CN114284367B - Detector packaging structure and packaging method thereof - Google Patents
Detector packaging structure and packaging method thereof Download PDFInfo
- Publication number
- CN114284367B CN114284367B CN202111598183.8A CN202111598183A CN114284367B CN 114284367 B CN114284367 B CN 114284367B CN 202111598183 A CN202111598183 A CN 202111598183A CN 114284367 B CN114284367 B CN 114284367B
- Authority
- CN
- China
- Prior art keywords
- detector
- heat conducting
- conducting block
- supporting piece
- block supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000006073 displacement reaction Methods 0.000 claims abstract description 11
- 239000000523 sample Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 5
- 230000008859 change Effects 0.000 abstract description 8
- 238000003384 imaging method Methods 0.000 abstract description 8
- 230000035882 stress Effects 0.000 abstract description 8
- 238000012546 transfer Methods 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000701 chemical imaging Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention provides a detector packaging structure, comprising: the detector comprises a detector substrate, a detector, a heat conducting block supporting piece and a heat conducting block; a heat conducting block supporting piece is fixed above the detector substrate, the heat conducting block supporting piece is of a hollow cylinder structure, a central hole is formed in the upper bottom surface of the heat conducting block supporting piece, and a light hole is formed in the center of the lower bottom surface of the heat conducting block supporting piece; the detector is installed in light trap department, and the heat conduction piece is installed in centre bore department, and the heat conduction piece is laminated mutually with the back of detector, and the linear expansion displacement direction of heat conduction piece support piece and heat conduction piece is opposite, compensates displacement error to the detector. According to the invention, by arranging the heat conducting block supporting piece, the heat conducting performance is improved, the stress on the heat conducting surface of the detector is smaller, the thermal stress borne by the detector and generated due to the change of the ambient temperature is improved, the detector is subjected to smaller external interference stress during the task execution, a higher system transfer function is maintained, and the imaging quality of the detector is improved.
Description
Technical Field
The invention relates to the technical field of hyperspectral imaging, in particular to a detector packaging structure and a packaging method thereof.
Background
Nowadays, many imaging systems are independent of the detector, that is to say, the imaging unit of the detector has a crucial role in the imaging system, but is very important for supporting and positioning the detector chip, and serious damage and damage can be caused to the detector due to the influence of temperature and the deviation of vibration caused by improper mounting of the detector, and immeasurable loss can be caused to a detection task.
The prior method for fixing the detector is uncertain, and is easy to cause poor geometric shape and position stability of the heat conducting material overlapped with the radiating surface of the detector, and is separated from the radiating surface or causes the compression stress of the radiating surface to be increased.
Some detectors are directly welded on a PCB (circuit board), and the PCB is subjected to the change of the temperature of peripheral power elements of the PCB, so that the position of a photosurface is changed in displacement relative to the imaging position of an optical system, the weight of the detector is supported by pins of the detector, and the detector is easily damaged through a mechanical test.
At present, most of matrix packages of CCD and CMOS detectors use ceramic packages, and the ceramic packages are that produced integrated circuit bare chips are placed on a ceramic substrate with bearing function, and pins on an integrated circuit inside the ceramic substrate are led out from the ceramic matrix;
ceramic packages are also classified into different types, and there is a slight difference between different types of package structures. Whether the stability of the detector installation and fixation is light directly affects the imaging quality, and the detector is damaged directly or scrapped directly. Therefore, the thermal and mechanical interaction has high requirements on the mechanical structure design when the detector is installed. For example, the change of temperature can generate alternating stress on the ceramic substrate to change the photosensitive surface of the detector, so that the transfer function of the camera is poor, and the substrate is easily broken due to external impact, so that the detector is invalid.
Disclosure of Invention
In view of the foregoing, an object of the present invention is to provide a probe packaging structure and a packaging method thereof. By means of the heat conducting block supporting piece, the heat conducting performance is improved, meanwhile, the stress on the heat conducting surface of the detector is smaller, the thermal stress borne by the detector and generated due to the change of the ambient temperature is improved, the detector is smaller in external interference stress during the task execution, a higher system transfer function is maintained, and the imaging quality of the detector is improved.
In order to achieve the above purpose, the present invention adopts the following specific technical scheme:
the invention provides a detector packaging structure, comprising: the detector comprises a detector substrate, a detector, a heat conducting block supporting piece and a heat conducting block; a heat conducting block supporting piece is fixed above the detector substrate, the heat conducting block supporting piece is of a hollow cylinder structure, a central hole is formed in the upper bottom surface of the heat conducting block supporting piece, and a light hole is formed in the center of the lower bottom surface of the heat conducting block supporting piece; the detector is installed in light trap department, and the heat conduction piece is installed in centre bore department, and the heat conduction piece is laminated mutually with the back of detector, and the linear expansion displacement direction of heat conduction piece support piece and heat conduction piece is opposite, compensates displacement error to the detector.
Preferably, the heat conducting block support is: a cylindrical structure or a polygonal cylinder structure.
Preferably, the detector is mounted in the heat conducting block support through a first screw, and the light sensitive surface of the detector faces downwards and is matched with the central hole of the lower bottom surface of the heat conducting block support.
Preferably, the heat conduction block is of a T-shaped three-dimensional structure, two sides of the heat conduction block are arranged at the edge of a central hole of the upper bottom surface of the heat conduction block support piece through second screws, and a cylinder of the heat conduction block extends into the heat conduction block support piece and is attached to the back surface of the detector.
Preferably, the edge of the central hole of the upper bottom surface of the heat conducting block support piece is provided with an annular bulge, and the annular bulge and the heat conducting block support piece are of an integrated structure.
Preferably, a heat conducting rubber pad is arranged between the heat conducting block and the detector.
Preferably, the diameters of the heat conducting rubber pad, the cylinder of the heat conducting block and the detector are the same.
Preferably, the heat conducting block support is the same material as the heat conducting block.
The invention also provides a detector packaging method, which comprises the following steps:
s1, fixing a heat conduction block supporting piece on a detector substrate;
s2, mounting the detector at the light hole;
s3, installing the heat conducting block at the center hole to enable the heat conducting block to be attached to the back face of the detector.
Compared with the prior art, the invention improves the heat conduction performance by arranging the heat conduction block support piece, simultaneously leads the stress on the heat conduction surface of the detector to be smaller, improves the thermal stress born by the detector due to the change of the environmental temperature, leads the detector to be smaller in external interference stress during the task execution, keeps a higher system transfer function, and improves the imaging quality of the detector.
Drawings
Fig. 1 is a schematic diagram of a probe package structure according to an embodiment of the present invention.
Fig. 2 is a flowchart of a method for packaging a probe according to an embodiment of the present invention.
Wherein reference numerals include: the detector comprises a detector substrate 1, a detector 2, a first screw 3, a heat conducting block support 4, a heat conducting block 5, a second screw 6 and a heat conducting rubber pad 7.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, like modules are denoted by like reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, a detailed description thereof will not be repeated.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limiting the invention.
Fig. 1 shows a probe package structure provided according to an embodiment of the present invention.
As shown in fig. 1, a probe package structure provided in an embodiment of the present invention includes: the detector comprises a detector substrate 1, a detector 2, a first screw 3, a heat conducting block support 4, a heat conducting block 5, a second screw 6, a heat conducting rubber pad 7 and a detector photosurface 8.
The top at detector base plate 1 is placed to heat conduction piece support piece 4, and heat conduction piece support piece 4 is hollow cylinder structure, and heat conduction piece support piece is: the multi-prism structure comprises three prisms and prism structures with the number of the prisms being greater than three. A central hole is arranged at the center of the upper bottom surface of the column body; the center of the lower bottom surface of the column body is provided with a light hole, and the positions and the sizes of the center hole and the light hole are the same. The central hole and the light-transmitting holes can be round, rectangular and other structures
The edge of the central hole of the upper bottom surface of the heat conducting block support piece 4 is provided with an annular bulge, and the annular bulge and the heat conducting block support piece 4 are of an integrated structure.
The detector 2 is mounted on the lower bottom surface of the heat conducting block support 4 through a first screw 3, and the light sensitive surface 8 of the detector faces downwards and is matched with a central hole of the lower bottom surface of the heat conducting block support 4.
The heat conducting block 5 comprises a cylinder and a round table, the round table with the diameter larger than that of the cylinder is arranged above the cylinder, the round table and the cylinder are of an integrated structure, the round table of the heat conducting block 5 is installed on the annular protrusion of the heat conducting block supporting piece 4 through the second screw 6, and the cylinder of the heat conducting block 5 extends into the heat conducting block supporting piece 4 and abuts against the back of the detector 2.
The heat conduction rubber pad 7 is placed in the middle of the heat conduction block 5 and the detector 2, and the heat conduction block 5 is prevented from being in direct contact with the detector 2.
The diameters of the heat-conducting rubber pad 7, the column body of the heat-conducting block 5 and the photosensitive surface 8 of the detector are the same.
The heat conducting block support 4 is of the same material as the heat conducting block 5.
When the temperature changes, the linear expansion displacement directions of the heat conducting block supporting piece and the heat conducting block are opposite, and the displacement error generated between the detector and the heat conducting block is compensated. The heat conducting block supporting piece deforms to generate upward extrusion force to drive the heat conducting block to move upwards, and the heat conducting block is heated to generate deformation identical to that of the heat conducting block supporting piece because the heat conducting block is made of the same material as that of the heat conducting block supporting piece, so that the same extrusion force is generated downwards to the detector, the detector is fixed in the heat conducting block supporting piece, and displacement change is not generated; the material of the packaging structure provided by the invention is selected no matter what the temperature changes, so that the respective displacements inside the packaging structure provided by the invention do not change relatively, and the detector is in a state of no detachment, no extrusion and good heat conduction.
Fig. 2 shows a flow of a method for encapsulating a probe according to an embodiment of the invention.
As shown in fig. 2, the probe packaging method includes the steps of:
s1, fixing the heat conducting block supporting piece on the detector substrate.
S2, installing the detector in the heat conducting block supporting piece.
And S3, mounting the heat conducting block on the heat conducting block supporting piece.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention. The above embodiments of the present invention do not limit the scope of the present invention. Any of various other corresponding changes and modifications made according to the technical idea of the present invention should be included in the scope of the claims of the present invention.
Claims (6)
1. A probe package structure, comprising: the detector comprises a detector substrate, a detector, a heat conducting block supporting piece and a heat conducting block; the upper part of the detector substrate is fixedly provided with the heat conducting block supporting piece which is of a hollow cylinder structure, the upper bottom surface of the heat conducting block supporting piece is provided with a central hole, and the center of the lower bottom surface is provided with a light hole; the detector is arranged at the light hole, the heat conducting block is arranged at the central hole, the heat conducting block is attached to the back surface of the detector, the linear expansion displacement directions of the heat conducting block supporting piece and the heat conducting block are opposite, and displacement errors are compensated for the detector;
the detector is arranged in the heat conducting block supporting piece through a first screw, and the photosensitive surface of the detector faces downwards and is matched with the light hole; the heat conducting block comprises a cylinder and a round table, the diameter of the round table is larger than that of the cylinder, the round table is fixed on the cylinder and is of an integrated structure with the cylinder, the round table is installed at the edge of the central hole through a second screw, and the cylinder extends into the heat conducting block supporting piece and is attached to the back surface of the detector; the heat conducting block supporting piece is made of the same material as the heat conducting block.
2. The probe package structure of claim 1, wherein the thermally conductive mass support is: a cylindrical structure or a polygonal cylinder structure.
3. The probe package structure of claim 2, wherein an annular protrusion is provided at an edge of the central hole, the annular protrusion being of an integrated structure with the thermally conductive mass support.
4. The detector package structure of claim 1, wherein a thermal pad is disposed between the thermal block and the detector.
5. The probe package structure of claim 4, wherein the thermal pad, the post, and the probe are the same gauge.
6. A method of packaging a detector, for use in a detector package structure according to any of claims 1-5, comprising the steps of:
s1, fixing the heat conduction block support piece on the detector substrate;
s2, mounting the detector at the light hole;
s3, installing the heat conducting block at the center hole, and enabling the heat conducting block to be attached to the back face of the detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111598183.8A CN114284367B (en) | 2021-12-24 | 2021-12-24 | Detector packaging structure and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111598183.8A CN114284367B (en) | 2021-12-24 | 2021-12-24 | Detector packaging structure and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114284367A CN114284367A (en) | 2022-04-05 |
| CN114284367B true CN114284367B (en) | 2023-11-24 |
Family
ID=80874942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111598183.8A Active CN114284367B (en) | 2021-12-24 | 2021-12-24 | Detector packaging structure and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114284367B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5100479A (en) * | 1990-09-21 | 1992-03-31 | The Board Of Regents Acting For And On Behalf Of The University Of Michigan | Thermopile infrared detector with semiconductor supporting rim |
| CN101697332A (en) * | 2009-10-16 | 2010-04-21 | 中国科学院上海技术物理研究所 | Micro-expanded thermal switch |
| EP2560189A1 (en) * | 2011-08-16 | 2013-02-20 | Leica Microsystems CMS GmbH | Detector device |
| CN103043216A (en) * | 2012-12-04 | 2013-04-17 | 中国商用飞机有限责任公司 | Freezing detector |
| CN106052679A (en) * | 2016-08-16 | 2016-10-26 | 北京控制工程研究所 | Star sensor image detector assembly |
| CN106655810A (en) * | 2016-11-01 | 2017-05-10 | 株洲中车时代电气股份有限公司 | Traction auxiliary converter |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6910812B2 (en) * | 2001-05-15 | 2005-06-28 | Peregrine Semiconductor Corporation | Small-scale optoelectronic package |
-
2021
- 2021-12-24 CN CN202111598183.8A patent/CN114284367B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5100479A (en) * | 1990-09-21 | 1992-03-31 | The Board Of Regents Acting For And On Behalf Of The University Of Michigan | Thermopile infrared detector with semiconductor supporting rim |
| CN101697332A (en) * | 2009-10-16 | 2010-04-21 | 中国科学院上海技术物理研究所 | Micro-expanded thermal switch |
| EP2560189A1 (en) * | 2011-08-16 | 2013-02-20 | Leica Microsystems CMS GmbH | Detector device |
| CN103043216A (en) * | 2012-12-04 | 2013-04-17 | 中国商用飞机有限责任公司 | Freezing detector |
| CN106052679A (en) * | 2016-08-16 | 2016-10-26 | 北京控制工程研究所 | Star sensor image detector assembly |
| CN106655810A (en) * | 2016-11-01 | 2017-05-10 | 株洲中车时代电气股份有限公司 | Traction auxiliary converter |
Non-Patent Citations (1)
| Title |
|---|
| 超长线列双波段红外焦平面探测器杜瓦封装技术研究;李俊;红外与激光工程;第47卷(第11期);173-179 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114284367A (en) | 2022-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5768104A (en) | Cooling approach for high power integrated circuits mounted on printed circuit boards | |
| US7304848B2 (en) | Apparatus for performance testing of heat dissipating modules | |
| US8237190B2 (en) | Image sensor package and image sensing module using same | |
| US20030032322A1 (en) | Semiconductor device-socket | |
| US6886347B2 (en) | Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules | |
| KR102402669B1 (en) | Connection structural member and connection structural member module, and probe card assembly and wafer testing apparatus using the same | |
| US9366591B2 (en) | Determining magnitude of compressive loading | |
| US6745575B2 (en) | Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules | |
| JP2004205487A (en) | Probe card fixing mechanism | |
| US8508031B2 (en) | Electronic device and method of producing the same | |
| CN108231914B (en) | 3D imaging photoelectric module | |
| CN114284367B (en) | Detector packaging structure and packaging method thereof | |
| JP3096197B2 (en) | Probe card | |
| CN212519734U (en) | Electronic equipment | |
| EP2458689B1 (en) | Socket for connection between a package and an electronic circuit board | |
| KR20090014755A (en) | Probe card and apparatus for testing a wafer having the probe card | |
| KR20070016291A (en) | Probe card assembly | |
| JP2005181284A (en) | Card holder, and fixing mechanism for probe card | |
| JP2001068887A (en) | Cooling structure of printed-circiut board | |
| US20090009971A1 (en) | Fixing structure | |
| JPH07321168A (en) | Probe card | |
| CN112422855B (en) | Stress-free space astronomical camera CCD assembly with small splicing height error and assembling method | |
| CN100361299C (en) | Packed module with positioning structure, electronic device and inspection after assembly | |
| CN111219907B (en) | TEC heat dissipation assembly for direct-insert type multi-element area array detector | |
| EP0066694A2 (en) | Method for inspecting integrated circuit chips |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |