JP6455728B2 - ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 - Google Patents
ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 Download PDFInfo
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Description
ポリフェニレンエーテルと、クロロメチルスチレンとを反応させて変性ポリフェニレンエーテル1(変性PPE1)を得た。具体的には、まず、温度調節器、攪拌装置、冷却設備、及び滴下ロートを備えた1リットルの3つ口フラスコに、ポリフェニレンエーテル(上記式(5)に示す構造を有するポリフェニレンエーテル、SABICイノベーティブプラスチックス社製のSA90、固有粘度(IV)0.083dl/g、末端水酸基数1.9個、数平均分子量Mn2000)200g、p−クロロメチルスチレンとm−クロロメチルスチレンとの質量比が50:50の混合物(東京化成工業株式会社製のクロロメチルスチレン:CMS)30g、相間移動触媒として、テトラ−n−ブチルアンモニウムブロマイド1.227g、及びトルエン400gを仕込み、攪拌した。そして、ポリフェニレンエーテル、クロロメチルスチレン、及びテトラ−n−ブチルアンモニウムブロマイドが、トルエンに溶解するまで攪拌した。その際、徐々に加熱し、最終的に液温が75℃になるまで加熱した。そして、その溶液に、アルカリ金属水酸化物として、水酸化ナトリウム水溶液(水酸化ナトリウム20g/水20g)を20分間かけて、滴下した。その後、さらに、75℃で4時間攪拌した。次に、10質量%の塩酸でフラスコの内容物を中和した後、多量のメタノールを投入した。そうすることによって、フラスコ内の液体に沈殿物を生じさせた。すなわち、フラスコ内の反応液に含まれる生成物を再沈させた。そして、この沈殿物をろ過によって取り出し、メタノールと水との質量比が80:20の混合液で3回洗浄した後、減圧下、80℃で3時間乾燥させた。
ここで、εは、吸光係数を示し、4700L/mol・cmである。また、OPLは、セル光路長であり、1cmである。
本実施例において、ポリフェニレンエーテル樹脂組成物を調製する際に用いる成分について説明する。
変性PPE1:上記の合成方法により得られた変性ポリフェニレンエーテル
変性PPE2:SABICイノベーティブプラスチックス社製のSA9000(式7のポリフェニレンエーテルの末端水酸基をメタクリル基で変性した変性ポリフェニレンエーテル)
DVB810:ジビニルベンゼン 純度約81%(新日鐵住金化学社製)
B−1000:ポリブタジエン(日本曹達社製)
DCP:トリシクロデカンジメタノールジメタクリレート(新中村化学、分子量332のモノマー)
TAIC:トリアリルイソシアヌレート(日本化成株式会社製)
開始剤:1,3−ビス(ブチルパーオキシイソプロピル)ベンゼン(日油株式会社製のパーブチルP)
SAYTEX 8010:エチレンビス(ペンタブロモフェニル)(アルベマール日本社製)
まず、開始剤以外の各成分を表1に記載の配合割合で(表中、「部」は質量部を示す)、固形分濃度が50質量%となるように、トルエンに添加し、混合させた。その混合物を、80℃になるまで加熱し、80℃のままで30分間攪拌した。その後、その攪拌した混合物を40℃まで冷却した後、開始剤である1,3−ビス(ブチルパーオキシイソプロピル)ベンゼン(日油株式会社製のパーブチルP)を表1に記載の配合割合で添加することによって、ワニス状の樹脂組成物(樹脂ワニス)が得られた。
10GHzにおける評価基板の誘電率及び誘電正接を、空洞共振器摂動法で測定した。具体的には、ネットワーク・アナライザ(アジレント・テクノロジー株式会社製のN5230A)を用い、10GHzにおける評価基板の誘電率及び誘電正接を測定した。
銅張り積層板の1枚目と2枚目のガラスクロス間の引き剥がし強さをJIS C 6481に準拠して測定した。幅10mm、長さ100mmのパターンを形成し、引っ張り試験機により50mm/分の速度で引き剥がし、その時の引き剥がし強さを測定した。測定単位はkN/mである。
セイコーインスツルメンツ株式会社製の粘弾性スペクトロメータ「DMS100」を用いて、プリプレグのTgを測定した。このとき、曲げモジュールで周波数を10Hzとして動的粘弾性測定(DMA)を行い、昇温速度5℃/分の条件で室温から280℃まで昇温した際のtanδが極大を示す温度をTgとした。
吸湿後はんだ耐熱性は、以下の方法により測定した。まず得られた50mm×50mmの銅張積層板をエッチングし、121℃、2気圧(0.2MPa)、5時間のプレッシャークッカーテスト(PCT)を各サンプルで行い、サンプル数5個で、288℃の半田槽中に20秒間浸漬し、ミーズリングやフクレの発生の有無を目視で観察した。
