CN114277358B - Liquid source bottle and semiconductor process equipment - Google Patents
Liquid source bottle and semiconductor process equipment Download PDFInfo
- Publication number
- CN114277358B CN114277358B CN202111342420.4A CN202111342420A CN114277358B CN 114277358 B CN114277358 B CN 114277358B CN 202111342420 A CN202111342420 A CN 202111342420A CN 114277358 B CN114277358 B CN 114277358B
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- liquid
- air inlet
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- 239000007788 liquid Substances 0.000 title claims abstract description 150
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 abstract description 5
- 238000001704 evaporation Methods 0.000 abstract description 5
- 239000012159 carrier gas Substances 0.000 description 22
- 239000007789 gas Substances 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 5
- 150000002902 organometallic compounds Chemical class 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
A liquid source bottle and semiconductor process equipment are used in the semiconductor process equipment, the liquid source bottle comprises a bottle body and a plurality of liquid containing tanks which are sequentially arranged in the bottle body from top to bottom; the top of the bottle body is provided with an air inlet and an air outlet; the liquid reservoirs are respectively communicated with the air inlet through air inlet pipelines and the air outlet through air outlet pipelines. The liquid source bottle adopts a mode of arranging a plurality of layers of liquid containing tanks in one source bottle, greatly increases the evaporation capacity of the liquid source on the basis of not increasing the volume of the source bottle, and meets the process requirements of semiconductor process equipment with large capacity.
Description
Technical Field
The application belongs to the technical field of semiconductors, and particularly relates to a liquid source bottle and semiconductor process equipment.
Background
During a Metal-organic chemical vapor deposition (MOCVD) process, gaseous Metal-organic compounds are decomposed on a wafer on a susceptor surface within a process chamber and a Metal or Metal compound film is thermally deposited on the wafer surface. The gaseous metal organic compound can be obtained by the following process: the liquid metal organic compound is stored in a source bottle as a source, namely, the liquid source, the space except the liquid source in the source bottle is in a low-pressure state, a certain amount of gaseous source can be evaporated on the surface of the liquid source, inert gas with certain flow and pressure is introduced into the source bottle as carrier gas, the carrier gas is blown from the surface of the liquid source, the gaseous metal organic compound evaporated in the source bottle, namely, the gaseous source, is carried out of the source bottle, and the carrier gas carrying the gaseous source finally reaches a process chamber through a series of process gas pipelines, so that corresponding CVD reaction is carried out on the surface of a wafer.
During the CVD process, the rate at which the film is deposited on the wafer surface is directly related to the amount of gaseous source that reaches the wafer surface per unit time, which is insufficient to affect the efficiency of the overall deposition process and thus the overall throughput of the apparatus. According to the principle of evaporation of a liquid, the amount of liquid evaporated into a gaseous state per unit time is proportional to the liquid temperature and to the liquid surface area under a certain pressure, while the process temperature and pressure of the source used for a particular CVD reaction are determined, so that the amount of gaseous source evaporated per unit time in the source bottle is only related to the liquid surface area. Fig. 1 shows a schematic view of a structure of a source bottle adopting a surface blowing mode, wherein a gaseous source 6 is evaporated from the surface of a liquid source 5, a carrier gas enters the source bottle through an air inlet 1 in an air inlet direction 3, flows out of an air outlet 2 in a direction indicated by a flow direction 7 and flows out towards a carrier gas air outlet direction 4 carrying the gaseous source, a filling opening 8 of the source bottle is arranged in the middle of the top and is limited by the condition of equipment, the volume of the source bottle is not increased limitlessly, the surface area of the liquid source in the source bottle is not increased limitlessly, and the surface area of the liquid source is limited by the size of the source bottle and cannot be increased effectively, as in the source bottle shown in fig. 1. Therefore, how to increase the carry-over of a liquid source with a smaller saturated vapor pressure is a key technical problem. In order to improve the overall productivity of the equipment, 2 or more source bottles are often used in parallel connection for a CVD machine to achieve a higher level of the expected source blowout amount, but each time one source bottle is added, a set of auxiliary equipment for the source bottle is added, including a pneumatic valve group, heating and heat-preserving equipment and the like, so that the material cost and the maintenance difficulty of the machine are increased.
Therefore, there is a need for a new liquid source bottle that can greatly increase the surface area of the liquid source inside the source bottle and increase the rate of CVD reactions without increasing the volume of the source bottle.
Disclosure of Invention
The application aims to provide a liquid source bottle and semiconductor process equipment, which can greatly increase the surface area of a liquid source in the source bottle without increasing the volume of the source bottle.
In order to achieve the above purpose, the application provides a liquid source bottle which is used in semiconductor process equipment and comprises a bottle body, a bottle mouth section and a plurality of liquid containing tanks, wherein the bottle mouth section is sequentially arranged in the bottle body from top to bottom, and the liquid containing tanks are sequentially connected from the bottle mouth section downwards;
the top of the bottleneck section of the bottle body is provided with an air inlet and an air outlet;
the Cheng Yechi are respectively communicated with the air inlet through air inlet pipelines and the air outlet through air outlet pipelines.
Preferably, the air inlet pipeline comprises a plurality of air inlet pipe sections which are sequentially communicated from top to bottom, each air inlet pipe section corresponds to one Cheng Yechi except the lowest liquid containing pool, and the cross sections of the air inlet pipe sections from top to bottom are gradually reduced.
Preferably, the cross-sectional area of the ith tube section from top to bottom is the cross-sectional area of the air inlet
Wherein i and N represent positive integers, i < N is more than or equal to 1, and N represents the total number of liquid reservoirs.
Preferably, the top of the side wall of each liquid container is respectively provided with an air inlet hole, the air inlet holes are communicated with the air inlet pipeline, and the sectional area of each air inlet hole is the sectional area of the air inletN represents the total number of liquid reservoirs.
Preferably, the air outlet pipeline comprises a plurality of air outlet pipe sections which are sequentially communicated from top to bottom, each air outlet pipe section corresponds to one Cheng Yechi except for the lowest liquid containing pool, and the cross sections of the plurality of air outlet pipe sections are the same; the top of the side wall of each liquid containing tank is respectively provided with an air outlet hole, and the air outlet holes are communicated with the air outlet pipe section above the air outlet holes.
Preferably, the air inlet pipeline and the air outlet pipeline are symmetrically arranged relative to the central axis of the bottle body.
Preferably, the device further comprises a filling port, and a plurality of Cheng Yechi are communicated with the filling port.
Preferably, the inner wall of each liquid container is provided with a diversion hole penetrating through the bottom of the liquid container except the lowest liquid container, and two adjacent Cheng Yechi are communicated through the diversion holes.
Preferably, the bottle body comprises a plurality of bottle body sections which are welded in sequence from top to bottom, and each bottle body section is internally provided with one Cheng Yechi;
the outer diameters of the plurality of bottle body sections are equal; and/or the number of the groups of groups,
the shape and the size of the liquid containing tanks are the same.
The application also provides semiconductor process equipment comprising the liquid source bottle.
The application relates to a liquid source bottle, which has the beneficial effects that: the liquid source device has the advantages that the mode that the multilayer liquid containing tanks are arranged in one source bottle is adopted, the surface area of the liquid source exposed in the space is greatly increased on the basis that the volume of the source bottle is not increased, the evaporation capacity of the liquid source in unit time can be increased, and the process requirements of semiconductor process equipment with large productivity are met.
Additional features and advantages of the application will be set forth in the detailed description which follows.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
Fig. 1 is a schematic diagram showing the overall structure of a semiconductor processing apparatus in the prior art;
FIG. 2 illustrates a schematic diagram of a liquid source bottle according to an exemplary embodiment of the present application;
fig. 3 shows an exploded view of a plurality of body segments of a liquid source bottle according to an exemplary embodiment of the present application.
Reference numerals illustrate:
1. the device comprises an air inlet, 2, an air outlet, 3, an air inlet direction, 4, an air outlet direction, 5, a liquid source, 6, a gas source, 7, a flow direction, 8, a filling port, 9, a split carrier gas, 10, a first liquid source, 11, a converging gas, 12, a gas source, 13, a diversion hole, 14, a second liquid source, 15, a third liquid source, 16, a fourth liquid source, 17, an air inlet hole, 18 first pipe sections, 19 second pipe sections and 20 third pipe sections.
Detailed Description
Preferred embodiments of the present application will be described in more detail below. While the preferred embodiments of the present application are described below, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
In order to solve the problems in the prior art, the application provides a liquid source bottle which is used in semiconductor process equipment, as shown in fig. 2, and comprises a bottle body and a plurality of liquid containing tanks which are sequentially arranged in the bottle body from top to bottom;
the top of the bottle body is provided with an air inlet 1 and an air outlet 2;
the liquid reservoirs are respectively communicated with the air inlet 1 through an air inlet pipeline and the air outlet 2 through an air outlet pipeline;
according to the liquid source bottle, a mode of arranging the multilayer liquid containing tanks in one source bottle is adopted, so that the surface area of the liquid source exposed in the space is greatly increased on the basis of not increasing the volume of the source bottle, the evaporation capacity of the liquid source in unit time can be further increased, and the process requirements of semiconductor process equipment with large productivity are met.
The air inlet pipeline comprises a plurality of air inlet pipe sections which are sequentially communicated from top to bottom, the horizontal position of each air inlet pipe section corresponds to one liquid containing pool except the lowest liquid containing pool, and the sectional areas of the plurality of air inlet pipe sections from top to bottom are gradually reduced. Wherein, the lowest liquid containing pool is communicated with the corresponding air inlet pipe section of Cheng Yechi above the liquid containing pool.
Cheng Yechi are respectively communicated with the air inlet 1 through an air inlet pipeline and the air outlet 2 through an air outlet pipeline, in the process, the incoming carrier gas from the air inlet 1 enters the air inlet pipeline, is firstly split to the upper part of a liquid containing pool positioned on the first layer and the next air inlet pipe section in a splitting carrier gas 9 mode, and is then sequentially split to the surface of each liquid containing pool, the gaseous source 12 evaporated from the liquid source of each liquid containing pool is carried by the carrier gas, and is converged to the air outlet 2 through the air outlet pipeline to form a converged gas 11, flows out through the air outlet 2 and flows into the reaction chamber of the semiconductor process equipment in the air outlet direction 4.
Under the condition of a certain temperature, the gas flow is in direct proportion to the sectional area of the gas transmission pipeline, and the liquid source bottle provided by the application has the advantages that the internal pressure of the source bottle is constant, the inlet pipeline adopts a variable-diameter design, the inner diameters of a plurality of inlet pipe sections from top to bottom are gradually reduced, and the flow of carrier gas entering from the gas inlet 1 and blowing to four layers of liquid containing tanks is equivalent, so that the liquid source in each layer of liquid containing tanks is synchronously consumed.
The cross-sectional area of the i-th pipe section from top to bottom is the cross-sectional area of the air inlet 1Wherein i and N represent positive integers, i is more than or equal to 1<N, N represents the total number of reservoirs.
The top of the side wall of each liquid containing pool is respectively provided with an air inlet hole 17, the air inlet holes 17 are communicated with an air inlet pipeline, and the sectional area of each air inlet hole 17 is the sectional area of the air inlet 1N represents the total number of liquid reservoirs.
The number of the liquid containers can be 2 to 8 or even more, and the number of the liquid containers can be determined according to the actual conditions such as the whole height of the liquid source bottle, the equipment space and the like, but is not limited to the range of the application.
Specifically, in one embodiment of the present application, the number of Cheng Yechi is four, and the air inlet pipeline includes a first pipe segment 18, a second pipe segment 19 and a third pipe segment 20 that are sequentially connected from top to bottom, and are respectively used for accommodating the first liquid source 10, the second liquid source 14, the third liquid source 15 and the fourth liquid source 16. Cheng Yechi are wide and shallow structures to allow for multiple layers of reservoirs within the same source bottle, increasing the total surface area of the liquid source exposed to the space.
As shown by the arrow in fig. 2, the carrier gas enters the bottle from the gas inlet 1 and is split over the first tube section 18, one path of carrier gas flows over the first liquid source 10 through the gas inlet hole 17, the other path of carrier gas continues to flow down over the second tube section 19 through the first tube section 18 and continues to split, flows over the second liquid source 14 through the gas inlet hole 17, down over the third tube section 20 through the second tube section 19, and continues to split, flows over the third liquid source 15 through the gas inlet hole 17, flows over the fourth liquid source 16 through the third tube section 20 and the gas inlet hole 17, respectively;
the carrier gas enters the upper part of the liquid source of each liquid containing pool through the air inlet hole 17, and the carrier gas carries the gaseous source to form the converging gas 11 from the air outlet pipeline, and flows out from the air outlet 2.
In one embodiment of the application, the sides of the first, second and third tube sections 18, 19 and 20 adjacent to their respective reservoirs are on the same vertical plane.
The first pipe section 18 is arranged on the outer side of the first layer liquid containing pool and is positioned below the air inlet 1; the second pipe section 19 is arranged on the outer side of the second layer liquid containing pool, and the third pipe section 20 is arranged on the outer side of the third layer liquid containing pool.
The cross section area of the air inlet 1 is set to be A, the cross section area of the first pipe section 18 is 3/4 times of the cross section area A of the air inlet 1, the cross section area of the air inlet 17 is set to be 1/4 times of the cross section area A of the air inlet 1, so that the flow rate of the carrier gas 1/4 entering from the air inlet 1 divided by the air inlet 17 can be ensured, and the flow rate of the carrier gas 3/4 divided by the first pipe section 18 can be ensured;
by analogy, the cross-sectional area of the second pipe section 19 is 1/2 times of the cross-sectional area A of the air inlet 1, the cross-sectional area of the air inlet hole 17 above the second layer liquid containing pool is 1/4 times of the cross-sectional area A of the air inlet 1, then the air inlet hole 17 divides the flow rate of 1/4 of the carrier gas, and the second pipe section 19 divides the flow rate of 1/2 of the carrier gas;
the cross section area of the third pipe section 20 is 1/4 times of the cross section area A of the air inlet 1, the cross section area of the air inlet hole 17 above the liquid containing pool of the third layer is 1/4 times of the cross section area A of the air inlet 1, the air inlet hole 17 divides the flow of 1/4 of the carrier gas, and the carrier gas also flows downwards through the third pipe section 20 and blows to the upper part of the liquid containing pool of the fourth layer through the air inlet hole 17 above the liquid containing pool of the fourth layer;
the air flow rate in the air inlet holes 17 blowing to each layer of liquid containing pool is consistent through the design that the cross sectional areas of the air inlet holes 17 are the same. The gaseous sources evaporated from the surfaces of the first liquid source 10, the second liquid source 14, the third liquid source 15 and the fourth liquid source 16 are driven by the carrier gas with the same flow rate to form a converging gas 11 through a gas outlet pipeline, and then flow to the reaction chamber in the gas outlet direction 4 through the gas outlet 2. The air outlet pipeline comprises a plurality of air outlet pipeline sections which are sequentially communicated from top to bottom, each air outlet pipeline section corresponds to one liquid containing tank except the lowest liquid containing tank, the plurality of air outlet pipeline sections are straight pipes, the cross sections are the same, air outlet holes are respectively formed in the tops of the side walls of each liquid containing tank, and the air outlet holes are communicated with the air outlet pipeline section above the air outlet pipeline sections.
The liquid source bottle is characterized in that a plurality of liquid containing tanks are arranged in the bottle body to form a multi-layer structure, the surface area of the liquid source in each liquid containing tank exposed in the space is accumulated to be far larger than the surface area of the liquid source of a single source bottle in the prior art, and for the same liquid source, the evaporation capacity of the liquid source bottle is greatly increased compared with that of the liquid source bottle in the unit time in the prior art, two or more source bottles are not required to be connected in parallel, so that the material cost of a machine is reduced, and the maintenance difficulty of the machine is reduced.
The air inlet pipeline and the air outlet pipeline are symmetrically arranged relative to the central axis of the bottle body.
Except the lowest liquid containing tank, the inner wall of each liquid containing tank is provided with a diversion hole 13 penetrating through the tank bottom, and two adjacent liquid containing tanks are communicated through the diversion hole 13.
In one embodiment of the present application, the longitudinal section of the diversion hole 13 is V-shaped, or may be L-shaped, so that two adjacent liquid containers are communicated through the diversion hole 13.
The liquid source bottle of the application also comprises a filling opening 8, and a plurality of liquid containing tanks are communicated with the filling opening 8.
In one embodiment of the application, the filling opening 8 is arranged in the middle of the top of the bottle body, and the liquid source bottle adopts a layer-by-layer filling method when being filled. When filling, the source bottle is placed as shown in fig. 2, a liquid source is filled from the filling opening 8, the liquid source is filled with the liquid containing pool positioned on the first layer, then flows to the liquid containing pool positioned on the second layer through the flow guide pipe 13, flows to the liquid containing pool positioned on the third layer through the flow guide pipe 13 after the liquid containing pool positioned on the second layer is filled, and flows to the liquid containing pool positioned on the fourth layer through the flow guide pipe 13 after the liquid containing pool positioned on the third layer is filled Cheng Yechi.
The bottle body comprises a plurality of bottle body sections which are welded in sequence from top to bottom, and a liquid containing pool is arranged in each bottle body section;
the outer diameters of the bottle body sections are equal; and/or the number of the groups of groups,
the shape and the size of the liquid holding tanks are the same.
In one embodiment of the application, as shown in FIG. 3, a plurality of bottle segments are separately manufactured and then joined by welding. Preferably, welding is performed by electron beam welding along the butt surface.
The application also provides semiconductor process equipment comprising the liquid source bottle.
The foregoing description of embodiments of the application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described.
Claims (9)
1. The liquid source bottle is used in semiconductor process equipment and is characterized by comprising a bottle body and a plurality of liquid containing tanks which are sequentially arranged in the bottle body from top to bottom;
an air inlet (1) and an air outlet (2) are arranged at the top of the bottle body;
the Cheng Yechi are respectively communicated with the air inlet (1) through an air inlet pipeline and the air outlet (2) through an air outlet pipeline;
the air inlet pipeline comprises a plurality of air inlet pipe sections which are sequentially communicated from top to bottom, each air inlet pipe section corresponds to one Cheng Yechi except the lowest liquid containing pool, and the cross sections of the air inlet pipe sections from top to bottom are gradually reduced.
2. A liquid source bottle according to claim 1, characterized in that the cross-sectional area of the i-th tube section from top to bottom is the cross-sectional area of the inlet (1)，
Wherein i and N represent positive integers, i < N is more than or equal to 1, and N represents the total number of liquid reservoirs.
3. The liquid source bottle according to claim 1, wherein the top of the side wall of each liquid containing tank is provided with an air inlet hole (17), the air inlet holes (17) are communicated with the air inlet pipeline, and the sectional area of each air inlet hole (17) is the sectional area of the air inlet (1)N represents the total number of liquid reservoirs.
4. The liquid source bottle according to claim 1, wherein the air outlet pipeline comprises a plurality of air outlet pipe sections which are communicated sequentially from top to bottom, each air outlet pipe section corresponds to one Cheng Yechi except the lowest liquid containing pool, and the cross sections of the plurality of air outlet pipe sections are the same; the top of the side wall of each liquid containing tank is respectively provided with an air outlet hole, and the air outlet holes are communicated with the air outlet pipe section above the air outlet holes.
5. The liquid source bottle of claim 1, wherein the inlet conduit and the outlet conduit are symmetrically disposed about a central axis of the bottle body.
6. The liquid source bottle of claim 1, further comprising a filling port (8), wherein a plurality of said Cheng Yechi are each in communication with said filling port (8).
7. A liquid source bottle according to claim 1, wherein the inner wall of each liquid container except the lowest liquid container is provided with a flow guiding hole (13) penetrating through the bottom of the liquid container, and two adjacent liquid containers Cheng Yechi are communicated through the flow guiding holes (13).
8. The liquid source bottle according to claim 1, wherein the bottle body comprises a plurality of bottle body sections welded sequentially from top to bottom, and one Cheng Yechi is arranged in each bottle body section;
the outer diameters of the plurality of bottle body sections are equal; and/or the number of the groups of groups,
the shape and the size of the liquid containing tanks are the same.
9. Semiconductor process equipment characterized by comprising a liquid source bottle according to any of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111342420.4A CN114277358B (en) | 2021-11-12 | 2021-11-12 | Liquid source bottle and semiconductor process equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111342420.4A CN114277358B (en) | 2021-11-12 | 2021-11-12 | Liquid source bottle and semiconductor process equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114277358A CN114277358A (en) | 2022-04-05 |
| CN114277358B true CN114277358B (en) | 2023-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111342420.4A Active CN114277358B (en) | 2021-11-12 | 2021-11-12 | Liquid source bottle and semiconductor process equipment |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104651806A (en) * | 2013-11-25 | 2015-05-27 | 朗姆研究公司 | Multi-tray ballast vapor draw system |
| CN205473974U (en) * | 2016-03-23 | 2016-08-17 | 安徽三安光电有限公司 | Metal organic compound container |
| CN110885970A (en) * | 2018-09-11 | 2020-03-17 | 北京北方华创微电子装备有限公司 | Pressure stabilizing and purifying device for solid precursor vapor and ALD (atomic layer deposition) equipment |
| CN111286720A (en) * | 2018-12-10 | 2020-06-16 | 北京北方华创微电子装备有限公司 | Source bottle and semiconductor equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6301867B2 (en) * | 2015-03-31 | 2018-03-28 | 東芝メモリ株式会社 | Vaporization system |
| KR20170119360A (en) * | 2016-04-18 | 2017-10-27 | 삼성전자주식회사 | Solid source supply unit, Gas supply unit, and Substrate treating method |
-
2021
- 2021-11-12 CN CN202111342420.4A patent/CN114277358B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104651806A (en) * | 2013-11-25 | 2015-05-27 | 朗姆研究公司 | Multi-tray ballast vapor draw system |
| CN205473974U (en) * | 2016-03-23 | 2016-08-17 | 安徽三安光电有限公司 | Metal organic compound container |
| CN110885970A (en) * | 2018-09-11 | 2020-03-17 | 北京北方华创微电子装备有限公司 | Pressure stabilizing and purifying device for solid precursor vapor and ALD (atomic layer deposition) equipment |
| CN111286720A (en) * | 2018-12-10 | 2020-06-16 | 北京北方华创微电子装备有限公司 | Source bottle and semiconductor equipment |
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