CN114226145A - Electronic chip gluing device and gluing method - Google Patents
Electronic chip gluing device and gluing method Download PDFInfo
- Publication number
- CN114226145A CN114226145A CN202111603529.9A CN202111603529A CN114226145A CN 114226145 A CN114226145 A CN 114226145A CN 202111603529 A CN202111603529 A CN 202111603529A CN 114226145 A CN114226145 A CN 114226145A
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- Prior art keywords
- moving
- glue
- chip
- assembly
- base
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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Abstract
The invention discloses an electronic chip gluing device, which corresponds to a chip on a carrier and comprises a base, a moving seat, a side-moving driving assembly, a cleaning box, a cleaning wheel, a driving motor, a moving assembly and a glue extruder, wherein the moving seat is arranged on the base; the movable seat is movably connected to the base through a sliding rail, the side-shifting driving assembly is installed on the base, and the side-shifting driving assembly drives the movable seat to move; the cleaning box is arranged on the base, the cleaning wheel is arranged in the cleaning box, a transmission gear is arranged at the end part of the cleaning wheel, the driving motor is arranged below the base, and the driving motor drives the transmission gear to rotate; the moving assembly is arranged on the moving seat, and the glue extruder is arranged at the moving end of the moving assembly; the lower end of the glue extruder is a plane, a plurality of uniformly distributed fine round holes are formed in the lower end face of the glue extruder, and the glue is extruded from the round holes. The invention has the advantages of high gluing quality and high gluing efficiency.
Description
Technical Field
The invention relates to the technical field of electronic element production, in particular to an electronic chip gluing device and a gluing method.
Background
In household appliances, such as televisions, refrigerators and the like, in order to achieve a good heat dissipation effect of an integrated circuit chip (IC) on an internal circuit board, the IC is mounted on a heat sink. At present, heat dissipation glue is coated on an IC, then the IC is placed on a fixing hole of a heat sink, and finally a screw is fixed by using an air screwdriver or an electric screwdriver. The electronic chip shown in fig. 15 is composed of a chip (100) and a heat sink (200).
Chinese invention patent application (publication No. CN101521149B, published japanese 2011.01.12) discloses an automatic assembling apparatus for assembling an IC chip with a heat sink, comprising: a base; the device comprises a radiator loading device, a radiating oil loading device, an IC chip loading device, a screw feeding device and a fastening device which are driven by a control circuit controlled by a microprocessor; the radiator loading device is arranged on the base and is provided with a slideway for the radiator to slide, so that the radiator slides to a corresponding station along the slideway; the heat dissipation oil loading device drives the dipping part to dip heat dissipation oil by a moving structure capable of moving horizontally and vertically and coats the heat dissipation oil to the radiator; the IC chip loading device separates the IC chips and sends the IC chips to the station one by one, and the IC chips are absorbed by an absorption part arranged on the moving structure and are installed on the radiator; a screw outlet of the screw feeding device is aligned with a fixing hole of the radiator on the station, and screws are fed to the fixing holes one by one; and the fastening device is positioned vertically above the fixing hole and is used for screwing and fastening the screw in the fixing hole.
The prior art has the following defects: 1. the glue is not uniform, and the gluing efficiency is low; 2. the chip feeding efficiency is low, the chip shapes are not uniform, and the feeding needs to be adjusted in posture; 3. the assembly efficiency is low, and the automation degree is low; 4. the screw screwing process is multiple, the efficiency is low, and the success rate is low.
Disclosure of Invention
The invention aims to provide a gluing device and a gluing method for an electronic chip, which are high in gluing quality and gluing efficiency, aiming at the problems of uneven glue and low gluing efficiency in the prior art.
For the purpose of the invention, the following technical scheme is adopted for realizing the purpose:
an electronic chip gluing device corresponds to a chip on a carrier and comprises a base, a moving seat, a lateral moving driving assembly, a cleaning box, a cleaning wheel, a driving motor, a moving assembly and a glue extruder; the movable seat is movably connected to the base through a sliding rail, the side-shifting driving assembly is installed on the base, and the side-shifting driving assembly drives the movable seat to move; the cleaning box is arranged on the base, the cleaning wheel is arranged in the cleaning box, a transmission gear is arranged at the end part of the cleaning wheel, the driving motor is arranged below the base, and the driving motor drives the transmission gear to rotate; the moving assembly is arranged on the moving seat, and the glue extruder is arranged at the moving end of the moving assembly; the lower end of the glue extruder is a plane, a plurality of uniformly distributed fine round holes are formed in the lower end face of the glue extruder, and the glue is extruded from the round holes.
Preferably, the side-shifting driving assembly comprises a motor, a lead screw nut and a transmission belt, the lead screw nut is fixed with the moving seat, the lead screw and the lead screw nut form spiral fit, synchronizing wheels are arranged at the shaft end of the motor and the shaft end of the lead screw, and the transmission belt wheel is connected with the two synchronizing wheels.
Preferably, the moving assembly comprises a screw rod module, a transverse moving plate, a lifting cylinder and a lifting mounting plate; the sideslip board is installed at the motion end of lead screw module, and the lift cylinder is vertical to be installed on the sideslip board, and the lift mounting panel passes through the slide rail and removes the connection on the sideslip board, and the flexible end of lift cylinder is connected with the lift mounting panel.
Preferably, the cleaning box is provided with a cleaning liquid, and the cleaning wheel is cylindrical.
Preferably, the carrier is provided with a left station and a right station, and two chips and a radiator can be placed at the same time; the carrier comprises a carrier bottom plate, a movable clamping block, a fixed clamping block, a first radiator positioning block, a second radiator positioning block and a cover plate; the movable clamping blocks are movably connected in the carrier base plate, the cover plate is fixed on the carrier base plate and located above the movable clamping blocks, springs are arranged between the movable clamping blocks and the carrier base plate, the fixed clamping blocks are fixedly arranged on the carrier base plate, and the movable clamping blocks are opposite to the fixed clamping blocks to clamp the chip together.
Preferably, the first radiator positioning block is arranged above the fixed clamping block, the second radiator positioning block is arranged above the movable clamping block, the first radiator positioning block corresponds to the second radiator positioning block, and the first radiator positioning block and the second radiator positioning block clamp the radiator together; rectangular holes are formed in the movable clamping block and the cover plate.
A glue spreading method for an electronic chip comprises the steps that a moving assembly drives a glue extruder to move to the upper end of the chip, glue is spread on the surface of the chip by the lower end of the glue extruder, then the moving assembly moves the glue extruder to a cleaning wheel, and residual glue at the lower end is removed; and then the driving component is moved to one side by a distance, and the moving component and the glue extruder continue to glue another chip.
The electronic chip gluing device and the method adopting the technical scheme have the advantages that: the lower end of the glue extruder is provided with the uniformly distributed pores, so that the extruded glue can be ensured to be fine and uniform to spread, and the advantage of uniform gluing is achieved; the lower end of the glue extruder is cleaned by the cleaning wheel, so that dripping is prevented, the problem of glue solidification can be avoided, and the discharge hole is easy to block. The carrier realizes that the chip and the radiator are fixed a position when tight, and the clamp force passes through the spring and produces, keeps the state of normal close, just opens when wedge insertion process, and the drive mode is simple stable more.
Drawings
FIG. 1 is a block diagram of an embodiment of the present invention.
Fig. 2 is a structural view of the conveyance device.
Fig. 3 is a structural view of the carrier.
Fig. 4 is a structural view of a chip supply apparatus.
Figure 5 is a block diagram of a rotary silo assembly.
Fig. 6 is a structural diagram of the transfer assembly.
Fig. 7 is a block diagram of a shaping assembly and a foot cutting assembly.
Fig. 8 is a block diagram of the carrier assembly and the direction-adjusting assembly.
Fig. 9 is a structural view of the glue application device.
Fig. 10 is a structural view of a moving assembly.
Fig. 11 is a schematic end view of a glue extruder.
Fig. 12 is a structural view of a screw driving device.
FIG. 13 is a view showing the position of an end stop and a topping column.
Fig. 14 is a structural view of the blanking apparatus.
Fig. 15 is a structural view of a product.
Detailed Description
As shown in fig. 1, an electronic chip assembling apparatus includes a frame 1, and a conveying device 2, a chip feeding device 3, a gluing device 4, a screw screwing device 5 and a discharging device 6 which are mounted on the frame 1; the conveying device 2 is a rotating disc type, a chip feeding station, a gluing station, a radiator feeding station, a screw screwing station and a blanking station are sequentially arranged on one circle of the conveying device 2, the chip feeding device 3 corresponds to the chip feeding station, the gluing device 4 corresponds to the gluing station, a feeding manipulator is arranged at the radiator feeding station, the screw screwing device 5 corresponds to the screw screwing station, and the blanking device 6 corresponds to the blanking station; the conveying device 2 is provided with carriers, one carrier can be used for placing two electronic chips, the chip feeding devices 3 are provided with two groups, the screw screwing devices 5 are also provided with two groups, and feeding and assembling of the two electronic chips can be carried out. The above-mentioned glue spreading device 4 is a glue spreading device for electronic chips.
The conveying device 2 is used for positioning and placing the chip and the radiator and driving the chip and the radiator to rotate between stations; chip feedway 3 is arranged in with chip feed to conveyor 2, and rubber coating device 4 is used for carrying out the rubber coating to the chip surface, and the feed manipulator is used for the radiator feed to the chip on, screws device 5 and is used for connecting chip and radiator.
As shown in fig. 2, the conveying device 2 includes a speed reduction motor 21, a divider 22, a turntable 23, and a carrier 24; an output shaft of the speed reducing motor 21 is connected with an input shaft of the divider 22 through a belt wheel, a turntable 23 is arranged on the output shaft above the divider 22, and carriers 24 are uniformly arranged on the periphery of the turntable 23.
As shown in fig. 3, the carrier 24 is provided with a left station and a right station for placing two chips and a heat sink at the same time; the carrier 24 comprises a carrier base plate 241, a movable clamping block 242, a fixed clamping block 243, a first heat radiator positioning block 244, a second heat radiator positioning block 245 and a cover plate 247; the movable clamping block 242 is movably connected in the carrier base plate 241, the cover plate 247 is fixed on the carrier base plate 241, the cover plate 247 is positioned above the movable clamping block 242, a spring is arranged between the movable clamping block 242 and the carrier base plate 241, the fixed clamping block 243 is fixedly arranged on the carrier base plate 241, and the movable clamping block 242 and the fixed clamping block 243 are opposite to clamp the chip together; the first radiator positioning block 244 is installed above the fixed clamping block 243, the second radiator positioning block 245 is installed above the movable clamping block 242, the first radiator positioning block 244 corresponds to the second radiator positioning block 245, and the first radiator positioning block 244 and the second radiator positioning block 245 clamp the radiator together; the movable clamping block 242 and the cover plate 247 are provided with rectangular holes 246.
When the conveying device 2 works, the movable clamping block 242 and the fixed clamping block 243 clamp the chip, the speed reducing motor 21 drives the divider 22 to work, and the divider 22 drives the carrier 24 on the turntable 23 to intermittently rotate; then the heat sink is placed between the first heat sink positioning block 244 and the second heat sink positioning block 245, and the chip is located below the heat sink; the purpose of carrying the workpiece to rotate is achieved.
As shown in fig. 4-8, the chip feeder 3 includes a base frame 30, a rotary bin assembly 31, an arc-shaped material passing rail 32, a material moving assembly 33, a shaping assembly 34, a foot cutting assembly 35, a carrying assembly 36 and a direction adjusting assembly 37; the underframe 30 comprises an upper platform and a lower platform, the rotary stock bin assembly 31 is arranged on the upper platform, and the material moving assembly 33 is arranged on the lower platform; the upper end of the arc-shaped material passing rail 32 is vertical and is connected with the discharge end of the rotary bin assembly 31; the lower end of the arc-shaped material passing rail 32 is horizontal and is connected with the feeding end of the material moving component 33; shaping subassembly 34 and cutting foot subassembly 35 set up in the side of shifting material subassembly 33, and the subassembly 37 of transferring to is installed on lower platform, and carrying subassembly 36 links up the discharge end of shifting material subassembly 33 and transfers to subassembly 37.
Rotatory feed bin subassembly 31 be used for storing the chip, move material subassembly 33 and be used for realizing the chip step-by-step removal, plastic subassembly 34 is used for carrying out the shaping to the pin of chip and presses, cuts foot subassembly 35 and is used for amputating the unnecessary pin of chip, transfers to subassembly 37 and is used for carrying out the gesture adjustment with the chip, and transport subassembly 36 is used for absorbing the chip and carries.
The rotary bin assembly 31 comprises a circular disc 311, a bin 312, a rotating shaft 313, a driving air cylinder 314, a swing rod 315, a push claw 3151, a ratchet disc 316, a non-return claw 317, a material stopping air cylinder 318 and a material stopping column 319; the center of the circular plate 311 is fixed with a rotating shaft 313, the rotating shaft 313 is fixed on the upper platform, and the ratchet plate 316 is hinged on the rotating shaft 313; one end of the swing rod 315 is hinged with the rotating shaft 313, the other end of the swing rod 315 is connected with the telescopic end of the driving cylinder 314, and the fixed end of the driving cylinder 314 is hinged on the upper platform; the push pawl 3151 is hinged in the middle of the swing rod 315, a torsion spring is arranged on the hinged center of the push pawl 3151, the torsion spring presses the push pawl 3151 on the ratchet wheel disc 316, a plurality of notches are arranged on the circumference of the ratchet wheel disc 316, and the notches correspond to the tip of the push pawl 3151; the non-return claw 317 is hinged on the upper platform, and the non-return claw 317 is also pressed on the ratchet wheel disc 316; the plurality of storage bins 312 are arranged, the plurality of storage bins 312 are arranged on the periphery of the circular disc 311, the material stopping cylinder 318 is arranged at the upper end of the rotating shaft 313, the material stopping column 319 is fixed on a connecting block, and the connecting block is arranged at the telescopic end of the material stopping cylinder 318; wedge ports 3121 are arranged on the corners of the storage bin 312, and the wedge ports 3121 correspond to the extended connecting blocks; a side hole 3122 is provided on the bin 312, the material stopping column 319 is located in the side hole 3122, and the material stopping column 319 corresponds to the round hole on the chip.
The material moving assembly 33 comprises a moving rail 331, a front material receiving seat 332, a first side moving cylinder 333, a cross bar 334, a side moving cylinder 335, a one-way push block 336, a rear material receiving seat 337 and a second side moving cylinder 338; the cross bar 334 is movably connected below the moving rail 331, the one-way push blocks 336 are uniformly connected on the cross bar 334, the upper ends of the one-way push blocks 336 are provided with inclined planes, the one-way push blocks 336 can swing, and the one-way push blocks 336 push the chips to be conveyed in a one-way mode; the front receiving base 332 is movably connected to the feeding end of the moving rail 331, and the telescopic end of the first side moving cylinder 333 is connected with the front receiving base 332; the rear material receiving seat 337 is movably connected to the discharge end of the moving rail 331, the rear material receiving seat 337 is connected to the telescopic end of the second sideshift cylinder 338, and the front material receiving seat 332 and the rear material receiving seat 337 are provided with sinking grooves, and the shapes of the sinking grooves are matched with those of the chips; the side of the moving rail 331 is provided with a first notch 3311 and a second notch 3312, at which the leads of the chip are exposed.
The shaping assembly 34 comprises a first support 341, a first downward air cylinder 342, a downward pressing block 343 and a forming block 344; the first support 341 is fixedly arranged, the first downward-pressing cylinder 342 is installed above the first support 341, the downward-pressing block 343 is installed at the telescopic end of the first downward-pressing cylinder 342, the molding block 344 is fixed on the first support 341, the molding block 344 corresponds to the downward-pressing block 343, and the bonding surface of the molding block 344 and the downward-pressing block 343 is in a step shape, so that the pins are pressed into a folded shape.
The cutting foot assembly 35 comprises a second support 351, a second downward-pressing cylinder 352, a pressing block 353, a cutting knife 354 and a support 355; the second downward air cylinder 352 is arranged at the upper end of the second support 351, the telescopic end of the second downward air cylinder 352 is provided with an installation seat 3521, the pressing block 353 is elastically connected to the installation seat 3521, and the cutting knife 354 is fixedly connected to the installation seat 3521; the abutting seat 355 is installed on the side of the second support 351, the upper end plane of the abutting seat 355 corresponds to the pressing block 353, and the cutting knife 354 corresponds to the side of the abutting seat 355.
The carrying assembly 36 comprises a two-degree-of-freedom moving mechanism 361, a slide bar 362, a suction block 363 and a wedge block 364; the two-degree-of-freedom moving mechanism 361 is fixedly arranged, the slide bar 362 is horizontally arranged at the moving tail end of the two-degree-of-freedom moving mechanism 361, the suction blocks 363 are arranged at two ends of the slide bar 362, the wedge block 364 is fixedly arranged at the moving tail end of the two-degree-of-freedom moving mechanism 361, and an inclined plane is arranged on the side of the lower end of the wedge block 364.
The direction adjusting assembly 37 comprises a gear shaft 371, a receiving seat 372, a rack 373 and a direction adjusting cylinder 374; the gear shaft 371 articulates on chassis 30, and the seat 372 is installed in the upper end of gear shaft 371, is provided with the scarce groove that just can place the chip on the seat 372, and rack 373 removes the connection on chassis 30, transfers to cylinder 374 fixed setting on chassis 30, transfers to cylinder 374 flexible end and is connected with rack 373, and rack 373 meshes with gear shaft 371 mutually.
When the chip feeding device 3 works, the chips are sent out from the rotary bin assembly 31, conveyed by the arc-shaped material passing rail 32 and conveyed to the material moving assembly 33, intermittently moved at the material moving assembly 33, and are pressed and molded by the shaping assembly 34 in sequence, and redundant pins of the chips are cut off by the pin cutting assembly 35; the carrying module 36 carries the chip to the direction-adjusting module 37, and carries out the chip after rotating the chip by a certain angle, and then the carrying module 36 carries out the chip.
The chip feeding device 3 solves the problems that the chip feeding efficiency is low, the chip appearance is not uniform, and the feeding posture needs to be adjusted; the rotary bin assembly 31 greatly improves the storage capacity of the chips, and the rotary switching improves the feeding efficiency and avoids feeding waiting; the pins of the chip are processed by arranging the shaping assembly 34 and the pin cutting assembly 35, so that the chip uniformity of feeding is improved, and the qualification rate of the chip is improved; the posture of the chip is adjusted by the direction adjusting component 37, so that the device is suitable for carriers arranged in a circumferential mode, and the success rate of chip feeding is improved.
As shown in fig. 9 and 11, an electronic chip gluing device comprises a base 41, a moving base 42, a side-shifting driving assembly 43, a cleaning box 44, a cleaning wheel 45, a driving motor 46, a moving assembly 47 and a glue extruder 48; the movable seat 42 is movably connected to the base 41 through a sliding rail, the side shift driving assembly 43 is installed on the base 41, and the side shift driving assembly 43 drives the movable seat 42 to move; the cleaning box 44 is arranged on the base 41, the cleaning wheel 45 is arranged inside the cleaning box 44, a transmission gear is arranged at the end part of the cleaning wheel 45, the driving motor 46 is arranged below the base 41, and the driving motor 46 drives the transmission gear to rotate; the moving assembly 47 is mounted on the moving base 42, and the glue extruder 48 is mounted on the moving end of the moving assembly 47.
The side-shifting driving assembly 43 comprises a motor, a lead screw nut and a transmission belt, the lead screw nut is fixed with the shifting base 42, the lead screw and the lead screw nut form a spiral fit, synchronizing wheels are arranged at the shaft end of the motor and the shaft end of the lead screw, and the transmission belt wheel is connected with the two synchronizing wheels.
The moving assembly 47 comprises a lead screw module 471, a traverse plate 472, a lifting cylinder 473 and a lifting mounting plate 474; the traverse plate 472 is installed at the moving end of the lead screw module 471, the lifting cylinder 473 is vertically installed on the traverse plate 472, the lifting mounting plate 474 is movably connected to the traverse plate 472 through a sliding rail, and the telescopic end of the lifting cylinder 473 is connected to the lifting mounting plate 474.
The lower end of the glue extruder 48 is a plane, a plurality of uniformly distributed fine round holes are formed in the lower end face, and the glue is extruded from the round holes.
When the electronic chip gluing device works, the moving assembly 47 drives the glue extruder 48 to move to the upper end of the chip, the lower end of the glue extruder 48 coats glue on the surface of the chip, and then the moving assembly 47 moves the glue extruder 48 to the cleaning wheel 45 to remove residual glue at the lower end; then the drive assembly 43 is moved laterally a distance and the moving assembly 47 and glue extruder 48 continue to apply glue to another chip.
The electronic chip gluing device solves the problems of uneven glue and low gluing efficiency, and the lower end of a glue extruder 48 is provided with uniformly distributed pores, so that the extruded glue can be ensured to be fine and uniform spread, and the advantage of uniform gluing is achieved; the lower end of the glue extruder 48 is cleaned by the cleaning wheel 45, so that dripping is prevented, the problem of glue solidification can be avoided, and a discharge hole is easy to block; set up and move drive assembly 43 drive glue extruder 48 round trip movement to the side, can realize carrying out the rubber coating respectively to two chips, raise the efficiency.
As shown in fig. 12 and 13, the screwing device 5 includes a base 51, a screwing assembly 52, a vibration rail 53, a straight vibrator 54, a side seat 55, a separation cylinder 56, a separation seat 57, an end stopper 58, a knockout pin 59, and a jacking cylinder 510; the screwing component 52 is arranged at the upper end of the base 51, the vibration material rail 53 is arranged at the upper end of the straight vibrator 54, and a channel for the hexagon nut to pass through is arranged in the vibration material rail 53; the side seat 55 is arranged on the side of the base 51, the upper end surface of the side seat 55 is provided with a rectangular hole, the separating seat 57 is in a T shape, and the horizontal part of the separating seat 57 is movably connected in the rectangular hole on the side seat 55; the end part stop block 58 is fixedly arranged on the separating seat 57, the material ejecting column 59 is movably matched in the separating seat 57, the material ejecting column 59 is positioned on the side of the end part stop block 58, the jacking cylinder 510 is arranged on the vertical part of the separating seat 57, and the telescopic end of the jacking cylinder 510 is connected with the material ejecting column 59; the upper end of the end stop block 58 is in a stepped shape, a hexagonal counter bore is formed in the upper end of the material ejection column 59, the size of the hexagonal counter bore is matched with the shape of the nut, a round hole is further formed in the center of the hexagonal counter bore, the diameter of the round hole is larger than the large diameter of the screw, and a notch is formed in the side edge, corresponding to the vibration material rail 53, of the hexagonal counter bore so that the nut can pass through.
The vibrating material rail 53 comprises a bottom rail 531 and a cover rail 532, the cover rail 532 is arranged on the bottom rail 531, the width of a groove on the bottom rail 531 is matched with the distance between opposite edges of the nut, and the posture of the sent nut is limited; the end of the bottom rail 531 is provided with a protrusion 533, and the protrusion 533 is provided with an optical fiber sensor, and the optical fiber sensor corresponds to the nut at the end of the vibrating material rail 53.
The screwing assembly 52 comprises a longitudinal moving cylinder 521, an adjusting seat 522, a spinning machine 523 and a tip seat 524; the longitudinal moving cylinder 521 is fixed on the base 51, the adjusting seat 522 is movably connected to the base 51 through a slide rail, and the telescopic end of the longitudinal moving cylinder 521 is connected with the adjusting seat 522; the spinning machine 523 and the tip seat 524 are fixed on the adjusting seat 522, the spinning machine 523 is positioned right above the tip seat 524, a vertical through hole is formed in the tip seat 524, an inclined hole is further formed in the side of the tip seat 524, the inclined hole penetrates through the vertical through hole, and a conduit is connected to the inclined hole and connected with the end of the screw material shaking device; elastic clamping jaws are arranged on two sides of the lower end portion of the sharp-mouth seat 524 and used for clamping screws. The end of the straight vibrator 54 is provided with a circular vibrator, and the discharge end of the circular vibrator is connected with the feed end of the straight vibrator 54.
When the screw screwing device 5 works, screws are vibrated out, sent to the sharp mouth seat 524 and fall into the vertical through holes after passing through the inclined holes; the nut is sent out through the straight oscillator 54, and after the nut withstood the end stop 58, the optical fiber sensor detects that the rear separation cylinder 56 contracts, the separation seat 57 is driven to move, the nut falls into the material jacking column 59, the rear jacking cylinder 510 rises, the nut is lifted, the rear screwing screw assembly 52 descends, and the rear spinning machine 523 works to screw the screw into the nut.
The screw twisting device 5 solves the problems of multiple screw twisting procedures, low efficiency and low success rate, realizes automatic ordered feeding of nuts and screws by arranging a vibration feeder, realizes feeding of the screws and the nuts at one station, and improves the screw twisting efficiency; set up accurate separation and the fixing of end stop 58 and liftout post 59 realization nut, prevent the nut dislocation at the in-process of twisting the screw, improve the success rate of twisting the screw.
As shown in fig. 14, the discharging device 6 includes a moving module 61, a connecting seat 62, a driving rod 63 and a suction cup 64, the connecting seat 62 is installed at the moving end of the moving module 61, the lower end of the driving rod 63 is provided with an inclined surface, the driving rod 63 is arranged at the lower end of the connecting seat 62, and the suction cup 64 is installed on the connecting seat 62.
Claims (7)
1. An electronic chip gluing device corresponds to a chip on a carrier (24), and is characterized by comprising a base (41), a moving seat (42), a side-moving driving assembly (43), a cleaning box (44), a cleaning wheel (45), a driving motor (46), a moving assembly (47) and a glue extruder (48); the movable seat (42) is movably connected to the base (41) through a sliding rail, the side-shifting driving component (43) is installed on the base (41), and the side-shifting driving component (43) drives the movable seat (42) to move; the cleaning box (44) is arranged on the base (41), the cleaning wheel (45) is arranged in the cleaning box (44), a transmission gear is arranged at the end part of the cleaning wheel (45), the driving motor (46) is arranged below the base (41), and the driving motor (46) drives the transmission gear to rotate; the moving assembly (47) is arranged on the moving seat (42), and the glue extruder (48) is arranged at the moving end of the moving assembly (47); the lower end of the glue extruder (48) is a plane, a plurality of uniformly distributed fine round holes are formed in the lower end face, and the glue is extruded from the round holes.
2. The gluing device of the electronic chip as claimed in claim 1, wherein the lateral movement driving assembly (43) comprises a motor, a lead screw nut and a transmission belt, the lead screw nut is fixed with the moving base (42), the lead screw and the lead screw nut form a spiral fit, a motor shaft and a lead screw shaft end are provided with synchronous wheels, and the transmission belt wheel is connected with the two synchronous wheels.
3. The gluing device for electronic chips as claimed in claim 1, wherein the moving assembly (47) comprises a lead screw module (471), a traverse plate (472), a lifting cylinder (473), and a lifting mounting plate (474); the traverse moving plate (472) is installed at the moving end of the lead screw module (471), the lifting cylinder (473) is vertically installed on the traverse moving plate (472), the lifting installation plate (474) is movably connected to the traverse moving plate (472) through a sliding rail, and the telescopic end of the lifting cylinder (473) is connected with the lifting installation plate (474).
4. The gluing device for electronic chips according to claim 1, wherein the cleaning tank (44) is filled with a cleaning fluid and the cleaning wheel (45) is cylindrical.
5. The gluing device of an electronic chip as claimed in claim 1, wherein the carrier (24) is provided with a left station and a right station for placing two chips and a heat sink at the same time; the carrier (24) comprises a carrier base plate (241), a movable clamping block (242), a fixed clamping block (243), a first heat radiator positioning block (244), a second heat radiator positioning block (245) and a cover plate (247); the movable clamping block (242) is movably connected in the carrier base plate (241), the cover plate (247) is fixed on the carrier base plate (241), the cover plate (247) is located above the movable clamping block (242), a spring is arranged between the movable clamping block (242) and the carrier base plate (241), the fixed clamping block (243) is fixedly arranged on the carrier base plate (241), and the movable clamping block (242) is opposite to the fixed clamping block (243) to clamp the chip together.
6. The gluing device for the electronic chip as recited in claim 1 or 5, wherein a first heat sink positioning block (244) is installed above the fixed clamping block (243), a second heat sink positioning block (245) is installed above the movable clamping block (242), the first heat sink positioning block (244) corresponds to the second heat sink positioning block (245), and the first heat sink positioning block (244) and the second heat sink positioning block (245) clamp the heat sink together; the movable clamping block (242) and the cover plate (247) are provided with rectangular holes (246).
7. A glue spreading method for an electronic chip is characterized in that a moving assembly (47) drives a glue extruder (48) to move to the upper end of the chip, glue is spread on the surface of the chip by the lower end of the glue extruder (48), then the moving assembly (47) moves the glue extruder (48) to a cleaning wheel (45), and residual glue at the lower end is removed; then the lateral moving driving assembly (43) moves a distance to the side, and the moving assembly (47) and the glue extruder (48) continue to glue another chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111603529.9A CN114226145A (en) | 2021-12-24 | 2021-12-24 | Electronic chip gluing device and gluing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111603529.9A CN114226145A (en) | 2021-12-24 | 2021-12-24 | Electronic chip gluing device and gluing method |
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| Publication Number | Publication Date |
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| CN114226145A true CN114226145A (en) | 2022-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111603529.9A Withdrawn CN114226145A (en) | 2021-12-24 | 2021-12-24 | Electronic chip gluing device and gluing method |
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| Country | Link |
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| CN (1) | CN114226145A (en) |
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2021
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| US6302961B1 (en) * | 1999-07-12 | 2001-10-16 | Ennis Automotive, Inc. | Apparatus for applying a liquid coating to electrical components |
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| CN213494649U (en) * | 2020-09-17 | 2021-06-22 | 通达（厦门）精密橡塑有限公司 | Rotary spot coating device for plastic workpieces |
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