難燃性は得られた銅張積層板をエッチングし、127×12.7mmにカットした後、UL94に準拠して評価した。
Claims (14)
- (A)炭素−炭素不飽和二重結合を有する置換基により末端変性された変性ポリフェニレンエーテル、(B)炭素−炭素不飽和二重結合を有する架橋剤を含有し、
成分(B)である架橋剤が、(B−1)ジビニルベンゼン及び(B−2)ポリブタジエンを50〜100質量%含み、
成分(A)と成分(B)の含有比が質量比で、成分(A):成分(B)=65:35〜95:5であり、かつ
成分(B−1)と成分(B−2)の含有比が質量比で、成分(B−1):成分(B−2)=1:20〜1.5:1であることを特徴とする、ポリフェニレンエーテル樹脂組成物。 - 前記成分(A)及び(B)の合計量に対して、
前記(A)変性ポリフェニレンエーテルを70〜95質量%、
前記(B−1)ジビニルベンゼンを0.1〜15質量%、および
前記(B−2)ポリブタジエンを4〜25質量%
含有する、請求項1に記載のポリフェニレンエーテル樹脂組成物。 - 成分(B)である架橋剤が、炭素−炭素不飽和二重結合を有する他の架橋剤(B−3)を50質量%以下で更に含む、請求項1に記載のポリフェニレンエーテル樹脂組成物。
- 他の架橋剤(B−3)が(メタ)アクリレート基を含有する化合物を含む、請求項3に記載のポリフェニレンエーテル樹脂組成物。
- 前記成分(A)及び(B)の合計量に対して、
前記(A)変性ポリフェニレンエーテルを70〜95質量%、
前記(B−1)ジビニルベンゼンを0.1〜15質量%、
前記(B−2)ポリブタジエンを4〜25質量%、及び
前記(B−3)他の架橋剤を17.5質量%以下で含有する、請求項3または4に記載のポリフェニレンエーテル樹脂組成物。 - 前記(A)変性ポリフェニレンエーテルの末端における前記置換基が、(メタ)アクリレート基を有する置換基である、請求項1〜5のいずれかに記載のポリフェニレンエーテル樹脂組成物。
- 前記(A)変性ポリフェニレンエーテルの数平均分子量が1000〜7000である、請求項1〜8のいずれかに記載のポリフェニレンエーテル樹脂組成物。
- 更に難燃剤を含有する、請求項1〜9のいずれかに記載のポリフェニレンエーテル樹脂組成物。
- 前記難燃剤が臭素含有化合物であり、前記臭素含有化合物が、樹脂組成物における樹脂成分の全量に対する臭素含有量が8〜20質量%となるように配合されている、請求項10に記載のポリフェニレンエーテル樹脂組成物。
- 請求項1〜11のいずれかに記載のポリフェニレンエーテル樹脂組成物が基材に含浸されたプリプレグ。
- 請求項12に記載のプリプレグと金属箔とを加熱加圧成形することにより積層して製造される金属張積層板。
- 請求項12に記載のプリプレグを用いて製造されたことを特徴とするプリント配線板。
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Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101865649B1 (ko) | 2014-12-22 | 2018-07-04 | 주식회사 두산 | 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
TWI538958B (zh) * | 2015-05-18 | 2016-06-21 | Nanya Plastics Corp | A preparation method of polyphenylene ether microspore dispersions |
JP6548118B2 (ja) * | 2015-09-11 | 2019-07-24 | パナソニックIpマネジメント株式会社 | 樹脂付き金属箔、並びにそれを用いた金属張積層板及び配線板 |
CN106609031B (zh) * | 2015-10-22 | 2018-11-27 | 广东生益科技股份有限公司 | 一种聚苯醚树脂组合物以及含有它的预浸料、层压板和印制电路板 |
JP6906171B2 (ja) * | 2016-01-19 | 2021-07-21 | パナソニックIpマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 |
TWI625345B (zh) * | 2016-08-17 | 2018-06-01 | Nanya Plastics Corp | 一種熱固性聚苯醚樹脂之製造方法 |
KR102056303B1 (ko) * | 2017-05-15 | 2019-12-16 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 사용한 프리프레그 및 금속박 적층판 |
