CN114168507B - CAN compatible circuit - Google Patents
CAN compatible circuit Download PDFInfo
- Publication number
- CN114168507B CN114168507B CN202010945034.3A CN202010945034A CN114168507B CN 114168507 B CN114168507 B CN 114168507B CN 202010945034 A CN202010945034 A CN 202010945034A CN 114168507 B CN114168507 B CN 114168507B
- Authority
- CN
- China
- Prior art keywords
- resistor
- chip
- type
- pins
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 238000004891 communication Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000002618 waking effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
The application provides a CAN compatibleA circuit, comprising: a chip pad having a plurality of pins; a first type of resistor comprising N 1 At least one resistor in the first type of resistor is connected to a first voltage; a second type of resistor comprising N 2 The second type of resistor is connected with the second voltage; n resistance bonding pads respectively connected to one end of each of the first and second resistors, wherein when the CAN compatible circuit is applied to the first communication mode, the chip bonding pads are welded to the first CAN chip and connected to N of multiple pins of the first CAN chip 1 The pins are welded with resistance pads connected to the first type of resistors; when the CAN compatible circuit is applied to the second communication mode, the chip bonding pad is welded with the second CAN chip and is connected with N in a plurality of pins of the second CAN chip 2 The pins are soldered to resistive pads connected to the second type of resistor. The circuit provided by the application is compatible with different CAN communication types.
Description
Technical Field
The application relates to circuit control and circuit design, in particular to a CAN compatible circuit.
Background
Currently, an Electric Power Steering (EPS) controller of an automobile generally selects an HS (high speed) CAN or a CAN wakeup (having a function of waking up a circuit board controller through a CAN chip) communication type for designing a circuit diagram and a circuit board according to specific application requirements.
The existing controller only supports one CAN (controller area network ) communication type, a schematic diagram and a circuit board are required to be designed respectively according to different design requirements, and after the circuit board is redesigned, the integrity of a circuit signal is required to be estimated again, and corresponding electromagnetic compatibility tests are required to be estimated again, so that the development and maintenance cost of the system is increased.
Disclosure of Invention
The present application is directed to overcoming the above-mentioned drawbacks of the related art, and provides a CAN-compliant circuit, and the technical solution described herein overcomes, at least in part, one or more of the problems due to the limitations and disadvantages of the related art.
According to one aspect of the present application, there is provided a CAN-compliant circuit comprising:
a chip pad having a plurality of pins;
a first type of resistor comprising N 1 A resistor of the first type, at least one resistor of the first type connected to a first voltage, N 1 Is an integer of 1 or more;
a second type of resistor comprising N 2 A resistor of at least one resistor of the second type connected to a second voltage, N 2 Is an integer of 1 or more;
n resistor pads respectively connected to one end of each of the first type resistor and the second type resistor, N being N 1 And N 2 The sum of N is more than or equal to 2, wherein,
when the CAN compatible circuit is applied to the first mode, the chip bonding pad is welded with a first CAN chip and is connected with N in a plurality of pins of the first CAN chip 1 The pins are welded with a resistance bonding pad connected to the first type of resistance;
when the CAN compatible circuit is applied to the second mode, the chip bonding pad is welded with a second CAN chip and is connected with N in a plurality of pins of the second CAN chip 2 Each pin is soldered to a resistive pad connected to the second type of resistor.
In some embodiments of the application, the first CAN chip has M 1 A second CAN chip with M pins 2 Pins, M 1 And M 2 Is a positive integer, and M 2 Greater than M 1 The number of pins of the chip bonding pad is M 2 And each.
In some embodiments of the present application, the first type of resistor includes a second resistor and a fifth resistor, wherein the other end of the second resistor is connected to the first voltage, and the other end of the fifth resistor is grounded.
In some embodiments of the application, the second resistor is connected to the first voltage through a first node, the first node also being grounded through a second capacitor.
In some embodiments of the application, the first CAN chip is an HS CAN chip.
In some embodiments of the present application, the second type of resistor includes a first resistor, a third resistor, and a fourth resistor, where the other end of the first resistor is connected to the second voltage, the other end of the third resistor is connected to a micro control unit, and the other end of the fourth resistor is connected to the second voltage.
In some embodiments of the application, one end of the first resistor is further grounded through a first capacitor.
In some embodiments of the application, the second CAN chip is a CAN wake-up chip.
In some embodiments of the application, the second resistor and the third resistor are connected to the same pin.
In some embodiments of the application, the fourth resistor and the fifth resistor are connected to the same pin.
The advantages of the present application compared to the prior art include at least:
according to the application, the first type resistor and the second type resistor are respectively connected with the first voltage and the second voltage, so that two voltage sources V1 and V2 are provided as I/O power supply modes; using a plurality of resistors for jumping signals as peripheral components, and welding or suspending corresponding peripheral components on a circuit board according to the applied communication type and the welded chip; therefore, design and test verification resources are saved, and development cost is reduced.
Drawings
The above and other features and advantages of the present application will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
Fig. 1 shows a circuit diagram of a CAN-compliant circuit according to an embodiment of the application.
Fig. 2 shows a schematic circuit board diagram of a CAN-compliant circuit according to an embodiment of the application.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Furthermore, the drawings are merely schematic illustrations of the present application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus a repetitive description thereof will be omitted.
The present application provides a CAN-compliant circuit, which is described below with reference to fig. 1 and 2. Fig. 1 shows a circuit diagram of a CAN-compliant circuit according to an embodiment of the application. Fig. 2 shows a schematic circuit board diagram of a CAN-compliant circuit according to an embodiment of the application.
In various embodiments of the present application, the CAN compatible circuit provided by the present application is mainly applied to an HS CAN or CAN wake-up mode. The CAN compatible circuit includes a chip pad U1 having a plurality of pins, a first type of resistor, a second type of resistor, N number of resistor pads (resistor pads for connecting the resistor and the pins).
The chip pad U1 is used for accessing the first CAN chip or the second CAN chip. The first CAN chip may have M 1 A second CAN chip with M pins 2 Pins, M 1 And M 2 Is a positive integer, and M 2 Greater than M 1 The number of pins of the chip bonding pad is M 2 And each. In particular, the first CAN chip may be an HS CAN chip. The second CAN chip may be a CAN wake-up chip. Thus, an HS CAN chip typically includes 8 pins. CAN wake-up chips typically include 14 pins. Thus, the chip pad U1 may be arranged with 14 pins. In some embodiments, the model of the HS CAN chip may be TJA1051; the model of the CAN wake-up chip may be TJA1145, and the application is not limited thereto, and the HS CAN chip for realizing the HS CAN function and the CAN wake-up chip for realizing the CAN wake-up function provided by other models or other suppliers are all within the scope of the application.
Specifically, in the present embodiment, 14 pins arranged in the chip pad U1 may be numbered in order 1 to 14. The 14 pins of the CAN wake-up chip CAN also be numbered from 1 to 14 in sequence. The serial numbers of the pins of the chip bonding pad U1 and the serial numbers of the pins of the CAN wake-up chip are corresponding and consistent, and are connected according to the corresponding relation. The 14 pins of the CAN WAKE-up chip are a first pin (TXD), a second pin (GND), a third pin (VCC), a fourth pin (RXD), a fifth pin (VIO), a sixth pin (SDO), a seventh pin (INH), an eighth pin (SCK), a ninth pin (WAKE), a tenth pin (BAT), an eleventh pin (SDI), a twelfth pin (CANL), a thirteenth pin (CANH), and a fourteenth pin (SCSN), and each pin has a corresponding function. The 8 pins of the HS CAN chip CAN be numbered from 1 to 8 in sequence. However, the 8 pin serial numbers of the HS CAN chip are not completely consistent with the pin serial number of the chip bonding pad U1. Specifically, the 8 pins of the HS CAN chip are a first pin (TXD), a second pin (GND), a third pin (VCC), a fourth pin (RXD), a fifth pin (VIO), a sixth pin (CANL), a seventh pin (CANH), and an eighth pin (INH). The first pin to the fourth pin of the HS CAN chip are consistent with the first pin sequence number to the fourth pin sequence number in the U1 pin sequence number of the chip bonding pad, and CAN be connected according to the corresponding relation. The fifth pin of the HS CAN chip corresponds to the eleventh pin of the chip bonding pad U1, the sixth pin of the HS CAN chip corresponds to the twelfth pin of the chip bonding pad U1, the seventh pin of the HS CAN chip corresponds to the thirteenth pin of the chip bonding pad U1, and the eighth pin of the HS CAN chip corresponds to the fourteenth pin of the chip bonding pad U1 and CAN be connected according to the corresponding relation.
The first type of resistor may include N 1 A resistor. At least one resistor of the first type is connected to a first voltage, N 1 Is an integer of 1 or more. Specifically, in the present embodiment, N 1 2. The first type of resistor includes a second resistor R02 and a fifth resistor R05. One end of the second resistor R02 is connected to a corresponding resistor pad, and the other end of the second resistor R02 is connected to the first voltage V1. One end of the fifth resistor R05 is connected with the corresponding resistor pad, and the other end of the fifth resistor R05 is grounded. Wherein the second resistor R02 and the fifth resistor R05 are connected by a jumper wireIs used. Specifically, the second resistor R02 is connected to the first voltage V1 through a first node, and the first node V1 is further grounded through a second capacitor C02 to perform a filtering function.
The second type of resistor may include N 2 A resistor. At least one resistor of the second type of resistor is connected to a second voltage, N 2 Is an integer of 1 or more. Specifically, in the present embodiment, N 2 3. The second type of resistor comprises a first resistor R01, a third resistor R03 and a fourth resistor R04. One end of the first resistor R01 is connected with the corresponding resistor pad, and the other end of the first resistor R01 is connected with the second voltage V2. One end of the third resistor R03 is connected with the corresponding resistor pad, and the other end of the third resistor R03 is connected with a Micro Control Unit (MCU). One end of the fourth resistor R04 is connected to the corresponding resistor pad, and the other end of the fourth resistor R04 is connected to the second voltage V2. The first resistor R01, the third resistor R03 and the fourth resistor R04 play a role of jumper connection. Specifically, one end of the first resistor R01 connected to the corresponding resistor pad is further grounded through the first capacitor C01, so as to play a role of filtering.
N resistor pads are respectively connected to one end of each resistor in the first type resistor and the second type resistor, N is N 1 And N 2 And N is more than or equal to 2. In this embodiment, N is 5.
When the CAN compatible circuit is applied in a first mode (such as HS CAN), the chip bonding pad is caused to bond with a first CAN chip (such as HS CAN chip), and N in a plurality of pins connected to the first CAN chip is caused to bond with N in a plurality of pins of the first CAN chip 1 Each pin is soldered to a resistive pad connected to the first type of resistor. In the present embodiment, the resistance pad connected to the second resistor R02 is soldered to the fifth pin (eleventh pin of U1) of the HS CAN; the resistor pad connected to the fifth resistor R05 is soldered to the eighth pin (fourteenth pin of U1) of the HS CAN.
When the CAN compatible circuit is applied in a second mode (such as CAN wake-up), the chip pad is welded with a second CAN chip (such as CAN wake-up chip) and connected with the second CAN chipN in multiple pins of a chip 2 Each pin is soldered to a resistive pad connected to the second type of resistor. In this embodiment, the resistor pad connected to the first resistor R01 is soldered to the fifth pin (the fifth pin of U1) of the CAN wake-up chip; a resistor pad connected with the third resistor R03 is welded with an eleventh pin (an eleventh pin of U1) of the CAN wake-up chip; the resistor pad connected with the fourth resistor R04 is welded with the fourteenth pin (the fourteenth pin of U1) of the CAN wake-up chip. Thereby, the second resistor R02 and the third resistor R03 are connected to the same pin of U1. The fourth resistor R04 and the fifth resistor R05 are connected to the same pin of U1.
