CN114242598A - Preparation method and application method of super-infiltrated diamond micro-channel heat sink - Google Patents
Preparation method and application method of super-infiltrated diamond micro-channel heat sink Download PDFInfo
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
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- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention discloses a preparation method of a super-infiltration diamond microchannel heat sink, which comprises the following steps of a, adopting a polycrystalline diamond sheet as a microchannel structure material, and carrying out microchannel heat sink structure processing on the polycrystalline diamond sheet by utilizing high-precision laser etching to form a microchannel groove on the surface of the polycrystalline diamond sheet so as to prepare the polycrystalline diamond microchannel heat sink; b. carrying out micro-nano structure construction on the surface of the polycrystalline diamond micro-channel heat sink by a maskless processing method, and carrying out oxygen plasma surface treatment to prepare the diamond micro-channel heat sink with super-wetting performance; c. the diamond is used as a micro-channel structure material for high-precision laser processing, and the heat exchange is carried out by adopting a two-fluid cooling working medium mixed by liquid metal and a water medium, so that the ultrahigh heat flow density heat dissipation requirement of a high-power electronic system can be met.
Description
Technical Field
The invention relates to the technical field of a heat sink heat dissipation preparation process of a high-power semiconductor device, in particular to a preparation method and a use method of a super-infiltrated diamond micro-channel heat sink.
Background
With the rapid development of the electronic industry and the semiconductor industry, various electronic chips are continuously developed towards miniaturization and high integration; meanwhile, the functions and the performance of the chip are continuously improved, and the calculation frequency of the chip is further increased; the power consumption of the chip is larger and larger, and the heating problem is more and more severe. The chip heating mainly comes from the joule heat effect of internal elements and the transistor leakage current heat effect, and the higher the integration level and the higher the leakage power consumption are, the more remarkable the thermal phenomenon is. Two key parameters of the chip thermal problem are thermal design power consumption and local heat flux density, the thermal design power consumption represents the total heat released when a single chip normally works to reach the maximum load, and the local heat flux density describes the thermal power generated by a unit surface area of a local position on the surface of the chip; the larger the thermal design power consumption is, the larger the required cold plate heat exchange area is, which means that the radiator has larger volume (heat exchange problem) macroscopically, and the local hot spot problem (heat expansion problem) is caused by the over-high or non-uniform local heat flow density; these two aspects have become two major heat dissipation bottlenecks of high-end chips, which bring a severe thermal barrier challenge to the heat dissipation technology, and a preparation and application technology of a heat sink with high heat dissipation efficiency is urgently needed to solve the related problems.
The increasing demand for heat dissipation in high power electronic devices has driven the rapid development of cooling technology. Air cooling is a heat dissipation mode mainly adopted by the low-power-consumption electronic device at present, and comprises natural air convection cooling and forced convection air cooling, so that the heat dissipation mode has the advantages of simplicity, reliability and low cost, but the heat dissipation capacity is limited, and the heat dissipation mode is only suitable for the situation that the heat flow density is less than 10W/cm 2. The heat pipe is a high-efficiency heat transfer element, is invented by George Grover of national laboratory of Los Alamos (Los Alamos) in 1963, and has extremely high equivalent thermal conductivity which is generally in the order of 104W/m.K; the CPU cooling based on the heat pipe is the mainstream heat dissipation mode of the notebook computer at present, and the heat dissipation heat flow density is within the range of 101-102W/cm 2. When the heat flow density reaches 102-103W/cm 2 range, liquid cooling measures are often needed for heat dissipation, including single-phase relative flow liquid cooling and two-phase boiling cooling. In 1981, a microchannel heat dissipation concept is creatively proposed by Tuckerman and Pease, a micro flow channel structure is used as a heat exchange body, and the microchannel heat dissipation device has the characteristics of compact structure and strong heat dissipation capability, and becomes a high-end cooling method for solving the heat dissipation problem of the ultrahigh heat flow density electronic chip; the experimental result shows that when the flow rate of water is 10cm3/s and the temperature rise of the water is 71 ℃, the cooling heat flow of the micro-channel can be up to 790W/cm 2; this cooling capacity is far beyond the level achievable by conventional means. Therefore, it can be judged that: the micro-channel structure is adopted as a heat exchange body, the fine and dense flow channel structure in the micro-channel structure not only thins a heat transfer boundary layer, but also greatly increases the convection heat exchange area, can realize extremely high-efficiency heat exchange performance in a smaller space, and has great advantages as an advanced high-efficiency compact cooling device for semiconductor devices.
