CN114280462A - Radio frequency integrated circuit testing device and testing platform - Google Patents
Radio frequency integrated circuit testing device and testing platform Download PDFInfo
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Abstract
The application relates to a radio frequency integrated circuit testing device and a testing platform, and belongs to the technical field of integrated circuit testing. A kind of radio frequency integrated circuit testing device, the vector modulation demodulation module is used for producing the first baseband signal, transmit the first baseband signal to the radio frequency and launch the conditioning module; the radio frequency transmitting and conditioning module is used for generating a first vector signal according to the first baseband signal sent by the vector modulation and demodulation module and transmitting the first vector signal to the device to be tested through the switch matrix module; the radio frequency receiving and conditioning module is used for receiving a second vector signal returned by the device to be tested based on the first vector signal through the switch matrix module, demodulating the second vector signal to obtain a second baseband signal and transmitting the second baseband signal to the vector modulation and demodulation module; the vector modulation and demodulation module is also used for obtaining a test result of the device to be tested according to the first baseband signal and the second baseband signal, so that various radio frequency parameters can be tested at one time, a test instrument does not need to be frequently replaced, and the test efficiency is improved.
Description
Technical Field
The application relates to the technical field of integrated circuit testing, in particular to a radio frequency integrated circuit testing device and a testing platform.
Background
With the continuous development of radio frequency integrated circuits, the test requirements are higher and higher, and the test requirements of the radio frequency integrated circuits are high in complexity, and relate to various radio frequency parameters including frequency, power, noise coefficients, standing-wave ratios, harmonic suppression, spurious suppression, insertion loss, gain, third-order intermodulation, medium-frequency bandwidth and the like. The parameter testing needs to be completed by matching various radio frequency instruments such as a spectrum analyzer, a vector signal source, a noise coefficient analyzer, a vector network analyzer and the like. For multiple radio frequency integrated circuits of the same type, in order to improve the test efficiency, the measuring instrument is required to have the functions of multi-channel signal input and output and automatic test, but the traditional instrument does not have the functions.
Disclosure of Invention
In order to solve the problem of testing efficiency of testing various radio frequency parameters, the application provides a radio frequency integrated circuit testing device and a testing platform.
In a first aspect, the present application provides a radio frequency integrated circuit testing apparatus, including: the device comprises a vector modulation and demodulation module, a radio frequency transmitting and conditioning module, a radio frequency receiving and conditioning module and a switch matrix module;
the vector modulation and demodulation module is connected with the radio frequency transmitting and conditioning module and the radio frequency receiving and conditioning module;
the radio frequency emission conditioning module is connected with a test signal input end of a device to be tested through the switch matrix module;
the radio frequency receiving and conditioning module is connected with a test signal output end of the device to be tested through the switch matrix module;
the vector modulation and demodulation module is used for generating a first baseband signal and transmitting the first baseband signal to the radio frequency transmitting and conditioning module;
the radio frequency transmitting and conditioning module is used for generating a first vector signal according to the first baseband signal sent by the vector modulation and demodulation module, and transmitting the first vector signal to the device to be tested through the switch matrix module;
the radio frequency receiving and conditioning module is used for receiving a second vector signal returned by the device to be tested based on the first vector signal through the switch matrix module, demodulating the second vector signal to obtain a second baseband signal, and transmitting the second baseband signal to the vector modulation and demodulation module;
the vector modulation and demodulation module is further used for obtaining a test result of the device to be tested according to the first baseband signal and the second baseband signal;
further, the radio frequency emission conditioning module comprises: the radio frequency transmitting channel conditions the local oscillation unit and the up-conversion unit;
the radio frequency transmitting channel conditioning local oscillator unit is used for generating the first vector signal in a first frequency interval based on the first baseband signal and transmitting the first vector signal to a test signal input end of the device to be tested through the switch matrix module;
the up-conversion unit is used for performing frequency expansion on the radio frequency transmitting channel conditioning local oscillator module, generating the first vector signal in a second frequency interval based on the first baseband signal, and transmitting the first vector signal to a test signal input end of the device to be tested through the switch matrix module;
further, the radio frequency receiving and conditioning module comprises: the radio frequency receiving channel conditions the local oscillation unit and the down-conversion unit;
the radio frequency receiving channel conditioning local oscillator unit is used for receiving the second vector signal in a first frequency interval through the switch matrix module, demodulating the second vector signal to obtain a second baseband signal, and transmitting the second baseband signal to the vector modulation and demodulation module;
the down-conversion unit is used for performing frequency expansion on the radio frequency receiving channel conditioning local oscillator unit, receiving the second vector signal in a second frequency interval through the switch matrix module, demodulating the second vector signal to obtain a second baseband signal, and transmitting the second baseband signal to the vector modulation and demodulation module;
further, the apparatus further comprises: the system comprises a directional coupler, a signal acquisition and conditioning unit and a noise coefficient measuring unit;
the directional coupler is connected with the switch matrix module and the signal acquisition conditioning unit;
the signal acquisition conditioning unit is connected with the switch matrix module, the radio frequency emission conditioning module, the radio frequency reception conditioning module and the noise coefficient measuring unit;
the directional coupler is used for performing directional coupling on the first vector signal sent by the switch matrix module and transmitting the first vector signal to the radio frequency receiving and conditioning module for receiving; the second vector signal is used for being directionally coupled and received by the switch matrix module, and is transmitted to the radio frequency receiving and conditioning module;
the signal acquisition conditioning unit is used for conditioning the first vector signal and outputting the conditioned first vector signal to a test signal output end of the device to be tested through the switch matrix module; the second vector signal is subjected to signal conditioning and then output to the radio frequency receiving and conditioning module;
the noise coefficient measuring unit is used for generating a noise source signal and transmitting the noise source signal to a test signal input end of the device to be tested through the switch matrix module;
the radio frequency receiving and conditioning module is further used for receiving a microwave signal returned by the device to be tested based on the noise source signal through the switch matrix module and transmitting the microwave signal to the vector modulation and demodulation module; the vector modulation and demodulation module is further used for obtaining a noise coefficient parameter of the device to be tested according to the noise source signal and the microwave signal;
further, the noise coefficient measuring unit includes: the noise source submodule and the switch attenuation link submodule;
the noise source submodule is used for generating the noise source signal for testing and transmitting the noise source signal to the switch attenuation link submodule;
the switch attenuation link submodule is used for conditioning and controlling the noise source signal according to the measurement requirement of the device to be tested and outputting the signal to the test signal input end of the device to be tested through the switch matrix module;
further, the switch matrix module comprises at least two paths of test interfaces; the at least one test interface is used for connecting a test input end of the device to be tested; the at least one test interface is used for connecting a test output end of the device to be tested; the switch matrix module selects the test interface communicated with the radio frequency emission conditioning module or the radio frequency emission conditioning module under the action of a control end;
further, the switch matrix module comprises 4 input test interfaces and 4 output test interfaces;
furthermore, the device also comprises a clock unit, wherein the clock unit is used for providing clock signals for the radio frequency transmitting and conditioning module and the radio frequency receiving and conditioning module;
further, the operating frequencies of the switch matrix module, the radio frequency receiving and conditioning module and the radio frequency transmitting and conditioning module are greater than or equal to 50MHz and less than or equal to 12 GHz;
the working bandwidth of the vector modulation and demodulation module is less than or equal to 1 GHz.
In a second aspect, the present application provides a radio frequency integrated circuit test platform, where the test platform includes two radio frequency integrated circuit test apparatuses according to any one of the first aspects; and the two radio frequency integrated circuit testing devices are connected through the switch matrix module.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
the radio frequency integrated circuit testing device provided by the embodiment of the application comprises: the device comprises a vector modulation and demodulation module, a radio frequency transmitting and conditioning module, a radio frequency receiving and conditioning module and a switch matrix module; the vector modulation and demodulation module is connected with the radio frequency transmitting and conditioning module and the radio frequency receiving and conditioning module; the radio frequency emission conditioning module is connected with a test signal input end of a device to be tested through the switch matrix module; the radio frequency receiving and conditioning module is connected with a test signal output end of the device to be tested through the switch matrix module; the vector modulation and demodulation module is used for generating a first baseband signal and transmitting the first baseband signal to the radio frequency transmitting and conditioning module; the radio frequency transmitting and conditioning module is used for generating a first vector signal according to the first baseband signal sent by the vector modulation and demodulation module, and transmitting the first vector signal to the device to be tested through the switch matrix module; the radio frequency receiving and conditioning module is used for receiving a second vector signal returned by the device to be tested based on the first vector signal through the switch matrix module, demodulating the second vector signal to obtain a second baseband signal, and transmitting the second baseband signal to the vector modulation and demodulation module; the vector modulation and demodulation module is further used for obtaining a test result of the device to be tested according to the first baseband signal and the second baseband signal. The radio frequency integrated circuit testing device can test various radio frequency parameters at one time, solves the problem of testing efficiency of testing various radio frequency parameters, does not need to frequently replace a testing instrument, and improves the testing efficiency.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic diagram illustrating an application of an rf integrated circuit testing apparatus according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a radio frequency integrated circuit testing apparatus according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of another RF integrated circuit testing apparatus according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a noise factor measurement unit according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a radio frequency integrated circuit test platform according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The first embodiment of the present application provides a radio frequency integrated circuit testing apparatus, which may be applied to a system architecture as shown in fig. 1, where the system architecture includes at least a hardware platform 101 and a software platform 102, and the hardware platform 101 and the software platform 102 establish a communication connection, for example, a standard PXIe bus may be used for the communication connection. The software platform 102 comprises an application layer, an interface layer, an algorithm, a hardware function, an operating system and the like, wherein the application layer comprises functions of a user input/output interface, data acquisition, parameter setting and the like, the interface layer comprises functions of a vector modulation interface, a vector demodulation interface, vector network analysis, noise coefficient measurement and the like, the algorithm comprises a vector modulation demodulation algorithm, a vector network analysis algorithm, a noise coefficient measurement algorithm, a self-calibration algorithm and the like, the hardware function comprises channel control and data acquisition, and the channel control comprises control over a channel in a switch matrix module. The testing device is applied to a hardware platform in the system architecture.
Next, a radio frequency integrated circuit testing apparatus is described in detail based on the system architecture, and a radio frequency integrated circuit testing apparatus, as shown in fig. 2, includes: a vector modulation demodulation module 201, a radio frequency transmission conditioning module 202, a radio frequency reception conditioning module 203 and a switch matrix module 204.
The vector modulation and demodulation module 201 is connected with the radio frequency transmitting and conditioning module 202 and the radio frequency receiving and conditioning module 203; the radio frequency emission conditioning module 202 is connected with a test signal input end of a device to be tested 205 through the switch matrix module 204; the rf receiving and conditioning module 203 is connected to the test signal output terminal of the device under test 205 through the switch matrix module 204.
The vector modulation and demodulation module is used for generating a first baseband signal and transmitting the first baseband signal to the radio frequency emission conditioning module; the radio frequency transmitting and conditioning module is configured to generate a first vector signal according to the first baseband signal sent by the vector modulation and demodulation module, and transmit the first vector signal to the device to be tested 205 through the switch matrix module; the radio frequency receiving and conditioning module is configured to receive a second vector signal returned by the device under test 205 based on the first vector signal through the switch matrix module, demodulate the second vector signal to obtain a second baseband signal, and transmit the second baseband signal to the vector modulation and demodulation module; the vector modulation and demodulation module is further used for obtaining a test result of the device to be tested according to the first baseband signal and the second baseband signal.
In the embodiment of the application, in a test process of a device to be tested, according to a test requirement, a vector modulation and demodulation module generates a first baseband signal, a radio frequency transmitting and conditioning module generates a first vector signal according to the first baseband signal, a channel is selected by a switch matrix module to be connected with a test signal input end of the device to be tested, the switch matrix module receives a second vector signal from a test signal output end of the device to be tested and sends the second vector signal to a radio frequency receiving and conditioning module, the radio frequency receiving and conditioning module demodulates the second baseband signal according to the second vector signal to obtain the second baseband signal, and transmits the second baseband signal to the vector modulation and demodulation module, and the vector modulation and demodulation module obtains a test result of the device to be tested according to the first baseband signal and the second baseband signal. The radio frequency integrated circuit testing device can be connected with a device to be tested once according to the testing requirement to measure various radio frequency parameters, a testing instrument does not need to be frequently replaced, and the testing efficiency is improved.
In one embodiment, as shown in fig. 3, the rf transmit conditioning module comprises: the radio frequency transmission channel conditions the local oscillator unit 301 and the up-conversion unit 302.
The radio frequency transmitting channel conditioning local oscillator unit 301 is configured to generate a first vector signal in a first frequency interval based on the first baseband signal, and transmit the first vector signal to a test signal input end of the device to be tested through the switch matrix module; the up-conversion unit 302 is configured to perform frequency expansion on the radio frequency transmission channel conditioning local oscillator module, generate a first vector signal of a second frequency interval based on the first baseband signal, and transmit the first vector signal to a test signal input end of the device to be tested through the switch matrix module.
In this embodiment, the first frequency interval of the work of the radio frequency transmission channel conditioning local oscillator unit is 50MHz-6GHz, the second frequency interval of the work of the up-conversion unit is 6GHz-12GHz, if the first vector signal to be generated is located in the frequency interval of 6GHz-12GHz, frequency expansion needs to be performed by the up-conversion unit, and frequency band output of the vector signal of 50MHz-12GHz can be realized by using the radio frequency transmission channel conditioning local oscillator unit and the up-conversion unit in a matching manner, so that the output frequency band coverage range of the radio frequency integrated circuit testing device is improved, and further, the performance of the radio frequency integrated circuit testing device is improved.
Specifically, the output of the radio frequency transmission channel conditioning local oscillator unit 301 or the output of the up-conversion unit 302 may also be controlled by the first switch 309, for example, the first switch 309 may be a single-second switch, a common end of the single-second switch is used as an output end of the radio frequency transmission conditioning module, and a first end and a second end of the single-second switch are connected to the radio frequency transmission channel conditioning local oscillator unit or the up-conversion unit under the action of the control end, where the first switch 309 may belong to a switch matrix module, which is convenient for centralized control.
In one embodiment, as shown in fig. 3, the rf receiving and conditioning module includes: the radio frequency receiving channel conditions the local oscillation unit 303 and the down-conversion unit 304.
The radio frequency receiving channel conditioning local oscillator unit 303 is configured to receive a second vector signal in the first frequency interval through the switch matrix module, demodulate the second vector signal to obtain a second baseband signal, and transmit the second baseband signal to the vector modulation and demodulation module; the down-conversion unit 304 is configured to perform frequency expansion on the radio frequency receiving channel conditioning local oscillation unit, receive a second vector signal in a second frequency interval through the switch matrix module, demodulate the second vector signal to obtain a second baseband signal, and transmit the second baseband signal to the vector modulation and demodulation module.
In this embodiment, the first frequency interval of the work of the radio frequency receiving channel conditioning local oscillator unit is 50MHz-6GHz, the second frequency interval of the work of the down conversion unit is 6GHz-12GHz, if the received second vector signal is located in the frequency interval of 6GHz-12GHz, the down conversion unit needs to perform frequency expansion, and the frequency band receiving of the vector signal of 50MHz-12GHz can be realized by using the radio frequency receiving channel conditioning local oscillator unit and the down conversion unit in a matching manner, so that the input frequency band coverage range of the radio frequency integrated circuit testing device is improved, and further the performance of the radio frequency integrated circuit testing device is improved.
Specifically, the output of the radio frequency receiving channel conditioning local oscillator unit 303 or the down conversion unit 304 may also be controlled by the second switch 310, for example, the second switch 310 may be a single or double switch, a common end of the single or double switch is used as an output end of the radio frequency receiving conditioning module, a first end and a second end of the single or double switch are connected to the radio frequency receiving channel conditioning local oscillator unit or the down conversion unit under the action of the control end, where the second switch 310 may belong to a switch matrix module, which is convenient for centralized control.
In one embodiment, as shown in fig. 3, the apparatus further comprises: a directional coupler 306, a signal acquisition and conditioning unit 305 and a noise coefficient measuring unit 307.
The directional coupler is connected with the switch matrix module and the signal acquisition conditioning unit; the signal acquisition conditioning unit is connected with the switch matrix module, the radio frequency emission conditioning module, the radio frequency receiving conditioning module and the noise coefficient measuring unit.
The directional coupler is used for performing directional coupling on the first vector signal sent by the switch matrix module and transmitting the first vector signal to the radio frequency receiving and conditioning module for receiving; the second vector signal received by the switch matrix module is directionally coupled and transmitted to the radio frequency receiving and conditioning module; the signal acquisition conditioning unit is used for conditioning the first vector signal and outputting the conditioned first vector signal to a test signal output end of the device to be tested through the switch matrix module; the second vector signal is output to the radio frequency receiving and conditioning module after being subjected to signal conditioning; the noise coefficient measuring unit is used for generating a noise source signal and transmitting the noise source signal to a test signal input end of the device to be tested through the switch matrix module; the radio frequency receiving and conditioning module is also used for receiving a microwave signal returned by the device to be tested based on the noise source signal through the switch matrix module and transmitting the microwave signal to the vector modulation and demodulation module; the vector modulation and demodulation module is also used for obtaining a noise coefficient parameter of the device to be tested according to the noise source signal and the microwave signal.
It should be noted that, when the directional coupler is required to perform directional coupling on the first vector signal and transmit the first vector signal to the radio frequency receiving and conditioning module for reception, the first vector signal is also sent to the test signal input end of the device to be tested through the switch matrix module, and the test signal output end of the device to be tested returns the second vector signal. The directional coupler here may include two directional couplers, where one directional coupler is configured to perform directional coupling on the first vector signal sent by the switch matrix module and transmit the first vector signal to the rf receiving and conditioning module for receiving, and the other directional coupler is configured to perform directional coupling on the second vector signal received by the switch matrix module and transmit the second vector signal to the rf receiving and conditioning module for receiving.
It should be noted that, the directional coupler may transmit the directionally coupled first vector signal or second vector signal to the radio frequency receiving and conditioning module directly, or may transmit the directionally coupled first vector signal or second vector signal to the radio frequency receiving and conditioning module after signal conditioning by the signal acquisition and conditioning unit.
In this embodiment, if the signal frequency, power, harmonic suppression, spurious suppression, third-order intermodulation and other parameters need to be measured, the vector signal transceiving measurement function of the radio frequency integrated circuit test device is used, that is, the vector signal transceiving test function is completed through the vector modulation and demodulation module, the radio frequency transmitting and conditioning module, the radio frequency receiving and conditioning module and the switch matrix module.
If the port parameters of the device to be tested need to be measured, for example, parameters such as scattering parameters, standing-wave ratio, group delay and the like are obtained, a vector network analysis function of the radio frequency integrated circuit testing device needs to be used, namely, on the basis of vector signal receiving and transmitting tests, the first vector signal and the second vector signal are subjected to directional coupling, and after the first vector signal and the second vector signal are respectively measured, relevant algorithm calculation is performed to obtain relevant parameters. For example, a first vector signal transmitted to the device to be measured is used as an incident signal, a second vector signal is used as a transmission signal, a signal transmitted back from a signal input end of the device to be measured is used as a reflection signal, the incident signal, the reflection signal and the transmission signal are separated by the directional coupler, the amplitude and the phase of the incident signal, the amplitude and the phase of the reflection signal and the amplitude and the phase of the transmission signal are respectively measured, and parameters such as a scattering parameter, a standing-wave ratio, a group delay and the like are calculated by the vector modulation and demodulation module.
If the noise coefficient parameter of the device to be tested needs to be measured, the noise coefficient measurement unit needs to perform testing to obtain the noise coefficient parameter, namely, the noise coefficient measurement unit generates a noise source signal and transmits the noise source signal to the test signal input end of the device to be tested through the switch matrix module, the radio frequency receiving and conditioning module receives a microwave signal returned by the device to be tested based on the noise source signal through the switch matrix module and transmits the microwave signal to the vector modulation and demodulation module, and the vector modulation and demodulation module obtains the noise coefficient parameter of the device to be tested according to the noise source signal and the microwave signal.
In one embodiment, as shown in fig. 4, the noise figure measuring unit includes: a noise source sub-module 401 and a switch attenuation link sub-module 402.
The noise source sub-module 401 is configured to generate a noise source signal for testing, and transmit the noise source signal to the switch attenuation link sub-module; the switch attenuation link submodule 402 is configured to condition and control a noise source signal according to a measurement requirement of the device to be tested, and output the noise source signal to a test signal input end of the device to be tested through the switch matrix module.
In one embodiment, the switch matrix module comprises at least two test interfaces; the at least one test interface is used for connecting a test input end of a device to be tested; the at least one test interface is used for connecting a test output end of the device to be tested; the switch matrix module selects a test interface communicated with the radio frequency emission conditioning module or the radio frequency emission conditioning module under the action of the control end.
The switch matrix module at least comprises two paths of test interfaces, namely, the switch matrix module can be connected with at least one device to be tested and can also be connected with a plurality of devices to be tested, and when the switch matrix module is connected with the plurality of devices to be tested, the plurality of devices to be tested can be tested at one time.
In one embodiment, the switch matrix module includes a 4-way input test interface and a 4-way output test interface. Under the action of the control end, the path of the switch matrix module is selected, the switching of multi-channel signal input and output and various test functions can be realized, and the multifunctional test of four radio frequency integrated circuits is completed. For example, the switch matrix module may include a third switch 311 and a fourth switch 312, where the third switch and the fourth switch may be one-out-of-four switches, and the one-out-of-four switches may selectively connect different devices to be tested under the action of the control terminal, and in addition, connect to the directional coupler through the common terminal when connecting the directional coupler.
It should be noted that the device to be tested may be a plurality of devices to be tested, each device to be tested is connected to the test interface of one group of switch matrix modules, or may be a device to be tested having a plurality of interfaces, and different test interfaces in the switch matrix modules are selected and connected according to the number of the interfaces of the device to be tested.
In one embodiment, as shown in fig. 3, the apparatus further comprises a clock unit 308 for providing clock signals to the rf transmitting and receiving conditioning modules.
In one embodiment, the operating frequency of the switch matrix module, the rf receiving and conditioning module, and the rf transmitting and conditioning module is greater than or equal to 50MHz and less than or equal to 12 GHz. The working bandwidth of the vector modulation and demodulation module is less than or equal to 1 GHz.
The radio frequency integrated circuit testing device can receive and transmit 50MHz-12GHz vector signals, and the vector receiving and transmitting bandwidth with the highest bandwidth of 1GHz can meet the 5G broadband radio frequency integrated circuit test.
Based on the same technical concept, a second embodiment of the present application provides a radio frequency integrated circuit testing platform, as shown in fig. 5, the testing platform includes two radio frequency integrated circuit testing devices 501 described in any one of the first embodiments, and the two radio frequency integrated circuit testing devices 501 are connected through a switch matrix module. Specifically, the first switch, the second switch, the third switch and the fourth switch included in the two radio frequency integrated circuit testing devices are respectively connected, and path selection is performed under the action of the control end, so that the output of a dual-tone signal by a corresponding module can be achieved.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In the present invention, the terms "upper", "lower", "inner", "center", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In the description, suffixes such as "module", "part", or "unit" used to denote elements are used only for facilitating the description of the present invention, and have no specific meaning in themselves. Thus, "module", "component" or "unit" may be used mixedly.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A radio frequency integrated circuit testing apparatus, comprising: the device comprises a vector modulation and demodulation module, a radio frequency transmitting and conditioning module, a radio frequency receiving and conditioning module and a switch matrix module;
the vector modulation and demodulation module is connected with the radio frequency transmitting and conditioning module and the radio frequency receiving and conditioning module;
the radio frequency emission conditioning module is connected with a test signal input end of a device to be tested through the switch matrix module;
the radio frequency receiving and conditioning module is connected with a test signal output end of the device to be tested through the switch matrix module;
the vector modulation and demodulation module is used for generating a first baseband signal and transmitting the first baseband signal to the radio frequency transmitting and conditioning module;
the radio frequency transmitting and conditioning module is used for generating a first vector signal according to the first baseband signal sent by the vector modulation and demodulation module, and transmitting the first vector signal to the device to be tested through the switch matrix module;
the radio frequency receiving and conditioning module is used for receiving a second vector signal returned by the device to be tested based on the first vector signal through the switch matrix module, demodulating the second vector signal to obtain a second baseband signal, and transmitting the second baseband signal to the vector modulation and demodulation module;
the vector modulation and demodulation module is further used for obtaining a test result of the device to be tested according to the first baseband signal and the second baseband signal.
2. The testing device of claim 1, wherein the radio frequency emission conditioning module comprises: the radio frequency transmitting channel conditions the local oscillation unit and the up-conversion unit;
the radio frequency transmitting channel conditioning local oscillator unit is used for generating the first vector signal in a first frequency interval based on the first baseband signal and transmitting the first vector signal to a test signal input end of the device to be tested through the switch matrix module;
the up-conversion unit is used for performing frequency expansion on the radio frequency transmitting channel conditioning local oscillator module, generating a first vector signal of a second frequency interval based on the first baseband signal, and transmitting the first vector signal to a test signal input end of the device to be tested through the switch matrix module.
3. The testing device of claim 1, wherein the radio frequency receive conditioning module comprises: the radio frequency receiving channel conditions the local oscillation unit and the down-conversion unit;
the radio frequency receiving channel conditioning local oscillator unit is used for receiving the second vector signal in a first frequency interval through the switch matrix module, demodulating the second vector signal to obtain a second baseband signal, and transmitting the second baseband signal to the vector modulation and demodulation module;
the down-conversion unit is used for performing frequency expansion on the radio frequency receiving channel conditioning local oscillator unit, receiving the second vector signal in a second frequency interval through the switch matrix module, demodulating the second vector signal to obtain the second baseband signal, and transmitting the second baseband signal to the vector modulation and demodulation module.
4. The testing device of claim 1, wherein the device further comprises: the system comprises a directional coupler, a signal acquisition and conditioning unit and a noise coefficient measuring unit;
the directional coupler is connected with the switch matrix module and the signal acquisition conditioning unit;
the signal acquisition conditioning unit is connected with the switch matrix module, the radio frequency emission conditioning module, the radio frequency reception conditioning module and the noise coefficient measuring unit;
the directional coupler is used for performing directional coupling on the first vector signal sent by the switch matrix module and transmitting the first vector signal to the radio frequency receiving and conditioning module for receiving; the second vector signal received by the switch matrix module is directionally coupled and transmitted to the radio frequency receiving and conditioning module;
the signal acquisition conditioning unit is used for conditioning the first vector signal and outputting the conditioned first vector signal to a test signal output end of the device to be tested through the switch matrix module; the second vector signal is subjected to signal conditioning and then output to the radio frequency receiving and conditioning module;
the noise coefficient measuring unit is used for generating a noise source signal and transmitting the noise source signal to a test signal input end of the device to be tested through the switch matrix module;
the radio frequency receiving and conditioning module is further used for receiving a microwave signal returned by the device to be tested based on the noise source signal through the switch matrix module and transmitting the microwave signal to the vector modulation and demodulation module; and the vector modulation and demodulation module is also used for obtaining a noise coefficient parameter of the device to be tested according to the noise source signal and the microwave signal.
5. The test apparatus according to claim 4, wherein the noise figure measuring unit comprises: the noise source submodule and the switch attenuation link submodule;
the noise source submodule is used for generating the noise source signal for testing and transmitting the noise source signal to the switch attenuation link submodule;
and the switch attenuation link submodule is used for conditioning and controlling the noise source signal according to the measurement requirement of the device to be tested and outputting the signal to the test signal input end of the device to be tested through the switch matrix module.
6. The testing device of claim 1, wherein the switch matrix module comprises at least two test interfaces; the at least one test interface is used for connecting a test input end of the device to be tested; the at least one test interface is used for connecting a test output end of the device to be tested; and the switch matrix module selects the test interface communicated with the radio frequency emission conditioning module or the radio frequency emission conditioning module under the action of a control end.
7. The test device of claim 6, wherein the switch matrix module comprises a 4-way input test interface and a 4-way output test interface.
8. The testing device of claim 1, further comprising a clock unit configured to provide a clock signal to the rf transmit conditioning module and the rf receive conditioning module.
9. The testing device of claim 8, wherein the operating frequencies of the switch matrix module, the rf receive conditioning module, and the rf transmit conditioning module are greater than or equal to 50MHz and less than or equal to 12 GHz;
the working bandwidth of the vector modulation and demodulation module is less than or equal to 1 GHz.
10. A radio frequency integrated circuit test platform, characterized in that the test platform comprises two radio frequency integrated circuit test devices according to claims 1-9; and the two radio frequency integrated circuit testing devices are connected through the switch matrix module.
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