CN114174434B - 聚苯醚树脂组合物、预浸料坯、及覆金属层叠板 - Google Patents
聚苯醚树脂组合物、预浸料坯、及覆金属层叠板 Download PDFInfo
- Publication number
- CN114174434B CN114174434B CN202080054607.1A CN202080054607A CN114174434B CN 114174434 B CN114174434 B CN 114174434B CN 202080054607 A CN202080054607 A CN 202080054607A CN 114174434 B CN114174434 B CN 114174434B
- Authority
- CN
- China
- Prior art keywords
- polyphenylene ether
- resin composition
- component
- ether resin
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920001955 polyphenylene ether Polymers 0.000 title claims abstract description 67
- 239000011342 resin composition Substances 0.000 title claims abstract description 45
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims abstract description 59
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 19
- 239000003063 flame retardant Substances 0.000 claims description 16
- 229920001400 block copolymer Polymers 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 9
- 239000003431 cross linking reagent Substances 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 30
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 25
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 16
- 239000004793 Polystyrene Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000203 mixture Substances 0.000 description 12
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 9
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 230000008034 disappearance Effects 0.000 description 8
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000002966 varnish Substances 0.000 description 8
- 239000004744 fabric Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000005062 Polybutadiene Substances 0.000 description 5
- -1 acryl group Chemical group 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920002857 polybutadiene Polymers 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 4
- 238000004817 gas chromatography Methods 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 238000001226 reprecipitation Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000005090 alkenylcarbonyl group Chemical group 0.000 description 2
- 125000004448 alkyl carbonyl group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- ACRQLFSHISNWRY-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-phenoxybenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=CC=CC=C1 ACRQLFSHISNWRY-UHFFFAOYSA-N 0.000 description 1
- ORYGKUIDIMIRNN-UHFFFAOYSA-N 1,2,3,4-tetrabromo-5-(2,3,4,5-tetrabromophenoxy)benzene Chemical compound BrC1=C(Br)C(Br)=CC(OC=2C(=C(Br)C(Br)=C(Br)C=2)Br)=C1Br ORYGKUIDIMIRNN-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- CWJHMZONBMHMEI-UHFFFAOYSA-N 1-tert-butylperoxy-3-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC(OOC(C)(C)C)=C1 CWJHMZONBMHMEI-UHFFFAOYSA-N 0.000 description 1
- GOAHRBQLKIZLKG-UHFFFAOYSA-N 1-tert-butylperoxybutane Chemical compound CCCCOOC(C)(C)C GOAHRBQLKIZLKG-UHFFFAOYSA-N 0.000 description 1
- SZVMZLJAAGWNPG-UHFFFAOYSA-N 1-tert-butylperoxyoctane Chemical compound CCCCCCCCOOC(C)(C)C SZVMZLJAAGWNPG-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- JIYXDFNAPHIAFH-UHFFFAOYSA-N tert-butyl 3-tert-butylperoxycarbonylbenzoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC(C(=O)OC(C)(C)C)=C1 JIYXDFNAPHIAFH-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XPEMYYBBHOILIJ-UHFFFAOYSA-N trimethyl(trimethylsilylperoxy)silane Chemical compound C[Si](C)(C)OO[Si](C)(C)C XPEMYYBBHOILIJ-UHFFFAOYSA-N 0.000 description 1
- KBAOLOSFEJJQPL-UHFFFAOYSA-N trimethyl(triphenylsilylperoxy)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OO[Si](C)(C)C)C1=CC=CC=C1 KBAOLOSFEJJQPL-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
- C08F283/08—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
- C08F283/085—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides on to unsaturated polyphenylene oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F236/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
- C08F236/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds
- C08F236/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated
- C08F236/10—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated with vinyl-aromatic monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
- C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
- C08F297/04—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B32B2260/023—Two or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/308—Heat stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
- B32B2307/7265—Non-permeable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2353/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2353/02—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2371/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2453/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2453/02—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2471/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2471/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2471/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
本发明的课题在于提供一种新型的聚苯醚树脂组合物,其能够制造耐热性、耐水性等优异的覆金属层叠板。本发明的聚苯醚树脂组合物含有(A)聚苯醚、以及(B)包含1,2键合结构与1,4键合结构的摩尔比为80:20~100:0的丁二烯嵌段、和苯乙烯嵌段的嵌段共聚物。成分(A)的数均分子量(Mn)可以举出1,000~7,000,成分(B)中的苯乙烯嵌段与丁二烯嵌段的重量比可以举出10:90~80:20,成分(B)的重均分子量(Mw)可以举出2,000~100,000。
Description
技术领域
本发明涉及聚苯醚树脂组合物、预浸料坯、覆金属层叠板。本申请对2019年8月6日提出申请的日本专利申请第2019-144191号及2020年2月27日提出申请的日本专利申请第2020-031772号主张优先权,并将其内容并入本文中。
背景技术
聚苯醚(PPE)的介电常数、介质损耗角正切等介电特性优异,在MHz带至GHz带这样的高频带(高频区域)中介电特性也优异。因此,研究了将包含聚苯醚的树脂组合物用作例如高频用成型材料。在将前述的树脂组合物用作基板材料等成型材料时,不仅要求介电特性优异,而且还要求耐热性、成型性、耐水性等优异。另外,从加工性的观点考虑,要求热固性优异的树脂组合物。
专利文献1中提出了包含特定的聚苯醚和交联型固化剂的聚苯醚树脂组合物。据称,专利文献1中记载的树脂组合物不会使介电特性降低,即使为了提高制造预浸料坯时的便利性而使用分子量小的PPE,也能够得到耐热性、成型性等高的层叠板。
专利文献2中提出了一种聚苯醚树脂组合物,其特征在于,含有(A)利用具有碳-碳不饱和双键的取代基进行了末端改性的改性聚苯醚、(B)具有碳-碳不饱和双键的交联剂,作为成分(B)的交联剂包含50~100质量%的(B-1)二乙烯基苯及(B-2)聚丁二烯,成分(A)与成分(B)的含有比以质量比计为成分(A):成分(B)=65:35~95:5,并且成分(B-1)与成分(B-2)的含有比以质量比计为成分(B-1):成分(B-2)=1:100~1.5:1。据称,专利文献2中记载的树脂组合物在维持了优异的介电特性的状态下,兼具优异的耐热性、密合性、Tg等特性。
