CN112786519A - Green ceramic lamination device and method - Google Patents
Green ceramic lamination device and method Download PDFInfo
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- CN112786519A CN112786519A CN202110042525.1A CN202110042525A CN112786519A CN 112786519 A CN112786519 A CN 112786519A CN 202110042525 A CN202110042525 A CN 202110042525A CN 112786519 A CN112786519 A CN 112786519A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 94
- 238000003475 lamination Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 24
- 238000005507 spraying Methods 0.000 claims abstract description 23
- 229920006267 polyester film Polymers 0.000 claims abstract description 12
- 229910052573 porcelain Inorganic materials 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000004575 stone Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 238000011112 process operation Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 101150038956 cup-4 gene Proteins 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention discloses a green ceramic lamination device and a method, the method comprises the steps of placing green ceramic chips with positioning holes at four corners on a bearing table with positioning pins at four corners, adsorbing the green ceramic chips on the bearing table by adopting vacuum for demolding, then placing the demolded green ceramic chips on a collecting table with positioning pins at four corners by adopting a vacuum chuck, and spraying adhesive glue by utilizing the chuck for lamination. When the polyester film is removed by laminating, in order to ensure that the green ceramic chip is not damaged, the vacuum adsorption is utilized during film uncovering to firmly adsorb the green ceramic chip on the chip bearing platform, so that the front and back of the green ceramic chip are uniformly stressed, and the purposes of no deformation and no damage of the green ceramic chip are achieved.
Description
Technical Field
The invention relates to a green ceramic lamination device and method, and belongs to the technical field of lamination.
Background
LTCC (low temperature co-fired ceramic) circuits have the remarkable characteristics of high three-dimensional wiring density, embeddable integrated elements, good high-frequency transmission performance, strong environmental adaptability, high long-term reliability and the like, and become typical advanced circuits of modern microelectronic components. In the production process of the LTCC substrate, the lamination process is a non-reworkable process, and the precision of the lamination process directly influences subsequent assembly, the high-frequency performance of a circuit, the microwave transmission performance and the like.
At present, the common lamination methods mainly include:
1. the lamination machine is used for loading, vacuum sucking, film uncovering, automatic alignment, conveying, laminating, hot pressing (or glue spraying) and repeated circulation. The disadvantages are as follows: for the green porcelain with multiple cavities, the green ceramic chip is easy to fall off from the sucking disc when the film is uncovered, so that the green ceramic chip is damaged.
2. Manual lamination of a lamination table: and sleeving the green ceramic chip by using a positioning pin of the laminating table, uncovering the film, gluing and repeatedly circulating. The disadvantages are as follows: when the film is uncovered, the raw porcelain can be stretched, so that the raw porcelain piece is easy to deform; the film of the green ceramic chip with the multi-cavity and the special-shaped cavity can not be uncovered; the lamination precision is lower.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a green ceramic lamination device and a green ceramic lamination method for an LTCC substrate manufacturing process with a cavity.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the invention provides a green porcelain lamination device, comprising:
a tile bearing platform used for placing the green ceramic tiles and demoulding the green ceramic tiles,
a chip conveying sucker for conveying the demolded green ceramic chips to a collecting table and spraying bonding glue to the green ceramic chips,
and a collection station for the laminations;
the sheet conveying sucker is positioned between the sheet bearing platform and the collecting platform;
the four corners of the chip bearing table are respectively provided with a first positioning pin, and the first positioning pins correspond to the positioning holes at the four corners of the green ceramic chip one by one;
the four corners of the tile conveying sucker are respectively provided with a positioning hole, and the positioning holes correspond to the positioning holes at the four corners of the green tiles one by one;
glue spraying holes are formed in the periphery of the sheet conveying sucker and used for spraying bonding glue;
and four corners of the collecting table are respectively provided with a second positioning pin, and the second positioning pins correspond to the positioning holes at the four corners of the green ceramic chip one by one.
Further, the wafer bearing table is a porous stone table surface.
Furthermore, the glue spraying holes are formed between the positioning holes in the sheet conveying sucker, and 3 glue spraying holes are formed between every two positioning holes.
Furthermore, the sheet conveying sucker is a vacuum sucker.
Further, the sheet conveying suction cups are provided with vertical guide rails and horizontal guide rails.
Furthermore, a foot switch is arranged at the bottom of the device and used for starting the vacuum of the wafer bearing platform.
Furthermore, a button switch is arranged on the table surface of the device and used for controlling the sheet conveying sucker to move along the guide rail.
