarge aperture of the coarsening hole 20 can be avoided to be poor, and the number of stacked plates and the drilling efficiency when the coarsening hole 20 is drilled due to the influence of the undersize aperture of the coarsening hole 20 can also be avoided.
In some embodiments, when the roughening hole 20 is drilled on the substrate 10, the maximum distance between the wall of the roughening hole 20 outside the molding region 11 and the molding boundary 111 is 0.025mm to 0.05mm, such as 0.025mm, 0.03mm, 0.035mm, 0.04mm, 0.045mm, 0.05mm, and the like.
By adopting the above scheme, it can be ensured that the subsequent hole copper and the hole wall of the roughening hole 20 located outside the forming area 11 have better bonding force, and the influence on the function and appearance of the slot 30 due to too much hole wall of the roughening hole 20 located outside the forming area 11 can be avoided.
In some embodiments, the depth of the roughened hole 20 is 50% to 100% of the depth of the slotted hole 30, such as 50%, 60%, 70%, 80%, 90%, or 100%.
By adopting the scheme, the subsequent hole copper and the hole wall of the coarsening hole 20 positioned outside the forming area 11 can be ensured to have better bonding force, the phenomenon of hole wall separation is avoided, meanwhile, the processing amount when the coarsening hole 20 is drilled can be reduced, and the processing efficiency is improved.
Referring to fig. 1 to 9, an embodiment of the present application provides a processing method for preventing separation of hole walls of a PCB, including the following steps:
first, a substrate 10 is provided, wherein the substrate 10 has a molding region 11, and the molding region 11 has a molding boundary 111.
Secondly, a plurality of coarsening holes 20 are drilled on the substrate 10 by a drill bit with the diameter of 0.20mm-0.60mm, the plurality of coarsening holes 20 are uniformly arranged along the forming boundary 111 at intervals, the coarsening holes 20 are round holes, the central axis of each coarsening hole 20 is positioned in the forming area 11, the hole walls of the coarsening holes 20 are intersected with the forming boundary 111, the distance between every two adjacent coarsening holes 20 is 0.20mm-0.60mm, and the maximum distance between the hole wall of each coarsening hole 20 positioned outside the forming area 11 and the forming boundary 111 is 0.025mm-0.05mm.
Then, the slot 30 is formed in the molding region 11 of the substrate 10, and the wall of the slot 30 overlaps the molding boundary 111.
Embodiments of the second aspect of the present application provide a PCB, which is manufactured by using the processing method for preventing the separation of the hole walls of the PCB according to the first aspect.
According to the PCB, the coarsening hole 20 with the hole wall intersected with the forming boundary 111 is drilled on the substrate 10 in the processing process, and the slotted hole 30 with the hole wall overlapped with the forming boundary 111 is processed in the forming area 11 of the substrate 10, so that the contact area between the hole copper of the finished PCB and the hole wall of the slotted hole 30 is large, the bonding force between the hole copper and the hole wall of the slotted hole 30 is high, the phenomenon of hole wall separation cannot occur after the hole copper and the slotted hole 30 are heated, and the quality is good.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A processing method for preventing the separation of the hole walls of a PCB is characterized by comprising the following steps:
providing a substrate, wherein the substrate is provided with a molding area, and the molding area is provided with a molding boundary;
drilling coarsening holes on the substrate, wherein the hole walls of the coarsening holes are intersected with the forming boundary, part of the hole walls of the coarsening holes are positioned in the forming area, and the rest of the hole walls of the coarsening holes are positioned outside the forming area;
and processing a slotted hole in the forming area of the substrate, wherein the hole wall of the slotted hole is superposed with the forming boundary.
2. The processing method for preventing the separation of the hole walls of the PCB board according to claim 1, wherein the step of drilling the roughened hole on the substrate comprises the following steps: and drilling a plurality of coarsening holes on the substrate, wherein the plurality of coarsening holes are arranged at intervals along the forming boundary.
3. The processing method for preventing PCB board hole walls from separating according to claim 2, wherein a plurality of the roughened holes are uniformly arranged at intervals along the molding boundary.
4. The processing method for preventing the separation of the hole wall of the PCB as claimed in claim 2, wherein the distance between two adjacent roughened holes is 0.20mm-0.60mm.
5. The processing method for preventing the separation of the hole walls of the PCB according to claim 1, wherein the roughened hole is a circular hole and the central axis of the roughened hole is located in the molding region.
6. The processing method for preventing the separation of the hole wall of the PCB board as claimed in claim 1, wherein in the process of processing the slot hole in the molding area of the substrate, when the aperture of the slot hole is less than or equal to 6mm, the slot hole is drilled in the molding area of the substrate; and when the aperture of the slotted hole is larger than 6mm, routing the slotted hole in the forming area of the substrate.
7. The processing method for preventing the separation of the hole wall of the PCB as claimed in any one of claims 1 to 6, wherein a drill with a diameter of 0.20mm-0.60mm is used when the roughened hole is drilled on the substrate.
8. The processing method for preventing the separation of the hole wall of the PCB board according to any one of claims 1 to 6, wherein when the roughened hole is drilled on the substrate, the maximum distance between the hole wall of the roughened hole outside the molding region and the molding boundary is 0.025mm-0.05mm.
9. The processing method for preventing the separation of the hole wall of the PCB according to any one of claims 1 to 6, wherein the depth of the roughened hole is 50-100% of the depth of the slotted hole.
10. A PCB board manufactured by the method of any one of claims 1 to 9 for preventing separation of the hole walls of the PCB board.
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| CN202111553525.4A CN114302562B (en) | 2021-12-17 | 2021-12-17 | Processing method for preventing separation of hole walls of PCB and PCB |
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| CN202111553525.4A CN114302562B (en) | 2021-12-17 | 2021-12-17 | Processing method for preventing separation of hole walls of PCB and PCB |
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| CN101887251A (en) * | 2009-05-11 | 2010-11-17 | 鸿富锦精密工业（深圳）有限公司 | Processing method of circuit board slotted hole |
| CN102427668A (en) * | 2011-11-14 | 2012-04-25 | 江苏同昌电路科技有限公司 | Technology of processing large hole with diameter of more than 5.0 mm on circuit board |
| CN106714460A (en) * | 2017-02-06 | 2017-05-24 | 吉安市满坤科技有限公司 | Method for manufacturing special-shaped slot hole in printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4134503B2 (en) * | 2000-10-11 | 2008-08-20 | 松下電器産業株式会社 | Method for manufacturing circuit-formed substrate |
| CN104427768B (en) * | 2013-08-29 | 2017-11-10 | 北大方正集团有限公司 | The circuit board that circuit board drilling method and this method make |
| CN106170177A (en) * | 2016-05-05 | 2016-11-30 | 浪潮电子信息产业股份有限公司 | A kind of big hole forming method of PCB |
| CN106132092A (en) * | 2016-06-30 | 2016-11-16 | 广州兴森快捷电路科技有限公司 | A kind of via-hole fabrication process of wiring board |
| CN213152457U (en) * | 2020-09-10 | 2021-05-07 | 广州源康精密电子股份有限公司 | FPC board with small slotted hole |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101887251A (en) * | 2009-05-11 | 2010-11-17 | 鸿富锦精密工业（深圳）有限公司 | Processing method of circuit board slotted hole |
| CN102427668A (en) * | 2011-11-14 | 2012-04-25 | 江苏同昌电路科技有限公司 | Technology of processing large hole with diameter of more than 5.0 mm on circuit board |
| CN106714460A (en) * | 2017-02-06 | 2017-05-24 | 吉安市满坤科技有限公司 | Method for manufacturing special-shaped slot hole in printed circuit board |
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