CN114249944A - Laser direct forming polypropylene material and preparation method and application thereof - Google Patents
Laser direct forming polypropylene material and preparation method and application thereof Download PDFInfo
- Publication number
- CN114249944A CN114249944A CN202111609067.1A CN202111609067A CN114249944A CN 114249944 A CN114249944 A CN 114249944A CN 202111609067 A CN202111609067 A CN 202111609067A CN 114249944 A CN114249944 A CN 114249944A
- Authority
- CN
- China
- Prior art keywords
- laser direct
- polypropylene material
- laser
- agent
- direct structuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- -1 polypropylene Polymers 0.000 title claims abstract description 66
- 239000004743 Polypropylene Substances 0.000 title claims abstract description 65
- 229920001155 polypropylene Polymers 0.000 title claims abstract description 65
- 239000000463 material Substances 0.000 title claims abstract description 59
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000012190 activator Substances 0.000 claims abstract description 16
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 16
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000002270 dispersing agent Substances 0.000 claims abstract description 8
- 239000012745 toughening agent Substances 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims description 14
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 12
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000012153 distilled water Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000000806 elastomer Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 4
- 239000000314 lubricant Substances 0.000 claims description 4
- 238000001354 calcination Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 238000000967 suction filtration Methods 0.000 claims description 3
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 229960000892 attapulgite Drugs 0.000 claims description 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims description 2
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 2
- 229910052625 palygorskite Inorganic materials 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims description 2
- 150000007970 thio esters Chemical class 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 8
- 239000000126 substance Substances 0.000 abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 230000000704 physical effect Effects 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 15
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Abstract
The invention relates to a laser direct forming polypropylene material and a preparation method and application thereof, belonging to the technical field of materials. The laser direct forming polypropylene material comprises the following components in parts by weight: 70-90 parts of polypropylene, 5-15 parts of laser activator, 10-30 parts of coarsening agent, 1-5 parts of toughening agent, 0.1-1 part of antioxidant and 0.1-1 part of dispersing agent. The laser direct forming polypropylene material has good mechanical properties, and meets the requirements of intelligent wearable equipment on the process and physical properties of the laser direct forming material; the thermal deformation temperature of the laser direct forming polypropylene material exceeds 90 ℃, and the process requirement of chemical nickel plating at the maximum temperature of 82 ℃ can be met.
Description
Technical Field
The invention relates to a laser direct forming polypropylene material and a preparation method and application thereof, belonging to the technical field of materials.
Background
Laser Direct Structuring (LDS) is a production technology of a three-dimensional molded interconnect device (3D-MID) integrating injection molding, laser processing, and electroless plating processes, which uses a computer to control the movement of laser according to the trajectory of a conductive pattern, projects the laser onto the molded three-dimensional plastic device, and activates a circuit pattern within a few seconds. In brief, on a molded plastic support, a metal pattern is directly formed on the support by chemical plating by using a laser technology. The technology is suitable for the fine circuit manufacture of electronic devices such as mobile phone antennas, printed circuit boards, sensors, micro electro mechanical systems, global positioning system mobile terminals and the like.
Polypropylene is the fastest growing general-purpose thermoplastic resin in the world, is second only to polyethylene and polyvinyl fluoride in total, and is the third largest general-purpose resin. Since the industrialization of polypropylene in 1957, it has become the shortest history, the fastest growing and the fastest growing variety of general-purpose thermoplastic resins. The polypropylene has the advantages of simple production process, rich raw material sources, high product transparency, high degree of freedom, small density, easy processing, toughness, flexibility, chemical resistance, good electrical insulation, easy copolymerization, blending, filling, enhancement modification, alloying and the like, is widely applied to the industrial and medical fields of chemical industry, chemical fiber, building, light industry, household appliances, automobiles, packaging and the like, and is closely related to the production and daily life of people. The polypropylene is applied to the laser direct forming technology, and the surface polarity of the polypropylene is low, so that the prepared polypropylene material has poor mechanical property, and the wide application of the laser direct forming polypropylene material is influenced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a laser direct forming polypropylene material with strong coating adhesive force and good uniformity and a preparation method thereof. The laser direct forming polypropylene material has very good mechanical property, and can completely meet the requirements of intelligent wearable equipment on the process and physical properties of the laser direct forming material.
In order to achieve the purpose, the invention adopts the technical scheme that: a laser direct structuring polypropylene material comprises the following components in parts by weight: 70-90 parts of polypropylene, 5-15 parts of laser activator, 10-30 parts of coarsening agent, 1-5 parts of toughening agent, 0.1-1 part of antioxidant and 0.1-1 part of lubricant. The components and the content of the laser direct forming polypropylene material are selected, so that the laser direct forming polypropylene material has excellent mechanical properties.
As a preferred embodiment of the laser direct structuring polypropylene material of the present invention, the polypropylene has a melt index of 230 ℃ 2.16kg < 5g/min and a notched izod impact strength of > 20KJ/m2。
As a preferred embodiment of the laser direct structuring polypropylene material of the present invention, the preparation method of the laser activator comprises the following steps:
(1) dissolving copper chloride in distilled water, and stirring until the solution is blue to obtain a solution A;
(2) dispersing disodium hydrogen phosphate and a dispersing agent in distilled water to obtain a solution B;
(3) and dropwise adding the solution B into the solution A, heating to 80 ℃ at the speed of 10 ℃/min, stirring to react until a blue colloidal object appearing in the solution is changed into light green, performing suction filtration and drying to obtain powder, and calcining the powder at 140-180 ℃ for 2 hours to obtain the laser activator.
As a preferred embodiment of the laser direct structuring polypropylene material of the present invention, the weight ratio of copper chloride to disodium hydrogen phosphate is copper chloride: the disodium hydrogen phosphate is 1:1 to 5: 3.
As a preferable embodiment of the laser direct structuring polypropylene material, the dispersant is polyethylene glycol with the molecular weight of 3500-9000.
As a preferred embodiment of the laser direct structuring polypropylene material of the present invention, the coarsening agent is at least one of kaolin, attapulgite and montmorillonite; the mesh number of the coarsening agent is 800-2500 meshes.
As a preferred embodiment of the laser direct structuring polypropylene material of the present invention, the toughening agent is at least one of SEBS elastomer, EVA elastomer, and POE elastomer; the antioxidant is at least one of hindered phenol antioxidant, hindered amine antioxidant, phosphate antioxidant and thioester antioxidant; at least one of the lubricants ebs, ebs graft and silicone powder.
The invention also provides a preparation method of the laser direct forming polypropylene material, which comprises the following steps:
(1) uniformly mixing a laser activator, a coarsening agent, a toughening agent, an antioxidant and a dispersing agent to obtain powder;
(2) mixing and stirring polypropylene and silicone oil, adding the powder in the step (1), and uniformly stirring and dispersing to obtain a mixture;
(3) and (3) adding the mixture obtained in the step (2) into a double-screw extruder for extrusion to obtain the laser direct forming polypropylene material.
As a preferred embodiment of the preparation method of the laser direct structuring polypropylene material, the extrusion temperature in the step (3) is 190-220 ℃.
The invention also provides application of the laser direct forming polypropylene material or the laser direct forming polypropylene material prepared by the preparation method of the laser direct forming polypropylene material in preparation of intelligent wearable equipment.
Compared with the prior art, the invention has the beneficial effects that:
(1) the laser direct forming polypropylene material disclosed by the invention contains the self-made laser activating agent, and the problems of serious agglomeration and poor dispersibility of the traditional activating agent are solved, so that when the laser direct forming polypropylene material is blended with a polypropylene material, the material processing performance is excellent, the activating agent is uniformly distributed, and the adhesive force and uniformity of a plating layer of the subsequent polypropylene material after plating are improved.
(2) The laser direct forming polypropylene material has good mechanical properties, and meets the requirements of intelligent wearable equipment on the process and physical properties of the laser direct forming material; the thermal deformation temperature of the laser direct forming polypropylene material exceeds 90 ℃, and the process requirement of chemical nickel plating at the maximum temperature of 82 ℃ can be met.
Detailed Description
To better illustrate the objects, aspects and advantages of the present invention, the present invention will be further described with reference to specific examples.
Examples 1 to 8
The compositions of the laser direct structuring polypropylene materials of examples 1-8 are shown in Table 1.
The preparation method of the laser direct forming polypropylene material of the embodiments 1-8 comprises the following steps:
(1) uniformly mixing a laser activator, a coarsening agent, a toughening agent, an antioxidant and a dispersing agent to obtain powder;
(2) mixing and stirring polypropylene and silicone oil, adding the powder in the step (1), and uniformly stirring and dispersing to obtain a mixture;
(3) and (3) adding the mixture obtained in the step (2) into a double-screw extruder for extrusion to obtain the laser direct forming polypropylene material.
The preparation method of the laser activator in the laser direct forming polypropylene material of the embodiments 1-8 comprises the following steps:
(1) dissolving copper chloride in distilled water, and stirring until the solution is blue to obtain a solution A;
(2) dispersing disodium hydrogen phosphate in distilled water to obtain solution B;
(3) and dropwise adding the solution B into the solution A, heating to 80 ℃ at the speed of 10 ℃/min, stirring to react until a blue colloidal object appearing in the solution is changed into light green, performing suction filtration and drying to obtain powder, and calcining the powder at 140-180 ℃ for 2 hours to obtain the laser activator.
In the preparation method of the laser activator in the laser direct structuring polypropylene material, the weight ratio of the copper chloride to the disodium hydrogen phosphate is 3: 2.
TABLE 1
Example 9
This example differs from example 1 only in that the weight ratio of copper chloride to disodium hydrogen phosphate in the laser activator in the laser direct structuring polypropylene material is different, in this example the weight ratio of copper chloride to disodium hydrogen phosphate in the laser activator is 1: 1.
example 10
This example differs from example 1 only in that the weight ratio of copper chloride to disodium hydrogen phosphate in the laser activator in the laser direct structuring polypropylene material is different, in this example the weight ratio of copper chloride to disodium hydrogen phosphate in the laser activator is 5: 3.
examples of effects
Tensile strength, notched izod impact strength and thermal deformation of the laser direct-molded polypropylene materials of examples 1 to 10 were respectively tested, and then the extrusion-molded materials were subjected to injection molding, laser etching and chemical plating, and then evaluated by a Baige test, with the evaluation results shown in Table 2.
The Baige test is carried out according to ASTM D3359-97, and the test method is as follows: 100 squares of 1mm2 were cut on the plane of the sample with the end of a sewing needle, the scratches extended to the surface of the resin, and after washing with a cloth that was thoroughly wetted with methanol (95%), 3M adhesive tape paper (610#) was pressed with a finger, both ends of the adhesive tape paper were grasped and pulled vertically rapidly to peel off, and the operation was performed twice at the same position. Wherein the size of the adhesive tape paper is 15-20mm, and the adhesive tape paper can be judged to be qualified when meeting the ASTM specification requirement of 4B and above. The adhesion grade of the Baige test is generally divided into 6 grades according to the percentage of the area of the falling part of the plating layer to the total area, wherein the grades comprise 0B (the falling part exceeds 65%), 1B (the falling part is 35-65%), 2B (the falling part is 15-35%), 3B (the falling part is 5-15%), 4B (the falling part is less than 5%), 5B (no whole lattice falls off), and the higher the Baige grade is, the better the adhesion of the plating layer is.
TABLE 2
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. The laser direct forming polypropylene material is characterized by comprising the following components in parts by weight: 70-90 parts of polypropylene, 5-15 parts of laser activator, 10-30 parts of coarsening agent, 1-5 parts of toughening agent, 0.1-1 part of antioxidant and 0.1-1 part of lubricant.
2. The laser direct structuring polypropylene material of claim 1, wherein the polypropylene has a melt index of 230 ℃ C. about.2.16 kg < 5g/min and a notched izod impact strength of greater than 20KJ/m2。
3. The laser direct structuring polypropylene material of claim 1, wherein the laser activating agent is prepared by a process comprising the steps of:
(1) dissolving copper chloride in distilled water, and stirring until the solution is blue to obtain a solution A;
(2) dispersing disodium hydrogen phosphate and a dispersing agent in distilled water to obtain a solution B;
(3) and dropwise adding the solution B into the solution A, heating to 80 ℃ at the speed of 10 ℃/min, stirring to react until a blue colloidal object appearing in the solution is changed into light green, performing suction filtration and drying to obtain powder, and calcining the powder at 140-180 ℃ for 2 hours to obtain the laser activator.
4. The laser direct structuring polypropylene material of claim 3, wherein the weight ratio of copper chloride to disodium hydrogen phosphate is copper chloride: the disodium hydrogen phosphate is 1:1 to 5: 3.
5. The laser direct structuring polypropylene material of claim 3, wherein the dispersant is polyethylene glycol having a molecular weight of 3500 to 9000.
6. The laser direct structuring polypropylene material of claim 1, wherein the coarsening agent is at least one of kaolin, attapulgite, and montmorillonite; the mesh number of the coarsening agent is 800-2500 meshes.
7. The laser direct structuring polypropylene material of claim 1, wherein the toughening agent is at least one of SEBS elastomer, EVA elastomer, and POE elastomer; the antioxidant is at least one of hindered phenol antioxidant, hindered amine antioxidant, phosphate antioxidant and thioester antioxidant; the lubricant is at least one of ebs, ebs graft and silicone powder.
8. The method for preparing the laser direct structuring polypropylene material according to any one of claims 1 to 7, comprising the steps of:
(1) uniformly mixing a laser activator, a coarsening agent, a toughening agent, an antioxidant and a dispersing agent to obtain powder;
(2) mixing and stirring polypropylene and silicone oil, adding the powder in the step (1), and uniformly stirring and dispersing to obtain a mixture;
(3) and (3) adding the mixture obtained in the step (2) into a double-screw extruder for extrusion to obtain the laser direct forming polypropylene material.
9. The method for preparing a laser direct structuring polypropylene material as claimed in claim 8, wherein the extrusion temperature in the step (3) is 190-220 ℃.
10. Use of the laser direct structuring polypropylene material according to any one of claims 1 to 7 or the laser direct structuring polypropylene material prepared by the method according to any one of claims 8 to 9 in the preparation of intelligent wearable equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111609067.1A CN114249944A (en) | 2021-12-27 | 2021-12-27 | Laser direct forming polypropylene material and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111609067.1A CN114249944A (en) | 2021-12-27 | 2021-12-27 | Laser direct forming polypropylene material and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114249944A true CN114249944A (en) | 2022-03-29 |
Family
ID=80797950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111609067.1A Pending CN114249944A (en) | 2021-12-27 | 2021-12-27 | Laser direct forming polypropylene material and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114249944A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140255600A1 (en) * | 2011-10-10 | 2014-09-11 | Enthone Inc. | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
| WO2014163242A1 (en) * | 2013-04-02 | 2014-10-09 | Kim Han Joo | Composition for laser direct structuring process |
| WO2015154502A1 (en) * | 2014-04-11 | 2015-10-15 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface, and plastic component |
| US20210130585A1 (en) * | 2017-01-11 | 2021-05-06 | Sabic Global Technologies B.V. | Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom |
| CN112778761A (en) * | 2020-12-08 | 2021-05-11 | 南京聚隆科技股份有限公司 | High-toughness laser direct-forming glass fiber reinforced polyphenylene sulfide composite material and preparation method thereof |
| CN113321866A (en) * | 2020-02-28 | 2021-08-31 | 合肥杰事杰新材料股份有限公司 | Laser direct forming polypropylene material and preparation method thereof |
-
2021
- 2021-12-27 CN CN202111609067.1A patent/CN114249944A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140255600A1 (en) * | 2011-10-10 | 2014-09-11 | Enthone Inc. | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
| WO2014163242A1 (en) * | 2013-04-02 | 2014-10-09 | Kim Han Joo | Composition for laser direct structuring process |
| WO2015154502A1 (en) * | 2014-04-11 | 2015-10-15 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface, and plastic component |
| US20210130585A1 (en) * | 2017-01-11 | 2021-05-06 | Sabic Global Technologies B.V. | Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom |
| CN113321866A (en) * | 2020-02-28 | 2021-08-31 | 合肥杰事杰新材料股份有限公司 | Laser direct forming polypropylene material and preparation method thereof |
| CN112778761A (en) * | 2020-12-08 | 2021-05-11 | 南京聚隆科技股份有限公司 | High-toughness laser direct-forming glass fiber reinforced polyphenylene sulfide composite material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109735060B (en) | Thermoplastic composite material for laser direct forming technology and preparation method thereof | |
| US6537359B1 (en) | Conductive ink or paint | |
| KR102473439B1 (en) | Polyphenylene sulfide resin composition, method for preparing the same and injection molded article prepared therefrom | |
| CN103408887B (en) | ABS/PBT alloy material and preparation method thereof | |
| CN109294220B (en) | Magnetic material-nylon composite material for injection molding and preparation method thereof | |
| CN103450675A (en) | Resin composition having laser direct-structuring function and its preparation method and use | |
| CN111961352A (en) | Laser direct-forming low-warpage LDS composite high polymer material and preparation method thereof | |
| CN102643535A (en) | Modified resin composition and preparation method and application thereof | |
| CN106674784A (en) | Stretchable flexible conductive composite material as well as preparation method and application thereof | |
| CN103694697A (en) | Thermal conducting material capable of selectively depositing metal, preparation method of the material and applications of the material | |
| CN103923449B (en) | The PC/ABS composite of laser direct forming and preparation method and application | |
| CN110283441B (en) | Mesoporous molecular sieve compound laser direct forming material and application thereof | |
| CN114249944A (en) | Laser direct forming polypropylene material and preparation method and application thereof | |
| CN112778661B (en) | High-impact-resistance high-fluidity flame-retardant PVC-ABS alloy material and preparation method thereof | |
| CN113861688A (en) | Low-dielectric polyphenylene sulfide composite material and preparation method thereof | |
| CN103756278A (en) | Engineering plastic applicable to LDS (Laser Direct Structuring) forming process as well as preparation method and application thereof | |
| CN110157109A (en) | A kind of moisture-proof high intensity IC carrier material | |
| CN110951236B (en) | Laser direct forming material based on polyphenyl ether and preparation method thereof | |
| CN111393826A (en) | Graphene-enhanced conductive PC/ABS alloy and preparation method thereof | |
| CN115785584A (en) | Plastic carrier tape material for packaging electronic components and preparation method thereof | |
| WO2023094141A1 (en) | Highly conductive filament for fused deposition modeling | |
| CN108276752A (en) | A kind of heat-proof combustion-resistant PC-PBT alloy materials and preparation method thereof | |
| CN112615105B (en) | Preparation method for battery porous film, battery diaphragm and battery | |
| CN110467811B (en) | Bending-resistant laser direct forming material and preparation method thereof | |
| CN111534075B (en) | Thermoplastic heat-conducting composite material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20240227 |
|
| AD01 | Patent right deemed abandoned |