CN114286544A - Processing method of anti-interference printed circuit board of 5G base station signal amplifier - Google Patents

Abstract

The invention discloses a processing method of an anti-interference printed circuit board of a 5G base station signal amplifier, which relates to the technical field of printed circuit boards and is realized by a stacking correction seat, wherein the stacking correction seat comprises a base plate, a first through groove is formed in the center of the top of the base plate, lifting type positioning mechanisms are arranged on four sides of the top of the base plate, a triggering type driving mechanism is arranged on the outer side of each lifting type positioning mechanism, and a lower end limiting mechanism is arranged at the bottom of each lifting type positioning mechanism. The invention can effectively reduce the stacking difficulty of the core plates, simultaneously can ensure the stacking precision of the core plates, avoids the displacement of the core plates, simultaneously can not block the movable hot pressing plate and the fixed hot pressing plate in the core plate laminating process, and ensures the actual laminating effect.

Description

Processing method of anti-interference printed circuit board of 5G base station signal amplifier

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a method for processing an anti-interference 5G base station signal amplifier printed circuit board.

Background

With the advent of the 5G high-speed communication era, various types of high-frequency circuits, including high-frequency high-speed power amplifiers, need appropriate printed circuit board materials as a foundation, so that the demand of the 5G era for novel high-speed printed circuit boards is increasing, and under the application of various frequencies of the 5G, the material manufacturing process and the product yield of the circuit boards face new challenges.

The invention patent of patent application publication No. CN 110831355B discloses a method for preparing a 5G base station coupler printed circuit board, which is used for preparing an N-layer high-frequency HDI board for a millimeter wave power amplifier of a 5G base station, wherein N is an even number greater than 6, and the method comprises the following steps: l, L2 layer preparation: selecting a TG170 core board for manufacturing, only manufacturing an L2 layer of circuit, and reserving a copper surface on the L layer; the second step is that: production of L3 to L (N-2) layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment; the third step: l (N-1) and LN layer production: selecting a TG170 core board for manufacturing, only manufacturing an L (N-1) layer circuit, and reserving a copper surface on an LN layer; the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminator to integrally laminate the L1 to the LN layers; the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment. The invention has the advantages of strong lamination bonding force, less signal transmission loss, fine circuit and the like.

However, the preparation method still has some disadvantages after practical use by those skilled in the art, and it is obvious that the core plates are more in number, so that when the core plates are stacked, the core plates are difficult to align, and the stacked core plates need to be placed into a laminating machine for lamination subsequently, so that the core plates after being stacked are easy to shift in the process of being placed into the laminating machine, and further the product yield after the subsequent lamination is affected.

In view of the above situation, those skilled in the art think of setting a stacking correction seat for calibrating a core board when the core boards are stacked, but after practical use, it is found that the setting of the stacking correction seat can relatively and conveniently complete the alignment of the core boards, but when the core boards are subsequently laminated, the stacking correction seat cannot be taken down on the premise that the core boards are not affected, and the core boards cannot be directly contacted with a hot press plate of a laminating machine due to the blocking of the stacking correction seat without taking down the stacking correction seat for the practical laminating effect is not ideal.

Therefore, it is necessary to provide a method for processing an anti-interference printed circuit board of a 5G base station signal amplifier to solve the above problems.

Disclosure of Invention

The invention aims to provide a method for processing an anti-interference printed circuit board of a 5G base station signal amplifier, which aims to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: a processing method of an anti-interference printed circuit board of a 5G base station signal amplifier is realized by a stacking correction seat, the stacking correction seat comprises a base plate, a first through groove is formed in the center of the top of the base plate, lifting positioning mechanisms are arranged on four sides of the top of the base plate, a triggering type driving mechanism is arranged on the outer side of each lifting positioning mechanism, a lower end limiting mechanism is arranged at the bottom of each lifting positioning mechanism, when an inner positioning plate in each lifting positioning mechanism descends along a lifting sliding groove in each lifting positioning mechanism, a limiting slide block in each lifting positioning mechanism is driven to press down a lifting pressing plate in each triggering type driving mechanism, a push block in each triggering type driving mechanism pushes the triggering plate in each triggering type driving mechanism, and therefore a sliding cross rod in each lower end limiting mechanism drives a limiting block in each lower end limiting mechanism to enter a containing groove in each lower end limiting mechanism, thereby releasing the position limitation of the stacked core plates.

