CN103923449B - The PC/ABS composite of laser direct forming and preparation method and application - Google Patents

The PC/ABS composite of laser direct forming and preparation method and application Download PDF

Info

Publication number
CN103923449B
CN103923449B CN201410135979.3A CN201410135979A CN103923449B CN 103923449 B CN103923449 B CN 103923449B CN 201410135979 A CN201410135979 A CN 201410135979A CN 103923449 B CN103923449 B CN 103923449B
Authority
CN
China
Prior art keywords
laser
direct forming
laser direct
abs
abs composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410135979.3A
Other languages
Chinese (zh)
Other versions
CN103923449A (en
Inventor
郝源增
邓爵安
袁海兵
唐海涛
谯盛元
吴磊
王雷
范木良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGZHOU SUPER-DRAGON ENGINEERING PLASTICS Co Ltd
Original Assignee
GUANGZHOU SUPER-DRAGON ENGINEERING PLASTICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GUANGZHOU SUPER-DRAGON ENGINEERING PLASTICS Co Ltd filed Critical GUANGZHOU SUPER-DRAGON ENGINEERING PLASTICS Co Ltd
Priority to CN201410135979.3A priority Critical patent/CN103923449B/en
Publication of CN103923449A publication Critical patent/CN103923449A/en
Application granted granted Critical
Publication of CN103923449B publication Critical patent/CN103923449B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

The invention belongs to laser direct forming field of compound material, disclose one can laser direct forming, and there is the PC/ABS composite of superior thermal oxygen aging performance and its preparation method and application.This composite comprises the component of following mass fraction: PC/ABS base material 60~80%;Halogen-free flame retardants 5~15%;Laser activation particle 5~15%;Heat conduction inorganic filler 0~10%;Other additives 0~5%;Laser activation particle is obtained from following methods: drip copper nanoparticle, initiator, the alcoholic solution of silane coupler in the forward microemulsion that acrylic ester monomer/Dodecyl trimethyl ammonium chloride/water forms, reacting by heating, filter, be dried, obtain laser activation particle.Metallic copper is modified by the present invention by microemulsion polymerization method, it is thus achieved that both had good induced with laser plating performance, has again the PC/ABS composite of the laser direct forming of excellent thermo oxidative aging performance.

Description

The PC/ABS composite of laser direct forming and preparation method and application
Technical field
The invention belongs to laser direct forming technical field of composite materials, can be connected into by laser straight particularly to one Type, and there is the PC/ABS composite of superior thermal oxygen aging performance and its preparation method and application.
Background technology
3D-molding interconnection element (Three-dimensional moulded interconnect device, It is 3D-MID) a kind of making circuit pattern on the plastic basis material of injection mo(u)lding, thus by common Electric interconnection function, supporting and the safeguard function of circuit board is implemented on a device, forms solid, collection Dynamo-electric function is in the circuit carrier of one.Compared with traditional wiring board production technology, 3D-molds interconnector Part production technology has speed of production faster, and flow process is simpler, and cost is more controlled, and application is broader Feature.Such as, using the sensor that laser direct structuring technique (LDS) manufactures, minimum conductor width can Reaching 100~200 μm, between minimum line, width is up to 100 μm, and this not only decreases the quantity of components and parts, also Reach save space and alleviate the purpose of weight.At present, the antenna that laser direct structuring technique manufactures is used It is widely used in automobile, on the mobile terminal such as smart mobile phone, notebook computer.
Laser direct structuring technique is to be irradiated to laser containing laser-sensitive additive under the control of the computer Plastic part on, produce the circuit pattern of activation, this activating area can be by without the side of electrochemical plating Method conductive metal deposition, thus realize producing the technical matters of conductive pattern on three-dimensional plastic product.Profit The technique making molding interconnection element of laser direct forming mainly includes three below step: resin base material Injection mo(u)lding, the Laser Processing of LDS element and circuit pattern metallization.This technical process can swash The exploitation of the polymeric substrate of light straight forming is one of the most key part.Therefore, design and prepare tool The polymer composites having laser direct forming performance has extremely important industrial value.
CN1198737C reports a kind of Merlon aliphatic radical material and has the Cupric chromate(III). of spinel structure As laser activation agent can laser direct forming material.With iraser, base material is carried out Selective activation After, by controlled circuit pattern can be formed at activating area without the method for electrochemical plating.
CN103450675A discloses a kind of resin combination with laser direct forming function: resin base Body 15~60wt%;Heat filling 30~70wt%;Laser-sensitive additive 5~12wt%;And other Additive 0~15wt%.Laser-sensitive additive therein be chemical general formula be XY2O4Copper-containing metal oxygen Compound.
Above-mentioned document all it should be particularly mentioned and utilize the oxide of copper or copper organometallic complex as laser Activating reagent.Under the corrasion of laser, polymeric substrate can occur melted or degraded depression, makes laser The nano metal simple substance that activating reagent restores is deposited on etching surface.Using nano metal simple substance as nucleus, Induction-chemical deposition conducting metal, can prepare the circuit pattern of μm level.But, on the one hand, due to this A little metallic copper compounds are susceptible to decompose in the course of processing, and the elemental copper of generation is enriched in product surface, Have a strong impact on the effect without electrochemical plating;Still further aspect, easily causes polymeric material due to copper compound Thermo-oxidative ageing (Degradation and Stabilization of Polymer, Applied Science and Publishers LTD London, 1975,90-92).In above-mentioned composite-material formula, metallic copper element with There is directly contact between polymeric substrate, make polymeric substrate be easy in the catalysis of copper compound and issue heat Oxygen aging reacts, and affects the service life of goods.Therefore, preparation one has good mechanics and resistance to ag(e)ing Can the polymer composites of laser direct forming be a very important research topic.
Summary of the invention
In order to overcome the shortcoming of above-mentioned prior art with not enough, the primary and foremost purpose of the present invention is to provide one to swash PC/ABS(polycarbonate/acrylonitrile-SB the alloy of light straight forming) composite wood Material, this composite has good induced with laser plating performance and excellent thermo oxidative aging performance.
Another object of the present invention is to provide the PC/ABS composite of a kind of above-mentioned laser direct forming Preparation method.
Still a further object of the present invention is that the PC/ABS composite providing above-mentioned laser direct forming is at electronics Application in the fields such as electrical equipment, Aero-Space, transportation, Industry Control.
The purpose of the present invention is realized by following proposal:
The PC/ABS composite of a kind of laser direct forming, comprises the component of following mass fraction:
Described laser activation particle is prepared by following methods:
Drip in the forward microemulsion of acrylic ester monomer/Dodecyl trimethyl ammonium chloride/water composition and receive Rice copper powder, initiator, the alcoholic solution of silane coupler, reacting by heating, filters, is dried, obtain laser and live Change particle.
Dodecyl trimethyl ammonium chloride, acrylic ester monomer, the mass ratio of water in described forward microemulsion For 5:30:100.
Amount is acrylic ester monomer quality the 1~5% of copper nanoparticle used.
Amount is acrylic ester monomer quality the 1~2% of initiator used.
Amount is acrylic ester monomer quality the 1~5% of silane coupler used.
Described initiator is azo-initiator, preferably azo isobutyronitrile.
Described silane coupler is preferably isobutyl group triethoxy silicone couplet.
The solvent of described alcoholic solution is methanol, ethanol or isopropanol.
In described alcoholic solution, the concentration of copper nanoparticle is 10~30wt%.
Described reacting by heating refers to react 5h at 60~90 DEG C.
Described acrylic ester monomer is preferably acrylic acid methyl ester., methyl methacrylate, methacrylic acid Propyl ester, butyl methacrylate, isobutyl methacrylate, sec-butyl acrylate, tert-butyl acrylate, N-propyl, cyclohexyl acrylate, lauryl acrylate, 2-EHA, acrylic acid At least one in 2-hydroxy methacrylate, acrylic acid 2-hydroxy propyl ester and methacrylic acid.More preferably acrylic acid At least one in methyl ester and methyl methacrylate.
The present invention by micro-emulsion polymerization preparation obtain laser activation particle, on the one hand, utilize acrylate with The compatibility of base material is good, improves laser activation particle in PC/ABS(polycarbonate/acrylonitrile-styrene-fourth Diene copolymers alloy) dispersibility in base material;On the other hand, by surface modification can completely cut off metallic copper with The directly contact of polymeric substrate, reduces the thermo-oxidative ageing reaction of the polymeric substrate of metallic copper catalysis, improves The life-span of product.
In the PC/ABS composite of described laser direct forming, the addition of laser activation particle is preferably 7~10wt%.When laser activation particle addition is too low, need electroplating time long, circuit and base material Adhesion is poor;When laser activation particle addition is too high, plating process easily causes the crackings such as excessive plating Phenomenon, affects the electronic apparatus performance of goods.
In the PC/ABS composite of described laser direct forming, the poly-carbonic acid of PC(in PC/ABS base material Ester) weight hundred parts be 50~90% than content, preferably 60~70%.
Described halogen-free flame retardants is preferably triphenylphosphine compound, three tertiary butyl phosphine compounds, tar acid phosphorus Acid esters, alkyl diaryl phosphate, trialkyl phosphates, biphosphonate, carbon phosphate ester, chlorinated phosphate With at least one in phosphoramidate, more preferably triphenylphosphine compound and three tertiary butyl phosphine compounds At least one.
The heat conduction inorganic filler that the present invention uses is preferably glass fibre, titanium dioxide, Pulvis Talci, sericite With at least one in Kaolin, more preferably glass fibre.
Other additives selected by the present invention include: at least one in releasing agent, antioxidant and compatilizer.
In order to the object of the invention is better achieved, releasing agent is preferably pentaerythritol stearate;Antioxidant is excellent Elect three [2,4-di-t-butyl] phenyl phosphites as;Compatilizer is preferably ABS-g-MAH.
Present invention also offers the preparation method of the PC/ABS composite of above-mentioned laser direct forming, including Following steps:
60~80wt%PC/ABS base materials, 5~15wt% halogen-free flame retardants, 5~15wt% laser activation grain Son, 0~other additive mix homogeneously of 5wt%, add in screw extruder, and 0~10wt% heat conduction is inorganic fills out Expect that, by entering the addition of glass mouth, through screw extruder extruding pelletization, the PC/ABS obtaining laser direct forming is combined Material.
Described mix homogeneously preferably stirs in homogenizer.
Each section of temperature of described extruding pelletization is 230~260 DEG C.
Preferably, the main-machine screw rotating speed of described screw extruder is 250~330r/min, hopper feed spiral shell The rotating speed of bar is 24~35r/min.
Laser activation particle in the PC/ABS composite of laser direct forming of the present invention is multiple to PC/ABS Condensation material plays an important role in laser processing procedure.The goods table that laser beam is made at composite Face is inswept, material matrix is ablated off, and forms rough region, can increase electroless metal layer with The adhesion strength of resin matrix;On the other hand, laser activation particle, under the effect of laser, restores metal Granule is attached on rough matrices of composite material, follow-up without in electrochemical plating, and these metallic particles Play the effect of active centre, promote the metal ion in chemical plating fluid to deposit selectively, formed Metallic film.
The PC/ABS composite Laser Processing of the laser direct forming of the present invention is functional, and heat-resisting oxygen Ageing properties is excellent, can be applicable in the fields such as electronic apparatus, Aero-Space, transportation, Industry Control. It is particularly well-suited to the product of surface mounting technology, is mainly used in electric part field.Pass through laser Then electric elements are directly sealed by straight forming Technology design and prepare the electric elements with difference in functionality It is contained on circuit, this process simplification circuit production process of material, greatly improves the space profit of product By rate.Such as the application on smart mobile phone, it is possible to realize circuit board of mobile phone system melting with sheathing material is one Body, it is achieved product is more frivolous, dispels the heat more efficient, the effect in extending cell phone service life.
The mechanism of the present invention is:
The present invention utilizes acrylate be modified metallic copper by micro-emulsion polymerization and modify, it is thus achieved that at base Dispersibility more preferable laser activation particle in material, and by the modification to metallic copper, completely cut off metallic copper and be polymerized The directly contact of thing base material, reduces the thermo-oxidative ageing reaction of the polymeric substrate of metallic copper catalysis, improves product Life-span, it is thus achieved that both there is good induced with laser plating performance, there is again excellent thermo oxidative aging performance The PC/ABS composite of laser direct forming.
The present invention, relative to prior art, has such advantages as and beneficial effect:
(1) in the PC/ABS composite of the laser direct forming of the present invention laser activation particle due to warp Acrylate modified, there is more preferable dispersibility in the substrate, improve the induced with laser plating of composite Performance.
(2) in the PC/ABS composite of the laser direct forming of the present invention laser activation particle due to warp Acrylate modified, reduce the thermo-oxidative ageing reaction of the polymeric substrate of metallic copper catalysis, improve heat resistanceheat resistant oxygen Ageing properties, improves the life-span of product.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described in further detail, but embodiments of the present invention do not limit In this.
In following example, in the PC/ABS composite of laser direct forming, the content of PC is 70%, tool The processing mode of body is: will be by the load weighted material of formula (except heat conduction inorganic filler) in following each embodiment Join stirring 10min, the above-mentioned material (heat conduction inorganic filler that then will stir in homogenizer It is directly added into by the glass mouth that adds of double screw extruder) to join draw ratio L/D be 38:1, screw diameter For in the hopper of the parallel double-screw extruder of 30mm, set the extruder each section of temperature from hopper to die head Degree is respectively (totally six district): 230 DEG C, 230 DEG C, 240 DEG C, 245 DEG C, 250 DEG C, 260 DEG C, main frame Screw speed is 300r/min, and the rotating speed of hopper feed screw rod is 28r/min, and then by material blended melting Extrusion;Above-mentioned grain bar cools down through tank, enters pelleter and carry out pelletizing after air-drying, and injection obtains swashing The PC/ABS composite of light straight forming.
Embodiment 1: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 74wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle 5wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] benzene Base phosphite ester) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance Press and the reactor of Dropping funnel, thermometer adds the acrylic ester monomer (methyl methacrylate configured Ester) the forward microemulsion 1L of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/ The mass ratio of Dodecyl trimethyl ammonium chloride/water is 30:5:100.Under conditions of room temperature is stirred vigorously, slowly Dropping copper nanoparticle concentration is the 3% of 30wt%(acrylic ester monomer quality), (azo is different for initiator Butyronitrile, the 1% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, propylene The 1% of esters of gallic acid monomer mass) ethanol solution.After dropping, it is warming up to 80 DEG C of reaction 5h, cold But, sucking filtration, it is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 48KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.93;Dissipation factor: 0.007;Metallic film Thickness 7.2 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 82%, impact strength conservation rate 84%.
Embodiment 2: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 69wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle 10wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] benzene Base phosphite ester) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance Press and the reactor of Dropping funnel, thermometer adds the acrylic ester monomer (methyl methacrylate configured Ester) the forward microemulsion 1L of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/ The mass ratio of Dodecyl trimethyl ammonium chloride/water is 30:5:100.Under conditions of room temperature is stirred vigorously, slowly Dropping copper nanoparticle concentration is the 1% of 20wt%(acrylic ester monomer quality), (azo is different for initiator Butyronitrile, the 1% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, propylene The 1% of esters of gallic acid monomer mass) methanol solution.After dropping, it is warming up to 80 DEG C of reaction 5h, cold But, sucking filtration, it is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 47KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.93;Dissipation factor: 0.007;Metallic film Thickness 7.8 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 80%, impact strength conservation rate 82%.
Embodiment 3: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 64wt%, halogen-free flame retardants selects Reofos TPP(Great Lakes Chemical) 10wt%, Laser activation particle 15wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] phenyl phosphorous Acid esters) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance Press and the reactor of Dropping funnel, thermometer adds the acrylic ester monomer (methacrylic acid third configured Ester) the forward microemulsion 1L of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/ The mass ratio of Dodecyl trimethyl ammonium chloride/water is 30:5:100.Under conditions of room temperature is stirred vigorously, slowly Dropping copper nanoparticle concentration is the 5% of 20wt%(acrylic ester monomer quality), (azo is different for initiator Butyronitrile, the 2% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, propylene The 5% of esters of gallic acid monomer mass) aqueous isopropanol.After dropping, it is warming up to 80 DEG C of reaction 5h, Cooling, sucking filtration, it is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 40KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.92;Dissipation factor: 0.007;Metallic film Thickness 8.7 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 80%, impact strength conservation rate 85%.
Embodiment 4: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 69wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle 10wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] benzene Base phosphite ester) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance Press and the reactor of Dropping funnel, thermometer adds acrylic ester monomer (the methacrylic acid fourth configured Ester) the forward microemulsion 1L of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/ The mass ratio of Dodecyl trimethyl ammonium chloride/water is 30:5:100.Under conditions of room temperature is stirred vigorously, slowly Dropping copper nanoparticle concentration is the 3% of 30wt%(acrylic ester monomer quality), (azo is different for initiator Butyronitrile, the 1% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, propylene The 1% of esters of gallic acid monomer mass) ethanol solution.After dropping, it is warming up to 80 DEG C of reaction 5h, cold But, sucking filtration, it is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 35KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.92;Dissipation factor: 0.007;Metallic film Thickness 8.4 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 79%, impact strength conservation rate 85%.
Embodiment 5: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 69wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle 10wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] benzene Base phosphite ester) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance (methacrylic acid is different to press the acrylic ester monomer that in the reactor of Dropping funnel, thermometer, addition has configured Butyl ester) the forward microemulsion 1 of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/ The mass ratio of Dodecyl trimethyl ammonium chloride/water is 30:5:100.Under conditions of room temperature is stirred vigorously, slowly Dropping copper nanoparticle concentration is the 1.5% of 30wt%(acrylic ester monomer quality), initiator (azo Isopropyl cyanide, the 1% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, third The 1% of olefin(e) acid esters monomer quality) ethanol solution.After dropping, it is warming up to 80 DEG C of reaction 5h, Cooling, sucking filtration, it is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 32KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.92;Dissipation factor: 0.007;Metallic film Thickness 8.6 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 79%, impact strength conservation rate 83%.
Embodiment 6: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 69wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle 10wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] benzene Base phosphite ester) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance Press and the reactor of Dropping funnel, thermometer adds the acrylic ester monomer (tert-butyl acrylate) configured The forward microemulsion 1L of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/12 The mass ratio of alkyl trimethyl ammonium bromide/water is 30:5:100.Under conditions of room temperature is stirred vigorously, it is slowly added dropwise Copper nanoparticle concentration is the 1.5% of 20wt%(acrylic ester monomer quality), initiator (azo isobutyl Nitrile, the 2% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, acrylic acid The 1% of esters monomer quality) ethanol solution.After dropping, it is warming up to 80 DEG C of reaction 5h, cools down, Sucking filtration, is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 37KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.97;Dissipation factor: 0.007;Metallic film Thickness 7.8 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 76%, impact strength conservation rate 78%.
Embodiment 7: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 69wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle 10wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] benzene Base phosphite ester) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance Press and the reactor of Dropping funnel, thermometer adds the acrylic ester monomer (methyl methacrylate configured Ester) the forward microemulsion 1L of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/ The mass ratio of Dodecyl trimethyl ammonium chloride/water is 30:5:100.Under conditions of room temperature is stirred vigorously, slowly Dropping copper nanoparticle concentration is the 1.5% of 10wt%(acrylic ester monomer quality), initiator (azo Isopropyl cyanide, the 1% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, third The 3% of olefin(e) acid esters monomer quality) ethanol solution.After dropping, it is warming up to 80 DEG C of reaction 5h, Cooling, sucking filtration, it is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 38KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.92;Dissipation factor: 0.007;Metallic film Thickness 7.4 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 78%, impact strength conservation rate 81%.
Embodiment 8: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 69wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle 10wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] benzene Base phosphite ester) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance Press and the reactor of Dropping funnel, thermometer adds the acrylic ester monomer (methyl methacrylate configured Ester) the forward microemulsion 1L of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/ The mass ratio of Dodecyl trimethyl ammonium chloride/water is 30:5:100.Under conditions of room temperature is stirred vigorously, slowly Dropping copper nanoparticle concentration is the 5% of 30wt%(acrylic ester monomer quality), (azo is different for initiator Butyronitrile, the 1% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, propylene The 5% of esters of gallic acid monomer mass) ethanol solution.After dropping, it is warming up to 80 DEG C of reaction 5h, cold But, sucking filtration, it is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 36KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.92;Dissipation factor: 0.007;Metallic film Thickness 7.6 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 77%, impact strength conservation rate 80%.
Embodiment 9: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 69wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle 10wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] benzene Base phosphite ester) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance Press and the reactor of Dropping funnel, thermometer adds the acrylic ester monomer (acrylic acid methyl ester .) configured The forward microemulsion 1L of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/12 The mass ratio of alkyl trimethyl ammonium bromide/water is 30:5:100.Under conditions of room temperature is stirred vigorously, it is slowly added dropwise Copper nanoparticle concentration is the 1.5% of 30wt%(acrylic ester monomer quality), initiator (azo isobutyl Nitrile, the 1% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, acrylic acid The 1% of esters monomer quality) ethanol solution.After dropping, it is warming up to 60 DEG C of reaction 5h, cools down, Sucking filtration, is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 35KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.92;Dissipation factor: 0.007;Metallic film Thickness 7.9 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 81%, impact strength conservation rate 85%.
Embodiment 10: the preparation of the PC/ABS composite of laser direct forming
PC/ABS alloy 69wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle 10wt%;Glass fibre 10wt%;Antioxidant (three [2,4-di-t-butyl] benzene Base phosphite ester) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
The preparation of described laser activation particle: under nitrogen atmosphere, equipped with agitator, reflux condensing tube, perseverance Press and the reactor of Dropping funnel, thermometer adds acrylic ester monomer (the methacrylic acid fourth configured Ester) the forward microemulsion 1L of/Dodecyl trimethyl ammonium chloride/water composition, wherein acrylic ester monomer/ The mass ratio of Dodecyl trimethyl ammonium chloride/water is 30:5:100.Under conditions of room temperature is stirred vigorously, slowly Dropping copper nanoparticle concentration is the 1.5% of 30wt%(acrylic ester monomer quality), initiator (azo Isopropyl cyanide, the 1% of acrylic ester monomer quality), silane coupler (isobutyl group triethoxysilicane, third The 1% of olefin(e) acid esters monomer quality) ethanol solution.After dropping, it is warming up to 80 DEG C of reaction 3h, Cooling, sucking filtration, it is dried to obtain laser activation particle.
Test result shows: notch impact strength is tested: 36KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.92;Dissipation factor: 0.007;Metallic film Thickness 7.4 μm, hundred lattice test metallic films come off area < 5%;The thermo oxidative aging performance test of material: Stretching strength retentivity 78%, impact strength conservation rate 83%.
Comparative example
PC/ABS alloy 79wt%, halogen-free flame retardants selects Reofos TPP(triphenylphosphine compound) 10 Wt%, laser activation particle addition 0wt%;Glass fibre 10wt%;Antioxidant (three [the tertiary fourths of 2,4-bis- Base] phenyl phosphites) 0.5wt%, compatilizer (ABS-g-MAH) 0.5wt%.
Test result shows: notch impact strength is tested: 46KJ/m2;Flame retardant test: thick at 1.6mm Degree meets fire-retardant UL94V-0 grade;Relative permitivity: 2.95;Dissipation factor: 0.007;Resisting of material Thermal-oxidative aging property is tested: stretching strength retentivity 83%, impact strength conservation rate 85%;Laser ablation After can not carry out without electrochemical plating.
In above-described embodiment, the method for test is: the simple beam impact strength of material is carried out by ISO179, examination Sample ruler cun 80 × 6 × 4mm, notch depth is 1/3rd of sample thickness;The fire resistance test of material Standard is that GB2409-84 uses vertical combustion;Relative permitivity and dissipation factor testing standard are ASTM D150.The test of thickness without electrochemical plating of material, i.e. test LDS material deposit in without electrochemical plating Thickness of metal film, requires in industry that film thickness is in being distributed in 7~12 μm qualified.Hundred lattice tests, On metallic film, i.e. cut the grid of 100 1mm × 1mm with cutter, stick with 3M610 adhesive tape Place vertical pull-up after about 2min after patch, the area that comes off of metallic film < 5% be qualified;Material Thermo oxidative aging performance is tested according to GB/T7141-2008, prepared plastics carries out artificial accelerated aging real Test (90 DEG C, 500h), and measure the hot strength before and after this plastic artificial's accelerated ageing, cantilever beam respectively Notch impact strength.
From above-mentioned test result, the PC/ABS composite wood of the laser direct forming that the present invention prepares Material can realize laser direct forming, and has good heatproof air aging performance and physical property, meets industry The needs produced.
Above-described embodiment is the present invention preferably embodiment, but embodiments of the present invention are not by above-mentioned reality Execute the restriction of example, the change made under other any spirit without departing from the present invention and principle, modification, Substitute, combine, simplify, all should be the substitute mode of equivalence, within being included in protection scope of the present invention.

Claims (10)

1. the PC/ABS composite of a laser direct forming, it is characterised in that comprise following quality and divide The component of number:
Described laser activation particle is prepared by following methods:
Drip in the forward microemulsion of acrylic ester monomer/Dodecyl trimethyl ammonium chloride/water composition and receive Rice copper powder, initiator, the alcoholic solution of silane coupler, reacting by heating, filters, is dried, obtain laser and live Change particle.
The PC/ABS composite of laser direct forming the most according to claim 1, its feature exists In: Dodecyl trimethyl ammonium chloride, acrylic ester monomer, the mass ratio of water in described forward microemulsion For 5:30:100.
The PC/ABS composite of laser direct forming the most according to claim 1, its feature exists In: the amount of copper nanoparticle used is the 1~5% of acrylic ester monomer quality;The amount of initiator used is third The 1~2% of olefin(e) acid esters monomer quality;The amount of silane coupler used is acrylic ester monomer quality 1~5%.
The PC/ABS composite of laser direct forming the most according to claim 1, its feature exists In: in described alcoholic solution, the concentration of copper nanoparticle is 10~30wt%;Described reacting by heating refers at 60~90 DEG C Reaction 5h.
The PC/ABS composite of laser direct forming the most according to claim 1, its feature exists In: described acrylic ester monomer be acrylic acid methyl ester., methyl methacrylate, propyl methacrylate, Butyl methacrylate, isobutyl methacrylate, sec-butyl acrylate, tert-butyl acrylate, acrylic acid N-propyl, cyclohexyl acrylate, lauryl acrylate, 2-EHA, acrylic acid 2-hydroxyl At least one in ethyl ester and acrylic acid 2-hydroxy propyl ester.
The PC/ABS composite of laser direct forming the most according to claim 1, its feature exists In: described halogen-free flame retardants be triphenylphosphine compound, three tertiary butyl phosphine compounds, tar acid phosphate ester, Alkyl diaryl phosphate, trialkyl phosphates, biphosphonate, carbon phosphate ester, chlorinated phosphate and amino At least one in phosphate ester;Described heat conduction inorganic filler be glass fibre, titanium dioxide, Pulvis Talci, At least one in sericite and Kaolin;Described initiator is azo-initiator;Described other add Adding agent is at least one in releasing agent, antioxidant and compatilizer.
The PC/ABS composite of laser direct forming the most according to claim 1, its feature exists In: described acrylic ester monomer is at least one in acrylic acid methyl ester. and methyl methacrylate;Institute The halogen-free flame retardants stated is at least one in triphenylphosphine compound and three tertiary butyl phosphine compounds;Described Initiator is azo isobutyronitrile;Described silane coupler is isobutyl group triethoxy silicone couplet;Described Heat conduction inorganic filler is glass fibre.
8. the PC/ABS composite wood according to the laser direct forming described in any one of claim 1~7 The preparation method of material, it is characterised in that comprise the following steps:
60~80wt%PC/ABS base materials, 5~15wt% halogen-free flame retardants, 5~15wt% laser activation grain Son, 0~other additive mix homogeneously of 5wt%, add in screw extruder, and 0~10wt% heat conduction is inorganic fills out Expect that, by entering the addition of glass mouth, through screw extruder extruding pelletization, the PC/ABS obtaining laser direct forming is combined Material.
The preparation method of the PC/ABS composite of laser direct forming the most according to claim 8, It is characterized in that: each section of temperature of described extruding pelletization is 230~260 DEG C.
10. exist according to the PC/ABS composite of the laser direct forming described in any one of claim 1~7 Application in electronic apparatus, Aero-Space, transportation, Industry Control.
CN201410135979.3A 2014-04-04 2014-04-04 The PC/ABS composite of laser direct forming and preparation method and application Active CN103923449B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410135979.3A CN103923449B (en) 2014-04-04 2014-04-04 The PC/ABS composite of laser direct forming and preparation method and application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410135979.3A CN103923449B (en) 2014-04-04 2014-04-04 The PC/ABS composite of laser direct forming and preparation method and application

Publications (2)

Publication Number Publication Date
CN103923449A CN103923449A (en) 2014-07-16
CN103923449B true CN103923449B (en) 2016-08-24

Family

ID=51141857

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410135979.3A Active CN103923449B (en) 2014-04-04 2014-04-04 The PC/ABS composite of laser direct forming and preparation method and application

Country Status (1)

Country Link
CN (1) CN103923449B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104151771A (en) * 2014-09-01 2014-11-19 苏州卓越工程塑料有限公司 Heat-conducting injection material
CN104387738B (en) * 2014-11-19 2016-08-17 东莞市三条化成实业有限公司 A kind of preparation method of the laser powder of white laser straight forming material
TWI507459B (en) * 2015-02-12 2015-11-11 Taiflex Scient Co Ltd Resin composition capable of forming metal circuit
CN105504745B (en) * 2015-12-25 2018-07-27 金发科技股份有限公司 A kind of polycarbonate composite material
CN105514601A (en) * 2015-12-31 2016-04-20 昆山骅盛电子有限公司 Fin-style vehicular antenna and method for producing same
CN106883580A (en) * 2017-04-07 2017-06-23 深圳市华盈新材料有限公司 Laser direct forming PC composites and its preparation technology

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101124517A (en) * 2004-11-25 2008-02-13 东京应化工业株式会社 Photosensitive resin composition and photosensitive dry film by the use thereof
CN102911491A (en) * 2012-11-19 2013-02-06 邓文 Thermoplastic composition, preparation method and application thereof
CN103450675A (en) * 2012-05-31 2013-12-18 金发科技股份有限公司 Resin composition having laser direct-structuring function and its preparation method and use
WO2014041527A1 (en) * 2012-09-17 2014-03-20 Sabic Innovative Plastics Ip B.V. Laser direct structuring materials with improved plating performance and acceptable mechanical properties

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101124517A (en) * 2004-11-25 2008-02-13 东京应化工业株式会社 Photosensitive resin composition and photosensitive dry film by the use thereof
CN103450675A (en) * 2012-05-31 2013-12-18 金发科技股份有限公司 Resin composition having laser direct-structuring function and its preparation method and use
WO2014041527A1 (en) * 2012-09-17 2014-03-20 Sabic Innovative Plastics Ip B.V. Laser direct structuring materials with improved plating performance and acceptable mechanical properties
CN102911491A (en) * 2012-11-19 2013-02-06 邓文 Thermoplastic composition, preparation method and application thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
《金属粉末选择性激光烧结技术研究进展》;任乃飞;张福周等;《机械设计与制造》;20100208(第2期);第202页 *
《高分子材料在选择性激光烧结中的应用》;闫春泽等;《高分子材料科学与工程》;20100731;第26卷(第7期);第171页 *

Also Published As

Publication number Publication date
CN103923449A (en) 2014-07-16

Similar Documents

Publication Publication Date Title
CN103923449B (en) The PC/ABS composite of laser direct forming and preparation method and application
US10546665B2 (en) Resin composition for high dielectric constant materials, molded article containing same, and master batch for coloring
CN101845197B (en) High-performance halogen-free flame retardant ABS modified resin and preparation method thereof
CN109486155B (en) Graphene modified halogen-free flame-retardant PC/ABS material and preparation method thereof
CN103450675A (en) Resin composition having laser direct-structuring function and its preparation method and use
CN109735060A (en) A kind of thermoplastic composite and preparation method thereof for laser direct structuring technique
CN106928682B (en) A kind of laser direct forming material and preparation method thereof with good comprehensive performance
CN103694697B (en) A kind of Heat Conduction Material with selectivity deposition metal and preparation method and application
CN104277443A (en) Preparation method of heat-resistant halogen-free flame-retardant PC (polycarbonate)/ABS
CN109575554A (en) High finished product rate laser direct forming LDS composite material and preparation method
CN103923450A (en) Synergistic flame retardant metal ion treated montmorillonoid PC/ABS (polycarbonate/polyacrylonitrile) alloy material and preparation method of alloy material
CN110511554A (en) Halogen-free flameproof nitrogen phosphorus Si modification graphene/polycarbonate/ABS alloy material and preparation method thereof
CN112920589A (en) LDS technology-based flame-retardant PC composition with heat conduction function, manufacturing method and application thereof
CN110283441B (en) Mesoporous molecular sieve compound laser direct forming material and application thereof
CN104725797B (en) Method for preparing flame-retardant plastic composite material
CN103160104B (en) Modified resin composition, preparation method thereof and application thereof
CN110951236B (en) Laser direct forming material based on polyphenyl ether and preparation method thereof
CN103694698B (en) Daiamid composition of a kind of selectivity metal refining and preparation method thereof and application
CN110467811A (en) A kind of laser direct forming material resistant to bending and preparation method thereof
CN112662159A (en) Polycarbonate laser direct forming material with good plating property and degradation resistance, preparation method and product
CN103408913B (en) Composite flame-retardant polycarbonate material and preparation method thereof and application
CN105713336A (en) High-performance electroplating ABS (acrylonitrile butadiene styrene) alloy material and preparation method thereof
CN101608049A (en) A kind of halogen-free flame-retardant ABS resin and preparation method thereof
CN102702660A (en) Halogen-free and flame retardant ACS (Acrylonitrile-Chlorinated polyethylene-Styrene)/PC (Poly Carbonate) alloy
CN104371257A (en) Multifunctional ABS composite material

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Conghua Ao town Guangzhou city Guangdong province 510940 Longtan Jubao industrial district (Village)

Applicant after: GUANGZHOU SUPER-DRAGON ENGINEERING PLASTICS CO., LTD.

Address before: Conghua City Ao town Guangzhou city Guangdong province 510945 Longtan Jubao Industrial Zone

Applicant before: Guangzhou Super-Dragon Engineering plastic Co., Ltd.

COR Change of bibliographic data
C14 Grant of patent or utility model
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: PC/ABS composites directly formed by laser and their preparation methods and Applications

Effective date of registration: 20190530

Granted publication date: 20160824

Pledgee: Conghua Branch of Guangzhou Bank Co., Ltd.

Pledgor: GUANGZHOU SUPER-DRAGON ENGINEERING PLASTICS CO., LTD.

Registration number: 2019440000196

PE01 Entry into force of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20200821

Granted publication date: 20160824

Pledgee: Conghua Branch of Guangzhou Bank Co.,Ltd.

Pledgor: GUANGZHOU SUPER-DRAGON ENGINEERING PLASTICS Co.,Ltd.

Registration number: 2019440000196

PC01 Cancellation of the registration of the contract for pledge of patent right