WO2019065941A1 (ja) * | 2017-09-29 | 2019-04-04 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板、及び配線板 |
JP7203386B2 (ja) * | 2017-12-28 | 2023-01-13 | パナソニックIpマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 |
CN111936526B (zh) * | 2018-03-29 | 2022-09-30 | Dic株式会社 | 固化性组合物及其固化物 |
TWI700330B (zh) * | 2018-11-09 | 2020-08-01 | 台光電子材料股份有限公司 | 樹脂組合物及由其製成之物品 |
TWI700332B (zh) * | 2018-12-06 | 2020-08-01 | 台燿科技股份有限公司 | 無鹵素低介電樹脂組合物,使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板 |
US20200270413A1 (en) * | 2019-02-27 | 2020-08-27 | Rogers Corporation | Low loss dielectric composite comprising a hydrophobized fused silica |
JP7255060B2 (ja) * | 2019-04-10 | 2023-04-11 | 四国化成工業株式会社 | 樹脂組成物及びその用途 |
KR20220025859A (ko) | 2019-08-06 | 2022-03-03 | 닛뽕소다 가부시키가이샤 | 폴리페닐렌에테르 수지 조성물, 프리프레그, 및 금속 피복 적층판 |
CN113088060B (zh) * | 2019-12-23 | 2023-10-31 | 台光电子材料(昆山)有限公司 | 一种树脂组合物及由其制备的制品 |
JPWO2021153315A1 (ja) * | 2020-01-31 | 2021-08-05 | ||
CN113444355B (zh) * | 2020-03-24 | 2023-04-14 | 中山台光电子材料有限公司 | 树脂组合物及其制品 |
JP7450136B2 (ja) | 2020-03-24 | 2024-03-15 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
TWI725851B (zh) | 2020-05-15 | 2021-04-21 | 台燿科技股份有限公司 | 樹脂組合物,使用該樹脂組合物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
CN114316389B (zh) * | 2020-10-10 | 2023-05-23 | 台光电子材料(昆山)有限公司 | 树脂组合物及其制品 |
CN116583544A (zh) * | 2020-12-17 | 2023-08-11 | 积水化成品工业株式会社 | 中空树脂颗粒、其制造方法和其用途 |
CN116635433A (zh) * | 2020-12-17 | 2023-08-22 | 积水化成品工业株式会社 | 中空树脂颗粒、其制造方法和其用途 |
CN113072885B (zh) * | 2021-03-29 | 2022-06-03 | 广东生益科技股份有限公司 | 一种树脂组合物、树脂膜、电路材料及印刷电路板 |
WO2023286714A1 (ja) | 2021-07-14 | 2023-01-19 | 日本曹達株式会社 | 新規の(メタ)アクリルアミド系ポリマー及びそれを含む樹脂組成物とその成形体 |
WO2023286713A1 (ja) | 2021-07-14 | 2023-01-19 | 日本曹達株式会社 | 新規ポリマーおよびそれを含む樹脂組成物とその成形体 |
CN117126505A (zh) * | 2022-05-20 | 2023-11-28 | 台光电子材料(昆山)有限公司 | 树脂组合物及其制品 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5540615B2 (ja) | 1972-10-06 | 1980-10-18 | ||
JPS5540616B2 (ja) | 1972-10-06 | 1980-10-18 | ||
JPS5540615A (en) | 1978-09-14 | 1980-03-22 | Takeda Chem Ind Ltd | Separation and purification of cephalosporins |
JPS5540616A (en) | 1978-09-14 | 1980-03-22 | Otsuka Pharmaceut Co Ltd | Preparation of benzo-hetero-compound |
EP0309025B1 (en) | 1987-09-09 | 1995-05-17 | Asahi Kasei Kogyo Kabushiki Kaisha | A cured polyphenylene ether resin and a curable polyphenylene ether resin |
JPS6469629A (en) | 1987-09-09 | 1989-03-15 | Asahi Chemical Ind | Novel curable polyphenylene ether and preparation thereof |
JP2542686B2 (ja) * | 1988-10-12 | 1996-10-09 | 三菱化学株式会社 | 樹脂組成物 |
JP3015812B2 (ja) * | 1989-01-31 | 2000-03-06 | 住友化学工業株式会社 | 熱可塑性樹脂組成物 |
GB8913542D0 (en) * | 1989-06-13 | 1989-08-02 | Shell Int Research | Process for modification of polyphenylene ether or related polymers with a cyclic anhydride and the use thereof in modified,high temperature rigid polymer |
JP3069364B2 (ja) * | 1990-08-01 | 2000-07-24 | 旭化成工業株式会社 | 硬化性樹脂組成物および硬化性複合材料 |
EP0493811A3 (en) * | 1990-12-29 | 1993-04-07 | Nippon Petrochemicals Company, Limited | Improved thermoplastic resin composition and method for producing the same |
WO1996016091A1 (en) * | 1994-11-21 | 1996-05-30 | Asahi Kasei Kogyo Kabushiki Kaisha | Curable resin and composition |
US6306963B1 (en) * | 2000-05-08 | 2001-10-23 | General Electric Co. | Thermosetting resins and laminates |
US7413791B2 (en) * | 2003-01-28 | 2008-08-19 | Matsushita Electric Works, Ltd. | Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
JP2005060635A (ja) * | 2003-08-20 | 2005-03-10 | Mitsubishi Gas Chem Co Inc | 積層板用樹脂組成物およびプリプレグおよび金属張積層板 |
CN1972996A (zh) * | 2004-06-23 | 2007-05-30 | 日本瑞翁株式会社 | 丙烯酸类橡胶组合物以及丙烯酸类橡胶交联物 |
US20100016509A1 (en) * | 2006-08-18 | 2010-01-21 | Kaneka Coorporation | Method for producing branched vinyl polymer having functional group |
JP2009078209A (ja) * | 2007-09-25 | 2009-04-16 | Panasonic Electric Works Co Ltd | 樹脂付き金属箔とその製造方法、並びに金属張りフレキシブル積層板 |
JP5093059B2 (ja) | 2008-11-06 | 2012-12-05 | 日立化成工業株式会社 | 樹脂組成物、プリプレグ、積層板及びプリント基板 |
JP5463117B2 (ja) * | 2009-10-20 | 2014-04-09 | 株式会社日立製作所 | 低損失配線板,多層配線板、それに用いる銅箔及び積層板 |
US8809690B2 (en) * | 2010-03-04 | 2014-08-19 | Rogers Corporation | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
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