The invention also provides a green ceramic lamination method, which comprises the following steps:
a. placing the piece bearing paper printed with the cavity pattern of the green ceramic chip on a piece bearing table, and sleeving the positioning holes of the piece bearing paper on the first positioning pins in a one-to-one correspondence manner;
b. opening a foot switch, placing the top layer green ceramic sheets with the positioning holes at the four corners on the sheet bearing paper printed with the cavity patterns on the sheet bearing platform, and sleeving the positioning holes on the first positioning pins in a one-to-one correspondence manner; the polyester film of the top green ceramic chip faces upwards; after the pedal switch is turned on, the sheet bearing paper and the green ceramic sheets are firmly sucked on the sheet bearing platform together;
c. sticking one corner of the polyester film on the green porcelain sheet by using a sticky roller, pressing and rolling to uncover the polyester film;
d. pressing a starting button of the tile conveying sucker to convey the green tiles to a collecting platform;
e. controlling the sheet conveying sucker to rise to a certain distance from the collecting table, starting the electromagnetic valve, spraying the bonding glue through the glue spraying hole of the sheet conveying sucker, and spraying the bonding glue on the raw porcelain sheets;
f. b, replacing the sheet bearing paper printed with the cavity pattern of the next layer of green ceramic sheet, sleeving the sheet bearing paper on the sheet bearing table, and placing the next layer of green ceramic sheet on the sheet bearing table by adopting the method in the step b;
g. repeating the steps c-f until the stacking of the penultimate layer of green ceramic chips is finished;
h. repeating the steps c to d to complete the stacking of the last layer of green ceramic chips;
i. taking down the raw porcelain blank together with the collecting table for subsequent process operation.
Further, the step of transporting the green ceramic chips to a collection table specifically comprises:
the tile conveying sucker moves above the tile bearing table, descends and presses the raw tiles on the tile bearing table;
opening the vacuum of the sheet conveying sucker and closing the vacuum of the sheet bearing platform at the same time;
the tile conveying sucker sucks the green tiles, then the green tiles ascend and move to the upper part of the collecting table;
and the sheet conveying sucker descends and presses the sheet conveying sucker onto the collecting platform, the vacuum of the sheet conveying sucker is closed, the pressure is opened, and the positioning holes at the four corners of the green ceramic sheets are sleeved on the four second positioning pins.
Further, the method also comprises the following steps:
cutting the piece bearing paper in advance, cutting the piece bearing paper into the same size as the raw ceramic chip, punching a positioning hole on the piece bearing paper, and printing a cavity pattern consistent with the raw ceramic chip on the piece bearing paper by using glass glaze slurry;
the positioning holes correspond to the first positioning pins on the wafer bearing table one by one.
The invention achieves the following beneficial effects:
aiming at the existing raw ceramic chip with multiple cavities and special-shaped cavities (non-circular or rectangular), when the polyester film is removed by lamination, in order to ensure that the raw ceramic chip is not damaged, the vacuum adsorption is utilized during film uncovering, and the raw ceramic chip is firmly adsorbed on the chip bearing platform, so that the front and back stress of the raw ceramic chip is uniform, and the purposes of no deformation and no damage of the raw ceramic chip are achieved.
Drawings
FIG. 1 is a structural diagram of a high-precision green ceramic lamination device according to the present invention;
FIG. 2 is a schematic view of a wafer conveying chuck in the high-precision green ceramic lamination device according to the present invention;
FIG. 3 is a topographical map of the alignment condition after lamination using the method of the present invention.
Detailed Description
The invention is further described below. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
The invention provides a high-precision green ceramic lamination device, which comprises a wafer bearing table 1, a wafer conveying suction cup 4 and a collecting table 7, and is shown in figure 1. The sheet conveying suction cups 4 are positioned between the sheet bearing platform 1 and the collecting platform 7.
In particular, the method comprises the following steps of,
the four corners of the tile bearing table 1 are respectively provided with a first positioning pin 3, and the first positioning pins correspond to the positioning holes at the four corners of the green ceramic tiles one by one.
In the embodiment of the invention, the wafer bearing platform is a porous stone table surface.
Referring to fig. 2, the four corners of the tile conveying sucker 4 are respectively provided with a positioning hole 8, and the positioning holes correspond to the positioning holes at the four corners of the green tiles one by one.
The sheet conveying suction cup 4 is provided with a sheet suction area 10 in the center.
Glue spraying holes 9 are formed in the periphery of the sheet conveying sucker 4 and used for spraying bonding glue to the green porcelain sheets.
In the embodiment of the invention, the glue spraying holes are arranged between the positioning holes on the sheet conveying sucker, and 3 glue spraying holes are respectively arranged between every two positioning holes.
In the embodiment of the invention, the sheet conveying sucker is a vacuum sucker.
Referring to fig. 1, four corners of the sheet conveying suction cups are fixed on vertical guide rails 5 to realize up-and-down movement.
The sheet conveying sucker is also fixed on the horizontal guide rail to realize horizontal movement.
And four corners of the collecting table 7 are respectively provided with a second positioning pin 6, and the second positioning pins correspond to the positioning holes at the four corners of the green ceramic chip one by one.
Furthermore, a foot switch is arranged at the bottom of the device and used for starting the vacuum of the wafer bearing platform.
Further, a button switch 2 is arranged on the device table surface and used for controlling the sheet conveying sucker to move along the guide rail.
The invention provides a high-precision green ceramic lamination method, which utilizes a positioning pin for positioning and whole-process vacuum adsorption to inhibit shrinkage for lamination, and specifically comprises the following steps:
a. early preparation work: cutting A4 paper into ceramic sheets with the same size, punching positioning holes on the paper, and printing a cavity pattern with glass glaze slurry. Circuits with stepped cavities require multiple sheets of paper to print the corresponding cavity pattern. Wherein, the positioning holes correspond to the positioning pins on the porous stone table surface.
b. Placing the A4 paper printed with the cavity patterns on a bearing table, and ensuring that the positioning holes of the paper are sleeved on the positioning pins in a one-to-one correspondence manner;
c. opening a foot switch, placing the top layer green ceramic sheets with positioning holes at four corners on A4 paper printed with cavity patterns on a sheet bearing table, enabling polyester films of the top layer green ceramic sheets to face upwards, and ensuring that the positioning holes are sleeved on the positioning pins in a one-to-one correspondence manner; at the moment, the paper and the green ceramic sheets are firmly sucked on the sheet bearing platform together;
d. sticking one corner of the polyester film on the green porcelain sheet by using a sticky roller, pressing and rolling to uncover the polyester film;
e. pressing a start button, transporting the green ceramic chips to a collecting platform by the chip transporting sucker, and specifically acting as follows:
the sheet conveying sucker moves above the sheet bearing table, slowly descends and presses the raw ceramic sheets on the sheet bearing table, the sucker is opened in vacuum, meanwhile, the vacuum of the sheet bearing table is closed, the sucker sucks the raw ceramic sheets, the raw ceramic sheets ascend and move above the collecting table, the raw ceramic sheets descend and are pressed on the collecting table (a metal tray is placed on the collecting table in advance), the vacuum of the sucker is closed, the sucking disc is opened and the raw ceramic sheets are pressed, accurately placed on the collecting table and sleeved on the four positioning pins (the process is controlled by the PLC of the device);
f. the sucking disc rises to a certain distance from the collecting table, the electromagnetic valve is opened, and the bonding glue is sprayed out of the glue spraying hole on the sucking disc and is sprayed on the raw porcelain sheet;
g. taking off the paper on the bearing platform, and covering the A4 paper printed with the next layer of cavity pattern on the bearing platform; c, placing the next layer of green ceramic chip on a chip bearing platform in the step c;
if the cavity pattern of the second layer of green ceramic tiles is consistent with the cavity pattern of the top layer, the A4 paper can be not replaced;
if the layer of green ceramic chips have no cavity, the A4 paper is not needed;
h. repeating the steps d to g until the stacking of the penultimate layer of green ceramic chips is finished;
i. repeating d-e to complete the stacking of the last layer of green ceramic chips;
j. taking down the raw porcelain blank together with the collecting table for subsequent process operation.
Fig. 3 is a topographic map of the alignment condition after lamination by the device and method of the present invention, and it is obvious that the interlayer alignment precision of the lamination method of the present invention is much improved compared with the conventional method, and compared with the conventional method, the lamination method of the present invention has significant advantages: when the polyester film is removed from the laminated sheet, in order to ensure that the green ceramic sheet is not damaged, the vacuum adsorption is utilized during film uncovering, and the green ceramic sheet is firmly adsorbed on the sheet bearing platform, so that the front and back stress of the green ceramic sheet is uniform, and the purposes of no deformation and no damage of the green ceramic sheet are achieved.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A green ceramic lamination assembly, comprising:
a chip bearing platform used for placing the green ceramic chip and demoulding the green ceramic chip,
a conveying sucker for conveying the stripped green ceramic chips to a collecting table and spraying bonding glue to the green ceramic chips,
and a collection station for the laminations;
the sheet conveying sucker is positioned between the sheet bearing platform and the collecting platform;
the four corners of the chip bearing table are respectively provided with a first positioning pin, and the first positioning pins correspond to the positioning holes at the four corners of the green ceramic chip one by one;
the four corners of the tile conveying sucker are respectively provided with a positioning hole, and the positioning holes correspond to the positioning holes at the four corners of the green tiles one by one;
glue spraying holes are formed in the periphery of the sheet conveying sucker and used for spraying bonding glue;
and four corners of the collecting table are respectively provided with a second positioning pin, and the second positioning pins correspond to the positioning holes at the four corners of the green ceramic chip one by one.
2. The green ceramic lamination assembly of claim 1, wherein the support platform is a porous stone table.
3. The green ceramic lamination device according to claim 1, wherein the glue spraying holes are formed between the positioning holes of the wafer conveying suction disc, and 3 glue spraying holes are formed between every two positioning holes.
4. The green ceramic lamination device of claim 1, wherein the wafer conveying suction cup is a vacuum suction cup.
5. The green ceramic lamination device of claim 1, wherein the wafer transfer chuck is configured with vertical and horizontal rails.
6. The green ceramic lamination device of claim 1, wherein a foot switch is provided at the bottom of the device for turning on the vacuum of the support platform.
7. The green ceramic lamination device of claim 1, wherein a push button switch is provided on the device platform for controlling the movement of the wafer-moving chuck along the guide rail.
8. A method of green ceramic lamination, comprising:
a. placing the piece bearing paper printed with the cavity pattern of the green ceramic chip on a piece bearing table, and sleeving the positioning holes of the piece bearing paper on the first positioning pins in a one-to-one correspondence manner;
b. opening a foot switch, placing the top layer green ceramic sheets with the positioning holes at the four corners on the sheet bearing paper printed with the cavity patterns on the sheet bearing platform, and sleeving the positioning holes on the first positioning pins in a one-to-one correspondence manner; the polyester film of the top green ceramic chip faces upwards; after the pedal switch is turned on, the sheet bearing paper and the green ceramic sheets are firmly sucked on the sheet bearing platform together;
c. sticking one corner of the polyester film on the green porcelain sheet by using a sticky roller, pressing and rolling to uncover the polyester film;
d. pressing a starting button of the tile conveying sucker to convey the green tiles to a collecting platform;
e. controlling the sheet conveying sucker to rise to a certain distance from the collecting table, starting the electromagnetic valve, spraying the bonding glue through the glue spraying hole of the sheet conveying sucker, and spraying the bonding glue on the raw porcelain sheets;
f. b, replacing the sheet bearing paper printed with the cavity pattern of the next layer of green ceramic sheet, sleeving the sheet bearing paper on the sheet bearing table, and placing the next layer of green ceramic sheet on the sheet bearing table by adopting the method in the step b;
g. repeating the steps c-f until the stacking of the penultimate layer of green ceramic chips is finished;
h. repeating the steps c to d to complete the stacking of the last layer of green ceramic chips;
i. taking down the raw porcelain blank together with the collecting table for subsequent process operation.
9. The green ceramic lamination method of claim 8, wherein the step of transporting the green ceramic sheets to a collection station comprises:
the tile conveying sucker moves above the tile bearing table, descends and presses the raw tiles on the tile bearing table;
opening the vacuum of the sheet conveying sucker and closing the vacuum of the sheet bearing platform at the same time;
the tile conveying sucker sucks the green tiles, then the green tiles ascend and move to the upper part of the collecting table;
and the sheet conveying sucker descends and presses the sheet conveying sucker onto the collecting platform, the vacuum of the sheet conveying sucker is closed, the pressure is opened, and the positioning holes at the four corners of the green ceramic sheets are sleeved on the four second positioning pins.
10. The method of claim 8, further comprising:
cutting the piece bearing paper in advance, cutting the piece bearing paper into the same size as the raw ceramic chip, punching a positioning hole on the piece bearing paper, and printing a cavity pattern consistent with the raw ceramic chip on the piece bearing paper by using glass glaze slurry;
the positioning holes correspond to the first positioning pins on the wafer bearing table one by one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110042525.1A CN112786519A (en) | 2021-01-13 | 2021-01-13 | Green ceramic lamination device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110042525.1A CN112786519A (en) | 2021-01-13 | 2021-01-13 | Green ceramic lamination device and method |
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| CN112786519A true CN112786519A (en) | 2021-05-11 |
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| CN202110042525.1A Pending CN112786519A (en) | 2021-01-13 | 2021-01-13 | Green ceramic lamination device and method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115352046A (en) * | 2022-10-21 | 2022-11-18 | 河北鼎瓷电子科技有限公司 | Full-automatic flatting mill |
| CN115366523A (en) * | 2022-10-27 | 2022-11-22 | 河北鼎瓷电子科技有限公司 | A lamination equipment that is used for range upon range of connection of multi-disc green ceramic chip |
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| CN115366523A (en) * | 2022-10-27 | 2022-11-22 | 河北鼎瓷电子科技有限公司 | A lamination equipment that is used for range upon range of connection of multi-disc green ceramic chip |
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