CN114188473A

CN114188473A - Packaging structure and method of surface acoustic wave device

Info

Publication number: CN114188473A
Application number: CN202111212417.0A
Authority: CN
Inventors: 刘国君; 沈望皓; 董轮涛; 李新波; 孙晓东; 王聪慧; 王猛; 李鹏飞; 李星奇; 刘晓鹏
Original assignee: Jilin University
Current assignee: Jilin University
Priority date: 2021-10-18
Filing date: 2021-10-18
Publication date: 2022-03-15

Abstract

The invention provides a packaging structure and a method of a surface acoustic wave device, which comprises a connecting plate; the top of the connecting plate is provided with an installation structure, the top of the installation structure is provided with a protective cover, and the center of the top of the installation structure is provided with a driving structure; the two gears are meshed with the two moving blocks I and the two moving blocks II, so that the piezoelectric base bodies are centered and clamped by the clamping plates I and the clamping plates II, clamping damage and damage of the piezoelectric base bodies due to one side stress are reduced, the limit block is arranged, the limit main body and the piezoelectric base bodies are positioned on the same central line, the grounding metal electrode and the interdigital transducer are prevented from being skewed and dislocated during packaging, and packaging accuracy is improved.

Description

Packaging structure and method of surface acoustic wave device

Technical Field

The invention belongs to the technical field of packaging, and particularly relates to a packaging structure and a packaging method of a surface acoustic wave device.

Background

The surface acoustic wave device utilizes the characteristics of an acoustic-electric transducer to carry out various treatments on acoustic signals transmitted on the surface of a piezoelectric material substrate and complete solid devices with various functions.

If the application number is: CN201811645476.5 discloses a method and structure for packaging a surface acoustic wave device, wherein one method includes: forming a metal layer on the surface of the carrier plate provided with the temporary bonding layer; forming a salient point and a first medium layer on the metal layer, wherein the first medium layer covers the side wall of the salient point and exposes the salient point; arranging a surface acoustic wave device with a second medium layer on the surface of the first medium layer, wherein the second medium layer is provided with a first gap to expose a bonding pad and a device functional area of the surface acoustic wave device; the salient points are positioned in the first notches corresponding to the bonding pads of the surface acoustic wave device and are electrically connected with the bonding pads of the surface acoustic wave device; according to the invention, the cavity on the surface of the functional region of the device is formed by the second medium layer between the surface acoustic wave device and the first medium layer, and the pad of the surface acoustic wave device is electrically connected with the metal layer by the salient points penetrating through the first medium layer and the second medium layer.

Based on the above, the inventor finds that the current packaging structure cannot clamp packaged products when in use, cannot guarantee the accuracy of packaging for some high-precision research and development projects, reduces the universality of the device, is easy to overflow redundant solder when packaging the products, reduces the attractiveness of the products, is easy to cause short circuit of the products seriously, generates more defective products and is inconvenient to use, and the current packaging structure cannot meet the current use requirements.

Disclosure of Invention

In order to solve the technical problems, the invention provides a packaging structure and a packaging method of a surface acoustic wave device, which aim to solve the problems that a packaged product cannot be clamped when the packaging structure is used, the packaging accuracy cannot be guaranteed for some high-precision research and development projects, the universality of the device is reduced, redundant welding flux is easy to overflow when the product is packaged, the attractiveness of the product is reduced, and the product is easy to cause short circuit when the product is serious, so that a plurality of defective products are generated.

The invention relates to a packaging structure of a surface acoustic wave device and a method thereof, which are achieved by the following specific technical means:

a packaging structure of a surface acoustic wave device comprises a connecting plate;

the top of the connecting plate is provided with an installation structure, the top of the installation structure is provided with a protective cover, and the center of the top of the installation structure is provided with a driving structure;

the outer connecting devices are provided with two groups, the two groups of outer connecting devices are arranged at the top of the mounting structure, the two groups of inner connecting devices are arranged at the top of the mounting structure, and the two groups of inner connecting devices are positioned at the inner sides of the two groups of outer connecting devices;

the front clamping device is arranged on the left sides of the two groups of external connecting devices, the rear clamping device is arranged on the left sides of the two groups of internal connecting devices, and piezoelectric substrates are arranged on the inner sides of the front clamping device and the rear clamping device;

the limiting device comprises a limiting main body, a front clamping device and a rear clamping device, wherein the limiting main body is arranged at the tops of the front clamping device and the rear clamping device, a grounding metal electrode, an interdigital transducer and a welding ring are arranged in the limiting main body, the limiting main body is internally provided with the limiting device, and a pressing device is arranged in the limiting main body;

the driving structure includes:

the two mounting plates are arranged and are of an L-shaped structure, and the two mounting plates are fixedly connected with the base;

electric telescopic handle, electric telescopic handle fixed mounting are in the inside of two mounting panels.

Further, the rear clamping device includes:

the second clamping plate is of a rectangular plate-shaped structure and is fixedly arranged on the left side of the two moving blocks II;

the second supporting plate is fixedly arranged on the left side of the second clamping plate, and a placing groove is formed in the top of the second supporting plate;

the second magnet is fixedly arranged inside the second clamping plate, and the top surface of the second magnet is flush with the top surface of the second clamping plate;

the second sliding chute is arranged together; two sliding chutes II penetrate through the clamping plate II, and are connected with the two limiting rods in a sliding manner;

and the two connecting holes are in sliding connection with the two connecting rods.

Further, the external connection device includes:

the first connecting rods are provided with two connecting rods in total, and the first connecting rods are connected inside the mounting block in a sliding manner;

the first moving blocks are provided with two moving blocks in total, the two moving blocks are fixedly mounted on the outer walls of the first connecting rods, gear rows are welded on the inner sides of the two moving blocks, and the gear rows of the two moving blocks are meshed with the two gears.

Further, stop device includes:

the two sliding rods are arranged and are connected inside the limiting rod in a sliding manner;

the limiting blocks are fixedly arranged on the inner sides of the two sliding rods, and springs are fixedly arranged between the limiting blocks and the limiting rods;

the pulling plate is fixedly arranged on the outer sides of the two sliding rods, and a handle is fixedly arranged on the outer side of the pulling plate.

Further, the mounting structure includes:

the base is of a rectangular plate-shaped structure and is fixedly connected with the connecting plate;

the eight mounting blocks are fixedly mounted at the top of the base, and through holes are formed in the eight mounting blocks in a penetrating manner;

the gear, the gear is equipped with two altogether, and two gears rotate through the pivot and install the top at the base.

Further, the method is simple and convenient to operate.

Further, spacing main part includes:

the mounting groove penetrates through the limiting main body, and the size of the mounting groove is the same as that of the grounding metal electrode, the interdigital transducer and the welding ring;

the two limiting grooves are arranged on two sides of the limiting main body;

the limiting rods are arranged at two positions, and the two limiting rods are fixedly arranged at the bottom of the limiting main body.

Further, the pressing device includes:

the pressing block is of a rectangular plate-shaped structure, and the top of the pressing block is fixedly provided with a handle;

the elastic pieces are arranged in twenty-one mode, the twenty-one elastic pieces are of circular structures, and the twenty-one elastic pieces are fixedly arranged at the bottom of the pressing block;

the pressing plate is of a rectangular plate-shaped structure and is fixedly arranged at the bottom of the twenty-one elastic piece;

the two fixing plates are fixedly arranged on two sides of the pressing block, and through grooves are formed in the two fixing plates in a penetrating mode;

the fixing blocks are arranged in two numbers, the cross sections of the two fixing blocks are of T-shaped structures, and the two fixing blocks are slidably mounted inside the two fixing plates.

Further, the front clamping device includes:

the first clamping plate is of a rectangular plate-shaped structure and is fixedly arranged on the left sides of the first two connecting rods;

the first supporting plate is fixedly arranged on the right side of the first clamping plate, and a placing groove is formed in the top of the first supporting plate;

the first magnet is fixedly arranged inside the first clamping plate, and the top surface of the first magnet is flush with the top surface of the first clamping plate;

the first sliding grooves and the second sliding grooves are totally two, the first sliding grooves penetrate through the inside of the first clamping plate, and the first sliding grooves are connected with the two limiting rods in a sliding mode.

Further, the packaging method of the surface acoustic wave device comprises the following steps:

1) the piezoelectric substrates to be packaged are placed in the placing grooves in the tops of the first supporting plate and the second supporting plate, then a worker starts a power supply of the electric telescopic rod, when the electric telescopic rod works, the first clamping plate and the second clamping plate move in a reverse direction, centering and clamping of the two pairs of piezoelectric substrates of the first clamping plate and the second clamping plate are achieved, and the piezoelectric substrates are always located at the same position;

2) then, the limiting main body is arranged at the tops of the first clamping plate and the second clamping plate, and then the pulling plate is pulled to insert and connect the limiting block in the piezoelectric base body, so that the limiting main body and the piezoelectric base body are positioned on the same central line;

3) and then the welding ring, the grounding metal electrode and the interdigital transducer are arranged in the limiting groove, the pressing device is arranged at the top of the grounding metal electrode and the top of the interdigital transducer, and twenty-one elastic piece is arranged at the top of the pressing plate, so that the grounding metal electrode and the interdigital transducer are tightly attached to the piezoelectric substrate during packaging.

The invention at least comprises the following beneficial effects:

1. according to the invention, the two gears are meshed and connected with the two moving blocks I and the two moving blocks II, when the electric telescopic rod works, the clamping plate I and the clamping plate II move reversely, so that the centering clamping of the piezoelectric substrate by the clamping plate I and the clamping plate II is realized, the clamping injury and damage of the piezoelectric substrate due to one side stress are reduced, the piezoelectric substrate is always in the same position due to the structure, the piezoelectric substrate is convenient to clamp and disassemble by packaging personnel, and the working efficiency of the packaging personnel is improved.

2. The arrangement of the mounting groove facilitates the installation of a grounding metal electrode, the interdigital transducer and the welding ring by a packaging worker, the pressing plates are arranged at the tops of the grounding metal electrode, the interdigital transducer and the welding ring, and twenty elastic pieces are arranged at the tops of the pressing plates, so that the grounding metal electrode and the interdigital transducer are tightly attached to the piezoelectric substrate during packaging, the packaging quality is improved, meanwhile, the limiting groove prevents the welding ring from overflowing to the outer sides of the grounding metal electrode and the interdigital transducer during melting, the packaging accuracy and the packaging attractiveness are improved, and the pressing blocks are connected with the limiting main body more firmly by the two fixing blocks.

3. The arrangement of the placing grooves formed in the tops of the first supporting plate and the second supporting plate is convenient for the device to place piezoelectric substrates with different lengths and different widths, so that the device is convenient to use for small-batch research and development projects, the cost for manufacturing packaging structures in factories is reduced, the intelligentization is high, the packaging efficiency and the packaging quality are improved, the limiting block is arranged, the limiting main body and the piezoelectric substrate are positioned on the same central line, the grounding metal electrode and the interdigital transducer are prevented from being skewed and staggered during packaging, the packaging accuracy is improved, the adjustment is convenient and fast, and the packaging personnel can conveniently and quickly master the device.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic top view of the present invention.

Fig. 3 is a schematic structural view of the hidden protective cover of the present invention.

Fig. 4 is a sectional view in the direction a of fig. 2 according to the present invention.

Fig. 5 is an exploded view of the internal components of the present invention.

Fig. 6 is a schematic view of the structure of fig. 4 from another view angle according to the present invention.

Fig. 7 is a partially enlarged structural view of the region B in fig. 3 according to the present invention.

Fig. 8 is a partially enlarged structural view of the region C in fig. 4 according to the present invention.

Fig. 9 is a partially enlarged view of region D of fig. 5 according to the present invention.

Fig. 10 is a partially enlarged structural view of the region E in fig. 6 according to the present invention.

Fig. 11 is a schematic structural diagram of another embodiment of the present invention.

In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:

1. a connecting plate;

2. a mounting structure; 201. a base; 202. mounting blocks; 203. a gear;

3. a protective cover;

4. an external connection device; 401. a first connecting rod; 402. moving a first block;

5. an inner connecting device; 501. a second connecting rod; 502. a second moving block;

6. a drive structure; 601. mounting a plate; 602. an electric telescopic rod;

7. a pressing device; 701. briquetting; 702. an elastic member; 703. pressing a plate; 704. a fixing plate; 705. a fixed block;

8. a limiting main body; 801. mounting grooves; 802. a limiting groove; 803. a limiting rod;

9. a front clamping device; 901. a first clamping plate; 902. a first support plate; 903. a magnet I; 904. a first sliding chute;

10. a rear clamping device; 1001. a second clamping plate; 1002. a second support plate; 1003. a second magnet; 1004. a second chute; 1005. connecting holes;

11. a limiting device; 1101. a slide bar; 1102. a limiting block; 1103. pulling a plate;

12. a piezoelectric substrate;

13. a grounded metal electrode;

14. an interdigital transducer;

15. and (7) welding a ring.

Detailed Description

The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "side," "top," "inner," "front," "center," "two ends," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing and simplifying the description, and are not intended to indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be understood broadly, and for example, they may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Example (b):

as shown in figures 1 to 11:

the invention provides a packaging structure of a surface acoustic wave device, which comprises a connecting plate 1;

the top of the connecting plate 1 is provided with a mounting structure 2, the top of the mounting structure 2 is provided with a protective cover 3, and the center of the top of the mounting structure 2 is provided with a driving structure 6;

the outer connecting devices 4 are provided with two groups, the two groups of outer connecting devices 4 are arranged at the top of the mounting structure 2, the two groups of inner connecting devices 5 are arranged at the top of the mounting structure 2, and the two groups of inner connecting devices 5 are arranged at the inner sides of the two groups of outer connecting devices 4;

the front clamping device 9, the front clamping device 9 is arranged on the left side of the two groups of external connecting devices 4, the rear clamping device 10 is arranged on the left side of the two groups of internal connecting devices 5, and the piezoelectric substrate 12 is arranged on the inner sides of the front clamping device 9 and the rear clamping device 10;

spacing main part 8, spacing main part 8 is installed at the top of preceding clamping device 9 and back clamping device 10, and the internally mounted of spacing main part 8 has ground metal electrode 13, interdigital transducer 14 and welding ring 15, and spacing main part 8 internally mounted has stop device 11, and the internally mounted of spacing main part 8 has closing device 7 moreover.

Wherein, mounting structure 2 includes:

the base 201 is of a rectangular plate-shaped structure, and the base 201 is fixedly connected with the connecting plate 1;

the mounting blocks 202 are provided with eight mounting blocks 202, the eight mounting blocks 202 are fixedly mounted at the top of the base 201, and through holes are formed in the eight mounting blocks 202 in a penetrating manner;

the gears 203, the gears 203 are provided with two, and the two gears 203 are rotatably installed on the top of the base 201 through a rotating shaft, the external connection device 4 comprises:

the number of the first connecting rods 401 is two, and the first connecting rods 401 are connected inside the mounting block 202 in a sliding mode;

the first moving block 402 and the first moving block 402 are provided with two moving blocks 402, the two moving blocks 402 are fixedly arranged on the outer wall of the first connecting rod 401, the inner sides of the two moving blocks 402 are welded with gear rows, the gear rows of the two moving blocks 402 are meshed with the two gears 203, and the inner connecting device 5 comprises:

two connecting rods 501 are arranged, and the two connecting rods 501 are connected inside the mounting block 202 in a sliding manner;

two moving blocks 502 are provided with two moving blocks 502, the two moving blocks 502 are fixedly arranged on the outer wall of the two connecting rods 501, the gear rows are welded on the outer sides of the two moving blocks 502, the gear rows of the two moving blocks 502 are meshed with the two gears 203, and the driving structure 6 comprises:

the two mounting plates 601 are arranged, the two mounting plates 601 are in an L-shaped structure, and the two mounting plates 601 are fixedly connected with the base 201;

electric telescopic handle 602, electric telescopic handle 602 fixed mounting is in the inside of two mounting panels 601, two gears 203 with two movable blocks 402 and two movable blocks 502 meshing connection's setting, when electric telescopic handle 602 during operation, make grip block 901 and grip block 1001 reverse movement, it presss from both sides tightly to the centering of piezoelectricity base member 12 to have realized grip block 901 and grip block 1001, it leads to the clamp to hinder and damage because of one side atress to have reduced piezoelectricity base member 12, and this structure makes piezoelectricity base member 12 be in same position always, be convenient for the centre gripping and the dismantlement of packaging personnel to piezoelectricity base member 12, packaging personnel's work efficiency has been improved.

Wherein, closing device 7 includes:

the pressing block 701, the pressing block 701 is a rectangular plate-shaped structure, and a handle is fixedly installed at the top of the pressing block 701;

the elastic members 702 are arranged, twenty-one elastic members 702 are arranged, the twenty-one elastic members 702 are of a circular structure, and the twenty-one elastic members 702 are fixedly arranged at the bottom of the pressing block 701;

the pressing plate 703 is of a rectangular plate-shaped structure, and the pressing plate 703 is fixedly arranged at the bottom of the twenty-one elastic piece 702;

two fixing plates 704 are arranged, the two fixing plates 704 are fixedly arranged on two sides of the pressing block 701, and through grooves are formed in the two fixing plates 704 in a penetrating mode;

the fixed block 705, the fixed block 705 is equipped with two altogether, and two fixed blocks 705 cross-sections are "T" font structure to two fixed blocks 705 slidable mounting are in the inside of two fixed plates 704, and spacing main part 8 includes:

the mounting groove 801 penetrates through the limiting main body 8, and the size of the mounting groove 801 is the same as that of the grounding metal electrode 13, the interdigital transducer 14 and the welding ring 15;

the number of the limiting grooves 802 is two, and the two limiting grooves 802 are formed on two sides of the limiting main body 8;

spacing rod 803, spacing rod 803 is equipped with two altogether, and two spacing rod 803 fixed mounting are in the bottom of spacing main part 8, the setting of mounting groove 801, be convenient for the installation of encapsulating personnel to ground metal electrode 13, interdigital transducer 14 and welding ring 15, and ground metal electrode 13, clamp plate 703 is installed at interdigital transducer 14 and welding ring 15 top, and twenty one elastic component 702 is installed at clamp plate 703 top, make ground metal electrode 13 and interdigital transducer 14 closely laminate between encapsulation time and piezoelectric substrate 12, the encapsulation quality has been improved, spacing groove 802 has simultaneously overflowed the outside of ground metal electrode 13 and interdigital transducer 14 when having avoided welding ring 15 to melt, the accuracy and the aesthetic property of encapsulation have been improved, two fixed blocks 705 make to be connected more firmly between briquetting 701 and the spacing main part 8.

Wherein the front clamping device 9 comprises:

the first clamping plate 901, the first clamping plate 901 is of a rectangular plate-shaped structure, and the first clamping plate 901 is fixedly installed on the left side of the first two connecting rods 401;

the first supporting plate 902, the first supporting plate 902 is fixedly arranged on the right side of the first clamping plate 901, and the top of the first supporting plate 902 is provided with a placing groove;

the first magnet 903, the first magnet 903 is fixedly installed inside the first clamping plate 901, and the top surface of the first magnet 903 is flush with the top surface of the first clamping plate 901;

a first sliding chute 904, two sliding chutes 904 penetrating through the first clamping plate 901, two sliding chutes 904 slidably connected with the two limiting rods 803, and the rear clamping device 10 comprising:

the second clamping plate 1001, the second clamping plate 1001 is a rectangular plate-shaped structure, and the second clamping plate 1001 is fixedly installed on the left side of the two second moving blocks 502;

the second support plate 1002, the second support plate 1002 is fixedly installed on the left side of the second clamping plate 1001, and a placing groove is formed in the top of the second support plate 1002;

the magnet II 1003 is fixedly arranged inside the clamping plate II 1001, and the top surface of the magnet II 1003 is flush with the top surface of the clamping plate II 1001;

the second sliding groove 1004 is formed together with the second sliding groove 1004; two sliding chutes 1004 penetrate through the clamping plates 1001, and the two sliding chutes 1004 are slidably connected with two limiting rods 803;

connecting hole 1005, connecting hole 1005 is equipped with two altogether, and two connecting holes 1005 and two connecting rod 401 sliding connection, the setting of standing groove has been seted up at backup pad 902 and backup pad two 1002 tops, the device of being convenient for places the piezoelectricity base member 12 of different length and different width for the device is convenient for use the research and development class project of small batch, has reduced the cost of mill's preparation packaging structure, and is intelligent high, has improved encapsulation efficiency and encapsulation quality.

Wherein, stop device 11 includes:

two sliding rods 1101 are arranged, and the two sliding rods 1101 are connected to the inside of the limiting rod 803 in a sliding manner;

a limiting block 1102, the limiting block 1102 is fixedly installed at the inner sides of the two sliding rods 1101, and a spring is fixedly installed between the limiting block 1102 and the limiting rod 803;

the pulling plate 1103 and the pulling plate 1103 are fixedly mounted on the outer sides of the two sliding rods 1101, the pulling handle is fixedly mounted on the outer side of the pulling plate 1103, and the limiting block 1102 is arranged, so that the limiting main body 8 and the piezoelectric substrate 12 are located on the same center line, the grounding metal electrode 13 and the interdigital transducer 14 are prevented from being inclined and dislocated during packaging, the packaging accuracy is improved, the adjustment is convenient, and packaging personnel can conveniently and quickly master the packaging.

The packaging method of the surface acoustic wave device comprises the following steps:

1) placing the piezoelectric substrate 12 to be packaged at the placing grooves at the tops of the first supporting plate 902 and the second supporting plate 1002, starting a power supply of the electric telescopic rod 602 by a worker, and enabling the first clamping plate 901 and the second clamping plate 1001 to move reversely when the electric telescopic rod 602 works, so that the first clamping plate 901 and the second clamping plate 1001 clamp the piezoelectric substrate 12 in a centering manner, and the piezoelectric substrate 12 is always located at the same position;

2) then, the limiting main body 8 is installed at the tops of the first clamping plate 901 and the second clamping plate 1001, and then the pulling plate 1103 is pulled to insert and connect the limiting block 1102 in the piezoelectric base body 12, so that the limiting main body 8 and the piezoelectric base body 12 are located on the same central line;

3) and then the welding ring 15, the grounding metal electrode 13 and the interdigital transducer 14 are arranged in the limiting groove 802, finally the pressing device 7 is arranged at the top of the grounding metal electrode 13 and the interdigital transducer 14, and twenty-one elastic piece 702 is arranged at the top of the pressing plate 703, so that the grounding metal electrode 13 and the interdigital transducer 14 are tightly attached to the piezoelectric substrate 12 during packaging.

In another embodiment, referring to fig. 11, the limiting body 8, the first clamping plate 901 and the second clamping plate 1001 have through holes formed therein, so that on one hand, the piezoelectric base body 12, the grounding metal electrode 13, the interdigital transducer 14 and the solder ring 15 are heated more uniformly, the time required for packaging is reduced, the working efficiency is improved, on the other hand, the piezoelectric base body 12, the grounding metal electrode 13 and the interdigital transducer 14 are prevented from being damaged due to a high-temperature environment for a long time, and the number of defective products is reduced.

The specific use mode and function of the embodiment are as follows:

when the piezoelectric packaging device is used, firstly, a worker installs the device at a proper position through the connecting plate 1, then the device is connected with an external power supply, then the piezoelectric substrate 12 to be packaged is placed at the placing grooves at the tops of the first supporting plate 902 and the second supporting plate 1002, then the worker starts the power supply of the electric telescopic rod 602, when the electric telescopic rod 602 works, the first clamping plate 901 and the second clamping plate 1001 move reversely, the first clamping plate 901 and the second clamping plate 1001 clamp the piezoelectric substrate 12 in a centering manner, clamping injury and damage of the piezoelectric substrate 12 due to one side stress are reduced, the piezoelectric substrate 12 is always in the same position, the piezoelectric substrate 12 can be clamped and disassembled conveniently by the packaging worker, the working efficiency of the packaging worker is improved, then the limiting body 8 is installed at the tops of the first clamping plate 901 and the second clamping plate 1001, then the pulling plate 1103 is pulled to insert and connect the limiting block 1102 in the piezoelectric substrate 12, the limiting main body 8 and the piezoelectric substrate 12 are positioned on the same central line, the grounding metal electrode 13 and the interdigital transducer 14 are prevented from being inclined and dislocated during packaging, packaging accuracy is improved, then the welding ring 15, the grounding metal electrode 13 and the interdigital transducer 14 are installed inside the limiting groove 802, the limiting groove 802 prevents the welding ring 15 from overflowing to the outer sides of the grounding metal electrode 13 and the interdigital transducer 14 when being melted, packaging accuracy and attractiveness are improved, finally the pressing device 7 is installed at the tops of the grounding metal electrode 13 and the interdigital transducer 14, twenty-one elastic piece 702 is installed at the top of the pressing plate 703, the grounding metal electrode 13 and the interdigital transducer 14 are tightly attached to the piezoelectric substrate 12 during packaging, and packaging quality is improved.

The invention is not described in detail, but is well known to those skilled in the art.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. A packaging structure of a surface acoustic wave device is characterized in that: comprises a connecting plate (1);

the top of the connecting plate (1) is provided with a mounting structure (2), the top of the mounting structure (2) is provided with a protective cover (3), and the center of the top of the mounting structure (2) is provided with a driving structure (6);

the outer connecting devices (4) are provided with two groups, the two groups of outer connecting devices (4) are arranged at the top of the mounting structure (2), the two groups of inner connecting devices (5) are provided with two groups, the two groups of inner connecting devices (5) are arranged at the top of the mounting structure (2), and the two groups of inner connecting devices (5) are positioned at the inner sides of the two groups of outer connecting devices (4);

the front clamping device (9) is arranged on the left side of the two groups of outer connecting devices (4), the rear clamping device (10) is arranged on the left side of the two groups of inner connecting devices (5), and piezoelectric substrates (12) are arranged on the inner sides of the front clamping device (9) and the rear clamping device (10);

the limiting device comprises a limiting main body (8), wherein the limiting main body (8) is installed at the tops of a front clamping device (9) and a rear clamping device (10), a grounding metal electrode (13), an interdigital transducer (14) and a welding ring (15) are installed inside the limiting main body (8), a limiting device (11) is installed inside the limiting main body (8), and a pressing device (7) is installed inside the limiting main body (8);

the mounting structure (2) includes:

the base (201), the base (201) is a rectangular plate-shaped structure, and the base (201) is fixedly connected with the connecting plate (1);

the eight mounting blocks (202) are arranged, the eight mounting blocks (202) are fixedly mounted at the top of the base (201), and through holes are formed in the eight mounting blocks (202) in a penetrating mode;

the two gears (203) are arranged, and the two gears (203) are rotatably arranged on the top of the base (201) through rotating shafts.

2. The package structure of a surface acoustic wave device according to claim 1, wherein: the external connection device (4) comprises:

the two connecting rods (401) are arranged, and the two connecting rods (401) are connected inside the mounting block (202) in a sliding mode;

the two moving blocks I (402) are arranged, the two moving blocks I (402) are fixedly mounted on the outer walls of the two connecting rods I (401), tooth rows are welded on the inner sides of the two moving blocks I (402), and the tooth rows of the two moving blocks I (402) are meshed with the two gears (203).

3. The package structure of a surface acoustic wave device according to claim 1, wherein: the inner connection device (5) comprises:

two connecting rods II (501) are arranged, and the two connecting rods II (501) are connected inside the mounting block (202) in a sliding manner;

two moving blocks (502) are arranged, the two moving blocks (502) are fixedly mounted on the outer walls of the two connecting rods (501), tooth rows are welded on the outer sides of the two moving blocks (502), and the tooth rows of the two moving blocks (502) are meshed with the two gears (203).

4. The package structure of a surface acoustic wave device according to claim 1, wherein: the drive structure (6) comprises:

the mounting plates (601), the number of the mounting plates (601) is two, the two mounting plates (601) are in an L-shaped structure, and the two mounting plates (601) are fixedly connected with the base (201);

the electric telescopic rod (602) is fixedly arranged inside the two mounting plates (601).

5. The package structure of a surface acoustic wave device according to claim 1, wherein: the pressing device (7) comprises:

the pressing block (701), the pressing block (701) is of a rectangular plate-shaped structure, and a handle is fixedly installed at the top of the pressing block (701);

the elastic pieces (702), the total number of the elastic pieces (702) is twenty one, the twenty one elastic piece (702) is of a circular structure, and the twenty one elastic piece (702) is fixedly arranged at the bottom of the pressing block (701);

the pressing plate (703), the pressing plate (703) is the rectangular platelike structure, and the pressing plate (703) is fixedly mounted on the bottom of twenty-one elastic pieces (702);

the two fixing plates (704) are arranged, the two fixing plates (704) are fixedly arranged on two sides of the pressing block (701), and through grooves are formed in the two fixing plates (704) in a penetrating mode;

the fixing blocks (705) are arranged, the number of the fixing blocks (705) is two, the cross sections of the two fixing blocks (705) are of T-shaped structures, and the two fixing blocks (705) are slidably mounted inside the two fixing plates (704).

6. The package structure of a surface acoustic wave device according to claim 1, wherein: the limiting main body (8) comprises:

the mounting groove (801) penetrates through the limiting main body (8), and the mounting groove (801) is the same as the grounding metal electrode (13), the interdigital transducer (14) and the welding ring (15) in size;

the limiting grooves (802) are arranged, the number of the limiting grooves (802) is two, and the two limiting grooves (802) are arranged on two sides of the limiting main body (8);

the limiting rods (803) and the limiting rods (803) are arranged in two, and the two limiting rods (803) are fixedly installed at the bottom of the limiting main body (8).

7. The package structure of a surface acoustic wave device according to claim 1, wherein: the front clamping device (9) comprises:

the first clamping plate (901), the first clamping plate (901) is of a rectangular plate-shaped structure, and the first clamping plate (901) is fixedly installed on the left side of the first connecting rods (401);

the first supporting plate (902), the first supporting plate (902) is fixedly installed on the right side of the first clamping plate (901), and a placing groove is formed in the top of the first supporting plate (902);

the first magnet (903), the first magnet (903) is fixedly installed inside the first clamping plate (901), and the top surface of the first magnet (903) is flush with the top surface of the first clamping plate (901);

the first sliding grooves (904) and the first sliding grooves (904) are provided with two parts, the first sliding grooves (904) penetrate through the first clamping plate (901), and the first sliding grooves (904) are connected with the two limiting rods (803) in a sliding mode.

8. The package structure of a surface acoustic wave device according to claim 1, wherein: the rear clamping device (10) comprises:

the second clamping plate (1001), the second clamping plate (1001) is of a rectangular plate-shaped structure, and the second clamping plate (1001) is fixedly installed on the left side of the two moving blocks (502);

the second support plate (1002), the second support plate (1002) is fixedly installed on the left side of the second clamping plate (1001), and a placing groove is formed in the top of the second support plate (1002);

the magnet II (1003) is fixedly arranged inside the clamping plate II (1001), and the top surface of the magnet II (1003) is flush with the top surface of the clamping plate II (1001);

the second sliding chute (1004) is provided with the second sliding chute (1004); two sliding chutes II (1004) penetrate through the clamping plate II (1001), and the two sliding chutes II (1004) are connected with two limiting rods (803) in a sliding manner;

the two connecting holes (1005) are arranged, and the two connecting holes (1005) are connected with the two first connecting rods (401) in a sliding mode.

9. The package structure of a surface acoustic wave device according to claim 1, wherein: the limiting device (11) comprises:

the two sliding rods (1101) are arranged, and the two sliding rods (1101) are connected to the inside of the limiting rod (803) in a sliding mode;

the limiting blocks (1102), the limiting blocks (1102) are fixedly installed on the inner sides of the two sliding rods (1101), and springs are fixedly installed between the limiting blocks (1102) and the limiting rods (803);

the pull plate (1103) is fixedly arranged on the outer sides of the two sliding rods (1101), and the pull handle is fixedly arranged on the outer side of the pull plate (1103).

10. The method of packaging a surface acoustic wave device according to claim 1, wherein:

1) placing the piezoelectric substrate (12) to be packaged at the placing grooves at the tops of the first supporting plate (902) and the second supporting plate (1002), starting a power supply of the electric telescopic rod (602) by a worker, and enabling the first clamping plate (901) and the second clamping plate (1001) to move reversely when the electric telescopic rod (602) works, so that the first clamping plate (901) and the second clamping plate (1001) clamp the piezoelectric substrate (12) in a centering manner, and the piezoelectric substrate (12) is always located at the same position;

2) then, installing a limiting main body (8) at the tops of the first clamping plate (901) and the second clamping plate (1001), and pulling a pulling plate (1103) to insert and connect a limiting block (1102) in the piezoelectric base body (12) so that the limiting main body (8) and the piezoelectric base body (12) are positioned on the same central line;

3) and then the welding ring (15), the grounding metal electrode (13) and the interdigital transducer (14) are arranged in the limiting groove (802), finally the pressing device (7) is arranged at the tops of the grounding metal electrode (13) and the interdigital transducer (14), and twenty-one elastic piece (702) is arranged at the top of the pressing plate (703), so that the grounding metal electrode (13) and the interdigital transducer (14) are tightly attached to the piezoelectric substrate (12) during packaging.