Preferably, the lifting positioning mechanism comprises an outer positioning plate, a lifting chute, a limiting chute, an inner positioning plate, a positioning rod, a first return spring and a limiting slide block.

Preferably, the outer locating plate slides and sets up in the bed plate top, the inboard top of outer locating plate is seted up to the lift spout, spacing spout is seted up on the lift spout inner wall, it is inboard that the lift spout is provided with to the inner locating plate along vertical direction slip, the locating lever slides along vertical direction and sets up in the inner locating plate inboard, first reset spring cup joints and sets up in the locating lever outside, spacing slider slides along vertical direction and sets up in spacing spout inboard and with inner locating plate fixed connection.

Preferably, the triggering type driving mechanism comprises a second through groove, a guide vertical rod, a second return spring, a pressure rising and reducing plate, a push block and a triggering plate.

Preferably, the second through groove is opened in outer locating plate outside top and is communicated with spacing spout, the direction montant is fixed to be set up in second through groove inboard, second reset spring cup joints and sets up in the direction montant outside, the pressure rising board slides along vertical direction and cup joints and sets up in the direction montant outside, the ejector pad is fixed to be set up in pressure rising board outer end, trigger the board and slide and set up in bed plate top and with the ejector pad laminating.

Preferably, the lower end limiting mechanism comprises a containing groove, a limiting block, a sliding cross rod and a third return spring.

Preferably, it is inboard to accomodate the groove and set up in outer locating plate bottom, the stopper slides along the horizontal direction and sets up in accomodating the inslot side, the slip horizontal pole run through outer locating plate and with outer locating plate sliding connection, slip horizontal pole inner and stopper fixed connection and slip horizontal pole outer end and trigger plate fixed connection, third reset spring cup joints and sets up in the slip horizontal pole outside, and its one end and outer locating plate fixed connection and the other end and trigger plate fixed connection.

Preferably, it still includes adjustment mechanism to pile up correction seat, adjustment mechanism is located the trigger formula actuating mechanism outside, adjustment mechanism includes mounting panel, traction lever, fourth reset spring, handle, fifth reset spring and extension rod.

Preferably, the mounting panel is fixed to be set up in the bed plate top, the traction lever run through the mounting panel and with mounting panel sliding connection along the horizontal direction, traction lever inner and outer locating plate fixed connection and traction lever outer end and handle fixed connection, fourth reset spring cup joints and sets up in the traction lever outside, and its one end passes through the bearing rotation with mounting panel fixed connection and the other end and handle and is connected, fifth reset spring sets up in the inboard bottom of handle, the extension rod slides along vertical direction and sets up in the handle inboard.

Preferably, the processing method specifically comprises the following steps:

s1, selecting a TG170 core board to manufacture L1 and L2 layers, selecting a ROGERS core board to manufacture L3-L (N-2) layers, and selecting the TG170 core board to manufacture L (N-1) and LN layers;

s2, performing pre-process treatment on the L3-L (N-2) layers, wherein the pre-process treatment comprises cutting, baking a plate, inner layer wet film, inner layer etching and inner detection;

s3, stacking the L3-L (N-2) layers, and placing the L3-L (N-2) layers on the inner sides of the four lifting positioning mechanisms at the top of the bottom seat plate, wherein the four limiting blocks block the L3 positioned at the lowest part, and the four outer positioning plates are matched with the four inner positioning plates to position the stacked L3-L (N-2) layers;

s4, placing a stacking correction seat bearing L3 to L (N-2) layers above a fixed-heat pressing plate in a laminating machine, starting the laminating machine, vacuumizing the interior of the laminating machine after the laminating machine is started, simultaneously lowering the movable-heat pressing plate, pushing an inner positioning plate by the movable-heat pressing plate along with continuous lowering of the movable-heat pressing plate, lowering the inner positioning plate along a lifting chute, pushing a lifting pressing plate by a limit slide block connected with the inner positioning plate when the lowering distance of the inner positioning plate reaches a first threshold value, so that the lifting pressing plate is lowered synchronously, pushing a trigger plate by a push block in the lowering process of the lifting pressing plate, further pulling a sliding cross rod by the trigger plate, further retracting a limit block towards the interior of a containing groove, retracting the limit block into the containing groove when the lowering distance of the inner positioning plate reaches a second threshold value, and further removing the limit to the L3 layer, with the continuous descending of the movable hot pressing plate, the movable hot pressing plate presses the top of the L (N-2) layer, and pushes the stacked L3-L (N-2) downwards to enter the inner side of the first through groove until the bottom of the L3 is in contact with the fixed hot pressing plate positioned below the base plate, and then hot pressing starts;

s5, after lamination is completed, the stacking correction seat is taken out of the laminating machine, then the L3 to L (N-2) layer after lamination is completed is pushed from the upper part, so that the layer slides out of the inner side of the first through groove, after the stacking correction seat is taken out, the inner positioning plate is driven to reset by the first reset spring due to the fact that the inner positioning plate loses pressure, meanwhile, the lifting pressing plate is driven to reset by the second reset spring, after the L3 to L (N-2) layer after lamination is completed is taken out, the stop block is lost, and the trigger plate and the stop block reset synchronously under the pulling of the third reset spring;

s6, carrying out edge milling treatment on the L3 to L (N-2) layers after lamination;

s7, stacking the L1 layer and the L2 layer, the laminated L3-L (N-2) layer and the laminated L (N-1) layer and LN layer in sequence, putting the stacked layers into a stacking correction seat, and repeating the operations for the second lamination treatment to integrally press the L1-LN layers together;

s8, carrying out edge milling, plate baking, drilling, metal edge-wrapping treatment and post-process treatment on L1 to LN after lamination is finished, wherein the post-process treatment comprises the steps of milling an inner groove before copper deposition, copper deposition plate electricity, outer layer dry film, pattern electricity, milling a half groove, film stripping and etching.

The invention has the technical effects and advantages that:

the invention is provided with the stacking correction seat, so that when the lamination of L3 to L (N-2) layer and the lamination of L1 to LN layer are carried out, the L3 to L (N-2) layer and the L1 to LN layer can be placed at the inner sides of four lifting positioning mechanisms at the top of the base plate, then the four lifting positioning mechanisms are used for positioning the L3 to L (N-2) layer and the L1 to LN layer, meanwhile, during the subsequent lamination operation, the movable hot press plate can be used for driving the inner positioning plate in the lifting positioning mechanism to descend, further, on the premise of keeping the positioning, the blockage of the movable hot press plate is avoided, in addition, after the limitation of the lower end limiting mechanism to L3 and L1 is relieved by the lifting positioning mechanism and the trigger type driving mechanism, the stacked core plate can be directly contacted with the movable hot press plate and the fixed hot press plate, compared with the same type device or method in the prior art, the invention can effectively reduce the stacking difficulty of the core plates, simultaneously can ensure the stacking precision of the core plates, avoids the displacement of the core plates, simultaneously can not block the movable hot pressing plate and the fixed hot pressing plate in the core plate laminating process, and ensures the actual laminating effect.

Drawings

FIG. 1 is a schematic diagram of the overall formal structure of the present invention.

Fig. 2 is a partial front sectional structural schematic view of the present invention.

Fig. 3 is a schematic front sectional structural view of the lifting positioning mechanism, the trigger type driving mechanism and the lower end limiting mechanism of the present invention.

Fig. 4 is a schematic perspective view of the trigger plate of the present invention.

Fig. 5 is a front sectional structural schematic view of the adjusting mechanism of the present invention.

In the figure: 1. a base plate; 2. a first through groove; 3. a lifting positioning mechanism; 31. an outer positioning plate; 32. a lifting chute; 33. a limiting chute; 34. an inner positioning plate; 35. positioning a rod; 36. a first return spring; 37. a limiting slide block; 4. a trigger-type drive mechanism; 41. a second through groove; 42. a guide vertical rod; 43. a second return spring; 44. a voltage rising and falling plate; 45. a push block; 46. a trigger plate; 5. a lower end limiting mechanism; 51. a receiving groove; 52. a limiting block; 53. a sliding rail; 54. a third return spring; 6. an adjustment mechanism; 61. mounting a plate; 62. a draw bar; 63. a fourth return spring; 64. a handle; 65. a fifth return spring; 66. an extension rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

The invention provides a processing method of an anti-interference printed circuit board of a 5G base station signal amplifier, which is shown in figures 1-4 and is realized by a stacking correction seat, wherein the stacking correction seat comprises a base plate 1, a first through groove 2 is arranged at the center of the top of the base plate 1, lifting positioning mechanisms 3 are respectively arranged on four sides of the top of the base plate 1, a trigger type driving mechanism 4 is arranged on the outer side of each lifting positioning mechanism 3, a lower end limiting mechanism 5 is arranged at the bottom of each lifting positioning mechanism 3, when an inner positioning plate 34 in each lifting positioning mechanism 3 descends along a lifting sliding groove 32 in each lifting positioning mechanism 3, a limiting slide block 37 in each lifting positioning mechanism 3 is driven to press a lifting pressure plate 44 in each trigger type driving mechanism 4, and a push block 45 in each trigger type driving mechanism 4 pushes a trigger plate 46 in each trigger type driving mechanism 4, and then the sliding cross bar 53 in the lower end limiting mechanism 5 drives the limiting block 52 in the lower end limiting mechanism 5 to enter the accommodating groove 51 in the lower end limiting mechanism 5, so that the limitation on the stacked core plates is released.

As shown in fig. 3, the lifting positioning mechanism 3 includes an outer positioning plate 31, a lifting chute 32, a limiting chute 33, an inner positioning plate 34, a positioning rod 35, a first return spring 36 and a limiting slider 37.

More specifically, the outer positioning plate 31 is slidably disposed at the top of the base plate 1, the lifting chute 32 is disposed at the top of the inner side of the outer positioning plate 31, the limiting chute 33 is disposed on the inner wall of the lifting chute 32, the inner positioning plate 34 is slidably disposed at the inner side of the lifting chute 32 along the vertical direction, the positioning rod 35 is slidably disposed at the inner side of the inner positioning plate 34 along the vertical direction, the first reset spring 36 is sleeved on the outer side of the positioning rod 35, the limiting slide block 37 is slidably disposed at the inner side of the limiting chute 33 and fixedly connected with the inner positioning plate 34 along the vertical direction, so that when the core plate is disposed at the inner side of the four lifting positioning mechanisms 3, the outer positioning plate 31 and the inner positioning plate 34 in the lifting positioning mechanisms 3 can be used for positioning the core plate by the edge of the core plate.

As shown in fig. 3 and 4, the trigger type driving mechanism 4 includes a second through slot 41, a vertical guiding rod 42, a second return spring 43, a lifting pressure plate 44, a pushing block 45, and a trigger plate 46.

More specifically, the second leads to groove 41 and sets up in outer locating plate 31 outside top and communicates with spacing spout 33, direction montant 42 is fixed to be set up in second through groove 41 inboardly, second reset spring 43 cup joints and sets up in the direction montant 42 outside, lift clamp plate 44 slides along vertical direction and cup joints and set up in the direction montant 42 outside, ejector pad 45 is fixed to be set up in lift clamp plate 44 outer end, trigger plate 46 slides and sets up in 1 top of bed plate and laminates with ejector pad 45 to when lift clamp plate 44 is pushed down, can promote trigger plate 46 through ejector pad 45, and then make trigger plate 46 to the direction removal of keeping away from outer locating plate 31.

As shown in fig. 3, the lower-end limiting mechanism 5 includes a receiving groove 51, a limiting block 52, a sliding cross bar 53, and a third return spring 54.

More specifically, it sets up in outer locating plate 31 bottom inboard to accomodate groove 51, stopper 52 slides along the horizontal direction and sets up in accomodating groove 51 inboardly, slip horizontal pole 53 run through outer locating plate 31 and with outer locating plate 31 sliding connection, slip horizontal pole 53 inner and stopper 52 fixed connection and slip horizontal pole 53 outer end and trigger plate 46 fixed connection, third reset spring 54 cup joints and sets up in the slip horizontal pole 53 outside, and its one end and outer locating plate 31 fixed connection and the other end and trigger plate 46 fixed connection to when slip horizontal pole 53 is dragged, can drive stopper 52 and get into and accomodate inside groove 51, and then relieve the spacing to the core.

Example 2

The processing method specifically comprises the following steps:

s1, selecting a TG170 core board to manufacture L1 and L2 layers, selecting a ROGERS core board to manufacture L3-L (N-2) layers, and selecting the TG170 core board to manufacture L (N-1) and LN layers;

s2, performing pre-process treatment on the L3-L (N-2) layers, wherein the pre-process treatment comprises cutting, baking a plate, inner layer wet film, inner layer etching and inner detection;

s3, stacking the L3 to L (N-2) layers, and placing the stacked L3 to L (N-2) layers inside four lifting positioning mechanisms 3 at the top of the base plate 1, wherein the four limiting blocks 52 block the L3 positioned at the lowest part, and the four outer positioning plates 31 cooperate with the four inner positioning plates 34 to position the stacked L3 to L (N-2) layers;

s4, placing a stacking correction seat bearing L3 to L (N-2) layers above a fixed-heat pressing plate in a laminating machine, starting the laminating machine, vacuumizing the interior of the laminating machine after the laminating machine is started, simultaneously, lowering the movable-heat pressing plate, pushing the inner positioning plate 34 by the movable-heat pressing plate along with the continuous lowering of the movable-heat pressing plate, lowering the inner positioning plate 34 along the lifting chute 32, pushing the lifting pressing plate 44 by a limit slide block 37 connected with the inner positioning plate 34 when the lowering distance of the inner positioning plate 34 reaches a first threshold value, so that the lifting pressing plate 44 is lowered synchronously, pushing the trigger plate 46 by a push block 45 in the lowering process of the lifting pressing plate 44, further pulling the sliding cross bar 53 by the trigger plate 46, so that the limit block 52 retracts towards the interior of the accommodating groove 51, when the lowering distance of the inner positioning plate 34 reaches a second threshold value, then the limit block 52 retracts into the accommodating groove 51, further releasing the limit of the L3 layer, pressing the movable hot pressing plate on the top of the L (N-2) layer along with the continuous descending of the movable hot pressing plate, pushing the L3 to the L (N-2) which are stacked downwards to enable the movable hot pressing plate to enter the inner side of the first through groove 2 until the bottom of the L3 is in contact with a constant-temperature hot pressing plate located below the base plate 1, and then starting hot pressing;

s5, after lamination is completed, the stacking correction seat is taken out of the laminating machine, then the L3 to L (N-2) layer after lamination is pushed from the upper part, so that the layer slides out from the inner side of the first through groove 2, after the stacking correction seat is taken out, the inner positioning plate 34 is driven to reset by the first reset spring 36 due to the fact that the inner positioning plate 34 loses pressure, meanwhile, the pressure rising and dropping plate 44 is driven to reset by the second reset spring 43, after the L3 to L (N-2) layer after lamination is taken out, the limiting block 52 loses blocking, and the trigger plate 46 and the limiting block 52 reset synchronously under the pulling of the third reset spring 54;

s6, carrying out edge milling treatment on the L3 to L (N-2) layers after lamination;

s7, stacking the L1 layer and the L2 layer, the laminated L3-L (N-2) layer and the laminated L (N-1) layer and LN layer in sequence, putting the stacked layers into a stacking correction seat, and repeating the operations for the second lamination treatment to integrally press the L1-LN layers together;

s8, carrying out edge milling, plate baking, drilling, metal edge-wrapping treatment and post-process treatment on L1 to LN after lamination is finished, wherein the post-process treatment comprises the steps of milling an inner groove before copper deposition, copper deposition plate electricity, outer layer dry film, pattern electricity, milling a half groove, film stripping and etching.

Example 3

Unlike the above embodiment, as shown in fig. 2 and 5, the stack correction base further includes an adjusting mechanism 6, the adjusting mechanism 6 is located outside the trigger type driving mechanism 4, and the adjusting mechanism 6 includes a mounting plate 61, a traction rod 62, a fourth return spring 63, a handle 64, a fifth return spring 65, and an extension rod 66.

More specifically, mounting panel 61 is fixed to be set up in 1 top of bed plate, draw bar 62 runs through mounting panel 61 and with mounting panel 61 sliding connection along the horizontal direction, draw bar 62 the inner and 31 fixed connection of outer locating plate and draw bar 62 outer end pass through the bearing rotation with handle 64 and be connected, fourth reset spring 63 cup joints and sets up in the draw bar 62 outside, and its one end and mounting panel 61 fixed connection and the other end and handle 64 fixed connection, fifth reset spring 65 sets up in the inboard bottom of handle 64, extension rod 66 slides along vertical direction and sets up in that handle 64 is inboard.

More specifically, by adopting the above structure, when the core plate is placed and taken out, since the clearance between the core plate and the lifting type positioning mechanism 3 is extremely small, in order to further facilitate the placement and the taking out of the core plate, a technician can pull the handle 64, further pull the outer positioning plate 31 through the draw bar 62 by the handle 64, further move the outer positioning plate 31 outwards, and further increase the distance between the lifting type positioning mechanism 3 and the core plate on the premise of ensuring that the core plate can still be blocked by the limiting block 52;

accomplish pulling of handle 64 simultaneously and drag the back, can rotate handle 64, and then make extension rod 66 be located handle 64 and issue to in with handle 64 unclamp the back, fourth reset spring 63 pulls back handle 64, extension rod 66 then can't reset owing to being blockked by bed plate 1 edge, and then makes things convenient for the follow-up core board of placing of technical staff.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (10)

1. A processing method of an anti-interference printed circuit board of a 5G base station signal amplifier is characterized by comprising the following steps: the processing method is realized through a stacking correction seat, the stacking correction seat comprises a base plate (1), a first through groove (2) is formed in the center of the top of the base plate (1), lifting positioning mechanisms (3) are arranged on four sides of the top of the base plate (1), a triggering type driving mechanism (4) is arranged on the outer side of each lifting positioning mechanism (3), a lower end limiting mechanism (5) is arranged at the bottom of each lifting positioning mechanism (3), when an inner positioning plate (34) in each lifting positioning mechanism (3) descends along a lifting sliding groove (32) in each lifting positioning mechanism (3), a limiting sliding block (37) in each lifting positioning mechanism (3) is driven to press a lifting pressure plate (44) in each triggering type driving mechanism (4), and a pushing block (45) in each triggering type driving mechanism (4) pushes a triggering plate (46) in each triggering type driving mechanism (4), and then the sliding cross rod (53) in the lower end limiting mechanism (5) drives the limiting block (52) in the lower end limiting mechanism (5) to enter the accommodating groove (51) in the lower end limiting mechanism (5), so that the limitation on the stacked core plates is released.

2. The method for processing the anti-interference printed circuit board of the 5G base station signal amplifier according to claim 2, wherein the method comprises the following steps: the lifting type positioning mechanism (3) comprises an outer positioning plate (31), a lifting chute (32), a limiting chute (33), an inner positioning plate (34), a positioning rod (35), a first return spring (36) and a limiting slide block (37).

3. The method for processing the anti-interference printed circuit board of the 5G base station signal amplifier according to claim 2, wherein the method comprises the following steps: outer locating plate (31) slide and set up in bed plate (1) top, outer locating plate (31) inboard top is seted up in lift spout (32), spacing spout (33) are seted up on lift spout (32) inner wall, interior locating plate (34) slide along vertical direction and are provided with lift spout (32) inboard, locating lever (35) slide along vertical direction and set up in interior locating plate (34) inboard, first reset spring (36) cup joint and set up in locating lever (35) outside, spacing slider (37) slide along vertical direction set up in spacing spout (33) inboard and with interior locating plate (34) fixed connection.

4. The method for processing the anti-interference printed circuit board of the 5G base station signal amplifier according to claim 3, wherein the method comprises the following steps: the trigger type driving mechanism (4) comprises a second through groove (41), a guide vertical rod (42), a second return spring (43), a lifting pressing plate (44), a pushing block (45) and a trigger plate (46).

5. The method for processing the anti-interference printed circuit board of the 5G base station signal amplifier according to claim 4, wherein the method comprises the following steps: the second leads to groove (41) and sets up in outer locating plate (31) outside top and communicates with spacing spout (33), direction montant (42) are fixed to be set up in the second and lead to groove (41) inboardly, second reset spring (43) cup joint and set up in the direction montant (42) outside, rise step-down plate (44) slide along vertical direction and cup joint and set up in the direction montant (42) outside, ejector pad (45) are fixed to be set up in rise step-down plate (44) outer end, trigger plate (46) slide set up in bed plate (1) top and laminate with ejector pad (45).

6. The method for processing the anti-interference printed circuit board of the 5G base station signal amplifier according to claim 5, wherein the method comprises the following steps: the lower end limiting mechanism (5) comprises a containing groove (51), a limiting block (52), a sliding cross rod (53) and a third return spring (54).

7. The method for processing the anti-interference printed circuit board of the 5G base station signal amplifier according to claim 6, wherein the method comprises the following steps: accomodate groove (51) and set up in outer locating plate (31) bottom inboard, stopper (52) slide along the horizontal direction and set up in accomodating groove (51) inboardly, slip horizontal pole (53) run through outer locating plate (31) and with outer locating plate (31) sliding connection, slip horizontal pole (53) inner and stopper (52) fixed connection and slip horizontal pole (53) outer end and trigger plate (46) fixed connection, third reset spring (54) cup joint and set up in the slip horizontal pole (53) outside, and its one end and outer locating plate (31) fixed connection and the other end and trigger plate (46) fixed connection.

8. The method for processing the anti-interference printed circuit board of the 5G base station signal amplifier according to claim 7, wherein the method comprises the following steps: the stacking correction seat further comprises an adjusting mechanism (6), the adjusting mechanism (6) is located on the outer side of the trigger type driving mechanism (4), and the adjusting mechanism (6) comprises a mounting plate (61), a traction rod (62), a fourth reset spring (63), a handle (64), a fifth reset spring (65) and an extension rod (66).

9. The method for processing the anti-interference printed circuit board of the 5G base station signal amplifier according to claim 8, wherein the method comprises the following steps: mounting panel (61) are fixed to be set up in bed plate (1) top, traction lever (62) run through mounting panel (61) and with mounting panel (61) sliding connection along the horizontal direction, traction lever (62) the inner with outer locating plate (31) fixed connection and traction lever (62) outer end and handle (64) fixed connection, fourth reset spring (63) cup joint and set up in traction lever (62) the outside, and its one end passes through the bearing rotation with mounting panel (61) fixed connection and the other end and handle (64) and is connected, fifth reset spring (65) set up in handle (64) inboard bottom, extension rod (66) slide along vertical direction and set up in handle (64) inboardly.

10. The method for processing the printed circuit board of the anti-interference 5G base station signal amplifier according to any one of claims 1 to 9, characterized by comprising the following steps:

s1, selecting a TG170 core board to manufacture L1 and L2 layers, selecting a ROGERS core board to manufacture L3-L (N-2) layers, and selecting the TG170 core board to manufacture L (N-1) and LN layers;

s2, performing pre-process treatment on the L3-L (N-2) layers, wherein the pre-process treatment comprises cutting, baking a plate, inner layer wet film, inner layer etching and inner detection;

s3, stacking the L3-L (N-2) layers, and placing the L3-L (N-2) layers on the inner sides of four lifting positioning mechanisms (3) at the top of the bottom seat plate (1), wherein the four limiting blocks (52) block the L3 positioned at the lowest part, and the four outer positioning plates (31) are matched with the four inner positioning plates (34) to position the stacked L3-L (N-2) layers;

s4, a stacking correction seat bearing L3 to L (N-2) layers is placed above a fixed-heat pressing plate in a laminating machine, then the laminating machine is started, after the laminating machine is started, the interior starts to be vacuumized, meanwhile, the movable-heat pressing plate starts to descend, along with the continuous descending of the movable-heat pressing plate, the movable-heat pressing plate firstly pushes an inner positioning plate (34), the inner positioning plate (34) starts to descend along a lifting sliding groove (32), when the descending distance of the inner positioning plate (34) reaches a first threshold value, a limiting sliding block (37) connected with the inner positioning plate pushes a lifting pressure plate (44), so that the lifting pressure plate (44) synchronously descends, in the descending process of the lifting pressure plate (44), a trigger plate (46) is pushed through a pushing block (45), and the trigger plate (46) further pulls a sliding cross rod (53), so that a limiting block (52) retracts towards the interior of a containing groove (51), when the descending distance of the inner positioning plate (34) reaches a second threshold value, the limiting block (52) retracts into the containing groove (51) at the moment, the limiting on the L3 layer is relieved, the movable hot pressing plate is pressed on the top of the L (N-2) layer along with the continuous descending of the movable hot pressing plate, the L3 to the L (N-2) which are arranged in a stacked mode are pushed downwards to enter the inner side of the first through groove (2) until the bottom of the L3 is in contact with the fixed hot pressing plate located below the base plate (1), and then hot pressing starts;

s5, after lamination is completed, the stacking correction seat is taken out of the laminating machine, then the L3 to L (N-2) layers after lamination are pushed from the upper side, the layers slide out from the inner side of the first through groove (2), after the stacking correction seat is taken out, the inner positioning plate (34) loses pressure, the first return spring (36) drives the inner positioning plate (34) to reset, meanwhile, the second return spring (43) drives the pressure rising and dropping plate (44) to reset, when the L3 to L (N-2) layers after lamination are taken out, the limiting block (52) loses blocking, and the trigger plate (46) and the limiting block (52) synchronously reset under the pulling of the third return spring (54);

s6, carrying out edge milling treatment on the L3 to L (N-2) layers after lamination;

s7, stacking the L1 layer and the L2 layer, the laminated L3-L (N-2) layer and the laminated L (N-1) layer and LN layer in sequence, putting the stacked layers into a stacking correction seat, and repeating the operations for the second lamination treatment to integrally press the L1-LN layers together;

s8, carrying out edge milling, plate baking, drilling, metal edge-wrapping treatment and post-process treatment on L1 to LN after lamination is finished, wherein the post-process treatment comprises the steps of milling an inner groove before copper deposition, copper deposition plate electricity, outer layer dry film, pattern electricity, milling a half groove, film stripping and etching.

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