现有技术文献
专利文献
专利文献1:日本特表2006-516297号公报
专利文献2:WO2014/203511号
发明内容
发明所要解决的课题
由一直以来已知的聚苯醚树脂组合物制造的覆金属层叠板存在耐热性、耐水性不充分的情况。本发明的课题在于提供一种新型的聚苯醚树脂组合物,其能够制造耐热性、耐水性等优异的覆金属层叠板。
用于解决课题的手段
本申请的发明人为了解决上述课题而进行了深入研究,结果,发现了含有(A)聚苯醚、以及(B)包含1,2键合结构与1,4键合结构的摩尔比为80:20~100:0的丁二烯嵌段、和苯乙烯嵌段的嵌段共聚物的聚苯醚树脂组合物;含有(A)聚苯醚、以及(B)丁二烯嵌段中的1,2键合结构与1,4键合结构的摩尔比为80:20~100:0的苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)的聚苯醚树脂组合物。另外,发现了本发明的聚苯醚树脂组合物含浸于基材而得到的预浸料坯、将该预浸料坯与金属箔通过进行加热加压成型来层叠从而制造的覆金属层叠板。
即,本发明包括以下的方式。
(1)聚苯醚树脂组合物,其含有:(A)聚苯醚;以及,(B)包含1,2键合结构与1,4键合结构的摩尔比为80:20~100:0的丁二烯嵌段、和苯乙烯嵌段的嵌段共聚物。
(2)聚苯醚树脂组合物,其含有(A)聚苯醚;以及,(B)丁二烯嵌段中的1,2键合结构与1,4键合结构的摩尔比为80:20~100:0的苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)。
(3)如(1)或(2)所述的聚苯醚树脂组合物,其中,成分(A)的数均分子量(Mn)为1,000~7,000。
(4)如(1)~(3)中任一项所述的聚苯醚树脂组合物,其中,成分(B)中的苯乙烯嵌段与丁二烯嵌段的重量比为10:90~80:20。
(5)如(1)~(4)中任一项所述的聚苯醚树脂组合物,其中,成分(B)的重均分子量(Mw)为2,000~100,000。
(6)如(1)~(5)中任一项所述的聚苯醚树脂组合物,其中,成分(B)的分子量分布(Mw/Mn)为1.00~3.00。
(7)如(1)~(6)中任一项所述的聚苯醚树脂组合物,其中,成分(A)与成分(B)的含有比以重量比计为成分(A):成分(B)=5:95~95:5。
(8)如(1)~(7)中任一项所述的聚苯醚树脂组合物,其还含有交联剂。
(9)如(8)所述的聚苯醚树脂组合物,其中,交联剂的含量相对于成分(A)与成分(B)的合计重量而言为1~50重量%。
(10)如(1)~(9)中任一项所述的聚苯醚树脂组合物,其还含有阻燃剂。
(11)如(10)所述的聚苯醚树脂组合物,其中,阻燃剂的含量相对于成分(A)与成分(B)的合计重量而言为1~20重量%。
(12)预浸料坯,其是(1)~(11)中任一项所述的树脂组合物含浸于基材而得到的。
(13)覆金属层叠板,其是将(12)所述的预浸料坯与金属箔通过进行加热加压成型来层叠从而制造的。
发明效果
若使用本发明的聚苯醚树脂组合物,则能够制造耐热性、耐水性优异的覆金属层叠板。
具体实施方式
(聚苯醚)
本发明中使用的成分(A)为聚苯醚。聚苯醚只要是具有下述(1)表示的重复单元的聚合物,就没有特别限定。
[化学式1]
式(1)中,R1~R4各自独立地表示氢原子、烷基、链烯基、炔基、烷基羰基、或链烯基羰基。
作为R1~R4的烷基,可以举出甲基、乙基、丙基、异丙基等。
作为R1~R4的链烯基,可以举出乙烯基、烯丙基等。
作为R1~R4的炔基,可以举出乙炔基、2-丙炔基等。
作为R1~R4的烷基羰基,可以举出乙酰基等。
作为R1~R4的链烯基羰基,可以举出丙烯酰基、甲基丙烯酰基等。
本发明中使用的聚苯醚的末端可以进行改性。作为末端进行了改性的聚苯醚,可以举出末端被羟基改性的聚苯醚、末端被具有碳-碳不饱和双键的取代基改性的聚苯醚、末端被(甲基)丙烯酰基改性的聚苯醚。
作为前述的具有碳-碳不饱和双键的取代基,可以举出式(2)表示的取代基。
[化学式2]
式(2)中,n表示0~10的整数,Z表示亚芳基,R10~R12各自独立地表示氢原子或烷基,*表示键合位置。
作为R10~R12的烷基,可以举出甲基、乙基、丙基、异丙基等。
作为Z的亚芳基,可以举出亚苯基等。
作为式(2)表示的基团,具体而言,可以举出式(2a)、式(2b)表示的结构。
[化学式3]
式(2a)、式(2b)中,*表示键合位置。
本发明中使用的聚苯醚的数均分子量(Mn)没有特别限定,可以举出1,000~100,000、1,000~50,000、1,000~30,000、1,000~7,000、1,000~5,000、1,000~3,000等。需要说明的是,数均分子量(Mn)是利用凝胶渗透色谱(GPC)测定的值。
另外,本发明中使用的聚苯醚的特性粘度可以举出0.03~0.12dl/g、0.04~0.11dl/g、0.06~0.095dl/g等。特性粘度是在25℃的二氯甲烷中测定的特性粘度。更具体而言,是利用粘度计对0.18g/45ml的二氯甲烷溶液(液温为25℃)进行测定而得到的值。
本发明中使用的聚苯醚可以使用已知的聚苯醚、市售品。在合成的情况下,可以通过WO2014/203511号等中记载的方法及以其为基准的方法来合成。
(包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物)
本发明中使用的成分(B)为包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物。苯乙烯嵌段为使苯乙烯聚合而成的嵌段,丁二烯嵌段为使丁二烯聚合而成的嵌段。作为包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物,可以举出苯乙烯-丁二烯嵌段共聚物(SB)、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)、丁二烯-苯乙烯-丁二烯嵌段共聚物(BSB)等。这些之中,优选为苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)。
丁二烯嵌段仅由式(3)表示的1,2键合结构形成,或者由式(3)表示的1,2键合结构和式(4)表示的1,4键合结构形成。
[化学式4]
本发明中使用的包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物中的丁二烯嵌段中所含的、式(3)表示的1,2键合结构与式(4)表示的1,4键合结构的摩尔比优选为80:20~100:0。
包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物中的苯乙烯嵌段与丁二烯嵌段的重量比没有特别限定,可以举出10:90~80:20、10:90~70:30、10:90~60:40、20:80~80:20、30:70~80:20、40:60~80:20等。这些之中,优选为10:90~80:20、10:90~70:30、10:90~60:40。
包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物的重均分子量(Mw)没有特别限定,可以举出2,000~100,000、2,000~80,000、2,000~60,000、2,000~50,000、2,000~40,000等。包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物的分子量分布(Mw/Mn)没有特别限定,可以举出1.00~3.00、1.00~2.00等。前述重均分子量(Mw)、分子量分布(Mw/Mn)是以聚苯乙烯为标准物质而利用凝胶渗透色谱(GPC)测定的。其测定条件为:流动相为THF(四氢呋喃),流动相流量为1mL/分钟,柱温为40℃,试样注入量为40μL,试样浓度为2重量%。
本发明中使用的包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物的制造方法没有特别限定,例如,苯乙烯-丁二烯-苯乙烯嵌段共聚物可以通过日本特开平6-192502号公报、日本特表2000-514122号公报、日本特开2007-302901号公报等中记载的方法及以其为基准的方法来制造。
(聚苯醚树脂组合物)
本发明的聚苯醚树脂组合物为含有聚苯醚(PPE)(成分(A))、以及包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物(成分(B))的组合物。
本发明的聚苯醚树脂组合物中的成分(A)和成分(B)的含量没有特别限定,可以举出成分(A)与成分(B)的重量比成为5:95~95:5、10:90~95:5、15:85:95:5、20:80~95:5、25:75~95:5、30:70~95:5、35:65~95:5、40:60~95:5、45:55~95:5、50:50~95:5、55:65~95:5、60:40~95:5、65:35~95:5、70:30~95:5、70:30~90:10的量等。
(其他添加剂)
在本发明的聚苯醚树脂组合物中,可以在不损害本发明的效果的范围内适当地加入其他添加剂。作为其他添加剂,可以举出例如引发剂、交联剂、阻燃剂、无机填充材料等。
作为引发剂,没有特别限定。具体而言,可以举出过氧化苯甲酰、氢过氧化枯烯、2,5-二甲基-2,5-过氧化二氢己烷、2,5-二甲基-2,5-二(叔丁基过氧化)己-3-炔、二叔丁基过氧化物、叔丁基枯基过氧化物、α,α’-双(过氧化叔丁基-间异丙基)苯、2,5-二甲基-2,5-二(叔丁基过氧化)己烷、过氧化二异丙苯、过氧化间苯二甲酸二叔丁酯、过氧化苯甲酸叔丁酯、2,2-双(叔丁基过氧化)丁烷、2,2-双(叔丁基过氧化)辛烷、2,5-二甲基-2,5-二(过氧化苯甲酰)己烷、二(三甲基甲硅烷基)过氧化物、三甲基甲硅烷基三苯基甲硅烷基过氧化物等。
引发剂的添加量没有特别限定,可以举出相对于将成分(A)与成分(B)加和的量而言成为0.1~10重量%的量。
作为交联剂,没有特别限定。具体而言,可以举出二乙烯基苯、三烯丙基异氰脲酸酯、1,4-聚丁二烯、1,2-聚丁二烯、末端丙烯酸酯改性聚丁二烯、末端氨基甲酸酯甲基丙烯酸酯改性聚丁二烯等。这些之中,更优选使用三烯丙基异氰脲酸酯、数均分子量(Mn)为100~4,000左右的聚丁二烯。
添加交联剂的情况下,其添加量没有特别限定,可以举出相对于成分(A)与成分(B)的合计重量而言成为1~50重量%的量。
作为阻燃剂,没有特别限定。具体而言,可以举出溴系阻燃剂等卤素系阻燃剂、磷系阻燃剂等。
作为卤素系阻燃剂,可以举出五溴二苯基醚、八溴二苯基醚、十溴二苯基醚、四溴双酚A、六溴环十二烷等溴系阻燃剂、氯化石蜡等氯系阻燃剂等。
作为磷系阻燃剂,可以举出缩合磷酸酯、环状磷酸酯等磷酸酯、环状磷腈化合物等磷腈化合物、二烷基次膦酸铝盐等次膦酸盐系阻燃剂、磷酸三聚氰胺、及聚磷酸三聚氰胺等三聚氰胺系阻燃剂等。
添加阻燃剂的情况下,其添加量没有特别限定,可以举出相对于成分(A)与成分(B)的合计重量而言成为1~20重量%的量。
作为无机填充材料,可以举出二氧化硅、氧化铝、滑石、氢氧化铝、氢氧化镁、氧化钛、云母、硼酸铝、硫酸钡、及碳酸钙等。
添加无机填充材料的情况下,其添加量没有特别限定,可以举出相对于成分(A)与成分(B)的合计重量而言成为10~150重量%的量。
作为制造本发明的热固性组合物的方法,没有特别限定。例如,可以举出在聚苯醚(A)中添加包含丁二烯嵌段和苯乙烯嵌段的嵌段共聚物(B)和其他成分之后、利用混炼机进行混炼的方法。
(预浸料坯)
对于本发明的聚苯醚树脂组合物而言,在制造预浸料坯时,出于在用于形成预浸料坯的基材(纤维质基材)中含浸的目的而制备成清漆状来使用的情况较多。这样的树脂清漆例如可如下所述地制备。
首先,将能溶解于有机溶剂的各成分投入至有机溶剂中而使其溶解。此时,根据需要,可以进行加热。其后,添加根据需要使用的、不溶于有机溶剂的成分、例如无机填充材料等,使用球磨机、珠磨机、行星式混合机、辊式研磨机等进行分散,直至成为规定的分散状态为止,由此制备树脂清漆。
作为使用所得到的树脂清漆来制造预浸料坯的方法,可举出例如在使所得到的树脂清漆含浸于纤维质基材之后进行干燥的方法。
作为在制造预浸料坯时使用的纤维质基材,具体而言,可举出例如玻璃布、芳族聚酰胺布、聚酯布、玻璃无纺布、芳族聚酰胺无纺布、聚酯无纺布、纸浆纸、及棉绒纸等。
将含浸有树脂清漆的纤维质基材在所期望的加热条件、例如80~170℃下加热1~10分钟,将溶剂除去,由此能够得到半固化状态(B阶段)的预浸料坯。
(覆金属层叠板)
将所得到的预浸料坯一张或重叠多张,进一步在其上下两面或一面重叠铜箔等金属箔,对其进行加热加压成型从而层叠一体化,由此能够制作两面覆有金属箔或一面覆有金属箔的层叠体。
加热加压条件可以根据制造的层叠板的厚度、预浸料坯的树脂组合物的种类等而适当地设定。例如,可以使温度为170~210℃、压力为1.5~4.0MPa、时间为60~150分钟。
实施例
以下,使用实施例来详细说明本发明,但本发明并不限定于实施例的范围。
成分(B):苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)的制造制造例1
向500mL烧瓶中加入四氢呋喃(以下,简记为THF)151.95g、己烷19.65g。冷却至-40℃后,加入正丁基锂2.28g(浓度为15.1重量%的己烷溶液),搅拌10分钟后,滴加苯乙烯11.99g,继续进行30分钟反应。测定气相色谱(以下简记为GC),确认单体消失。接着,滴加1,3-丁二烯21.44g、THF 23.43g、己烷7.80g的混合液,继续进行反应。测定GC,确认单体消失后,滴加苯乙烯12.05g,在30分钟后加入甲醇0.51g而使反应停止。
