CN114256083B - Method for removing Taizhou ring - Google Patents
Method for removing Taizhou ring Download PDFInfo
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- CN114256083B CN114256083B CN202210191578.4A CN202210191578A CN114256083B CN 114256083 B CN114256083 B CN 114256083B CN 202210191578 A CN202210191578 A CN 202210191578A CN 114256083 B CN114256083 B CN 114256083B
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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Abstract
The invention discloses a Taizhou ring removing method, which is characterized in that before the removal of the Taizhou ring by a removing mechanism, the Taizhou ring is detected by a detecting device, and a control device judges whether the Taizhou ring is a whole according to a detection signal of the detecting device; when the taidrum ring is determined not to be a whole, the control device gives an alarm and controls the removing mechanism not to remove the taidrum ring; when it is determined that the tympanum is one body, the control device controls the removal mechanism to perform removal of the tympanum. The scheme adopts the mode of firstly detecting the integrity of the too-drum ring and then removing the too-drum ring, can effectively control the action of the removing mechanism according to the actual condition of the too-drum ring, can alarm under the condition that the too-drum ring is not a whole, and reminds manual processing to avoid the problem that the wafer cannot be smoothly processed due to the fact that the too-drum ring is damaged and cannot be removed. Meanwhile, the invalid action of the removing mechanism under the abnormal condition of the tympanum can be avoided, and the loss can be reduced in time.
Description
Technical Field
The invention relates to the field of wafer processing in the semiconductor industry, in particular to a method for removing a Taizhou ring.
Background
When the known Taiko thinning process is adopted for wafer processing, only the central area of the wafer is thinned, and the non-thinned part of the periphery of the wafer forms an annular Taiko ring to support the thinner wafer, so that the storage, the movement and the like of the wafer are facilitated.
When a subsequent wafer is processed, the Taibo ring on the wafer needs to be annularly cut, then the wafer is fixed on the ring taking circular table, the annularly cut Taibo ring is removed from the wafer through the removing mechanism, when the removing mechanism removes the Taibo ring from the wafer, the annularly cut Taibo ring and a film on the wafer need to be peeled off and grabbed, and then the grabbed Taibo ring is moved to the outer side of the wafer.
Because the width of the too-drum ring is very small and the texture is brittle, the too-drum ring is easy to break in the processes of ring cutting, moving and positioning, once the too-drum ring is broken, the too-drum ring cannot be automatically removed through the removing mechanism, and in the existing removing process, the process of detecting the integrity of the too-drum ring before the too-drum ring is removed does not exist, so that the abnormal condition of the too-drum ring cannot be timely found, the removing mechanism is easy to work inefficiently, and the too-drum ring is not effectively removed, so that the subsequent processing of the wafer is seriously influenced.
Disclosure of Invention
The present invention is directed to solving the above problems of the prior art and providing a method for removing the tympanum.
The purpose of the invention is realized by the following technical scheme:
the method for removing the Taibo ring comprises the steps that before the Taibo ring is removed from a wafer through a removing mechanism, the Taibo ring is detected through a detection device, and a control device judges whether the Taibo ring is a whole body or not according to a detection signal of the detection device;
when it is determined that the tympanum is not a whole, the control device gives an alarm and controls the removal mechanism not to perform the removal of the tympanum;
when it is determined that the taidrum ring is one piece, the control device controls the removal mechanism to perform removal of the taidrum ring.
Preferably, the detection device is at least one of a distance measuring sensor, an image acquisition device and a fiber scanning probe.
Preferably, before the detection of the detection device, the wafer is adjusted to be coaxial with the ring taking round table through a centering device.
Preferably, during the process of adjusting the wafer by the centering device, air is blown from the lower part of the wafer to the bottom of the wafer.
Preferably, the outer periphery of the ring taking circular table is provided with a lifting table, and the lifting table is provided with a fixing mechanism for fixing an outer frame of the wafer; after the Taizhou ring is determined to be an integral body, the control device firstly controls the top surface of the lifting platform to move downwards from the position flush with the top surface of the ring taking round platform to the position lower than the top surface of the ring taking round platform, and then controls the removing mechanism to remove the Taizhou ring.
Preferably, the removing mechanism performs the removal of the tympanum according to the following steps:
s1, moving a group of removing claws of the removing mechanism to a first position, wherein the group of removing claws is arranged around the periphery of the tympanum and the grabbing plate of each removing claw is positioned below the tympanum;
s2, each removing claw moves towards the Taizhou ring direction until the partial area of the grabbing plate extends into the inner side of the outer circumference of the Taizhou ring;
s3, a group of removing claws synchronously rotate along the outer circumference of the Taiwan hoop in the same direction for a preset stroke;
s4, lifting the group of removing claws to a second position, wherein the grabbing plate is close to or contacted with the bottom surface of the tympanum;
s5, a group of removing claws synchronously and simultaneously rotate along the outer circumference of the Taiwan ring for a preset stroke again;
and S6, continuously lifting the group of removing claws to separate the Taiko ring from the wafer, and then translating the group of removing claws to move the Taiko ring grabbed by the removing claws to the outer side of the wafer.
Preferably, the removing claw is reciprocally rotated by 120 ° to 140 ° along the outer circumference of the taidrum ring.
The method comprises the steps that before the Taibo ring is removed from a wafer through a removing mechanism, the Taibo ring is detected through a detection device, and a control device judges whether the Taibo ring is damaged or not according to a detection signal of the detection device;
when it is determined that the tympanum is broken, the control device gives an alarm and controls the removal mechanism not to remove the tympanum;
when it is determined that the overtravel ring is not broken, the control device controls the removal mechanism to perform removal of the overtravel ring.
The technical scheme of the invention has the advantages that:
the mode that too drum ring integrality detected earlier, removed again is carried out to this scheme adoption, thereby can be effectively according to too the actual conditions of drum ring control the action of removing the mechanism, can report to the police under too the drum ring is not a holistic condition, reminds manual processing to avoid because too the drum ring damages can't remove the problem that leads to the follow-up processing of wafer to carry out smoothly. Meanwhile, the invalid action of the removing mechanism under the abnormal condition of the tympanum can be avoided, and the loss can be reduced in time.
According to the scheme, the bottom of the wafer is blown in the wafer adjusting process, so that the friction force between the wafer and the ring taking round platform and between the wafer and the lifting platform can be effectively reduced, the stress of the wafer in the adjusting process is smaller, and the risk of damage to a too-drum ring during adjustment is greatly reduced.
According to the scheme, after the wafer is fixed, the lifting platform is lowered, so that the film and the Taichou ring can be pre-peeled, and favorable conditions are created for the removal claws to move between the Taichou ring and the film to peel the film and the Taichou ring; the removing claw firstly extends and rotates at a lower height, then is lifted to the height that the grabbing plate is close to the bottom of the Taizhou ring and rotates again, so that the film and the Taizhou ring can be fully peeled off, and a basic condition is created for the complete removal of the Taizhou ring finally.
Drawings
FIG. 1 is a partial schematic view of the apparatus for removing a tympanometric ring of the present invention with the removal pawl in a first position at S1;
FIG. 2 is a top view of the removal robot of the present invention gripping the tympanum;
FIG. 3 is a schematic flow chart of the removal method of the present invention;
FIG. 4 is a schematic diagram of the removal method of the present invention with the processes of wafer position adjustment, lift table lowering, etc.;
FIG. 5 is a schematic diagram of the process of removing the Taiwan hoop by the removing mechanism in the present invention;
FIG. 6 is a schematic view of the invention with the gripper plate of the removal claw extending to a predetermined position below the tera-drum ring;
FIG. 7 is a schematic view of the present invention with the removal claw raised to a position where its gripping plate is in contact with or close to the tambour ring.
Detailed Description
Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.
In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the embodiment, the operator is used as a reference, and the direction close to the operator is a proximal end, and the direction away from the operator is a distal end.
Example 1
The method for removing the tympanogram ring disclosed by the invention is explained in the following by combining with the accompanying drawings, as shown in fig. 1 and fig. 2, and the method for removing the tympanogram ring is realized by adopting various known devices. In this embodiment, the apparatus includes a ring taking circular truncated cone 5, a set of air passages (not shown in the figure) is formed on the ring taking circular truncated cone 5, one end of each air passage extends to the top surface of the ring taking circular truncated cone 5, and the other end of each air passage extends to the bottom surface or the outer circumference of the ring taking circular truncated cone 5 and is connected with a vacuum pumping device (not shown in the figure) and an air supply device (not shown in the figure) through an external pipeline, and the specific structures of the external pipeline, the vacuum pumping device and the air supply device are known technologies and are not described herein.
The outer periphery of the ring taking circular truncated cone 5 is provided with a lifting table 6, and the top surface of the lifting table 6 can move from a height lower than that of the ring taking circular truncated cone 5 to a height flush with that of the top surface of the ring taking circular truncated cone 5; before the wafer is placed on the ring taking round table 5, the ring taking round table 5 is flush with the top surface of the lifting table 6.
The lifting table 6 preferably comprises a circular table coaxial with the ring taking circular table 5 and a structure for driving the circular table to lift, and the structure for driving the circular table to lift is known in the art and is not described herein again. The lifting table 6 is provided with a fixing mechanism 7 for fixing the outer frame of the wafer, the fixing mechanism 7 is a flap-type fixing mechanism, and the flap-type fixing mechanism drives a platen to rotate and press the outer frame of the wafer through an air cylinder or a motor, so that the outer frame of the wafer is fixed on the lifting table 6. Of course, the fixing mechanism 7 may also be of other possible structures, which are not described in detail herein.
The apparatus further includes a removing mechanism, the removing mechanism includes a moving mechanism (not shown in the figure), the moving mechanism may be a known three-axis moving module, a four-axis robot, or a six-axis robot, and the specific structure thereof is known in the art and will not be described herein.
The moving mechanism is connected with a rotating mechanism (not shown in the figure) and drives the rotating mechanism to translate and lift. The rotating mechanism includes a rotating shaft rotatably disposed on the moving structure, a rotating motor for driving the rotating shaft to rotate, and the like, and the specific structure of the rotating mechanism is known in the art and is not described herein. The lower end of the rotating shaft is provided with a removing manipulator 8, as shown in fig. 2, the removing manipulator 8 can adopt an electric or pneumatic three-jaw centering chuck structure or the like, and the removing manipulator 8 is arranged coaxially with the rotating shaft.
Preferably, the removing manipulator 8 may adopt three independent linear moving mechanisms (not shown in the figure) to drive the three removing claws 1 to respectively move and contract to realize the grabbing of the taidrum ring 3, and the specific structure of the linear moving mechanism is a known technology, for example, each removing claw 1 is driven by a linear motor to linearly move, the three linear motors are uniformly circumferentially fixed on a mounting rack, the mounting rack is arranged at the lower end of the rotating shaft and enables the three linear motors to be uniformly distributed on the periphery of the rotating shaft, so that when the rotating shaft rotates, the removing claws 1 on the three linear motors are driven to synchronously revolve around the rotating shaft.
The specific shape of each removing claw 1 can be designed according to the needs, for example, the removing claw 1 can be arranged in an L shape, a T shape or an "Contraband" shape. As shown in fig. 1 and 2, the removing claw 1 is a spool, an axis of the spool is parallel to an axis of the doughnut removing circular truncated cone 5, the spool includes an upper end plate 11, a lower end plate 12 and a connecting column 13 coaxially connected with the upper end plate and the lower end plate, the lower end plate 12 is the grabbing plate, and a distance from an outer circumference of the lower end plate 12 to the connecting column 13 is greater than a width of the doughnut removing ring 3. And the spool is rotatably provided on the linear movement mechanism.
When the removal manipulator 8 is used for grabbing the tympanum 3, 3-6 removal claws 1 clamp the outer circumference of the tympanum 3 so as to realize grabbing. However, when the snare loop 3 is not a single piece (i.e., the snare loop 3 is separate pieces), the snare loop 3 cannot be held by the removal robot 8, and thus cannot be removed.
Thus, as shown in fig. 3, the innovative improvements of the present invention are:
before the taidrum ring 3 is removed from the wafer by the removing mechanism, the taidrum ring 3 is detected by a detecting device (not shown in the figure), and a control device determines whether the taidrum ring is a whole body according to a detection signal of the detecting device;
when it is determined that the overtravel collar 3 is not an integral body, the control device issues an alarm and controls the removal mechanism not to perform the removal of the overtravel collar 3;
when it is determined that the taidrum ring 3 is one piece, the control device controls the removal mechanism to perform removal of the taidrum ring 3.
The integrity of the Taizhou hoop 3 is detected firstly, then the removal control is carried out, so that the action of the removal mechanism can be effectively controlled according to the actual condition of the Taizhou hoop 3, an alarm can be given out under the condition that the Taizhou hoop 3 is not a whole, manual processing is reminded, abnormal conditions are found timely, and the problem that subsequent processing of wafers cannot be effectively carried out due to the fact that the Taizhou hoop 3 is damaged and cannot be removed is solved. While avoiding the ineffective action of the removal mechanism in the case of an anomaly of the tympanum 3. The control mode can also improve the efficiency as much as possible and reduce the alarming frequency.
In performing the pseudodrum ring 3 detection, various known methods may be employed, for example, the control means determines whether the pseudodrum ring 3 is a whole body based on the shape of the outer circumference or the shape of the top surface of the pseudodrum ring 3 detected by the detection means. Taking the example of detecting the shape of the outer circumference of the tera-drum ring 3, if the tera-drum ring 3 is intact, the shape of the outer circumference thereof is a complete and continuous circle; when it is detected that the outer circumference of the tera-drum ring 3 is not a complete and continuous circle or is not a circle, it is considered that the tera-drum ring 3 is broken, but it is not directly confirmed whether the tera-drum ring 3 is a whole. When it is determined that there are 1 defect (e.g., crack) or no defect in the outer circumference of the tera-drum ring 3, the tera-drum ring 3 remains as a whole; when the inspection determines that the outer circumference of the tympanogram 3 has at least two defects (cracks) or is not circular, the tympanogram 3 is highly likely to be divided into a plurality of segments, and it can be confirmed that the tympanogram 3 is not a whole.
In actual detection, the detection device is at least one of a distance measurement sensor, an image acquisition device and an optical fiber scanning probe, and one of the distance measurement sensor, the image acquisition device and the optical fiber scanning probe can be selected for detection, or multiple combinations of the distance measurement sensor, the image acquisition device and the optical fiber scanning probe can be selected for detection.
When the detection device is an image acquisition device, the image acquisition device can be a CCD (charge coupled device), a camera and other known devices arranged above the ring taking circular table 5, and the shooting range of the image acquisition device can cover wafers on the ring taking circular table 5. The diameter of the hoop taking round platform 5 is slightly smaller than the outer diameter of the hoop taking round platform 3, so that the outer circumference of the hoop taking round platform 3 can be located on the outer side of the hoop taking round platform 5, at the moment, an annular light source can be coaxially arranged on the outer circumference of the hoop taking round platform 5, and light of the annular light source irradiates a wafer on the hoop taking round platform 5, so that the image acquisition device acquires clear images to accurately identify the shape of the outer circumference of the hoop taking round platform 3. Of course, when the top surface of the tympanogram 3 is detected by the image acquisition device, the shape of the top surface of the tympanogram 3 can be determined by image analysis so as to determine whether the tympanogram 3 is a whole.
When the detection device is a distance measuring sensor or an optical fiber scanning probe, the distance measuring sensor or the optical fiber scanning probe needs to rotate around the outer circle of the tera-drum ring 3 for realizing corresponding detection, and in order to improve the compactness of the equipment, the distance measuring sensor or the optical fiber scanning probe can also be driven by the rotating shaft of the rotating mechanism to revolve around the rotating shaft. When a distance measuring sensor is adopted, the distance measuring sensor can be arranged on a mounting rack where three linear motors are arranged, the distance measuring sensor is positioned on the outer side of the Taibu ring 3, and the detection head of the distance measuring sensor faces the outer circumference of the Taibu ring 3. When an optical fiber scanning probe is adopted, the optical fiber scanning probe can also be arranged on a mounting rack where three linear motors are arranged, at this time, the axis of the optical fiber scanning probe is parallel to the axis of the Taibo ring 3 on the ring taking round platform 5, and the detection head of the optical fiber scanning probe needs to be aligned to the outer circumference of the Taibo ring 3 and rotate for one circle above the Taibo ring 3 to detect.
When the ranging sensor is used for detection, if the Taizhou ring is a whole body without defects, the distance measured by the ranging sensor in real time to the outer circumference of the Taizhou ring in the rotating process is a fixed value and cannot be changed. If one or more of the measured values of the distance measuring sensor changes obviously when the distance measuring sensor rotates one circle, one or more defects are present on the outer circumference of the Taibo ring 3, so that whether the Taibo ring 3 is a whole body can be determined according to the number of the defects. The specific principle of using the fiber scanning probe for detection is known in the art, and is not described herein.
The Taizhou ring 3 and the ring taking round platform 5 are kept coaxial, and therefore the important premise that the detection precision and subsequent reliable grabbing are guaranteed is achieved. Therefore, as shown in fig. 4, the apparatus further includes a centering device, and before the detection device detects, the wafer is adjusted to a state of being coaxial with the ring taking round table 5 by the centering device, and at this time, the tympanum ring 3 is coaxial with the ring taking round table 5. The centering device can adopt a three-jaw centering structure, and the specific structure thereof is known in the art and is not described in detail herein. During adjustment, the Taizhou ring 3 is held by the three centering claws of the three-claw centering structure, so that adjustment is realized through three-point positioning.
In the process of adjusting the wafer through the centering device, a certain friction force exists between the wafer and the ring taking round table 5 and the lifting table 6, so that the resistance of wafer movement during adjustment is increased, and the Taizhou ring 3 is easily damaged due to clamping force in the adjusting process. Therefore, as shown in fig. 4, when the wafer is adjusted by the centering device, air is blown from the lower part of the wafer to the bottom of the wafer through the air channel on the ring taking circular table 5 so as to slightly float the wafer, which is beneficial to reducing the stress of the too-bulging ring 3 during adjustment, and after the too-bulging ring 3 is adjusted in place, air is stopped being blown to the bottom of the wafer. The wafer is fixed on the ring taking round platform 5 through vacuum adsorption; then, the outer frame of the wafer is pressed and fixed by a fixing mechanism 7 on the lift table 6.
As shown in fig. 1, when the wafer is fixed on the ring taking round table 5 and the lifting table 6, the outer circumference of the solar drum ring 3 is located outside the ring taking round table 5, and in order to facilitate peeling of the solar drum ring 3 and the film 4 of the wafer, after the solar drum ring 3 is determined to be an integral body, the control device firstly controls the lifting table 6 to descend until the top surface thereof is lower than the top surface of the ring taking round table 5, and then controls the removing mechanism to remove the solar drum ring 3.
As shown in fig. 5, the specific process of removing the tympanum 3 by the removing mechanism is as follows:
s1, the moving mechanism drives the removing manipulator 8 to move until the removing manipulator 8 and the workbench are kept coaxial and the group of removing claws 1 on the removing manipulator 8 moves to the first position, at which the group of removing claws 1 is arranged around the periphery of the tai drum ring 3 and the grabbing plate of each removing claw 1 is arranged below the tai drum ring 3, as shown in fig. 1.
S2, the plurality of linear moving mechanisms of the removing robot 8 are activated to drive a group of removing claws 1 to move towards the tai-drum ring 3 to a preset position (the preset position is set according to actual needs and is not limited herein) where a partial area of the grabbing plate of each removing claw 1 extends into the inner side of the outer circumference of the tai-drum ring 3, and during the process that each removing claw 1 moves towards the tai-drum ring 3, the removing claw 1 presses on the film 4 of the wafer and separates the film 4 corresponding to the removing claw 1 from the bonding position of the tai-drum ring 3, as shown in fig. 6.
S3, the rotating mechanism of the removing mechanism drives a set of the removing claws 1 to rotate along the outer circumference of the taidrum ring 3 for a predetermined stroke, and the rotating mechanism rotates each removing claw 1 along the outer circumference of the taidrum ring 3 by 120-140 ° and then rotates in the reverse direction to the original position. During the rotation of each removal claw 1, said removal claw 1 causes the film 4 to tear open from the other bonding points of the tambour ring 3.
S4, the moving mechanism drives the removing robot 8 to lift, so that the group of removing claws 1 is lifted to the second position where the grasping plate is brought into close proximity or contact with the bottom surface of the solar drum ring 3, as shown in fig. 7.
S5, the rotating mechanism drives a set of the removing claws 1 to rotate along the outer circumference of the taidrum ring 3 again for a predetermined stroke, and the rotating mechanism rotates each removing claw 1 120-140 ° along the outer circumference of the taidrum ring 3 and then rotates in the reverse direction to the original position. This rotation can completely separate the thin film 4 which is not peeled off in the first rotation from the Taibo ring 3, and the Taibo ring 3 can be taken away at this time.
And S6, driving the removing manipulator 8 to continuously lift, so that the group of removing claws 1 lift the Taiko ring 3 held by the removing claws upwards to separate the Taiko ring from the wafer, and driving the removing manipulator 8 to translate to move the Taiko ring 3 held by the removing manipulator to the outer side of the wafer and blanking.
Example 2
This embodiment is similar to the above embodiment 1 in the whole process, and the difference is that: in the present embodiment, the first and second electrodes are,
before the Taibo ring 3 is removed from the wafer, the Taibo ring 3 is detected by a detection device, and a control device determines whether the Taibo ring is broken or not according to a detection signal of the detection device;
when it is determined that the tympanum 3 is broken, the control device gives an alarm and controls the removal mechanism not to remove the tympanum 3;
when it is determined that the overtravel ring 3 is not broken, the control device controls the removal mechanism to perform removal of the overtravel ring 3.
That is, in the present embodiment, the alarm process is performed as long as the tai-drum ring 3 is determined to be broken, regardless of whether the broken tai-drum ring 3 is a whole. The mode can furthest ensure the troubleshooting and timely treatment of the abnormal conditions, and avoid the risk of the forced damage of the Taizhou ring 3 when the film 4 and the Taizhou ring 3 are peeled off in the subsequent process under the condition that the Taizhou ring 3 is damaged but still in a whole.
Example 3
The present embodiment is further designed based on the above embodiments 1 and 2 as follows:
a sensor 2 is arranged on each removing claw 1 of the removing mechanical arm 8, the sensor 2 is used for detecting the extending amount of the removing claw 1 extending into the inner side of the outer circumference of the Taiko ring 3, the extending amount is the length of a partial area extending into the inner side of the outer circumference of the Taiko ring 3 when a grabbing plate of the removing claw 1 is positioned below the Taiko ring 3, the sensor 2 is connected with a control device (not shown in the figure), the control device controls a plurality of linear moving mechanisms according to the signal of each sensor 2, so that the removing claw 1 driven by each linear moving mechanism moves to a preset position (at the preset position, the length of the partial area extending into the inner side of the outer circumference of the Taiko ring 3 by the grabbing plate is slightly smaller than the width of the Taiko ring 3, and a connecting column 13 of the I-shaped wheel keeps a distance with the outer circumference of the Taiko ring 3), the distance of movement of each removal claw 1 in the direction of the snare loop 3 may be different at this time.
In such a way, when the Taizhou ring 3 and the removing manipulator 8 are not in a coaxial state, the moving position of each removing claw 1 can be still flexibly and accurately controlled, the problem that the Taizhou ring 3 is in hard contact with the removing claw 1 to cause crushing because the Taizhou ring 3 and the removing manipulator 8 are not coaxial when the moving control of each removing claw 1 is carried out by adopting a set value in the prior art is solved, the stability of ring taking is ensured, the time waste of shutdown and manual treatment caused by the crushing of the Taizhou ring 3 is avoided, and the efficiency of the whole machine is improved.
At this time, the spool (removing claw 1) is provided on the linear moving mechanism so as not to be rotatable. The sensor 2 may be a known sensor such as a correlation sensor, a reflection type photoelectric sensor, a light curtain sensor, a grating sensor, and the like, and for example, a strip-shaped, circular, or square optical fiber sensor, the sensor 2 is disposed on the upper end plate 11, the sensing range 21 of the sensor faces the lower end plate 12, and the sensor can detect an object between the upper end plate 11 and the lower end plate 12, and the sensor 2 is disposed on the upper end plate 11, so that the sensor can effectively detect the amount of insertion, and can be disposed on the lower end plate 12, and the sensor 2 can avoid affecting the action of the grasping plate.
As shown in fig. 1 and 2, the sensing range 21 of the sensor 2 extends from the outer circumference of the lower end plate 12 to the center of the lower end plate 12, and when the lower end plate 12 moves to different positions inside the outer circumference of the tympanum 3, different areas of the sensing range 21 of the sensor 2 sense the tympanum 3, so that the extending amount of the removing claw 1 can be determined. The communication between the sensor 2 and the control device is a known technology, and for example, an optical fiber sensor may be connected to an analog quantity acquisition card through an optical fiber amplifier, the analog quantity acquisition card directly provides a final calculation result to the control device, and the control device performs corresponding control.
Therefore, when each removing claw 1 is moved in the direction of the snare loop 3, the control of the removing claw 1 is performed as follows.
The extending amount of each removing claw 1 of the removing manipulator 8 extending into the inner side of the outer circumference of the Taiko ring 3 is detected in real time by a plurality of sensors 2 and sent to a control device.
The control device compares the insertion amount of each removing claw 1 detected in real time with a set threshold value (the set threshold value is designed according to actual needs and is not limited herein); and controlling a linear moving mechanism for driving each removing claw 1 to move according to the comparison result so as to move each removing claw 1 to a preset position (the preset position is designed according to actual needs as well, and details are not described here).
That is, when the sensor 2 detects that the amount of insertion of the removing claw 1 has not reached the set threshold, the control device controls the linear moving mechanism that drives the removing claw 1 to drive the removing claw 1 to move continuously toward the snare drum 3. When the sensor 2 detects that the extending amount of the removing claw 1 reaches a set threshold value, the control device controls the linear moving mechanism driving the removing claw 1 to stop, and at the moment, the removing claw 1 is located at a preset position.
Further, if the removing robot 8 and the taidrum ring 3 are not in a coaxial state during the rotation of the removing claws 1 along the outer circumference of the taidrum ring 3, the amount of insertion of each removing claw 1 into the inner side of the outer circumference of the taidrum ring 3 may change in real time when each removing claw 1 rotates along the outer circumference of the taidrum ring 3, and thus it is not guaranteed that each removing claw 1 is always located at a predetermined position, which also easily causes damage to the taidrum ring 3. Correspondingly, the extending amount of each removing claw 1 is adjusted in real time during the rotation process of each removing claw 1.
When the sensor 2 detects that the extending amount of the removing claw 1 where the sensor is located is larger than a set threshold value, the control device controls the linear moving mechanism which drives the removing claw 1 to drive the removing claw 1 to move to a preset position in a direction away from the Taizhou ring 3; when the sensor 2 detects that the extending amount of the removing claw 1 where the sensor is positioned is equal to a set threshold value, the control device controls the linear moving mechanism which drives the removing claw 1 not to act; when the sensor 2 detects that the extending amount of the removing claw 1 is smaller than the set threshold value, the control device controls the linear moving mechanism for driving the removing claw 1 to drive the removing claw 1 to move towards the Taizhou ring 3 to reach the preset position.
Example 4
This example further designs the following process on the basis of the above examples 1 to 3: as shown in fig. 3, when the removing claws 1 move towards the drum ring 3, each removing claw 1 moves at a first speed, until the sensor 2 detects the outer circumference (edge) of the drum ring 3, the removing claws 1 move continuously at a second speed until reaching a preset position, wherein the second speed is lower than the first speed, so that the moving efficiency and the control stability of the removing claws 1 can be considered, and the problem that the removing claws 1 contact with the drum ring 3 due to the fact that the moving speed of the removing claws 1 is too high and the control is not timely is avoided.
The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.
Claims (8)
1. The method for removing the Taizhou ring is characterized in that: before the Taizhou ring is removed from the wafer through the removing mechanism, the Taizhou ring is detected through a detection device, and a control device judges whether the Taizhou ring is a whole body or not according to a detection signal of the detection device;
when it is determined that the tympanum is not a whole, the control device gives an alarm and controls the removal mechanism not to perform the removal of the tympanum;
when it is determined that the tera-drum ring is a whole, the control device controls the removal mechanism to perform the removal of the tera-drum ring.
2. The method of claim 1 wherein the method of removing the tera-drum ring comprises: the detection device is at least one of a distance measurement sensor, an image acquisition device and an optical fiber scanning probe.
3. The method of removing a pseudodrum ring according to claim 1, wherein: and before the detection of the detection device, the wafer is adjusted to be in a state of keeping the same axis with the ring taking round platform through the centering device.
4. The method of claim 3, wherein: and in the process of adjusting the wafer by the centering device, blowing air from the lower part of the wafer to the bottom of the wafer.
5. The method of claim 3 wherein: the outer periphery of the ring taking circular truncated cone is provided with a lifting table, and a fixing mechanism for fixing an outer frame of the wafer is arranged on the lifting table; after the Taizhou ring is determined to be an integral body, the control device firstly controls the top surface of the lifting platform to move downwards from the position flush with the top surface of the ring taking round platform to the position lower than the top surface of the ring taking round platform, and then controls the removing mechanism to remove the Taizhou ring.
6. The method of removing the tera-drum ring of any of claims 1-5, wherein: the removing mechanism removes the tympanum according to the following steps:
s1, moving a group of removing claws of the removing mechanism to a first position, wherein the group of removing claws is arranged around the periphery of the tympanum and the grabbing plate of each removing claw is positioned below the tympanum;
s2, each removing claw moves towards the Taizhou ring direction until the partial area of the grabbing plate extends into the inner side of the outer circumference of the Taizhou ring;
s3, a group of removing claws synchronously rotate along the outer circumference of the Taiwan hoop in the same direction for a preset stroke;
s4, lifting the group of removing claws to a second position, wherein the grabbing plate is close to or contacted with the bottom surface of the tympanum;
s5, a group of removing claws synchronously and simultaneously rotate along the outer circumference of the Taiwan ring for a preset stroke again;
and S6, continuously lifting the group of removing claws to separate the Taiko ring from the wafer, and then translating the group of removing claws to move the Taiko ring grabbed by the removing claws to the outer side of the wafer.
7. The method of claim 6, wherein: the removing claw rotates back and forth 120-140 degrees along the outer circumference of the Taiwan ring.
8. The method for removing the Taizhou ring is characterized in that: before the Taizhou ring is removed from the wafer through the removing mechanism, the Taizhou ring is detected through a detection device, and a control device judges whether the Taizhou ring is damaged or not according to a detection signal of the detection device;
when it is determined that the tympanum is broken, the control device gives an alarm and controls the removal mechanism not to remove the tympanum;
when it is determined that the overtravel ring is not broken, the control device controls the removal mechanism to perform removal of the overtravel ring.
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| DE102015115914A1 (en) * | 2014-09-19 | 2016-03-24 | Infineon Technologies Ag | Wafer assembly and method for processing a wafer |
| DE102017206400A1 (en) * | 2016-04-18 | 2017-10-19 | Disco Corporation | PROCESSING METHOD FOR A WAFER |
| JP2018166179A (en) * | 2017-03-28 | 2018-10-25 | 株式会社ディスコ | Cutting device |
| CN110265314A (en) * | 2019-05-29 | 2019-09-20 | 上海晶毅电子科技有限公司 | A kind of TAIKO wafer thin slice test macro |
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| KR102433436B1 (en) * | 2018-07-04 | 2022-08-17 | 삼성전자주식회사 | Substrate processing system, edge rign inspection method in the substrate processing system, and disk-type vision sensor performing for the same |
| US20200321236A1 (en) * | 2019-04-02 | 2020-10-08 | Semiconductor Components Industries, Llc | Edge ring removal methods |
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| DE102015115914A1 (en) * | 2014-09-19 | 2016-03-24 | Infineon Technologies Ag | Wafer assembly and method for processing a wafer |
| DE102017206400A1 (en) * | 2016-04-18 | 2017-10-19 | Disco Corporation | PROCESSING METHOD FOR A WAFER |
| JP2018166179A (en) * | 2017-03-28 | 2018-10-25 | 株式会社ディスコ | Cutting device |
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