The foregoing is merely illustrative of various implementations of the application, and the application is not limited thereto.
The advantages of the present application compared to the prior art include at least:
according to the application, the first type resistor and the second type resistor are respectively connected with the first voltage and the second voltage, so that two voltage sources V1 and V2 are provided as I/O power supply modes; using a plurality of resistors for jumping signals as peripheral components, and welding or suspending corresponding peripheral components on a circuit board according to an applied communication mode and a welded chip; therefore, design and test verification resources are saved, and development cost is reduced.
Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
Claims (10)
1. A CAN-compliant circuit, comprising:
a chip pad having a plurality of pins;
a first type resistor, said first type resistor packageDraw N 1 A resistor of the first type, at least one resistor of the first type connected to a first voltage, N 1 Is an integer of 1 or more;
a second type of resistor comprising N 2 A resistor of at least one resistor of the second type connected to a second voltage, N 2 Is an integer of 1 or more;
n resistor pads respectively connected to one end of each of the first type resistor and the second type resistor, N being N 1 And N 2 The sum of N is more than or equal to 2, wherein,
when the CAN compatible circuit is applied to the first mode, the chip bonding pad is welded with a first CAN chip and is connected with N in a plurality of pins of the first CAN chip 1 The pins are welded with a resistance bonding pad connected to the first type of resistance;
when the CAN compatible circuit is applied to the second mode, the chip bonding pad is welded with a second CAN chip and is connected with N in a plurality of pins of the second CAN chip 2 Each pin is soldered to a resistive pad connected to the second type of resistor.
2. The CAN-compliant circuit of claim 1 wherein the first CAN chip has M 1 A second CAN chip with M pins 2 Pins, M 1 And M 2 Is a positive integer, and M 2 Greater than M 1 The number of pins of the chip bonding pad is M 2 And each.
3. The CAN-compliant circuit of claim 1 wherein the first type of resistor comprises a second resistor and a fifth resistor, wherein the other end of the second resistor is connected to the first voltage and the other end of the fifth resistor is grounded.
4. The CAN-compliant circuit of claim 3 wherein the second resistor is connected to the first voltage through a first node, the first node further being grounded through a second capacitor.
5. The CAN-compliant circuit of claim 3 wherein the first CAN chip is an HS CAN chip.
6. The CAN-compliant circuit of claim 3, wherein the second type of resistor comprises a first resistor, a third resistor, and a fourth resistor, wherein the other end of the first resistor is connected to the second voltage, the other end of the third resistor is connected to a micro-control unit, and the other end of the fourth resistor is connected to the second voltage.
7. The CAN-compliant circuit of claim 6 wherein one end of the first resistor is further coupled to ground through a first capacitor.
8. The CAN-compliant circuit of claim 6 wherein the second CAN chip is a CAN wake-up chip.
9. The CAN-compliant circuit of claim 7, wherein the second resistor and the third resistor are connected to the same pin.
10. The CAN-compliant circuit of claim 7 wherein the fourth resistor and the fifth resistor are connected to the same pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010945034.3A CN114168507B (en) | 2020-09-10 | 2020-09-10 | CAN compatible circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010945034.3A CN114168507B (en) | 2020-09-10 | 2020-09-10 | CAN compatible circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114168507A CN114168507A (en) | 2022-03-11 |
| CN114168507B true CN114168507B (en) | 2023-12-05 |
Family
ID=80475545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010945034.3A Active CN114168507B (en) | 2020-09-10 | 2020-09-10 | CAN compatible circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114168507B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7872346B1 (en) * | 2007-12-03 | 2011-01-18 | Xilinx, Inc. | Power plane and land pad feature to prevent human metal electrostatic discharge damage |
| CN207117649U (en) * | 2017-09-16 | 2018-03-16 | 锦州辽晶电子科技有限公司 | CAN isolated transceiver |
| CN108556632A (en) * | 2018-06-10 | 2018-09-21 | 重庆三三电器股份有限公司 | A kind of intelligence TFT instrument screen intensity wake-up circuits and its control method |
| CN110350903A (en) * | 2019-08-13 | 2019-10-18 | 厦门亚锝电子科技有限公司 | A kind of novel touch key-press BLE remote control switch panel |
| CN111404494A (en) * | 2020-06-04 | 2020-07-10 | 微龛(广州)半导体有限公司 | Transimpedance amplifier chip and optical receiving module |
-
2020
- 2020-09-10 CN CN202010945034.3A patent/CN114168507B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7872346B1 (en) * | 2007-12-03 | 2011-01-18 | Xilinx, Inc. | Power plane and land pad feature to prevent human metal electrostatic discharge damage |
| CN207117649U (en) * | 2017-09-16 | 2018-03-16 | 锦州辽晶电子科技有限公司 | CAN isolated transceiver |
| CN108556632A (en) * | 2018-06-10 | 2018-09-21 | 重庆三三电器股份有限公司 | A kind of intelligence TFT instrument screen intensity wake-up circuits and its control method |
| CN110350903A (en) * | 2019-08-13 | 2019-10-18 | 厦门亚锝电子科技有限公司 | A kind of novel touch key-press BLE remote control switch panel |
| CN111404494A (en) * | 2020-06-04 | 2020-07-10 | 微龛(广州)半导体有限公司 | Transimpedance amplifier chip and optical receiving module |
Non-Patent Citations (1)
| Title |
|---|
| 高速CAN收发器的设计与研究;宫磊;《中国优秀硕士学位论文全文数据库信息科技辑》;I136-75 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114168507A (en) | 2022-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101729255B1 (en) | Vehicle computing module | |
| CN103186441A (en) | Switching circuit | |
| US7411407B2 (en) | Testing target resistances in circuit assemblies | |
| CN103098039B (en) | High-speed peripheral device interconnection bus port collocation method and equipment | |
| CN103616937A (en) | Mainboard, PCIE network card and server system | |
| MSA | QSFP-DD Hardware Specification for QSFP Double Density 8X Pluggable Transceiver | |
| US8433839B2 (en) | Connector assembly | |
| CN114168507B (en) | CAN compatible circuit | |
| US20100281279A1 (en) | Power supply system and electronic device for cpu | |
| CN116243147B (en) | PAD function matrix-based integrated control chip peripheral self-test method and device | |
| CN215932621U (en) | PCIE-SATA interface circuit | |
| CN107506319A (en) | A kind of integrated storage system | |
| Martín et al. | Low cost programmable modular system to perform In-Circuit Test (ICT) full development of the hardware, software and mechanics of an ICT machine | |
| CN209624707U (en) | A kind of ICT tester system | |
| CN206353307U (en) | Mobile terminal for debugging peripheral hardware | |
| CN102446132B (en) | Method and device for performing board-level management by simulating local bus | |
| CN217332792U (en) | Power supply diagnosis device of vehicle-mounted 4G communication module | |
| CN101299720A (en) | Modularization equipment and method for connecting principal and subordinate module thereof | |
| CN215954292U (en) | Vehicle MCU (microprogrammed control Unit) flash device based on external plug connector | |
| CN220962403U (en) | Power consumption detection circuit, system and electronic equipment | |
| CN218181372U (en) | Controller testing device | |
| US20230116296A1 (en) | Modular System Validation Platform for Computing Devices | |
| CN216210578U (en) | Control device and CAN bus communication circuit thereof | |
| CN217825009U (en) | General development board and electronic equipment | |
| CN210051880U (en) | Jumper cable detector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |