CN114245573A - Circuit board embedded with FPC - Google Patents
Circuit board embedded with FPC Download PDFInfo
- Publication number
- CN114245573A CN114245573A CN202111610999.8A CN202111610999A CN114245573A CN 114245573 A CN114245573 A CN 114245573A CN 202111610999 A CN202111610999 A CN 202111610999A CN 114245573 A CN114245573 A CN 114245573A
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- CN
- China
- Prior art keywords
- fpc
- board
- pcb
- embedded
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- 238000004381 surface treatment Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 238000012805 post-processing Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 8
- 230000008054 signal transmission Effects 0.000 abstract description 2
- 230000001360 synchronised effect Effects 0.000 abstract description 2
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 19
- 239000004743 Polypropylene Substances 0.000 description 12
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical group ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 9
- 239000013039 cover film Substances 0.000 description 9
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 8
- 239000000084 colloidal system Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A kind of circuit board embedded with FPC, the PCB board includes at least a PCB core board, a FPC core board and a PP piece, the FPC core board is pressed in any one side of the said PCB core board or among many said PCB core boards, in the circuit board, the hard board part exposed in the air is PCB board, the soft board part exposed in the air is FPC board, there are hollow areas in the middle area of PCB board, FPC part is embedded in the hollow area among said PCB boards foldingly; the FPC foldable part is provided with a bonding pad, and the FPC foldable part is released for extending welding or segmented welding; the method has the characteristics of realizing extension link without a converter, synchronous signal transmission and stable structure; the production mode realizes the special combination of the soft board and the hard board, and the soft board and the hard board are different and are used as a connecting board independently; the FPC board of the embedded part can be divided into two sections to realize extension design with different functional requirements; the FPC board of the embedded part is divided into a plurality of strands, the lengths of the strands are different, and different functional connections are achieved respectively.
Description
Technical Field
The invention relates to a PCB structure and a method for manufacturing the PCB, in particular to a circuit board embedded with an FPC (flexible printed circuit).
Background
Along with the increasing functional requirements of people on electronic products, the electronic products need to have high integration, are used as important and indispensable printed circuit boards of the electronic products, also put forward the development direction of 'light, thin, short and small', benefit from the comprehensive advantages of the PCB and the FPC, the rigid-flexible combined board is produced at the same time, and is widely applied to the electronic products, so that the flexible-flexible combined board can be used in products with special requirements, has a certain flexible area and a certain rigid area, and is greatly helpful for saving the internal space of the products, reducing the volume of finished products and improving the performance of the products.
In the prior art, the soft board is usually arranged on two sides or one side of the hard board, or the soft board plays a role in connection and conduction among a plurality of hard boards, meanwhile, the thickness of the soft board is far smaller than that of the hard boards, the thickness of the boards can be further effectively reduced in a soft and hard combination mode, when one core board is required to control a plurality of devices or a parallel structure is controlled and used, for the purpose of signal matching and further optimization of the structure, the production of the extensible FPC board is locally arranged in the middle of the hard boards, so that more and more requirements are met, connectors and conversion joints of various specifications are replaced, and the butt joint use of conversion spaces and piled conversion lines is reduced; the new production method is beneficial to the development towards the thin direction, can increase the production of more layers, realizes more dense wiring and is beneficial to the development of a specific structure and a high-efficiency small precision direction.
Accordingly, the prior art is deficient and needs improvement.
Disclosure of Invention
The invention aims to provide a method for producing a PCB with a novel structure, which can realize more efficient and more multi-level production and realize high-level development of high density, high precision and further structure optimization.
In order to solve the technical problems, the invention adopts the following technical scheme: a circuit board embedded with an FPC (flexible printed circuit) comprises at least one PCB core board 1, one FPC core board 2 and one PP (polypropylene) sheet, wherein the FPC core board 2 is pressed on any one side of the PCB core board 1 or among a plurality of PCB core boards 1, in the circuit board, a hard board part exposed in the air is a PCB 4, a soft board part exposed in the air is the FPC 4, a hollow area is arranged in the middle area of the PCB 4, and the FPC 5 is embedded in the hollow area among the PCB 4 in a foldable manner; the foldable part of the FPC board 5 is provided with a welding pad, and the foldable part of the FPC board 5 is released for extending welding or segmented welding.
According to the design concept of the invention, the method comprises the following steps:
the first step is as follows: typesetting according to the PCB 4 structure of the delivery unit, and simultaneously performing corresponding typesetting design of the FPC core board 2 structure aiming at the PCB 4 of the delivery unit;
the second step is that: manufacturing a circuit pattern of the FPC core board 2;
the third step: manufacturing inner layer circuits of the PCB core board 1;
the fourth step: the PCB 4 is hollowed out of the hollowed-out area 3, and meanwhile, corresponding groove bodies are hollowed out at the positions of the corresponding PP sheets, wherein the groove bodies are 0.05-1mm larger than the single side of the hollowed-out area;
the fifth step: pressing, wherein the foldable part of the FPC board 5 is embedded in the hollowed-out area 3;
and a sixth step: attaching high-temperature glue, attaching two sides of the high-temperature glue, and sealing the hollowed-out area 3;
the seventh step: drilling and post-processing.
According to the design concept of the invention, the second step of the invention further comprises pasting a cover film on the foldable part of the FPC board 5, wherein the cover film is provided with a windowing position, the bonding pad is exposed in the air, the cover film is provided with letter-shaped alignment icons, and the alignment icons are consistent with the corresponding alignment icons on the FPC board 5.
According to the design concept of the invention, the PP sheet is a weak flow adhesive PP sheet.
According to the design concept of the invention, the FPC board 5 is a single-sided soft board, a double-sided soft board or a multi-layer soft board, and the multi-layer soft board is a multi-layer non-drilled laminated board or a blind-buried multi-layer step board.
According to the design concept of the invention, the high-temperature adhesive is a red adhesive tape or a filling colloid, two sides of the filling colloid are filled, and the filling colloid is taken out after being pressed.
According to the design concept of the invention, the width and the length of the hollow area are smaller than the dry film sealing capacity, and the processing is carried out in a dry film sealing mode, so that the sixth step is omitted.
According to the design concept of the present invention, the post-process further includes surface treatment.
According to the design concept of the invention, the foldable part of the FPC board 5 is of a two-section structure or an integral structure, the foldable part of the FPC board 5 is provided with a bonding pad or is not provided with the bonding pad, and the foldable part of the FPC board 5 is provided with an outer shielding layer for the design of an impedance line.
Compared with the prior art, the invention has the following beneficial effects: (1) the extension link is realized under the action of no converter, and the characteristics of thin thickness, high line density, synchronous signal transmission and stable structure are realized.
2) The production mode realizes the special combination of the soft board and the hard board, and is different from the independent use of the soft board as the connecting board.
3) The FPC board of the embedded part can be divided into two sections to realize extension design with different functional requirements.
4) The FPC board of the embedded part is divided into a plurality of strands, the lengths of the strands are different, and different functional connections are achieved respectively.
Drawings
Fig. 1 is a view showing a structure of a corresponding layer of a circuit board in which an FPC is embedded;
fig. 2 is a schematic diagram of a cut-off surface structure of the FPC-embedded circuit board.
Detailed Description
Firstly, it needs to be explained that the invention realizes the flexible soft board embedded in the local area of the hard board through a plurality of times of combined typesetting design and production, simultaneously reduces the combination of the converter or the installation adapter in the installation process, and simultaneously realizes the solution of the specific scheme that the local area can not be installed by large devices;
example 1: a single PCB core board 1, a FPC core board 2 and a PP piece are typeset according to the structure of a PCB 4 of a delivery unit, and meanwhile, the corresponding typesetting design of the structure of the FPC core board 2 is carried out aiming at the PCB 4 of the delivery unit.
The structure of the PCB 4 of the delivery unit is limited in a specified range, the FPC board needs to be extended for long distance use, a plurality of groups of welding points need to be arranged in parallel, and the single PCB core board 1 typesetting and the single FPC core board 2 typesetting design are carried out on the circuit board; at least one direction of the single FPC core board is larger than the size of the single PCB core board.
Manufacturing a circuit pattern on the FPC core board 2; the FPC board 2 and the PCB board 1 are provided with corresponding metal via hole pads at the lamination overlapping part, the FPC board 5 further comprises a cover pasting film, the cover pasting film is insulating glue, insulating ink or an insulating cover film, and welding points are exposed in the air. Finally, the individual FPC boards 5 are cut.
And manufacturing inner layer circuits of the PCB core board 1, etching the circuits on a single surface, manufacturing partial circuits which need to be pressed with the FPC circuits, and covering the rest parts with a covering film.
The PCB core board 1 is hollowed out of the hollowed-out position 3. meanwhile, a corresponding groove body is hollowed out at the position of a corresponding PP sheet, and the groove body is 0.05-1mm larger than the single side of the hollowed-out area; pressing, wherein the foldable part of the FPC board 5 is embedded in the hollowed-out area; attaching high-temperature glue, attaching two sides of the high-temperature glue, and sealing the hollowed-out area 3; the seventh step: drilling and post-working procedures; and (3) producing according to a normal double-sided board, tearing high-temperature glue after production before surface treatment, and releasing the foldable part of the FPC board 5.
Example 2
The multilayer circuit board is provided with a plurality of PCB core boards 1 and a plurality of layers of PP sheets, and the FPC core board 2 is a core board or a pressed core board which is pressed and contains a plurality of FPC core boards.
The FPC core board 2 is pressed on any one side of the PCB core board or among a plurality of PCB core boards.
The production steps are as follows; the layout design of the PCB core board 1 and the layout design of the FPC core board 2 are respectively carried out according to the PCB structure of the delivery unit, the layout design of the FPC core board 2 is at least the design of one FPC core board 2, the patterns of the FPC are divided into multiple parts, and the layout design is carried out according to the circuit patterns of a plurality of FPC core boards 2.
And (3) manufacturing circuit patterns of the FPC core boards 2, wherein the FPC core boards 2 are manufactured into different corresponding FPC circuit patterns respectively, and the FPC circuit patterns are correspondingly provided with metal bonding pads which are correspondingly conducted by the metal through holes. The independent manufacture of the FPC circuit pattern realizes the great reduction of the production efficiency and the production cost, realizes the multi-directional extension of the foldable part of the FPC board 5, realizes the multi-directional overlapping treatment and simultaneously reduces the production difficulty.
In the circuit pattern manufacturing of the FPC core board 2, the FPC core board further comprises a cover film, wherein the cover film is insulating glue, insulating ink or an insulating cover film, and the welding points are exposed in the air.
The cover film is provided with a windowing position, the bonding pad is exposed in the air, the cover film is provided with letter-shaped alignment icons, and the alignment icons are consistent with the alignment icons on the corresponding FPC board 5, and finally a single FPC board is cut.
And manufacturing the inner layer circuit of the PCB core board 1, wherein the inner layer circuit of the PCB core board 1 is manufactured by etching the circuit pattern according to the typesetting mode of PNL.
The PCB core plate 1 is hollowed out of the hollowed-out area 3, corresponding groove bodies are hollowed out of the positions of the corresponding PP pieces, the PP pieces need to adjust corresponding hollowed-out sizes according to different glue flowing amounts, and the groove bodies are larger than the single edges of the hollowed-out areas by 0.05-1mm according to the glue flowing amount. The PP sheet is a weak flow adhesive PP sheet.
And pasting high-temperature glue, wherein the pasting high-temperature glue is to paste the high-temperature glue at the position of the hollowed-out area of the outer layer circuit, so that a plurality of PCB core boards 1 are laminated to form a closed space for placing the FPC foldable part in the laminating process.
The high-temperature adhesive is a red adhesive tape or a filling colloid, two sides of the filling colloid are filled, and the filling colloid is taken out after being pressed.
And pressing, wherein the pressing is conventional hot pressing.
And drilling, copper deposition, outer layer circuit, solder resistance, surface treatment, silk screen printing and molding are carried out on the pressed circuit board according to the multilayer hard board.
Before the surface treatment, the high-temperature glue is torn off, and the bendable part of the FPC board is released, so that the disposable surface treatment is realized.
Claims (8)
1. A circuit board embedded with an FPC is characterized by comprising at least one PCB core board, one FPC core board and one PP sheet, wherein the FPC core board is pressed on any one side of the PCB core board or among a plurality of PCB core boards; in the circuit board, a hard plate part exposed in the air is a PCB (printed Circuit Board), a soft plate part exposed in the air is an FPC (Flexible printed Circuit), a hollow-out area is arranged in the middle part of the PCB, and the FPC is embedded in the hollow-out area of the PCB in a foldable manner; the outer leakage FPC is provided with a bonding pad, and the foldable portion of the FPC is released to extend and weld or be welded in a segmented mode.
2. The method for manufacturing an FPC-embedded circuit board according to claim 1, comprising the steps of:
the first step is as follows: typesetting according to the PCB structure of the delivery unit, and simultaneously performing corresponding FPC structure typesetting design aiming at the PCB of the delivery unit;
the second step is that: manufacturing a circuit pattern of the FPC core board;
the third step: manufacturing inner layer circuits of the PCB core board;
the fourth step: the PCB core board is hollowed out of the hollowed-out position, and meanwhile, a corresponding groove body is hollowed out at the position of the corresponding PP sheet, wherein the groove body is 0.05-1mm larger than the single side of the hollowed-out area;
the fifth step: attaching high-temperature glue, attaching two sides of the high-temperature glue, and sealing the hollowed-out area;
and a sixth step: pressing, wherein the foldable part of the FPC board is embedded in the hollowed-out area;
the seventh step: drilling and post-processing.
The method for manufacturing a circuit board with an embedded FPC of claim 2, wherein the second step further comprises pasting a coverlay on a foldable portion of the FPC board, wherein the coverlay is provided with a window opening position, the bonding pad is exposed to the air, the coverlay is provided with an alignment icon in a letter shape, and the alignment icon is identical to the alignment icon on the corresponding FPC board.
3. The method for manufacturing an FPC-embedded circuit board according to claim 2, wherein the PP sheet is a weak flow adhesive PP sheet.
4. The method for manufacturing an FPC-embedded circuit board according to claim 2, wherein the FPC board is a single-sided flexible board, a double-sided flexible board, or a multi-layered flexible board which is a multi-layered non-drilled laminated board or a multi-layered ladder board buried blind.
5. The method for manufacturing a circuit board with an embedded FPC as recited in claim 2, wherein the high temperature adhesive is a red adhesive tape or a filling adhesive, both sides of the filling adhesive are filled, and the filling adhesive is taken out after being pressed.
6. The method for manufacturing a FPC-embedded circuit board according to claim 6, wherein the sixth step is omitted by performing a dry-sealing treatment for the hollow area having a width and a length smaller than a dry-sealing ability.
7. The method for manufacturing an FPC embedded circuit board according to any one of claims 1 to 7, wherein the post-process further includes surface treatment.
8. The method for manufacturing an FPC-embedded circuit board according to claim 8, wherein the FPC board foldable portion is of a two-piece structure or an integral structure, the FPC board foldable portion is provided with a pad or no pad, and the FPC board foldable portion is further provided with an outer shield layer for a design provided with an impedance line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111610999.8A CN114245573A (en) | 2021-12-27 | 2021-12-27 | Circuit board embedded with FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111610999.8A CN114245573A (en) | 2021-12-27 | 2021-12-27 | Circuit board embedded with FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114245573A true CN114245573A (en) | 2022-03-25 |
Family
ID=80763396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111610999.8A Pending CN114245573A (en) | 2021-12-27 | 2021-12-27 | Circuit board embedded with FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114245573A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060027209A (en) * | 2004-09-22 | 2006-03-27 | 삼성전자주식회사 | Display device |
| CN1780532A (en) * | 2004-10-28 | 2006-05-31 | 三星电机株式会社 | Method of fabricating rigid-flexible printed circuit board |
| CN101896037A (en) * | 2004-06-11 | 2010-11-24 | 揖斐电株式会社 | Rigid-flex wiring board and method for producing same |
| CN104768335A (en) * | 2015-04-15 | 2015-07-08 | 深圳市爱升精密电路科技有限公司 | Manufacturing method of flexible-rigid board |
| KR101980102B1 (en) * | 2019-01-16 | 2019-05-20 | 신덕전자(주) | Method for Manufacturing Rigid-Flexible PCB |
-
2021
- 2021-12-27 CN CN202111610999.8A patent/CN114245573A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101896037A (en) * | 2004-06-11 | 2010-11-24 | 揖斐电株式会社 | Rigid-flex wiring board and method for producing same |
| KR20060027209A (en) * | 2004-09-22 | 2006-03-27 | 삼성전자주식회사 | Display device |
| CN1780532A (en) * | 2004-10-28 | 2006-05-31 | 三星电机株式会社 | Method of fabricating rigid-flexible printed circuit board |
| CN104768335A (en) * | 2015-04-15 | 2015-07-08 | 深圳市爱升精密电路科技有限公司 | Manufacturing method of flexible-rigid board |
| KR101980102B1 (en) * | 2019-01-16 | 2019-05-20 | 신덕전자(주) | Method for Manufacturing Rigid-Flexible PCB |
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