The high-efficiency heat exchange performance of the micro-channel cooling system is a system optimization result under the coupling of multiple factors such as a comprehensive material structure, a cooling working medium and interaction thereof. However, conventional materials and cooling media face two key challenges in attempting to break through higher limiting heat flows: performance limitation caused by low thermal conductivity of the material and the working medium and stability defect caused by low boiling point of the working medium.
Disclosure of Invention
In view of the above, the present invention provides a method for preparing a super-infiltrated diamond micro-channel heat sink and a method for using the same, which solve the problems of heat dissipation and heat spreading of a high power electronic system.
The invention discloses a preparation method of a super-infiltrated diamond micro-channel heat sink, which comprises the following steps of:
a. the method comprises the following steps of (1) adopting a polycrystalline diamond sheet as a microchannel structure material, and carrying out microchannel heat sink structure processing on the polycrystalline diamond sheet by utilizing high-precision laser etching to form a microchannel groove on the surface of the polycrystalline diamond sheet so as to prepare a polycrystalline diamond microchannel heat sink;
b. carrying out micro-nano structure construction on the surface of the polycrystalline diamond micro-channel heat sink by a maskless processing method, and carrying out oxygen plasma surface treatment to prepare the diamond micro-channel heat sink with super-wetting performance;
further, in the step a, the polycrystalline diamond sheet is chemical vapor deposition diamond, the surface roughness is less than 10nm, the length of the polycrystalline diamond sheet is 10-100mm, the width of the polycrystalline diamond sheet is 10-100mm, the thickness of the polycrystalline diamond sheet is 1-5mm, and the thermal conductivity of the polycrystalline diamond sheet is 1000-2000W/m.K;
further, in step a, the microchannel groove of the polycrystalline diamond is: the width of the micro-groove is 100-;
further, in the step b, firstly, carrying out high-temperature oxidation treatment on the diamond microchannel heat sink, and then carrying out oxygen plasma surface treatment;
further, in the step b, the temperature of the high-temperature oxidation treatment is 350-.
Further, in the step b, a microwave plasma etching method is adopted, an oxygen plasma generator adopts oxygen with the purity of 99.99 percent as a gas source, and the oxygen plasma surface treatment is carried out on the diamond heat sink through a plasma etching process, wherein the microwave power is 1000-;
further, in the step b, the static water contact angle of the surface of the prepared super-wetting diamond micro-channel is less than 5 degrees.
The use method of the super-wetting diamond micro-channel heat sink comprises the following steps: when the super-infiltration diamond microchannel is used for heat dissipation, the super-infiltration diamond microchannel is installed on a convective heat exchange experiment platform in a heat sink mode, a double-fluid cooling working medium consisting of water and liquid metal is adopted for cooling, wherein the diamond microchannel is completely wetted by cooling water in advance, and then a heat source is cooled under a certain working condition by using a liquid metal and water mixed solution after ultrasonic dispersion;
further, the liquid metal is gallium-based liquid alloy Ga68In20Sn12When the liquid metal is subjected to ultrasonic dispersion, the pH value of the aqueous solution is adjusted to be 4-6 or 8-10 so that the solution is weakly acidic or weakly alkaline;
further, the temperature of the mixed solution of the liquid metal and the water is 15-30 ℃, the ultrasonic dispersion power is 1-20 kilowatts, and the frequency is 20-40 KHz.
The invention has the beneficial effects that: the invention discloses a preparation method and a use method of a super-infiltration diamond micro-channel heat sink.
Drawings
The invention is further described below with reference to the following figures and examples:
FIG. 1 is a schematic structural view of a super-infiltrated diamond microchannel heat sink of the present invention.
Detailed Description
The preparation method of the super-wetting diamond micro-channel heat sink comprises the following steps:
a. the method comprises the following steps of (1) adopting a polycrystalline diamond sheet as a microchannel structure material, and carrying out microchannel heat sink structure processing on the polycrystalline diamond sheet by utilizing high-precision laser etching to form a microchannel groove on the surface of the polycrystalline diamond sheet so as to prepare a polycrystalline diamond microchannel heat sink; the diamond is a material with the highest natural thermal conductivity and has excellent mechanical property and chemical stability, the diamond is selected as a structural material of the micro-channel, and the cooling effect of the limiting heat flux density can be theoretically realized by the diamond micro-channel under the same other operating conditions.
b. Carrying out micro-nano structure construction on the surface of the polycrystalline diamond micro-channel heat sink by a maskless processing method, and carrying out oxygen plasma surface treatment to prepare the diamond micro-channel heat sink with super-wetting performance; aiming at the size, orientation and distribution condition of the crystal grains on the surface of the diamond, the high-temperature oxidation and plasma etching process is adjusted, and the mask-free method for manufacturing the diamond micro-nano structure is realized.