利用凝胶渗透色谱(流动相为THF,聚苯乙烯标样)对所得到的共聚物进行分析,结果,确认了重均分子量(Mw)为24,300,分子量分布(Mw/Mn)为1.28。另外,是组成比为PS/PB/PS=25/50/25重量%的共聚物。需要说明的是,PS的含义是苯乙烯嵌段,PB的含义是丁二烯嵌段。以下是同样的。
对反应液进行两次水洗后,将溶剂蒸馏除去。在甲醇中进行再沉淀,过滤分离并进行真空干燥,由此得到白色粉末。利用1H-NMR算出的丁二烯嵌段中的1,2键合结构为93摩尔%。
制造例2
向500mL烧瓶中加入THF 149.37g、己烷17.53g。冷却至-40℃后,加入正丁基锂5.21g(浓度为15.1重量%的己烷溶液),搅拌10分钟后,滴加苯乙烯10.47g,继续进行30分钟反应。测定气相色谱(以下简记为GC),确认单体消失。接着,滴加1,3-丁二烯49.28g、THF49.28g的混合液,继续进行反应。测定GC,确认单体消失后,滴加苯乙烯10.66g,在30分钟后加入甲醇1.12g而使反应停止。
利用凝胶渗透色谱(流动相为THF,聚苯乙烯标样)对所得到的共聚物进行分析,结果,确认了分子量(Mw)为14,200,分子量分布(Mw/Mn)为1.18。另外,是组成比为PS/PB/PS=15/70/15重量%的共聚物。
对反应液进行两次水洗后,将溶剂蒸馏除去。在甲醇中进行再沉淀,过滤分离并进行真空干燥,由此得到无色透明的粘性液体。利用1H-NMR算出的丁二烯嵌段中的1,2键合结构为94摩尔%。
制造例3
向500mL烧瓶中加入环己烷155.90g、THF 20.10g。加热至30℃,加入正丁基锂1.95g(浓度为15.1重量%的己烷溶液),搅拌10分钟后,滴加苯乙烯7.64g,继续进行30分钟反应。测定气相色谱(以下简记为GC),确认单体消失。接着,滴加1,3-丁二烯35.07g、环己烷35.07g的混合液,继续进行反应。测定GC,确认单体消失后,滴加苯乙烯7.78g,在30分钟后加入甲醇0.40g而使反应停止。
利用凝胶渗透色谱(流动相为THF,聚苯乙烯标样)对所得到的共聚物进行分析,结果,确认了分子量(Mw)为17,400,分子量分布(Mw/Mn)为1.07。另外,是组成比为PS/PB/PS=15/70/15重量%的共聚物。
对反应液进行两次水洗后,将溶剂蒸馏除去。在甲醇中进行再沉淀,过滤分离并进行真空干燥,由此得到无色透明的粘性液体。利用1H-NMR算出的丁二烯嵌段中的1,2键合结构为89摩尔%。
制造例4
向5000mL烧瓶中加入THF 1212g、己烷132g。冷却至-40℃后,加入正丁基锂98.58g(浓度为15.1重量%的己烷溶液),搅拌10分钟后,滴加苯乙烯60.50g,继续进行15分钟反应。测定气相色谱(以下简记为GC),确认单体消失。接着,滴加丁二烯481.88g、THF432.12g、己烷48.08g的混合液,继续进行反应。测定GC,确认单体消失后,滴加苯乙烯61.13g,在30分钟后加入甲醇16.02g而使反应停止。
利用凝胶渗透色谱(流动相为THF,聚苯乙烯标样)对所得到的共聚物进行分析,结果,确认了重均分子量(Mw)为4742,分子量分布(Mw/Mn)为1.12。另外,是组成比为PS/PB/PS=10/80/10重量%的共聚物。
对反应液进行两次水洗后,将溶剂蒸馏除去,得到白色的粘性液体。利用1H-NMR算出的丁二烯单元的1,2键合结构为91%。
实施例1
将甲基丙烯酸改性聚苯醚(SA9000,SABIC公司制,Mn=1700)、制造例1中得到的苯乙烯-丁二烯-苯乙烯嵌段共聚物、三烯丙基异氰脲酸酯(FUJIFILM Wako Pure Chemical(株)公司制)、和过氧化二异丙苯(Aldrich公司制)以表1所示的配合量进行配合,利用甲基乙基酮(以下为MEK,FUJIFILM Wako Pure Chemical(株)公司制)进行溶解,得到清漆。
实施例2
使用制造例4中得到的苯乙烯-丁二烯-苯乙烯嵌段共聚物来代替制造例1中得到的苯乙烯-丁二烯-苯乙烯嵌段共聚物,除此以外,与实施例1同样地得到清漆。
比较例1
使用Ricon181(Cray Valley公司制,苯乙烯-丁二烯无规共聚物)来代替制造例1中得到的苯乙烯-丁二烯-苯乙烯嵌段共聚物,除此以外,与实施例1同样地得到清漆。
(焊料耐热性试验用样品的制作方法)
在已切成3cm见方的玻璃布4张中充分地含浸清漆,利用150℃的烘箱进行10分钟加热,制作预浸料坯。在所得到的预浸料坯的两面贴上厚度为18μm的铜箔的粗糙面。其后,夹在聚四氟乙烯板中,使用加压机,在230℃、3-4MPa的条件下进行2小时加热加压,由此得到评价基板(覆铜层叠板)。
(焊料耐热性试验)
焊料耐热性试验按照JIS C 6481进行测定,即,将覆铜层叠板在260℃的焊料中浸渍2分钟,对铜箔的剥离进行观察,由此对焊料耐热性进行评价。将没有剥离的情况记为“○”,将产生了剥离的情况记为“×”。将结果示于表1。
(玻璃化转变温度Tg及电特性测定用样品的制作方法)
在已切成10cm见方的正方形的玻璃布10张中充分地含侵清漆,利用150℃的烘箱进行10分钟加热,制作预浸料坯。将10张所得到的预浸料坯层叠,夹在聚四氟乙烯板中,使用加压机,在230℃、3-4MPa的条件下进行2小时加热加压,由此得到评价基板(层叠板)。
(玻璃化转变温度Tg的测定)
使用TA Instruments公司制的动态粘弹性装置“RSA-G2”,对层叠板的Tg进行测定。此时,利用将30mm的双悬臂(Dual cantilever)用于夹具的弯曲组件,使频率为1Hz,进行动态粘弹性测定(DMA),将以5℃/分钟的升温速度从-50℃升温至270℃时的tanδ显示为极大的温度作为Tg。将结果示于表1。
(耐热性评价)
通过TA Instruments公司制的动态粘弹性装置“RSA-G2”,利用将30mm的双悬臂用于夹具的弯曲组件,使频率为1Hz,进行动态粘弹性测定(DMA),对将以5℃/分钟的升温速度从-50℃至270℃的测定实施2个循环时的第1个循环与第2个循环的Tg之差ΔTg进行评价。将tanδ显示为极大的温度作为Tg。将结果示于表1。
(介电特性)
利用空腔谐振器摄动法来测定10GHz时的各评价基板的相对介电常数(Dk)及介质损耗角正切(Df)。具体而言,使用网络分析仪(Network Analyzer)(Anritsu公司制的MS46122B),测定10GHz时的评价基板的相对介电常数及介质损耗角正切。将结果示于表1。
[表1]
表1
由该试验结果表明,使用本发明的组合物制造的层叠板的ΔTg低,耐热性优异。
Claims (11)
1.聚苯醚树脂组合物,其含有:(A)聚苯醚;以及,(B)包含下述式(3)表示的1,2键合结构与下述式(4)表示的1,4键合结构的摩尔比为80:20~100:0的丁二烯嵌段、和苯乙烯嵌段的嵌段共聚物,
