CN114242626B - 一种干法晶圆片清洗设备 - Google Patents
一种干法晶圆片清洗设备 Download PDFInfo
- Publication number
- CN114242626B CN114242626B CN202111568058.2A CN202111568058A CN114242626B CN 114242626 B CN114242626 B CN 114242626B CN 202111568058 A CN202111568058 A CN 202111568058A CN 114242626 B CN114242626 B CN 114242626B
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- CN
- China
- Prior art keywords
- wafer
- dry
- worm wheel
- cleaning
- sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 57
- 239000012495 reaction gas Substances 0.000 claims abstract description 35
- 230000007306 turnover Effects 0.000 claims abstract description 34
- 239000007789 gas Substances 0.000 claims abstract description 28
- 235000012431 wafers Nutrition 0.000 claims description 239
- 238000003825 pressing Methods 0.000 claims description 14
- 230000006835 compression Effects 0.000 claims description 8
- 238000007906 compression Methods 0.000 claims description 8
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 230000036632 reaction speed Effects 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 239000002699 waste material Substances 0.000 abstract description 7
- 238000005108 dry cleaning Methods 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000007789 sealing Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 3
- 239000003344 environmental pollutant Substances 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002912 waste gas Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/335—Cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111568058.2A CN114242626B (zh) | 2021-12-21 | 2021-12-21 | 一种干法晶圆片清洗设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111568058.2A CN114242626B (zh) | 2021-12-21 | 2021-12-21 | 一种干法晶圆片清洗设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114242626A CN114242626A (zh) | 2022-03-25 |
CN114242626B true CN114242626B (zh) | 2022-04-29 |
Family
ID=80760000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111568058.2A Active CN114242626B (zh) | 2021-12-21 | 2021-12-21 | 一种干法晶圆片清洗设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114242626B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180155829A1 (en) * | 2016-12-06 | 2018-06-07 | Tokyo Electron Limited | Cleaning method and film deposition apparatus |
CN109037099A (zh) * | 2017-06-09 | 2018-12-18 | 责市特马股份有限公司 | 晶片容器的气体供应装置 |
CN111463107A (zh) * | 2020-04-07 | 2020-07-28 | 北京烁科精微电子装备有限公司 | 一种晶圆清洗设备 |
-
2021
- 2021-12-21 CN CN202111568058.2A patent/CN114242626B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180155829A1 (en) * | 2016-12-06 | 2018-06-07 | Tokyo Electron Limited | Cleaning method and film deposition apparatus |
CN109037099A (zh) * | 2017-06-09 | 2018-12-18 | 责市特马股份有限公司 | 晶片容器的气体供应装置 |
CN111463107A (zh) * | 2020-04-07 | 2020-07-28 | 北京烁科精微电子装备有限公司 | 一种晶圆清洗设备 |
Also Published As
Publication number | Publication date |
---|---|
CN114242626A (zh) | 2022-03-25 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215316 room 3, No. 299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: 215316 room 3, No. 299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP03 | Change of name, title or address |
Address after: No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215316 Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 215316 room 3, No. 299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |
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CP03 | Change of name, title or address |