In the embodiment, in the step a, the polycrystalline diamond sheet is a chemical vapor deposition diamond, the surface roughness is less than 10nm, the length of the polycrystalline diamond sheet is 10-100mm, the width of the polycrystalline diamond sheet is 10-100mm, the thickness of the polycrystalline diamond sheet is 1-5mm, and the thermal conductivity of the polycrystalline diamond sheet is 1000-2000W/m.K; preferably, self-supporting polycrystalline diamond is adopted, and a high-precision laser processing technology is adopted to perform high-quality processing on a diamond heat sink functional structure to prepare the self-supporting polycrystalline diamond micro-channel heat sink.
In this embodiment, in step a, the micro-channel groove of the polycrystalline diamond is: the width of the micro-groove is 100-500 mu m, the roughness of the side wall of the micro-groove is less than or equal to 5 mu m, the roughness of the bottom of the micro-groove is less than or equal to 20 mu m, the aspect ratio is greater than or equal to 2:1, the inclination angle of the side wall is-10 degrees to +10 degrees, and the processing error is +/-20 mu m.
In the embodiment, in the step b, the diamond microchannel heat sink is subjected to high-temperature oxidation treatment, and then oxygen plasma surface treatment is performed; firstly, carrying out high-temperature oxidation treatment on the surface of the diamond in an atmospheric environment, wherein the high-temperature oxidation treatment temperature is 350-550 ℃ and the treatment time is 10-120 minutes according to the basic physical properties of the nano-diamond and the amorphous carbon; secondly, a microwave plasma etching method is adopted, an oxygen plasma generator adopts high-purity (99.99%) oxygen as a gas source, and oxygen plasma surface treatment is carried out on the diamond heat sink through an optimized plasma etching process, wherein the microwave power is 1000-.
In this embodiment, in the step b, the static water contact angle of the surface of the prepared super-infiltrated diamond micro-channel is less than 5 °.
The use method of the super-wetting diamond micro-channel heat sink comprises the following steps: when the super-infiltration diamond microchannel is used for heat dissipation, the super-infiltration diamond microchannel heat sink is arranged on a convective heat exchange experiment platform, a two-fluid cooling working medium consisting of water and liquid metal is adopted for cooling, wherein the cooling water completely wets the diamond microchannel in advance, and then the liquid gold after ultrasonic dispersion is usedCooling a heat source by a solution mixed with water under a certain working condition; the liquid metal is gallium-based liquid alloy Ga68In20Sn12When the liquid metal is subjected to ultrasonic dispersion, the pH value of the aqueous solution is adjusted to be 4-6 or 8-10 so that the solution is weakly acidic or weakly alkaline; the temperature of the liquid metal and water mixed solution is 15-30 ℃, the ultrasonic dispersion power is 1-20 kilowatts, and the frequency is 20-40 KHz; when the super-infiltration diamond microchannel is used for heat dissipation, the diamond microchannel is installed on a convective heat exchange experiment platform, the convective heat exchange experiment platform consists of a liquid storage tank, a filter, a peristaltic pump, a constant temperature water bath box, a heat exchanger, a pressure gauge, a diamond microchannel module, a heating module, a far-end radiator, a liquid recoverer, a weighing and metering system and a data acquisition system, wherein 5 temperature measuring holes are uniformly distributed in a microchannel testing section along the flow direction, and a T-shaped thermocouple is adopted for monitoring the real-time temperature of a microchannel bottom plate and inlet and outlet fluids. The heating module is used for simulating the heat dissipation requirement of certain heat flux density, and under the drive of the peristaltic pump, the cooling working medium sequentially passes through the constant-temperature water bath tank, the micro-channel testing section, the far-end radiator, the liquid recoverer and the weighing and metering system to acquire fluid flow data, real-time temperature data and system pressure data. Cooling by using a two-fluid cooling medium consisting of water and liquid metal, wherein the liquid metal is gallium-based liquid alloy (Ga)68In20Sn12) Adjusting the pH value of the aqueous solution within the range of 4-6 or 8-10 to make the solution in weak acidity or weak alkalinity, then carrying out ultrasonic dispersion on the liquid metal, wherein the ultrasonic dispersion power is 1-20 kilowatts, the frequency is 20-40KHz, adjusting the temperature range of the liquid metal and water mixed solution to 15-30 ℃ through an oil bath pan, and fully dispersing to prepare the two-fluid cooling working medium consisting of water and the liquid metal. When the diamond microchannel is used for heat dissipation, cooling water completely wets the diamond microchannel in advance, then a double-fluid solution formed by mixing liquid metal and water after ultrasonic dispersion is used for cooling a heat source under a certain working condition, and a flow pattern evolution rule of a double-fluid cooling process is monitored in real time through a high-speed camera; recording the temperature distribution of the system by infrared camera method, and determiningAnd recording a system thermal expansion data graph at the position of the hot spot, thereby completing the heat dissipation application of the super-infiltrated diamond micro-channel in a high heat flow density heat source.
Example one
The preparation method of the super-wetting diamond micro-channel heat sink comprises the following steps:
a. according to the size of a heat source, the size of the self-supporting polycrystalline diamond is 25 multiplied by 2mm, the thermal conductivity is 1500W/m.K, and high-quality processing of a diamond heat sink functional structure is carried out by adopting a high-precision laser processing technology to prepare the self-supporting polycrystalline diamond micro-channel heat sink. Wherein, the structural parameter range of the diamond heat sink micro blind groove is the width of the micro groove: 200 μm, microgroove sidewall roughness: less than or equal to 5 mu m, and the roughness of the bottom of the micro-groove: less than or equal to 20 mu m, depth-to-width ratio: 3:1, side wall inclination angle: -5 ° +5 °; machining errors: 10 μm.
b. And (b) carrying out micro-nano structure construction on the surface of the diamond microchannel heat sink prepared in the step a, and adjusting high-temperature oxidation and plasma etching processes according to the size, orientation and distribution condition of crystal grains on the surface of the diamond, so as to realize the mask-free method for manufacturing the diamond micro-nano structure. Firstly, carrying out high-temperature oxidation treatment on the surface of the diamond in an atmospheric environment, wherein the high-temperature oxidation treatment temperature is 350 ℃ and the treatment time is 30 minutes according to the basic physical properties of the nano-diamond and the amorphous carbon; secondly, adopting a microwave plasma etching method, using high-purity (99.99%) oxygen as a gas source by an oxygen plasma generator, and carrying out oxygen plasma surface treatment on the diamond heat sink by an optimized plasma etching process, wherein the specific process comprises the steps of 2500W of microwave power, 2.45GHz of microwave frequency, 0.5Pa of air pressure and 350 ℃ of a substrate, and after treatment, the static water contact angle of the surface of the diamond is 2 degrees, so that the diamond micro-channel heat sink with super-wetting performance is prepared.
The use method of the super-wetting diamond micro-channel heat sink comprises the following steps:
when the super-infiltrated diamond micro-channel is used for heat dissipation, the diamond micro-channel is arranged on a convective heat exchange experiment platform, and the convective heat exchange experiment platform consists of a liquid storage tank, a filter, a peristaltic pump, a constant temperature water bath box and a heat exchange boxThe device comprises a pressure gauge, a diamond micro-channel module, a heating module, a far-end radiator, a liquid recoverer, a weighing and metering system and a data acquisition system, wherein 5 temperature measuring holes are uniformly distributed in the micro-channel testing section in the flow direction, and a T-shaped thermocouple is adopted to monitor the temperature of a micro-channel bottom plate and inlet and outlet fluids in real time. The heating module is used for simulating the heat dissipation requirement of certain heat flux density, and under the drive of the peristaltic pump, the cooling working medium sequentially passes through the constant-temperature water bath tank, the micro-channel testing section, the far-end radiator, the liquid recoverer and the weighing and metering system to acquire fluid flow data, real-time temperature data and system pressure data. Cooling by using a two-fluid cooling medium consisting of water and liquid metal, wherein the liquid metal is gallium-based liquid alloy (Ga)68In20Sn12) Adjusting the pH value of the aqueous solution to 5 to enable the solution to be in faintly acid, then carrying out ultrasonic dispersion on the liquid metal, wherein the ultrasonic dispersion power is 3 kilowatts, the frequency is 30KHz, adjusting the temperature range of the liquid metal and water mixed solution to be 25 ℃ through an oil bath pan, and fully dispersing to obtain the double-fluid cooling working medium consisting of water and the liquid metal. When the diamond microchannel is used for heat dissipation, cooling water completely wets the diamond microchannel in advance, then a double-fluid solution formed by mixing liquid metal and water after ultrasonic dispersion is used for cooling a heat source under a certain working condition, and a flow pattern evolution rule of a double-fluid cooling process is monitored in real time through a high-speed camera; and recording the temperature distribution of the system by adopting an infrared camera shooting method, judging the position of a hot spot, and recording a heat expansion data graph of the system, thereby completing the heat dissipation application of the super-infiltration diamond micro-channel in a high heat flow density heat source.
Example two
The preparation method of the super-wetting diamond micro-channel heat sink comprises the following steps:
a. according to the size of a heat source, the size of the self-supporting polycrystalline diamond is 50 multiplied by 3mm, the thermal conductivity is 1500W/m.K, and high-quality processing of a diamond heat sink functional structure is carried out by adopting a high-precision laser processing technology to prepare the self-supporting polycrystalline diamond micro-channel heat sink. Wherein, the structural parameter range of the diamond heat sink micro blind groove is the width of the micro groove: 350 μm, microgroove sidewall roughness: less than or equal to 5 mu m, and the roughness of the bottom of the micro-groove: less than or equal to 20 mu m, depth-to-width ratio: 5:1, side wall inclination: -10 ° +10 °; machining errors: . + -. 15 μm.
b. And (b) carrying out micro-nano structure construction on the surface of the diamond microchannel heat sink prepared in the step a, and adjusting high-temperature oxidation and plasma etching processes according to the size, orientation and distribution condition of crystal grains on the surface of the diamond, so as to realize the mask-free method for manufacturing the diamond micro-nano structure. Firstly, carrying out high-temperature oxidation treatment on the surface of the diamond in an atmospheric environment, wherein the high-temperature oxidation treatment temperature is 400 ℃ and the treatment time is 60 minutes according to the basic physical properties of the nano-diamond and the amorphous carbon; secondly, adopting a microwave plasma etching method, using high-purity (99.99%) oxygen as a gas source by an oxygen plasma generator, and carrying out oxygen plasma surface treatment on the diamond heat sink by an optimized plasma etching process, wherein the specific process comprises the steps of microwave power of 3000W, microwave frequency of 2.45GHz, gas pressure of 1Pa and substrate temperature of 450 ℃, and after treatment, the static water contact angle of the diamond surface is 3 degrees, so that the diamond micro-channel heat sink with super-wetting performance is prepared.
The use method of the super-wetting diamond micro-channel heat sink comprises the following steps: when the super-infiltration diamond microchannel is used for heat dissipation, the diamond microchannel is installed on a convective heat exchange experiment platform, the convective heat exchange experiment platform consists of a liquid storage tank, a filter, a peristaltic pump, a constant temperature water bath box, a heat exchanger, a pressure gauge, a diamond microchannel module, a heating module, a far-end radiator, a liquid recoverer, a weighing and metering system and a data acquisition system, wherein 5 temperature measuring holes are uniformly distributed in a microchannel testing section along the flow direction, and a T-shaped thermocouple is adopted for monitoring the real-time temperature of a microchannel bottom plate and inlet and outlet fluids. The heating module is used for simulating the heat dissipation requirement of certain heat flux density, and under the drive of the peristaltic pump, the cooling working medium sequentially passes through the constant-temperature water bath tank, the micro-channel testing section, the far-end radiator, the liquid recoverer and the weighing and metering system to acquire fluid flow data, real-time temperature data and system pressure data. Cooling by using a two-fluid cooling medium consisting of water and liquid metal, wherein the liquid metal is gallium-based liquid alloy (Ga)68In20Sn12) Adjusting the pH value of the aqueous solution to 8 to make the solution in alkalescence, then carrying out ultrasonic dispersion on the liquid metal, wherein the ultrasonic dispersion power is 3 kilowatts, the frequency is 30KHz, adjusting the temperature range of the liquid metal and water mixed solution to be 25 ℃ through an oil bath pan, and fully dispersing to obtain the double-fluid cooling working medium consisting of water and the liquid metal. When the diamond microchannel is used for heat dissipation, cooling water completely wets the diamond microchannel in advance, then a double-fluid solution formed by mixing liquid metal and water after ultrasonic dispersion is used for cooling a heat source under a certain working condition, and a flow pattern evolution rule of a double-fluid cooling process is monitored in real time through a high-speed camera; and recording the temperature distribution of the system by adopting an infrared camera shooting method, judging the position of a hot spot, and recording a heat expansion data graph of the system, thereby completing the heat dissipation application of the super-infiltration diamond micro-channel in a high heat flow density heat source.
EXAMPLE III
The preparation method of the super-wetting diamond micro-channel heat sink comprises the following steps:
a. according to the size of a heat source, the size of the self-supporting polycrystalline diamond is 50 multiplied by 3mm, the thermal conductivity is 1500W/m.K, and high-quality processing of a diamond heat sink functional structure is carried out by adopting a high-precision laser processing technology to prepare the self-supporting polycrystalline diamond micro-channel heat sink. Wherein, the structural parameter range of the diamond heat sink micro blind groove is the width of the micro groove: 500 μm, microgroove sidewall roughness: less than or equal to 5 mu m, and the roughness of the bottom of the micro-groove: less than or equal to 20 mu m, depth-to-width ratio: 5:1, side wall inclination: -10 ° +10 °; machining errors: . + -. 15 μm.
b. And (b) carrying out micro-nano structure construction on the surface of the diamond microchannel heat sink prepared in the step a, and adjusting high-temperature oxidation and plasma etching processes according to the size, orientation and distribution condition of crystal grains on the surface of the diamond, so as to realize the mask-free method for manufacturing the diamond micro-nano structure. Firstly, carrying out high-temperature oxidation treatment on the surface of the diamond in an atmospheric environment, wherein the high-temperature oxidation treatment temperature is 500 ℃ and the treatment time is 90 minutes according to the basic physical properties of the nano-diamond and the amorphous carbon; secondly, adopting a microwave plasma etching method, using high-purity (99.99%) oxygen as a gas source by an oxygen plasma generator, and carrying out oxygen plasma surface treatment on the diamond heat sink by an optimized plasma etching process, wherein the specific process comprises the steps of microwave power of 5000W, microwave frequency of 2.45GHz, gas pressure of 1Pa and substrate temperature of 450 ℃, and after treatment, the static water contact angle of the diamond surface is 5 degrees, so that the diamond micro-channel heat sink with super-wetting performance is prepared.
The use method of the super-wetting diamond micro-channel heat sink comprises the following steps: when the super-infiltration diamond microchannel is used for heat dissipation, the diamond microchannel is installed on a convective heat exchange experiment platform, the convective heat exchange experiment platform consists of a liquid storage tank, a filter, a peristaltic pump, a constant temperature water bath box, a heat exchanger, a pressure gauge, a diamond microchannel module, a heating module, a far-end radiator, a liquid recoverer, a weighing and metering system and a data acquisition system, wherein 5 temperature measuring holes are uniformly distributed in a microchannel testing section along the flow direction, and a T-shaped thermocouple is adopted for monitoring the real-time temperature of a microchannel bottom plate and inlet and outlet fluids. The heating module is used for simulating the heat dissipation requirement of certain heat flux density, and under the drive of the peristaltic pump, the cooling working medium sequentially passes through the constant-temperature water bath tank, the micro-channel testing section, the far-end radiator, the liquid recoverer and the weighing and metering system to acquire fluid flow data, real-time temperature data and system pressure data. Cooling by using a two-fluid cooling medium consisting of water and liquid metal, wherein the liquid metal is gallium-based liquid alloy (Ga)68In20Sn12) Adjusting the pH value of the aqueous solution to 9 to enable the solution to be in alkalescence, then carrying out ultrasonic dispersion on the liquid metal, wherein the ultrasonic dispersion power is 3 kilowatts, the frequency is 30KHz, adjusting the temperature range of the liquid metal and water mixed solution to be 25 ℃ through an oil bath pan, and fully dispersing to obtain the double-fluid cooling working medium consisting of water and the liquid metal. When the diamond microchannel is used for heat dissipation, cooling water completely wets the diamond microchannel in advance, then a double-fluid solution formed by mixing liquid metal and water after ultrasonic dispersion is used for cooling a heat source under a certain working condition, and a flow pattern evolution rule of a double-fluid cooling process is monitored in real time through a high-speed camera; recording the temperature distribution of the system by adopting an infrared camera shooting method, judging the position of a hot spot, and recording the systemAnd thermally expanding the data graph so as to finish the heat dissipation application of the super-infiltration diamond micro-channel in a high heat flow density heat source.
Example four
a. According to the size of a heat source, the self-supporting polycrystalline diamond is selected to be 50 multiplied by 3mm in size, the thermal conductivity is 2000W/m.K, and high-quality processing of a diamond heat sink functional structure is carried out by adopting a high-precision laser processing technology to prepare the self-supporting polycrystalline diamond micro-channel heat sink. Wherein, the structural parameter range of the diamond heat sink micro blind groove is the width of the micro groove: 300 μm, microgroove sidewall roughness: less than or equal to 5 mu m, and the roughness of the bottom of the micro-groove: less than or equal to 20 mu m, depth-to-width ratio: 4:1, sidewall inclination angle: -10 ° +10 °; machining errors: . + -. 5 μm.
b. And (b) carrying out micro-nano structure construction on the surface of the diamond microchannel heat sink prepared in the step a, and adjusting high-temperature oxidation and plasma etching processes according to the size, orientation and distribution condition of crystal grains on the surface of the diamond, so as to realize the mask-free method for manufacturing the diamond micro-nano structure. Firstly, carrying out high-temperature oxidation treatment on the surface of the diamond in an atmospheric environment, wherein the high-temperature oxidation treatment temperature is 540 ℃ and the treatment time is 10 minutes according to the basic physical properties of the nano-diamond and the amorphous carbon; secondly, adopting a microwave plasma etching method, using high-purity (99.99%) oxygen as a gas source by an oxygen plasma generator, and carrying out oxygen plasma surface treatment on the diamond heat sink by an optimized plasma etching process, wherein the specific process comprises the steps of microwave power of 1000W, microwave frequency of 4GHz, air pressure of 0.1Pa and substrate temperature of 500 ℃, and after treatment, the static water contact angle of the diamond surface is 4 degrees, so that the diamond micro-channel heat sink with super-wetting performance is prepared.
The application method of the super-wetting diamond microchannel heat sink of the embodiment is the same as that of the third embodiment, wherein the pH value of the aqueous solution is adjusted to 10, the solution is in alkalescence, then the liquid metal is subjected to ultrasonic dispersion, the ultrasonic dispersion power is 18 kilowatts, the frequency is 38KHz, and the temperature range of the mixed solution of the liquid metal and the water is adjusted to 28 ℃ through an oil bath pan.
EXAMPLE five
a. According to the size of a heat source, the size of the self-supporting polycrystalline diamond is 25 multiplied by 2mm, the thermal conductivity is 1700W/m.K, and high-quality processing of a diamond heat sink functional structure is carried out by adopting a high-precision laser processing technology to prepare the self-supporting polycrystalline diamond micro-channel heat sink. Wherein, the structural parameter range of the diamond heat sink micro blind groove is the width of the micro groove: 200 μm, microgroove sidewall roughness: less than or equal to 5 mu m, and the roughness of the bottom of the micro-groove: less than or equal to 20 mu m, depth-to-width ratio: 6:1, side wall inclination: -10 ° +10 °; machining errors: . + -. 8 μm.
b. And (b) carrying out micro-nano structure construction on the surface of the diamond microchannel heat sink prepared in the step a, and adjusting high-temperature oxidation and plasma etching processes according to the size, orientation and distribution condition of crystal grains on the surface of the diamond, so as to realize the mask-free method for manufacturing the diamond micro-nano structure. Firstly, carrying out high-temperature oxidation treatment on the surface of the diamond in an atmospheric environment, wherein the high-temperature oxidation treatment temperature is 450 ℃ and the treatment time is 60 minutes according to the basic physical properties of the nano-diamond and the amorphous carbon; secondly, adopting a microwave plasma etching method, using high-purity (99.99%) oxygen as a gas source by an oxygen plasma generator, and carrying out oxygen plasma surface treatment on the diamond heat sink by an optimized plasma etching process, wherein the specific process comprises the steps of microwave power of 3000W, microwave frequency of 1GHz, air pressure of 5Pa and substrate temperature of 380 ℃, and after treatment, the static water contact angle of the diamond surface is 3 degrees, so that the diamond micro-channel heat sink with super-wetting performance is prepared.
The method for using the super-wetting diamond microchannel heat sink is the same as that of the second embodiment, wherein the pH value of the aqueous solution is adjusted to 4, the solution is in weak acidity, then the liquid metal is subjected to ultrasonic dispersion, the ultrasonic dispersion power is 8 kilowatts, the frequency is 25KHz, and the temperature range of the mixed solution of the liquid metal and the water is adjusted to 25 ℃ through an oil bath pan.
Finally, the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all of them should be covered in the claims of the present invention.
Claims (10)
1. A preparation method of a super-wetting diamond micro-channel heat sink is characterized by comprising the following steps: the method comprises the following steps:
a. the method comprises the following steps of (1) adopting a polycrystalline diamond sheet as a microchannel structure material, and carrying out microchannel heat sink structure processing on the polycrystalline diamond sheet by utilizing high-precision laser etching to form a microchannel groove on the surface of the polycrystalline diamond sheet so as to prepare a polycrystalline diamond microchannel heat sink;
b. and (3) carrying out micro-nano structure construction on the surface of the polycrystalline diamond micro-channel heat sink by a maskless processing method, and carrying out oxygen plasma surface treatment to prepare the diamond micro-channel heat sink with super-wetting performance.
2. The method for preparing a super-infiltrated diamond microchannel heat sink as recited in claim 1, wherein: in the step a, the polycrystalline diamond sheet is chemical vapor deposition diamond, the surface roughness is less than 10nm, the length of the polycrystalline diamond sheet is 10-100mm, the width of the polycrystalline diamond sheet is 10-100mm, the thickness of the polycrystalline diamond sheet is 1-5mm, and the thermal conductivity of the polycrystalline diamond sheet is 1000-2000W/m.K.
3. The method for preparing a super-infiltrated diamond microchannel heat sink as recited in claim 2, wherein: in step a, the micro-channel groove of the polycrystalline diamond is as follows: the width of the micro-groove is 100-.
4. The method for preparing a super-infiltrated diamond microchannel heat sink as recited in claim 1, wherein: in the step b, the diamond microchannel heat sink is firstly subjected to high-temperature oxidation treatment, and then oxygen plasma surface treatment is carried out.
5. The method for preparing a super-infiltrated diamond microchannel heat sink as recited in claim 4, wherein: in the step b, the temperature of the high-temperature oxidation treatment is 350-550 ℃, and the treatment time is 10-120 minutes.
6. The method for preparing a super-infiltrated diamond microchannel heat sink as recited in claim 5, wherein: in the step b, a microwave plasma etching method is adopted, an oxygen plasma generator adopts oxygen with the purity of 99.99 percent as a gas source, and the surface treatment of the oxygen plasma is carried out on the diamond heat sink by a plasma etching process, wherein the microwave power is 1000-.
7. The preparation method of the super-infiltrated diamond microchannel heat sink is characterized by comprising the following steps of: in the step b, the static water contact angle of the surface of the prepared super-wetting diamond micro-channel is less than 5 degrees.
8. The method of using a super-infiltrated diamond microchannel heat sink as recited in claim 1, wherein: the method comprises the following steps: when the super-infiltration diamond microchannel is used for heat dissipation, the super-infiltration diamond microchannel is installed on a convective heat transfer experiment platform in a heat sink mode, a double-fluid cooling working medium consisting of water and liquid metal is adopted for cooling, wherein the diamond microchannel is completely wetted by cooling water in advance, and then a heat source is cooled under a certain working condition by using a liquid metal and water mixed solution after ultrasonic dispersion.
9. The method of using a super-infiltrated diamond microchannel heat sink as recited in claim 8, wherein: the liquid metal is gallium-based liquid alloy Ga68In20Sn12The water is distilled water at room temperature, and when the liquid metal is subjected to ultrasonic dispersion, the pH value of the aqueous solution is adjusted to be 4-6 or 8-10, so that the solution is weakly acidic or weakly alkaline.
10. The method of using a super-infiltrated diamond microchannel heat sink as recited in claim 9, wherein: the temperature of the liquid metal and water mixed solution is 15-30 ℃, the ultrasonic dispersion power is 1-20 kilowatts, and the frequency is 20-40 KHz.
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| CN115044892A (en) * | 2022-05-24 | 2022-09-13 | 中国电子科技集团公司第三十八研究所 | Surface modification method of diamond micro-groove heat sink device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115044892A (en) * | 2022-05-24 | 2022-09-13 | 中国电子科技集团公司第三十八研究所 | Surface modification method of diamond micro-groove heat sink device |
| CN115044892B (en) * | 2022-05-24 | 2024-03-26 | 中国电子科技集团公司第三十八研究所 | Surface modification method of diamond micro-groove heat sink device |
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