(A)聚苯醚的数均分子量(Mn)为1,000~5,000,
(B)嵌段共聚物的重均分子量(Mw)为2,000~100,000,
2.聚苯醚树脂组合物,其含有(A)聚苯醚;以及,(B)丁二烯嵌段中的、下述式(3)表示的1,2键合结构与下述式(4)表示的1,4键合结构的摩尔比为80:20~100:0的苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS),
(A)聚苯醚的数均分子量(Mn)为1,000~5,000,
(B)苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)的重均分子量(Mw)为2,000~100,000,
3.如权利要求1或2所述的聚苯醚树脂组合物,其中,成分(B)中的苯乙烯嵌段与丁二烯嵌段的重量比为10:90~80:20。
4.如权利要求1或2所述的聚苯醚树脂组合物,其中,成分(B)的分子量分布(Mw/Mn)为1.00~3.00。
5.如权利要求1或2所述的聚苯醚树脂组合物,其中,成分(A)与成分(B)的含有比以重量比计为成分(A):成分(B)=5:95~95:5。
6.如权利要求1或2所述的聚苯醚树脂组合物,其还含有交联剂。
7.如权利要求6所述的聚苯醚树脂组合物,其中,交联剂的含量相对于成分(A)与成分(B)的合计重量而言为1~50重量%。
8.如权利要求1或2所述的聚苯醚树脂组合物,其还含有阻燃剂。
9.如权利要求8所述的聚苯醚树脂组合物,其中,阻燃剂的含量相对于成分(A)与成分(B)的合计重量而言为1~20重量%。
10.预浸料坯,其是权利要求1或2所述的树脂组合物含浸于基材而得到的。
11.覆金属层叠板,其是将权利要求10所述的预浸料坯与金属箔通过进行加热加压成型来层叠从而制造的。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-144191 | 2019-08-06 | ||
JP2019144191 | 2019-08-06 | ||
JP2020-031772 | 2020-02-27 | ||
JP2020031772 | 2020-02-27 | ||
PCT/JP2020/026565 WO2021024679A1 (ja) | 2019-08-06 | 2020-07-07 | ポリフェニレンエーテル樹脂組成物、プリプレグ、及び金属張積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114174434A CN114174434A (zh) | 2022-03-11 |
CN114174434B true CN114174434B (zh) | 2024-03-08 |
Family
ID=74502927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080054607.1A Active CN114174434B (zh) | 2019-08-06 | 2020-07-07 | 聚苯醚树脂组合物、预浸料坯、及覆金属层叠板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11939443B2 (zh) |
EP (1) | EP4011926A4 (zh) |
JP (1) | JP7124227B2 (zh) |
KR (1) | KR20220025859A (zh) |
CN (1) | CN114174434B (zh) |
TW (1) | TWI824165B (zh) |
WO (1) | WO2021024679A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102663977B1 (ko) * | 2019-08-06 | 2024-05-10 | 닛뽕소다 가부시키가이샤 | 금속 피복 적층판용 수지 조성물, 프리프레그, 및 금속 피복 적층판 |
TWI757173B (zh) * | 2021-05-11 | 2022-03-01 | 台光電子材料股份有限公司 | 樹脂組合物及其製品 |
WO2023286713A1 (ja) | 2021-07-14 | 2023-01-19 | 日本曹達株式会社 | 新規ポリマーおよびそれを含む樹脂組成物とその成形体 |
WO2023286714A1 (ja) | 2021-07-14 | 2023-01-19 | 日本曹達株式会社 | 新規の(メタ)アクリルアミド系ポリマー及びそれを含む樹脂組成物とその成形体 |
TWI823309B (zh) * | 2022-03-28 | 2023-11-21 | 台光電子材料股份有限公司 | 樹脂組合物及其製品 |
CN114940816A (zh) * | 2022-06-28 | 2022-08-26 | 上海载正化工科技发展有限公司 | 一种可交联聚苯醚薄膜及其制备方法和应用 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0977969A (ja) * | 1995-09-14 | 1997-03-25 | Asahi Chem Ind Co Ltd | ポリマー組成物 |
CN1227855A (zh) * | 1998-01-06 | 1999-09-08 | 通用电气公司 | 聚苯醚与苯乙烯共聚物的半透明共混物 |
JP2001139798A (ja) * | 1999-08-27 | 2001-05-22 | Asahi Kasei Corp | 制振性を有するポリフェニレンエーテル樹脂組成物 |
JP2005290123A (ja) * | 2004-03-31 | 2005-10-20 | Asahi Kasei Chemicals Corp | 熱可塑性樹脂組成物 |
CN101668806A (zh) * | 2007-04-26 | 2010-03-10 | 日立化成工业株式会社 | 含有半ipn型复合体的热固性树脂的树脂清漆的制造方法以及使用有其的印刷线路板用树脂清漆、预浸料及贴金属箔层压板 |
JP2010229348A (ja) * | 2009-03-27 | 2010-10-14 | Asahi Kasei Chemicals Corp | 樹脂組成物およびその成形体 |
CN103619953A (zh) * | 2011-06-20 | 2014-03-05 | 旭化成化学株式会社 | 聚苯醚系树脂组合物及其制造方法 |
JP2015071653A (ja) * | 2013-10-01 | 2015-04-16 | 旭化成ケミカルズ株式会社 | 樹脂組成物及びその成形体 |
CN105358595A (zh) * | 2013-06-18 | 2016-02-24 | 松下知识产权经营株式会社 | 聚苯醚树脂组合物、预浸料、覆金属箔层压板以及印刷布线板 |
WO2018139122A1 (ja) * | 2017-01-24 | 2018-08-02 | 旭化成株式会社 | 熱可塑性エラストマー組成物、栓体及び容器 |
JP2018168347A (ja) * | 2017-08-25 | 2018-11-01 | 新日鉄住金化学株式会社 | 硬化性樹脂組成物、その硬化物、硬化性複合材料、樹脂付き金属箔、及び回路基板材料用ワニス |
WO2019103048A1 (ja) * | 2017-11-22 | 2019-05-31 | 株式会社クラレ | ブロック共重合体又はその水素添加物 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06192502A (ja) | 1992-12-25 | 1994-07-12 | Daicel Chem Ind Ltd | 熱可塑性樹脂組成物 |
US5571609A (en) | 1994-10-13 | 1996-11-05 | Rogers Corporation | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof |
CA2258555A1 (en) | 1996-07-03 | 1998-01-15 | Shell Internationale Research Maatschappij B.V. | High 1,2-content thermoplastic elastomer oil polyolefin composition |
US7413791B2 (en) | 2003-01-28 | 2008-08-19 | Matsushita Electric Works, Ltd. | Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
US7541399B2 (en) | 2003-09-30 | 2009-06-02 | Asahi Kasei Chemicals Corporation | Process for producing polyphenylene ether resin composition |
JP4138729B2 (ja) * | 2004-11-01 | 2008-08-27 | 住友ゴム工業株式会社 | ゴム組成物およびそれからなるタイヤ |
US20060177666A1 (en) | 2005-02-08 | 2006-08-10 | Masanao Kawabe | Curable resin compositions |
FR2961818B1 (fr) | 2010-06-23 | 2012-07-20 | Michelin Soc Tech | Composition de caoutchouc comprenant une charge thermoplastique et un agent compatibilisant |
JP5901066B2 (ja) * | 2012-04-27 | 2016-04-06 | 三井金属鉱業株式会社 | 樹脂組成物、樹脂層付金属箔、金属張積層板及びプリント配線板 |
CN102807658B (zh) * | 2012-08-09 | 2014-06-11 | 广东生益科技股份有限公司 | 聚苯醚树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
US11041045B2 (en) * | 2015-04-30 | 2021-06-22 | Showa Denko Materials Co., Ltd. | Resin composition, prepreg, laminate and multilayer printed wiring board |
FR3037591A1 (fr) * | 2015-06-18 | 2016-12-23 | Michelin & Cie | Pneumatique pourvu d'une bande de roulement comprenant un elastomere dienique, un elastomere thermoplastique et une resine thermoplastique comprenant des motifs polyphenylene ether |
WO2018164833A1 (en) * | 2017-03-07 | 2018-09-13 | Icl-Ip America Inc. | Non-migratory, high-melting/softening polymeric phosphorus-containing flame retardant for printed wiring boards |
JP6734583B2 (ja) | 2018-02-23 | 2020-08-05 | 株式会社市川工務店 | 橋梁などの構造物を検査するための画像処理システム、画像処理方法及びプログラム |
JP6902003B2 (ja) | 2018-08-28 | 2021-07-14 | 株式会社メディカロイド | 滅菌ドレープおよび手術器具の取付方法 |
CN111253888A (zh) * | 2020-03-30 | 2020-06-09 | 广东生益科技股份有限公司 | 一种电路材料及包含其的电路板 |
-
2020
- 2020-07-07 US US17/632,067 patent/US11939443B2/en active Active
- 2020-07-07 EP EP20850936.4A patent/EP4011926A4/en active Pending
- 2020-07-07 CN CN202080054607.1A patent/CN114174434B/zh active Active
- 2020-07-07 KR KR1020227002849A patent/KR20220025859A/ko not_active Application Discontinuation
- 2020-07-07 JP JP2021537630A patent/JP7124227B2/ja active Active
- 2020-07-07 WO PCT/JP2020/026565 patent/WO2021024679A1/ja unknown
- 2020-07-09 TW TW109123226A patent/TWI824165B/zh active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0977969A (ja) * | 1995-09-14 | 1997-03-25 | Asahi Chem Ind Co Ltd | ポリマー組成物 |
CN1227855A (zh) * | 1998-01-06 | 1999-09-08 | 通用电气公司 | 聚苯醚与苯乙烯共聚物的半透明共混物 |
JP2001139798A (ja) * | 1999-08-27 | 2001-05-22 | Asahi Kasei Corp | 制振性を有するポリフェニレンエーテル樹脂組成物 |
JP2005290123A (ja) * | 2004-03-31 | 2005-10-20 | Asahi Kasei Chemicals Corp | 熱可塑性樹脂組成物 |
CN101668806A (zh) * | 2007-04-26 | 2010-03-10 | 日立化成工业株式会社 | 含有半ipn型复合体的热固性树脂的树脂清漆的制造方法以及使用有其的印刷线路板用树脂清漆、预浸料及贴金属箔层压板 |
JP2010229348A (ja) * | 2009-03-27 | 2010-10-14 | Asahi Kasei Chemicals Corp | 樹脂組成物およびその成形体 |
CN103619953A (zh) * | 2011-06-20 | 2014-03-05 | 旭化成化学株式会社 | 聚苯醚系树脂组合物及其制造方法 |
CN105358595A (zh) * | 2013-06-18 | 2016-02-24 | 松下知识产权经营株式会社 | 聚苯醚树脂组合物、预浸料、覆金属箔层压板以及印刷布线板 |
JP2015071653A (ja) * | 2013-10-01 | 2015-04-16 | 旭化成ケミカルズ株式会社 | 樹脂組成物及びその成形体 |
WO2018139122A1 (ja) * | 2017-01-24 | 2018-08-02 | 旭化成株式会社 | 熱可塑性エラストマー組成物、栓体及び容器 |
JP2018168347A (ja) * | 2017-08-25 | 2018-11-01 | 新日鉄住金化学株式会社 | 硬化性樹脂組成物、その硬化物、硬化性複合材料、樹脂付き金属箔、及び回路基板材料用ワニス |
WO2019103048A1 (ja) * | 2017-11-22 | 2019-05-31 | 株式会社クラレ | ブロック共重合体又はその水素添加物 |
Also Published As
Publication number | Publication date |
---|---|
TW202108695A (zh) | 2021-03-01 |
EP4011926A4 (en) | 2023-08-30 |
WO2021024679A1 (ja) | 2021-02-11 |
US11939443B2 (en) | 2024-03-26 |
CN114174434A (zh) | 2022-03-11 |
KR20220025859A (ko) | 2022-03-03 |
US20220251376A1 (en) | 2022-08-11 |
JP7124227B2 (ja) | 2022-08-23 |
EP4011926A1 (en) | 2022-06-15 |
JPWO2021024679A1 (zh) | 2021-02-11 |
TWI824165B (zh) | 2023-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN114174434B (zh) | 聚苯醚树脂组合物、预浸料坯、及覆金属层叠板 | |
CN110366569B (zh) | 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板 | |
JP6455728B2 (ja) | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 | |
CN108473758B (zh) | 聚苯醚树脂组合物、预浸渍体、覆金属层叠板及印刷布线板 | |
JP7316572B2 (ja) | 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 | |
JP6906170B2 (ja) | 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、プリプレグ、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板 | |
JP2016113543A (ja) | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 | |
JP2016056367A (ja) | 硬化性組成物、プリプレグ、樹脂付き金属箔、金属張積層板、及びプリント配線板 | |
CN109504062A (zh) | 一种热固性树脂组合物 | |
JP2017031276A (ja) | 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板 | |
WO2019208471A1 (ja) | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 | |
JPWO2019130735A1 (ja) | ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 | |
CN114174419B (zh) | 覆金属层叠板用树脂组合物、预浸料坯、及覆金属层叠板 | |
JP2019044031A (ja) | ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、金属張積層板及び配線基板 | |
JP2019044090A (ja) | 熱硬化性樹脂組成物、並びに、それを用いたプリプレグ、樹脂付金属箔、樹脂フィルム、金属張積層板及び配線基板 | |
US20220356349A1 (en) | Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board | |
JP7507382B2 (ja) | 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 | |
TWI846848B (zh) | 樹脂組成物、以及使用其之預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |